PCB processing equipment and control method thereof
By designing the first spindle structure with integrated pick-and-place assembly, the complexity and offset problems of spindle structure pick-and-place tool in existing PCB processing equipment is solved, and a higher machining accuracy and simplified control process is achieved.
Patent Information
- Application Number
- CN202411894266.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-04-01
AI Technical Summary
In existing PCB processing equipment, the spindle structure needs to drive each machining spindle to move to pick and place the tool, resulting in complex control and increasing the probability of the machining spindle offset, affecting the machining accuracy.
A PCB processing device is designed, including a frame, a first spindle structure and a second spindle structure. The first spindle structure integrates the first spindle assembly and two pick-and-place components, allowing the first pick-and-place component to exchange a first tool with the first spindle assembly, and the second pick-and-place component to exchange a second tool with the second spindle assembly, thereby driving only the first spindle structure to move when picking up and dropping materials, simplifying the control process and reducing the probability of position deviation of the second spindle assembly.
Through this design, the control process is simplified, the probability of position offset of the second spindle assembly is reduced, and the machining accuracy is improved.
Smart Images
Figure CN119743897A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of PCB processing, and in particular relates to a PCB processing device and a control method thereof. Background Art
[0002] In existing PCB processing equipment, multiple spindle structures are usually used to process PCB boards. The spindle structure usually includes a processing spindle and a spindle clamp assembly, wherein the spindle clamp assembly is used to clamp the processing spindle, and the processing spindle is used to process the PCB board through a tool.
[0003] In order to achieve the picking and placing of the tools required for the machining spindle, the prior art generally equips each machining spindle with a robot for picking and placing the tools. This requires driving each machining spindle to move when picking and placing the tools, which makes the control complicated and increases the probability of the machining spindle offset, affecting the machining accuracy. Summary of the invention
[0004] The technical problem to be solved by the present invention is: in view of the technical problem that each processing spindle needs to be driven to move when picking up and placing a tool in the existing spindle structure, which increases the probability of deviation of the processing spindle, a PCB processing device and a control method thereof are provided.
[0005] To solve the above technical problems, on the one hand, an embodiment of the present invention provides a PCB processing device, including a frame, a first spindle structure and a second spindle structure, the first spindle structure includes a first spindle assembly, a first pick-and-place assembly and a second pick-and-place assembly, the second spindle structure includes a second spindle assembly, the first spindle assembly and the second spindle assembly are slidably installed on the frame along a first direction and spaced from each other; The first pick-and-place assembly and the second pick-and-place assembly are installed at intervals on the first spindle assembly; The first pick-and-place assembly is capable of exchanging a first tool with the first spindle assembly; The second pick and place assembly is capable of exchanging a second tool with the second spindle assembly.
[0006] In the PCB processing equipment according to the embodiment of the present invention, the first spindle structure integrates the first spindle assembly and two pick-and-place assemblies at the same time, and enables the first pick-and-place assembly to exchange the first tool with the first spindle assembly, and the second pick-and-place assembly to exchange the second tool with the second spindle assembly. Therefore, when picking and placing materials, only the first spindle structure is driven to move, so as to simplify the control process, and at the same time reduce the probability of the position of the second spindle assembly being offset, thereby improving the processing accuracy.
[0007] Optionally, the PCB processing equipment further comprises a loading structure, the loading structure is arranged on the frame, the loading structure is provided with a first position, a second position, a third position and a fourth position at intervals, the first position is used to store the pin and the first tool, and the third position is used to store the second tool; The first pick-and-place assembly is capable of transporting the first tool between the first position and the second position; the first spindle assembly is capable of picking up and placing the first tool located at the second position; The second pick-and-place assembly can transport the second tool between the third position and the fourth position; and the second spindle assembly can pick up and place the second tool located at the fourth position.
[0008] Optionally, the first pick-and-place assembly is further capable of transporting the pin between the first position and the pin hole of the rack.
[0009] Optionally, the first pick-and-place assembly and the second pick-and-place assembly are respectively disposed on opposite sides of the first spindle assembly along the first direction.
[0010] Optionally, the distance between the first position and the third position is equal to the distance between the second position and the fourth position; The distance between the first position and the third position is equal to the distance between the first pick-and-place assembly and the second pick-and-place assembly.
[0011] Optionally, a first material tray is disposed at the first position, and a first transfer seat is disposed at the second position; The first pick-and-place assembly can transport the first tool between the first material tray and the first intermediate transfer seat; the first spindle assembly can pick up and place the first tool at the first intermediate transfer seat; The third position is provided with a second material tray, and the fourth position is provided with a second transfer seat; The second pick-and-place assembly can transport the second tool between the second material tray and the second intermediate transfer seat; the second spindle assembly is used to pick up and place the second tool at the second intermediate transfer seat.
[0012] Optionally, the distance between the first material tray and the second material tray is equal to the distance between the first transfer seat and the second transfer seat; and the distance between the first material tray and the second material tray is equal to the distance between the first pick-and-place component and the second pick-and-place component.
[0013] Optionally, a plurality of first material loading slots are provided on the first material tray, at least some of the first material loading slots are used to place the pins, and / or at least some of the first material loading slots are used to place the first tools; The second material tray is provided with a plurality of second material loading slots, and at least some of the second material loading slots are used for placing the second cutting tools; The plurality of the first material loading slots and the plurality of the second material loading slots are arranged in one-to-one correspondence; The distance between the first material loading slot and the second material loading slot corresponding to each other is equal to the distance between the first pick-and-place component and the second pick-and-place component.
[0014] Optionally, the PCB processing equipment further comprises a first knife detection component and a second knife detection component, and the first knife detection component and the second knife detection component are installed on the material loading structure; The first pick-and-place assembly is capable of transporting the pin between the first position, the first knife detection assembly, the second knife detection assembly, and the pin hole of the frame; The first spindle assembly is capable of transporting the first tool between the second position, the first tool detection assembly, and the second tool detection assembly; The second spindle assembly is capable of transporting the second tool between the fourth position, the first tool detection assembly, and the second tool detection assembly; The first tool detection component is used to detect the pin, the first tool and / or the second tool along the first direction; the second tool detection component is used to detect the pin, the first tool and / or the second tool along the second direction; The first direction intersects the second direction.
[0015] Optionally, the first pick-and-place assembly is also capable of transporting the second tool between the third position and the second position; or, the first pick-and-place assembly is also capable of transporting the second tool between the third position and the fourth position.
[0016] Optionally, the second spindle structure further includes an adjusting assembly, the adjusting assembly is slidably mounted on the frame along the first direction, and the second spindle assembly is mounted on the adjusting assembly; The adjusting assembly is used to adjust the relative distance between the second spindle assembly and the first spindle assembly.
[0017] Optionally, the PCB processing equipment includes a plurality of processing platforms, the processing platforms are movably connected to the frame, the processing platforms are used to carry the PCB, and the first spindle structure and the second spindle structure can process the PCB on the same processing platform.
[0018] Optionally, the PCB processing equipment is a multi-axis forming machine, which includes a first connecting rod, multiple first spindle structures and multiple second spindle structures, the multiple first spindle structures are connected by the first connecting rod, the multiple second spindle structures are independently controlled or linked to each other, and the first spindle structure and the second spindle structure are independently controlled or linked to each other.
[0019] On the other hand, an embodiment of the present invention provides a control method for a PCB processing device, which is used for the above-mentioned PCB processing device, wherein a rack is provided with a first position and a third position at intervals, wherein the first position is used to store a first tool, and the third position is used to store the second tool; the method comprises: The first pick-and-place assembly moves to the first position, and the second pick-and-place assembly moves to the third position; The first pick-and-place assembly clamps the first tool at the first position, and the second pick-and-place assembly clamps the second tool at the third position; The first spindle assembly exchanges the first tool with the first pick-and-place assembly, and the second spindle assembly exchanges the second tool with the second pick-and-place assembly; Processing the PCB by using the first tool clamped by the first spindle assembly and the second tool clamped by the second spindle assembly; After the processing is completed, the first pick-and-place assembly exchanges the first tool with the first spindle assembly, and the second pick-and-place assembly exchanges the second tool with the second spindle assembly; The first pick-and-place assembly returns the first tool to the first position, while the second pick-and-place assembly returns the second tool to the third position.
[0020] According to the control method of the PCB processing equipment of the embodiment of the present invention, the first spindle structure integrates the first spindle assembly and two pick-and-place assemblies, and enables the first pick-and-place assembly to exchange the first tool with the first spindle assembly, and the second pick-and-place assembly to exchange the second tool with the second spindle assembly. Therefore, when picking and placing materials, it is only necessary to drive the first spindle structure to move, so as to simplify the control process, and at the same time reduce the probability of the position of the second spindle assembly being offset, thereby improving the processing accuracy.
[0021] Optionally, the rack is further provided with a second position and a fourth position at intervals; The step of exchanging the first tool between the first spindle assembly and the first pick-and-place assembly, and exchanging the second tool between the second spindle assembly and the second pick-and-place assembly specifically includes: The first pick-and-place assembly moves to the second position, and the second pick-and-place assembly moves to the fourth position; The first pick-and-place assembly places the first tool at the second position, and the second pick-and-place assembly places the second tool at the fourth position; The first spindle assembly moves to the second position, and the first spindle assembly clamps the first tool at the second position; The second spindle assembly moves to the fourth position, and the second spindle assembly clamps the second tool at the fourth position.
[0022] Optionally, after the processing is completed, the first pick-and-place assembly exchanges the first tool with the first spindle assembly, and the second pick-and-place assembly exchanges the second tool with the second spindle assembly, comprises: The first spindle assembly returns the clamped first tool to the second position; The second spindle assembly returns the clamped second tool to the fourth position; The first pick-and-place assembly moves to the second position, and the second pick-and-place assembly moves to the fourth position; The first pick-and-place assembly takes away the first tool at the second position, and the second pick-and-place assembly takes away the second tool at the fourth position.
[0023] Optionally, the second spindle structure further includes an adjusting assembly, the adjusting assembly is slidably mounted on the frame along the first direction, and the second spindle assembly is mounted on the adjusting assembly; Before the step of moving the first pick-and-place assembly to the first position and the second pick-and-place assembly to the third position, the method further includes: The adjusting assembly is driven to adjust the relative distance between the second spindle assembly and the first spindle assembly.
[0024] Optionally, the frame is further provided with a first knife detection component and a second knife detection component; After the step of exchanging the first tool with the first pick-and-place assembly, and the step of exchanging the second tool with the second pick-and-place assembly, and before the step of processing the PCB by the first tool clamped by the first spindle assembly and the second tool clamped by the second spindle assembly, the method further includes: The first spindle assembly sequentially transports the clamped first tool to the first tool detection assembly and the second tool detection assembly to detect the first tool; The second spindle assembly transports the clamped second tool to the first tool detection assembly and the second tool detection assembly in sequence to detect the second tool.
[0025] Optionally, the first position is also used to store pins; the method further comprises: The first pick-and-place assembly takes the pin located at the first position and inserts it into the pin hole of the frame; The first pick-and-place assembly pulls out the pin of the rack and transports it to the first position.
[0026] Optionally, the step of the first pick-and-place assembly taking the pin located at the first position and inserting the pin into the pin hole of the rack includes: The first pick-and-place assembly clamps the pin located at the first position, and sequentially transports the clamped pin to the first knife detection assembly and the second knife detection assembly to detect the pin; Insert the pin that has passed the inspection into the pin hole of the frame. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 is a schematic diagram of a drilling machine provided in Embodiment 1 of the present invention; Figure 2 yes Figure 1 A schematic diagram from another angle; Figure 3 yes Figure 2 The enlarged schematic diagram of point A in the middle; Figure 4 yes Figure 1 Schematic diagram of the first spindle structure, the second spindle structure and the carrier plate; Figure 5 yes Figure 4 A schematic diagram of another angle of (the first pick-and-place assembly is located at the first position, the first spindle assembly is located at the second position, the second pick-and-place assembly is located at the third position, and the second spindle assembly is located at the fourth position); Figure 6 yes Figure 4 Schematic diagram after removing the second spindle structure (the first pick-and-place assembly is located at the first position, and the second pick-and-place assembly is located at the third position); Figure 7 yes Figure 4 Another schematic diagram after removing the second spindle structure (the first pick-and-place assembly is located at the second position, and the second pick-and-place assembly is located at the fourth position); Figure 8 yes Figure 4 Schematic diagram of the middle loading plate; Fig. 9 It is a flow chart of a control method of PCB processing equipment provided in the second embodiment of the present invention; Fig.10 yes Fig. 9 Specific flow diagram of step S3; Fig.11 yes Fig. 9 Specific flow chart of step S5 in FIG.
[0028] The reference numerals in the specification are as follows: 1. Frame; 101. First position; 102. Second position; 103. Third position; 104. Fourth position; 11. Crossbeam; 12. Base; 13. Loading structure; 14. First knife detection assembly; 15. Second knife detection assembly; 2. First spindle structure; 21. First spindle assembly; 22. First pick-and-place assembly; 221. First bracket; 222. First clamping component; 23. Second pick-and-place assembly; 231. Second bracket; 232. Second clamping component; 24. First lifting assembly; 3. Second spindle structure; 31. Second spindle assembly; 32. Second lifting assembly; 33. Adjustment assembly; 4. First material; 5. Second material; 6. The first material tray; 7. First transfer seat; 8. The second material tray; 9. Second transfer seat; x, first direction; y, second direction; z, third direction. DETAILED DESCRIPTION
[0029] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. The equal distances mentioned in this application are not equal in an absolute sense, and it should be understood that situations within a certain deviation range can also be considered equal situations.
[0030] Embodiment 1 like Figures 1 to 8 As shown, the PCB processing equipment provided in the first embodiment of the present invention includes a frame 1, a first spindle structure 2 and a second spindle structure 3, the first spindle structure 2 includes a first spindle assembly 21, a first pick-and-place assembly 22 and a second pick-and-place assembly 23, the second spindle structure 3 includes a second spindle assembly 31 and an adjustment assembly 33, and the first spindle assembly 21 and the second spindle assembly 31 are slidably installed on the frame 1 at intervals from each other along a first direction x.
[0031] The first pick-and-place assembly 22 and the second pick-and-place assembly 23 are installed on the first spindle assembly 21 .
[0032] The first pick-and-place assembly 22 can exchange the first material 4 , such as the first tool (labeled as the first material 4 in FIG. 3 ), with the first spindle assembly 21 .
[0033] The second pick-and-place assembly 23 can exchange the second material 5 , such as a second tool (labeled as the second material 5 in FIG. 3 ), with the second spindle assembly 31 .
[0034] In the PCB processing equipment provided by the embodiment of the present invention, the first spindle structure 2 integrates the first spindle assembly 21 and two pick-and-place assemblies at the same time, and enables the first pick-and-place assembly 22 to exchange the first tool with the first spindle assembly 21, and the second pick-and-place assembly 23 to exchange the second tool with the second spindle assembly 31. Therefore, when picking and placing materials, it is only necessary to drive the first spindle structure 2 to move, so as to simplify the control process, and at the same time reduce the probability of the position of the second spindle assembly 31 being offset, thereby improving the processing accuracy.
[0035] In one embodiment, the PCB processing equipment may be a forming machine (forming machine), a drilling machine, or a drilling and forming machine.
[0036] In one embodiment, if Figures 1 to 8 As shown, the PCB processing equipment also includes a loading structure 13, which is arranged on the frame 1, and the loading structure 13 is provided with a first position 101, a second position 102, a third position 103 and a fourth position 104. The first position 101 is used to store pins and a first tool, and the third position 103 is used to store a second tool.
[0037] The first pick-and-place assembly 22 can transport the first tool between the first position 101 and the second position 102. The first spindle assembly 21 can pick up and place the first tool located at the second position 102.
[0038] The second pick-and-place assembly 23 can transport the second tool between the third position 103 and the fourth position 104. The second spindle assembly 31 can pick up and place the second tool located at the fourth position 104.
[0039] When each spindle assembly takes a tool, the first tool at the first position 101 can be placed at the second position 102 by the first pick-and-place assembly 22, so that the first spindle assembly 21 can take the material, and at the same time, the second tool at the third position 103 can be placed at the fourth position 104 by the second pick-and-place assembly 23, so that the second spindle assembly 31 can take the material. When each spindle assembly puts the tool and recycles each tool, the first spindle assembly 21 places the clamped first tool at the second position 102, so that the first pick-and-place assembly 22 can place the first tool at the second position 102 at the first position 101, and at the same time, the second spindle assembly 31 places the clamped second tool at the fourth position 104, so that the second pick-and-place assembly 23 can place the second tool at the fourth position 104 at the third position 103. By setting the second position 102 and the fourth position 104 as transfer, the difficulty of exchanging tools is reduced, and the stability of exchanging tools is improved.
[0040] In one embodiment, the first material 4 may further include pins, and the first pick-and-place assembly may further be capable of transporting the pins between the first position and the pin holes of the frame.
[0041] When a pinning or pinning process is required, the first pick-and-place component 2 can also insert or pull out the pins of the frame 1. By storing the pins in the first position 101, it is convenient for the first pick-and-place component 22 to pick up and place the pins, thereby improving the efficiency of pinning or pinning.
[0042] In one embodiment, if Figures 3 to 7 As shown, the first pick-and-place assembly 22 and the second pick-and-place assembly 23 are respectively arranged on opposite sides of the first spindle assembly 21 along the first direction x, so as to realize the installation of the first pick-and-place assembly 22 and the second pick-and-place assembly 23 on the first spindle assembly 21, and form the first spindle structure 2. Specifically, the first spindle structure 2 and the second spindle structure 3 are arranged at intervals along the first direction x, the first pick-and-place assembly 22 is arranged on the side of the first spindle structure 2 away from the second spindle structure 3, and the second pick-and-place assembly 23 is arranged on the side of the first spindle structure 2 close to the second spindle structure 3, so as to facilitate the interaction of the second pick-and-place assembly 23 and the second spindle structure 3 for the second material 5.
[0043] In one embodiment, if Figure 4 and Figure 5 As shown, the distance between the first position 101 and the third position 103 is equal to the distance between the second position 102 and the fourth position 104 , and the distance between the first position 101 and the third position 103 is equal to the distance between the first pick-and-place component 22 and the second pick-and-place component 23 .
[0044] Thus, when the first pick-and-place assembly 22 is located at the first position 101 , the second pick-and-place assembly 23 is located at the third position 103 , so that the second pick-and-place assembly 23 can pick up materials at the third position 103 while the first pick-and-place assembly 22 picks up materials at the first position 101 .
[0045] When the first pick-and-place component 22 is located at the second position 102, the second pick-and-place component 23 is located at the fourth position 104, so that the second pick-and-place component 23 can discharge materials at the fourth position 104 while the first pick-and-place component 22 discharges materials at the second position 102, which is beneficial to improving material interaction efficiency.
[0046] In one embodiment, if Figure 4 and Figure 5As shown, when the first pick-and-place component 22 picks and places the first material 4 at the first position 101, the second pick-and-place component 23 can synchronously pick and place the second material 5 at the third position 103. At this time, the first pick-and-place component 22 and the second pick-and-place component 23 perform the pick-and-place action synchronously, thereby simplifying the material picking procedure and improving the feeding or material recovery speed of the first pick-and-place component 22 and the second pick-and-place component 23.
[0047] When the first pick-and-place component 22 picks and places the first material 4 at the second position 102, the second pick-and-place component 23 can synchronously pick and place the second material 5 at the fourth position 104. At this time, the first pick-and-place component 22 and the second pick-and-place component 23 perform the pick-and-place action synchronously, thereby simplifying the material placement procedure and improving the feeding speed of the first pick-and-place component 22 and the second pick-and-place component 23.
[0048] In one embodiment, if Figure 4 and Figure 5 As shown, the first pick-and-place assembly 22 includes a first bracket 221 and a first clamping component 222. The first bracket 221 is installed on the first spindle assembly 21, and the first clamping component 222 is installed on the first bracket 221. The first clamping component 222 is used to clamp the pin or the first tool. When the first clamping component 222 clamps the pin, the clamped pin can be placed in the first position 101 or the pin hole of the frame 1, or when the PCB processing equipment is provided with a tool inspection component, the clamped pin can be placed in the first tool inspection component 14 or the second tool inspection component 15 to inspect the pin. When the first clamping component 222 clamps the first tool, the clamped first tool can be placed in the first position 101 or the second position 102 to provide the first tool to the first spindle assembly 21 or to recycle the first tool.
[0049] The second pick-and-place assembly 23 includes a second bracket 231 and a second clamping component 232. The second bracket 231 is installed on the first spindle assembly 21, and the second clamping component 232 is installed on the second bracket 231. The second clamping component 232 is used to clamp the second tool and place the clamped second tool at the third position 103 or the fourth position 104 to provide the second tool to the second spindle assembly 22 or to recycle the second tool.
[0050] In one embodiment, the first clamping member 222 and the second clamping member 232 can use existing clamping structures, and only need to be able to clamp the pin, the first tool and the second tool. Therefore, the specific structure of the first clamping member 222 and the second clamping member 232 is not limited here.
[0051] Furthermore, the first material 4 includes a pin and a first tool, and the second material 5 includes a second tool. At this time, the first material 4 and the second material 5 are both roughly tubular structures. Therefore, the first clamping component 222 and the second clamping component 232 can select existing clamping structures that can clamp the ends of the tubular structure to ensure the clamping of the first material 4 and the second material 5.
[0052] In one embodiment, if Figures 3 to 7 As shown, a first material tray 6 is provided at the first position 101 .
[0053] The second position 102 is provided with a first transfer seat 7 .
[0054] The first pick-and-place assembly 22 can transport the first tool between the first material tray 6 and the first intermediate transfer seat 7. The first spindle assembly 21 can pick up and place the first tool at the first intermediate transfer seat 7.
[0055] The first material tray 6 can provide a storage space for the first tool, and the first transfer seat 7 can provide a transfer space for the first tool, which is beneficial to improving the interaction efficiency of the first tool.
[0056] Furthermore, the first tool is roughly tubular in structure, so that the first material tray 6 and the first transfer seat 7 can be used to accommodate one end of the first tool (Figure 5 is the lower end of the first tool), and the other end of the first tool (exposed from the first material tray 6 or one end of the first transfer seat 7, Figure 5 is the upper end of the first tool) can be clamped by the first material picking and placing assembly 22 or the first spindle clamp assembly 21.
[0057] In one embodiment, if Figures 3 to 7 As shown, the third position 103 is provided with a second material tray 8 .
[0058] The fourth position 104 is provided with a second transfer seat 9 .
[0059] The second pick-and-place assembly 23 can transport the second tool between the second material tray 8 and the second intermediate transfer seat 9. The second spindle assembly 31 is used to pick up and place the second tool at the second intermediate transfer seat 9.
[0060] The second material tray 8 can provide a storage space for the second tool, and the second transfer seat 9 can provide a transfer space for the second tool, which is beneficial to improving the interaction efficiency of the second tool.
[0061] Furthermore, the second tool is roughly tubular in structure, so that the second material tray 8 and the second transfer seat 9 can be used to accommodate one end of the second tool (Figure 5 is the lower end of the second tool), and the other end of the second tool (exposed from one end of the second material tray 8 or the second transfer seat 9, Figure 5 is the upper end of the second tool) can be clamped by the second material picking and placing assembly 23 or the second spindle clamp assembly 31.
[0062] In one embodiment, the first material tray 6 is provided with a plurality of first material loading slots, at least some of which are used to place pins, and / or at least some of which are used to place first tools. The second material tray 8 is provided with a plurality of second material loading slots, at least some of which are used to place second tools.
[0063] The plurality of first material loading slots and the plurality of second material loading slots are arranged in one-to-one correspondence.
[0064] The distance between the first loading trough and the second loading trough corresponding to each other is equal to the distance between the first pick-and-place assembly 22 and the second pick-and-place assembly 23, so that the first pick-and-place assembly 22 can be picked and placed synchronously with the second pick-and-place assembly 23. In other embodiments not shown in the figure, the positions of the first loading trough and the second loading trough can be interchanged, that is, the first loading trough can be set on the first material tray, and the second loading trough can be set on the second material tray.
[0065] In one embodiment, the plurality of first loading slots are arranged in a matrix of n rows and m columns on the first material tray 6, wherein n and m are both positive integers.
[0066] The plurality of second loading slots are arranged on the second material tray 8 in a matrix of r rows and c columns, wherein r and c are both positive integers.
[0067] When the first pick-and-place component 22 clamps the first material 4 at the first loading slot in the n1th row and the m1th column, the second pick-and-place component 23 clamps the second material 5 at the second loading slot in the r1th row and the c1th column. Wherein, 1≤n1≤n, 1≤m1≤m, 1≤r1≤r, 1≤c1≤c. n1, m1, r1, c1 are all integers.
[0068] By arranging multiple first loading slots in a matrix of n rows and m columns on the first material tray 6, the first material 4 at the first position 101 can be placed more neatly. Then, through software control, the first picking and placing component 22 can clamp the first material 4 at the first loading slot of the n1th row and m1th column, making the picking of the first material 4 faster.
[0069] At the same time, by arranging multiple second loading slots in a matrix of r rows and c columns on the second material tray 8, the second material 5 can be placed more neatly at the third position 103. Then, through software control, the second picking and placing component 23 can clamp the second material 5 at the second loading slot of the r1 row and c1 column, making the picking of the second material 5 faster.
[0070] In one embodiment, n=r, m=c; and n1= r1, m1= c1.
[0071] At this time, the arrangement of the multiple first loading slots on the first material tray 6 is consistent with the arrangement of the multiple second loading slots on the second material tray 7. When the first pick-and-place component 22 clamps the first material 4 at the first loading slot at the n1th row and the m1th column, the second pick-and-place component 23 can clamp the second material 5 at the second loading slot at the r1th row and the c1th column at the same coordinate position on the second material tray 8. This coordinate position refers to the relative coordinate value on the first material tray 6 and the second material tray 8. This setting allows the first pick-and-place component 22 to always pick up materials synchronously with the second pick-and-place component 23, so as to avoid the situation where the second pick-and-place component 23 is empty when the first pick-and-place component 22 picks up materials, or the first pick-and-place component 22 is empty when the second pick-and-place component 23 picks up materials, thereby improving the feeding speed of the first pick-and-place component 22 and the second pick-and-place component 23.
[0072] In one embodiment, if Figure 3 As shown, the first spindle structure 2 also includes a first lifting assembly 24, which is slidably connected to the frame 1 along the first direction x, and the first spindle assembly 21 is installed on the first lifting assembly 24. The first lifting assembly 24 is used to drive the first spindle assembly 21 to move along the third direction z, so that the first spindle assembly 21 approaches or moves away from the first position 101, or makes the first spindle assembly 21 approach or move away from the second position 102. In addition, the first lifting assembly 24 can also drive the first pick-and-place assembly 22 and the second pick-and-place assembly 23 connected to the first spindle assembly 21 to move along the third direction z.
[0073] The second spindle structure 3 also includes a second lifting assembly 32, which is slidably connected to the frame 1 along the first direction x, and the adjusting assembly 33 is installed on the second lifting assembly 32. The second lifting assembly 32 is used to drive the adjusting assembly 33 to move along the third direction z, thereby driving the second spindle assembly 31 connected to the adjusting assembly 33 to move along the third direction z, so that the second spindle assembly 31 approaches or moves away from the third position 103, or approaches or moves away from the fourth position 104.
[0074] In one embodiment, if Figure 8 As shown, the PCB processing equipment further includes a first knife detection component 14 and a second knife detection component 15 , and the first knife detection component 14 and the second knife detection component 15 are installed on the material loading structure 13 .
[0075] The first pick-and-place assembly 22 can transport pins between the first position 101, the first tool detection assembly 14, the second tool detection assembly 15 and the pin hole of the frame 1. The first spindle assembly 21 can pick up and place the first tool located at the second position 102, and can transport the first tool between the second position 102, the first tool detection assembly 14 and the second tool detection assembly 15.
[0076] The second spindle assembly 31 is capable of transporting the second tool between the fourth position 104 , the first tool detection assembly 14 , and the second tool detection assembly 15 .
[0077] The first tool inspection component 14 is used to inspect the pin acquired by the first pick-and-place component 22, the first tool acquired by the first spindle component 21 and / or the second tool acquired by the second spindle component 31 along the first direction x, so as to detect the diameter and inclination of the pin and the tools acquired by each spindle component along the first direction x, confirm whether the pin and the tools acquired by each spindle component meet the required specifications, and at the same time confirm whether each spindle component and the tools it acquires are coaxial.
[0078] The second tool inspection component 15 is used to inspect the pin acquired by the first pick-and-place component 22, the first tool acquired by the first spindle component 21 and / or the second tool acquired by the second spindle component 31 along the second direction y, so as to detect the diameter and inclination of the pin and the tools acquired by each spindle component along the second direction y, confirm whether the pin and the tools acquired by each spindle component meet the required specifications, and at the same time confirm whether each spindle component and the tools it acquires are coaxial.
[0079] The first direction x intersects the second direction y.
[0080] In addition, due to the setting of the first tool inspection component 14 and the second tool inspection component 15, the pin, the first tool and / or the second tool can be inspected to confirm whether the specifications of the pin and each tool meet the requirements, ensure the quality of subsequent tool processing, and ensure that each tool can be coaxially arranged with the connected spindle assembly, while ensuring that each tool is parallel to each other.
[0081] In one embodiment, the first knife detecting component 14 and the second knife detecting component 15 may be photoelectric sensors or other detection structures.
[0082] In one embodiment, if Figure 8 As shown, the first blade detecting assembly 14 includes a first blade detector 141 and a second blade detector 142 . The first blade detector 141 and the second blade detector 142 are installed on the material carrying structure 13 .
[0083] The first tool detector 141 is used to detect the tool acquired by the first spindle assembly 21 along the first direction x, so as to detect the diameter and inclination of the tool acquired by the first spindle assembly 21 along the first direction x, confirm whether the tool acquired by the first spindle assembly 21 meets the required specifications, and confirm whether the first spindle assembly 21 and the first tool acquired by it are coaxial.
[0084] The second tool detector 142 is used to detect the tool acquired by the second spindle assembly 31 along the first direction x, so as to detect the diameter and inclination of the tool acquired by the second spindle assembly 31 along the first direction x, confirm whether the tool acquired by the second spindle assembly 31 meets the required specifications, and confirm whether the second spindle assembly 31 and the second tool acquired by it are coaxial.
[0085] In addition, at least one of the first tool detector 141 and the second tool detector 142 may also be used to detect the pin along the first direction x to confirm whether the pin meets the required specifications.
[0086] The second tool inspection component 15 includes a third tool detector, which is used to inspect the pin, the first tool and the second tool along the second direction y, so as to detect the diameter and inclination of the pin and each tool along the second direction y, confirm whether the pin and each tool meet the required specifications, and at the same time confirm whether each spindle component is coaxial with the tool it obtains.
[0087] In one embodiment, the distance between the first tool detector 141 and the second tool detector 142 is equal to the distance between the first spindle assembly 21 and the second spindle assembly 31, so that the tool acquired by the first spindle assembly 21 and the tool acquired by the second spindle assembly 31 can be detected synchronously.
[0088] In one embodiment, the first pick-and-place assembly 22 can also transport the second tool between the third position 103 and the second position 102. At this time, the first spindle assembly 21 can also pick up and place the second tool located at the second position 102, and can transport the second tool between the second position 102, the first tool detection assembly 14, and the second tool detection assembly 15 to detect the second tool.
[0089] In one embodiment, the first pick-and-place assembly 22 can also transport the second tool between the third position 103 and the fourth position 104. At this time, the first spindle assembly 21 can also pick up and place the second tool located at the fourth position 104, and can transport the second tool between the fourth position 104, the first tool detection assembly 14 and the second tool detection assembly 15 to detect the second tool.
[0090] In one embodiment, if Figure 3 As shown, the second spindle structure 3 further includes an adjusting assembly 33 , which is slidably mounted on the frame 1 at intervals along the first direction x, and the second spindle assembly 31 is mounted on the adjusting assembly 33 .
[0091] The adjustment assembly 33 is used to adjust the relative distance between the second spindle assembly 31 and the first spindle assembly 21 to ensure the accuracy of drilling.
[0092] In one embodiment, the adjustment component 33 is only provided on the second spindle structure 3, and the adjustment component is not provided on the first spindle structure 2. At this time, in order to make the axis of the second spindle component 31 parallel to the axis of the first spindle component 21, it is only necessary to adjust the adjustment component 33 of the second spindle structure 3, which can simplify the adjustment procedure. At the same time, since the second pick-and-place component 23 of the second spindle structure 3 is not provided with a pick-and-place component, the load-bearing capacity of the second pick-and-place component 23 can be reduced, so that the adjustment accuracy of the second spindle structure 3 is higher.
[0093] In one embodiment, if Figures 1 to 3 As shown, the frame 1 includes a crossbeam 11 and a base 12, the crossbeam 11 is installed on the base 12, and the first spindle assembly 21 and the second spindle assembly 31 are installed on the crossbeam 11 along the first direction x with intervals and sliding, so as to realize the installation of the first spindle assembly 21 and the second spindle assembly 31 on the frame 1.
[0094] The material loading structure 13 is disposed on the base 12, and the first position 101, the second position 102, the third position 103 and the fourth position 104 are disposed on the material loading structure 13 to realize the taking and placing of the first material 4 and the second material 5. Preferably, the material loading structure 13 can be a material loading plate.
[0095] In one embodiment, the PCB processing equipment includes a plurality of processing platforms, which are movably connected to a frame and used to carry PCBs. The first spindle structure and the second spindle structure can process the PCB on the same processing platform.
[0096] In one embodiment, the PCB processing equipment can be a multi-axis forming machine. In this case, the multi-axis forming machine may include a first connecting rod, multiple first spindle structures 2 are connected by the first connecting rod, multiple second spindle structures 3 are independently controlled or linked to each other, and the first spindle structure 2 and the second spindle structure 3 are independently controlled or linked to each other to form a multi-axis forming machine.
[0097] Embodiment 2 Embodiment 2 of the present invention provides a control method for PCB processing equipment, which is used for the PCB processing equipment of embodiment 1 above. The rack 1 is provided with a first position 101 and a third position 103 at intervals. The first position 101 is used to store a first tool, and the third position 103 is used to store a second tool. Fig. 9 As shown, the method includes: Step S1 : The first pick-and-place assembly 22 moves to the first position 101 , and the second pick-and-place assembly 23 moves to the third position 103 .
[0098] Step S2 , the first pick-and-place assembly 22 clamps the first tool at the first position 101 , and the second pick-and-place assembly 23 clamps the second tool at the third position 103 .
[0099] Step S3 : the first spindle assembly 21 exchanges the first tool with the first pick-and-place assembly 22 , and the second spindle assembly 31 exchanges the second tool with the second pick-and-place assembly 23 .
[0100] Step S4 , processing the PCB with the first tool clamped by the first spindle assembly 21 and the second tool clamped by the second spindle assembly 31 .
[0101] Step S5 , after the processing is completed, the first pick-and-place assembly 22 exchanges the first tool with the first spindle assembly 21 , and the second pick-and-place assembly 23 exchanges the second tool with the second spindle assembly 31 .
[0102] Step S6: The first pick-and-place assembly 22 puts the first tool back to the first position 101, and the second pick-and-place assembly 23 puts the second tool back to the third position 103, thereby recycling the tools.
[0103] According to the control method of the PCB processing equipment of the embodiment of the present invention, the first spindle structure 2 integrates the first spindle component 2121 and two pick-and-place components at the same time, and enables the first pick-and-place component 22 to exchange the first tool with the first spindle component 21, and the second pick-and-place component 23 to exchange the second tool with the second spindle component 31. Therefore, when picking and placing materials, only the first spindle structure 2 is driven to move, so as to simplify the control process, and at the same time reduce the probability of the position of the second spindle component 31 being offset, thereby improving the processing accuracy.
[0104] In one embodiment, the rack 1 is further provided with a second position 102 and a fourth position 104 at intervals. Fig.10 As shown, the above step S3 specifically includes: Step S31 : The first pick-and-place assembly 22 moves to the second position 102 , and the second pick-and-place assembly 23 moves to the fourth position 104 .
[0105] In step S32 , the first pick-and-place assembly 22 places the first tool at the second position 102 , and the second pick-and-place assembly 23 places the second tool at the fourth position 104 .
[0106] Step S33 : The first spindle assembly 21 moves to the second position 102 , and the first spindle assembly 21 clamps the first tool at the second position 102 .
[0107] Step S34 , the second spindle assembly 31 moves to the fourth position 104 , and the second spindle assembly 31 clamps the second tool at the fourth position 104 .
[0108] Through the above steps S31 to S34, each spindle assembly is clamped to the corresponding tool.
[0109] In one embodiment, the above steps S33 and S34 can be performed simultaneously or in sequence. When the steps S33 and S34 are performed in sequence, step S33 can be performed first and step S34 can be performed later, or step S34 can be performed first and step S33 can be performed later, which is not limited here.
[0110] like Fig.10 As shown, the above step S5 specifically includes: Step S51 : The first spindle assembly 21 returns the clamped first tool to the second position 102 .
[0111] Step S52 : The second spindle assembly 31 returns the clamped second tool to the fourth position 104 .
[0112] Step S53 : the first pick-and-place assembly 22 moves to the second position 102 , and the second pick-and-place assembly 23 moves to the fourth position 104 .
[0113] Step S54 , the first pick-and-place assembly 22 takes away the first tool at the second position 102 , and the second pick-and-place assembly 23 takes away the second tool at the fourth position 104 .
[0114] Through the above steps S51 to S54, each pick-and-place assembly can retrieve the corresponding tool.
[0115] In one embodiment, the above steps S51 and S52 can be performed simultaneously or sequentially. When the steps S51 and S52 are performed sequentially, step S51 can be performed first and step S52 can be performed later, or step S52 can be performed first and step S51 can be performed later, which is not limited here.
[0116] In one embodiment, the second spindle structure 3 further includes an adjustment assembly 33, which is slidably mounted on the frame 1 at intervals along the first direction x, and the second spindle assembly 31 is mounted on the adjustment assembly 33. At this time, before the above step S1, the step of driving the adjustment assembly 33 to adjust the relative distance between the second spindle assembly 31 and the first spindle assembly 2 is also included to ensure the subsequent processing effect.
[0117] In one embodiment, the frame is further provided with a first knife detection component 14 and a second knife detection component 15. At this time, after the above step S3 and before step S4, the following steps are further included: The first spindle assembly 21 sequentially transports the clamped first tool to the first tool detection assembly 14 and the second tool detection assembly 15 to detect the first tool.
[0118] The second spindle assembly 31 sequentially transports the clamped second tool to the first tool detection assembly 14 and the second tool detection assembly 15 to detect the second tool.
[0119] In one embodiment, when the first tool is tested, if the test result of the first tool is unqualified, the first spindle assembly 21 puts the clamped first tool back to the second position 102, and then the first pick-and-place assembly 22 puts the unqualified first tool back from the second position 102 to the first position 101, so as to recycle the unqualified first tool. If the test result of the first tool is qualified, the first spindle assembly 21 transports the clamped first tool to the workbench to process the material plate placed on the workbench.
[0120] When the second tool is tested, if the test result of the second tool is unqualified, the second spindle assembly 31 puts the clamped second tool back to the fourth position 104, and then the second pick-and-place assembly 23 puts the unqualified second tool back from the fourth position 104 to the third position 103, so as to recycle the unqualified second tool. If the test result of the second tool is qualified, the second spindle assembly 31 transports the clamped second tool to the workbench to process the material plate placed on the workbench.
[0121] In one embodiment, the first position 101 is also used to store pins. At this time, the control method of the PCB processing equipment further includes: the first pick-and-place component 22 takes the pin located at the first position 101 and inserts it into the pin hole of the rack 1; the first pick-and-place component 22 pulls out the pin of the rack 1 and transports it to the first position 101.
[0122] At this time, the first pick-and-place assembly 2 can not only remove the pins from the first position 101 , but also insert and remove the pins, thereby realizing the positioning of the PCB board on the rack 1 .
[0123] In one embodiment, when the frame 1 is provided with a first knife detection component 14 and a second knife detection component 15, the step of the first picking and placing component 22 taking away the pin located at the first position 101 and inserting it into the pin hole of the frame 1 includes: the first picking and placing component 22 clamps the pin located at the first position 101, and transports the clamped pin to the first knife detection component 14 and the second knife detection component 15 in sequence to detect the pin.
[0124] Afterwards, the pins that have passed the inspection are inserted into the pin holes of the frame 1 to achieve the positioning of the plate.
[0125] In one embodiment, when the pin is inspected, if the inspection result of the pin is unqualified, the first pick-and-place assembly 22 puts the clamped pin back to the first position 101. If the inspection result of the pin is qualified, the first pick-and-place assembly 22 transports the clamped pin to the workbench to position the material plate placed on the workbench.
[0126] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A PCB processing equipment, characterized in that: The machine comprises a frame, a first spindle structure and a second spindle structure, wherein the first spindle structure comprises a first spindle assembly, a first pick-and-place assembly and a second pick-and-place assembly, and the second spindle structure comprises a second spindle assembly, wherein the first spindle assembly and the second spindle assembly are slidably mounted on the frame at intervals from each other along a first direction; The first pick-and-place assembly and the second pick-and-place assembly are installed at intervals on the first spindle assembly; The first pick-and-place assembly is capable of exchanging a first tool with the first spindle assembly; The second pick and place assembly is capable of exchanging a second tool with the second spindle assembly.
2. The PCB processing equipment according to claim 1, characterized in that: The PCB processing equipment further includes a loading structure, the loading structure is arranged on the frame, the loading structure is provided with a first position, a second position, a third position and a fourth position at intervals, the first position is used to store the pin and the first tool, and the third position is used to store the second tool; The first pick-and-place assembly is capable of transporting the first tool between the first position and the second position; The first spindle assembly is capable of picking up and placing the first tool located at the second position; The second pick-and-place assembly can transport the second tool between the third position and the fourth position; and the second spindle assembly can pick up and place the second tool located at the fourth position.
3. The PCB processing equipment according to claim 2, characterized in that: The first pick-and-place assembly is further capable of transporting the pin between the first location and the pin hole of the frame.
4. The PCB processing equipment according to any one of claims 1 to 3, characterized in that: The first pick-and-place assembly and the second pick-and-place assembly are respectively disposed on opposite sides of the first spindle assembly along the first direction.
5. The PCB processing equipment according to claim 2, characterized in that: The distance between the first position and the third position is equal to the distance between the second position and the fourth position; The distance between the first position and the third position is equal to the distance between the first pick-and-place assembly and the second pick-and-place assembly.
6. The PCB processing equipment according to claim 2, characterized in that: The first position is provided with a first material tray, and the second position is provided with a first transfer seat; The first pick-and-place assembly can transport the first tool between the first material tray and the first intermediate transfer seat; the first spindle assembly can pick up and place the first tool at the first intermediate transfer seat; The third position is provided with a second material tray, and the fourth position is provided with a second transfer seat; The second pick-and-place assembly can transport the second tool between the second material tray and the second intermediate transfer seat; the second spindle assembly is used to pick up and place the second tool at the second intermediate transfer seat.
7. The PCB processing equipment according to claim 6, characterized in that: The distance between the first material tray and the second material tray is equal to the distance between the first transfer seat and the second transfer seat; and the distance between the first material tray and the second material tray is equal to the distance between the first pick-and-place component and the second pick-and-place component.
8. The PCB processing equipment according to claim 6, characterized in that: A plurality of first material loading slots are provided on the first material tray, at least some of the first material loading slots are used to place the pins, and / or at least some of the first material loading slots are used to place the first tools; The second material tray is provided with a plurality of second material loading slots, and at least some of the second material loading slots are used for placing the second cutting tools; The plurality of the first material loading slots and the plurality of the second material loading slots are arranged in one-to-one correspondence; The distance between the first material loading slot and the second material loading slot corresponding to each other is equal to the distance between the first pick-and-place component and the second pick-and-place component.
9. The PCB processing equipment according to claim 2, characterized in that: The PCB processing equipment further includes a first knife detection component and a second knife detection component, wherein the first knife detection component and the second knife detection component are installed on the material loading structure; The first pick-and-place assembly is capable of transporting the pin between the first position, the first knife detection assembly, the second knife detection assembly, and the pin hole of the frame; The first spindle assembly is capable of transporting the first tool between the second position, the first tool detection assembly, and the second tool detection assembly; The second spindle assembly is capable of transporting the second tool between the fourth position, the first tool detection assembly, and the second tool detection assembly; The first tool detection component is used to detect the pin, the first tool and / or the second tool along the first direction; the second tool detection component is used to detect the pin, the first tool and / or the second tool along the second direction; The first direction intersects the second direction.
10. The PCB processing equipment according to claim 2, characterized in that: The first pick-and-place assembly can also transport the second tool between the third position and the second position; or, the first pick-and-place assembly can also transport the second tool between the third position and the fourth position.
11. The PCB processing equipment according to claim 1, characterized in that: The second spindle structure further includes an adjustment component, the adjustment component is slidably mounted on the frame along a first direction, and the second spindle component is mounted on the adjustment component; The adjusting assembly is used to adjust the relative distance between the second spindle assembly and the first spindle assembly.
12. The PCB processing equipment according to claim 1, characterized in that: The PCB processing equipment includes a plurality of processing platforms, which are movably connected to the frame and used to carry the PCB. The first spindle structure and the second spindle structure can process the PCB on the same processing platform.
13. The PCB processing equipment according to claim 1, characterized in that: The PCB processing equipment is a multi-axis forming machine, which includes a first connecting rod, multiple first spindle structures and multiple second spindle structures. The multiple first spindle structures are connected by the first connecting rod, and the multiple second spindle structures are independently controlled or linked to each other. The first spindle structure and the second spindle structure are independently controlled or linked to each other.
14. A control method for PCB processing equipment, characterized in that: For the PCB processing equipment according to any one of claims 1 to 13, the rack is provided with a first position and a third position, the first position is used to store the first tool, and the third position is used to store the second tool; the method comprises: The first pick-and-place assembly moves to the first position, and the second pick-and-place assembly moves to the third position; The first pick-and-place assembly clamps the first tool at the first position, and the second pick-and-place assembly clamps the second tool at the third position; The first spindle assembly exchanges the first tool with the first pick-and-place assembly, and the second spindle assembly exchanges the second tool with the second pick-and-place assembly; Processing the PCB by using the first tool clamped by the first spindle assembly and the second tool clamped by the second spindle assembly; After the processing is completed, the first pick-and-place assembly exchanges the first tool with the first spindle assembly, and the second pick-and-place assembly exchanges the second tool with the second spindle assembly; The first pick-and-place assembly returns the first tool to the first position, while the second pick-and-place assembly returns the second tool to the third position.
15. The control method of PCB processing equipment according to claim 14, characterized in that: The rack is also provided with a second position and a fourth position at intervals; The step of exchanging the first tool between the first spindle assembly and the first pick-and-place assembly, and exchanging the second tool between the second spindle assembly and the second pick-and-place assembly specifically includes: The first pick-and-place assembly moves to the second position, and the second pick-and-place assembly moves to the fourth position; The first pick-and-place assembly places the first tool at the second position, and the second pick-and-place assembly places the second tool at the fourth position; The first spindle assembly moves to the second position, and the first spindle assembly clamps the first tool at the second position; The second spindle assembly moves to the fourth position, and the second spindle assembly clamps the second tool at the fourth position.
16. The control method of PCB processing equipment according to claim 15, characterized in that: After the processing is completed, the first pick-and-place assembly exchanges the first tool with the first spindle assembly, and the second pick-and-place assembly exchanges the second tool with the second spindle assembly, comprising: The first spindle assembly returns the clamped first tool to the second position; The second spindle assembly returns the clamped second tool to the fourth position; The first pick-and-place assembly moves to the second position, and the second pick-and-place assembly moves to the fourth position; The first pick-and-place assembly takes away the first tool at the second position, and the second pick-and-place assembly takes away the second tool at the fourth position.
17. The control method of PCB processing equipment according to claim 14, characterized in that: The second spindle structure further includes an adjustment component, the adjustment component is slidably mounted on the frame along a first direction, and the second spindle component is mounted on the adjustment component; Before the step of moving the first pick-and-place assembly to the first position and the second pick-and-place assembly to the third position, the method further includes: The adjusting assembly is driven to adjust the relative distance between the second spindle assembly and the first spindle assembly.
18. The control method of PCB processing equipment according to claim 14, characterized in that: The frame is also provided with a first knife detection component and a second knife detection component; After the step of exchanging the first tool with the first pick-and-place assembly, and the step of exchanging the second tool with the second pick-and-place assembly, and before the step of processing the PCB by the first tool clamped by the first spindle assembly and the second tool clamped by the second spindle assembly, the method further includes: The first spindle assembly sequentially transports the clamped first tool to the first tool detection assembly and the second tool detection assembly to detect the first tool; The second spindle assembly transports the clamped second tool to the first tool detection assembly and the second tool detection assembly in sequence to detect the second tool.
19. The control method of PCB processing equipment according to claim 18, characterized in that: The first position is also used to store pins; the method further comprises: The first pick-and-place assembly takes the pin located at the first position and inserts it into the pin hole of the frame; The first pick-and-place assembly pulls out the pin of the rack and transports it to the first position.
20. The control method of PCB processing equipment according to claim 19, characterized in that: The step of the first pick-and-place assembly taking the pin located at the first position and inserting the pin into the pin hole of the frame comprises: The first pick-and-place assembly clamps the pin located at the first position, and sequentially transports the clamped pin to the first knife detection assembly and the second knife detection assembly to detect the pin; Insert the pin that has passed the inspection into the pin hole of the frame.