Circuit board processing method and circuit board

Abstract

The invention provides a circuit board processing method and a circuit board. The circuit board processing method comprises the following steps: laminating a plurality of substrates to obtain a circuit board semi-finished product; performing copper plating treatment on the circuit board semi-finished product to form a copper-based body; performing nickel and gold electroplating treatment on the gold finger coverage area of the base copper body to form a gold finger; performing vacuum film pressing treatment on the circuit board semi-finished product; and carrying out exposure and development treatment on the circuit board semi-finished product after vacuum film pressing. According to the circuit board processing method, the electrical performance of the circuit board is relatively good.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a circuit board processing method and a circuit board. Background Art

[0002] A circuit board is an electrical component that achieves electrical connection between electronic components by patterning conductive copper foil on the surface of an insulating material. Circuit boards are widely used in consumer electronics, computers and communications, automobiles, medical equipment, aerospace, and industrial automation. Circuit boards are processed using circuit board processing methods.

[0003] The circuit board processing method of the related technology includes the following steps: S1, outer layer inspection: complete the circuit design of the conductor; S2, first external light imaging: cover the first dry film around the pattern of the conductor; S3, electroplating flash gold: electroplating nickel gold on the conductor; S4, alkaline etching: the first dry film is removed by alkaline solution; S5, second external light imaging: cover the second dry film on the conductor; S6, acid etching: etch away the gold-infiltrated part of the conductor together with the base copper, such as the Chinese patent No. CN202111006651.8.

[0004] However, first, the line design of the wire is completed so that a wire line is formed on the substrate. Then, a first dry film is covered around the wire so that the first dry film is attached to the board surface. Then, nickel gold is electroplated on the wire so that the gold finger is set at the edge of the board, and one end of the wire connected to the gold finger extends to the edge of the board, as shown in the attached figure of the specification. Figure 1 As shown, during the nickel-gold electroplating process, a gap exists between the first dry film and the board surface, so that the nickel-gold electroplating solution penetrates from the gap, so that the wire portion covered by the first dry film is also electroplated with nickel-gold to form a gold-infiltrated portion of the wire. Afterwards, the gold-infiltrated portion of the wire is etched away together with the base copper. However, since it is difficult to completely remove the gold-infiltrated portion of the wire with an acidic solution, it is difficult to completely remove the wire on the circuit board, resulting in poor electrical performance of the circuit board. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a circuit board processing method and a circuit board that improve the electrical performance of the circuit board.

[0006] The purpose of this disclosure is achieved through the following technical solutions:

[0007] A circuit board processing method, comprising:

[0008] Performing a pressing process on multiple substrates to obtain a semi-finished circuit board;

[0009] Performing copper plating on the semi-finished circuit board to form a base copper body;

[0010] Electroplating the gold finger covering area of ​​the base copper body with nickel and gold to form a gold finger;

[0011] Performing vacuum lamination treatment on the semi-finished circuit board product;

[0012] The semi-finished circuit board product after vacuum lamination is subjected to exposure and development treatment.

[0013] In one embodiment, the step of laminating a plurality of substrates to obtain a semi-finished circuit board includes: obtaining a copper-clad laminate and cutting the copper-clad laminate to obtain a plurality of substrates of predetermined sizes; performing wet film coating on each of the substrates; performing inner layer patterning on each of the substrates; and laminating a plurality of the substrates to obtain a semi-finished circuit board of predetermined sizes.

[0014] In one embodiment, the step of copper plating the semi-finished circuit board to form the base copper body includes: drilling the semi-finished circuit board; and copper plating the semi-finished circuit board to form the base copper body.

[0015] In one of the embodiments, a plurality of the gold fingers are formed on the semi-finished circuit board, and the plurality of the gold fingers are arranged at intervals.

[0016] In one of the embodiments, the gold finger covering area of ​​the base copper body is electroplated with nickel-gold, and the steps of forming the gold finger include: performing an outer lamination treatment on the surface of the circuit board semi-finished product on which the base copper body is formed; performing an outer layer exposure treatment on the circuit board semi-finished product after the outer lamination; performing an outer layer development treatment on the circuit board semi-finished product after the outer layer exposure to obtain an exposed area; wherein the gold finger covering area of ​​the base copper body is located in the exposed area; performing an nickel-gold electroplating treatment on the gold finger covering area of ​​the base copper body to form the gold finger.

[0017] In one of the embodiments, the step of performing vacuum lamination on the semi-finished circuit board product is specifically: performing vacuum lamination on the semi-finished circuit board product using a vacuum lamination device.

[0018] In one embodiment, the step of exposing and developing the semi-finished circuit board after vacuum lamination includes: exposing the semi-finished circuit board after vacuum lamination; and developing the semi-finished circuit board after exposure.

[0019] In one of the embodiments, after the step of performing exposure and development treatment on the semi-finished circuit board product after vacuum lamination, the circuit board processing method further comprises: performing solder mask treatment on the semi-finished circuit board product.

[0020] In one of the embodiments, after the step of performing solder mask treatment on the semi-finished circuit board, the circuit board processing method further comprises: performing gong plate treatment on the semi-finished circuit board.

[0021] A circuit board is manufactured by using the circuit board manufacturing method described in any one of the above embodiments.

[0022] Compared with the prior art, the present invention has at least the following advantages:

[0023] The circuit board processing method disclosed in the present invention firstly performs copper plating treatment on the semi-finished circuit board to form a base copper body, which is formed on one end of the board surface of the semi-finished circuit board. Then, the gold finger covering area of ​​the base copper body is electroplated with nickel and gold to form a gold finger, so that the gold finger is formed in the gold finger covering area, and the gold finger covering area is adjacent to the board edge of the semi-finished circuit board. Then, the semi-finished circuit board is vacuum pressed, so that the dry film covers the surface of the semi-finished circuit board formed with the base copper body, so that the dry film is respectively attached to the gold finger and the circuit forming area of ​​the semi-finished circuit board. Then, the semi-finished circuit board after vacuum pressing is exposed and developed, and the circuit pattern on the dry film is cured in the circuit forming area of ​​the base copper body through the exposure treatment to form a circuit dry film layer. At the same time, the dry film covering the gold finger is cured through the exposure treatment to form a gold finger dry film layer. Then, the uncured dry film is removed through the development treatment, leaving the circuit dry film layer and the gold finger dry film layer, so that an outer layer circuit pattern is formed on the semi-finished circuit board, and the outer layer circuit pattern is a wire circuit, so that a wire circuit is formed on the semi-finished circuit board.

[0024] Since the circuit board processing method first performs nickel-gold electroplating treatment and then performs outer layer circuit processing during the process of processing the circuit board, the outer layer circuit cannot form a gold-seeping part of the conductor, thereby avoiding the problem of the conductor part covered by the first dry film being electroplated with nickel-gold to form a gold-seeping part of the conductor in the prior art, that is, avoiding the problem of the conductor on the circuit board being difficult to remove cleanly in the prior art, thereby improving the electrical performance of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 This is a physical picture of a wire connected to one end of a gold finger extending to the edge of a board in the background technology;

[0027] Figure 2The figure is a flow chart of a circuit board processing method according to an embodiment. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] The present invention provides a circuit board processing method, comprising: laminating a plurality of substrates to obtain a semi-finished circuit board; copper-plating the semi-finished circuit board to form a base copper body; electroplating nickel-gold on a gold finger covering area of ​​the base copper body to form a gold finger; vacuum laminating the semi-finished circuit board; and exposing and developing the semi-finished circuit board after vacuum lamination.

[0032] The above-mentioned circuit board processing method firstly performs copper plating treatment on the semi-finished circuit board to form a base copper body, which is formed on one end of the board surface of the semi-finished circuit board. Then, the gold finger covering area of ​​the base copper body is electroplated with nickel and gold to form a gold finger, so that the gold finger is formed in the gold finger covering area, and the gold finger covering area is adjacent to the board edge of the semi-finished circuit board. Then, the semi-finished circuit board is vacuum pressed so that the dry film covers the surface of the semi-finished circuit board formed with the base copper body, so that the dry film is respectively attached to the gold finger and the circuit forming area of ​​the semi-finished circuit board. Then, the semi-finished circuit board after vacuum pressing is exposed and developed, and the circuit pattern on the dry film is cured in the circuit forming area of ​​the base copper body through the exposure treatment to form a circuit dry film layer. At the same time, the dry film covering the gold finger is cured through the exposure treatment to form a gold finger dry film layer. Then, the uncured dry film is removed through the development treatment, leaving the circuit dry film layer and the gold finger dry film layer, so that an outer layer circuit pattern is formed on the semi-finished circuit board, and the outer layer circuit pattern is a wire circuit, so that a wire circuit is formed on the semi-finished circuit board;

[0033] Since the circuit board processing method first performs nickel-gold electroplating treatment and then performs outer layer circuit processing during the process of processing the circuit board, the outer layer circuit cannot form a gold-seeping part of the conductor, thereby avoiding the problem of the conductor part covered by the first dry film being electroplated with nickel-gold to form a gold-seeping part of the conductor in the prior art, that is, avoiding the problem of the conductor on the circuit board being difficult to remove cleanly in the prior art, thereby improving the electrical performance of the circuit board.

[0034] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0035] like Figure 2 As shown, a circuit board processing method of an embodiment is used to process a circuit board. Further, the circuit board processing method includes part or all of the following steps:

[0036] S101, performing a pressing process on a plurality of substrates to obtain a semi-finished circuit board.

[0037] In this embodiment, a plurality of substrates are pressed together to connect the plurality of substrates to form inner layer circuits, thereby obtaining a semi-finished circuit board.

[0038] S103, copper plating the semi-finished circuit board to form a base copper body.

[0039] In this embodiment, the semi-finished circuit board is copper-plated to form a base copper body, which is formed on one end surface of the semi-finished circuit board; the base copper body includes an integrally formed gold finger covering area and a circuit forming area, so that the gold finger covering area is electrically connected to the circuit forming area.

[0040] S105, performing nickel-gold electroplating on the gold finger covering area of ​​the base copper body to form gold fingers.

[0041] Further, the gold finger covering area of ​​the base copper body is electroplated with nickel and gold to form a gold finger, so that the gold finger is formed in the gold finger covering area. In this embodiment, the gold finger covering area is adjacent to the board edge of the semi-finished circuit board. In other embodiments, the gold finger covering area may not be adjacent to the board edge of the semi-finished circuit board.

[0042] S107, performing vacuum lamination treatment on the semi-finished circuit board product.

[0043] In this embodiment, the semi-finished circuit board is subjected to vacuum lamination treatment so that the dry film covers the surface of the semi-finished circuit board with the base copper body formed thereon, so that the dry film is respectively attached to the gold finger and circuit forming area of ​​the semi-finished circuit board; the dry film is a photosensitive dry film.

[0044] S109, performing exposure and development processing on the semi-finished circuit board after vacuum lamination.

[0045] Furthermore, the semi-finished circuit board after vacuum lamination is exposed and developed, and the circuit pattern on the dry film is solidified in the circuit forming area of ​​the base copper body through the exposure process to form a circuit dry film layer. At the same time, the dry film covering the gold finger is solidified through the exposure process to form a gold finger dry film layer. Then, the uncured dry film is removed through the development process, leaving the circuit dry film layer and the gold finger dry film layer, so that an outer layer circuit pattern is formed on the semi-finished circuit board, and the outer layer circuit pattern is a wire circuit, so that a wire circuit is formed on the semi-finished circuit board. In this embodiment, the area of ​​the gold finger dry film layer is larger than the area of ​​the gold finger, that is, the gold finger dry film layer completely covers the gold finger, so that the gold finger dry film layer plays a better protective role on the gold finger. The circuit dry film layer is connected to the gold finger dry film layer.

[0046] The above-mentioned circuit board processing method firstly performs copper plating treatment on the semi-finished circuit board to form a base copper body, which is formed on one end of the board surface of the semi-finished circuit board. Then, the gold finger covering area of ​​the base copper body is electroplated with nickel and gold to form a gold finger, so that the gold finger is formed in the gold finger covering area, and the gold finger covering area is adjacent to the board edge of the semi-finished circuit board. Then, the semi-finished circuit board is vacuum pressed so that the dry film covers the surface of the semi-finished circuit board formed with the base copper body, so that the dry film is respectively attached to the gold finger and the circuit forming area of ​​the semi-finished circuit board. Then, the semi-finished circuit board after vacuum pressing is exposed and developed, and the circuit pattern on the dry film is cured in the circuit forming area of ​​the base copper body through the exposure treatment to form a circuit dry film layer. At the same time, the dry film covering the gold finger is cured through the exposure treatment to form a gold finger dry film layer. Then, the uncured dry film is removed through the development treatment, leaving the circuit dry film layer and the gold finger dry film layer, so that an outer layer circuit pattern is formed on the semi-finished circuit board, and the outer layer circuit pattern is a wire circuit, so that a wire circuit is formed on the semi-finished circuit board;

[0047] Since the circuit board processing method first performs nickel-gold electroplating treatment and then performs outer layer circuit processing during the process of processing the circuit board, the outer layer circuit cannot form a gold-seeping part of the conductor, thereby avoiding the problem of the conductor part covered by the first dry film being electroplated with nickel-gold to form a gold-seeping part of the conductor in the prior art, that is, avoiding the problem of the conductor on the circuit board being difficult to remove cleanly in the prior art, thereby improving the electrical performance of the circuit board.

[0048] In one embodiment, the step of laminating a plurality of substrates to obtain a semi-finished circuit board includes: obtaining a copper-clad laminate and cutting the copper-clad laminate to obtain a plurality of substrates of predetermined sizes, which is beneficial for subsequent processing of the substrates; performing a wet film coating process on each of the substrates to uniformly coat the wet film ink on each substrate to protect each substrate from chemical corrosion, wherein the thickness of the wet film ink is 10 μm-15 μm; performing an inner layer patterning process on each of the substrates, i.e., first performing an inner layer exposure process on each substrate, then performing an inner layer development process on each substrate to remove the unexposed ink portion of each substrate, then performing an inner layer etching process on each substrate to etch away the copper layer exposed to the outside, so that the desired inner layer circuit pattern is formed on each substrate, and then performing a dehumidifying film process on each substrate; laminating a plurality of the substrates so that the plurality of substrates are interconnected to form an inner layer circuit, thereby obtaining a semi-finished circuit board of predetermined sizes.

[0049] In one of the embodiments, the step of copper plating the semi-finished circuit board to form a base copper body includes: firstly drilling the semi-finished circuit board so that the semi-finished circuit board is formed with positioning holes and copper-plated holes to facilitate subsequent copper plating; then, copper plating the semi-finished circuit board so that a layer of copper foil is formed on the inner wall of the copper-plated hole to improve the conductive line of the copper-plated hole; and, a layer of copper foil is formed on one end surface of the semi-finished circuit board so that a base copper body is formed on one end surface of the semi-finished circuit board, thereby improving the electrical performance of the circuit board.

[0050] In one of the embodiments, a plurality of the gold fingers are formed on the semi-finished circuit board, and the plurality of the gold fingers are arranged at intervals, so that the electrical connection performance between the circuit board and the electronic components is better.

[0051] In one of the embodiments, the gold finger covering area of ​​the base copper body is subjected to nickel-gold electroplating treatment, and the steps of forming the gold finger include: firstly, the surface of the semi-finished circuit board formed with the base copper body is subjected to external lamination treatment, and the surface of the semi-finished circuit board formed with the base copper body is subjected to external lamination treatment with a dry film, so that the dry film is tightly attached to the surface of the base copper body; then, the semi-finished circuit board after the external lamination is subjected to external exposure treatment, and the area where nickel-gold electroplating is required is planned on the dry film by pattern transfer technology, that is, the dry film of the area where nickel-gold electroplating is required is not exposed, and the dry film of the remaining areas is not exposed. The film part is exposed to form an electroplated nickel-gold unexposed area, and the gold finger covering area is located below the electroplated nickel-gold unexposed area; then, the outer layer development treatment is performed on the semi-finished circuit board after the outer layer exposure to remove the unexposed dry film, so that the dry film in the electroplated nickel-gold unexposed area is removed to obtain an exposed area; wherein the gold finger covering area of ​​the base copper body is located in the exposed area; the gold finger covering area of ​​the base copper body is electroplated with nickel-gold to form the gold finger, so that the gold finger has better conductive performance; then, the exposed dry film is stripped to facilitate the subsequent vacuum lamination treatment.

[0052] In one embodiment, the step of performing vacuum lamination on the semi-finished circuit board product is specifically: performing vacuum lamination on the semi-finished circuit board product using a vacuum lamination device. In this embodiment, the vacuum lamination device is a vacuum laminator, which can effectively reduce the generation of bubbles and gaps between the surface of the base copper body and the dry film by performing vacuum lamination on the surface of the semi-finished circuit board product formed with the base copper body and the dry film in a vacuum environment, so that the connection between the dry film and the surface of the base copper body is better.

[0053] In one of the embodiments, the step of exposing and developing the semi-finished circuit board after vacuum lamination includes: firstly exposing the semi-finished circuit board after vacuum lamination, curing the circuit pattern on the dry film in the circuit forming area of ​​the base copper body through the exposure process to form a circuit dry film layer, and at the same time, curing the dry film covering the gold finger through the exposure process to form a gold finger dry film layer; then, developing the semi-finished circuit board after exposure, removing the uncured dry film through the development process, leaving the circuit dry film layer and the gold finger dry film layer, so that an outer layer circuit pattern is formed on the semi-finished circuit board, and the outer layer circuit pattern is a wire circuit, so that a wire circuit is formed on the semi-finished circuit board, so that the electrical performance of the circuit board is better.

[0054] In one of the embodiments, after the step of exposing and developing the semi-finished circuit board after vacuum lamination, the circuit board manufacturing method further includes: performing secondary copper plating on the semi-finished circuit board, the exposed part of the circuit forming area is the circuit dry film layer, and the unexposed part of the circuit forming area is the circuit base copper layer, that is, performing secondary copper plating on the circuit base copper layer in the circuit forming area to thicken the circuit base copper layer, so that a copper layer of a predetermined thickness is formed on the surface of the semi-finished circuit board, thereby making the circuit board have better corrosion resistance; performing tin plating on the semi-finished circuit board after the secondary copper plating, that is, performing tin plating on the circuit base copper layer, so that a layer of tin is plated on the surface of the circuit base copper layer, so that the tin layer covers the circuit base copper layer, so that the tin layer has a better protective effect on the circuit base copper layer.

[0055] In one of the embodiments, after the step of tinning the semi-finished circuit board after secondary copper plating, the circuit board processing method further includes: performing film stripping on the semi-finished circuit board, that is, removing the dry film on the circuit dry film layer, so that the copper layer of the circuit dry film layer is exposed, so as to facilitate subsequent alkaline etching treatment; performing alkaline etching on the semi-finished circuit board after film stripping, that is, performing alkaline etching on the copper layer of the circuit dry film layer, etching away the copper layer not at the bottom of the circuit to form the required outer layer circuit pattern, thereby improving the reliability of the circuit board; performing tin removal on the semi-finished circuit board after alkaline etching, that is, removing the tin layer on the surface of the circuit base copper layer, so that the circuit base copper layer is exposed, thereby improving the electrical performance of the circuit board.

[0056] In one embodiment, after the step of exposing and developing the semi-finished circuit board after vacuum lamination, the circuit board processing method further includes: performing solder mask treatment on the semi-finished circuit board. In this embodiment, after the step of detinning the semi-finished circuit board after alkaline etching, solder mask treatment is performed on the semi-finished circuit board using solder mask oil, and the solder mask oil is applied to the surface of the semi-finished circuit board to prevent the heat during welding from damaging the circuit on the circuit board, so that the circuit of the circuit board has better reliability in use.

[0057] In one embodiment, after the step of performing solder mask treatment on the semi-finished circuit board, the circuit board processing method further includes: performing gong plate treatment on the semi-finished circuit board. In this embodiment, a gong plate machine is used to perform gong plate treatment on the semi-finished circuit board to obtain the circuit board shape required by the customer, so that the production efficiency of the circuit board is higher.

[0058] Furthermore, in one of the embodiments, after the step of copper plating the semi-finished circuit board product to form a copper-based body, the circuit board processing method further includes: performing plasma surface treatment on the semi-finished circuit board product.

[0059] In this embodiment, the surface of the semi-finished circuit board that has been copper-plated is covered with a metal copper layer (i.e., a base copper body), and the semi-finished circuit board is subjected to plasma surface treatment. Plasma surface treatment is an electric shock treatment method. A large number of ions, excited molecules, free radicals and other active particles in the plasma will act on the surface of the metal copper layer, which can remove the original pollutants and impurities on the surface of the copper layer, and can destroy the original chemical bonds on the surface of the copper layer, making the surface of the copper layer rough, forming countless grooves and micropores, increasing the roughness coefficient of the surface of the copper layer, and improving the adhesion and wetting properties of the surface of the copper layer.

[0060] Furthermore, in one of the embodiments, before the step of performing plasma surface treatment on the semi-finished circuit board product, the circuit board processing method further includes: performing surface polishing treatment on the copper-plated surface of the semi-finished circuit board product.

[0061] It is understandable that plasma surface treatment can form countless micropores on the surface of the copper layer (i.e., the copper-plated surface), thereby improving the bonding ability between the copper layer surface and the photosensitive dry film. Before the copper layer surface is subjected to plasma treatment, there may be convex structures on the copper layer surface that are difficult to detect with the naked eye, or the copper layer surface may have a low flatness. After the copper layer surface with the above defects is subjected to plasma treatment, although it helps to improve the bonding ability between the copper layer surface and the photosensitive dry film, there will be uneven bonding ability between the copper layer surface and the photosensitive dry film. After the photosensitive dry film is formed, due to the uneven bonding force at various locations on the copper layer surface, it will easily lead to local force concentration and the photosensitive dry film will be separated from the copper layer surface. Therefore, in this embodiment, before the copper layer surface is subjected to plasma surface treatment, the copper layer surface is also polished. The polishing treatment can remove the protruding structures on the copper layer surface that are difficult to detect with the naked eye, and increase the flatness of the copper layer surface, thereby making the roughening degree of the copper layer surface after plasma more consistent, and the bonding ability of the copper layer surface with the photosensitive dry film is more uniform, thereby achieving the effect of improving the bonding strength.

[0062] Furthermore, in one of the embodiments, the step of surface grinding the copper-plated surface of the semi-finished circuit board includes: firstly performing a first surface grinding on the copper-plated surface of the semi-finished circuit board, and then performing a second surface grinding on the copper-plated surface of the semi-finished circuit board; wherein the roughness of the abrasive of the first surface grinding is greater than the roughness of the abrasive of the second surface grinding.

[0063] In order to achieve a better grinding effect on the copper-plated surface of the semi-finished circuit board, and further make the surface structure of the adhesive surface of the copper-plated surface of the semi-finished circuit board after plasma treatment more consistent, so that the bonding ability of the copper-plated surface of the semi-finished circuit board is stronger, in this embodiment, the grinding of the copper-plated surface of the semi-finished circuit board is divided into two times, the first surface grinding uses an abrasive with a higher roughness to grind the copper-plated surface of the semi-finished circuit board, and the second surface grinding uses an abrasive with a lower roughness to grind the copper-plated surface of the semi-finished circuit board. The copper-plated surface of the semi-finished circuit board is ground by an abrasive with a higher roughness in the first surface grinding, which helps to quickly grind and remove the larger protruding structure in the copper-plated surface of the semi-finished circuit board, so that the copper-plated surface of the semi-finished circuit board quickly reaches a relatively uniform and flat state, so as to increase the grinding efficiency; The copper-plated surface of the semi-finished circuit board is polished with an abrasive with a lower roughness in the second surface polishing. After the first surface polishing, the copper-plated surface of the semi-finished circuit board is in a relatively uniform and flat state. The second polishing can further polish the adhesive surface that has not been completely polished after the first surface polishing, so that the copper-plated surface of the semi-finished circuit board has better flatness. At the same time, since the second surface polishing is performed with an abrasive with a lower roughness, it helps to make the copper-plated surface of the semi-finished circuit board lower in roughness, that is, the surface flatness of the copper-plated surface of the semi-finished circuit board is more consistent at various locations. After plasma treatment, it helps to form uniform micropores at various locations on the adhesive surface, so that the bonding ability at various locations on the adhesive surface is more consistent, thereby preventing the local detachment of the dry film and the warping of the edge of the dry film caused by uneven bonding force at various locations on the adhesive surface.

[0064] Furthermore, after the step of performing a first surface polishing on the copper-plated surface of the semi-finished circuit board and before the step of performing a second surface polishing on the copper-plated surface of the semi-finished circuit board, the circuit board processing method further includes: flushing the semi-finished circuit board.

[0065] After the copper-plated surface of the semi-finished circuit board is polished for the first time, a lot of fine dust will be produced on the adhesive surface after polishing. During the second surface polishing, the fine dust will affect the contact between the abrasive and the copper-plated surface of the semi-finished circuit board, resulting in a decrease in the polishing effect. In this embodiment, after the first surface polishing, the semi-finished circuit board is rinsed to remove the fine dust on the adhesive surface, so that the surface structure of the adhesive surface is completely exposed to the external environment, and then during the second surface polishing, the abrasive can fully contact the adhesive surface, thereby further improving the polishing effect and reducing the surface roughness of the adhesive surface, making the bonding ability of various parts of the adhesive surface more consistent, thereby preventing the local detachment of the dry film and the curling of the edge of the dry film caused by uneven bonding force at various parts of the adhesive surface.

[0066] Furthermore, in one of the embodiments, after the step of performing gong processing on the semi-finished circuit board, the circuit board processing method further comprises:

[0067] Conduct electrical testing on semi-finished circuit boards;

[0068] Conduct quality inspection on semi-finished circuit boards after electrical testing;

[0069] The semi-finished circuit board products after quality inspection are packaged to obtain circuit boards.

[0070] Furthermore, the semi-finished circuit board is subjected to electrical testing.

[0071] In this embodiment, the semi-finished circuit board is subjected to electrical testing to detect the electrical performance of the semi-finished circuit board, so that the defective products of the semi-finished circuit board with poor electrical performance are screened out. If the result of the electrical testing of the semi-finished circuit board is unqualified, the semi-finished circuit board is classified as a defective product; if the result of the electrical testing of the semi-finished circuit board is qualified, the semi-finished circuit board is classified as a genuine product to ensure the electrical performance of the circuit board.

[0072] Furthermore, the semi-finished circuit board after the electrical test is subjected to quality inspection.

[0073] In this embodiment, the semi-finished circuit board products after the electrical test are subjected to quality inspection to check the quality of the semi-finished circuit board products, thereby screening out the semi-finished circuit board products with defects such as damage on the surface of the semi-finished circuit board products, thereby improving the qualified rate of the circuit boards.

[0074] Furthermore, in one of the embodiments, the step of performing gong processing on the semi-finished circuit board includes: firstly performing positioning processing on the semi-finished circuit board so that the semi-finished circuit board is stationary and fixed relative to the gong processing base; performing gong processing on the positioned semi-finished circuit board so as to process the outer shape gong grooves on the surface of the semi-finished circuit board so as to obtain the circuit board shape required by the customer.

[0075] Furthermore, in one of the embodiments, after the step of electroplating the base copper body with nickel-gold to form gold fingers, the circuit board processing method also includes: pasting a high-temperature resistant protective tape on the gold finger dry film layer so that the surface of the gold finger dry film layer is covered with the high-temperature resistant protective tape.

[0076] In this embodiment, the surface of the gold finger dry film layer is covered with a high temperature resistant protective tape, which is specifically a polyimide tape. The polyimide tape has excellent insulation, wear resistance, acid and alkali resistance, and can withstand high temperatures of 300 degrees / 10 minutes and can be used for a long time at 180 degrees. Since the high temperature resistant protective tape has good high temperature resistance, it can be firmly covered just above the gold finger dry film layer, so that the high temperature resistant protective tape can firmly fix the gold finger dry film layer just above the gold finger, thereby providing better protection for the gold finger.

[0077] Furthermore, in one of the embodiments, the area of ​​the high temperature resistant protective tape is larger than the area of ​​the gold finger dry film layer. In order to further increase the protective effect of the high temperature resistant protective tape on the gold finger, in this embodiment, the area of ​​the high temperature resistant protective tape is larger than the area of ​​the gold finger dry film layer, so that the high temperature resistant protective tape can fully cover the gold finger dry film layer, further making the surface of the gold finger dry film layer completely isolated from the outside world, thereby enhancing the protective effect of the gold finger dry film layer on the gold finger.

[0078] Furthermore, in one embodiment, after the step of performing plasma surface treatment on the semi-finished circuit board, the circuit board processing method further comprises:

[0079] Perform static elimination treatment on semi-finished circuit boards.

[0080] After the semi-finished circuit board is subjected to plasma surface treatment, static electricity will remain on the surface of the copper layer, and the static electricity on the surface of the copper layer will absorb dust and impurities in the surrounding environment. When the photosensitive dry film is pasted, dust and impurities will be mixed in the connection between the surface of the copper layer and the photosensitive dry film, resulting in a decrease in the bonding strength, and then causing the photosensitive dry film to fall off or warp. In this embodiment, after the step of performing plasma surface treatment on the semi-finished circuit board, the semi-finished circuit board is subjected to static electricity elimination treatment. Static electricity elimination can remove the static electricity generated by the plasma treatment, avoid static electricity from absorbing dust and impurities, improve the cleanliness of the bonding surface, and then improve the bonding strength, so that the copper layer surface and the photosensitive dry film are more stable after pasting.

[0081] Furthermore, in one embodiment, after the step of electroplating the base copper body with nickel and gold to form gold fingers and before the step of vacuum laminating the semi-finished circuit board, the circuit board processing method further includes:

[0082] The semi-finished circuit board is baked.

[0083] When a photosensitive dry film is pasted on the surface of a semi-finished circuit board, the moisture on the surface of the semi-finished circuit board will affect the bonding effect of the photosensitive dry film, resulting in a decrease in the bonding strength. In this embodiment, before the photosensitive dry film is pasted on the surface of the semi-finished circuit board, the surface of the semi-finished circuit board is baked. Baking can remove the moisture on the surface of the semi-finished circuit board, making the surface of the semi-finished circuit board drier. In this way, when the surface of the semi-finished circuit board is pasted with the photosensitive dry film, the contact between the microporous structure on the surface of the semi-finished circuit board and the photosensitive dry film will not be blocked by water molecules, so that the microporous structure and the photosensitive dry film are more tightly combined, thereby improving the bonding strength between the surface of the semi-finished circuit board and the photosensitive dry film.

[0084] The present disclosure also provides a circuit board, which is processed by the circuit board processing method of any of the above embodiments.

[0085] Compared with the prior art, the present invention has at least the following advantages:

[0086] The circuit board processing method disclosed in the present invention firstly performs copper plating treatment on the semi-finished circuit board to form a base copper body, which is formed on one end of the board surface of the semi-finished circuit board. Then, the gold finger covering area of ​​the base copper body is electroplated with nickel and gold to form a gold finger, so that the gold finger is formed in the gold finger covering area, and the gold finger covering area is adjacent to the board edge of the semi-finished circuit board. Then, the semi-finished circuit board is vacuum pressed, so that the dry film covers the surface of the semi-finished circuit board formed with the base copper body, so that the dry film is respectively attached to the gold finger and the circuit forming area of ​​the semi-finished circuit board. Then, the semi-finished circuit board after vacuum pressing is exposed and developed, and the circuit pattern on the dry film is cured in the circuit forming area of ​​the base copper body through the exposure treatment to form a circuit dry film layer. At the same time, the dry film covering the gold finger is cured through the exposure treatment to form a gold finger dry film layer. Then, the uncured dry film is removed through the development treatment, leaving the circuit dry film layer and the gold finger dry film layer, so that an outer layer circuit pattern is formed on the semi-finished circuit board, and the outer layer circuit pattern is a wire circuit, so that a wire circuit is formed on the semi-finished circuit board.

[0087] Since the circuit board processing method first performs nickel-gold electroplating treatment and then performs outer layer circuit processing during the process of processing the circuit board, the outer layer circuit cannot form a gold-seeping part of the conductor, thereby avoiding the problem of the conductor part covered by the first dry film being electroplated with nickel-gold to form a gold-seeping part of the conductor in the prior art, that is, avoiding the problem of the conductor on the circuit board being difficult to remove cleanly in the prior art, thereby improving the electrical performance of the circuit board.

[0088] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A circuit board processing method, characterized in that: include: Performing a pressing process on multiple substrates to obtain a semi-finished circuit board; Performing copper plating on the semi-finished circuit board to form a base copper body; Electroplating the gold finger covering area of ​​the base copper body with nickel and gold to form a gold finger; Performing vacuum lamination treatment on the semi-finished circuit board product; The semi-finished circuit board product after vacuum lamination is subjected to exposure and development treatment.

2. The circuit board processing method according to claim 1, characterized in that: The steps of laminating a plurality of substrates to obtain a semi-finished circuit board include: Obtaining a copper-clad laminate and cutting the copper-clad laminate to obtain a plurality of substrates of predetermined sizes; Performing a wet film coating process on each of the substrates; Performing inner layer pattern processing on each of the substrates; The plurality of substrates are pressed together to obtain the semi-finished circuit board of a predetermined size.

3. The circuit board processing method according to claim 1, characterized in that: The step of copper plating the semi-finished circuit board to form a base copper body comprises: Performing drilling processing on the semi-finished circuit board product; The semi-finished circuit board is subjected to copper plating to form the base copper body.

4. The circuit board processing method according to claim 3, characterized in that: A plurality of the gold fingers are formed on the semi-finished circuit board, and the plurality of the gold fingers are arranged at intervals.

5. The circuit board processing method according to claim 1, characterized in that: The steps of electroplating nickel and gold on the gold finger covering area of ​​the base copper body to form the gold finger include: Performing an outer lamination treatment on the surface of the semi-finished circuit board formed with the base copper body; Performing outer layer exposure treatment on the semi-finished circuit board product after the outer lamination film; Performing outer layer development treatment on the semi-finished circuit board after outer layer exposure to obtain a bare area; wherein the gold finger covering area of ​​the base copper body is located in the bare area; The gold finger covering area of ​​the base copper body is subjected to nickel-gold electroplating treatment to form the gold finger.

6. The circuit board processing method according to claim 1, characterized in that: The specific steps of vacuum lamination treatment of the semi-finished circuit board are as follows: A vacuum lamination device is used to perform vacuum lamination treatment on the semi-finished circuit board product.

7. The circuit board processing method according to claim 1, characterized in that: The step of performing exposure and development treatment on the semi-finished circuit board after vacuum lamination comprises: performing exposure processing on the semi-finished circuit board product after vacuum lamination; The exposed semi-finished circuit board is subjected to a development process.

8. The circuit board processing method according to claim 1, characterized in that: After the step of performing exposure and development treatment on the semi-finished circuit board product after vacuum lamination, the circuit board processing method further comprises: The semi-finished circuit board is subjected to solder resist treatment.

9. The circuit board processing method according to claim 8, characterized in that: After the step of performing solder mask treatment on the semi-finished circuit board, the circuit board processing method further comprises: The semi-finished circuit board is subjected to gong processing.

10. A circuit board, characterized in that: The circuit board is processed by the circuit board processing method according to any one of claims 1 to 9.

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