Crystal support surface polishing equipment

Abstract

The invention relates to the technical field of polishing equipment, in particular to crystal support surface polishing equipment, which is characterized in that rotating shafts which are axially and transversely arranged and are axially perpendicular to the conveying direction of a crystal support are arranged on the left side edge and the right side edge of a supporting frame body, and the rotating shafts are rotationally arranged on a supporting frame; a third servo motor is arranged on the supporting frame, and an output shaft of the third servo motor is in transmission connection with the rotating shaft through a transmission part. The supporting frame is further provided with a limiting component used for limiting the rotating shaft so that the rotating shaft can rotate by a specified angle. A third servo motor is operated to control a rotating shaft to rotate, so that a supporting frame body and a roller conveying part rotate on a supporting frame, the pressed crystal support is driven to rotate to be in a vertical state, a linear driving module is operated, and a coarse grinding mechanism and a fine grinding mechanism are driven to move up and down through a movable support and a supporting plate; and in the grinding and polishing process of the crystal support, ground glue impurities fall down, and the glue impurities are collected and treated from the lower portion of the crystal support.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing equipment, and in particular to a wafer support surface polishing equipment. Background Art

[0002] The main production process of the photovoltaic slicing industry includes six steps: ingot inspection, gluing, slicing, degumming, cleaning, and sorting. The crystal tray is a key component for supporting silicon wafers. After gluing and slicing, impurities such as glue will remain on its surface, which will not only affect the performance and service life of the crystal tray itself, but may also have an adverse effect on subsequent production links. For example, in the slicing process, if the surface of the crystal tray is uneven or has impurities, it may lead to a decline in the quality of silicon wafer cutting, and cause problems such as edge collapse and uneven thickness, thereby reducing the product qualification rate.

[0003] There are many problems with existing polishing equipment when polishing the crystal tray. During the polishing process, most of the existing equipment can only polish the surface of the crystal tray in a single direction or a limited angle, and it is difficult to achieve all-round and multi-angle fine polishing. For example, some equipment can only polish the top surface of the crystal tray, but the processing effect on the side is not good, resulting in incomplete removal of glue on the surface of the crystal tray, affecting its surface quality; at the same time, during the polishing process of the existing polishing equipment, the glue polished off is easy to splash everywhere, which not only pollutes the working environment, but also is difficult to collect and process. Therefore, a crystal tray surface polishing device is provided to solve the above technical problems. Summary of the invention

[0004] The purpose of the present invention is to provide a wafer tray surface polishing device to address the deficiencies in the prior art, so as to solve the technical problem that the prior polishing device is not convenient for collecting and processing the polished colloid during the process of conveying and polishing the wafer tray.

[0005] To achieve the above object, the technical solution of the present invention is as follows:

[0006] A crystal tray surface polishing device comprises a base and a support frame arranged on the base, a support frame is arranged on the support frame, and a roller conveying component for conveying the crystal tray to a polishing station is arranged on the support frame, handles are arranged on both sides of the width of the crystal tray, a pressing mechanism for pressing the handles of the crystal tray is also arranged on the support frame, and a positioning mechanism for positioning the crystal tray placed at the polishing station at a designated pressing position;

[0007] It also includes a linear drive module installed on the support frame and having a length direction consistent with the conveying direction of the crystal tray, a movable bracket is installed on the movable end of the linear drive module, the movable bracket is provided with a support plate above the roller conveying component, and a rough grinding mechanism for rough grinding the top surface and left and right side surfaces of the crystal tray is installed on the support plate, and a fine grinding mechanism for fine grinding the top surface and left and right side surfaces of the crystal tray is also installed;

[0008] The left and right sides of the support frame are provided with a rotating shaft with an axial direction arranged horizontally and perpendicular to the conveying direction of the crystal tray, and the rotating shaft is rotatably arranged on the support frame; a third servo motor is installed on the support frame, and the output shaft of the third servo motor is connected to the rotating shaft through a transmission component; the support frame is also provided with a limiting component for limiting the rotating shaft so that it rotates to a specified angle.

[0009] The beneficial effects of the present invention are as follows: during polishing, after the crystal tray is horizontally transported to the designated polishing station by operating the roller conveying component, the left and right sides of the crystal tray are first positioned by the positioning mechanism, and the crystal tray placed at the polishing station is positioned to the designated pressing position, and then the pressing mechanism is operated to press the handle of the crystal tray, thereby pressing the crystal tray. After pressing, it is convenient to perform glue removal and polishing on the crystal tray, and by pressing the crystal tray, it can be prevented from moving around during the glue removal and polishing process.

[0010] When the crystal tray at the polishing station is pressed by the pressing mechanism, the linear drive module is operated to control the movable bracket and the support plate to move along the conveying direction of the crystal tray. While moving, the rough grinding mechanism is operated first to make it contact with the top surface and the left and right sides of the crystal tray at the same time, and then the rough grinding mechanism is driven by the movable bracket and the support plate to move along the conveying direction of the crystal tray, so that the top surface and the left and right sides of the crystal tray can be rough ground and polished at the same time; in the process of rough grinding of the crystal tray, the fine grinding mechanism is operated to achieve rough grinding of the top surface and the left and right sides of the crystal tray first, and then fine grinding, and grinding and polishing of both sides are performed at one time, which improves the efficiency of degumming the surface of the crystal tray.

[0011] In addition, by running the third servo motor, under the transmission action of the transmission component, the rotating shaft is controlled to rotate, so that the support frame and the roller conveying component rotate on the support frame, and also drive the pressed crystal tray to rotate to a vertical state. In addition, the linear drive module is run to drive the coarse grinding mechanism and the fine grinding mechanism to move up and down through the movable bracket and the support plate. In the process of grinding and polishing the crystal tray, the glue impurities polished off will fall downward, and the glue impurities will be collected and processed from the bottom of the crystal tray, thereby improving the collection efficiency.

[0012] When the crystal tray is polished, the control shaft is rotated in the opposite direction to reset, so that the crystal tray is arranged horizontally again. When the pressing mechanism is reset, the roller conveying component will convey the polished crystal tray away, so as to facilitate the delivery of the next crystal tray to be polished to the polishing station. By setting the limit component, the shaft is only rotated 90°, that is, the pressed crystal tray is arranged horizontally or vertically. When the crystal tray needs to be transported and pressed, the roller conveying component is arranged horizontally, and when the crystal tray needs to be polished, the roller conveying component is arranged vertically; the state can be freely switched according to different situations, so that the polishing mechanism can not only automatically transport the crystal tray horizontally, but also polish it in the vertical direction, which is convenient for collecting the polished colloid, thereby improving the practicality of the polishing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0014] Figure 2 It is a partial structural schematic diagram of the present invention.

[0015] Figure 3 It is a schematic diagram of the polishing state after the support frame of the present invention is rotated.

[0016] Figure 4 It is a schematic diagram of the internal structure of the support frame of the present invention.

[0017] Figure 5 It is a structural schematic diagram of the pressing mechanism of the present invention.

[0018] Figure 6 It is a partial structural schematic diagram of the pressing mechanism of the present invention.

[0019] Figure 7 It is a structural schematic diagram of the pressing part of the present invention.

[0020] Figure 8 It is a structural schematic diagram of the positioning mechanism of the present invention.

[0021] Fig. 9 This is a schematic diagram of the state in which the crystal tray is pressed and the positioning mechanism is driven downward to leave the polishing station.

[0022] Fig.10 It is a schematic structural diagram of the rough grinding mechanism and the fine grinding mechanism of the present invention.

[0023] Reference numerals include:

[0024] 1. Base; 2. Support frame; 3. Support frame; 4. Roller conveying component; 5. Pressing mechanism; 51. Guide rail; 52. Lifting frame; 53. Pressing part; 531. Mounting plate; 532. First rotating shaft; 533. Pressing plate; 534. Accommodating groove; 535. First gear; 536. Electric push rod; 537. Rack; 538. Second rotating shaft; 539. Bevel gear; 5310. Push block; 54. Threaded rod; 55. Driven wheel; 56. First servo motor; 57. Driving wheel; 58. Transmission belt; 6. Positioning mechanism; 61. Left support rod; 62. Right support rod; 63. Positioning roller; 64. Support member; 65. Forward and reverse screw rod; 66. Second servo motor; 67. Second gear; 68. Third gear; 69. Guide rod; 610. Spring; 611. Matching member ;612, give way groove; 7, linear drive module; 8, movable bracket; 9, support plate; 10, rough grinding mechanism; 101, movable seat; 102, cylinder; 103, left movable frame; 104, right movable frame; 105, double-axis motor; 106, lead screw; 107, first drive motor; 108, left rough grinding wheel; 109, right rough grinding wheel; 1010, second drive motor; 1011, top surface rough grinding wheel; 11, fine grinding mechanism; 111, top surface fine grinding wheel; 112, left fine grinding wheel; 113, right fine grinding wheel; 12, rotating shaft; 13, third servo motor; 14, transmission component; 15, limit component; 151, swing arm; 152, limit piece; 153, arc guide rod; 16, transportation mechanism; 17, crystal support; 18, handle; 19, polishing station. DETAILED DESCRIPTION

[0025] The following is a detailed description of a wafer tray surface polishing device according to the present invention in conjunction with the accompanying drawings.

[0026] like Figure 1-3As shown, an embodiment of a crystal tray surface polishing device of the present invention includes a base 1 for supporting the entire device and a support frame 2 arranged on the base 1, a support frame 3 is installed on the support frame 2, and a roller conveying component 4 for horizontally conveying the crystal tray 17 to the polishing station 19 is provided on the support frame 3. After the crystal tray 17 is horizontally conveyed to the designated polishing station 19, it can be subjected to glue removal and polishing. Handles 18 are provided on both sides of the width of the crystal tray 17, and a pressing mechanism 5 for pressing the handles 18 of the crystal tray 17 is also installed on the support frame 3, and a positioning mechanism 6 for positioning the crystal tray 17 placed at the polishing station 19 at a designated pressing position. After the crystal tray 17 is horizontally transported to the designated polishing station 19 by operating the roller conveying component 4, the left and right sides of the crystal tray 17 are first positioned by the positioning mechanism 6, and the crystal tray 17 placed at the polishing station 19 is positioned to the designated pressing position, and then the pressing mechanism 5 is operated to press the handle 18 of the crystal tray 17, so as to achieve the pressing of the crystal tray 17. After pressing, it is convenient to perform glue removal and polishing on the crystal tray 17. By pressing the crystal tray 17, it can prevent it from moving around during the process of glue removal and polishing; and, in the process of pressing the handle 18 of the crystal tray 17, the pressing mechanism 5 will drive the positioning mechanism 6 to move together, so that the positioning mechanism 6 is separated from the polishing station 19. During the process of glue removal and polishing, the top surface and left and right side surfaces of the crystal tray 17 can be simultaneously subjected to glue removal and polishing.

[0027] In order to remove glue and polish the top surface and left and right side surfaces of the crystal tray 17, a linear drive module 7 whose length direction is consistent with the conveying direction of the crystal tray 17 is installed on the support frame 3, and a movable bracket 8 is installed on the movable end of the linear drive module 7. The movable bracket 8 is provided with a support plate 9 above the roller conveying component 4, and a rough grinding mechanism 10 for rough grinding the top surface and left and right side surfaces of the crystal tray 17 is installed on the support plate 9, and a fine grinding mechanism 11 for fine grinding the top surface and left and right side surfaces of the crystal tray 17 is also installed. When the crystal tray 17 at the polishing station 19 is pressed by the pressing mechanism 5, the linear drive module 7 is operated to control the movable bracket 8 and the support plate 9 to move along the conveying direction of the crystal tray 17. During the movement, the rough grinding mechanism 10 is operated first to make it contact with the top surface and the left and right side surfaces of the crystal tray 17 at the same time. The rough grinding mechanism 10 is driven by the movable bracket 8 and the support plate 9 to move along the conveying direction of the crystal tray 17, so that the top surface and the left and right side surfaces of the crystal tray 17 can be rough ground and polished at the same time; in the process of rough grinding the crystal tray 17, the fine grinding mechanism 11 is operated to achieve rough grinding of the top surface and the left and right side surfaces of the crystal tray 17 first, and then fine grinding, so that grinding and polishing are performed on both sides at one time, thereby improving the efficiency of degumming the surface of the crystal tray 17.

[0028] In order to collect and process the impurities of the polished glue, a rotating shaft 12 is arranged on the left and right sides of the support frame 3, and the rotating shaft 12 is arranged axially and horizontally and perpendicular to the conveying direction of the crystal tray 17. The rotating shaft 12 is rotatably arranged on the support frame 2; by setting the rotating shaft 12, the support frame 3 and the roller conveying component 4 can be rotated on the support frame 2, and the pressed crystal tray 17 can also be driven to rotate to a vertical state (such as Figure 3 As shown), the linear drive module 7 is operated to drive the rough grinding mechanism 10 and the fine grinding mechanism 11 to move up and down through the movable bracket 8 and the support plate 9. During the grinding and polishing of the crystal tray 17, the glue impurities polished will fall down. After placing a collection frame (not shown in the figure) under the crystal tray 17, the glue impurities can be collected and processed. When the crystal tray 17 is polished, the control shaft 12 is rotated in the opposite direction to reset, so that the crystal tray 17 is arranged horizontally again. After the pressing mechanism 5 is reset, the roller conveying component 4 conveys the polished crystal tray 17 away, so as to facilitate the conveying of the next crystal tray 17 to be polished to the polishing station 19.

[0029] In order to control the rotation of the rotating shaft 12, a third servo motor 13 is installed on the support frame 2, and the output shaft of the third servo motor 13 is connected to the rotating shaft 12 through a transmission component 14. The transmission component 14 can be a transmission structure composed of a pulley and a belt. By running the third servo motor 13, the rotating shaft 12 is controlled to rotate forward and reverse under the transmission action of the transmission component 14. In addition, a limiting component 15 for limiting the rotating shaft 12 to rotate a specified angle is also installed on the support frame 2. By setting the limiting component 15, the rotating shaft 12 is only rotated 90°, that is, the pressed crystal support 17 is driven to be arranged horizontally or vertically. When the crystal support 17 needs to be transported and pressed, the roller conveying component 4 is arranged horizontally, and when the crystal support 17 needs to be polished, the roller conveying component 4 is arranged vertically. The base 1 is provided with a pair of transport mechanisms 16 respectively connected to the initial end and the terminal end of the roller conveying component 4. When the crystal tray 17 is polished, the roller conveying component 4 and the transport mechanisms 16 connected to the two ends thereof are operated simultaneously to transport the crystal tray 17 away. After being transported away, the next crystal tray 17 to be polished is transported to the polishing station 19, thereby realizing automatic transport processing of the crystal tray 17.

[0030] Furthermore, the limiting component 15 includes a limiting member 152 which is annular and coaxially arranged with the rotating shaft 12. The limiting member 152 is fixedly arranged on the support frame 2. A curved guide rod 153 is formed on a part of the limiting member 152. The limiting member 152 also includes a swing arm 151 which is fixedly arranged with the rotating shaft 12 at one end. The other end of the swing arm 151 is slidably arranged on the curved guide rod 153 to limit the sliding range through the limiting member 152. When the rotating shaft 12 is controlled to rotate, the swing arm 151 can be driven to rotate around its axis. The swing arm 151 slides on the curved guide rod 153, and the sliding range is limited by the limiting member 152, so that the rotating shaft 12 can only rotate 90°.

[0031] like Figure 4-6 As shown, the pressing mechanism 5 includes a guide rail 51 disposed on the support frame 3 and arranged vertically, and a lifting frame 52 that can move up and down is disposed on the guide rail 51. Both ends of the lifting frame 52 are equipped with pressing parts 53 that can pass through the roller conveying component 4 from bottom to top and are used to respectively press the handles 18 on both sides of the crystal holder 17. The initial position of the pressing part 53 is below the roller conveying component 4. After the crystal holder 17 is conveyed to the polishing station 19 by the roller conveying component 4, the lifting frame 52 is controlled to move upward on the guide rail 51 to drive the pressing parts 53 at both ends to pass through the gap between the rollers on the roller conveying component 4 from bottom to top. After passing through, the pressing parts 53 at both ends are close to different handles 18 respectively. At this time, the pressing part 53 is operated to change its state, and then the lifting frame 52 is controlled to move downward to drive the pressing part 53 after the state is changed to press the handles 18 on both sides of the crystal holder 17 at the same time. How the state of the pressing part 53 is changed is described below.

[0032] In order to control the lifting frame 52 to slide up and down on the guide rails 51, vertically arranged threaded rods 54 are rotatably provided on each guide rail 51, and the threaded rods 54 are threadedly connected to the lifting frame 52. The top of each threaded rod 54 passes through the guide rails 51 and extends upward. The top of the threaded rod 54 extending outside the guide rails 51 is provided with a driven wheel 55, and a transmission belt 58 is wound around the driven wheel 55. The support frame 3 is equipped with a first servo motor 56, and a driving wheel 57 is provided on the output shaft of the first servo motor 56. The transmission belt 58 is also wound around the driving wheel 57. When the first servo motor 56 is operated, the driving wheel 57 is driven to rotate, and under the transmission action of the transmission belt 58, each driven wheel 55 can be driven to rotate synchronously, thereby driving the threaded rods 54 in each guide rail 51 to rotate synchronously, and controlling the lifting frame 52 to slide up and down on the guide rail 51.

[0033] like Figure 7As shown, the pressing part 53 includes a mounting plate 531 disposed on the end of the lifting frame 52, and a first rotating shaft 532 is rotatably disposed on the mounting plate 531, which is arranged axially and horizontally and parallel to the width direction of the crystal holder 17. A pressing plate 533 for pressing the handle 18 is disposed on the first rotating shaft 532. The pressing plate 533 is initially arranged vertically and is rotatably disposed on the mounting plate 531 through the first rotating shaft 532. When the first rotating shaft 532 is controlled to rotate to drive the pressing plate 533 to rotate together, the pressing plate 533 is placed directly above the handle 18 and is arranged horizontally. When the pressing plate 533 is rotated in the opposite direction to reset, it will deviate from the position directly above the handle 18. When the pressing plate 533 rotates to the position directly above the handle 18, the lifting frame 52 is controlled to move downward on the guide rail 51, and the mounting plate 531 moves downward with the pressing plate 533 to press the handle 18. In addition, a receiving groove 534 is formed on the pressing plate 533 for pressing the handle 18 and limiting its position. When the mounting plate 531 drives the pressing plate 533 to move downward to press the handle 18, the handle 18 is placed in the receiving groove 534 to limit its position, thereby preventing the position of the crystal holder 17 from shifting during the grinding and polishing of the crystal holder 17, thereby improving the pressing effect.

[0034] In order to control the rotation of the first rotating shaft 532, an installation chamber is formed in the installation plate 531. The end of the first rotating shaft 532 extends into the installation chamber, and a first gear 535 is installed on the end. An electric push rod 536 is also installed in the installation chamber. The end of the telescopic rod of the electric push rod 536 is provided with a rack 537 meshing with the first gear 535. The initial state of the telescopic rod of the electric push rod 536 is the extended state. By running the electric push rod 536, the telescopic rod contracts and drives the rack 537 to move, so as to drive the rack 537 to rotate 90 degrees. The first rotating shaft 532 rotates to drive the pressing plate 533 to rotate 90 degrees on the installation plate 531 as well, so that the pressing plate 533 is placed just above the handle 18. After the lifting frame 52 is controlled to move downward on the guide rail 51, the installation plate 531 moves downward with the pressing plate 533 to press the handle 18 tightly. In addition, when there is no need to tighten the handle 18, the electric push rod 536 operates to control the telescopic rod to extend again, and the rack 537 drives the rack 537 to rotate 90° in the opposite direction. The first rotating shaft 532 rotates in the opposite direction to drive the pressing plate 533 to deviate from the top of the handle 18. At this time, the lifting frame 52 is controlled to move downward on the guide rail 51 to drive the mounting plate 531 from top to bottom through the gap between the rollers on the roller conveying component 4 to prevent it from being blocked when the polished crystal tray 17 is conveyed.

[0035] like Figure 8-9As shown, the positioning mechanism 6 includes a left support rod 61 and a right support rod 62 which are placed below the roller conveying component 4 and arranged on the left and right sides. The left support rod 61 and the right support rod 62 are both provided with positioning rollers 63 for positioning the left and right sides of the crystal holder 17 placed at the polishing station 19. The positioning rollers 63 pass through the gaps between the rollers on the roller conveying component 4 from bottom to top, thereby positioning the left and right sides of the crystal holder 17 placed at the polishing station 19. The positioned crystal holder 17 is placed at a designated clamping position to facilitate being clamped by the pressing plate 533.

[0036] In addition, a T-shaped support member 64 that can slide up and down is provided on the support frame 3, and the left support rod 61 and the right support rod 62 are slidably arranged at the left and right ends of the support member 64, and the two can slide in a direction of approaching or moving away from each other. By controlling the left support rod 61 and the right support rod 62 to move closer to or away from each other, the spacing between the left and right positioning rollers 63 can be controlled to position the crystal holders 17 of different sizes. In addition, the support member 64 is slidably arranged on the support frame 3 up and down, so that the left support rod 61 and the right support rod 62 can also be slidably arranged on the support frame 3 up and down; when the mounting plate 531 moves downward to drive the pressing plate 533 to press the handle 18, the mounting plate 531 will drive the left support rod 61 and the right support rod 62 to move downward together, so that the positioning roller 63 moves downward away from the polishing station 19, so as to facilitate the grinding and polishing of the left and right sides of the crystal support 17; when the pressing plate 533 is arranged vertically and deviates from the top of the handle 18, when the mounting plate 531 drives the pressing plate 533 to move downward, it will not drive the left support rod 61 and the right support rod 62 to move downward, thereby achieving a linkage effect, as shown in the figure and how to link is described below.

[0037] A positive and negative threaded rod 65 is rotatably arranged in the support member 64, and the positive and negative threaded rod 65 is arranged in a transverse direction and parallel to the width direction of the crystal holder 17. Different threaded parts on the positive and negative threaded rod 65 are respectively threadedly connected with the left support rod 61 and the right support rod 62. A second servo motor 66 is installed on the outer side of the support member 64. A second gear 67 is installed on the output shaft of the second servo motor 66. A third gear 68 is installed in the middle of the positive and negative threaded rod 65 to be connected with the second gear 67. When the second servo motor 66 is operated, the positive and negative threaded rod 65 can be driven to rotate in the support member 64 under the transmission action of the second gear 67 and the third gear 68, so as to control the left support rod 61 and the right support rod 62 to move in the direction of approaching or moving away from each other.

[0038] A guide rod 69 is also mounted on the support member 64 and is arranged vertically and is slidably mounted with the support frame 3. A spring 610 is mounted on the guide rod 69 and is placed between the support member 64 and the support frame 3 to apply an upward thrust to the support member 64. When the mounting plate 531 drives the left support rod 61 and the right support rod 62 to move downward together, the support member 64 will also move downward on the support frame 3, and the spring 610 will be compressed. When the downward pressure on the left support rod 61 and the right support rod 62 stops, the left support rod 61 and the right support rod 62 will automatically reset upward under the action of the compression spring 610, so that the positioning roller 63 is placed back in the polishing station 19.

[0039] Furthermore, the mounting plate 531 is further provided with a linkage part for driving the pressing plate 533 to move downward to press the handle 18, and at the same time, driving the left support rod 61 and the right support rod 62 to move downward together, wherein the linkage part includes a second rotating shaft 538 (such as a second rotating shaft 538) rotatably disposed on the mounting plate 531 and arranged vertically. Figure 7 As shown in the figure, the top end of the second rotating shaft 538 extends into the installation chamber, and the bottom end extends to the outside of the bottom of the installation plate 531. Bevel gears 539 are provided on the top end of the second rotating shaft 538 and the end of the first rotating shaft 532, and the bevel gears 539 are meshed with each other. A push block 5310 is installed at the bottom end of the second rotating shaft 538. The middle position of the push block 5310 deviates from the axis of the second rotating shaft 538. The second rotating shaft 538 rotates to drive the push block 5310 to swing around its axis. The initial position of the push block 5310 is placed directly below the mounting plate 531, and the swinging end is also placed directly below the mounting plate 531. The electric push rod 536 is operated, and the telescopic rod contracts to drive the rack 537 to move, thereby driving the rack 537 to rotate 90°. The first rotating shaft 532 rotates to drive the pressing plate 533 to also rotate 90° on the mounting plate 531, so that the pressing plate 533 is placed directly above the handle 18. While the first rotating shaft 532 rotates, the second rotating shaft 538 can be driven to rotate under the transmission action of the bevel gear 539, thereby driving the push block 5310 to swing around the axis of the second rotating shaft 538, so that the swinging end of the push block 5310 deviates from directly below the mounting plate 531.

[0040] In addition, the left support rod 61 and the right support rod 62 are both provided with a matching piece 611 (such as Figure 8As shown), and a clearance groove 612 for the side edge of the mounting plate 531 to pass through is formed on the matching piece 611. When the pressing plate 533 is arranged vertically, the swinging end of the push block 5310 is placed directly below the mounting plate 531. At this time, when the lifting frame 52 drives the mounting plate 531 to move up and down, it can easily pass through the clearance groove 612 on the matching piece 611, thereby not driving the left support rod 61 and the right support rod 62 to move downward; when the pressing plate 533 is controlled to rotate so as to be placed horizontally directly above the handle 18, the push block 5310 is driven to swing around the axis of the second rotating shaft 538, so that the swinging end of the push block 5310 deviates from directly below the mounting plate 531. In the process of the lifting frame 52 driving the mounting plate 531 to move downward to press the handle 18 through the pressing plate 533, the swinging push block 5310 cannot pass through the clearance groove 612, thereby pushing the matching piece 611 to move downward through the swinging push block 5310 (as shown in FIG. Fig. 9 As shown), the left support rod 61 and the right support rod 62 are pushed downward together to achieve a linkage effect, thereby improving the automation setting of the polishing equipment.

[0041] like Fig.10As shown, the rough grinding mechanism 10 includes a movable seat 101 which is arranged on the support plate 9 and can move toward or away from the polishing station 19, and a cylinder 102 which controls the movable seat 101 to move. The end of the telescopic rod of the cylinder 102 is fixedly arranged with the movable seat 101. By running the cylinder 102, the movable seat 101 is controlled to move toward or away from the polishing station 19 on the support plate 9. The movable seat 101 is equipped with a second driving motor 1010, and a top motor for rough grinding the top surface of the crystal holder 17 is installed on the output shaft of the second driving motor 1010. A surface rough grinding wheel 1011. In addition, the movable seat 101 is also equipped with a left movable frame 103 and a right movable frame 104 which are arranged on the left and can move towards or away from each other. The left movable frame 103 and the right movable frame 104 are both equipped with a first driving motor 107. A left rough grinding wheel 108 for rough grinding the left side surface of the crystal holder 17 is provided at the end of the output shaft of the first driving motor 107 on the left. A right rough grinding wheel 109 for rough grinding the right side surface of the crystal holder 17 is provided at the end of the output shaft of the first driving motor 107 on the right. When the crystal holder 17 placed at the polishing station 19 is pressed, the cylinder 102 is operated to control the movable seat 101 to move on the support plate 9 toward the polishing station 19, so that the top surface rough grinding wheel 1011 contacts the top surface of the crystal holder 17, and at the same time, the left movable frame 103 and the right movable frame 104 are controlled to move toward each other, so as to drive the left rough grinding wheel 108 and the right rough grinding wheel 109 to move toward each other, so as to contact the left and right sides of the crystal holder 17 respectively. When the second drive motor 1010, the first drive motor 107 and the linear drive module 7 are operated at the same time, while driving the top surface rough grinding wheel 1011, the left side rough grinding wheel 108 and the right side rough grinding wheel 109 to rotate, the support plate 9 will move the top surface rough grinding wheel 1011, the left side rough grinding wheel 108 and the right side rough grinding wheel 109 on the crystal support 17 at a uniform speed along its length direction, thereby realizing automatic grinding and polishing of the top surface and left and right sides of the crystal support 17.

[0042] In order to control the left movable frame 103 and the right movable frame 104 to move in the direction of approaching or moving away from each other, the movable seat 101 is equipped with a double-axis motor 105, and screw rods 106 are provided on both sides of the output shaft of the double-axis motor 105, and the screw rods 106 on both sides are respectively threadedly connected with the left movable frame 103 and the right movable frame 104. The threads of the screw rods 106 on both sides are arranged oppositely, and the operation of the double-axis motor 105 can drive the screw rods 106 on both sides to rotate simultaneously, so that the left movable frame 103 and the right movable frame 104 can be controlled to move in the direction of approaching or moving away from each other.

[0043] In addition, the rough grinding mechanism 10 and the fine grinding mechanism 11 have the same structure, and the only difference is the different grinding wheels, and the two can operate simultaneously or separately; the rough grinding mechanism 10 is equipped with a top surface rough grinding wheel 1011, a left side rough grinding wheel 108 and a right side rough grinding wheel 109, and the fine grinding mechanism 11 is equipped with a top surface fine grinding wheel 111, a left side fine grinding wheel 112 and a right side fine grinding wheel 113; when the top surface of the crystal holder 17 passes through the top surface rough grinding wheel After rough grinding by 1011, the top surface of the crystal support 17 is finely ground by the top surface fine grinding wheel 111. Similarly, after the left and right side surfaces of the crystal support 17 are rough ground by the left rough grinding wheel 108 and the right rough grinding wheel 109, the left and right side surfaces of the crystal support 17 are finely ground by the left fine grinding wheel 112 and the right fine grinding wheel 113. After two grindings, the surface of the crystal support 17 is fully de-glueed and polished to improve the efficiency of de-glueing and polishing.

[0044] In summary, it can be seen that the present invention has the above-mentioned excellent characteristics, which can enhance the performance unprecedented in the prior art and become a product with great practical value.

[0045] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The content of this specification should not be understood as limiting the present invention.

Claims

1. A wafer support surface polishing device, characterized in that: The invention comprises a base (1) and a support frame (2) arranged on the base (1); a support frame (3) is arranged on the support frame (2); a roller conveying component (4) for conveying a crystal tray (17) to a polishing station (19) is arranged on the support frame (3); handles (18) are arranged on both sides of the width of the crystal tray (17); a pressing mechanism (5) for pressing the handles (18) of the crystal tray (17) is also arranged on the support frame (3); and a positioning mechanism (6) for positioning the crystal tray (17) placed on the polishing station (19) at a designated pressing position; It also includes a linear drive module (7) mounted on the support frame (3) and having a length direction consistent with the conveying direction of the crystal tray (17); a movable bracket (8) is mounted on the movable end of the linear drive module (7); the movable bracket (8) is provided with a support plate (9) above the roller conveying component (4); a rough grinding mechanism (10) for rough grinding the top surface and left and right side surfaces of the crystal tray (17) is mounted on the support plate (9); and a fine grinding mechanism (11) for fine grinding the top surface and left and right side surfaces of the crystal tray (17) is also mounted; The left and right sides of the support frame (3) are both provided with a rotating shaft (12) which is arranged axially transversely and axially perpendicular to the conveying direction of the crystal tray (17); the rotating shaft (12) is rotatably arranged on the support frame (2); a third servo motor (13) is installed on the support frame (2), and the output shaft of the third servo motor (13) is connected to the rotating shaft (12) through a transmission component (14); and a limiting component (15) is also installed on the support frame (2) for limiting the rotating shaft (12) so that it rotates to a specified angle.

2. The wafer support surface polishing device according to claim 1, characterized in that: The limiting component (15) comprises a limiting member (152) which is annular and coaxially arranged with the rotating shaft (12); the limiting member (152) is fixedly arranged on the support frame (2); a portion of the limiting member (152) is formed with an arc-shaped guide rod (153); and the limiting member (152) further comprises a swing arm (151) having one end fixedly arranged with the rotating shaft (12); the other end of the swing arm (151) is slidably arranged on the arc-shaped guide rod (153) to be limited by the limiting member (152).

3. The wafer support surface polishing device according to claim 1, characterized in that: The pressing mechanism (5) includes a guide rail (51) which is arranged vertically on the support frame 3, and a lifting frame (52) which can move up and down is provided on the guide rail (51). Both ends of the lifting frame (52) are provided with pressing parts (53) which can pass through the roller conveying component (4) from bottom to top and are used to respectively press the handles (18) on the two sides of the crystal tray (17).

4. The wafer support surface polishing device according to claim 3, characterized in that: Each guide rail (51) is rotatably provided with a vertically arranged threaded rod (54), the threaded rod (54) is threadedly connected to the lifting frame (52), the top end of each threaded rod (54) passes through the guide rail (51) and extends upward, the top end of the threaded rod (54) extending outside the guide rail (51) is provided with a driven wheel (55), and a transmission belt (58) is wound around the driven wheel (55), the support frame (3) is equipped with a first servo motor (56), and a driving wheel (57) is provided on the output shaft of the first servo motor (56), and the transmission belt (58) is also wound around the driving wheel (57).

5. The wafer support surface polishing device according to claim 3, characterized in that: The pressing portion (53) includes a mounting plate (531) arranged on the end of the lifting frame (52), and a first rotating shaft (532) is rotatably provided on the mounting plate (531) and is axially arranged transversely and axially parallel to the width direction of the crystal holder (17). A pressing plate (533) for pressing the handle (18) is provided on the first rotating shaft (532). The pressing plate (533) is rotatably arranged on the mounting plate (531) through the first rotating shaft (532) so that it is placed directly above the handle (18) or deviated from directly above the handle (18); a receiving groove (534) is formed on the pressing plate (533) for pressing the handle (18) and limiting it at the same time.

6. The wafer support surface polishing device according to claim 5, characterized in that: An installation chamber is formed in the installation plate (531), the end of the first rotating shaft (532) extends into the installation chamber, and a first gear (535) is installed on the end. An electric push rod (536) is also installed in the installation chamber, and a rack (537) meshing with the first gear (535) is provided on the end of the telescopic rod of the electric push rod (536).

7. The wafer support surface polishing device according to claim 6, characterized in that: The positioning mechanism (6) comprises a left support rod (61) and a right support rod (62) which are arranged below the roller conveying component (4) and on the left and right sides. The left support rod (61) and the right support rod (62) are both provided with positioning rollers (63) for positioning the left and right sides of the crystal holder (17) placed at the polishing station (19); a T-shaped support member (64) which can slide up and down is provided on the support frame (3); the left support rod (61) and the right support rod (62) are respectively slidably arranged at the left and right ends of the support member (64), and the two can slide in directions approaching or moving away from each other; the support member (64) is also provided with a guide rod (69) which is arranged vertically and slidably arranged with the support frame (3); the guide rod (69) is provided with a spring (610) which is placed between the support member (64) and the support frame 3 to apply an upward thrust to the support member (64).

8. The wafer support surface polishing device according to claim 7, characterized in that: A forward and reverse threaded rod (65) is rotatably arranged in the support member (64) with its axial direction arranged transversely and its axial direction parallel to the width direction of the crystal holder (17), and different threaded parts on the forward and reverse threaded rod (65) are respectively threadedly connected to the left support rod (61) and the right support rod (62); a second servo motor (66) is installed on the outer side of the support member (64), a second gear (67) is installed on the output shaft of the second servo motor (66), and a third gear (68) connected to the second gear (67) is installed in the middle of the forward and reverse threaded rod (65).

9. The wafer support surface polishing device according to claim 7, characterized in that: The mounting plate (531) is provided with a linkage part for driving the pressing plate (533) to move downward to press the handle (18) and drive the left support rod (61) and the right support rod (62) to move downward together; the linkage part includes a second rotating shaft (538) rotatably arranged on the mounting plate (531) and arranged vertically, the top end of the second rotating shaft (538) extends into the mounting chamber, and the bottom end extends to the outside of the bottom of the mounting plate (531), and bevel gears (539) are provided on the top end of the second rotating shaft (538) and the end of the first rotating shaft (532), and The bevel gears (539) are meshed with each other, and a push block (5310) is installed at the bottom end of the second rotating shaft (538). The middle position of the push block (5310) deviates from the axis of the second rotating shaft (538), and the second rotating shaft (538) rotates to drive the push block (5310) to swing around its axis; the left support rod (61) and the right support rod (62) are both provided with a matching piece (611) for being pushed by the push block (5310) after swinging, and a clearance groove (612) is formed on the matching piece (611) for the side edge of the mounting plate (531) to pass through.

10. The wafer support surface polishing device according to claim 1, characterized in that: The rough grinding mechanism (10) comprises a movable seat (101) arranged on a support plate (9) and movable in a direction close to or away from a polishing station (19), and a cylinder (102) for controlling the movable seat (101) to move, the movable seat (101) being provided with a second drive motor (1010), and a top surface rough grinding wheel (1011) for rough grinding the top surface of a crystal holder (17) being provided on an output shaft of the second drive motor (1010), and a left-right arranged movable seat (1012) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (1013) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (1014) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (1015) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (1016) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (1017) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (1018) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (1019) being movable in a direction close to or away from a polishing station (19), and a right-left arranged movable seat (101 A left movable frame (103) and a right movable frame (104) are provided for moving in opposite directions, and a first driving motor (107) is installed on both the left movable frame (103) and the right movable frame (104). A left rough grinding wheel (108) for rough grinding the left side surface of the crystal support (17) is provided on the end of the output shaft of the first driving motor (107) on the left side, and a right rough grinding wheel (109) for rough grinding the right side surface of the crystal support (17) is provided on the end of the output shaft of the first driving motor (107) on the right side.

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