Femtosecond laser-based rotary cutting-ultra-high-speed combined machining device and method

Abstract

The invention provides a femtosecond-laser-based rotary cutting-ultra-high-speed combined machining device and method, and belongs to the technical field of femtosecond lasers, and the femtosecond-laser-based rotary cutting-ultra-high-speed combined machining device comprises an ultra-high-speed scanning assembly used for carrying out ultra-high-speed scanning machining on a workpiece; the rotary cutting assembly is used for carrying out rotary cutting machining on the workpiece; and the adjusting assembly is used for loading a workpiece which can be subjected to ultra-high-speed scanning machining and rotary cutting machining and can move relative to the ultra-high-speed scanning assembly and the rotary cutting assembly. The rotary cutting-ultra-high-speed combined machining device based on the femtosecond laser has the beneficial effects that ultra-high-speed scanning machining and rotary cutting machining are combined, the ultra-high-speed scanning machining taper is expected to be eliminated through rotary cutting machining, the side wall roughness is remarkably reduced, the bottom surface roughness is remarkably reduced through ultra-high-speed scanning machining, and the machining precision is improved. The machining efficiency of the high-energy high-frequency femtosecond laser is remarkably improved, and meanwhile the machining quality is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of femtosecond lasers, and relates to a femtosecond laser-based rotary cutting-ultra-high-speed composite processing device and method. Background Art

[0002] Femtosecond laser (pulse width is usually 10 -15 s level) with ultra-high peak energy (≥10 9 W), can induce nonlinear absorption effect in materials, obtain focal spot with size far smaller than diffraction limit, thus greatly improving spatial resolution of processing, and is widely used in micro-nano field, but the material removal rate of femtosecond laser processing is low, and processing efficiency is the bottleneck factor restricting engineering application of femtosecond laser processing. The use of high average power, high peak power and high repetition frequency femtosecond laser is expected to significantly improve material removal rate and realize efficient and precise cold processing of difficult-to-process materials. However, excessive laser energy density input and long-term irradiation of materials will lead to severe plasma shielding cloud, which will affect the material's continued absorption of material and material removal; in addition, the high temperature of plasma shielding cloud will cause heat accumulation and lead to uncontrollable thermal damage.

[0003] An ultra-high-speed scanning strategy is adopted, even if the laser irradiation area is switched at a speed of 200m / s-1000m / s, that is, the target is changed immediately after shooting, to prevent excessive heat accumulation in the local area, increase the rest time of the irradiated area, facilitate the dissipation of the plasma cloud, and avoid thermal damage caused by plasma accumulation. However, the structure and working principle of the polygonal prism scanning galvanometer determine that the polygonal prism scanning galvanometer can only scan line by line in a single direction, and the focus position of the light spot cannot be quickly adjusted in the Z-axis direction during the scanning process. Therefore, the polygonal prism scanning galvanometer is mainly used for two-dimensional plane feature processing. If the three-dimensional parts are processed by removing materials layer by layer, the surface quality of the junction of the edges of each layer (i.e., the side) is poor.

[0004] The use of high pulse energy and high power is expected to improve the material removal rate. During the laser peeling process, the laser beam is always in a high-speed spinning state, which can effectively avoid deformation caused by uneven laser energy distribution. The method of adjusting the tilt angle of the focused beam can achieve tilt focusing of the focused beam and ensure that the peripheral light of the beam is not blocked by the orifice, thereby fundamentally eliminating the processing taper. It has been widely used in aerospace, automobile, semiconductor, textile and other fields. However, due to the layer-by-layer scanning and filling, the peeling process has low processing efficiency, and when processing non-penetrating features, the bottom surface roughness is relatively large due to its own path planning.

[0005] In summary, the processing methods corresponding to these existing devices all have certain defects. For example, when laser rotary cutting processes non-penetrating features, the bottom surface roughness is large, the material removal rate is low, and the processing efficiency is low; the taper is difficult to eliminate in ultra-high-speed scanning processing, and the side wall processing quality is poor. Therefore, there is a lot of room for improvement. Summary of the invention

[0006] The purpose of the present invention is to address the above-mentioned problems existing in the prior art and to propose a femtosecond laser-based rotary cutting-ultra-high-speed composite processing device and method.

[0007] The purpose of the present invention can be achieved by the following technical solutions: A femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, comprising:

[0008] An ultra-high-speed scanning component, which is used to perform ultra-high-speed scanning processing on a workpiece;

[0009] A rotary cutting assembly, which is used to perform rotary cutting on a workpiece;

[0010] The adjusting component is used for loading a workpiece that can be processed by ultra-high-speed scanning and peeling and can move relative to the ultra-high-speed scanning component and the peeling component.

[0011] In the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the ultra-high-speed scanning component includes a high-power and high-frequency femtosecond laser, a first beam collimation module, a beam shaping module, an ultra-high-speed scanning galvanometer, a field mirror and a first Z-axis slide arranged in sequence, the high-power and high-frequency femtosecond laser is used to emit a first laser beam, the second beam collimation module is used to collimate, expand, switch, and adjust the first laser beam, the ultra-high-speed scanning galvanometer is used to move the first laser beam along the fast axis and the slow axis, the field mirror is used to focus the first laser beam, and the first Z-axis slide is used to drive the ultra-high-speed scanning galvanometer component and the field mirror to move in the vertical direction.

[0012] In the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the ultra-high-speed scanning galvanometer includes a polygonal prism, and the polygonal prism is used to rotate at an ultra-high speed to reflect the second laser beam to move along the fast axis direction.

[0013] In the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the rotary cutting component includes a high-power and high-energy femtosecond laser, a four-wedge prism rotation module, a second beam collimation module, a second beam focusing module, a nozzle and a second Z-axis slide which are arranged in sequence. The high-power and high-frequency femtosecond laser is used to emit a second laser beam, the four-wedge prism rotation module is used to rotate the second laser beam along the optical axis, the second beam collimation module is used to collimate, expand, switch and adjust the second laser beam, the second beam focusing module is used to focus the second laser beam, the nozzle is used to emit gas coaxial with the second laser beam, and the second Z-axis slide is used to drive the second beam collimation module, the second beam focusing module and the nozzle to move in the vertical direction.

[0014] In the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the adjustment component includes a rotating table, which is used to load workpieces that can be processed by the first laser beam and the second laser beam and can rotate relative to the high-power and high-energy femtosecond laser component and the high-power and high-frequency femtosecond laser component.

[0015] In the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the adjustment component also includes an X-axis slide, the rotating table is connected to the X-axis slide, and the X-axis slide can drive the rotating table to move along the X-axis.

[0016] In the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the adjustment component also includes a Y-axis slide, the X-axis slide is connected to the Y-axis slide, and the Y-axis slide can drive the X-axis slide to move along the Y-axis.

[0017] In the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the adjustment component is linked through the X-axis, Y-axis, first Z-axis, second Z-axis slide and rotating table.

[0018] A femtosecond laser-based rotary cutting-ultra-high-speed composite processing method is also provided, comprising the steps of:

[0019] S1: Use ultra-high-speed scanning components and adjustment components to coordinate the processing of the filling area to ensure the processing quality of the bottom surface of non-penetrating features or penetrating features;

[0020] S2: The rotary cutting component and the adjusting component are used to cooperate in processing the edge of the non-through feature or the through feature to ensure the processing quality of the side of the non-through feature or the through feature.

[0021] A femtosecond laser-based rotary cutting-ultra-high-speed composite processing method is also provided, comprising the steps of:

[0022] S1: Use the rotary cutting component and the adjustment component to cooperate in processing the edge of the non-penetrating feature to ensure the processing quality of the side of the non-penetrating feature;

[0023] S2: Ultra-high-speed scanning components and adjustment components are used to coordinate the processing of the filling area to ensure the processing quality of the bottom surface of non-penetrating features.

[0024] A femtosecond laser-based rotary cutting-ultra-high-speed composite processing method is also provided, comprising the steps of:

[0025] S1: Use the rotary cutting component and the adjustment component to process the edge of the through-feature to ensure the processing quality of the side of the non-through-feature.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The femtosecond laser-based rotary cutting-ultra-high-speed composite processing device combines ultra-high-speed scanning processing with rotary cutting, and is expected to eliminate the taper of ultra-high-speed scanning processing through rotary cutting, significantly reduce the side wall roughness, and significantly reduce the bottom surface roughness through ultra-high-speed scanning processing, significantly improve the processing efficiency of high-energy and high-frequency femtosecond lasers, and ensure the processing quality at the same time.

[0028] 2. First, ultra-high-speed scanning components and adjustment components are used to process the filling area, and then the rotary cutting components and adjustment components are used to process the edges of non-through features. This ensures that the workpiece has both the bottom surface processing quality formed by ultra-high-speed scanning processing and the side surface processing quality formed by rotary cutting processing, while also improving the processing efficiency.

[0029] 3. First, the edges of non-penetrating features are processed by using the rotary cutting component and the adjusting component, and then the filling area is processed by using the ultra-high-speed scanning component and the adjusting component, so that the workpiece has both the bottom surface processing quality formed by ultra-high-speed scanning processing and the side surface processing quality formed by rotary cutting processing, while also improving the processing efficiency.

[0030] 4. Directly use rotary cutting to process the edge of the through-feature, thereby improving the processing efficiency and ensuring the processing quality of the side of the non-through-feature.

[0031] 5. Before rotary cutting the edge of the through-type feature, the filling area is first processed by ultra-high-speed scanning to eliminate the possible influence of factors such as stress in the feature filling area on the through-type, thereby ensuring the processing quality of the side of the non-through-type feature and improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic structural diagram of the femtosecond laser-based rotary cutting-ultra-high-speed composite processing device of the present invention.

[0033] Figure 2 It is a schematic diagram of the principle of the processing method for non-penetrating features of the present invention.

[0034] Figure 3 It is a schematic diagram of the principle of the processing method for through-type features of the present invention.

[0035] In the figure, 1. high-power and high-frequency femtosecond laser; 2. first beam collimation module; 3. beam shaping module; 4. first movable reflector; 5. first reflector; 6. ultra-high-speed scanning galvanometer; 7. field mirror; 8. second reflector; 9. polygonal prism; 10. first Z-axis slide; 11. workpiece; 12. rotating table; 13. X-axis slide; 14. Y-axis slide; 15. high-power and high-energy femtosecond laser; 16. four-wedge prism rotation module; 17. second movable reflector; 18. second beam collimation module; 19. beam focusing module; 20. nozzle; 21. second Z-axis slide. DETAILED DESCRIPTION

[0036] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0037] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0038] In addition, in the present invention, descriptions such as "first", "second", "one", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0041] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0042] The invention is mainly used for processing heterogeneous ceramic-based composite materials, resin-based composite materials and metal-based composite materials; it is also suitable for processing homogeneous inorganic materials and organic materials.

[0043] like Figure 1 As shown, a femtosecond laser-based rotary cutting-ultra-high-speed composite processing device includes: an ultra-high-speed scanning component, a rotary cutting component and an adjustment component.

[0044] The ultra-high-speed scanning component is used to perform ultra-high-speed scanning processing on the workpiece 11 .

[0045] The rotary cutting assembly is used to perform rotary cutting on the workpiece 11 .

[0046] The adjusting component is used to load the workpiece 11 that can be processed by ultra-high-speed scanning and peeling, and can move relative to the ultra-high-speed scanning component and the peeling component.

[0047] In this embodiment, the femtosecond laser-based rotary cutting-ultra-high-speed composite processing device combines ultra-high-speed scanning processing with rotary cutting, and is expected to eliminate the taper of ultra-high-speed scanning processing through rotary cutting, significantly reduce the side wall roughness, and significantly reduce the bottom surface roughness through ultra-high-speed scanning processing, significantly improve the processing efficiency of high-energy and high-frequency femtosecond lasers, and at the same time ensure the processing quality.

[0048] like Figure 1 As shown, on the basis of the above-mentioned embodiment, the ultra-high-speed scanning component includes a high-power and high-frequency femtosecond laser 1, a first beam collimation module 2, a beam shaping module 3, an ultra-high-speed scanning galvanometer 6, a field lens 7 and a first Z-axis slide 10 which are arranged in sequence, the high-power and high-frequency femtosecond laser 1 is used to emit a first laser beam, the second beam collimation module 18 is used to collimate, expand, switch and adjust the first laser beam, the ultra-high-speed scanning galvanometer 6 is used to move the first laser beam along the fast axis and the slow axis, the field lens 7 is used to focus the first laser beam, and the first Z-axis slide 10 is used to drive the ultra-high-speed scanning galvanometer 6 component and the field lens 7 to move in the vertical direction.

[0049] Specifically, the high-power high-frequency femtosecond laser 1 is used to generate a first laser beam of high-frequency pulses with adjustable frequency and pulse width. The pulses should have a pulse train mode, and the number of sub-pulses in the pulse train, the sub-pulse interval time and the sub-pulse peak power are adjustable.

[0050] Specifically, the beam shaping module 3 converts Gaussian light into flat-top light, so that the light spot energy is uniform.

[0051] Specifically, the first Z-axis slide 10 is used to drive the ultra-high-speed scanning galvanometer 6 and the field lens 7 to move up and down to keep the processed surface at the laser focus position.

[0052] Specifically, it also includes a first movable reflector 4 , which is located between the beam shaping module 3 and the ultra-high-speed scanning galvanometer 6 , and is used to adjust and reflect the first laser beam passing through the beam shaping module 3 to the ultra-high-speed scanning galvanometer 6 .

[0053] Specifically, the ultra-high-speed scanning galvanometer 6 includes a polygonal prism 9, and the polygonal prism 9 is used to rotate at an ultra-high speed so as to reflect the second laser beam to move along the fast axis direction.

[0054] More specifically, the ultra-high-speed scanning galvanometer 6 also includes a first reflector 5 and a second reflector 8. The first reflector 5 is located between the first movable reflector 4 and the polygonal prism 9, and is used to reflect the first laser beam reflected by the first movable reflector 4 to the polygonal prism 9. The second reflector 8 is located between the polygonal prism 9 and the field lens 7, and is used to reflect the first laser beam reflected by the polygonal prism 9 to the field lens 7.

[0055] It is worth noting here that the high-power and high-frequency femtosecond laser 1 is used to increase the material removal rate while reducing heat accumulation, and cannot be replaced by other lasers.

[0056] It is also worth noting here that the ultra-high-speed scanning galvanometer 6 is used to increase the material removal rate and reduce heat accumulation, and cannot be replaced by other galvanometers.

[0057] In this embodiment, a high-power and high-frequency femtosecond laser 1 emits a first laser beam, which passes through a first beam collimation module 2 and a beam shaping module 3 in sequence, and then is reflected by a first movable reflector 4, a first reflector 5, a polygonal prism 9 and a second reflector 8 in sequence, and is emitted through a field lens 7.

[0058] like Figure 1As shown, on the basis of the above-mentioned embodiment, in the above-mentioned femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, the rotary cutting component includes a high-power and high-energy femtosecond laser 15, a four-wedge prism rotation module 16, a second beam collimation module 18, a second beam focusing module 19, a nozzle 20 and a second Z-axis slide 21 which are arranged in sequence, the high-power and high-frequency femtosecond laser 1 is used to emit a second laser beam, the four-wedge prism rotation module 16 is used to rotate the second laser beam along the optical axis, the second beam collimation module 18 is used to collimate, expand, switch, and adjust the second laser beam, the second beam focusing module 19 is used to focus the second laser beam, the nozzle 20 is used to emit gas coaxial with the second laser beam, and the second Z-axis slide 21 is used to drive the second beam collimation module 18, the second beam focusing module 19 and the nozzle 20 to move in the vertical direction.

[0059] Specifically, the high-power and high-energy femtosecond laser 15 is used to generate a second laser beam of high-pulse energy and high-power femtosecond pulses.

[0060] Specifically, the four-wedge prism rotation module 16 is used to realize spiral line scanning by utilizing high-speed rotation and refraction and deflection of optical devices, and realizes the rotation of the light beam along the optical axis in combination with the four-wedge prism.

[0061] Specifically, it also includes a second movable reflector 17 . The first movable reflector 4 is located between the four-wedge prism rotation module 16 and the second beam collimation module 18 . The first movable reflector 4 is used to adjust and reflect the second laser beam passing through the four-wedge prism rotation module 16 to the second beam collimation module 18 .

[0062] Specifically, the first Z-axis slide 10 is used to drive the second beam collimating module 18, the second beam focusing module 19 and the nozzle 20 to move up and down to keep the processed surface at the laser focus position.

[0063] It is worth noting here that the high-power and high-energy femtosecond laser 15 is used to improve the material removal rate and cannot be replaced by other lasers.

[0064] It is also worth noting here that the four-wedge prism rotation module 16 is used to eliminate taper and improve the side wall processing quality, and cannot be replaced by other processing devices.

[0065] In this embodiment, the high power and high energy femtosecond laser 15 emits a second laser beam, which passes through the four-wedge prism rotating module 16, is reflected by the second movable reflector 17, and is provided to the second beam collimating module 18, the second beam focusing module 19 and the nozzle 20 for emission.

[0066] like Figure 1As shown, based on the above embodiment, the adjustment component includes a rotating table 12, which is used to load a workpiece 11 that can be processed by the first laser beam and the second laser beam and can rotate relative to the high-power high-energy femtosecond laser component and the high-power high-frequency femtosecond laser component.

[0067] In this embodiment, the rotating table 12 is used to load the workpiece 11 that can be processed by the first laser beam and the second laser beam and can rotate relative to the high-power high-energy femtosecond laser component and the high-power high-frequency femtosecond laser component to switch the processing angle of the workpiece 11.

[0068] like Figure 1 As shown, based on the above embodiment, the adjustment component further includes an X-axis slide 13, the rotating table 12 is connected to the X-axis slide 13, and the X-axis slide 13 can drive the rotating table 12 to move along the X-axis.

[0069] In this embodiment, the X-axis slide 13 can drive the rotating table 12 to move along the X-axis direction, thereby driving the workpiece 11 to move along the X-axis direction to switch the position to be processed of the workpiece 11 .

[0070] like Figure 1 As shown, based on the above embodiment, the adjustment component also includes a Y-axis slide 14, the X-axis slide 13 is connected to the Y-axis slide 14, and the Y-axis slide 14 can drive the X-axis slide 13 to move along the Y-axis.

[0071] In this embodiment, the Y-axis slide 14 can drive the X-axis slide 13 to move along the Y-axis direction, thereby driving the workpiece 11 to move along the Y-axis direction to switch the position to be processed of the workpiece 11 .

[0072] like Figure 1 , Figure 2 As shown, a femtosecond laser-based rotary cutting-ultra-high-speed composite processing method for non-penetrating features includes embodiment 1 and embodiment 2.

[0073] Embodiment 1 includes the steps of:

[0074] S1: Ultra-high-speed scanning components and adjustment components are used to coordinate the processing and filling area to ensure the processing quality of the bottom surface of non-penetrating features;

[0075] S2: The peeling assembly and the adjusting assembly are used to process the edge of the non-penetrating feature to ensure the processing quality of the side of the non-penetrating feature.

[0076] In this embodiment, an ultra-high-speed scanning component and an adjusting component are first used in combination to process the filling area, and then a rotary cutting component and an adjusting component are used in combination to process the edge of the non-through feature, so that the workpiece 11 has both the bottom surface processing quality formed by ultra-high-speed scanning processing and the side surface processing quality formed by rotary cutting processing, while also improving the processing efficiency.

[0077] Embodiment 2 includes the steps of:

[0078] S1: Use the rotary cutting component and the adjustment component to cooperate in processing the edge of the non-penetrating feature to ensure the processing quality of the side of the non-penetrating feature;

[0079] S2: Ultra-high-speed scanning components and adjustment components are used to coordinate the processing of the filling area to ensure the processing quality of the bottom surface of non-penetrating features.

[0080] In this embodiment, a rotary cutting component and an adjusting component are first used in combination to process the edge of a non-through feature, and then an ultra-high-speed scanning component and an adjusting component are used in combination to process the filling area, so that the workpiece 11 has both the bottom surface processing quality formed by ultra-high-speed scanning processing and the side surface processing quality formed by rotary cutting processing, while also improving the processing efficiency.

[0081] like Figure 1 , Figure 3 As shown, a femtosecond laser-based rotary cutting-ultra-high-speed composite processing method for through-type features includes embodiment three and embodiment four.

[0082] Embodiment 3 comprises the steps of:

[0083] A femtosecond laser-based rotary cutting-ultra-high-speed composite processing method is also provided, comprising the steps of:

[0084] S1: Use the rotary cutting component and the adjustment component to process the edge of the through-feature to ensure the processing quality of the side of the non-through-feature.

[0085] In this embodiment, the edge of the through-feature is directly processed by rotary cutting, thereby improving the processing efficiency and ensuring the processing quality of the side of the non-through-feature.

[0086] Embodiment 4 comprises the steps of:

[0087] S1: Ultra-high-speed scanning components and adjustment components are used to coordinate the processing and filling area to ensure the processing quality of the bottom surface of the through-type feature;

[0088] S2: The rotary cutting component and the adjusting component are used to cooperate in processing the edge of the through-type feature to ensure the processing quality of the side of the through-type feature.

[0089] In this embodiment, before rotary cutting the edge of the through-type feature, the filling area is first processed by ultra-high-speed scanning, so as to eliminate the influence of factors such as stress in the feature filling area on the through-type, thereby ensuring the processing quality of the side of the non-through-type feature and improving the processing efficiency.

Claims

1. A femtosecond laser-based rotary cutting-ultra-high-speed composite processing device, characterized in that: include: An ultra-high-speed scanning component, which is used to perform ultra-high-speed scanning processing on a workpiece; A rotary cutting assembly, which is used to perform rotary cutting on a workpiece; The adjusting component is used for loading a workpiece that can be processed by ultra-high-speed scanning and peeling and can move relative to the ultra-high-speed scanning component and the peeling component.

2. The femtosecond laser-based rotary cutting-ultra-high-speed composite processing device according to claim 1, characterized in that: The ultra-high-speed scanning assembly includes a high-power and high-frequency femtosecond laser, a first beam collimation module, a beam shaping module, an ultra-high-speed scanning galvanometer, a field mirror and a first Z-axis slide which are arranged in sequence. The high-power and high-frequency femtosecond laser is used to emit a first laser beam. The second beam collimation module is used to collimate, expand, switch and adjust the first laser beam. The ultra-high-speed scanning galvanometer is used to move the first laser beam along a fast axis and a slow axis. The field mirror is used to focus the first laser beam. The first Z-axis slide is used to drive the ultra-high-speed scanning galvanometer assembly and the field mirror to move in a vertical direction.

3. The femtosecond laser-based rotary cutting-ultra-high-speed composite processing device according to claim 2, characterized in that: The ultra-high-speed scanning galvanometer includes a polygonal prism, and the polygonal prism is used to rotate at an ultra-high speed so as to reflect the second laser beam to move along the fast axis direction.

4. The femtosecond laser-based rotary cutting-ultra-high-speed composite processing device according to claim 1, characterized in that: The peeling assembly includes a high-power and high-energy femtosecond laser, a four-wedge prism rotation module, a second beam collimation module, a second beam focusing module, a nozzle and a second Z-axis slide which are arranged in sequence. The high-power and high-frequency femtosecond laser is used to emit a second laser beam. The four-wedge prism rotation module is used to rotate the second laser beam along the optical axis. The second beam collimation module is used to collimate, expand, switch and adjust the second laser beam. The second beam focusing module is used to focus the second laser beam. The nozzle is used to emit gas coaxial with the second laser beam. The second Z-axis slide is used to drive the second beam collimation module, the second beam focusing module and the nozzle to move in the vertical direction.

5. The femtosecond laser-based rotary cutting-ultra-high-speed composite processing device according to claim 1, characterized in that: The adjustment component includes a rotating table, which is used to load a workpiece that can be processed by the first laser beam and the second laser beam and can rotate relative to the high-power high-energy femtosecond laser component and the high-power high-frequency femtosecond laser component.

6. The femtosecond laser-based rotary cutting-ultra-high-speed composite processing device according to claim 5, characterized in that: The adjustment component also includes an X-axis slide, the rotating table is connected to the X-axis slide, and the X-axis slide can drive the rotating table to move along the X-axis.

7. The femtosecond laser-based rotary cutting-ultra-high-speed composite processing device according to claim 6, characterized in that: The adjustment component also includes a Y-axis slide, the X-axis slide is connected to the Y-axis slide, and the Y-axis slide can drive the X-axis slide to move along the Y-axis.

8. A femtosecond laser-based rotary cutting-ultra-high-speed composite processing method, characterized in that: Includes steps: S1: Use ultra-high-speed scanning components and adjustment components to coordinate the processing of the filling area to ensure the processing quality of the bottom surface of non-penetrating features or penetrating features; S2: The rotary cutting component and the adjusting component are used to cooperate in processing the edge of the non-through feature or the through feature to ensure the processing quality of the side of the non-through feature or the through feature.

9. A femtosecond laser-based rotary cutting-ultra-high-speed composite processing method, characterized in that: Includes steps: S1: Use the rotary cutting component and the adjustment component to cooperate in processing the edge of the non-penetrating feature to ensure the processing quality of the side of the non-penetrating feature; S2: Ultra-high-speed scanning components and adjustment components are used to coordinate the processing of the filling area to ensure the processing quality of the bottom surface of non-penetrating features.

10. A femtosecond laser-based rotary cutting-ultra-high-speed composite processing method, characterized in that: Includes steps: S1: Use the rotary cutting component and the adjustment component to process the edge of the through-feature to ensure the processing quality of the side of the non-through-feature.

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