Planar transformer and vehicle-mounted electric energy converter
By adopting double-layer copper strips and optimized heat dissipation paths in the planar transformer of the vehicle-mounted electric energy converter, the problem of large volume and weight of the planar transformer is solved, and efficient heat dissipation and lightweight effects are achieved.
Patent Information
- Application Number
- CN202411978316.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-04-01
AI Technical Summary
Among the existing vehicle-mounted electric energy converters, the planar transformer has a large volume and weight, making it difficult to meet the needs of lightweight and efficient heat dissipation.
By adopting a double-layer copper strip structure and an optimized heat dissipation path, including setting up two upper and lower copper strips on the printed circuit board, and setting up thermally conductive step copper particles on the lower surface of the magnetic core, the external dissipation path of heat is enhanced.
While ensuring electrical performance, it improves heat dissipation efficiency, reduces volume and weight, and meets the needs of on-board electrical energy converters for lightweight and efficient heat dissipation.
Smart Images

Figure CN119742162A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of vehicle-mounted power supplies, and in particular to a planar transformer and a vehicle-mounted power converter. Background Art
[0002] In vehicle-mounted power converters (such as vehicle-mounted chargers or DC converters), planar transformers play a key role, which determines the electrical performance of the entire charger. Reducing the size and weight of planar transformers is also the current mainstream trend. Planar transformers consist of at least three parts: the magnetic core, the primary coil, and the secondary coil.
[0003] In the prior art, the primary coil is arranged inside the printed circuit board and extends to the outside of the printed circuit board for heat dissipation; the secondary coil is realized by using a large number of copper bars of patch on the printed circuit board (the copper bars are not designed as an integral whole) to carry current and dissipate heat.
[0004] However, the structure of the planar transformer in the prior art results in a larger volume and weight of the planar transformer. Summary of the invention
[0005] The purpose of the present invention is to provide a planar transformer and an on-board power converter, which can improve the heat dissipation efficiency, reduce the volume and weight while ensuring the electrical performance through a double-layer copper busbar and an optimized heat dissipation path, thereby meeting the requirements of the on-board power converter for lightweight and efficient heat dissipation.
[0006] In a first aspect, the present application provides a planar transformer, comprising:
[0007] A primary side, provided in a printed circuit board;
[0008] The secondary side includes two copper bars, wherein the first copper bar is arranged on the upper layer of the printed circuit board, and the second copper bar is arranged on the lower layer of the printed circuit board;
[0009] A magnetic core, wherein the magnetic column of the magnetic core sequentially penetrates the first copper bar, the printed circuit board and the second copper bar from top to bottom, the upper surface of the magnetic core is arranged above the first copper bar, the lower surface of the magnetic core is arranged below the second copper bar, the magnetic column is located between the upper surface and the lower surface of the magnetic core, the first copper bar extends from the upper surface of the magnetic core, and the second copper bar extends from the lower surface of the magnetic core;
[0010] At least one thermally conductive step copper particle extends from the second portion of the copper row on the lower layer of the printed circuit board.
[0011] Optionally, the thermally conductive step copper particles are specifically adjacent to the second portion of the copper bar on the lower layer of the printed circuit board, and penetrate the printed circuit board to be attached to the first portion of the copper bar on the upper layer of the printed circuit board.
[0012] Optionally, the first portion of the copper bar includes a first copper bar submodule surrounding the magnetic column and covering the magnetic core, and a second copper bar submodule connected to the first copper bar submodule and exposed outside the magnetic core;
[0013] The second copper bar portion includes a third copper bar submodule surrounding the magnetic column and covering the magnetic core, and a fourth copper bar submodule connected to the third copper bar submodule and exposed outside the magnetic core;
[0014] The area of the fourth copper bar submodule is smaller than the area of the second copper bar submodule.
[0015] Optionally, the thermally conductive step copper particles are adjacent to the fourth copper bar submodule, penetrate the printed circuit board, and adhere to the second copper bar submodule on the upper layer of the printed circuit board.
[0016] Optionally, the magnetic column of the magnetic core is a cylindrical structure.
[0017] Optionally, the structure of the first portion of the copper busbar includes a first Ω-shaped structure, and a first rectangular structure disposed on an upper portion of the first Ω-shaped structure and connected to an arc-shaped outer side of the first Ω-shaped structure;
[0018] The structure of the second copper busbar includes a second Ω-shaped structure and a second rectangular structure disposed on the upper portion of the second Ω-shaped structure and connected to the arc-shaped outer side of the second Ω-shaped structure;
[0019] The width of the first rectangular structure is greater than the width of the second rectangular structure;
[0020] The number of the thermally conductive step copper particles is 2, the first thermally conductive step copper particle is adjacent to the left end of the second Ω-type structure, and passes through the printed circuit board to be bonded to the left end of the first Ω-type structure, and the second thermally conductive step copper particle is adjacent to the right end of the second Ω-type structure, and passes through the printed circuit board to be bonded to the right end of the first Ω-type structure.
[0021] Optionally, the number of the thermally conductive step copper particles is 4;
[0022] The third thermally conductive step copper particle is adjacent to the left end of the second rectangular structure, and penetrates the printed circuit board and adheres to the left end of the first rectangular structure;
[0023] The fourth thermally conductive step copper particle is adjacent to the right end of the second rectangular structure, and penetrates through the printed circuit board and adheres to the right end of the first rectangular structure.
[0024] Optionally, the first portion of the copper bar includes a plurality of split pieces of the first portion of the copper bar, and the second portion of the copper bar includes a plurality of split pieces of the second portion of the copper bar.
[0025] Optionally, it also includes:
[0026] The water cooling module is arranged below the lower surface of the magnetic core and is adjacent to the thermally conductive step copper particles and the lower surface of the magnetic core respectively.
[0027] Optionally, it also includes:
[0028] The thermally conductive adhesive is respectively arranged between the water cooling module and the thermally conductive step copper particles, and between the second portion of the copper bar and the lower surface of the magnetic core.
[0029] In a second aspect, the present application provides a vehicle-mounted power converter, comprising the planar transformer as described above.
[0030] The present invention discloses a planar transformer and an on-board electric energy converter. The copper busbar on the secondary side is divided into two parts, which are respectively arranged on the upper and lower layers of a printed circuit board, and the layout of the copper busbar is optimized by design. This double-layer structure can effectively reduce the size of the copper busbar and effectively increase the heat dissipation surface area of the copper busbar. The copper busbar is not only in direct contact with the magnetic core, but can also extend out of the surface of the magnetic core, which helps to improve the heat dissipation performance. In addition, at least one thermally conductive step copper particle extends from the second part of the copper busbar on the lower layer of the printed circuit board, which can further enhance the external heat dissipation path of the heat and accelerate the conduction and discharge of the heat. It can be seen that the structure of the planar transformer of the present application can improve the heat dissipation efficiency, reduce the volume and weight while ensuring the electrical performance through the double-layer copper busbar and the optimized heat dissipation path, which meets the requirements of the on-board electric energy converter for lightweight and efficient heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0032] Figure 1 An exploded schematic diagram of a planar transformer provided by the present invention;
[0033] Figure 2 An overall schematic diagram of a planar transformer provided by the present invention;
[0034] Figure 3 A schematic diagram of a first copper busbar provided by the present invention;
[0035] Figure 4 A schematic diagram of a second copper busbar provided by the present invention;
[0036] Figure 5 A schematic diagram of a first copper busbar provided by the present invention comprising two separate parts;
[0037] Figure 6 A schematic diagram of another first copper busbar provided by the present invention including two separate parts;
[0038] Figure 7 A schematic diagram of a first copper busbar provided by the present invention comprising four separate parts. DETAILED DESCRIPTION
[0039] The core of the present invention is to provide a planar transformer and an on-board power converter. Through a double-layer copper busbar and an optimized heat dissipation path, while ensuring electrical performance, the heat dissipation efficiency can be improved, the volume and weight can be reduced, and the requirements of the on-board power converter for lightweight and efficient heat dissipation can be met.
[0040] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0041] First, as Figure 1 and Figure 2 As shown, the present application provides a planar transformer, comprising:
[0042] The primary side is arranged in the printed circuit board 4;
[0043] The secondary side includes two copper bars, wherein the first copper bar 3 is arranged on the upper layer of the printed circuit board 4, and the second copper bar 5 is arranged on the lower layer of the printed circuit board 4;
[0044] A magnetic core 1, wherein a magnetic column of the magnetic core 1 sequentially penetrates a first copper bar 3, a printed circuit board 4, and a second copper bar 5 from top to bottom, an upper surface of the magnetic core 1 is arranged above the first copper bar 3, a lower surface of the magnetic core 1 is arranged below the second copper bar 5, the magnetic column is located between the upper surface and the lower surface of the magnetic core 1, the first copper bar 3 extends from the upper surface of the magnetic core 1, and the second copper bar 5 extends from the lower surface of the magnetic core 1;
[0045] At least one thermally conductive step copper particle 6 extends from the second portion of the copper bus 5 on the lower layer of the printed circuit board 4 .
[0046] In this embodiment, the core idea of the planar transformer design is to achieve more efficient current transmission and heat dissipation by optimizing the structure of the copper busbar and the design of the magnetic core 1 and adding thermal conductive step copper particles 6, thereby improving the transformer efficiency while reducing its volume and weight. The innovation of this design is that it takes into account both current transmission efficiency and heat dissipation performance, breaking through the limitations of traditional designs.
[0047] The primary side of the transformer is arranged inside the printed circuit board 4. This design helps to simplify the structure and reduce the external space occupied. Compared with the traditional design, the primary side is directly combined with the conductor layer in the circuit board, which avoids additional space consumption and can improve electrical performance and stability.
[0048] The secondary side adopts a two-layer copper busbar design, which is located on the upper and lower layers of the circuit board respectively. They extend from the surface of the corresponding magnetic core 1 respectively. The copper busbar and the magnetic core 1 can be in contact with each other through the thermal conductive insulating material, which helps to improve the heat dissipation performance. This layout design enables the secondary side copper busbar to effectively carry current while improving the heat dissipation function.
[0049] The magnetic column of the magnetic core 1 runs through the entire copper bar and is effectively coupled with the copper bar, optimizing the distribution of the magnetic field and the power conversion efficiency. The size of the magnetic core 1 is relatively compact, reducing the shortcomings of the large volume and heavy weight of the magnetic core 1 in the traditional transformer. At the same time, by reasonably designing its area, it ensures that the magnetic properties of the magnetic core 1 match the current transmission capacity of the copper bar.
[0050] In addition, this embodiment also places special emphasis on heat dissipation. In order to solve the heat dissipation problem of the planar transformer, a thermally conductive step copper particle 6 is introduced into the design, which can effectively conduct heat from the copper busbar and circuit board inside the transformer to the external environment. When the temperature of the second copper busbar 5 of the lower layer of the circuit board rises, the thermally conductive step copper particle 6 absorbs and conducts heat through direct connection with the second copper busbar 5. The copper material itself has a high thermal conductivity, so it can quickly transfer heat from the internal heat source area to the outside. Through the extended thermally conductive step copper particles, heat can be transferred more directly to the outside of the transformer, avoiding heat accumulation in the circuit board and internal structure, thereby accelerating heat discharge. This design effectively increases the heat dissipation area and provides a smoother discharge path for heat, thereby improving the overall heat dissipation efficiency of the transformer, reducing the risk of temperature increase, and ensuring the stability and reliability of the equipment during long-term operation.
[0051] As a preferred embodiment, the thermally conductive step copper particles 6 are specifically adjacent to the second copper bar 5 of the lower layer of the printed circuit board 4, and penetrate the printed circuit board 4 and fit the first copper bar 3 of the upper layer of the printed circuit board 4. Adjacent to the second copper bar 5, and penetrate the entire circuit board and fit the first copper bar 3 of the upper layer, the heat conduction path and heat dissipation effect can be further optimized. First, the close contact between the thermally conductive step copper particles 6 and the second copper bar 5 of the lower layer ensures that heat can be efficiently transferred from the lower layer of the circuit board to the thermally conductive step copper particles, avoiding the accumulation of heat and local overheating. Secondly, the thermally conductive step copper particles 6 penetrate the entire circuit board and fit the first copper bar 3 of the upper layer. Such a design enhances the heat conduction efficiency between the upper and lower layers of copper bars, helps to quickly transfer heat from the inside of the transformer to the outside of the circuit board, and promotes heat dissipation. That is, the role of the thermally conductive step copper particles 6 is to transfer the heat generated by the copper bars of the secondary side and the primary side to the outside of the copper bars, further enhancing the heat dissipation effect. Through this design, the thermally conductive step copper particles 6 not only accelerate the discharge of heat, but also avoid the retention of heat inside the circuit board, thereby improving the heat dissipation performance of the entire transformer. The transformer can maintain a good operating temperature under high load or high temperature environment, avoiding performance degradation or damage caused by overheating.
[0052] In summary, the design of the planar transformer comprehensively considers the dual needs of current transmission and heat dissipation. Through the optimization of the copper busbar structure and the design of the magnetic core 1, the transformer can not only improve the electrical efficiency, but also effectively reduce the volume and weight. This design has significant advantages, especially in applications such as on-board power converters that have high requirements on volume and weight.
[0053] As a preferred embodiment, the magnetic column of the magnetic core 1 is a cylindrical structure. This improvement effectively solves some problems existing in the design of traditional square magnetic columns. The circumference of the cylindrical magnetic column is smaller. Compared with the square magnetic column, the cylindrical design reduces the external area of the magnetic core 1, thereby reducing the amount of copper material required. The reduction in copper material directly leads to a reduction in cost, making the production process more economical and efficient.
[0054] In addition to material savings, the cylindrical magnetic column design also brings about a significant improvement in magnetic field closure. The circular magnetic column can better close the magnetic field in structure, which helps to improve the magnetic properties of the magnetic core 1. Effective magnetic field closure means that the magnetic lines of force are more evenly and concentrated inside the magnetic core 1, thereby enhancing the efficiency and energy conversion capability of the magnetic core 1. This design allows the magnetic core 1 to achieve a smaller volume and lighter weight under the same power requirements, which meets the current demand for lightweight and high efficiency, and is particularly suitable for space and weight-constrained application scenarios such as on-board power converters.
[0055] As a preferred embodiment, it also includes: a water cooling module 7, which is arranged below the lower surface of the magnetic core 1, and is adjacent to the thermally conductive step copper particles 6 and the lower surface of the magnetic core 1 respectively; and thermally conductive glue, which is arranged between the water cooling module 7 and the thermally conductive step copper particles 6, and between the second part of the copper bus 5 and the lower surface of the magnetic core 1 respectively.
[0056] In this embodiment, a water cooling module 7, a thermally conductive step copper particle 6 and a thermally conductive adhesive are added to further optimize the heat dissipation performance and solve the heat dissipation problem caused by the design of the magnetic core 1.
[0057] The introduction of the water cooling module 7 is to enhance the heat dissipation capacity of the transformer, especially in high-power working environments, where water cooling technology is widely used due to its efficient heat conduction characteristics. The water cooling module 7 can remove the heat generated by the magnetic core 1 and the copper bar area through liquid circulation, effectively reducing the temperature of the transformer and avoiding performance degradation or failure due to overheating. The water cooling module 7 is adjacent to the thermally conductive step copper particles 6 and the lower surface of the magnetic core 1, ensuring that the heat can be quickly transferred to the water cooling module 7 through the thermally conductive step copper particles 6, and then removed by the water flow. This design not only improves the heat dissipation efficiency, but also helps maintain the stability of the transformer under long-term high-load operation.
[0058] In order to further optimize the heat dissipation path and improve the heat transfer efficiency, thermal conductive glue is also used in the design. As a highly efficient thermal conductive material, thermal conductive glue can fill the gap between the water cooling module 7 and the thermal step copper particles 6, and between the second part of the copper bus 5 and the lower surface of the magnetic core 1, to ensure efficient heat conduction. The use of thermal conductive glue reduces the thermal resistance between the contact interfaces, allowing heat to flow more smoothly from the magnetic core 1 and the copper bus to the water cooling module 7, thereby improving the overall heat dissipation effect. In addition, the use of thermal conductive glue helps to fix and seal various components, enhancing the reliability and durability of the system.
[0059] In summary, the combined design of the water cooling module 7, the thermally conductive step copper particles 6 and the thermally conductive adhesive not only solves the shortcomings of the traditional magnetic core 1 design in heat dissipation, but also effectively discharges heat through an efficient heat conduction path, ensuring that the transformer can maintain low temperature operation under high load, thereby improving the working efficiency and service life of the system.
[0060] As a preferred embodiment, the first copper bar 3 includes a first copper bar submodule surrounding the magnetic column and covering the magnetic core 1, and a second copper bar submodule connected to the first copper bar submodule and exposed outside the magnetic core 1;
[0061] The second copper bar 5 includes a third copper bar submodule surrounding the magnetic column and covering the magnetic core 1, and a fourth copper bar submodule connected to the third copper bar submodule and exposed outside the magnetic core 1;
[0062] The area of the fourth copper bar submodule is smaller than the area of the second copper bar submodule.
[0063] Specifically, the core idea of the present embodiment is to divide the copper bar into two sub-modules, the inner and outer sub-modules, which can not only optimize the transmission efficiency of the current, but also better control the distribution and dissipation of heat. First, the first copper bar sub-module and the third copper bar sub-module can effectively carry a large current and ensure the normal operation of the transformer by closely surrounding the magnetic core 1 and covering the inside of the magnetic core 1. The second copper bar sub-module and the fourth copper bar sub-module are exposed outside the magnetic core 1, and in addition to performing the current transmission function, they also play an important role in the heat dissipation process. By dividing the copper bar module into an inner and outer structure, the heat dissipation surface area of the copper bar can be increased while ensuring electrical performance, thereby improving the heat dissipation effect.
[0064] Furthermore, the area of the fourth copper bar submodule is smaller than that of the second copper bar submodule, and this design helps to optimize the distribution of heat. The larger area of the second copper bar submodule provides a larger heat dissipation surface, which helps to reduce the operating temperature of the entire transformer, and the smaller area allows the fourth copper bar submodule to be adjacent to the heat conduction module. In addition, the connection design between the copper bar submodules effectively avoids the concentration of heat in a certain part, thereby ensuring that the heat is evenly distributed between multiple copper bar modules, improving the overall heat dissipation efficiency.
[0065] As a preferred embodiment, the thermally conductive step copper particles 6 are adjacent to the fourth copper bar submodule, penetrate the printed circuit board 4 , and are attached to the second copper bar submodule on the upper layer of the printed circuit board 4 .
[0066] Specifically, the design of the thermally conductive step copper particles 6 is adjacent to the fourth copper row submodule and runs through the printed circuit board 4, and is fitted with the second copper row submodule on the upper layer of the printed circuit board 4, further enhancing the overall heat dissipation effect. Since the heat accumulation between the copper row and the magnetic core 1 may cause excessive temperature, affecting the performance and reliability of the transformer, the main function of the thermally conductive step copper particles 6 is to quickly conduct the heat generated during the operation of the transformer from the copper row area to the external heat dissipation system or other cooling equipment through its excellent thermal conductivity. Since the thermally conductive step copper particles 6 are adjacent to the fourth copper row submodule, they can effectively receive and conduct the heat emitted by the fourth copper row submodule. At the same time, the thermally conductive step copper particles 6 run through the entire printed circuit board 4 to ensure that the heat can be quickly exported from the inside of the circuit board through the heat conduction path. The thermally conductive step copper particles 6 are fitted with the second copper row submodule on the upper layer of the printed circuit board 4. This layout enables the thermally conductive step copper particles 6 to directly contact the upper copper row, thereby further accelerating the transfer of heat. Through this design, heat can be conducted from the second copper row submodule to the thermally conductive step copper particles 6, and then effectively guided to the external heat dissipation system to prevent overheating caused by heat accumulation.
[0067] In general, by adding the thermally conductive step copper particles 6 between the copper busbar modules, not only the heat conduction path is optimized, but also the heat dissipation efficiency is improved. The location of the thermally conductive step copper particles 6 makes the thermal contact between them and the heat source closer, ensuring that the heat can be quickly and effectively discharged.
[0068] like Figure 3 , shows the structure of the first copper bus 3, such as Figure 4 , shows the structure of the second copper busbar 5, wherein 8 is the primary side arranged in the printed circuit board 4, which is not shown in other figures.
[0069] As a preferred embodiment, the structure of the first copper busbar 3 includes a first Ω-shaped structure, and a first rectangular structure disposed on the upper portion of the first Ω-shaped structure and connected to the arc-shaped outer side of the first Ω-shaped structure;
[0070] The structure of the second copper busbar 5 includes a second Ω-shaped structure and a second rectangular structure disposed on the upper portion of the second Ω-shaped structure and connected to the arc-shaped outer side of the second Ω-shaped structure;
[0071] The width of the first rectangular structure is greater than the width of the second rectangular structure;
[0072] The number of thermally conductive step copper particles 6 is 2. The first thermally conductive step copper particle 6 is adjacent to the left end of the second Ω-type structure, and passes through the printed circuit board 4 to fit the left end of the first Ω-type structure. The second thermally conductive step copper particle 6 is adjacent to the right end of the second Ω-type structure, and passes through the printed circuit board 4 to fit the right end of the first Ω-type structure.
[0073] In this embodiment, the design effectively optimizes the current transmission and heat dissipation performance by adopting a combination of the Ω-shaped structure and the rectangular structure of the first copper bar 3 and the second copper bar 5. The first copper bar 3 includes a first Ω-shaped structure and a first rectangular structure connected to its upper portion, and the second copper bar 5 includes a second Ω-shaped structure and a second rectangular structure connected to its upper portion. The width of the first rectangular structure is greater than the width of the second rectangular structure, and this design can effectively distribute current and heat. Specifically, the first rectangular structure is wider and can carry more current, which helps to reduce the heat generated when the current passes through, while the second rectangular structure is narrower and is suitable for carrying less current and providing auxiliary functions of heat dissipation.
[0074] The use of the Ω-shaped structure has several advantages. First, the Ω-shaped copper busbar structure surrounds the circular magnetic column and provides a larger surface area, thereby improving the heat conduction efficiency. Through the Ω-shaped inner and outer layer layout, the copper busbar can simultaneously carry current and conduct heat. This structure helps to reduce the impedance of the current flowing through the copper busbar, improve electrical performance, and optimize heat distribution, avoiding heat concentration in a certain part and improving the heat dissipation effect.
[0075] The design of the thermally conductive step copper particles 6 further optimizes the heat dissipation path. For example, the number of the thermally conductive step copper particles 6 is 2 (but in the specific implementation, it is not limited to 2), which are respectively adjacent to the left and right ends of the second Ω-shaped structure, and penetrate the printed circuit board 4, respectively fitting with the left and right ends of the first Ω-shaped structure. This layout ensures that heat can be evenly transferred from both ends of the copper bar to the thermally conductive step copper particles 6, and then the heat is effectively guided out of the transformer through the thermally conductive step copper particles 6. Through this precise design, the thermally conductive step copper particles 6 can help better disperse and guide heat and avoid local overheating problems.
[0076] In general, the combination of the Ω-shaped structure and the rectangular structure, by optimizing the geometric shape and heat conduction path of the copper busbar and the reasonable layout of the thermal step copper particles 6, not only improves the electrical performance and current carrying capacity of the transformer, but also enhances the heat dissipation efficiency.
[0077] As a preferred embodiment, the number of the thermally conductive step copper particles 6 is 4;
[0078] The third thermally conductive step copper particle 6 is adjacent to the left end of the second rectangular structure, and penetrates the printed circuit board 4 and fits with the left end of the first rectangular structure;
[0079] The fourth thermally conductive step copper particle 6 is adjacent to the right end of the second rectangular structure, and passes through the printed circuit board 4 to fit the right end of the first rectangular structure.
[0080] In this embodiment, if the number of the thermally conductive step copper particles 6 is increased to at least 4 (but in the specific implementation, it is not limited to 4), the heat dissipation effect is further optimized and the overall thermal management performance is improved. Specifically, the design of the third and fourth thermally conductive step copper particles 6 is closely matched with the layout between the second rectangular structure and the first rectangular structure, ensuring that heat can be effectively transferred from various areas of the transformer to the external heat dissipation system.
[0081] The number of thermally conductive step copper particles 6 is increased to disperse heat more effectively, especially in high-power applications where the transformer generates a lot of heat. If there are only a few thermally conductive step copper particles 6, it may not be able to fully cover the entire heat dissipation demand, resulting in local overheating. By using four thermally conductive step copper particles 6, the design can provide more heat conduction paths, thereby significantly improving the heat dissipation efficiency and ensuring the stability and reliability of the transformer when working under high load.
[0082] The introduction of the third and fourth thermally conductive step copper particles 6 fits the left and right ends of the first rectangular structure respectively. This design ensures that the heat is not only conducted to the outside by the two thermally conductive step copper particles 6, but also accelerates the flow of heat through more paths, reducing the risk of heat accumulation. Through this fine layout, heat can be more evenly extracted from different areas of the transformer, thereby preventing local temperatures from being too high and further improving the heat dissipation performance of the transformer.
[0083] As a preferred embodiment, the first copper bar 3 includes a plurality of split parts of the first copper bar 3 , and the second copper bar 5 includes a plurality of split parts of the second copper bar 5 .
[0084] Furthermore, in order to cope with the challenges brought by the increase in transformer power, the design introduces a solution to split the secondary copper busbar. The core goal of this design idea is to solve the problem of excessive weight that may be caused by a single-layer copper busbar (that is, the first copper busbar 3 or the second copper busbar 5 is a whole) under high power conditions, especially the risks that may arise in the PCB surface mounting process, such as difficulty in suction cup adsorption, bending and deformation of the PCBA, etc. By dividing the secondary copper busbar into multiple separate parts, the design effectively reduces the weight of a single copper busbar, thereby avoiding these potential production and operation problems.
[0085] Separating the secondary copper busbar not only helps reduce the weight of the busbar, but also reduces the mechanical stress on the PCB surface caused by the oversized busbar, thereby improving the stability of the overall structure. By dividing the secondary copper busbar into multiple separate parts, the staff can optimize the heat dissipation performance without sacrificing the integrity of the current path. Although the design of the separate parts may slightly reduce the continuity of the current path, the heat dissipation effect is almost unaffected through reasonable distribution and layout, ensuring that the transformer can still maintain good heat dissipation performance when working at high power.
[0086] For example, Figure 5 and Figure 6 By splitting the secondary copper bar into two, or Figure 7 In the embodiment, the copper busbar 5 is divided into four equal parts symmetrically from the center, that is, the first or second part of the copper busbar 5 is divided into two or four relatively evenly spaced parts (such as the area difference between the parts is within a preset range), so that the current and heat dissipation burden carried by each part are relatively evenly spaced, and a single copper busbar is prevented from carrying too much heat, thereby reducing the risk of local overheating. In addition, this design method also enhances the flexibility of the production process, and can more easily handle and control the stress on the PCB surface during the assembly process, thereby improving the reliability and efficiency of production.
[0087] In the second aspect, the present application provides an on-vehicle power converter, including the planar transformer as described above. It also includes an on-vehicle charger OBC and a DC converter DCDC. For other introductions to the on-vehicle power converter, please refer to the above embodiments, and the present application will not repeat them here.
[0088] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.
[0089] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A planar transformer, characterized in that: include: A primary side, provided in a printed circuit board; The secondary side includes two copper bars, wherein the first copper bar is arranged on the upper layer of the printed circuit board, and the second copper bar is arranged on the lower layer of the printed circuit board; A magnetic core, wherein the magnetic column of the magnetic core sequentially penetrates the first copper bar, the printed circuit board and the second copper bar from top to bottom, the upper surface of the magnetic core is arranged above the first copper bar, the lower surface of the magnetic core is arranged below the second copper bar, the magnetic column is located between the upper surface and the lower surface of the magnetic core, the first copper bar extends from the upper surface of the magnetic core, and the second copper bar extends from the lower surface of the magnetic core.
2. The planar transformer according to claim 1, characterized in that: At least one thermally conductive step copper particle extends from the second portion of the copper bar on the lower layer of the printed circuit board. The thermally conductive step copper particle is specifically adjacent to the second portion of the copper bar on the lower layer of the printed circuit board, and penetrates the printed circuit board and adheres to the first portion of the copper bar on the upper layer of the printed circuit board.
3. The planar transformer according to claim 2, characterized in that: The first copper bar portion includes a first copper bar submodule surrounding the magnetic column and covering the magnetic core, and a second copper bar submodule connected to the first copper bar submodule and exposed outside the magnetic core; The second copper bar portion includes a third copper bar submodule surrounding the magnetic column and covering the magnetic core, and a fourth copper bar submodule connected to the third copper bar submodule and exposed outside the magnetic core; The area of the fourth copper bar submodule is smaller than the area of the second copper bar submodule.
4. The planar transformer according to claim 3, characterized in that: The thermally conductive step copper particles are adjacent to the fourth copper bar submodule, penetrate the printed circuit board, and are attached to the second copper bar submodule on the upper layer of the printed circuit board.
5. The planar transformer according to claim 2, characterized in that: The magnetic column of the magnetic core is a cylindrical structure.
6. The planar transformer according to claim 5, characterized in that: The structure of the first copper busbar includes a first Ω-shaped structure and a first rectangular structure disposed on the upper portion of the first Ω-shaped structure and connected to the arc-shaped outer side of the first Ω-shaped structure; The structure of the second copper busbar includes a second Ω-shaped structure and a second rectangular structure disposed on the upper portion of the second Ω-shaped structure and connected to the arc-shaped outer side of the second Ω-shaped structure; The width of the first rectangular structure is greater than the width of the second rectangular structure; The number of the thermally conductive step copper particles is 2, the first thermally conductive step copper particle is adjacent to the left end of the second Ω-type structure, and passes through the printed circuit board to be bonded to the left end of the first Ω-type structure, and the second thermally conductive step copper particle is adjacent to the right end of the second Ω-type structure, and passes through the printed circuit board to be bonded to the right end of the first Ω-type structure.
7. The planar transformer according to claim 6, characterized in that: The number of the thermally conductive step copper particles is 4; The third thermally conductive step copper particle is adjacent to the left end of the second rectangular structure, and penetrates the printed circuit board and adheres to the left end of the first rectangular structure; The fourth thermally conductive step copper particle is adjacent to the right end of the second rectangular structure, and penetrates through the printed circuit board and adheres to the right end of the first rectangular structure.
8. The planar transformer according to claim 6, characterized in that: The first portion of the copper bar includes a plurality of split parts of the first portion of the copper bar, and the second portion of the copper bar includes a plurality of split parts of the second portion of the copper bar.
9. The planar transformer according to any one of claims 1 to 8, characterized in that: Also includes: The water cooling module is arranged below the lower surface of the magnetic core and is adjacent to the thermally conductive step copper particles and the lower surface of the magnetic core respectively.
10. A vehicle-mounted electric energy converter, characterized in that: Comprising a planar transformer as described in any one of claims 1-9.