A chip packaging device for low inductance resistance components

Abstract

The present invention discloses a patch packaging device for low inductance resistance components, which relates to the field of electronic manufacturing technology, including an operating table and two first support plates arranged on the top outer wall of the operating table, and also includes: a patch mechanism: the patch mechanism is arranged on the outer walls of the two first support plates on the opposite side, and the outer walls of the two first support plates on the opposite side are each provided with a first slide groove, and two mounting components are arranged on the inner wall of the first slide groove; a mounting mechanism: the mounting mechanism is arranged on the top outer wall of the operating table; a first feeding mechanism: the first feeding mechanism is arranged on the top outer wall of the operating table. The patch packaging device for low inductance resistance components disclosed by the present invention has the effect of improving mounting efficiency and avoiding affecting subsequent packaging.

Description

Technical Field

[0001] The invention relates to the technical field of electronic manufacturing, and in particular to a patch packaging device for low inductance resistance components. Background Art

[0002] In the field of electronic manufacturing and packaging technology, surface mount packaging is an important packaging form. It forms a complete electronic circuit by directly mounting electronic components on a circuit board (such as a PCB) and achieving electrical connections through welding and other methods. This packaging method has the advantages of small size, light weight, high reliability, and easy automated production. Therefore, it has been widely used in modern electronic products.

[0003] The patent document with application number 202210401090.X discloses an automatic chip placement device for electronic components, including a support frame, a rotating shaft, a conveyor belt and a fixing groove. The chip placement mechanism used in the automatic chip placement device for electronic components designed by the present invention applies solder paste on the chip components, and then adjusts the position of the chip components to place the chip components on the circuit board.

[0004] However, traditional SMD packaging equipment for low inductance resistance components uses single-station mounting technology. When maintaining a single mounting component, it is usually necessary to stop the operation of the entire equipment, resulting in inefficient production interruptions and affecting subsequent packaging work.

[0005] For example, when a placement head fails or needs to be replaced, the entire production line must be paused to wait for technicians to troubleshoot and repair the problem. This not only means that ongoing production tasks will be forced to be interrupted, but may also cause a backlog of semi-finished products that have already been placed, as well as waiting and delays in subsequent packaging processes, further reducing the overall efficiency of the equipment. Summary of the invention

[0006] The invention discloses a patch packaging device for low inductance resistance components, aiming to solve the technical problem that when using single-station mounting technology, a single mounting component usually needs to stop the operation of the entire device during maintenance, resulting in low production interruption efficiency and affecting subsequent packaging work.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] A patch packaging device for low inductance resistance components, comprising an operating table and two first support plates arranged on the top outer wall of the operating table, and further comprising:

[0009] Patch mechanism: the patch mechanism is arranged on the outer wall of the two first support plates on one side opposite to each other, the outer wall of the two first support plates on one side opposite to each other is provided with a first slide groove, and the inner wall of the first slide groove is provided with two mounting components;

[0010] Installation mechanism: The installation mechanism is arranged on the top outer wall of the operating table;

[0011] First feeding mechanism: the first feeding mechanism is arranged on the top outer wall of the operating table;

[0012] Second feeding mechanism: the second feeding mechanism is arranged on the top outer wall of the operating table;

[0013] Feeding mechanism: The feeding mechanism is arranged on one side outer wall of the operating table. In this case, the design of the patch packaging equipment optimizes the component layout, and two mounting components are carried by using the slide grooves on the two first support plates, so that they can move flexibly and quickly along the slide grooves in alternating cooperation with each other, ensuring that the components can be accurately mounted to the designated position. This alternating working mode not only greatly improves the mounting speed, but also further optimizes the production process, making the entire patch packaging process smoother and more efficient.

[0014] 4. The repairing kit for automotive dents, according to claim 1, wherein a bottom of the foot stand comprises a through-hole, and the two foot pieces comprise two bosses, wherein the bosses comprise a through-hole, a screw bolt, and a nut. The bosses comprise a through-hole, a screw bolt, and a nut. The bosses comprise a through-hole, a screw bolt, and a nut.

[0015] Specifically, the mounting components adopt multiple structures, which operate in a unified and independent manner and can adapt to the mounting requirements of different sizes. When the distance between the adsorption components needs to be adjusted, the protrusion on the first assembly plate can slide in the third slide groove to drive the connecting rod on the inner wall of the adjustment gap to move. The connecting rod, as a transmission component, utilizes the principle of mechanical transmission to drive the connecting frame to move left and right, thereby adapting to the mounting requirements of different sizes and providing a finer adjustment range for the mounting components. This design enables the mounting components to adjust the position of components more accurately and improve the accuracy and efficiency of mounting.

[0016] In a preferred embodiment, the adsorption component includes a screw rod, two ends of the screw rod pass through the outer walls of both sides of the fixing frame, and a threaded groove and a straight groove are opened on the circumferential outer wall of the screw rod, and a ball nut and a spline nut are arranged on the circumferential outer wall of the screw rod, and the ball nut and the spline nut are respectively arranged on the inner wall of the opposite side of the fixing frame, and a transmission bar is arranged on the inner wall of the opposite side of the fixing frame through a rotating shaft, and the two transmission bars are respectively in contact with the ball nut and the spline nut, and an air pipe joint and a connecting seat are respectively arranged at both ends of the screw rod, and a suction nozzle assembly is arranged on the inner wall of the connecting seat, and a slot and a fixing groove are arranged on the outer wall of the suction nozzle assembly, and a card slot is opened on the circumferential inner wall of the connecting seat, and a steel ball is connected to the bottom inner wall of the card slot by a spring, and a convex strip is arranged on the inner wall of the connecting seat, and the thickness of the convex strip is adapted to the width of the fixing groove.

[0017] It should be noted that a visual positioning system is provided at the bottom of the adsorption component, through which the running trajectory of the adsorption component can be confirmed, providing convenience for mounting. The interior of the screw rod is a hollow structure, the air pipe joint is connected to an external air source, and the mechanical structure in the connecting seat can facilitate and quickly install or remove the nozzle assembly to meet the mounting requirements of different components and improve the versatility and flexibility of the equipment. The threaded grooves and straight grooves on the screw rod, as well as the ball nuts and spline nuts that match them, can accurately adjust the position of the adsorption component through the operation of the conveyor bar (rotate the ball nut, the screw rod rises and falls, rotate the spline nut and ball nut, the screw rod can rotate, only rotate the spline nut, the screw rod can spiral up or down). This design enables the equipment to quickly fine-tune the adsorption component according to the size and shape of the components and the specific requirements of the patch, thereby ensuring the accurate mounting of the components, improving the production efficiency of the equipment, and helping to reduce errors caused by position adjustment.

[0018] In a preferred scheme, the mounting mechanism includes two groups of third support plates, each group of the third support plates has two, two fixing rods are arranged on one outer wall of the third support plate, a plurality of second electric telescopic rods distributed at equal distances are arranged on the outer walls on the opposite sides of the two fixing rods, a clamping plate is arranged at the movable end of the second electric telescopic rod, and an assembly component is arranged at the middle position of each group of the third support plates, the assembly component includes a mounting frame, the mounting frame is arranged on the top outer wall of the operating table through a bearing, a support rod is arranged on the bottom outer wall of the mounting frame, two second slide grooves are provided on the top outer wall of the operating table, the support rod is slidably installed on the inner wall of the second slide groove, three groups of mounting grooves are provided on the top outer wall of the mounting frame, the number of each group of mounting grooves is six, and fixing pads and anti-collision rings are respectively provided on the bottom and top inner walls of the mounting grooves.

[0019] Specifically, the mounting mechanism is designed to be divided into two groups according to the mounting components, which can be used alternately to quickly replace the nozzle assemblies without affecting the normal operation of the equipment, further improving work efficiency. The mounting frame is in an "*"-shaped structure. When in use, the mounting frame rotates the unused mounting slot to the replacement area, and then the nozzle assembly to be replaced is moved to the inside of the unused mounting slot, and the nozzle assembly is clamped and disassembled using the splint. The mounting frame then rotates to send the mounting slot with other nozzle assemblies to the replacement area, and the adsorption assembly moves downward to dock and install with the nozzle assembly. This design can quickly replace nozzle assemblies of different specifications or types, increases the flexibility of the equipment, and shortens the time required to replace the nozzle assembly, thereby improving the work efficiency of the entire SMD packaging equipment.

[0020] In a preferred embodiment, the first feeding mechanism includes two third support frames, two placement grooves are provided on the top outer wall of the operating table, the third support frame is arranged on the bottom inner wall of the installation groove, a hopper is provided on the top outer wall of the third support frame, the inner wall on the opposite side of the third support frame is connected with the same material guide plate through a bearing, a placement plate is provided below the material guide plate, an assembly groove is provided on the bottom inner wall of the third support frame, a picking up plate is provided on the inner wall of the assembly groove, searchlights distributed equidistantly are provided on the bottom inner wall of the picking up plate, and a partition is provided on the inner wall of the picking up plate, and a vibrator and an elastic element are provided on the bottom inner wall of the assembly groove and the top outer wall of the placement plate.

[0021] Among them, the first feeding mechanism is mainly for more delicate components. Through the coordinated work of structures such as the hopper, guide plate and picking tray, the components can be accurately guided out of the hopper and placed on the partition. The partition is made of plexiglass and has good light transmittance. The partition is illuminated by searchlights evenly distributed on the bottom inner wall of the picking tray, which makes it more convenient for the equipment to accurately identify the position and state of the components during the feeding process, and facilitates the suction nozzle assembly to absorb them. Vibrators are provided on the bottom inner wall of the assembly groove and the top outer wall of the placement plate, which helps the smooth flow of components during the feeding process, so that they are evenly transported to the partition and can be spread out quickly and evenly to prevent components from getting stuck or piled up on the hopper or guide plate, thereby improving the accuracy and efficiency of the feeding process. This design not only ensures the stable feeding of components, but also improves the performance and reliability of the entire SMD packaging equipment.

[0022] As can be seen from the above, a patch packaging device for low inductance resistance components includes an operating table and two first support plates arranged on the top outer wall of the operating table, and also includes: a patch mechanism: the patch mechanism is arranged on the outer wall of the opposite side of the two first support plates, and the outer wall of the opposite side of the two first support plates is provided with a first slide groove, and the inner wall of the first slide groove is provided with two mounting components; a mounting mechanism: the mounting mechanism is arranged on the top outer wall of the operating table; a first feeding mechanism: the first feeding mechanism is arranged on the top outer wall of the operating table; a second feeding mechanism: the second feeding mechanism is arranged on the top outer wall of the operating table; a loading mechanism: the loading mechanism is arranged on one side outer wall of the operating table. The patch packaging device for low inductance resistance components provided by the present invention has the technical effect of improving mounting efficiency and avoiding affecting subsequent packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The present invention is a schematic diagram of the overall structure of a patch packaging device for low inductance resistance components.

[0024] Figure 2 The present invention provides a schematic diagram of a patch mechanism for a patch packaging device for low inductance resistance components.

[0025] Figure 3 The present invention provides a schematic diagram of the disassembly of a patch mechanism of a patch packaging device for low inductance resistance components.

[0026] Figure 4 The present invention provides a schematic diagram of the partial structure of a patch mechanism of a patch packaging device for low inductance resistance components.

[0027] Figure 5 For the present invention Figure 4 Enlarged structural diagram at A in the middle.

[0028] Figure 6 The present invention provides a schematic diagram of the internal structure of a connection socket for a patch packaging device for low inductance resistance components.

[0029] Figure 7 The present invention is a schematic diagram of an installation mechanism of a surface mount packaging device for low inductance resistance components.

[0030] Figure 8 This is a schematic diagram of a first feeding mechanism of a patch packaging device for low inductance resistance components proposed by the present invention.

[0031] Fig. 9 This is a schematic diagram of a second feeding mechanism of a patch packaging device for low inductance resistance components proposed by the present invention.

[0032] In the figure: 1, operating table; 2, first support plate; 3, first support frame; 4, first slide; 5, slider; 6, slide bar; 7, loading rack; 8, second support plate; 9, first electric telescopic rod; 10, conveyor belt; 11, operating panel; 12, second slide; 13, second support frame; 14, third support frame; 15, hopper; 16, assembly frame; 17, first assembly plate; 18, trachea joint; 19, screw rod; 20, mounting plate; 21, mounting cover; 22, third support plate; 23, mounting frame; 24, fixing plate; 25, baffle plate; 26, connecting plate; 27. Adjustment gap; 28. Connecting frame; 30. Ball nut; 31. Spline nut; 32. Connecting seat; 33. Suction nozzle assembly; 34. Fixing frame; 35. Connecting rod; 36. Slot; 37. Raised strip; 38. Steel ball; 39. Fixing rod; 40. Support rod; 41. Mounting groove; 42. Fixing pad; 43. Second electric telescopic rod; 44. Clamp; 45. Placement plate; 46. Guide plate; 47. Assembly groove; 48. Pick-up tray; 49. Searchlight; 50. Support seat; 51. Second assembly plate; 52. Pick-up hole; 53. Disc; 54. Limit plate. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] The present invention discloses a patch packaging device for low inductance resistance components, which is mainly used in scenarios where single-station mounting technology is adopted. When a single mounting component is maintained, it is usually necessary to stop the operation of the entire device, resulting in low production interruption efficiency and affecting subsequent packaging work.

[0035] Reference Figure 1 , Figure 2 and Figure 3 , a patch packaging device for low inductance resistance components, including an operating table 1 and two first support plates 2 arranged on the top outer wall of the operating table 1, and also includes: a patch mechanism: the patch mechanism is arranged on the outer walls of the two first support plates 2 on the opposite side, and the outer walls of the two first support plates 2 on the opposite side are each provided with a first slide groove 4, and two mounting components are arranged on the inner wall of the first slide groove 4; an installation mechanism: the installation mechanism is arranged on the top outer wall of the operating table 1; a first feeding mechanism: the first feeding mechanism is arranged on the top outer wall of the operating table 1; a second feeding mechanism: the second feeding mechanism is arranged on the top outer wall of the operating table 1; a loading mechanism: the loading mechanism is arranged on one side outer wall of the operating table 1.

[0036] In a specific embodiment, the design of the chip packaging equipment optimizes the component layout, and uses the slide grooves on the two first support plates 2 to carry two mounting components, so that they can move flexibly and quickly along the slide grooves in alternating cooperation with each other, ensuring that the components can be accurately mounted to the specified positions. This alternating working mode not only greatly improves the mounting speed, but also further optimizes the production process, making the entire chip packaging process smoother and more efficient.

[0037] For example: Even if one of the mounting components needs maintenance due to long-term use or unexpected failure, the other mounting component can still operate independently and continue to complete the mounting task, thereby ensuring the continuous operation of the production line. This design not only improves the reliability and stability of the equipment, but also greatly enhances the flexibility and fault tolerance of the production line, further improving the overall production efficiency and economic benefits.

[0038] Reference Figure 1 and Figure 3 In a preferred embodiment, the mounting assembly includes two sliders 5, a first assembly plate 17 and six connecting frames 28. A slide bar 6 is provided in the middle of the two sliders 5. An assembly frame 16 is provided on the outer wall of the slide bar 6. The inner wall of the opposite side of the assembly frame 16 is provided with the same fixing plate 24. An installation seam is provided on one side outer wall of the fixing plate 24. A connecting plate 26 is provided on the top outer wall of the assembly frame 16. A third sliding groove is provided on one side outer wall of the connecting plate 26. A The protrusion is slidably installed on the inner wall of the third slide groove. Two groups of adjustment slots 27 are opened on the outer wall of one side of the first assembly plate 17, and the number of each group of adjustment slots 27 is three. The connecting frame 28 is slidably installed on the inner wall of the installation slot. A fixing frame 34 is arranged at one end of the connecting frame 28. A connecting rod 35 is arranged at the middle position of the outer wall at the bottom of the fixing frame 34 and the outer wall on one side of the connecting frame 28. The end of the connecting rod 35 away from the fixing frame 34 is arranged on the inner wall of the adjustment slot 27, and an adsorption component is arranged on the inner wall on the opposite side of the fixing frame 34.

[0039] Specifically, the mounting components adopt multiple structures, which operate in a unified and independent manner and can adapt to the mounting requirements of different sizes. When the distance between the adsorption components needs to be adjusted, the protrusion on the first assembly plate 17 can slide in the third slide groove to drive the connecting rod 35 on the inner wall of the adjustment gap 27 to move. The connecting rod 35 is used as a transmission component and utilizes the principle of mechanical transmission to drive the connecting frame 28 to move left and right, thereby adapting to the mounting requirements of different sizes and providing a finer adjustment range for the mounting components. This design enables the mounting components to adjust the position of components more accurately and improve the accuracy and efficiency of mounting.

[0040] Reference Figure 3 , Figure 4 , Figure 5 and Figure 6 In a preferred embodiment, the adsorption assembly includes a screw rod 19, both ends of which penetrate the outer walls of both sides of the fixing frame 34, a threaded groove and a straight groove are provided on the circumferential outer wall of the screw rod 19, a ball nut 30 and a spline nut 31 are provided on the circumferential outer wall of the screw rod 19, and the ball nut 30 and the spline nut 31 are respectively arranged on the inner wall of the opposite side of the fixing frame 34, and a transmission bar is provided on the inner wall of the opposite side of the fixing frame 34 through a rotating shaft, and the two transmission bars are respectively arranged on the inner wall of the opposite side of the fixing frame 34. The two ends of the screw rod 19 are respectively provided with an air pipe joint 18 and a connecting seat 32, a nozzle assembly 33 is provided on the inner wall of the connecting seat 32, a slot 36 and a fixing groove are provided on the outer wall of the nozzle assembly 33, a card groove is provided on the circumferential inner wall of the connecting seat 32, a steel ball 38 is connected to the inner wall of the bottom of the card groove through a spring, and a convex strip 37 is provided on the inner wall of the connecting seat 32, and the thickness of the convex strip 37 is adapted to the width of the fixing groove.

[0041] It should be noted that a visual positioning system is provided at the bottom of the adsorption component, through which the running trajectory of the adsorption component can be confirmed, providing convenience for mounting. The interior of the screw rod 19 is a hollow structure, the air pipe joint 18 is connected to an external air source, and the mechanical structure in the connecting seat 32 can facilitate and quickly install or remove the suction nozzle assembly 33 to meet the mounting requirements of different components and improve the versatility and flexibility of the equipment. The threaded grooves and straight grooves on the screw rod 19, as well as the ball nut 30 and spline nut 31 matched therewith, can accurately adjust the position of the adsorption component through the operation of the conveyor bar (rotate the ball nut 30, the screw rod 19 rises and falls, rotate the spline nut 31 and the ball nut 30, the screw rod 19 can rotate, only rotate the spline nut 31, the screw rod 19 can spiral up or down). This design enables the equipment to quickly fine-tune the adsorption component according to the size and shape of the components and the specific requirements of the patch, thereby ensuring the accurate mounting of the components, improving the production efficiency of the equipment, and helping to reduce the errors caused by position adjustment.

[0042] Reference Figure 2 and Figure 7 In a preferred embodiment, the mounting mechanism includes two groups of third support plates 22, each group of third support plates 22 has two third support plates 22, two fixing rods 39 are arranged on one side outer wall of the third support plate 22, and a plurality of second electric telescopic rods 43 distributed at equal distances are arranged on the outer wall on the opposite side of the two fixing rods 39, a clamping plate 44 is arranged at the movable end of the second electric telescopic rod 43, and an assembly component is arranged in the middle position of each group of third support plates 22.

[0043] The assembly component includes a mounting frame 23, which is arranged on the top outer wall of the operating table 1 through a bearing, a support rod 40 is arranged on the bottom outer wall of the mounting frame 23, two second slide grooves 12 are opened on the top outer wall of the operating table 1, and the support rod 40 is slidably installed on the inner wall of the second slide groove 12, three groups of mounting grooves 41 are opened on the top outer wall of the mounting frame 23, and the number of each group of mounting grooves 41 is six, and a fixing pad 42 and an anti-collision ring are respectively arranged on the bottom and top inner walls of the mounting grooves 41.

[0044] Specifically, the mounting mechanism is designed into two groups in conjunction with the mounting components, which can be used alternately to quickly replace the suction nozzle assembly 33 without affecting the normal operation of the equipment, further improving work efficiency. The mounting frame 23 is in an "*"-shaped structure. When in use, the mounting frame 23 rotates to rotate the unused mounting slot 41 to the replacement area, and then the suction nozzle assembly 33 to be replaced is moved to the inside of the unused mounting slot 41, and the suction nozzle assembly 33 is clamped and disassembled using the clamping plate 44. The mounting frame 23 then rotates to send the mounting slot 41 with other suction nozzle assemblies 33 to the replacement area, and the adsorption assembly moves downward to dock and install with the suction nozzle assembly 33. This design can quickly replace suction nozzle assemblies 33 of different specifications or types, increases the flexibility of the equipment, and shortens the time required to replace the suction nozzle assembly 33, thereby improving the work efficiency of the entire patch packaging equipment.

[0045] Reference Figure 1 and Figure 8 In a preferred embodiment, the first feeding mechanism includes two third support frames 14, two placement grooves are provided on the top outer wall of the operating table 1, the third support frame 14 is arranged on the bottom inner wall of the installation groove 41, and a hopper 15 is provided on the top outer wall of the third support frame 14. The inner wall on the opposite side of the third support frame 14 is connected to the same material guide plate 46 through a bearing, and a placement plate 45 is provided below the material guide plate 46. An assembly groove 47 is provided on the bottom inner wall of the third support frame 14, and a picking plate 48 is provided on the inner wall of the assembly groove 47. The bottom inner wall of the picking plate 48 is provided with searchlights 49 distributed at equal distances, and a partition is provided on the inner wall of the picking plate 48. Vibrators and elastic elements are provided on the bottom inner wall of the assembly groove 47 and on the top outer wall of the placement plate 45.

[0046] Among them, the first feeding mechanism is mainly for relatively delicate components. Through the coordinated work of structures such as the hopper 15, the guide plate 46 and the picking tray 48, the components can be accurately guided out of the hopper 15 and placed on the partition. The partition is made of organic glass and has good light transmittance. The partition is illuminated by the searchlights 49 evenly distributed on the bottom inner wall of the picking tray 48, which makes it more convenient for the equipment to accurately identify the position and state of the components during the feeding process, and facilitates the suction nozzle assembly 33 to absorb them. Vibrators are provided on the bottom inner wall of the assembly groove 47 and the top outer wall of the placement plate 45, which helps the smooth flow of components during the feeding process, so that they are evenly transported to the partition and can be quickly and evenly spread out to prevent the components from getting stuck or piled up on the hopper 15 or the guide plate 46, thereby improving the accuracy and efficiency of the feeding process. This design not only ensures the stable feeding of components, but also improves the performance and reliability of the entire SMD packaging equipment.

[0047] Reference Figure 2 and Fig. 9 In a preferred embodiment, the second feeding mechanism includes a plurality of second support frames 13 distributed at equal distances, the second support frame 13 is arranged on the bottom inner wall of the placement groove, a support seat 50, a second assembly plate 51 and a disc 53 are arranged on one side outer wall of the second support frame 13, a fourth slide groove is arranged on the top outer wall of the support seat 50, a fifth slide groove is arranged on one side outer wall of the second assembly plate 51, a limiting plate 54 is arranged on the inner wall of the fourth slide groove, a limiting column is arranged on one side outer wall of the limiting plate 54, one end of the limiting column is inserted into one end of the fifth slide groove, three mounting plates 20 and three guide columns are arranged on one side outer wall of the second support frame 13, a mounting column is arranged on one side outer wall of the mounting plate 20, a connecting groove is opened on one side outer wall of the mounting column, a mounting cover 21 is arranged on the circumferential outer wall of the mounting column, a guide rod is arranged on the top outer wall of the second support frame 13, and a picking hole 52 is opened on the top outer wall of the second support frame 13.

[0048] The structural design of the second feeding mechanism can efficiently process and supply components of common sizes. The component rolls stored in the tape are installed on three mounting plates 20. The cooperation of the mounting plates 20 and the guide rods provides a clear path and direction for the transmission of the component rolls, which can achieve rapid feeding. The nozzle assembly 33 identifies the components in the picking hole 52 through the visual positioning system, can accurately pick up the components, and reduces the displacement and damage of the components during the picking process. Two structures are used for classified feeding, which helps to improve the overall efficiency and product quality of the SMD packaging equipment.

[0049] Reference Figure 1 and Figure 2In a preferred embodiment, the feeding mechanism includes a second support plate 8, a first support frame 3 and an operating panel 11, the first support frame 3 is arranged on one side outer wall of the operating platform 1, a first electric lifting rod is arranged on the bottom inner wall of the first support frame 3, a tray is arranged at the movable end of the first electric lifting rod, a feeding rack 7 is arranged on the top outer wall of the tray, a sixth slide groove is opened on the top outer wall of the second support plate 8, a first electric telescopic rod 9 is slidably installed on the inner wall of the sixth slide groove, a push rod is arranged at the movable end of the first electric telescopic rod 9, a strip groove is opened on the top outer wall of the operating platform 1, a conveyor belt 10 is arranged on the inner wall on the opposite side of the strip groove through a rotating shaft, a second electric lifting rod and a third electric lifting rod are arranged on the bottom inner wall of the strip groove, the operating panel 11 is arranged at the movable end of the second electric lifting rod, and a baffle 25 is arranged at the movable end of the third electric lifting rod.

[0050] The loading mechanism realizes automatic loading and conveying of circuit boards through the coordinated work of automated components such as the conveyor belt 10, the first electric lifting rod, the second electric lifting rod and the third electric lifting rod. Through precise automated loading and conveying, problems such as component damage or circuit board contamination caused by improper manual operation are avoided, thereby improving product quality and reliability and reducing the defective rate.

[0051] Working principle: When in use, the circuit board is supplied to the equipment through the feeding mechanism, and the circuit board is accurately positioned in the mounting area by the visual positioning system. The mounting mechanism adjusts the position of the patch component and the adsorption component according to the data, and uses the lateral position between the adsorption components in the mounting component to adjust the height and angle of the nozzle assembly 33 by using the ball nut 30 and the spline nut 31 in conjunction with the threaded groove and the straight groove on the screw rod 19. The nozzle assembly 33 moves to the picking area of ​​the first feeding mechanism or the second feeding mechanism, and uses negative pressure to suck up the components. The visual positioning system is used to take a photo of the components to ensure that their type, direction and other information are consistent with the mounting procedure. The nozzle assembly 33 moves the sucked components to the specified position of the circuit board, and fine-tunes the position as needed, and then uses a certain pressure to stick the components on the circuit board to complete the mounting action. The two patch components run simultaneously and are used alternately. When the nozzle attachment needs to be replaced, only one of the patch components needs to be moved to the top of the mounting mechanism, and then the nozzle attachment is moved to the inside of the mounting slot 41 for automatic replacement.

[0052] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A patch packaging device for low inductance resistance components, comprising an operating table (1) and two first support plates (2) arranged on the top outer wall of the operating table (1), characterized in that: Also includes: Patch mechanism: the patch mechanism is arranged on the outer wall of the two first support plates (2) on one side opposite to each other, the outer wall of the two first support plates (2) on one side opposite to each other is provided with a first slide groove (4), and the inner wall of the first slide groove (4) is provided with two mounting components; Mounting mechanism: the mounting mechanism is arranged on the top outer wall of the operating table (1); First feeding mechanism: the first feeding mechanism is arranged on the top outer wall of the operating table (1); Second feeding mechanism: the second feeding mechanism is arranged on the top outer wall of the operating table (1); Loading mechanism: The loading mechanism is arranged on an outer wall of one side of the operating table (1).

2. A chip packaging device for low inductance resistance components according to claim 1, characterized in that: The mounting assembly comprises two sliders (5), a first assembly plate (17) and six connecting frames (28), a slide bar (6) is arranged at the middle position of the two sliders (5), an assembly frame (16) is arranged on the outer wall of the slide bar (6), a same fixing plate (24) is arranged on the inner wall on the opposite side of the assembly frame (16), a mounting seam is provided on the outer wall on one side of the fixing plate (24), a connecting plate (26) is arranged on the top outer wall of the assembly frame (16), a third sliding groove is provided on the outer wall on one side of the connecting plate (26), a protrusion is arranged on the outer wall on one side of the first assembly plate (17), and the protrusion is slidably installed On the inner wall of the third slide groove, two groups of adjustment slots (27) are provided on the outer wall of one side of the first assembly plate (17), and the number of the adjustment slots (27) in each group is three. The connecting frame (28) is slidably mounted on the inner wall of the mounting slot, and a fixing frame (34) is provided at one end of the connecting frame (28). A connecting rod (35) is provided at a middle position between the bottom outer wall of the fixing frame (34) and the outer wall of one side of the connecting frame (28). The end of the connecting rod (35) away from the fixing frame (34) is provided on the inner wall of the adjustment slot (27), and an adsorption component is provided on the inner wall of the opposite side of the fixing frame (34).

3. A chip packaging device for low inductance resistance components according to claim 2, characterized in that: The adsorption component comprises a screw rod (19), the two ends of which penetrate through the outer walls of both sides of the fixing frame (34), the circumferential outer wall of the screw rod (19) is provided with a thread groove and a straight groove, the circumferential outer wall of the screw rod (19) is provided with a ball nut (30) and a spline nut (31), the ball nut (30) and the spline nut (31) are respectively arranged at positions on the inner wall of the opposite side of the fixing frame (34), and the inner wall of the opposite side of the fixing frame (34) is provided with a transmission bar through a rotating shaft, and the two transmission bars are respectively connected to the ball nut (3 0) is in contact with the spline nut (31), the two ends of the screw rod (19) are respectively provided with an air pipe joint (18) and a connecting seat (32), a suction nozzle assembly (33) is provided on the inner wall of the connecting seat (32), a slot (36) and a fixing slot are provided on the outer wall of the suction nozzle assembly (33), a clamping slot is provided on the circumferential inner wall of the connecting seat (32), a steel ball (38) is connected to the bottom inner wall of the clamping slot through a spring, and a convex strip (37) is provided on the inner wall of the connecting seat (32), and the thickness of the convex strip (37) is adapted to the width of the fixing slot.

4. A chip packaging device for low inductance resistance components according to claim 3, characterized in that: The mounting mechanism comprises two groups of third support plates (22), each group of the third support plates (22) comprises two third support plates (22), one side outer wall of the third support plates (22) is provided with two fixing rods (39), a plurality of second electric telescopic rods (43) distributed at equal distances are provided on the outer wall on the opposite side of the two fixing rods (39), a clamping plate (44) is provided at the movable end of the second electric telescopic rod (43), and an assembly component is provided at the middle position of each group of the third support plates (22).

5. A chip packaging device for low inductance resistance components according to claim 4, characterized in that: The assembly component comprises a mounting frame (23), the mounting frame (23) being arranged on the top outer wall of the operating table (1) via a bearing, a support rod (40) being arranged on the bottom outer wall of the mounting frame (23), two second slide grooves (12) being arranged on the top outer wall of the operating table (1), the support rod (40) being slidably mounted on the inner wall of the second slide groove (12), three groups of mounting grooves (41) being arranged on the top outer wall of the mounting frame (23), each group of mounting grooves (41) having six in number, and a fixing pad (42) and an anti-collision ring being arranged on the bottom and top inner walls of the mounting grooves (41) respectively.

6. A chip packaging device for low inductance resistance components according to claim 5, characterized in that: The first feeding mechanism comprises two third support frames (14), two placement grooves are provided on the top outer wall of the operating table (1), the third support frame (14) is arranged on the bottom inner wall of the installation groove (41), a hopper (15) is provided on the top outer wall of the third support frame (14), a same material guide plate (46) is connected to the inner wall on the opposite side of the third support frame (14) through a bearing, a placement plate (45) is provided below the material guide plate (46), an assembly groove (47) is provided on the bottom inner wall of the third support frame (14), a material picking plate (48) is provided on the inner wall of the assembly groove (47), searchlights (49) distributed at equal distances are provided on the bottom inner wall of the material picking plate (48), and a partition is provided on the inner wall of the material picking plate (48).

7. A chip packaging device for low inductance resistance components according to claim 6, characterized in that: A vibrator and an elastic element are arranged on the bottom inner wall of the assembly groove (47) and on the top outer wall of the placement plate (45).

8. The chip packaging equipment for low inductance resistance components according to claim 7, characterized in that: The second feeding mechanism comprises a plurality of second support frames (13) distributed at equal distances, wherein the second support frames (13) are arranged on the bottom inner wall of the placement groove, a support seat (50), a second assembly plate (51) and a disc (53) are arranged on one side outer wall of the second support frame (13), a fourth slide groove is arranged on the top outer wall of the support seat (50), a fifth slide groove is arranged on one side outer wall of the second assembly plate (51), a limiting plate (54) is arranged on the inner wall of the fourth slide groove, a limiting column is arranged on one side outer wall of the limiting plate (54), and one end of the limiting column is inserted into one end of the fifth slide groove.

9. A chip packaging device for low inductance resistance components according to claim 8, characterized in that: Three mounting plates (20) and three guide columns are arranged on one side outer wall of the second support frame (13); a mounting column is arranged on one side outer wall of the mounting plate (20); a connecting groove is provided on one side outer wall of the mounting column; a mounting cover (21) is arranged on the circumferential outer wall of the mounting column; a guide rod is arranged on the top outer wall of the second support frame (13); and a picking hole (52) is provided on the top outer wall of the second support frame (13).

10. The chip packaging equipment for low inductance resistance components according to claim 1, characterized in that: The feeding mechanism comprises a second supporting plate (8), a first supporting frame (3) and an operating panel (11), wherein the first supporting frame (3) is arranged on an outer wall of one side of the operating platform (1), a first electric lifting rod is arranged on the bottom inner wall of the first supporting frame (3), a tray is arranged on the movable end of the first electric lifting rod, a feeding rack (7) is arranged on the top outer wall of the tray, a sixth sliding groove is arranged on the top outer wall of the second supporting plate (8), a first electric telescopic rod (9) is slidably mounted on the inner wall of the sixth sliding groove, a push rod is arranged on the movable end of the first electric telescopic rod (9), a strip groove is arranged on the top outer wall of the operating platform (1), a conveyor belt (10) is arranged on the inner wall of the opposite side of the strip groove through a rotating shaft, a second electric lifting rod and a third electric lifting rod are arranged on the bottom inner wall of the strip groove, the operating panel (11) is arranged on the movable end of the second electric lifting rod, and a baffle (25) is arranged on the movable end of the third electric lifting rod.

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