Semiconductor temperature-controlled cleaning equipment

Abstract

The present invention provides a semiconductor temperature-controlled cleaning device, belonging to the technical field of semiconductor processing, which includes: a cleaning component and a lifting component. The cleaning component includes a cleaning tank, and a partition is fixedly connected to the inner wall of the cleaning tank. A rotating mechanism is provided in the middle of the partition. The lifting component is fixedly installed inside the cleaning component. A blowing component is rotatably connected to the inner wall of the cleaning tank, and a guiding component is fixedly installed inside the cleaning tank. Since a large number of particles, organic substances, etc. will adhere during the production process of semiconductor materials, subsequent cleaning is required. However, there may be problems with difficult cleaning of the adhered impurities, and the adhered substances cannot be completely removed. This application uses dry ice cleaning and gas blowing methods to solve the problem of difficult effective cleaning of the adhered substances, and can achieve non-contact cleaning. Temperature control is carried out according to the temperature change situation. The rotation of the heat insulation cover realizes the enclosure at the carrier rack, and the hot air blowing method is used to remove frost and impurities, reducing the temperature change range and improving the cleaning efficiency.

Description

Technical Field

[0001] The present invention relates to a semiconductor temperature-controlled cleaning device, belonging to the technical field of semiconductor processing. Background Art

[0002] A semiconductor is a substance with electrical conductivity between that of an insulator and a conductor. Its electrical conductivity is easily controlled and it can be used as a component material for information processing. From the perspective of technological or economic development, semiconductors are very important. The core units of many electronic products, such as computers, mobile phones, and digital recorders, utilize the change in the electrical conductivity of semiconductors to process information.

[0003] Due to its excellent properties, silicon carbide has become an important semiconductor material. It is a high-performance material component widely used in semiconductor manufacturing, optics, aerospace, etc. In the process of preparing silicon carbide, the vapor of gaseous precursors (such as methyltrichlorosilane MTS, polymethylsilane PMS, etc.) is usually introduced into a reaction chamber containing substrates such as graphite, and a chemical reaction occurs under gaseous conditions to generate SiC, which is deposited on the surface of the substrate to form the required SiC.

[0004] After the semiconductor material is made, since there are many particles, organic substances, etc. attached to its surface, dry ice cleaning is currently often used for treatment. However, in actual operation, continuous flushing with dry ice will cause low-temperature condensation, making frost cover impurities and resulting in a reduction in subsequent flushing efficiency. When continuously cleaning, it cannot be completely cleaned, and a temperature increase operation is required to melt the frost and then perform the cleaning operation. At this time, the temperature change during the cleaning process is large, affecting the cleaning effect, and it is difficult to perform efficient cleaning under a constant temperature. Moreover, the placement of semiconductor materials during cleaning is inconvenient, affecting the operation efficiency, and the temperature increase operation during continuous cleaning also affects the cleaning efficiency and reduces the processing quality of semiconductor materials, bringing an impact on the subsequent processing of semiconductor materials. Summary of the Invention

[0005] The present invention provides a semiconductor temperature-controlled cleaning device to solve the technical problems that it is not easy to control the temperature during semiconductor constant-temperature cleaning, and the cleaning effect is poor and the cleaning efficiency is low.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] The present invention provides a semiconductor temperature-controlled cleaning device, and the semiconductor temperature-controlled cleaning device includes:

[0008] A cleaning component, the cleaning component includes a cleaning box. A placement groove for placing semiconductor materials is provided inside the cleaning box. A partition is fixedly connected to the inner wall of the cleaning box at the bottom of the placement groove. A rotating mechanism is provided in the middle of the partition, and the semiconductor material is placed on the rotating mechanism through a bracket component;

[0009] Lifting assembly, the lifting assembly is fixedly installed inside the cleaning assembly. A blowing component is rotatably connected to the inner wall of the cleaning tank on one side of the lifting assembly, and a diversion component is fixedly installed inside the cleaning tank. The diversion component is communicated with the flushing component, and the flushing component is fixedly installed inside the cleaning tank.

[0010] In this technical solution, a top plate located inside the placement groove is fixedly installed on the top of the cleaning tank. The top plate is a square hollow structure. Exhaust ports are opened on both sides of the partition inside the cleaning tank, and guide blocks are fixedly connected to the middle of both ends of the partition. An inclined surface is opened on one side of the guide block close to the inner wall of the placement groove. A temperature sensor and a gasket are fixedly connected to the inner wall of the cleaning tank respectively.

[0011] In this technical solution, the rotating mechanism includes a rotating motor. The rotating motor is fixedly installed at the bottom of the partition. The output end of the rotating motor is fixedly connected to a turntable. The turntable is rotatably connected to the top of the partition. A plurality of evenly distributed positioning pins are fixedly connected to the edge of the turntable. A bracket assembly is provided on the surface of the turntable for placing a semiconductor material in a ring structure. The bracket assembly is composed of a carrier frame and a bracket. The carrier frame is attached to the surface of the turntable, and positioning holes corresponding to the distribution of the positioning pins are opened at the edge of the carrier frame. Symmetrically distributed hanging ears are fixedly connected to both sides of the carrier frame. A ring-shaped bracket is fixedly installed in the middle of the carrier frame between the hanging ears. The semiconductor material is attached to the top surface of the bracket. A plurality of evenly distributed limiting blocks are fixedly connected to the edge of the bracket. The limiting blocks are in contact with the edge of the semiconductor material.

[0012] In this technical solution, the lifting assembly includes an electric push rod. The electric push rod is fitted and installed inside the cleaning tank. The telescopic end of the electric push rod penetrates through the partition and is fixedly connected to a surrounding frame. The cross-section of the surrounding frame is a square hollow structure. The surrounding frame is located outside the carrier frame. The middle parts of both sides of the surrounding frame are fixedly connected to the top cover through vertical plates. The four corners of the surrounding frame and the vertical plates are fixedly connected to both ends of the vertical rod respectively. The vertical plates and the vertical rods are both located inside the top plate. The bottom edge of the top cover is fixedly connected to a sealing ring, and the sealing ring is attached to the surface of the top plate. An activity rod slides horizontally at the bottom of the vertical plate. The cross-section of the activity rod is a square hollow structure and is fitted and connected to the inside of the notches on both sides at the bottom of the vertical plate. One end of the activity rod is connected to the vertical plate through a spring, and the other end of the activity rod is correspondingly arranged above the guide block.

[0013] In this technical solution, the blowing component includes a driving motor, which is fitted and installed inside the cleaning tank. The output end of the driving motor is fixedly connected to a driving shaft, and the end of the driving shaft is fixedly connected to a round rod. A sleeve rod is rotatably sleeved on the surface of the round rod, and both ends of the sleeve rod are respectively fixedly connected to a gear and a heat insulation cover. The driving shaft is rotatably connected to the inside of a side plate, and the side plate is fixedly installed on the inner wall of the cleaning tank. A rack with an arc-shaped structure is fixedly connected to the side wall of the side plate. The center of the arc where the rack is located coincides with the axis of the driving shaft, and the rack and the gear are correspondingly distributed. A sealing gasket is provided above the side plate, and when the heat insulation cover rotates, the edge of the heat insulation cover fits on the surface of the sealing gasket.

[0014] In this technical solution, the heat insulation cover is a circular hollow structure. A heater is fixedly installed on the top of the heat insulation cover. The heater is fixedly connected to the inside of the heat insulation cover through a delivery pipe, and one end of the delivery pipe located inside the heat insulation cover is attached to the inner wall of the heat insulation cover. The heater is fixedly connected to an intake pipe, and the bottom of the heat insulation cover is fixedly connected to an exhaust pipe. Both the intake pipe and the exhaust pipe are L-shaped structures and are parallelly distributed. The heat insulation cover is attached and connected to the top surface of the carrier frame.

[0015] In this technical solution, the guiding component includes a surrounding ring, which is fixedly installed at the bottom of the cleaning tank. The surrounding ring is fixedly connected to the bottom of a partition plate. A channel for gas collection is formed between the surrounding ring and the cleaning tank, and the channel is located below the exhaust port. A cavity communicating with the outside is opened at the bottom of the cleaning tank, and the cavity is communicated with the channel. A box cover is hinged to the outer wall of the cleaning tank on one side of the cavity, and a filter screen is fixedly connected to the inner wall of the cleaning tank located inside the cavity.

[0016] In this technical solution, a dry ice particle storage tank is fixedly installed on the outer wall of the cleaning tank. The top of the dry ice particle storage tank is fixedly connected to a connecting pipe through a delivery pump. The connecting pipe penetrates the cleaning tank and is communicated with the flushing component. A pump body is fixedly installed on the outer wall of the cleaning tank above the connecting pipe. The pump body is fixedly connected to the flushing component through a branch pipe, and a control valve is fixedly connected to the end of the branch pipe.

[0017] In this technical solution, an air pump is fixedly installed inside the cleaning tank. The air pump is located inside the surrounding ring below the partition plate. An electric push rod and a rotating motor are also provided inside the surrounding ring. The partition plate is respectively penetrated and connected by a first fixed pipe and a second fixed pipe. The first fixed pipe and the second fixed pipe are respectively correspondingly distributed with the exhaust pipe and the intake pipe. The ends of the first fixed pipe, the second fixed pipe, the intake pipe and the exhaust pipe are all fixedly connected to a fitting block, and both the first fixed pipe and the second fixed pipe extend to the outside of the cleaning tank.

[0018] In the present technical solution, the flushing assembly includes a spray pipe, the spray pipe is fixedly installed on the inner wall of the cleaning tank, an impeller is rotatably connected inside the spray pipe, the impeller is rotatably connected to a bearing installed inside the spray pipe, and the end of the impeller is fixedly connected to a stirring rod. The end of the spray pipe is fixedly connected to a nozzle, and the nozzle is correspondingly arranged above the bracket assembly.

[0019] On the basis of conforming to the common knowledge in the art, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred examples of the present invention.

[0020] The positive and progressive effects of the present invention are as follows:

[0021] For the above-mentioned semiconductor temperature-controlled cleaning equipment, it uses a cleaning tank to perform constant-temperature cleaning operations on semiconductor materials, and uses dry ice cleaning and gas blowing methods to achieve non-contact cleaning. It can ensure the cleaning effect while avoiding the impact of the cleaning medium on semiconductor materials. At the same time, when using the flushing assembly to adjust the rate during dry ice flushing, temperature control can be carried out according to the temperature change situation, and the semiconductor material is rotated during cleaning to achieve a comprehensive cleaning function. After cleaning, the rotation of the heat insulation cover can be used to close the carrier rack, and the frost and impurities are removed by hot air blowing, while reducing the amplitude of temperature change, minimizing the temperature change in the cleaning tank as much as possible, and using the lifting assembly to lift the bracket assembly, which is convenient for taking and placing semiconductor materials during cleaning, improving the cleaning efficiency, and avoiding the impact of dry ice cleaning on the environment. Description of the Drawings

[0022] Figure 1 It is a schematic three-dimensional structure diagram of the whole of the present invention.

[0023] Figure 2 It is a schematic front view structure diagram inside the present invention.

[0024] Figure 3 It is a schematic three-dimensional structure diagram at the partition of the present invention.

[0025] Figure 4 It is a schematic side view structure diagram inside the present invention.

[0026] Figure 5 For the present invention Figure 4 The partial enlarged structure diagram at A.

[0027] Figure 6 It is a schematic three-dimensional structure diagram at the heat insulation cover of the present invention.

[0028] Figure 7 It is a schematic three-dimensional structure diagram at the bracket assembly of the present invention.

[0029] Figure 8 It is a schematic three-dimensional structure diagram at the lifting assembly of the present invention.

[0030] Figure 9 This is a schematic top view of the internal structure of the present invention.

[0031] Figure 10 This is a schematic front view of the internal structure at the flushing assembly of the present invention.

[0032] Explanation of reference numerals in the drawings:

[0033] In the drawings: 100, cleaning assembly; 101, cleaning tank; 102, placement groove; 103, top plate; 104, partition; 105, exhaust port; 106, rotating motor; 107, turntable; 108, positioning pin; 109, temperature sensor; 110, gasket; 111, guide block; 112, lid; 200, lifting assembly; 201, electric push rod; 202, enclosure; 203, vertical plate; 204, vertical rod; 205, top cover; 206, sealing ring; 207, movable rod; 208, spring; 300, bracket assembly; 301, carrier frame; 302, hanging ear; 303, bracket; 304, limiting block; 305, positioning hole; 400, blowing assembly; 401, driving motor; 402, driving shaft; 403, round rod; 404, sleeve rod; 405, heat shield; 406, gear; 407, side plate; 408, rack; 409, heater; 410, delivery pipe; 411, outlet pipe; 412, inlet pipe; 500, diversion assembly; 501, ring; 502, cavity; 503, dry ice pellet storage tank; 504, connecting pipe; 505, air pump; 506, first fixing pipe; 507, second fixing pipe; 508, fitting block; 600, flushing assembly; 601, spray pipe; 602, impeller; 603, bearing; 604, stirring rod; 605, nozzle; 606, pump body; 607, branch pipe; 608, control valve. Detailed implementation manners

[0034] The present invention will be further described below by way of examples, but the present invention is not limited to the scope of the described examples.

[0035] As Figures 1-10 shown, the semiconductor temperature-controlled cleaning equipment includes:

[0036] A cleaning assembly 100, the cleaning assembly 100 includes a cleaning tank 101, a placement groove 102 for placing semiconductor materials is formed inside the cleaning tank 101, a partition 104 is fixedly connected to the inner wall of the cleaning tank 101 at the bottom of the placement groove 102, a rotating mechanism is provided in the middle of the partition 104, and the semiconductor materials are placed on the rotating mechanism through a bracket assembly 300;

[0037] The lifting assembly 200 is fixedly installed inside the cleaning assembly 100. A blowing assembly 400 is rotatably connected to the inner wall of the cleaning tank 101 on one side of the lifting assembly 200. A guiding assembly 500 is fixedly installed inside the cleaning tank 101. The guiding assembly 500 is communicated with a flushing assembly 600, and the flushing assembly 600 is fixedly installed inside the cleaning tank 101.

[0038] As a preferred solution, the semiconductor material is placed on the bracket assembly 300 and above the cleaning assembly 100. The lifting assembly 200 can stably place the semiconductor material inside the cleaning tank 101, and the semiconductor material is evenly rotated by the rotating mechanism. The dry ice flushing and gas blowing methods are alternately carried out inside the cleaning tank 101. The blowing assembly 400 drives the heat insulation cover 405 to close the bracket assembly 300, which can reduce the temperature change range inside the cleaning tank 101 and facilitate the temperature control during subsequent dry ice cleaning. The gas after cleaning can carry impurities for collection and discharge, and the rapid cleaning operation of the semiconductor material can be realized.

[0039] A top plate 103 located inside the placement groove 102 is fixedly installed on the top of the cleaning tank 101. The top plate 103 is a square hollow structure. Exhaust ports 105 are opened on both sides of a partition plate 104 inside the cleaning tank 101. Guide blocks 111 are fixedly connected to the middle of both ends of the partition plate 104. An inclined surface is opened on one side of the guide block 111 close to the inner wall of the placement groove 102. Temperature sensors 109 and gaskets 110 are fixedly connected to the inner wall of the cleaning tank 101 respectively.

[0040] Adopting such a solution, the top plate 103 can cooperate with the lifting assembly 200 to close the top of the cleaning tank 101. When placing the semiconductor material, the bracket assembly 300 can be moved above the top plate 103 through the lifting assembly 200. At this time, the convenient placement of the semiconductor material can be achieved, and the lifting assembly 200 can be quickly separated through the guide blocks 111 on the partition plate 104, so that it corresponds to the rotating mechanism after placement and does not affect the normal operation of the subsequent rotating mechanism. The temperature inside the cleaning tank 101 is monitored by the temperature sensor 109.

[0041] The rotation mechanism includes a rotation motor 106 which is fixedly installed at the bottom of the partition plate 104. The output end of the rotation motor 106 is fixedly connected to a turntable 107. The turntable 107 is rotatably connected to the top of the partition plate 104. A plurality of uniformly distributed positioning pins 108 are fixedly connected to the edge of the turntable 107. A bracket assembly 300 is provided on the surface of the turntable 107 for placing a semiconductor material in an annular structure. The bracket assembly 300 is composed of a carrier frame 301 and a bracket 303. The carrier frame 301 is in close contact with the surface of the turntable 107. Positioning holes 305 corresponding to the distribution of the positioning pins 108 are formed in the edge of the carrier frame 301. Symmetrically distributed hanging ears 302 are fixedly connected to both sides of the carrier frame 301. An annular bracket 303 is fixedly installed in the middle of the carrier frame 301 between the hanging ears 302. The semiconductor material is in close contact with the top surface of the bracket 303. A plurality of uniformly distributed limiting blocks 304 are fixedly connected to the edge of the bracket 303. The limiting blocks 304 are in contact with the edge of the semiconductor material.

[0042] As a specific solution, when the lifting assembly 200 drives the bracket assembly 300 to move downward, the carrier frame 301 moves downward and the positioning holes 305 cooperate with the positioning pins 108 to stably place the carrier frame 301 on the surface of the turntable 107. At this time, the semiconductor material is supported by the bracket 303, and the limiting blocks 304 are used to limit the semiconductor material. After the bracket assembly 300 is placed by the lifting assembly 200, when the rotation motor 106 is started to drive the turntable 107 to rotate, the turntable 107 drives the semiconductor material on the bracket assembly 300 to slowly rotate and is comprehensively cleaned during the flushing by the flushing assembly 600.

[0043] The lifting assembly 200 includes an electric push rod 201 which is fitted and installed inside the cleaning box 101. The telescopic end of the electric push rod 201 penetrates through the partition plate 104 and is fixedly connected to a surrounding frame 202. The cross-section of the surrounding frame 202 is a square hollow structure. The surrounding frame 202 is located outside the carrier frame 301. The middle parts of both sides of the surrounding frame 202 are fixedly connected to a top cover 205 through vertical plates 203. The four corners of the surrounding frame 202 and the vertical plates 203 are respectively fixedly connected to both ends of vertical rods 204. The vertical plates 203 and the vertical rods 204 are both located inside the top plate 103. The bottom edge of the top cover 205 is fixedly connected to a sealing ring 206, and the sealing ring 206 is in close contact with the surface of the top plate 103. A movable rod 207 slides horizontally at the bottom of the vertical plate 203. The cross-section of the movable rod 207 is a square hollow structure and is fitted and connected to the inside of the notches on both sides at the bottom of the vertical plate 203. One end of the movable rod 207 is connected to the vertical plate 203 through a spring 208, and the other end of the movable rod 207 is correspondingly arranged above a guide block 111.

[0044] As a specific solution, when arranging semiconductor materials, start the electric push rod 201 to drive the surrounding frame 202 to rise. The surrounding frame 202 drives the vertical plate 203 and the vertical rod 204 to rise. When the surrounding frame 202 moves below the top plate 103, at this time, the bracket assembly 300 passes through the top plate 103 and moves to the outside of the cleaning tank 101. After placing the semiconductor materials, the electric push rod 201 resets the surrounding frame 202. At this time, the sealing ring 206 on the top cover 205 is driven to press tightly on the edge of the top plate 103, thereby realizing the sealing inside the cleaning tank 101; when the electric push rod 201 extends, the movable rod 207 moves on the inclined surface of the guide block 111. Through the elasticity of the spring 208, the movable rod 207 is pushed to move towards the side close to the bracket assembly 300. The movable rod 207 realizes its stable translation through the limit at the bottom of the vertical plate 203. When one end of the movable rod 207 moves below the hanging ear 302, the carrier frame 301 is lifted to the top plate 103. When the electric push rod 201 moves downward and the carrier frame 301 is placed on the turntable 107, the movable rod 207 moves to the guide block 111. When continuing to move downward, the movement of the movable rod is restricted by the inclined surface of the guide block 111 and makes it move to both sides, thereby separating from the bracket assembly 300, not affecting the rotation of the turntable 107 and the carrier frame 301, and at the same time, rapid picking and placing can be carried out.

[0045] The blowing component 400 includes a driving motor 401, the driving motor 401 is fitted and installed inside the cleaning tank 101, the output end of the driving motor 401 is fixedly connected with a driving shaft 402, the end of the driving shaft 402 is fixedly connected with a round rod 403, a sleeve rod 404 is rotatably sleeved on the surface of the round rod 403, both ends of the sleeve rod 404 are respectively fixedly connected with a gear 406 and a heat insulation cover 405, the driving shaft 402 is rotatably connected inside the side plate 407, the side plate 407 is fixedly installed on the inner wall of the cleaning tank 101, and a rack 408 with an arc-shaped structure is fixedly connected to the side wall of the side plate 407. The center of the arc where the rack 408 is located coincides with the axis of the driving shaft 402, and the rack 408 and the gear 406 are correspondingly distributed. A sealing gasket 110 is provided above the side plate 407, and when the heat insulation cover 405 rotates, the edge of the heat insulation cover 405 fits on the surface of the sealing gasket 110.

[0046] As a preferred solution, when the driving motor 401 operates, it drives the driving shaft 402 to rotate on the side plate 407, causing the driving shaft 402 to drive the round rod 403 and the sleeve rod 404 to rotate synchronously. Furthermore, it drives the heat shield 405 to rotate to one side of the placement groove 102, which can ensure the normal lifting of the lifting assembly 200 without interference. At this time, the heat shield 405, the intake pipe 412, and the exhaust pipe 411 are all in contact with the surface of the gasket 110, and the dry ice cleaning will not affect the blowing assembly 400. After the dry ice cleaning, when the driving shaft 402 drives the round rod 403 and the sleeve rod 404 to rotate, the gear 406 on the sleeve rod 404 contacts the rack 408 on the side plate 407. At this time, the gear 406 drives the sleeve rod 404 to rotate on the surface of the round rod 403. After the sleeve rod 404 drives the heat shield 405 to rotate, it fits on the surface of the carrier frame 301, covering the semiconductor material and the bracket 303 inside the heat shield 405. Then, heated gas is transported inside the heat shield 405 to melt the dry ice and blow out the impurities.

[0047] The heat shield 405 is a circular hollow structure. A heater 409 is fixedly installed at the top of the heat shield 405. The heater 409 is fixedly connected to the inside of the heat shield 405 through a delivery pipe 410, and one end of the delivery pipe 410 located inside the heat shield 405 is in contact with the inner wall of the heat shield 405. The heater 409 is fixedly connected to the intake pipe 412. The bottom of the heat shield 405 is fixedly connected to the exhaust pipe 411. Both the intake pipe 412 and the exhaust pipe 411 are L-shaped structures and are parallelly distributed. The heat shield 405 is in contact connection with the top surface of the carrier frame 301.

[0048] Furthermore, before the heat shield 405 fits on the carrier frame 301, the gear 406 is separated from the rack 408. At this time, the heat shield 405 smoothly covers the edge of the carrier frame 301. At this time, the rotating motor 106 stops working. When the heat shield 405 rotates, it drives the intake pipe 412 and the exhaust pipe 411 to correspond to the first fixed pipe 506 and the second fixed pipe 507. The seal at the connection is achieved by the extrusion of the fitting block 508. At this time, the air pump 505 is started to pump out the air inside it, so that the outside air is transported into the intake pipe 412 through the second fixed pipe 507, and after being heated by the heater 409, it is transported into the heat shield 405 through the delivery pipe 410. The delivery pipe 410 is arranged on the inner wall of the heat shield 405, so that a swirling heated gas is formed inside the heat shield 405 and is discharged through the exhaust pipe 411 and the first fixed pipe 506, realizing the circulation of hot air, melting the frost attached to the surface of the semiconductor material, and blowing out the impurities. When the temperature rises, the rotating motor 106 drives the heat shield 405 to fit on the surface of the gasket 110, and the cleaning operation is continued by the dry ice cleaning method, realizing the alternation of dry ice cleaning and hot air blowing and suction methods. At the same time, the heat shield 405 can isolate the heat, avoiding affecting the temperature in the placement groove 102 and reducing the temperature change range to facilitate subsequent temperature-controlled cleaning.

[0049] The flow guiding assembly 500 includes a surrounding ring 501. The surrounding ring 501 is fixedly installed at the bottom of the cleaning tank 101. The surrounding ring 501 is fixedly connected to the bottom of the partition plate 104. A channel for gas collection is formed between the surrounding ring 501 and the cleaning tank, and the channel is located below the exhaust port 105. A cavity 502 communicating with the outside is formed at the bottom of the cleaning tank 101. The cavity 502 communicates with the channel. A box cover 112 is hinged to the outer wall of the cleaning tank 101 on one side of the cavity 502, and a filter screen is fixedly connected to the inner wall of the cleaning tank 101 inside the cavity 502.

[0050] With such a solution, the surrounding ring 501 is used to isolate the channel from other electrical equipment, so that the carbon dioxide gas during dry ice cleaning enters the channel from the exhaust ports 105 on both sides of the partition plate 104, and is discharged after passing through the cavity 502. A filter screen is arranged inside the cavity 502 to filter impurities during cleaning, and the box cover 112 is arranged to facilitate subsequent opening for cleaning.

[0051] A dry ice particle storage tank 503 is fixedly installed on the outer wall of the cleaning tank 101. The top of the dry ice particle storage tank 503 is fixedly connected to a connecting pipe 504 through a delivery pump. The connecting pipe 504 penetrates the cleaning tank 101 and communicates with the flushing assembly 600. A pump body 606 is fixedly installed on the outer wall of the cleaning tank 101 above the connecting pipe 504. The pump body 606 is fixedly connected to the flushing assembly 600 through a branch pipe 607, and a control valve 608 is fixedly connected to the end of the branch pipe 607.

[0052] Specifically, during cleaning, when the delivery pump is started to convey dry ice particles through the connecting pipe 504 into the inside of the spray pipe 601 and ejected from the nozzle 605, they are mixed with high-pressure gas to discharge a dry ice particle and gas mixture, thereby quickly removing particulate matter and organic substances on the surface of the semiconductor material.

[0053] Inside the cleaning box 101, an air pump 505 is fixedly installed. The air pump 505 is located inside the enclosure 501 below the partition 104. An electric push rod 201 and a rotating motor 106 are also provided inside the enclosure 501. The partition 104 is respectively connected through the first fixed pipe 506 and the second fixed pipe 507. The first fixed pipe 506 and the second fixed pipe 507 are respectively distributed corresponding to the air outlet pipe 411 and the air inlet pipe 412. The ends of the first fixed pipe 506, the second fixed pipe 507, the air inlet pipe 412 and the air outlet pipe 411 are fixedly connected to the fitting block 508, and both the first fixed pipe 506 and the second fixed pipe 507 extend outside the cleaning box 101. By the operation of the air pump 505, outside air can enter the heat insulation cover 405 from the second fixed pipe 507, the air inlet pipe 412 and the delivery pipe 410. The heat insulation cover 405 is used for temperature isolation to avoid affecting the low-temperature environment in the placement groove 102, and the hot air heats the semiconductor material and then is discharged from the air outlet pipe 411 and the first fixed pipe 506.

[0054] The flushing assembly 600 includes a spray pipe 601. The spray pipe 601 is fixedly installed on the inner wall of the cleaning box 101. An impeller 602 is rotatably connected inside the spray pipe 601. The impeller 602 is rotatably connected to a bearing 603 installed inside the spray pipe 601, and the end of the impeller 602 is fixedly connected to a stirring rod 604. The end of the spray pipe 601 is fixedly connected to a nozzle 605, and the nozzle 605 is correspondingly arranged above the bracket assembly 300.

[0055] Further, when the dry ice particles and the high-pressure gas entering the inside of the spray pipe 601 are ejected from the nozzle 605, at this time the gas drives the impeller 602 to rotate, so that the impeller 602 drives the stirring rod 604 to rotate synchronously, and then further breaks the dry ice particles to make them finer and then ejects them. During the cleaning process, the pump body 606 works to transport the gas from the branch pipe 607 to the inside of the spray pipe 601, thereby adjusting the gas discharge rate inside the spray pipe 601 and changing the dry ice discharge amount within a corresponding time to perform temperature control, and being able to perform temperature control according to the cleaning situation to achieve the constant-temperature cleaning function.

[0056] The present invention is not limited to the above embodiments. No matter what changes are made in its shape or structure, they all fall within the protection scope of the present invention. The protection scope of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A semiconductor temperature control cleaning device, characterized in that: The semiconductor temperature control cleaning equipment comprises: A cleaning assembly (100), the cleaning assembly (100) comprising a cleaning box (101), the cleaning box (101) having a placement groove (102) for placing semiconductor materials therein, a partition (104) being fixedly connected to the inner wall of the cleaning box (101) at the bottom of the placement groove (102), a rotating mechanism being provided in the middle of the partition (104), and the semiconductor materials being placed on the rotating mechanism via a bracket assembly (300); A lifting component (200), the lifting component (200) being fixedly mounted inside the cleaning component (100), a blowing component (400) being rotatably connected to an inner wall of a cleaning box (101) located on one side of the lifting component (200), and a flow guide component (500) being fixedly mounted inside the cleaning box (101), the flow guide component (500) being connected to a flushing component (600), and the flushing component (600) being fixedly mounted inside the cleaning box (101); A top plate (103) located inside the placement groove (102) is fixedly installed on the top of the cleaning box (101); the top plate (103) is a square hollow structure; exhaust ports (105) are provided on both sides of a partition (104) located inside the cleaning box (101); guide blocks (111) are fixedly connected to the middle of both ends of the partition (104); a slope is provided on one side of the guide block (111) close to the inner wall of the placement groove (102); and a temperature sensor (109) and a sealing gasket (110) are fixedly connected to the inner wall of the cleaning box (101); The blow-off assembly (400) comprises a drive motor (401), the drive motor (401) is mounted in a chimney-type manner inside the cleaning box (101), the output end of the drive motor (401) is fixedly connected to a drive shaft (402), the end of the drive shaft (402) is fixedly connected to a round rod (403), a sleeve rod (404) is rotatably sleeved on the surface of the round rod (403), the two ends of the sleeve rod (404) are respectively fixedly connected to a gear (406) and a heat shield (405), the drive shaft (402) is fixedly connected to a side plate ( The side plate (407) is internally rotatably connected, the side plate (407) is fixedly mounted to the inner wall of the cleaning box (101), and the side wall of the side plate (407) is fixedly connected with a rack (408) with an arc structure, the center of the arc where the rack (408) is located coincides with the axis of the drive shaft (402), and the rack (408) and the gear (406) are distributed correspondingly, a sealing gasket (110) is provided above the side plate (407), and when the heat insulation cover (405) rotates, the edge of the heat insulation cover (405) fits with the surface of the sealing gasket (110).

2. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The rotating mechanism comprises a rotating motor (106), the rotating motor (106) being fixedly mounted to the bottom of the partition (104), the output end of the rotating motor (106) being fixedly connected to a turntable (107), the turntable (107) being rotatably connected to the top of the partition (104), and a plurality of evenly distributed positioning pins (108) being fixedly connected to the edge of the turntable (107), the surface of the turntable (107) being provided with a bracket assembly (300) for placing semiconductor materials in an annular structure, the bracket assembly (300) being composed of a carrier frame (301) and a bracket (303), the carrier The carrier frame (301) is fitted and connected to the surface of the rotating disk (107), and positioning holes (305) distributed corresponding to the positioning pins (108) are opened on the edge of the carrier frame (301), symmetrically distributed hanging ears (302) are fixedly connected to both sides of the carrier frame (301), and a bracket (303) with an annular structure is fixedly installed in the middle of the carrier frame (301) between the hanging ears (302), and the semiconductor material is fitted and connected to the top surface of the bracket (303), and a plurality of uniformly distributed limiting blocks (304) are fixedly connected to the edge of the bracket (303), and the limiting blocks (304) are in contact with the edge of the semiconductor material.

3. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The lifting assembly (200) comprises an electric push rod (201), the electric push rod (201) being embedded and installed inside the cleaning box (101), the telescopic end of the electric push rod (201) passing through the partition (104) and being fixedly connected to the surrounding frame (202), the cross section of the surrounding frame (202) being a square hollow structure, the surrounding frame (202) being located outside the carrier frame (301), the middle of both sides of the surrounding frame (202) being fixedly connected to the top cover (205) via the vertical plates (203), the surrounding corners of the surrounding frame (202) and the vertical plates (203) being fixedly connected to the two ends of the vertical rod (204), the vertical plates The top plate (203) and the vertical rod (204) are both located inside the top plate (103); the bottom edge of the top cover (205) is fixedly connected to the sealing ring (206), and the sealing ring (206) is connected to the surface of the top plate (103) in a fitting manner; a movable rod (207) is provided at the bottom of the vertical plate (203) for horizontal sliding; the movable rod (207) has a square hollow structure in cross section and is connected to the inside of the notches on both sides of the bottom of the vertical plate (203); one end of the movable rod (207) is connected to the vertical plate (203) via a spring (208), and the other end of the movable rod (207) is correspondingly arranged above the guide block (111).

4. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The heat insulation cover (405) is a circular hollow structure. A heater (409) is fixedly mounted on the top of the heat insulation cover (405). The heater (409) is fixedly connected to the inside of the heat insulation cover (405) via a delivery pipe (410). One end of the delivery pipe (410) located inside the heat insulation cover (405) is fitted to the inner wall of the heat insulation cover (405). The heater (409) is fixedly connected to an air inlet pipe (412). The bottom of the heat insulation cover (405) is fixedly connected to an air outlet pipe (411). Both the air inlet pipe (412) and the air outlet pipe (411) are L-shaped structures and are distributed in parallel. The heat insulation cover (405) is fitted to the top surface of the carrier frame (301).

5. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The flow guide assembly (500) comprises a ring (501), the ring (501) being fixedly mounted to the bottom of the cleaning box (101), the ring (501) being fixedly connected to the bottom of the partition (104), a channel for collecting gas being formed between the ring (501) and the cleaning tank, and the channel being located below the exhaust port (105), a cavity (502) being arranged at the bottom of the cleaning box (101) and being connected to the outside, the cavity (502) being connected to the channel, a box cover (112) being hingedly connected to the outer wall of the cleaning box (101) on one side of the cavity (502), and a filter screen being fixedly connected to the inner wall of the cleaning box (101) located inside the cavity (502).

6. The semiconductor temperature control cleaning equipment according to claim 5, characterized in that: A dry ice particle storage tank (503) is fixedly mounted on the outer wall of the cleaning box (101); the top of the dry ice particle storage tank (503) is fixedly connected to a connecting pipe (504) via a delivery pump; the connecting pipe (504) passes through the cleaning box (101) and is in communication with the flushing assembly (600); a pump body (606) is fixedly mounted on the outer wall of the cleaning box (101) above the connecting pipe (504); the pump body (606) is fixedly connected to the flushing assembly (600) via a branch pipe (607); and a control valve (608) is fixedly connected to the end of the branch pipe (607).

7. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: An air pump (505) is fixedly installed inside the cleaning box (101). The air pump (505) is located inside the enclosure (501) below the partition (104). An electric push rod (201) and a rotating motor (106) are also provided inside the enclosure (501). The partition (104) is connected to a first fixed pipe (506) and a second fixed pipe (507) through each other, respectively. The first fixed pipe (506) and the second fixed pipe (507) are respectively distributed corresponding to the air outlet pipe (411) and the air inlet pipe (412). The ends of the first fixed pipe (506), the second fixed pipe (507), the air inlet pipe (412) and the air outlet pipe (411) are fixedly connected to the fitting block (508), and the first fixed pipe (506) and the second fixed pipe (507) are both extended to the outside of the cleaning box (101).

8. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The flushing assembly (600) comprises a spray pipe (601), wherein the spray pipe (601) is fixedly mounted to the inner wall of the cleaning box (101), and an impeller (602) is rotatably connected inside the spray pipe (601), wherein the impeller (602) is rotatably connected to a bearing (603) mounted inside the spray pipe (601), and an end of the impeller (602) is fixedly connected to a stirring rod (604), and an end of the spray pipe (601) is fixedly connected to a nozzle (605), and the nozzle (605) is correspondingly arranged above the bracket assembly (300).

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