A wafer carrier device for semiconductor device manufacturing

Abstract

The present invention relates to the technical field of semiconductor device manufacturing, and provides a wafer carrier device for semiconductor device manufacturing, which includes a carrier frame, a carrier cover and a wafer. An accommodation groove is provided on the carrier frame; the carrier cover is detachably fixed on the carrier frame; it further includes a composite cover and an elastic sealing ring. The composite cover is arranged on the carrier cover and encloses with it to form an adjustment cavity, and the volume of the adjustment cavity is adjustable; a ventilation hole is provided in the carrier frame, and the ventilation hole penetrates through the carrier frame; the elastic sealing ring is hermetically fixed in the ventilation hole; the wafer is abutted and arranged on one side of the elastic sealing ring close to the carrier cover and is spaced from the carrier frame. By providing an adjustment cavity and a ventilation hole communicated with the accommodation groove and making the volume of the adjustment cavity adjustable, when the carrier cover is connected to the carrier frame, the wafer can be stably and evenly pressed against the elastic sealing ring, thereby improving the processing safety of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device manufacturing, and in particular, to a wafer carrier device for semiconductor device manufacturing. Background Art

[0002] Wafers are raw materials for manufacturing related products in the semiconductor field. During the manufacturing process of semiconductor devices, a special wafer carrier device needs to be designed to carry the wafers to ensure the smooth progress of wafer processing operations.

[0003] The utility model with the publication number CN212967633U discloses a wafer cassette, which includes: the top cover is detachably connected to the bottom cover; the pressing mechanism includes: a connecting plate and more than three pressing claws; the connecting plate can be arranged between the bottom cover and the top cover; the first ends of more than three pressing claws are fixedly connected to the connecting plate; more than three supporting blocks are fixedly arranged on the bottom cover, and more than three supporting blocks correspond to more than three pressing claws one by one; placement grooves are formed on the supporting blocks, and the second ends of the pressing claws can be pressed into the corresponding placement grooves. This wafer cassette is easy to operate and can lock the wafers, so that the wafers will not slide when the opening operation is transferred.

[0004] In the above technical solution, in order to improve the locking degree of the wafers, multiple pressing claws and multiple supporting blocks are provided to press and fix the wafers. However, this pressing method not only easily damages the surface of the wafers, but also easily causes uneven pressure, which is not conducive to ensuring the processing safety of the wafers. Summary of the Invention

[0005] In view of this, the present invention provides a wafer carrier device for semiconductor device manufacturing, which can lock the wafers smoothly and evenly, and improve the processing safety of the wafers.

[0006] The technical solution of the present invention is realized as follows: The present invention provides a wafer carrier device for semiconductor device manufacturing, including a carrier frame, a carrier cover and wafers, wherein,

[0007] The carrier frame is provided with a receiving groove;

[0008] The carrier cover is detachably fixed on the carrier frame and seals the receiving groove;

[0009] It further includes a composite cover and an elastic sealing ring, wherein,

[0010] The composite cover is arranged on the carrier cover and encloses a regulating cavity with it. The regulating cavity is communicated with the receiving groove, and the volume of the regulating cavity is adjustable;

[0011] The carrier is provided with ventilation holes which penetrate through the carrier and communicate with the receiving groove; the elastic sealing ring is fixedly sealed in the ventilation holes, and a part of the elastic sealing ring extends out of the ventilation holes;

[0012] The wafer is abutted against one side of the elastic sealing ring close to the carrier cover and is spaced from the carrier.

[0013] On the basis of the above technical solutions, preferably, the composite cover includes a cover body and a convex ring, wherein,

[0014] The cover body is sleeved outside the carrier cover and is slidably connected thereto;

[0015] A clamping groove is formed on the peripheral side of the carrier cover, the convex ring is fixedly arranged in the cover body and can be clamped with the clamping groove, and when the convex ring is clamped with the clamping groove, the cover body abuts against the carrier.

[0016] More preferably, the carrier cover is connected to the carrier through threaded cooperation, a ring groove is formed at one end of the peripheral side of the carrier cover close to the carrier, and a limiting groove is formed on one side of the ring groove far from the carrier;

[0017] The composite cover further includes a limiting block which is fixedly arranged in the cover body, is clamped with the limiting groove and is rotatably connected with the ring groove.

[0018] More preferably, the composite cover further includes a spring, and two ends of the spring respectively abut against one side of the cover body close to the carrier and one side of the carrier cover far from the carrier;

[0019] A communication hole is formed in the middle of the carrier cover, and the communication hole communicates with the adjusting cavity and the receiving groove.

[0020] On the basis of the above technical solutions, preferably, a negative pressure mechanism is further included, and the negative pressure mechanism includes a piston plate, a connecting frame and a sliding rod, wherein,

[0021] The piston plate seals and slides in the ventilation hole;

[0022] The connecting frame is fixedly arranged on one side of the piston plate far from the elastic sealing ring;

[0023] The sliding rod penetrates through and is slidably arranged on the carrier, and one end of the sliding rod is fixedly connected with the connecting frame.

[0024] More preferably, one end of the sliding rod far from the connecting frame abuts against one side of the composite cover close to the carrier;

[0025] The negative pressure mechanism further includes an elastic block, which is fixedly arranged on the carrier and abuts against the side of the connecting frame away from the piston plate.

[0026] More preferably, the ventilation hole includes an installation part and a pressure regulating part, where,

[0027] The installation part is opened on the side of the carrier close to the carrier cover and is located in the accommodation groove, and the elastic sealing ring is fixedly sealed in the installation part;

[0028] The pressure regulating part is opened on the side of the carrier away from the carrier cover and is communicated with the installation part. The piston plate is slidably sealed in the pressure regulating part, and the inner diameter of the pressure regulating part is larger than that of the installation part.

[0029] More preferably, a plurality of the ventilation holes and the elastic sealing rings are provided and correspond to each other one by one;

[0030] One of the ventilation holes is coaxially arranged with the accommodation groove, and the remaining plurality of ventilation holes are arranged in a circumferential array around the axis of the accommodation groove.

[0031] More preferably, the piston plate includes a first movable plate, a sealing box and a second movable plate, where,

[0032] The first movable plate is slidably sealed in the ventilation hole at the middle position;

[0033] The sealing box is slidably sealed in the ventilation hole at the outer edge position and corresponds to it one by one. A T-shaped groove is opened on the side of the sealing box away from the carrier cover;

[0034] The second movable plate is slidably arranged in the T-shaped groove, and both the second movable plate and the first movable plate are fixedly connected to the connecting frame.

[0035] More preferably, the cross-section of the carrier is a rounded rhombus, and the cross-sections of the carrier cover and the composite cover are both circular.

[0036] A wafer carrier device for semiconductor device manufacturing according to the present invention has the following

[0037] Beneficial effects:

[0038] (1) By providing an adjustment cavity and a ventilation hole communicated with the accommodation groove and making the volume of the adjustment cavity adjustable, when the carrier cover is connected to the carrier, the wafer can be stably and evenly pressed against the elastic sealing ring, thereby improving the processing safety of the wafer;

[0039] (2) By setting the card slot and the convex ring, the relative positions of the composite cover and the carrier cover can be fixed. By setting the ring groove and the spring, it is convenient to restore the composite cover and the carrier cover to their original positions, thus improving the operation convenience of the present carrier device;

[0040] (3) By setting the negative pressure mechanism, the fixing firmness of the wafer can be improved, avoiding the wafer from shifting during the locking process, and facilitating the thin and light design of the present carrier device. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0042] Figure 1 It is a cross-sectional view of a wafer carrier device for semiconductor device manufacturing according to the present invention along its width direction;

[0043] Figure 2 It is a perspective view of the carrier in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0044] Figure 3 It is a partial cross-sectional view inside a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0045] Figure 4 It is a cross-sectional view of the carrier cover and the composite cover in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0046] Figure 5 It is Figure 1 an enlarged view of the unadjusted state of the adjustment cavity at position A in

[0047] Figure 6 It is Figure 1 an enlarged view of the reduced state of the adjustment cavity at position A in

[0048] Figure 7 It is a perspective view of the carrier cover in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0049] Figure 8 It is Figure 7 an enlarged view of position B in

[0050] Figure 9 It is a perspective view of the composite cover in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0051] Figure 10 It isFigure 9 Enlarged view at position C;

[0052] Figure 11 Cross-sectional view of a wafer carrier device for semiconductor device manufacturing according to the present invention along its length direction;

[0053] Figure 12 Stereogram of the connecting frame in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0054] Figure 13 Stereogram of the negative pressure mechanism in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0055] Figure 14 is Figure 11 Enlarged view at position D;

[0056] Figure 15 Cross-sectional view of the first movable plate in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0057] Figure 16 Cross-sectional view of the second movable plate in a wafer carrier device for semiconductor device manufacturing according to the present invention;

[0058] Figure 17 Stereogram of a wafer carrier device for semiconductor device manufacturing according to the present invention.

[0059] Wherein: 1, carrier frame; 101, receiving groove; 102, ventilation hole; 1021, mounting part; 1022, pressure regulating part; 2, carrier cover; 201, card slot; 202, annular groove; 203, limiting groove; 204, communication hole; 3, composite cover; 31, cover body; 32, convex ring; 33, limiting block; 34, spring; 301, adjusting cavity; 4, elastic sealing ring; 5, negative pressure mechanism; 51, piston plate; 511, first movable plate; 512, sealing box; 513, second movable plate; 52, connecting frame; 53, sliding rod; 54, elastic block; 501, T-shaped groove; 6, wafer. Detailed implementation manners

[0060] Next, in combination with the detailed implementation manners of the present invention, the technical solutions in the present invention will be clearly and completely described. Obviously, the described implementation manners are only a part of the implementation manners of the present invention, rather than all of the implementation manners. Based on the implementation manners in the present invention, all other implementation manners obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0061] Such as Figure 1As shown in the figure, a wafer carrier device for semiconductor device manufacturing according to the present invention includes a carrier 1, a carrier cover 2, a composite cover 3, an elastic sealing ring 4, a negative pressure mechanism 5, and a wafer 6, which is used in the manufacturing process of semiconductor devices.

[0062] Among them, the carrier 1 is the main component of this carrier device. An accommodation groove 101 is provided on the carrier 1. The accommodation groove 101 is used to place the wafer 6. After the wafer 6 is placed in the accommodation groove 101, the carrier cover 2 is fixed on the carrier 1 and seals the accommodation groove 101 to encapsulate the wafer 6. The carrier cover 2 is detachably and fixedly connected to the carrier 1, so as to facilitate the removal of the wafer 6 from the carrier 1.

[0063] When the wafer 6 is encapsulated in the carrier 1 and the carrier cover 2, it needs to be limited and fixed, otherwise the wafer 6 is likely to be damaged due to sliding.

[0064] To solve this problem, a ventilation hole 102 is opened in the carrier 1, and the ventilation hole 102 penetrates through the carrier 1 and is connected to the accommodation groove 101. The elastic sealing ring 4 is hermetically fixed in the ventilation hole 102, and a part of the elastic sealing ring 4 extends out of the ventilation hole 102; the composite cover 3 is arranged on the carrier cover 2, and the composite cover 3 and the carrier cover 2 enclose a relatively closed adjustment cavity 301. The adjustment cavity 301 is connected to the accommodation groove 101, and the volume of the adjustment cavity 301 is adjustable; as Figure 3 shown, when the wafer 6 is placed in the accommodation groove 101 and the carrier cover 2 is connected to the carrier 1, the volume of the adjustment cavity 301 is reduced, so as to compress the air in the adjustment cavity 301 and the accommodation groove 101 to form high-pressure air. This high-pressure air will press and hold the wafer 6 against the side of the elastic sealing ring 4 close to the carrier cover 2, thereby locking the wafer 6 to prevent the wafer 6 from sliding; at the same time, in order to prevent the wafer 6 from being squeezed and damaged by the carrier 1, the reduction amount of the adjustment cavity 301 and the elastic contraction amount of the elastic sealing ring 4 are limited, so that when the wafer 6 abuts against the elastic sealing ring 4, it can be spaced from the carrier 1.

[0065] Compared with the method of pressing the wafer 6 with related components in the prior art, this carrier device presses the wafer 6 with air pressure. This method is more stable and uniform, and reduces the contact between the wafer 6 and too many components, thus playing a good protective effect and ensuring the processing safety of the wafer 6.

[0066] In order to realize the connection between the adjustment cavity 301 and the accommodation groove 101, it is preferably to open a communication hole 204 in the middle of the carrier cover 2, and the communication hole 204 is connected to the adjustment cavity 301 and the accommodation groove 101.

[0067] In order to realize the adjustment of the volume of the adjustment cavity 301, as Figures 4 - 10As shown, the composite cover 3 includes a cover body 31 and a convex ring 32. The cover body 31 is sleeved outside the carrier cover 2 and is slidably connected thereto. A clamping groove 201 is formed on the circumferential side of the carrier cover 2. The convex ring 32 is fixedly arranged in the cover body 31 and can be clamped with the clamping groove 201. As Figure 5 shown, at this time, the cover body 31 and the carrier cover 2 are in a state where the adjustment cavity 301 is not adjusted. The volume of the adjustment cavity 301 is relatively large. When the carrier cover 2 is connected to the carrier 1, sliding the cover body 31 downward can reduce the volume of the adjustment cavity 301, thereby increasing the air pressure inside the receiving groove 101 to fix the wafer 6. As Figure 6 shown, until the convex ring 32 is clamped with the clamping groove 201, the force applied to the cover body 31 can be removed, and the relative position of the cover body 31 and the carrier cover 2 can be kept unchanged.

[0068] As Figure 6 shown, when the convex ring 32 is clamped with the clamping groove 201, the cover body 31 abuts against the carrier 1, thereby improving the sealing performance of the receiving groove 101 and avoiding affecting the locking degree of the wafer 6 and the cleanliness of the surface of the wafer 6 due to air leakage.

[0069] To facilitate the assembly of the carrier cover 2 and the carrier 1, it is preferably to connect the carrier cover 2 to the carrier 1 by threaded fit. The operation is relatively convenient, and this connection method makes the relative position of the carrier cover 2 and the carrier 1 more stable. However, the carrier cover 2 is located inside the composite cover 3. When assembling the carrier cover 2 and the carrier 1, it is necessary to rotate the carrier cover 2 by rotating the composite cover 3. For this reason, a ring groove 202 is formed at one end of the circumferential side of the carrier cover 2 close to the carrier 1, and a limiting groove 203 is formed on the side of the ring groove 202 far from the carrier 1; a limiting block 33 is arranged in the composite cover 3. The limiting block 33 is fixedly arranged in the cover body 31, and the limiting block 33 is clamped with the limiting groove 203 and is rotatably connected with the ring groove 202. As Figure 5 shown, at this time, the limiting block 33 is clamped with the limiting groove 203. By rotating the cover body 31, the carrier cover 2 can be driven to rotate, so that the carrier cover 2 can be screwed onto the carrier 1. When pressing the cover body 31 downward, the limiting block 33 will be separated from the limiting groove 203, and the limiting block 33 will enter the ring groove 202. At this time, rotating the cover body 31 will not drive the carrier cover 2 to rotate, thereby improving the independence of the composite cover 3 and the carrier cover 2; for example, in the state as Figure 6 shown, if you want to separate the convex ring 32 from the clamping groove 201, an upward force needs to be applied to the cover body 31. When applying force manually, the direction of the applied force is not easy to control, and it is easy for the cover body 31 to rotate during the movement. However, the design structure makes the rotation of the cover body 31 at this time not drive the carrier cover 2 to rotate, so that the carrier device is suitable for more use conditions.

[0070] Before using this carrier device, it is preferable to make the adjustment chamber 301 in the state with the maximum volume. For this purpose, a spring 34 is provided in the composite cover 3, and the two ends of the spring 34 are respectively abutted against the side of the cover body 31 close to the carrier 1 and the side of the carrier cover 2 far from the carrier 1, so that the side of the cover body 31 close to the carrier 1 and the side of the carrier cover 2 far from the carrier 1 maintain the maximum distance in the initial state.

[0071] The negative pressure mechanism 5 is used to form a negative pressure in the ventilation hole 102 to cooperate with the adjustment of the volume of the adjustment chamber 301 to lock the wafer 6. The setting of the negative pressure mechanism 5 helps to reduce the adjustment range of the adjustment chamber 301, which is beneficial to the thin and light design of the carrier cover 2 and the composite cover 3.

[0072] As a preferred embodiment, the negative pressure mechanism 5 includes a piston plate 51, a connecting frame 52 and a sliding rod 53. The piston plate 51 is hermetically slid in the ventilation hole 102; the connecting frame 52 is fixedly arranged on the side of the piston plate 51 away from the elastic sealing ring 4; the sliding rod 53 passes through and is slidably arranged on the carrier 1, and one end of it is fixedly connected to the connecting frame 52. By sliding the outer end of the sliding rod 53 located outside the carrier 1, the piston plate 51 can be driven to slide in the ventilation hole 102, so as to form a negative pressure in the ventilation hole 102, so as to increase the abutting force between the wafer 6 and the elastic sealing ring 4 and strengthen the fixing firmness of the wafer 6.

[0073] When fixing the wafer 6, not only the composite cover 3 needs to be operated, but also the sliding rod 53 needs to be operated, and its operation method is relatively cumbersome. In order to improve the operation efficiency of this carrier device, the composite cover 3 and the negative pressure mechanism 5 are linked, as Figure 11 and Figure 14 shown, the end of the sliding rod 53 away from the connecting frame 52 is abutted against the side of the composite cover 3 close to the carrier 1. An elastic block 54 is arranged in the negative pressure mechanism 5. The elastic block 54 is made of an elastic material, such as flexible silica gel, etc. The elastic block 54 is fixedly arranged on the carrier 1 and abutted against the side of the connecting frame 52 away from the piston plate 51. When the composite cover 3 is pressed down, the sliding rod 53, the connecting frame 52 and the piston plate 51 can be driven to move downward, not only forming a high pressure on the top side of the wafer 6, but also forming a negative pressure on the bottom side of the wafer 6, so as to firmly fix the wafer 6 on the elastic sealing ring 4; and when the wafer 6 needs to be taken out, the composite cover 3 is moved upward, and by using the abutment of the elastic block 54 against the connecting frame 52, the piston plate 51 can be moved back to its original position, so that no negative pressure is formed in the ventilation hole 102.

[0074] When the negative pressure demand in the vent hole 102 is relatively large, in order to ensure the thin and light design of the carrier 1 and the negative pressure mechanism 5, it is preferred that the vent hole 102 includes an installation part 1021 and a pressure regulating part 1022. The installation part 1021 is opened on the side of the carrier 1 close to the carrier cover 2 and is located in the accommodation groove 101. The elastic sealing ring 4 is fixedly sealed in the installation part 1021; the pressure regulating part 1022 is opened on the side of the carrier 1 away from the carrier cover 2 and is communicated with the installation part 1021. The piston plate 51 is hermetically slid in the pressure regulating part 1022, and the inner diameter of the pressure regulating part 1022 is larger than the inner diameter of the installation part 1021. As Figure 15 shown, the cross-section of the vent hole 102 is T-shaped. When the piston plate 51 moves downward a small distance, a large negative pressure can be formed in the installation part 1021.

[0075] The wafer 6 has a large specification. In order to improve the locking stability of the wafer 6, as Figure 2 shown, a plurality of vent holes 102 and elastic sealing rings 4 are provided and correspond to each other one by one; the center of gravity of the wafer 6 is at its middle position. Therefore, one of the vent holes 102 is coaxially arranged with the accommodation groove 101, that is, this vent hole 102 is arranged at the middle position of the accommodation groove 101, and the remaining plurality of vent holes 102 are arranged in a circumferential array around the axis of the accommodation groove 101.

[0076] For the piston plates 51 at different positions, the present invention makes different structural designs. Specifically, the piston plate 51 includes a first movable plate 511, a sealing box 512 and a second movable plate 513. As Figure 15 shown, the first movable plate 511 is hermetically slid in the vent hole 102 at the middle position and is fixedly connected to the connecting frame 52. When the composite cover 3 drives the sliding rod 53 to slide downward, the first movable plate 511 can be driven to move downward synchronously; as Figure 16 shown, the sealing box 512 is hermetically slid in the vent hole 102 at the outer edge position and corresponds to it one by one. A T-shaped groove 501 is opened on the side of the sealing box 512 away from the carrier cover 2; the second movable plate 513 is slidably arranged in the T-shaped groove 501, specifically slidably arranged in the large hole in the T-shaped groove 501. The second movable plate 513 is fixedly connected to the connecting frame 52. When the composite cover 3 drives the sliding rod 53 to slide downward, it will first drive the second movable plate 513 to slide downward in the T-shaped groove 501 until the second movable plate 513 abuts against the sealing box 512, and then drive the sealing box 512 to move downward; that is, when the composite cover 3 drives the sliding rod 53 to slide downward, the piston plate 51 in the vent hole 102 at the middle position moves downward synchronously with the composite cover 3, while the plurality of piston plates 51 in the vent holes 102 at the outer edge position first remain stationary and then move downward synchronously with the composite cover 3. Using this structure, the fixing firmness of the middle position of the wafer 6 can be strengthened first, and then the fixing firmness of the edge position of the wafer 6 can be strengthened, which is beneficial to improving the fixing stability of the wafer 6.

[0077] To avoid slippage of the carrier 1 relative to the rotating carrier cover 2 and composite cover 3, it is preferred that the cross-section of the carrier 1 is a rounded rhombus, and the cross-sections of the carrier cover 2 and composite cover 3 are both circular; at the same time, the upper and lower outer diameters of the present carrier device are not uniform, which is also conducive to stacking and splitting of multiple present carrier devices, improving the processing efficiency of the wafer 6.

[0078] Specifically, as Figure 2 and Figure 17 shown, it is preferred that the included angle between two adjacent sides of the carrier 1 is 90 degrees, the fillet radii of two opposite vertices of the carrier 1 are equal to the radius of the composite cover 3, and the fillet radii of the other two opposite vertices of the carrier 1 are smaller. At this time, not only can the present carrier device be placed in a circular space, but also the present carrier device can be placed in a rectangular space, and the side wall of the present carrier device is abutted against the side wall of the placement space to achieve the stacking stability of the present carrier device.

[0079] The usage method of a wafer carrier device for semiconductor device manufacturing according to the present invention is as follows:

[0080] S1, Place the wafer 6 in the receiving groove 101 and make the wafer 6 abut against a plurality of elastic sealing rings 4;

[0081] S2, Install the carrier cover 2 on the carrier 1;

[0082] S3, Press the composite cover 3 to make the convex ring 32 engage with the card slot 201, thereby forming high pressure and negative pressure on both sides of the wafer 6 respectively, and making the wafer 6 firmly abut against the elastic sealing ring 4;

[0083] S4, When it is necessary to take out the wafer 6, apply force to the composite cover 3 to separate the convex ring 32 from the card slot 201, and use the abutment of the spring 34 on the cover body 31 and the abutment of the elastic block 54 on the connecting frame 52 to make the composite cover 3 and the negative pressure mechanism 5 return to their original positions, so that the air pressure on both sides of the wafer 6 returns to the initial balanced state;

[0084] S5, Remove the carrier cover 2 from the carrier 1 and take out the wafer 6 from the receiving groove 101 for processing the wafer 6.

[0085] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer carrier device for semiconductor device manufacturing, comprising a carrier frame (1), a carrier cover (2) and a wafer (6), wherein, The carrier frame (1) is provided with a receiving groove (101); The carrier cover (2) is detachably fixed on the carrier frame (1) and seals the receiving groove (101); It is characterized in that: it further includes a composite cover (3) and an elastic sealing ring (4), wherein, The composite cover (3) is arranged on the carrier cover (2) and encloses with it to form an adjustment cavity (301), the adjustment cavity (301) is communicated with the receiving groove (101), and the volume of the adjustment cavity (301) is adjustable; An air vent hole (102) is arranged in the carrier frame (1), the air vent hole (102) penetrates through the carrier frame (1) and is communicated with the receiving groove (101); the elastic sealing ring (4) is hermetically fixed in the air vent hole (102), and a part of it extends out of the air vent hole (102); The wafer (6) is abutted against one side of the elastic sealing ring (4) close to the carrier cover (2) and is spaced from the carrier frame (1); The composite cover (3) includes a cover body (31) and a convex ring (32), wherein, The cover body (31) is sleeved outside the carrier cover (2) and is slidably connected with it; A clamping groove (201) is formed on the circumferential side of the carrier cover (2), the convex ring (32) is fixedly arranged in the cover body (31) and can be clamped with the clamping groove (201), and when the convex ring (32) is clamped with the clamping groove (201), the cover body (31) abuts against the carrier frame (1); The carrier cover (2) is connected to the carrier frame (1) by screw fit, a ring groove (202) is formed at one end of its circumferential side close to the carrier frame (1), and a limiting groove (203) is formed on the side of the ring groove (202) far from the carrier frame (1); The composite cover (3) further includes a limiting block (33), the limiting block (33) is fixedly arranged in the cover body (31) and is clamped with the limiting groove (203) and is rotatably connected with the ring groove (202).

2. The wafer carrier device for semiconductor device manufacturing according to claim 1, characterized in that: The composite cover (3) further includes a spring (34), and two ends of the spring (34) are respectively abutted against one side of the cover body (31) close to the carrier frame (1) and one side of the carrier cover (2) far from the carrier frame (1); A communication hole (204) is formed in the middle of the carrier cover (2), and the communication hole (204) is communicated with the adjustment cavity (301) and the receiving groove (101).

3. A wafer carrier device for manufacturing semiconductor devices according to claim 1, characterized in that: It further includes a negative pressure mechanism (5), the negative pressure mechanism (5) includes a piston plate (51), a connecting frame (52) and a sliding rod (53), wherein, The piston plate (51) seals and slides in the air vent hole (102); The connecting frame (52) is fixedly arranged on one side of the piston plate (51) far from the elastic sealing ring (4); The sliding rod (53) penetrates through and slides on the carrier frame (1), and one end of it is fixedly connected with the connecting frame (52).

4. A wafer carrier device for semiconductor device manufacturing according to claim 3, characterized in that: One end of the sliding rod (53) away from the connecting frame (52) abuts against one side of the composite cover (3) close to the carrier (1). The negative pressure mechanism (5) further includes an elastic block (54). The elastic block (54) is fixedly arranged on the carrier (1) and abuts against one side of the connecting frame (52) away from the piston plate (51).

5. A wafer carrier device for manufacturing semiconductor devices according to claim 3, characterized in that: The vent hole (102) includes a mounting portion (1021) and a pressure regulating portion (1022), wherein, The mounting portion (1021) is opened on one side of the carrier (1) close to the carrier cover (2) and is located in the receiving groove (101). The elastic sealing ring (4) is fixedly sealed in the mounting portion (1021). The pressure regulating portion (1022) is opened on one side of the carrier (1) away from the carrier cover (2) and is communicated with the mounting portion (1021). The piston plate (51) seals and slides in the pressure regulating portion (1022), and the inner diameter of the pressure regulating portion (1022) is larger than the inner diameter of the mounting portion (1021).

6. The wafer carrier device for semiconductor device manufacturing according to claim 3, wherein: The vent holes (102) and the elastic sealing rings (4) are both provided with a plurality of them and correspond to each other one by one. One of the vent holes (102) is coaxially arranged with the receiving groove (101), and the remaining plurality of vent holes (102) are arranged in a circumferential array around the axis of the receiving groove (101).

7. A wafer carrier device for manufacturing semiconductor devices according to claim 6, characterized in that: The piston plate (51) includes a first movable plate (511), a sealing box (512) and a second movable plate (513), wherein, The first movable plate (511) seals and slides in the vent hole (102) located in the middle position. The sealing box (512) seals and slides in the vent hole (102) located on the outer edge position and corresponds to it one by one. A T-shaped groove (501) is opened on one side of the sealing box (512) away from the carrier cover (2). The second movable plate (513) is slidably arranged in the T-shaped groove (501), and both the second movable plate (513) and the first movable plate (511) are fixedly connected to the connecting frame (52).

8. A wafer carrier device for semiconductor device manufacturing according to claim 3, characterized in that: The cross-section of the carrier (1) is in the shape of a rounded rhombus, and the cross-sections of the carrier cover (2) and the composite cover (3) are both circular.

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