Electronic components

Abstract

The present invention relates to an electronic component. A coil component (1) comprises a body (2) formed by stacking a plurality of insulating layers, and a column (8) arranged in the body (2) and extending in the stacking direction of the plurality of insulating layers, the column (8) comprising a plurality of column parts (12A, 12B) stacked in the stacking direction, a defining part (14) defining a contact surface (13) of the two column parts (12A, 12B) being provided between two column parts (12A, 12B) in the stacking direction, the defining part (14) being formed of a material different from that of the column part (8) and being arranged at an edge (12E) of the two column parts (12A, 12B) when viewed in the stacking direction.

Description

Technical Field

[0001] The present invention relates to an electronic component. Background Art

[0002] The electronic component includes: a body formed by stacking a plurality of insulating layers; a terminal electrode disposed on the body; and a coil disposed in the body and electrically connected to the terminal electrode (for example, see International Publication No. 2016 / 132911). The coil includes: a first wiring portion; a second wiring portion; and a connecting portion extending in the stacking direction of the plurality of insulating layers and connecting the first wiring portion and the second wiring portion. Summary of the invention

[0003] The connecting portion (conductor) constituting the coil is formed by stacking a plurality of components. In two components stacked in the stacking direction, an offset may occur in a direction orthogonal to the stacking direction (a direction parallel to the surfaces of the components facing each other). If an offset occurs between the two components, the contact area of ​​the two components changes. If the contact area changes, the characteristics of the electronic component are affected. The offset of the two components is different for each electronic component. Therefore, deviations may occur in the characteristics of the electronic component.

[0004] An object of one aspect of the present invention is to provide an electronic component capable of suppressing occurrence of variations in characteristics.

[0005] (1) An electronic component involved in one aspect of the present invention comprises: an element body, which is formed by stacking multiple insulating layers; a conductor, which is arranged in the element body and extends in the stacking direction of the multiple insulating layers, the conductor has multiple conductor parts stacked in the stacking direction, and a specified portion that specifies the contact surface of the two conductor parts is provided between two conductor parts in the stacking direction, the specified portion is formed of a material different from the conductor, and is arranged at the edge of the two conductor parts when viewed in the stacking direction.

[0006] In an electronic component of one embodiment of the present invention, a prescribed portion that specifies the contact surface of the two conductor components is provided between two conductor components in the stacking direction. The prescribed portion is formed of a material different from the conductor and is arranged at the edge of the two conductor components when viewed from the stacking direction. Thus, in the electronic component, even if a stacking offset occurs in the two conductor components, the contact surface of the two conductor components is specified by the prescribed portion, so that the contact area of ​​the two conductor components remains constant. Therefore, in the electronic component, even if an offset occurs in the two conductor components, the characteristics are not affected. As a result, in the electronic component, the occurrence of characteristic deviation can be suppressed.

[0007] (2) In the electronic component of (1) above, the conductor may be formed of Cu, and the predetermined portion may be formed of an inorganic material different from Cu. In this structure, since the predetermined portion is formed of an inorganic material different from the conductor formed of Cu, even if a deviation occurs between the two conductor components, the characteristics are not affected.

[0008] (3) In the electronic component of (1) or (2) above, the shape of the contact surface defined by the defining portion may be similar to the outer shape of the conductor when viewed in the stacking direction. In this structure, a large allowable range of misalignment between the two conductor components can be ensured.

[0009] (4) In the electronic component of (1) above, the predetermined portion may be formed of the same material as the element body. In this structure, even if a misalignment occurs between the two conductive members, the characteristics are not affected.

[0010] (5) In the electronic component of (4) above, in one of the two conductor components, the side surface and the contact surface of the one conductor component are connected by a curved surface, and a prescribed portion is arranged at a position corresponding to the curved surface when viewed from the stacking direction. In this structure, a space is formed between the two conductor components at the edge of the conductor component. Therefore, the element body can be set as the prescribed portion.

[0011] (6) An electronic component involved in one aspect of the present invention comprises: an element body, which is formed by stacking multiple insulating layers; a first conductor, which is arranged in the element body and extends in the stacking direction of the multiple insulating layers; a second conductor, which is connected to the first conductor, and a prescribed portion that specifies the contact surface between the first conductor and the second conductor is provided between the first conductor and the second conductor, the prescribed portion is formed of a material different from the first conductor and the second conductor, and is arranged at the edge of the first conductor when viewed in the stacking direction.

[0012] In an electronic component of one embodiment of the present invention, a prescribed portion that specifies the contact surface of the first conductor and the second conductor is provided between the first conductor and the second conductor. The prescribed portion is formed of a material different from that of the first conductor and the second conductor, and is arranged at the edge of the first conductor when viewed from the stacking direction. Thus, in the electronic component, even if a stacking offset occurs in the first conductor and the second conductor, the contact surface of the first conductor and the second conductor is specified by the prescribed portion, so that the contact area of ​​the first conductor and the second conductor remains constant. Therefore, in the electronic component, even if an offset occurs in the first conductor and the second conductor, the characteristics are not affected. As a result, in the electronic component, the occurrence of characteristic deviation can also be suppressed.

[0013] (7) In the electronic component of (6) above, the first conductor and the second conductor may be formed of Cu, and the predetermined portion may be formed of an inorganic material different from Cu. In this structure, since the predetermined portion is formed of an inorganic material different from the conductor formed of Cu, even if a deviation occurs in the first conductor and the second conductor, the characteristics are not affected.

[0014] (8) In the electronic component of (6) or (7) above, the shape of the contact surface defined by the defining portion may be similar to the outer shape of the first conductor when viewed in the stacking direction. In this structure, a large allowable range of misalignment of the first conductor and the second conductor can be ensured.

[0015] (9) In the electronic component of (6) above, the predetermined portion may be formed of the same material as the element body. In this structure, even if a misalignment occurs between the first conductor and the second conductor, the characteristics are not affected.

[0016] According to one aspect of the present invention, it is possible to suppress occurrence of variations in characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a perspective view of a coil component according to one embodiment.

[0018] Figure 2 Observed from the end side Figure 1 Figure 2 shows a coil assembly.

[0019] Figure 3 This is a cross-sectional view showing a part of the column portion of the coil component according to the first embodiment in an enlarged manner.

[0020] Figure 4 This is a diagram showing a predetermined portion as viewed from the stacking direction.

[0021] Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E , Fig. 5F and Figure 5G It is a figure for demonstrating the manufacture of a column part.

[0022] Fig. 6A is a diagram showing a state where no deviation occurs between the two column members. Figure 6B It is a diagram showing a state where a deviation occurs between two column members.

[0023] Figure 7 This is a cross-sectional view showing a part of a column portion of the coil component according to the second embodiment in an enlarged manner.

[0024] Figure 8This is a diagram showing a predetermined portion as viewed from the stacking direction.

[0025] Fig.9A , Fig. 9B , Fig. 9C , Fig.9D , Fig.9E and Fig.9F This is a diagram for explaining the manufacture of the column part.

[0026] Fig.10 This is a cross-sectional view showing, in an enlarged manner, a part of a column portion and a wiring portion of a coil component according to a third embodiment.

[0027] Fig.11 This is a cross-sectional view showing, in an enlarged manner, a part of a column portion and a wiring portion of a coil component according to a fourth embodiment. DETAILED DESCRIPTION

[0028] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and repeated descriptions are omitted.

[0029] Reference Figure 1 , a coil component according to one embodiment is described. Figure 1 This is a perspective view of a coil component according to one embodiment. Figure 2 Observed from the end side Figure 1 The coil components are shown in FIG. Figure 1 and Figure 2 As shown in FIG. 1 , a coil component (electronic component) 1 includes an element body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5, and a first connection conductor 10 and a second connection conductor 11. Figure 1 and Figure 2 In FIG, the element body 2 is represented by a double-dashed line. Figure 1 In the figure, it is represented by coil 5.

[0030] The element body 2 is in the shape of a rectangular parallelepiped. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The element body 2 has a pair of end faces 2a, 2b, a pair of main faces 2c, 2d, and a pair of side faces 2e, 2f as outer surfaces. The end faces 2a, 2b are opposite to each other. The main faces 2c, 2d are opposite to each other. The side faces 2e, 2f are opposite to each other. Hereinafter, the relative direction of the end faces 2a, 2b is set as the first direction D1, the relative direction of the main faces 2c, 2d is set as the second direction D2, and the relative direction of the side faces 2e, 2f is set as the third direction D3. The first direction D1, the second direction D2, and the third direction D3 are substantially orthogonal to each other.

[0031] The end faces 2a and 2b extend in the second direction D2 so as to connect the main faces 2c and 2d. The end faces 2a and 2b also extend in the third direction D3 so as to connect the side faces 2e and 2f. The main faces 2c and 2d extend in the first direction D1 so as to connect the end faces 2a and 2b. The main faces 2c and 2d also extend in the third direction D3 so as to connect the side faces 2e and 2f. The side faces 2e and 2f extend in the first direction D1 so as to connect the end faces 2a and 2b. The side faces 2e and 2f also extend in the second direction D2 so as to connect the main faces 2c and 2d.

[0032] The main surface 2d is a mounting surface, for example, a surface facing other electronic devices (eg, circuit substrate or coil component) when the coil component 1 is mounted on other electronic devices not shown. The end surfaces 2a and 2b are surfaces continuous from the mounting surface (ie, the main surface 2d).

[0033] exist Figure 1 and Figure 2 In the illustrated embodiment, the length of the element body 2 in the first direction D1 is longer than the length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3. The length of the element body 2 in the second direction D2 is shorter than the length of the element body 2 in the third direction D3. That is, in this embodiment, the end faces 2a, 2b, the main faces 2c, 2d, and the side faces 2e, 2f are rectangular. The length of the element body 2 in the second direction D2 may be equal to the length of the element body 2 in the third direction D3, or may be longer than the length of the element body 2 in the third direction D3.

[0034] In addition, in this embodiment, the term "equal" may include values ​​that include a slight difference or manufacturing error within a predetermined range, etc. For example, if multiple values ​​are within a range of ±5% of the average value of the multiple values, the multiple values ​​are defined as equal.

[0035] The element body 2 is formed by stacking a plurality of element body layers (insulator layers) in the second direction D2. That is, the stacking direction of the element body 2 is the second direction D2. In the actual element body 2, the plurality of element body layers may be integrated to such an extent that the boundaries between the layers cannot be identified, or may be integrated to such an extent that the boundaries between the layers can be identified.

[0036] The element layer may be, for example, a resin layer. The material of the element layer may include, for example, at least one selected from liquid crystal polymers, polyimide resins, crystalline polystyrene, epoxy resins, acrylic resins, bismaleimide resins, and fluorine resins. The element layer may also include a filler. The filler may be, for example, an inorganic filler. As an inorganic filler, for example, silicon dioxide (SiO2) may be cited. In addition, the element layer may not include a filler.

[0037] In addition, the body layer may also be configured to include a magnetic material. The magnetic material of the body layer may include, for example, a Ni-Cu-Zn ferrite material, a Ni-Cu-Zn-Mg ferrite material, or a Ni-Cu ferrite material. The magnetic material of the body layer may also include, for example, an Fe alloy. The body layer may also include, for example, a non-magnetic material. The non-magnetic material of the body layer may include, for example, a glass ceramic material or a dielectric material.

[0038] The first terminal electrode 3 and the second terminal electrode 4 are respectively provided on the element body 2. The first terminal electrode 3 and the second terminal electrode 4 are respectively arranged on the main surface 2d of the element body 2. The first terminal electrode 3 and the second terminal electrode 4 are respectively arranged on the element body 2 separated from each other in the first direction D1. Specifically, the first terminal electrode 3 is arranged on the end surface 2a side of the element body 2. The second terminal electrode 4 is arranged on the end surface 2b side of the element body 2.

[0039] The first terminal electrode 3 and the second terminal electrode 4 may also be in a rectangular shape, for example. The first terminal electrode 3 and the second terminal electrode 4 are arranged so that each side is along the first direction D1 or the third direction D3. Figure 2 As shown, the first terminal electrode 3 and the second terminal electrode 4 do not protrude from the main surface 2d. That is, in this embodiment, the surfaces of the first terminal electrode 3 and the second terminal electrode 4 are flush with the main surface 2d. The first terminal electrode 3 and the second terminal electrode 4 are made of a conductive material (eg, Cu).

[0040] The first terminal electrode 3 and the second terminal electrode 4 may be provided with a plating layer (not shown) containing, for example, Ni, Sn, Au, etc. by performing electrolytic plating or electroless plating on the first terminal electrode 3 and the second terminal electrode 4. The plating layer may include, for example, a Ni plating film containing Ni and covering the first terminal electrode 3 and the second terminal electrode 4, and an Au plating film containing Au and covering the Ni plating film.

[0041] like Figure 1 and Figure 2 As shown, the coil 5 is arranged in the element body 2. The coil 5 has a plurality of first wiring parts 6, a plurality of second wiring parts 7, and a plurality of pillars (conductors) 8. The coil 5 is formed by electrically connecting the first wiring parts 6, the second wiring parts 7, and the pillars 8. The coil axis of the coil 5 is set along the third direction D3. The plurality of first wiring parts 6, the plurality of second wiring parts 7, and the plurality of pillars 8 are made of a conductive material (for example, Cu). The first wiring part 6, the second wiring part 7, and the pillars 8 are separated and arranged from the end faces 2a, 2b, the main faces 2c, 2d, and the side faces 2e, 2f.

[0042] The first wiring portions 6 are respectively arranged on the main surface 2c side of the element body 2. The first wiring portions 6 extend along the first direction D1. The first wiring portions 6 connect the two pillars 8 respectively. The first wiring portion 6 is mounted on the two pillars 8. One end portion of the first wiring portion 6 in the extension direction (the end portion on the end surface 2a side) is connected to one end portion of the pillar 8 (the end portion on the main surface 2c side). The other end portion of the first wiring portion 6 in the extension direction (the end portion on the end surface 2b side) is connected to one end portion of the pillar 8 (the end portion on the main surface 2c side).

[0043] The second wiring portions 7 are respectively arranged on the main surface 2d (mounting surface) side of the element body 2. The second wiring portions 7 extend in the first direction D1. The second wiring portions 7 connect the two pillars 8 respectively. The second wiring portion 7 is mounted on the two pillars 8. One end portion (the end portion on the end surface 2a side) of the second wiring portion 7 in the extension direction is connected to the other end portion (the end portion on the main surface 2d side) of the pillar 8. The other end portion (the end portion on the end surface 2b side) of the second wiring portion 7 in the extension direction is connected to the other end portion (the end portion on the main surface 2d side) of the pillar 8. The number of the plurality of second wiring portions 7 is one less than the number of the plurality of first wiring portions 6. That is, when the number of the first wiring portions 6 is n, the number of the second wiring portions 7 becomes n-1.

[0044] The pillars 8 extend along the second direction D2. The pillars 8 connect the first wiring section 6 and the second wiring section 7. In the present embodiment, the pillars 8 are prism-shaped. The cross-sectional shape of the pillars 8 (the direction orthogonal to the second direction D2) is rectangular. One end of the pillar 8 is connected to the end of the first wiring section 6. The other end of the pillar 8 is connected to the end of the second wiring section 7.

[0045] The first connection conductor 10 connects the first terminal electrode 3 and one end of the coil 5. The first connection conductor 10 is connected to the other end of the column 8 of the coil 5. The first connection conductor 10 is arranged near the end surface 2a and near the side surface 2e. The first connection conductor 10 is made of a conductive material. The first connection conductor 10 is formed of Cu, for example.

[0046] The second connection conductor 11 connects the second terminal electrode 4 and the other end of the coil 5. The second connection conductor 11 is connected to the other end of the column 8 of the coil 5. The second connection conductor 11 is arranged near the end surface 2b and near the side surface 2f. The second connection conductor 11 is made of a conductive material. The second connection conductor 11 is formed of Cu, for example.

[0047] [First embodiment]

[0048] Figure 3 FIG. 2 is a cross-sectional view showing a part of the column portion of the first embodiment in an enlarged manner. Figure 3As shown, the column portion 8 has a plurality of column components (conductor components) 12. In the column portion 8, the plurality of column components 12 are stacked in the second direction D2. In the following description, for the sake of convenience, the plurality of column components 12 are sometimes distinguished from the column component 12A and the column component 12B. The column component 12A and the column component 12B are mutually connected (adjacent) column components.

[0049] The column part 8 has a contact surface 13. The contact surface 13 is a surface where two column parts 12 contact. Figure 3 In the illustrated example, the contact surface 13 is a surface where the column member 12A and the column member 12B are in contact.

[0050] In the column part 8, a prescribed portion 14 is provided between the column part 12A and the column part 12B. In the present embodiment, the prescribed portion 14 is arranged on the column part 12A. The prescribed portion 14 stipulates the contact surface 13 of the column part 12A and the column part 12B. The prescribed portion 14 stipulates the size of the contact area of ​​the contact surface 13 of the column part 12A and the column part 12B. The prescribed portion 14 is formed of a material different from the material (Cu) forming the column part 8, that is, an inorganic substance. In the present embodiment, the prescribed portion 14 is, for example, Cr, titanium oxide, etc. The conductivity of the prescribed portion 14 is lower than the conductivity of the column part 8.

[0051] like Figure 3 and Figure 4 As shown in FIG. 1 , when viewed from the second direction D2 (stack direction), the prescribed portion 14 is disposed at the edge 12E of the column members 12A and 12B. The edge 12E of the column members 12A and 12B is a concept that includes a portion at a prescribed distance from the side surfaces 12Aa and 12Ba (side surfaces of the column 8) of the column members 12A and 12B. Figure 4 As shown, in this embodiment, the regulation portion 14 is in a rectangular frame shape. The shape of the contact surface 13 defined by the regulation portion 14 is similar to the outer shape of the column portion 8. The shape of the contact surface 13 is rectangular. That is, the shape of the inner side of the regulation portion 14 is rectangular.

[0052] In the present embodiment, the prescribed portion 14 prescribes the contact surface 13 so that the area of ​​the contact surface 13 becomes 20% to 80% of the area of ​​the end surface of the column members 12A and 12B. That is, the width W of the prescribed portion 14 is set so that the area of ​​the contact surface 13 becomes 20% to 80% of the area of ​​the end surface of the column members 12A and 12B. The thickness T of the prescribed portion 14 is, for example, 10 nm to 30 nm.

[0053] The prescribed portion 14 is provided between two adjacent column members 12 among the plurality of column members 12. That is, for example, when there are four column members 12, three prescribed portions 14 are provided.

[0054] The coil component 1 can be manufactured as follows. The element body 2 can be formed by pressing sheets constituting the element body layer. The coil 5 (first wiring portion 6, second wiring portion 7, column portion 8), the first connecting conductor 10 and the second connecting conductor 11 can be manufactured using photolithography. "Photolithography" only requires exposing and developing a layer of a processing object containing a photosensitive material to a desired pattern, and is not limited to the type of mask, etc.

[0055] The manufacturing of the column 8 is described in detail below. Figure 5A As shown, in the sheet S1 constituting the element layer, after the conductor C1 (column member 12A) constituting the column portion 8 is formed by Cu plating, the sheet S1 is ground to expose the conductor C and to flatten the sheet S1.

[0056] Then, if Figure 5B As shown, on the sheet S1, a first film M1 of Cr is formed by a sputtering method, and on the first film M1, a second film M2 of Cu is formed by a sputtering method.

[0057] Then, if Figure 5C As shown, after the resist is spin-coated on the second film M2, the region corresponding to the conductor C1 is exposed and developed, thereby removing the first film M1 and the second film M2 in the region corresponding to the conductor C, and forming an opening O in the first film M1 and the second film M2. The opening area of ​​the opening O corresponds to the area of ​​the contact surface 13 of the pillar 8. By adjusting (setting) the opening area of ​​the opening O, the area of ​​the contact surface 13 of the pillar 8 can be adjusted.

[0058] Then, if Figure 5D As shown in FIG. 1 , after the resist R is spin-coated on the second film M2, the resist R in the region corresponding to the conductor C is removed by exposure and development. Figure 5E As shown, the conductor C2 (pillar member 12B) is formed by plating in the portion where the resist R is removed. The conductor C2 is Cu plating.

[0059] Then, if Fig. 5F As shown, the resist R is peeled off and the first film M1 and the second film M2 are removed. At this time, the first film M1 remains between the conductor C1 and the conductor C2. The first film M1 becomes the prescribed portion 14. Next, the sheet S2 constituting the element layer is buried, and the element layer is cured. As described above, the column portion 8 provided with the prescribed portion 14 is manufactured.

[0060] As described above, in the coil component 1 of the present embodiment, a prescribed portion 14 for prescribing the contact surface 13 of the two column components 12A and 12B is provided between the two column components 12A and 12B of the column portion 8. The prescribed portion 14 is formed of a material different from the column portion 8. When viewed from the second direction D2, the prescribed portion 14 is disposed at the edge 12E of the two column components 12A and 12B. Thus, in the coil component 1, even when a stacked offset occurs in the two column components 12A and 12B, the contact surface 13 of the two column components 12A and 12B is prescribed by the prescribed portion 14, so that the contact area of ​​the two column components 12A and 12B remains constant. Therefore, in the coil component 1, even when an offset occurs in the two column components 12A and 12B, the characteristics will not be affected. As a result, in the coil component 1, the generation of characteristic deviation can be suppressed.

[0061] Fig. 6A This is a diagram showing a state in which no deviation occurs between the two column members 12A and 12B. Figure 6B 1 is a diagram showing a state where a deviation occurs between the two column members 12A and 12B. Figure 6B As shown, even when the two column members 12A and 12B are offset, the area of ​​the contact surface 13 defined by the defining portion 14 is equal to the area of ​​the contact surface 13 ( Fig. 6A ) are the same. That is, even when an offset occurs in the two column components 12A and 12B, there is no change in the area of ​​the contact surface 13. Therefore, in the coil component 1, even when an offset occurs in the two column components 12A and 12B, it does not affect the characteristics, so the occurrence of characteristic deviation can be suppressed.

[0062] In the coil component 1 of this embodiment, the shape of the contact surface 13 defined by the defining portion 14 is similar to the outer shape of the column 8 when viewed from the second direction D2 (the extension direction of the column 8). In this structure, the allowable range of the displacement of the two column members 12A and 12B can be ensured to be large.

[0063] [Second embodiment]

[0064] Next, a second embodiment will be described. Figure 7 It is a cross-sectional view showing a part of the column part of the second embodiment in an enlarged manner. In the coil component 1A, in the column part 8, a regulating portion 20 is provided between the column part 12A and the column part 12B. The regulating portion 20 regulates the contact surface 13 of the column part 12A and the column part 12B. The regulating portion 20 regulates the size of the contact area of ​​the contact surface 13 of the column part 12A and the column part 12B. The regulating portion 20 is composed of a part of the element body 2.

[0065] like Figure 7 and Figure 8 As shown in FIG. 1 , the prescribed portion 20 is arranged at the edge 12E of the column members 12A and 12B when viewed from the second direction D2 (stacking direction). The edge 12E of the column members 12A and 12B is a concept including a portion at a prescribed distance from the side surface of the column members 12A and 12B to the inside. The edge 12E of the column member 12A is composed of a curved surface connecting the side surface 12Aa of the column member 12A and the contact surface 13. The prescribed portion 20 is arranged at a position corresponding to the curved surface when viewed from the second direction D2.

[0066] like Figure 8 As shown, in this embodiment, the defining portion 20 is in a rectangular frame shape. In this embodiment, the defining portion 20 defines the contact surface 13 so that the area of ​​the contact surface 13 becomes 20% to 80% of the area of ​​the end surface of the column members 12A, 12B.

[0067] The manufacturing of the column 8 is described in detail below. Fig.9A As shown, in the sheet S1 constituting the element layer, after the conductor C1 (column member 12A) constituting the column portion 8 is formed by Cu plating, the sheet S1 is ground to expose the conductor C and to flatten the sheet S1.

[0068] Then, if Fig. 9B As shown, a Cu film M is formed on a sheet S1 by a sputtering method.

[0069] Then, if Fig. 9C As shown in FIG. 1 , after the resist R is spin-coated on the film M, the resist R in the region corresponding to the conductor C1 is removed by exposure and development. Fig.9D As shown, the conductor C2 (pillar member 12B) is formed by plating in the portion where the resist R is removed. The conductor C2 is Cu plating.

[0070] Then, if Figure 5E As shown, the resist R is peeled off and the film M is removed. At this time, when the film M is removed, a part of the conductor C1 is removed to form the prescribed portion 20. Next, the sheet S2 constituting the element layer is buried and the element layer is cured. As described above, the column 8 provided with the prescribed portion 20 is manufactured.

[0071] As described above, in the coil component 1A of the present embodiment, a regulating portion 20 for regulating the contact surface 13 of the two column components 12A and 12B is provided between the two column components 12A and 12B of the column portion 8. The regulating portion 20 is formed by a material different from the column portion 8. When viewed from the second direction D2, the regulating portion 20 is disposed at the edge 12E of the two column components 12A and 12B. Thus, in the coil component 1A, even when a stacked offset occurs in the two column components 12A and 12B, the contact surface 13 of the two column components 12A and 12B is regulated by the regulating portion 20, so that the contact area of ​​the two column components 12A and 12B remains constant. Therefore, in the coil component 1A, even when an offset occurs in the two column components 12A and 12B, the characteristics will not be affected. As a result, in the coil component 1A, the generation of characteristic deviation can be suppressed.

[0072] As mentioned above, although embodiment of this invention was described, this invention is not necessarily limited to the said embodiment, Various changes are possible within the range which does not deviate from the summary.

[0073] In the above embodiment, the prescribed portions 14 and 20 are provided at the edge 12E of the two column members 12A and 12B of the column portion 8 as an example. However, the prescribed portions may be provided between other conductors.

[0074] like Fig.10 As shown, in the coil component 1B, the column 8 and the first wiring portion 6 have a contact surface 21. The contact surface 21 is the surface where the column 8 and the first wiring portion 6 are in contact. A prescribed portion 22 is provided between the column (first conductor) 8 and the first wiring portion (second conductor) 6. The prescribed portion 22 is arranged on the column 8. The prescribed portion 22 stipulates the contact surface 21 between the column 8 and the first wiring portion 6. The prescribed portion 22 stipulates the size of the contact area of ​​the contact surface 21 between the column 8 and the first wiring portion 6. The prescribed portion 22 is formed of a material different from the material (Cu) forming the column 8 and the first wiring portion 6, that is, an inorganic substance. The prescribed portion 22 is, for example, Cr, titanium oxide, etc. The conductivity of the prescribed portion 22 is lower than the conductivity of the column 8 and the first wiring portion 6.

[0075] When viewed from the second direction D2 (stacking direction), the prescribed portion 22 is arranged at the edge 8E of the column 8. The edge 8E of the column 8 is a concept that includes a portion at a prescribed distance from the side of the column 8 to the inside. The prescribed portion 22 is in the shape of a rectangular frame. The shape of the contact surface 21 prescribed by the prescribed portion 22 is similar to the outer shape of the column 8. The shape of the contact surface 21 is rectangular. That is, the shape of the inner side of the prescribed portion 22 is rectangular.

[0076] The prescribed portion 22 prescribes the contact surface 21 so that the area of ​​the contact surface 21 is 20% to 80% of the area of ​​the end surface of the pillar portion 8. That is, the width of the prescribed portion 22 is set so that the area of ​​the contact surface 21 is 20% to 80% of the area of ​​the end surface of the pillar portion 8. The thickness T of the prescribed portion 22 is, for example, 10 nm to 30 nm.

[0077] In the coil component 1B, a prescribed portion 22 for prescribing a contact surface 21 between the column 8 and the first wiring portion 6 is provided between the column 8 and the first wiring portion 6. The prescribed portion 22 is formed of a material different from that of the column 8 and the first wiring portion 6, and is disposed at the edge 8E of the column 8 as viewed from the second direction D2. Thus, in the coil component 1B, even when a stacking offset occurs between the column 8 and the first wiring portion 6, the contact surface 21 between the column 8 and the first wiring portion 6 is prescribed by the prescribed portion 22, so that the contact area between the column 8 and the first wiring portion 6 is kept constant. Therefore, in the coil component 1B, even when an offset occurs between the column 8 and the first wiring portion 6, the characteristics are not affected. As a result, in the coil component 1B, the occurrence of characteristic deviation can be suppressed.

[0078] like Fig.11 As shown, in the coil component 1C, a prescribed portion 23 is provided between the column portion 8 and the first wiring portion 6. The prescribed portion 23 prescribes the contact surface 21 between the column portion 8 and the first wiring portion 6. The prescribed portion 23 prescribes the size of the contact area between the column portion 8 and the contact surface 21 of the first wiring portion 6. The prescribed portion 23 is formed by a part of the element body 2.

[0079] When viewed from the second direction D2 (stacking direction), the prescribed portion 23 is arranged at the edge 8E of the column 8. The edge 8E of the column 8 is a concept including a portion at a prescribed distance from the side surface of the column 8 to the inside. The edge 8E of the column 8 is composed of a curved surface connecting the side surface of the column 8 and the contact surface 21. The prescribed portion 23 is arranged at a position corresponding to the curved surface when viewed from the second direction D2.

[0080] In the coil component 1C, a prescribed portion 23 for prescribing a contact surface 21 between the column 8 and the first wiring portion 6 is provided between the column 8 and the first wiring portion 6. The prescribed portion 23 is formed by a portion of the element body 2, and is disposed at the edge 8E of the column 8 when viewed from the second direction D2. Thus, in the coil component 1C, even when a stacking offset occurs between the column 8 and the first wiring portion 6, the contact surface 21 between the column 8 and the first wiring portion 6 is prescribed by the prescribed portion 23, and thus the contact area between the column 8 and the first wiring portion 6 is kept constant. Therefore, in the coil component 1C, even when an offset occurs between the column 8 and the first wiring portion 6, the characteristics are not affected. As a result, in the coil component 1B, the occurrence of characteristic deviation can be suppressed.

[0081] Furthermore, in the above-described modification, the example in which the prescribed portions 22 and 23 are provided between the column portion 8 and the first wiring portion 6 is described as an example, but the prescribed portion may be provided between the column portion 8 and the second wiring portion 7 .

[0082] In the above embodiment, the first terminal electrode 3 and the second terminal electrode 4 are described as an example in which they do not protrude from the main surface 2d. That is, the first terminal electrode 3 and the second terminal electrode 4 are described as an example in which the surfaces of the first terminal electrode 3 and the second terminal electrode 4 are the same surface as the main surface 2d. However, the first terminal electrode 3 and the second terminal electrode 4 may also protrude from the main surface 2d.

Claims

1. An electronic component, wherein: have: a body formed by laminating a plurality of insulating layers; and a conductor disposed in the element body and extending in a stacking direction of the plurality of insulating layers, The conductor has a plurality of conductor parts stacked in the stacking direction, A defining portion defining a contact surface between the two conductor components is provided between the two conductor components in the stacking direction. The prescribed portion is formed of a material different from that of the conductor, and is arranged at an edge portion of the two conductor members when viewed in the stacking direction.

2. The electronic component according to claim 1, wherein The conductor is formed of Cu, The predetermined portion is formed of an inorganic substance different from Cu.

3. The electronic component according to claim 1 or 2, wherein: When viewed from the stacking direction, the contact surface defined by the defining portion has a shape similar to an outer shape of the conductor.

4. The electronic component according to claim 1, wherein The prescribed portion is formed of the same material as that of the element body.

5. The electronic component according to claim 4, wherein The edge of one of the two conductor parts is formed by a curved surface connecting a side surface of the conductor part and the contact surface. The prescribed portion is arranged at a position corresponding to the curved surface when viewed from the stacking direction.

6. An electronic component, wherein: have: A body formed by laminating a plurality of insulating layers; A first conductor is disposed in the element body and extends in a stacking direction of the plurality of insulating layers; as well as a second conductor connected to the first conductor, A defining portion defining a contact surface between the first conductor and the second conductor is provided between the first conductor and the second conductor. The predetermined portion is formed of a material different from that of the first conductor and the second conductor, and is arranged at an edge of the first conductor when viewed in the stacking direction.

7. The electronic component according to claim 6, wherein The first conductor and the second conductor are formed of Cu, The predetermined portion is formed of an inorganic substance different from Cu.

8. The electronic component according to claim 6 or 7, wherein: When viewed from the stacking direction, the contact surface defined by the defining portion has a shape similar to an outer shape of the first conductor.

9. The electronic component according to claim 6, wherein The prescribed portion is formed of the same material as that of the element body.

Images