PCB processing equipment and PCB processing method

Abstract

The invention relates to the technical field of circuit board processing, and discloses a PCB processing device and a PCB processing method. The PCB processing device disclosed by the invention can, when a pressing component clamps a brush to perform milling processing, drive a brush to press the PCB in a first output state with a smaller air pressure value, thereby preventing the brush from damaging the PCB; when the pressing component clamps a presser foot to perform breakpoint processing, drive the brush to press the PCB in a second output state with a larger air pressure value, thereby effectively ensuring the pressing effect of the presser foot on the PCB, thereby protecting the PCB during milling processing, ensuring that the PCB will not shake during cutting processing, ensuring processing accuracy, and improving product yield.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a PCB processing device and a PCB processing method. Background Art

[0002] With the continuous advancement of science and technology, circuit boards are gradually developing in the direction of high precision and high density. Limited by the available area of ​​the circuit board, there may be no positioning holes inside the circuit board when it is designed, resulting in the inability to use positioning pins to fix the circuit board during the circuit board processing.

[0003] At present, when there are no positioning holes inside the circuit board, the circuit board is usually fixed on the processing table by sticking tape during the circuit board processing, or the circuit board is adsorbed and fixed on the processing table by a vacuum adsorption device. However, these two methods can only fix one circuit board on the processing table at a time, that is, only one circuit board can be processed at a time, resulting in low circuit board processing efficiency.

[0004] The existing solution is to use external positioning processing, which is to set positioning parts in the sheet (outside the circuit board) to achieve positioning, then mill out part of the circuit board's outline inside the sheet, and finally cut the circuit board from the rest of the sheet to obtain the circuit board. However, this processing method may cause the circuit board to shake during the cutting process, resulting in low processing accuracy and affecting product yield. Summary of the invention

[0005] The embodiments of the present invention provide a PCB processing device and a PCB processing method to solve the problems of low processing efficiency and low yield rate of a circuit board when there are no positioning holes on the circuit board.

[0006] A PCB processing device comprises a spindle assembly, a clamping assembly and a driving assembly, wherein the clamping assembly is movably connected to one end of the spindle assembly, and the clamping assembly can be equipped with a brush and a presser foot; the driving end of the driving assembly is connected to the clamping assembly to drive the clamping assembly to move; The driving component has a first output state and a second output state, and the air pressure value of the first output state is smaller than the air pressure value of the second output state; When the clamping assembly is clamped with the brush, the driving assembly is in a first output state; when the clamping assembly is clamped with the presser foot, the driving assembly is in a second output state.

[0007] The above-mentioned PCB processing equipment, optionally, further comprises a machine tool assembly, wherein the machine tool assembly comprises a processing table and a transfer seat mounted on the processing table; The transfer seat is provided with a placement position for placing the brush and the presser foot, and the spindle assembly can be moved to the transfer seat to replace the brush and the presser foot.

[0008] The above-mentioned PCB processing equipment may optionally further include a detection component, wherein the detection component is mounted on the pressing component, and a detection position is also provided on the transfer seat; The detection component is used to detect whether the pressing component is installed with the brush or the presser foot, and / or whether the brush installed on the pressing component meets the use requirements when the spindle component is in the detection position.

[0009] The above-mentioned PCB processing equipment, optionally, the detection component includes a sensor and a sensor sheet; The sensor is installed on the driving assembly, and the sensor sheet is installed on the pressing assembly; or, The sensor is installed on the pressing assembly, and the sensor sheet is installed on the driving assembly.

[0010] The above-mentioned PCB processing equipment, optionally, the placement position includes a brush placement position, a presser foot placement position and a discarded presser foot placement position which are arranged at intervals on the transfer seat, the brush placement position is used to place the brush, the presser foot placement position is used to place the presser foot, and the discarded presser foot placement position is used to place the scrapped brush or presser foot.

[0011] The above-mentioned PCB processing equipment can optionally include a cutter disc assembly on the processing table, and the transfer seat is installed on the cutter disc assembly.

[0012] A PCB processing method, used for processing a PCB from a sheet material, applied to any of the above-mentioned PCB processing equipment, comprising: The spindle assembly is equipped with a brush; The driving assembly is in the first output state, the spindle assembly presses the sheet material through the brush, and performs milling processing; After the milling process is completed, the spindle assembly clamps the presser foot; The driving assembly is in a second output state, the spindle assembly presses the sheet material through the presser foot, and performs breakpoint processing to obtain a PCB of a preset size.

[0013] In the above PCB processing method, optionally, the PCB processing equipment includes a processing table and a transfer seat installed on the processing table, and the transfer seat is provided with a brush placement position and a presser foot placement position, and the method specifically includes: The spindle assembly moves to the brush placement position, and the clamping assembly clamps the brush placed on the brush placement position; Controlling the driving assembly to adopt a first output state, driving the brush clamped by the pressing assembly to press the sheet material placed on the processing table, and controlling the spindle assembly to perform milling processing on the sheet material; After the milling process of the sheet metal is completed, the spindle assembly is controlled to move to the brush placement position to place the brush back to the brush placement position; The spindle assembly moves to the presser foot placement position on the intermediate transfer seat, and the clamping assembly clamps the presser foot placed on the presser foot placement position; The driving component is controlled to adopt the second output state, the presser foot clamped by the pressing component is driven to press the sheet placed on the processing table, and the spindle component is controlled to perform breakpoint processing on the sheet to obtain a PCB of a preset size. In the above PCB processing method, optionally, the PCB processing equipment further includes a detection component, and the transfer seat is further provided with a detection position; After the spindle assembly moves to the brush placement position on the intermediate transfer seat, and the pressing assembly on the spindle assembly clamps the brush placed on the brush placement position, and before the step of controlling the driving assembly to adopt the first output state, the method further includes: The spindle assembly moves to the detection position, and controls the spindle assembly to perform a downward pressure detection at the detection position; The detection component is used to detect whether the pressing component clamps the brush and / or detect whether the brush meets the use requirements.

[0014] In the above PCB processing method, optionally, the detection component includes a sensor and a sensor sheet, a first position is preset in the PCB processing equipment, and the spindle component can drive the clamping component to move to the first position; The step of detecting whether the pressing assembly holds the brush by the detection assembly specifically includes: driving the pressing assembly to move in a direction close to the first position; If the sensor senses the sensing sheet to trigger a sensing signal before the pressing assembly reaches the first position, it is determined that the pressing assembly clamps the brush; If the sensor does not sense the sensing sheet when the pressing assembly reaches the first position, it is determined that the pressing assembly does not clamp the brush.

[0015] In the above PCB processing method, optionally, the detection component includes a sensor and a sensor sheet, a second position is preset in the PCB processing equipment, and the spindle component can drive the clamping component to move to the second position; The step of detecting whether the brush meets the use requirements specifically includes: driving the pressing assembly to move in a direction close to the second position; If the sensor senses the sensing sheet to trigger a sensing signal before the pressing assembly reaches the second position, it is determined that the brush meets the usage requirements; If the sensor does not sense the sensing sheet when the pressing assembly reaches the second position, it is determined that the brush does not meet the usage requirements.

[0016] In the above PCB processing method, optionally, the intermediate transfer seat is further provided with a discarded presser foot placement position; After the step of determining that the brush does not meet the use requirements, the method further includes: The spindle assembly is controlled to move to the discarded presser foot placement position, and the brush is placed at the discarded presser foot placement position.

[0017] In the above PCB processing method, optionally, the detection component includes a sensor and a sensor sheet, a third position is preset in the PCB processing equipment, and the spindle component can drive the clamping component to move to the third position; After the step of clamping the presser foot placed on the presser foot placement position by the clamping assembly and before the step of controlling the driving assembly to adopt the second output state, the method further includes: driving the pressing assembly to move in a direction close to the third position; If the sensor senses the sensing sheet to trigger a sensing signal before the clamping assembly reaches the third position, it is determined that the clamping assembly clamps the presser foot; If the sensor does not sense the sensing sheet when the pressing assembly reaches the third position, it is determined that the pressing assembly does not clamp the presser foot.

[0018] The above-mentioned PCB processing equipment and PCB processing method include a spindle assembly, a clamping assembly and a driving assembly, wherein the clamping assembly is movably connected to one end of the spindle assembly, and the clamping assembly is used to install a brush or a presser foot; the driving end of the driving assembly is connected to the clamping assembly to drive the clamping assembly to move; the driving assembly has a first output state and a second output state, and the air pressure value of the first output state is less than the air pressure value of the second output state. When the clamping assembly clamps the brush, the driving assembly is in the first output state; when the spindle clamps the presser foot, the driving assembly is in the second output state. It can be seen that the PCB processing equipment disclosed in the present invention can drive the brush to clamp the PCB in the first output state with a smaller air pressure value when the clamping assembly is clamping the brush, and perform milling processing, which can avoid the brush from damaging the PCB; when the clamping assembly is clamping the presser foot, the driving assembly uses the second output state with a larger air pressure value to drive the presser foot to clamp the PCB, and perform breakpoint processing, which can effectively ensure the clamping effect of the presser foot on the PCB, ensure that the PCB will not shake when performing the cutting process, ensure the processing accuracy, and improve the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0020] Figure 1 It is a structural schematic diagram of a PCB processing device disclosed in an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a spindle assembly and a clamping assembly disclosed in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a transfer seat disclosed in an embodiment of the present invention. Figure 4 It is a flow chart for realizing a PCB processing method disclosed in an embodiment of the present invention; Figure 5 It is a schematic diagram of a PCB processing structure disclosed in an embodiment of the present invention; Figure 6 is another implementation flow chart of a PCB processing method disclosed in an embodiment of the present invention; Figure 7 It is a partial implementation flow chart of a PCB processing method disclosed in an embodiment of the present invention; Figure 8 It is a partial implementation flow chart of a PCB processing method disclosed in an embodiment of the present invention; Fig. 9It is a partial implementation flow chart of a PCB processing method disclosed in an embodiment of the present invention; Among them, 1 is the spindle assembly, 2 is the clamping assembly, 3 is the driving assembly, 4 is the brush, 5 is the presser foot, 6 is the machine tool assembly, 7 is the processing table, 8 is the transfer seat, 9 is the placement position, 10 is the detection assembly, 11 is the detection position, 12 is the sensor, 13 is the sensor sheet, 14 is the brush placement position, 15 is the presser foot placement position, 16 is the pressure plate placement position, 17 is the discarded presser foot placement position, 18 is the tool disc assembly, 19 is the sheet material, 20 is the cutting and milling processing area, 21 is the breakpoint processing area, 22 is the PCB, and 23 is the spindle tool. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0023] It should also be understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0024] As used in the present specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]", depending on the context.

[0025] In addition, in the description of the present specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0026] References to "one embodiment" or "some embodiments" etc. described in the present specification mean that one or more embodiments of the present invention include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0027] A schematic diagram of a sheet material processing structure disclosed in an embodiment of the present invention is as follows: Figure 5 As shown, it includes a processing table 7, a sheet 19, a cutting and milling processing area 20, a breakpoint processing area 21 and a PCB 22 of a preset size. It can be understood that the sheet 19 is divided into a first area, a second area and a third area, the first area is arranged around the second area, and the second area is arranged around the third area. The first area is used to set a pin hole to cooperate with the pin positioning on the processing table 7 to achieve the positioning of the sheet 19. After the processing is completed, the first area is a waste sheet area. The third area is the final required PCB 22, the second area is located between the first area and the third area, the second area is the area to be processed, including the milling processing area 20 and the breakpoint processing area 21, the spindle assembly 1 is processed along the second area to separate the third area from the first area, to achieve the separation of PCB 22 from the sheet 19, and obtain the final required PCB 22.

[0028] The embodiment of the present invention discloses a PCB processing device, referring to Figure 1 As shown, the PCB processing equipment disclosed in the embodiment of the present invention includes a spindle assembly 1, a clamping assembly 2 and a driving assembly 3. The clamping assembly 2 is movably connected to one end of the spindle assembly 1, and the clamping assembly 2 can be equipped with a brush 4 and a presser foot 5; the driving end of the driving assembly 3 is connected to the clamping assembly 2 to be able to drive the clamping assembly 2 to move; the driving assembly 3 has a first output state and a second output state, and the air pressure value of the first output state is less than the air pressure value of the second output state; when the clamping assembly 2 clamps the brush 4, the driving assembly 3 is in the first output state; when the spindle clamps the presser foot 5, the driving assembly 3 is in the second output state.

[0029] The driving assembly 3 in this embodiment includes but is not limited to driving devices such as a double-force cylinder and a motor. For example, taking the double-force cylinder as an example, the double-force cylinder can provide at least two output pressure values, corresponding to the first output state and the second output state. Alternatively, at least two stacked cylinders can be provided, when in the first output state, at least one cylinder is actuated, and when in the second output state, at least two cylinders are actuated, so as to provide two output pressure values.

[0030] In a specific implementation, in this embodiment, when the sheet material 19 is milled, the brush 4 can be first installed on the clamping assembly 2, and then the first output state with a smaller air pressure value is used to control the driving assembly 3 to drive the clamping assembly 2 to move so that the brush 4 presses the sheet material 19; when the sheet material 19 is broken, the presser foot 5 can be first installed on the clamping assembly 2, and then the second output state with a larger air pressure value is used to control the driving assembly 3 to drive the clamping assembly 2 to move so that the presser foot 5 presses the sheet material 19. Therefore, during the milling process, the first output state with a smaller air pressure value is used to control the driving assembly 3 to drive the clamping assembly 2 to move so that the brush 4 presses the sheet material 19, which not only allows the brush 4 to have sufficient pressing force to press the sheet material 19, but also allows the spindle assembly 1 to move on the sheet material 19 and prevents the brush from damaging the PCB 22. During the breakpoint processing, the second output state with a larger air pressure value is used to control the drive component 3 to drive the clamping component 2 to move, so that the rough presser foot 5 presses the sheet 19 and PCB22. This can ensure that when the spindle component 1 breaks the breakpoint, the sheet 19 and PCB22 are prevented from being offset and affecting the processing quality.

[0031] It should be noted that the spindle assembly 1 in this embodiment also includes a spindle tool 23. When processing the sheet 19, the spindle assembly 1 can be controlled to grab the spindle tool 23 first, and then the presser foot 5 or the brush 4 can be installed on the clamping assembly 2. Alternatively, in this embodiment, the presser foot 5 or the brush 4 can be installed on the clamping assembly 2 first, and then the spindle assembly 1 can be controlled to grab the spindle tool 23. In this way, the spindle assembly 1 can be controlled to process the sheet 19 through the spindle tool 23 while the clamping assembly 2 is driven to move through the driving assembly 3, so that the brush 4 or the presser foot 5 on the clamping assembly 2 can clamp the sheet 19 and PCB22. In this way, the sheet 19 and PCB22 can be prevented from moving during the processing, causing the PCB22 to be scrapped.

[0032] In one embodiment, Figure 1 As shown, the PCB processing equipment in this embodiment also includes a machine tool assembly 6, which includes a processing table 7 and a transfer seat 8 installed on the processing table 7. The transfer seat 8 is provided with a placement position 9, which is used to place the brush 4 and the presser foot 5. The spindle assembly 1 can be moved to the transfer seat 8 to replace the brush 4 and the presser foot 5.

[0033] Among them, the processing table 7 is used to place the sheet material 19 to be processed. At the same time, the transfer seat 8 is arranged on the processing table 7, which is convenient for controlling the spindle assembly 1 to move to the position of the transfer seat 8, and then replacing or installing the brush 4 and the presser foot 5 on the transfer seat 8 on the clamping assembly 2.

[0034] In a specific implementation, in this embodiment, the brush 4 and the presser foot 5 on the intermediate seat 8 can be replaced or installed on the clamping assembly 2 manually, or an automatic clamping structure, such as a snap mechanism, is provided on the clamping assembly 2 to realize automatic installation or replacement of the brush 4 and the presser foot 5 of the clamping assembly 2.

[0035] In one embodiment, Figure 1 , Figure 2 and Figure 3 As shown, the PCB processing equipment in this embodiment also includes a detection component 10, which is installed on the clamping component 2. A detection position 11 is also provided on the transfer seat 8. The detection component 10 is used to detect whether the clamping component 2 is installed with a brush 4 or a presser foot 5, and / or whether the brush installed on the clamping component meets the use requirements.

[0036] The detection component 10 includes a sensor 12 and a sensor sheet 13 . The sensor 12 is installed on the driving component 3 , and the sensor sheet 13 is installed on the clamping component 2 . Alternatively, the sensor 12 is installed on the clamping component 2 , and the sensor sheet 13 is installed on the driving component 3 .

[0037] In a specific implementation, the spindle assembly 1 drives the clamping assembly 2 to move close to the detection position 11. Before the clamping assembly 2 moves to the detection position 11, if the sensor 12 senses the sensing sheet 13, it is determined that the clamping assembly 2 is installed with a presser foot 5 or a brush 4. When the clamping assembly 2 moves to the detection position 11, if the sensor 12 does not sense the sensing sheet 13, it is determined that the clamping assembly 2 is not installed with a presser foot 5 or a brush 4. Therefore, the detection assembly 10 can detect whether the clamping assembly 2 is installed with a brush 4 or a presser foot 5.

[0038] To sum up, in this embodiment, by detecting whether a presser foot 5 or a brush 4 is installed on the clamping assembly 2, it is possible to avoid the situation where the PCB processing equipment processes the sheet 19 when there is no brush 4 or presser foot 5 on the clamping assembly 2, thereby avoiding the problem of the sheet 19 being scrapped due to the offset of the sheet 19 during the processing.

[0039] In one embodiment, Figure 1 , Figure 2 and Figure 3As shown, the placement position 9 in this embodiment includes a brush placement position 14, a presser foot placement position 15, and a discarded presser foot placement position 17 which are arranged at intervals on the transfer seat 8. The brush placement position 14 is used to place the brush 4, the presser foot placement position 15 is used to place the presser foot 5, and the discarded presser foot placement position 17 is used to place the discarded brush 4 or presser foot 5. In some embodiments, the placement position 9 may also include a pressure plate placement position 16, and the pressure plate placement position 16 is used to place the pressure plate. When the PCB is transported to the processing table 7, the clamping assembly 2 can clamp the pressure plate and press the PCB board onto the processing table 7 through the pressure plate, ensuring that the pin holes outside the PCB are sleeved onto the pins of the processing table 7 to achieve the positioning of the PCB.

[0040] In a specific implementation, during the processing of the PCB processing equipment in this embodiment, if the brush 4 is needed to press the sheet material, the main shaft assembly 1 is controlled to move to the brush placement position 14, and the pressing assembly 2 is controlled to clamp the brush 4 placed on the brush placement position 14; if the presser foot 5 is needed to press the sheet material, the main shaft assembly 1 is controlled to move to the presser foot placement position 15, and the pressing assembly 2 is controlled to clamp the presser foot 5 placed on the presser foot placement position 15; if the brush 4 or the presser foot 5 is severely worn and reaches the scrap standard, the main shaft assembly 1 is controlled to move to the discarded presser foot placement position 17, and the pressing assembly 2 is controlled to place the discarded brush 4 or presser foot 5 on the discarded presser foot placement position 17.

[0041] It should be noted that when a brush 4 has been installed on the clamping assembly 2, if it is necessary to replace the brush 4 installed on the clamping assembly 2 with a presser foot 5, it is necessary to first control the spindle assembly 1 to move to the brush placement position 14, control the clamping assembly 2 to place the brush 4 back to the brush placement position 14, and then control the spindle assembly 1 to move to the presser foot placement position 15, and then control the clamping assembly 2 to clamp the presser foot 5 placed on the presser foot placement position 15.

[0042] To sum up, in this embodiment, the brush placement position 14, the presser foot placement position 15, the pressure plate placement position 16 and the discarded presser foot placement position 17 are arranged at intervals on the transfer seat 8, which can effectively shorten the time for the spindle to replace the brush 4, the presser foot 5 and the pressure plate, etc., which is beneficial to improving the processing efficiency of the PCB equipment.

[0043] In one embodiment, Figure 1 , Figure 2 and Figure 3 As shown, a cutter disc assembly 18 is provided on the processing table 7 in this embodiment, and the intermediate transfer seat 8 is installed on the cutter disc assembly 18 .

[0044] refer to Figure 3As shown, the transfer seat 8 in this embodiment can be directly installed on the machine tool assembly 6, or the transfer seat 8 in this embodiment can also be indirectly installed on the machine tool assembly 6. For example, the transfer seat 8 is installed on the cutter head, and the cutter head is installed on the machine tool assembly 6, that is, the transfer seat 8 is installed on the machine tool assembly 6 through the cutter head, wherein the cutter head assembly 18 is provided with spindle tools 23 of different specifications.

[0045] In summary, in this embodiment, by integrating the transfer seat 8 on the cutter disc, not only can space be saved, but also the time for replacing the brush 4, the presser foot 5 and the cutting tools on the cutter disc can be reduced, which is beneficial to improving the processing efficiency of the PCB equipment.

[0046] In one embodiment, Figure 4 As shown, it is a flowchart of implementing a PCB processing method disclosed in an embodiment of the present invention. The method is applicable to the PCB processing equipment disclosed in any of the above embodiments. The method in this embodiment includes the following steps: The spindle assembly 1 clamps the brush 4; The driving assembly 3 is in the first output state, the spindle assembly 1 presses the sheet material 19 through the brush 4 and performs milling processing; After the milling process is completed, the spindle assembly 1 is clamped with the presser foot 5; The driving assembly 3 is in the second output state, the spindle assembly 1 presses the sheet material 19 via the presser foot 5 and performs breakpoint processing to obtain a circuit board of a preset size.

[0047] Further, the PCB processing equipment includes a processing table 7 and a transfer seat 8 installed on the processing table 7, and the transfer seat 8 is provided with a brush placement position 14 and a presser foot placement position 15. The method specifically includes: S401: Control the spindle assembly 1 to move to the brush placement position 14 on the transfer seat 8 to control the clamping assembly 2 on the spindle assembly 1 to clamp the brush 4 placed on the brush placement position 14 .

[0048] In a specific implementation, the brush placement position 14 in this embodiment has a corresponding unique coordinate in the machine coordinate system of the PCB processing equipment. According to the coordinate corresponding to the brush placement position 14, the spindle assembly 1 is controlled to move to the brush placement position 14 on the transfer seat 8, and then the clamping assembly 2 on the spindle assembly 1 is controlled to clamp the brush 4 placed on the brush placement position 14, so as to realize the replacement between the brush 4 and the presser foot 5.

[0049] S402: Control the driving component 3 to adopt the first output state, drive the brush 4 clamped by the pressing component 2 to press the PCB placed on the processing table 7, and control the spindle component 1 to perform milling processing on the sheet material 19.

[0050] It should be noted that the spindle assembly 1 in this embodiment includes a spindle tool, and the spindle tool can be installed on the spindle assembly 1 before installing the brush 4 on the clamping assembly 2, or the spindle tool can be installed on the spindle assembly 1 after installing the brush 4 on the clamping assembly 2, which is not limited in this embodiment.

[0051] In a specific implementation, in this embodiment, when the spindle assembly 1 is controlled to perform milling processing on the sheet material 19, the driving assembly 3 is controlled to adopt the first output state, and the brush 4 clamped by the clamping assembly 2 is driven to clamp the PCB placed on the processing table 7. That is to say, when the spindle assembly 1 is used to perform milling processing on the PCB, the brush 4 installed on the clamping assembly 2 is used to clamp the PCB to prevent the PCB from moving during the processing, thereby avoiding the PCB from being scrapped due to movement during the processing. Among them, controlling the spindle assembly 1 to perform milling processing on the sheet material 19 refers to cutting the PCB according to a preset cutting trajectory, skipping the preset break points during the cutting process, and waiting for the subsequent steps to process the break points.

[0052] S403: After completing the milling process on the sheet material 19 , the spindle assembly 1 is controlled to move to the brush placement position 14 to place the brush 4 back to the brush placement position 14 .

[0053] S404: Control the spindle assembly 1 to move to the presser foot placement position 15 on the transfer seat 8 to control the clamping assembly 2 on the spindle assembly 1 to clamp the presser foot 5 placed on the presser foot placement position 15 .

[0054] It should be understood that during the PCB processing, at different processing stages, the clamping assembly 2 needs to select the brush 4 or the presser foot 5 for subsequent processing steps. Therefore, it is necessary to replace the presser foot 5 installed on the clamping assembly 2 with the brush 4, or, replace the brush 4 installed on the clamping assembly 2 with the presser foot 5.

[0055] In the specific implementation, in this embodiment, in order to replace the brush 4 installed on the clamping assembly 2 with the presser foot 5, it is first necessary to place the brush 4 installed on the clamping assembly 2 back to the brush placement position 14, and then control the main shaft assembly 1 to move to the presser foot placement position 15 on the transfer seat 8, so as to control the clamping assembly 2 on the main shaft assembly 1 to clamp the presser foot 5 placed on the presser foot placement position 15.

[0056] S405: Control the driving component 3 to adopt the second output state, drive the presser foot 5 clamped by the clamping component 2 to clamp the sheet material 19 placed on the processing table 7, and control the spindle component 1 to perform breakpoint processing on the sheet material 19.

[0057] Among them, the air pressure value corresponding to the first output state is smaller than the air pressure value corresponding to the second output state.

[0058] In a specific implementation, in the process of breakpoint processing in this embodiment, since the spindle assembly 1 only needs to process a smaller area, the drive assembly 3 can be controlled to adopt the second output state during the breakpoint processing, and the presser foot 5 clamped by the clamping assembly 2 can be driven to press the sheet 19 placed on the processing table 7, and then the spindle assembly 1 is controlled to process the preset breakpoint, and after the breakpoint processing is completed, a circuit board of a preset size is obtained. The presser foot 5 includes but is not limited to a rubber presser foot 5.

[0059] During processing in the present application, the sheet material 19 is pressed and fixed on the processing table 7 by the driving component 3. Specifically, when the spindle component 1 is controlled to process the sheet material 19, the spindle component 1 is first controlled to process the cutting and milling processing area. At this time, the driving component 3 adopts the first output state to drive the brush 4 clamped by the clamping component to press the sheet material 19. After the cutting and milling processing area is processed, the spindle component 1 is controlled to process the breakpoint processing area. At this time, the driving component 3 adopts the second output state to drive the external positioning presser foot 5 clamped by the clamping component to press the sheet material 19. It should be noted that when controlling the spindle assembly 1 to process the cutting and milling processing area, the spindle assembly 1 needs to move over a large range in the cutting and milling processing area. At this time, the brush 4 also needs to move with the spindle assembly 1. Therefore, the drive assembly 3 adopts the first output state with a smaller air pressure value to drive the brush 4 to press the sheet 19. When controlling the spindle assembly 1 to process the breakpoint processing area, the breakpoint processing area is small, and there is no need for the external positioning presser foot 5 to move with the spindle assembly 1. The external positioning presser foot 5 only needs to cooperate with the spindle assembly 1 to twist in a small range. Therefore, the drive assembly 3 adopts the second output state with a larger air pressure value to drive the presser foot 5 assembly to press the sheet 19 to obtain a better pressing effect.

[0060] To sum up, in this embodiment, when the spindle assembly 1 is controlled to perform milling processing on the sheet 19, the brush 4 is required to follow the spindle to slide on the sheet 19, and the control drive assembly 3 adopts the first output state with a smaller air pressure value to drive the brush 4 to press the sheet 19, which can prevent the brush 4 from damaging the sheet 19. When the spindle assembly 1 is controlled to perform breakpoint processing on the sheet 19, the external positioning presser foot 5 is not required to slide with the spindle. The control drive assembly 3 adopts the second output state with a larger air pressure value to drive the brush 4 to press the sheet 19, which can achieve a better pressing effect, which is beneficial to ensure the processing accuracy and improve the yield rate of the PCB.

[0061] based on Figure 4 In the specific implementation, the following steps may be included after step S101 in this embodiment, such as Figure 6 As shown: S406: The spindle assembly 1 moves in a direction close to the detection position 11.

[0062] In this embodiment, the PCB processing equipment includes a length direction X, a width direction Y and a height direction Z. In step S406, the spindle assembly 1 first reaches directly above the detection position 11 in the length direction X and the width direction Y, that is, above the detection position 11 along the height direction Z, and then drives the spindle assembly 1 to move along the height direction Z close to the detection position 11.

[0063] S407: Detecting whether the pressing assembly 2 holds the brush 4 and / or detecting whether the brush 4 meets the use requirements by means of the detection assembly 10.

[0064] The detection component 10 includes a sensor 12 and a sensor sheet 13 . The sensor 12 is installed on the driving component 3 , and the sensor sheet 13 is installed on the clamping component 2 . Alternatively, the sensor 12 is installed on the clamping component 2 , and the sensor sheet 13 is installed on the driving component 3 .

[0065] In a specific embodiment, the detection assembly 10 includes a sensor 12 and a sensor sheet 13. A first position is preset in the PCB processing equipment, and the spindle assembly 1 can drive the clamping assembly 2 to move to the first position. The first position can be the same as the detection position 11 on the transfer seat 8, that is, the first position can be located on the upper surface of the transfer seat 8.

[0066] like Figure 7 As shown, the step of detecting whether the pressing assembly 2 holds the brush 4 by the detection assembly 10 specifically includes: S701: Drive the clamping assembly 2 to move in a direction approaching the first position.

[0067] S702: If the sensor 12 senses the sensing sheet 13 to trigger the sensing signal before the clamping assembly 2 reaches the first position, it is determined that the clamping assembly 2 clamps the brush 4. It can be understood that if the clamping assembly 2 clamps the brush 4, the brush 4 will reach the first position first during the process of the clamping assembly 2 approaching the first position. Since the brush 4 has a certain length, the brush 4 presses against the transfer seat 8 during the process of the clamping assembly 2 continuing to approach the first position, so that the transfer seat 8 provides a reaction force, so that the clamping assembly 2 moves upward, and then the sensing sheet 13 moves into the sensor 12 and is sensed by the sensor 12, and a sensing signal is emitted.

[0068] S703: If the sensor 12 does not sense the sensing sheet 13 when the pressing assembly 2 reaches the first position, it is determined that the pressing assembly 2 does not clamp the brush 4. In this embodiment, the initial distance between the sensor 12 and the sensing sheet 13 is adjusted according to the length of the brush 4 and can be flexibly set according to actual requirements.

[0069] In one embodiment, the detection assembly 10 includes a sensor 12 and a sensor sheet 13. A second position is preset in the PCB processing equipment, and the spindle assembly 1 can drive the clamping assembly 2 to move to the second position. The second position can be set according to the first position and the length of the brush 4 that meets the use requirements. For example, the Z-axis coordinate value of the first position is 0, and the length of the new brush 4 is 6 cm. When the length of the brush 4 is greater than or equal to 2 cm, it can meet the use requirements, and the Z-axis coordinate value of the second position is 2.

[0070] like Figure 8 As shown, the steps of detecting whether the brush 4 meets the use requirements specifically include: S801: driving the pressing assembly 2 to move in a direction close to the second position. Similar to the detection method of step S406, the pressing assembly 2 first reaches directly above the second position, and then moves in the height direction Z in a direction close to the second position.

[0071] S802: If the sensor 12 senses the sensing sheet 13 to trigger the sensing signal before the clamping assembly 2 reaches the second position, it is determined that the brush 4 meets the use requirement. Similarly, taking the use requirement of the length of the brush 4 as greater than or equal to 2 cm as an example, if the length of the brush 4 is greater than or equal to 2 cm, the brush 4 will reach the second position before the clamping assembly 2. When the clamping assembly 2 continues to approach the second position, the transfer seat 8 will provide a reaction force to the brush 4, causing the clamping assembly 2 to move upward, thereby causing the sensor 12 to sense the sensing sheet 13 to trigger the sensing signal.

[0072] S803: If the sensor 12 does not sense the sensing sheet 13 when the pressing assembly 2 reaches the second position, it is determined that the brush 4 does not meet the use requirements. It can be understood that if the length of the brush 4 is less than 2 cm, when the pressing assembly 2 reaches the second position, the brush 4 will not press the transfer seat 8, and the transfer seat 8 will not provide a reaction force, and the sensor 12 will not be able to sense the sensing sheet 13.

[0073] In one embodiment, the transfer seat 8 is further provided with a discarded presser foot placement position 17 .

[0074] After the step of determining that the brush 4 does not meet the use requirements, the method further includes: The spindle assembly 1 is controlled to move to the discarded presser foot placement position 17, and the brush 4 is placed in the discarded presser foot placement position 17. In this embodiment, when it is detected that the length of the brush 4 does not meet the use requirements, the spindle assembly 1 is controlled to move to the discarded presser foot placement position 17, so as to place the brush 4 in the discarded presser foot placement position 17, and then the brush 4 is reinstalled to ensure the processing quality.

[0075] In one embodiment, the detection assembly 10 includes a sensor 12 and a sensor sheet 13. A third position is preset in the PCB processing equipment, and the spindle assembly 1 can drive the clamping assembly 2 to move to the third position. The third position can be set according to the first position and the height of the presser foot 5.

[0076] like Fig. 9 As shown, after the step of the pressing assembly 2 clamping the presser foot 5 placed on the presser foot placement position 15 and before the step of controlling the driving assembly 3 to adopt the second output state, the method further includes: S901: Drive the clamping assembly 2 to move in a direction approaching the third position.

[0077] S902 : If the sensor 12 senses the sensing sheet 13 to trigger a sensing signal before the clamping assembly 2 reaches the third position, it is determined that the clamping assembly 2 clamps the presser foot 5 .

[0078] S903: If the sensor 12 does not sense the sensing sheet 13 when the pressing assembly 2 reaches the third position, it is determined that the pressing assembly 2 does not clamp the presser foot 5.

[0079] The principle of detecting whether the presser foot 5 is present is the same as the principle of detecting whether the brush 4 is present, and will not be described in detail here.

[0080] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A PCB processing equipment, characterized in that: It comprises a main shaft assembly, a clamping assembly and a driving assembly, wherein the clamping assembly is movably connected to one end of the main shaft assembly, and the clamping assembly can be equipped with a brush and a presser foot; the driving end of the driving assembly is connected to the clamping assembly to drive the clamping assembly to move; The driving component has a first output state and a second output state, and the air pressure value of the first output state is smaller than the air pressure value of the second output state; When the clamping assembly is clamped with the brush, the driving assembly is in a first output state; when the clamping assembly is clamped with the presser foot, the driving assembly is in a second output state.

2. The PCB processing equipment according to claim 1, characterized in that: The PCB processing equipment also includes a machine tool assembly, and the machine tool assembly includes a processing table and a transfer seat installed on the processing table; The transfer seat is provided with a placement position for placing the brush and the presser foot, and the spindle assembly can be moved to the transfer seat to replace the brush and the presser foot.

3. The PCB processing equipment according to claim 2, characterized in that: It also includes a detection component, which is installed on the pressing component, and a detection position is also provided on the transfer seat; The detection component is used to detect whether the pressing component is installed with the brush or the presser foot, and / or whether the brush installed by the pressing component meets the use requirements.

4. The PCB processing equipment according to claim 3, characterized in that: The detection component includes a sensor and a sensor sheet; The sensor is installed on the driving assembly, and the sensor sheet is installed on the pressing assembly; or, The sensor is installed on the pressing assembly, and the sensor sheet is installed on the driving assembly.

5. The PCB processing equipment according to claim 2, characterized in that: The placement position includes a brush placement position, a presser foot placement position and a discarded presser foot placement position which are arranged at intervals on the transfer seat. The brush placement position is used to place the brush, the presser foot placement position is used to place the presser foot, and the discarded presser foot placement position is used to place the discarded brush or presser foot.

6. The PCB processing equipment according to claim 2, characterized in that: The processing table is provided with a cutter disc assembly, and the intermediate transfer seat is installed on the cutter disc assembly.

7. A PCB processing method for processing a PCB from a sheet material, characterized in that: The PCB processing equipment used in any one of claims 1 to 6 comprises: The spindle assembly is equipped with a brush; The driving assembly is in the first output state, the spindle assembly presses the sheet material through the brush, and performs milling processing; After the milling process is completed, the spindle assembly clamps the presser foot; The driving assembly is in a second output state, the spindle assembly presses the sheet material through the presser foot, and performs breakpoint processing to obtain a PCB of a preset size.

8. The PCB processing method according to claim 7, characterized in that: The PCB processing equipment comprises a processing table and a transfer seat installed on the processing table, wherein the transfer seat is provided with a brush placement position and a presser foot placement position, and the method specifically comprises: The spindle assembly moves to the brush placement position, and the clamping assembly clamps the brush placed on the brush placement position; Controlling the driving assembly to adopt a first output state, driving the brush clamped by the pressing assembly to press the sheet material placed on the processing table, and controlling the spindle assembly to perform milling processing on the sheet material; After completing the milling process of the sheet material, controlling the spindle assembly to move to the brush placement position to place the brush back to the brush placement position; The spindle assembly moves to the presser foot placement position on the intermediate transfer seat, and the clamping assembly clamps the presser foot placed on the presser foot placement position; The driving component is controlled to adopt a second output state, the presser foot clamped by the pressing component is driven to press the sheet placed on the processing table, and the spindle component is controlled to perform breakpoint processing on the sheet to obtain a PCB of a preset size.

9. The PCB processing method according to claim 8, characterized in that: The PCB processing equipment also includes a detection component, and the transfer seat is also provided with a detection position; After the spindle assembly moves to the brush placement position on the intermediate transfer seat, and the pressing assembly on the spindle assembly clamps the brush placed on the brush placement position, and before the step of controlling the driving assembly to adopt the first output state, the method further includes: The spindle assembly moves in a direction close to the detection position; The detection component is used to detect whether the pressing component clamps the brush and / or detect whether the brush meets the use requirements.

10. The PCB processing method according to claim 9, characterized in that: The detection assembly includes a sensor and a sensor sheet. A first position is preset in the PCB processing equipment. The spindle assembly can drive the clamping assembly to move to the first position. The step of detecting whether the pressing assembly holds the brush by the detection assembly specifically includes: driving the pressing assembly to move in a direction close to the first position; If the sensor senses the sensing sheet to trigger a sensing signal before the pressing assembly reaches the first position, it is determined that the pressing assembly clamps the brush; If the sensor does not sense the sensing sheet when the pressing assembly reaches the first position, it is determined that the pressing assembly does not clamp the brush.

11. The PCB processing method according to claim 9, characterized in that: The detection assembly includes a sensor and a sensor sheet. A second position is preset in the PCB processing equipment. The spindle assembly can drive the clamping assembly to move to the second position. The step of detecting whether the brush meets the use requirements specifically includes: driving the pressing assembly to move in a direction close to the second position; If the sensor senses the sensing sheet to trigger a sensing signal before the pressing assembly reaches the second position, it is determined that the brush meets the usage requirements; If the sensor does not sense the sensing sheet when the pressing assembly reaches the second position, it is determined that the brush does not meet the usage requirements.

12. The PCB processing method according to claim 11, characterized in that: The transfer seat is also provided with a discarded presser foot placement position; After the step of determining that the brush does not meet the use requirements, the method further includes: The spindle assembly is controlled to move to the discarded presser foot placement position, and the brush is placed at the discarded presser foot placement position.

13. The PCB processing method according to claim 8, characterized in that: The detection assembly includes a sensor and a sensor sheet. A third position is preset in the PCB processing equipment. The spindle assembly can drive the clamping assembly to move to the third position. After the step of clamping the presser foot placed on the presser foot placement position by the clamping assembly and before the step of controlling the driving assembly to adopt the second output state, the method further includes: driving the pressing assembly to move in a direction close to the third position; If the sensor senses the sensing sheet to trigger a sensing signal before the clamping assembly reaches the third position, it is determined that the clamping assembly clamps the presser foot; If the sensor does not sense the sensing sheet when the pressing assembly reaches the third position, it is determined that the pressing assembly does not clamp the presser foot.

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