Ceramic leadless chip type carrier shell

Abstract

The invention discloses a ceramic leadless chip type carrier shell, and relates to the technical field of chip carriers, the ceramic leadless chip type carrier shell comprises a top sealing assembly, a middle ceramic body layer assembly, a middle printing layer assembly and a plurality of slurry filling layers, the middle ceramic body layer assembly comprises a plurality of ceramic body layers which are sequentially stacked, the adjacent ceramic body layers are connected, and the slurry filling layers are connected with the middle printing layer assembly. The middle printing layer assembly comprises a plurality of printing layers, each ceramic body layer is provided with a plurality of printing layers, the top sealing assembly is installed at the upper end of the middle ceramic body assembly, every two adjacent printing layers are communicated through different slurry filling layers, and each slurry filling layer comprises a plurality of slurry filling points. The on-resistance of the fabric is low.

Description

Technical Field

[0001] The invention relates to the technical field of chip carriers, in particular to a ceramic leadless chip carrier housing. Background Art

[0002] In electronics, a chip is a way to miniaturize a circuit (mainly semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of a semiconductor wafer. When a chip is used, it is generally carried in a metal or ceramic casing.

[0003] Although there are many types and quantities of ceramic chip carriers at present, there are still certain problems with the existing ceramic chip carriers. For example, the existing ceramic chip carriers have large on-resistance and generate a lot of heat, which brings certain inconveniences to the use of ceramic chip carriers. Summary of the invention

[0004] The object of the present invention is to provide a ceramic leadless sheet carrier housing to solve the problems existing in the above-mentioned prior art and reduce the on-resistance.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] The present invention provides a ceramic leadless sheet carrier shell, comprising a top sealing component, an intermediate ceramic layer component, an intermediate printing layer component and a multi-layer grouting layer, wherein the intermediate ceramic layer component comprises a plurality of ceramic layers stacked in sequence, and adjacent ceramic layers are connected, the intermediate printing layer component comprises a plurality of printing layers, and each ceramic layer is provided with a plurality of printing layers, the top sealing component is installed at the upper end of the intermediate ceramic layer component, and each adjacent two printing layers are connected via different grouting layers, and the grouting layer comprises a plurality of grouting points.

[0007] Preferably, the top sealing assembly includes a sealing ring, a first printed layer and a first ceramic layer, the first ceramic layer is installed on the upper end of the middle ceramic layer assembly, and the first printed layer is installed on the side of the first ceramic layer away from the middle ceramic layer assembly, and the sealing ring is installed on the side of the first printed layer away from the first ceramic layer.

[0008] Preferably, the outer periphery of the first printed layer extends beyond the outer periphery of the sealing ring, and the sealing ring, the first printed layer and the first ceramic body layer are all hollow frames.

[0009] Preferably, the plurality of ceramic layers include a second ceramic layer, a third ceramic layer, a fourth ceramic layer, a fifth ceramic layer, a sixth ceramic layer and a seventh ceramic layer arranged in sequence, and the second ceramic layer is connected to the first ceramic layer on a side away from the third ceramic layer.

[0010] Preferably, the multiple printed layers include a third printed layer, a fourth printed layer, a fifth printed layer, a sixth printed layer and a seventh printed layer arranged in sequence, the third printed layer is installed on the third ceramic layer, the fourth printed layer is installed on the fourth ceramic layer, the fifth printed layer is installed on the fifth ceramic layer, the sixth printed layer is installed on the sixth ceramic layer, and the seventh printed layer is installed on the seventh ceramic layer.

[0011] Preferably, the second ceramic layer is provided with a second opening, the third ceramic layer is provided with a third opening, the second opening corresponds to the position of the third opening, and the third opening is used to install the third printed layer; the fourth ceramic layer is provided with a fourth opening, and the fourth opening is used to install the fourth printed layer; the fifth printed layer is installed on the side of the fifth ceramic layer away from the sixth ceramic layer; the sixth printed layer is installed on the side of the sixth ceramic layer away from the seventh ceramic layer; and the seventh printed layer is installed on both sides of the seventh ceramic layer.

[0012] Preferably, there are four second openings and four third openings, the third printing layer includes eight third printing units, and two third printing units are installed in each third opening respectively; there are eight fourth openings, the fourth printing layer includes eight fourth printing units, and the eight fourth openings correspond to the eight fourth printing units one by one.

[0013] Preferably, the seventh printed layer includes a seventh front printed layer and a seventh pad printed layer, the seventh front printed layer is installed on a side of the seventh ceramic layer close to the sixth ceramic layer, the seventh pad printed layer is installed on a side of the seventh ceramic layer away from the sixth ceramic layer, the seventh pad printed layer includes sixteen seventh printed units, and the sixteen seventh printed units are divided into two columns, the number of the seventh printed units in each column is eight, and each of the seventh printed units is respectively installed with a lead frame on a side away from the seventh ceramic layer.

[0014] Preferably, the middle printing layer assembly also includes a first side printing layer and a second side printing layer that are symmetrically arranged, the first side printing layer and the second side printing layer are respectively located on both sides of the middle porcelain layer, and the connecting line between the first side printing layer and the second side printing layer is perpendicular to the arrangement direction of the porcelain layer; the first side printing layer includes eight first side printing units, the second side printing layer includes eight second side printing units, and the eight first side printing units correspond one-to-one to one of the columns of the seventh printing units, and the eight second side printing units correspond one-to-one to another column of the seventh printing units, the eight first side printing units also correspond one-to-one to eight third printing units, and the first side printing unit is connected to one side of the third printing unit, the eight second side printing units also correspond one-to-one to eight third printing units, and the second side printing unit is connected to the other side of the third printing unit.

[0015] Preferably, the grouting layer is divided into a first grouting layer, a second grouting layer, a third grouting layer, a fourth grouting layer, a fifth grouting layer, a sixth grouting layer and a seventh grouting layer, wherein the first end of the first grouting layer is connected to one side of the first printing layer, the second end of the first grouting layer passes through the first porcelain layer and is connected to the first end of the second grouting layer, the second end of the second grouting layer passes through the second porcelain layer and is connected to one side of the third printing layer; the first end of the third grouting layer is connected to one side of the third printing layer, the second end of the third grouting layer passes through the third porcelain layer and is connected to the fourth printing layer; the first end of the fourth grouting layer is connected to the fourth printing layer on one side, the second end of the fourth filling layer passes through the fourth porcelain layer and is connected to the fifth printing layer; the first end of the fifth filling layer is connected to one side of the fifth printing layer, the second end of the fifth printing layer passes through the fifth porcelain layer and is connected to one side of the sixth printing layer; the first end of the sixth filling layer is connected to the side connected to the sixth printing layer, the second end of the sixth filling layer passes through the sixth porcelain layer and is connected to one side of the seventh front printing layer; the first end of the seventh filling layer is connected to one side of the seventh front printing layer, the second end of the seventh filling layer passes through the seventh porcelain layer and is connected to one side of the seventh pad printing layer.

[0016] Compared with the prior art, the present invention has achieved the following technical effects:

[0017] The ceramic leadless sheet carrier shell provided by the present invention comprises an intermediate ceramic layer component including multiple ceramic layers stacked in sequence, adjacent ceramic layers are connected, and the ceramic layers play the role of insulation and heat dissipation, an intermediate printed layer component including multiple printed layers, each ceramic layer is provided with several printed layers, the printed layers can be used to make fine circuits, etc., a top sealing component is installed at the upper end of the intermediate ceramic layer component, and a metal cover plate can be used to encapsulate the top sealing component, each adjacent printed layer is respectively connected through different grouting layers, so as to facilitate the formation of a circuit loop, the grouting layer includes multiple grouting points, so as to reduce the on-resistance, thereby ensuring that the current can flow efficiently and stably, while reducing energy loss and heat generation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic structural diagram of a ceramic leadless sheet carrier housing in the present invention;

[0020] Figure 2 An exploded view of the ceramic leadless chip carrier housing of the present invention;

[0021] In the figure: 1-sealing ring, 2-first printed layer, 3-first filling layer, 4-first ceramic layer, 5-second filling layer, 6-second ceramic layer, 7-third printed layer, 8-third filling layer, 9-third ceramic layer, 10-fourth printed layer, 11-fourth filling layer, 12-fourth ceramic layer, 13-fifth printed layer, 14-second side printed layer, 15-fifth filling layer, 16-fifth ceramic layer, 17-sixth printed layer, 18-first side printed layer, 19-sixth filling layer, 20-sixth ceramic layer, 21-seventh front printed layer, 22-seventh filling layer, 23-seventh ceramic layer, 24-seventh pad printed layer, 25-lead frame. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] The purpose of the present invention is to provide a ceramic leadless sheet carrier housing to solve the problems existing in the prior art and reduce the on-resistance.

[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] like Figure 1-Figure 2 As shown, this embodiment provides a ceramic leadless sheet carrier housing, including a top sealing component, an intermediate ceramic layer component, an intermediate printing layer component and a multi-layer filling layer. The intermediate ceramic layer component includes a plurality of ceramic layers stacked in sequence, adjacent ceramic layers are connected, and the ceramic layers play the role of insulation and heat dissipation. The intermediate printing layer component includes a plurality of printing layers, and each ceramic layer is installed with a plurality of printing layers. The printing layers can be used to make fine circuits, etc. The top sealing component is installed at the upper end of the intermediate ceramic layer component, and can also be packaged by a metal cover plate at the top sealing component. Each two adjacent printing layers are respectively connected through different filling layers. The filling layer includes a plurality of filling points, thereby reducing the on-resistance, ensuring that the current can flow efficiently and stably, while reducing energy loss and heat generation.

[0026] Specifically, the top sealing assembly includes a sealing ring 1, a first printed layer 2 and a first ceramic layer 4. The first ceramic layer 4 is installed on the upper end of the middle ceramic layer assembly, and the first printed layer 2 is installed on the side of the first ceramic layer 4 away from the middle ceramic layer assembly. The sealing ring 1 is welded to the side of the first printed layer 2 away from the first ceramic layer 4 by a brazing process.

[0027] The outer periphery of the first printed layer 2 extends beyond the outer periphery of the sealing ring 1 , and the sealing ring 1 , the first printed layer 2 and the first ceramic body layer 4 are all hollow frames.

[0028] The multiple ceramic layers include a second ceramic layer 6, a third ceramic layer 9, a fourth ceramic layer 12, a fifth ceramic layer 16, a sixth ceramic layer 20 and a seventh ceramic layer 23 arranged in sequence. The second ceramic layer 6 is connected to the first ceramic layer 4 on the side away from the third ceramic layer 9, so that all the ceramic layers are combined together.

[0029] The multiple printed layers include a third printed layer 7, a fourth printed layer 10, a fifth printed layer 13, a sixth printed layer 17 and a seventh printed layer arranged in sequence. The arrangement of each printed layer facilitates the conduction of the circuit. The third printed layer 7 is installed on the third ceramic layer 9, the fourth printed layer 10 is installed on the fourth ceramic layer 12, the fifth printed layer 13 is installed on the fifth ceramic layer 16, the sixth printed layer 17 is installed on the sixth ceramic layer 20, and the seventh printed layer is installed on the seventh ceramic layer 23.

[0030] A second opening is provided on the second ceramic layer 6, and a third opening is provided on the third ceramic layer 9. The second opening corresponds to the third opening in position, and the third opening is used to install the third printed layer 7; a fourth opening is provided on the fourth ceramic layer 12, and the fourth opening is used to install the fourth printed layer 10; the fifth printed layer 13 is installed on the side of the fifth ceramic layer 16 away from the sixth ceramic layer 20; the sixth printed layer 17 is installed on the side of the sixth ceramic layer 20 away from the seventh ceramic layer 23; the seventh printed layer is installed on both sides of the seventh ceramic layer 23.

[0031] There are four second openings and four third openings, which divide the second ceramic layer 6 and the third ceramic layer 9 into four areas. The third printing layer 7 includes eight third printing units, and two third printing units are installed in each third opening respectively. There are eight fourth openings, and the fourth printing layer 10 includes eight fourth printing units. The eight fourth openings correspond to the eight fourth printing units one by one.

[0032] The seventh printed layer includes a seventh front printed layer 21 and a seventh pad printed layer 24. The seventh front printed layer 21 is installed on the side of the seventh ceramic layer 23 close to the sixth ceramic layer 20. The seventh pad printed layer 24 is installed on the side of the seventh ceramic layer 23 away from the sixth ceramic layer 20. The seventh pad printed layer 24 includes sixteen seventh printed units, and the sixteen seventh printed units are divided into two columns. The number of seventh printed units in each column is eight. Each seventh printed unit is respectively installed with a lead frame 25 on the side away from the seventh ceramic layer 23.

[0033] The middle printing layer assembly also includes a first side printing layer 18 and a second side printing layer 14 symmetrically arranged, the first side printing layer 18 and the second side printing layer 14 are respectively located on both sides of the middle porcelain layer, and the line between the first side printing layer 18 and the second side printing layer 14 is perpendicular to the arrangement direction of the porcelain layer; the first side printing layer 18 includes eight first side printing units, the second side printing layer 14 includes eight second side printing units, and the eight first side printing units correspond one-to-one to one of the seventh printing units in one column, and the eight second side printing units correspond one-to-one to one of the seventh printing units in another column, and the eight first side printing units correspond one-to-one to one of the seventh printing units in another column. The unit also corresponds one-to-one to the eight third printing units, and the first side printing unit is connected to one side of the third printing unit, and the eight second side printing units also correspond one-to-one to the eight third printing units, and the second side printing unit is connected to the other side of the third printing unit, and then the third printing layer 7 and the seventh printing layer are connected through the first side printing unit and the second side printing unit, and then through the connection between the lead frame 25 and the seventh printing layer, the circuit conduction of the chip is realized, and the circuit is connected with the outside world, and finally the chip is enlarged through the ceramic leadless chip carrier shell in this embodiment to facilitate the chip to be mounted on the circuit board.

[0034] At the same time, the thickness of each ceramic layer and the total number of ceramic layers can be adaptively changed according to parameter information such as the cavity depth used to install the chip on the user side and the size of the chip, and the quantity and thickness can be adaptively adjusted. The quantity, thickness, etc. of each structure can also be adjusted by changing the material of the printing layer and the number and position of the filling points.

[0035] The grouting layer is divided into a first grouting layer 3, a second grouting layer 5, a third grouting layer 8, a fourth grouting layer 11, a fifth grouting layer 15, a sixth grouting layer 19 and a seventh grouting layer 22. The grouting layer is preferably made of metal slurry. The first end of the first grouting layer 3 is connected to one side of the first printing layer 2, the second end of the first grouting layer 3 passes through the first porcelain layer 4 and is connected to the first end of the second grouting layer 5, the second end of the second grouting layer 5 passes through the second porcelain layer 6 and is connected to one side of the third printing layer 7; the first end of the third grouting layer 8 is connected to one side of the third printing layer 7, the second end of the third grouting layer 8 passes through the third porcelain layer 9 and is connected to the fourth printing layer 10; the first end of the fourth grouting layer 11 is connected to one side of the fourth printing layer 10, and the fourth The second end of the grouting layer 11 passes through the fourth ceramic layer 12 and is connected to the fifth printing layer 13; the first end of the fifth grouting layer 15 is connected to one side of the fifth printing layer 13, and the second end of the fifth printing layer 13 passes through the fifth ceramic layer 16 and is connected to one side of the sixth printing layer 17; the first end of the sixth grouting layer 19 is connected to one side connected to the sixth printing layer 17, and the second end of the sixth grouting layer 19 passes through the sixth ceramic layer 20 and is connected to one side of the seventh front printing layer 21; the first end of the seventh grouting layer 22 is connected to one side of the seventh front printing layer 21, and the second end of the seventh grouting layer 22 passes through the seventh ceramic layer 23 and is connected to one side of the seventh pad printing layer 24. Through the above design, conduction between adjacent printing layers is achieved. The number of grouting points in the fourth grouting layer 11, the fifth grouting layer 15, the sixth grouting layer 19 and the seventh grouting layer 22 are all large and dispersed, thereby reducing the conduction resistance compared to the traditional design.

[0036] After the product drawing design is completed, this embodiment performs three-dimensional modeling and internal structure design; then, the simulation software is used to perform resistance simulation on the internal structure of the product to optimize the internal circuit layout of the product and ensure that the product has a low on-resistance (i.e., resistance value ≤0.025Ω) in actual use, thereby ensuring that the current can flow efficiently and stably while reducing energy loss and heat generation.

[0037] At the same time, this embodiment can also continuously optimize the design of the internal structure of the product through multiple iterations of simulation and adjustment, such as adjusting the line width and thickness of the internal structure wires, increasing the number of filling points and selecting appropriate metallization paste, etc., until the expected low on-resistance target is achieved.

[0038] In terms of process production: when printing the green product, the metallization thickness needs to be controlled and strictly controlled within the range of simulation data, so as to ensure the metallization thickness while having the production capability.

[0039] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A ceramic leadless chip carrier housing, characterized in that: It includes a top sealing component, an intermediate porcelain layer component, an intermediate printing layer component and a multi-layer grouting layer. The intermediate porcelain layer component includes a multi-layer porcelain layer stacked in sequence, and adjacent porcelain layers are connected. The intermediate printing layer component includes a plurality of printing layers, and each porcelain layer is installed with a plurality of printing layers. The top sealing component is installed at the upper end of the intermediate porcelain layer component. Each two adjacent printing layers are connected through different grouting layers, and the grouting layer includes a plurality of grouting points.

2. The ceramic leadless chip carrier housing according to claim 1, characterized in that: The top sealing assembly includes a sealing ring, a first printed layer and a first ceramic layer. The first ceramic layer is installed on the upper end of the middle ceramic layer assembly, and the first printed layer is installed on a side of the first ceramic layer away from the middle ceramic layer assembly. The sealing ring is installed on a side of the first printed layer away from the first ceramic layer.

3. The ceramic leadless chip carrier housing according to claim 2, characterized in that: The outer periphery of the first printing layer extends beyond the outer periphery of the sealing ring, and the sealing ring, the first printing layer and the first ceramic body layer are all hollow frames.

4. The ceramic leadless chip carrier housing according to claim 2, characterized in that: The plurality of ceramic layers include a second ceramic layer, a third ceramic layer, a fourth ceramic layer, a fifth ceramic layer, a sixth ceramic layer and a seventh ceramic layer arranged in sequence, and the second ceramic layer is connected to the first ceramic layer at a side away from the third ceramic layer.

5. The ceramic leadless chip carrier housing according to claim 4, characterized in that: The multiple printed layers include a third printed layer, a fourth printed layer, a fifth printed layer, a sixth printed layer and a seventh printed layer arranged in sequence, the third printed layer is installed on the third ceramic layer, the fourth printed layer is installed on the fourth ceramic layer, the fifth printed layer is installed on the fifth ceramic layer, the sixth printed layer is installed on the sixth ceramic layer, and the seventh printed layer is installed on the seventh ceramic layer.

6. The ceramic leadless chip carrier housing according to claim 5, characterized in that: The second ceramic layer is provided with a second opening, the third ceramic layer is provided with a third opening, the second opening corresponds to the position of the third opening, and the third opening is used to install the third printed layer; the fourth ceramic layer is provided with a fourth opening, and the fourth opening is used to install the fourth printed layer; the fifth printed layer is installed on the side of the fifth ceramic layer away from the sixth ceramic layer; the sixth printed layer is installed on the side of the sixth ceramic layer away from the seventh ceramic layer; the seventh printed layer is installed on both sides of the seventh ceramic layer.

7. The ceramic leadless chip carrier housing according to claim 6, characterized in that: There are four second openings and four third openings, the third printing layer includes eight third printing units, and two third printing units are installed in each third opening; there are eight fourth openings, the fourth printing layer includes eight fourth printing units, and the eight fourth openings correspond to the eight fourth printing units one by one.

8. The ceramic leadless chip carrier housing according to claim 7, characterized in that: The seventh printing layer includes a seventh front printing layer and a seventh pad printing layer. The seventh front printing layer is installed on the side of the seventh ceramic layer close to the sixth ceramic layer, and the seventh pad printing layer is installed on the side of the seventh ceramic layer away from the sixth ceramic layer. The seventh pad printing layer includes sixteen seventh printing units, and the sixteen seventh printing units are divided into two columns, and the number of the seventh printing units in each column is eight. Each of the seventh printing units is respectively installed with a lead frame on the side away from the seventh ceramic layer.

9. The ceramic leadless chip carrier housing according to claim 8, characterized in that: The middle printing layer assembly also includes a first side printing layer and a second side printing layer symmetrically arranged, the first side printing layer and the second side printing layer are respectively located on both sides of the middle porcelain layer, and the connection line between the first side printing layer and the second side printing layer is perpendicular to the arrangement direction of the porcelain layer; the first side printing layer includes eight first side printing units, the second side printing layer includes eight second side printing units, and the eight first side printing units correspond one-to-one to one column of the seventh printing units, and the eight second side printing units correspond one-to-one to another column of the seventh printing units, and the eight first side printing units also correspond one-to-one to the eight third printing units, and the first side printing unit is connected to one side of the third printing unit, and the eight second side printing units also correspond one-to-one to the eight third printing units, and the second side printing unit is connected to the other side of the third printing unit.

10. The ceramic leadless chip carrier housing according to claim 8, characterized in that: The grouting layer is divided into a first grouting layer, a second grouting layer, a third grouting layer, a fourth grouting layer, a fifth grouting layer, a sixth grouting layer and a seventh grouting layer, wherein a first end of the first grouting layer is connected to one side of the first printing layer, a second end of the first grouting layer passes through the first porcelain layer and is connected to a first end of the second grouting layer, a second end of the second grouting layer passes through the second porcelain layer and is connected to one side of the third printing layer; a first end of the third grouting layer is connected to one side of the third printing layer, a second end of the third grouting layer passes through the third porcelain layer and is connected to the fourth printing layer; a first end of the fourth grouting layer is connected to one side of the fourth printing layer side, the second end of the fourth filling layer passes through the fourth porcelain layer and is connected to the fifth printing layer; the first end of the fifth filling layer is connected to one side of the fifth printing layer, the second end of the fifth printing layer passes through the fifth porcelain layer and is connected to one side of the sixth printing layer; the first end of the sixth filling layer is connected to the side connected to the sixth printing layer, the second end of the sixth filling layer passes through the sixth porcelain layer and is connected to one side of the seventh front printing layer; the first end of the seventh filling layer is connected to one side of the seventh front printing layer, the second end of the seventh filling layer passes through the seventh porcelain layer and is connected to one side of the seventh pad printing layer.

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