Glass wafer edge processing device

Abstract

The present invention discloses a glass wafer edge processing device, which relates to the field of industrial product processing equipment, including a mounting box, a mounting box is arranged on one side of the mounting box, a control device is arranged on the side of the mounting box close to the mounting box, and the control device includes a mounting block, and the mounting block is provided with a guide rail away from the mounting box, a connecting rod is arranged on one side of the guide rail, and a grinding disc is arranged at the bottom of the connecting rod. During the glass wafer edge processing, the present invention starts a first control motor to drive the grinding disc to rotate at high speed, and can operate strictly according to the preset processing path and parameters, thereby greatly improving the accuracy and uniformity of grinding, effectively reducing the edge roughness, and significantly improving the processing quality of the glass wafer, so that it can better meet the stringent requirements of high-end electronic products for chip accuracy, and enhance the competitiveness of the product in the market.

Description

Technical Field

[0001] The invention relates to the field of industrial product processing equipment, and in particular to a glass wafer edge processing device. Background Art

[0002] In today's technology industry, the semiconductor and optical fields are developing rapidly. As an important basic material, glass wafers are increasingly used, playing a key role in many fields, from electronic chip manufacturing to optical lens production. As the market's requirements for the performance of various electronic products and optical equipment increase, higher standards are also being put forward for the processing accuracy and quality of glass wafers, which has prompted the continuous innovation and development of related processing technologies to meet the needs of the industry.

[0003] At present, there are many processing equipment and methods in the field of glass wafer edge processing. The common processing devices on the market have their own characteristics in structure and function, but there are still some unsatisfactory aspects in general. For example, some equipment has poor stability during the polishing process and is easily disturbed by external factors, making it difficult for the flatness and smoothness of the wafer edge to meet high-precision requirements. Moreover, in terms of dust treatment during the processing process, the cleaning effect of most equipment is not ideal, which not only affects the processing environment, but may also cause secondary pollution to the wafer surface and reduce product yield.

[0004] Traditional glass wafer edge processing usually starts with fixing the wafer on a specific fixture, and then using a simple mechanical transmission structure to drive the grinding tool to perform edge grinding operations. During the grinding process, the position and strength of the grinding are mainly controlled by manual experience or preset fixed parameters, lacking precise automated control. For the generated dust, a simple dust collection device is generally used, which has a limited dust collection range and cannot be flexibly adjusted according to the processing position. It simply collects most of the dust, making it difficult to effectively filter and clean the fine dust, and subsequent complex cleaning and maintenance work is required manually.

[0005] In terms of grinding wheel control, existing equipment cannot achieve precise multi-dimensional intelligent movement up, down, left, and right. It is difficult to adjust the grinding position and force in real time according to the complex wafer edge shape and processing requirements, resulting in limited processing accuracy. At the same time, the cleaning system is inefficient and cannot efficiently absorb and filter dust from different positions, and cannot ensure the cleanliness of the processing environment, which in turn affects the processing quality and production efficiency of the wafer. In addition, frequent manual maintenance also increases production costs and time costs. Summary of the invention

[0006] Based on this, the purpose of the present invention is to provide a glass wafer edge processing device to solve the technical problems of low wafer grinding accuracy, poor dust cleaning and unstable fixation in the prior art.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a glass wafer edge processing device, comprising an installation box, an installation box is arranged on one side of the installation box, a control device is arranged on the side of the installation box close to the installation box, the control device comprises a mounting block, the mounting block is provided with a guide rail away from the mounting box, a connecting rod is arranged on one side of the guide rail, a grinding disc is arranged at the bottom of the connecting rod, a first control motor is arranged on the top of the connecting rod to cooperate with the grinding disc, a mounting plate is arranged on the installation box, a supporting chassis is arranged on the installation plate, a wafer is arranged on the supporting chassis, a connecting block is arranged at the bottom of the mounting plate to cooperate with it, a second guide groove is arranged on one side of the connecting block to cooperate with it, a fourth control motor is arranged on one side of the second guide groove, a cleaning device is arranged in the installation box to cooperate with the wafer, and a pair of centering positioning devices are arranged in the installation box to cooperate with the wafer.

[0008] By adopting the above technical solution, the grinding and positioning operations of wafers of different specifications and different positions can be realized.

[0009] The present invention is further configured such that the cleaning device includes a pair of first guide rods, a dust collecting plate is arranged between the pair of first guide rods, and a first guide groove is provided on the first guide rod to cooperate with the dust collecting plate.

[0010] By adopting the above technical solution, the dust collecting plate is driven to move by the guide rod, thereby absorbing the dust generated by the wafer grinding, thereby ensuring that the surface of the lens is clean.

[0011] The present invention is further configured such that a mounting groove is provided on the mounting box to cooperate with the first guide rod, and a fourth control motor is provided on the top of the mounting groove.

[0012] By adopting the above technical solution, the first control motor controls the first guide rod to move up and down, thereby adsorbing wafers of different specifications.

[0013] The present invention is further configured such that a third control motor is provided on the mounting block in cooperation with the connecting rod, and a second control motor is provided on one side of the mounting block in cooperation therewith.

[0014] By adopting the above technical solution, the second control motor cooperates with the third control motor to realize the left and right and up and down movement of the entire mounting block, thereby controlling the grinding disc to grind lenses at different positions.

[0015] The present invention is further configured such that support rods are provided at the bottom of the installation box and the installation case, and a plurality of universal wheels are provided at the bottom of the support rods.

[0016] By adopting the above technical solution, the entire device can be moved in one space.

[0017] The present invention is further configured such that an air pipe is connected to the dust collection plate, the air pipe extends into an installation box, a storage box is provided in the installation box to cooperate with the air pipe, the air pipe extends into the storage box, a guide plate is provided in the storage box, second guide rods are symmetrically provided on both sides of the guide plate, and a filter plate is provided on the guide plate.

[0018] By adopting the above technical solution, the gas containing dust is filtered through the filter plate, so that the absorbed raw materials are recovered and the dust is prevented from affecting the grinding process.

[0019] The present invention is further configured such that a guide tube is provided at the bottom of the connection block, the bottom of the guide tube extends to the outside of the installation box to connect to the gas delivery groove, and the guide tube is connected to the placement plate.

[0020] By adopting the above technical solution, the placement plate can adsorb the wafer.

[0021] In summary, the present invention mainly has the following beneficial effects:

[0022] 1. In the process of processing the edge of the glass wafer, the present invention starts the first control motor to drive the grinding disc to rotate at high speed, the second control motor accurately controls the lateral displacement of the mounting block, and the third control motor accurately adjusts the up and down position of the connecting rod, so as to achieve accurate grinding of the edge of the wafer by the grinding disc. This intelligent multi-dimensional control can strictly operate according to the preset processing path and parameters, greatly improves the grinding accuracy and uniformity, effectively reduces the edge roughness, and significantly improves the processing quality of the glass wafer, so that it can better meet the stringent requirements of high-end electronic products for chip accuracy, and enhances the competitiveness of the product in the market;

[0023] 2. When the grinding operation is started, the suction pump in the installation box is started synchronously, and a strong suction force is generated at the dust suction plate, and the dust-containing gas enters the storage box through the air pipe. In this process, the fourth control motor drives the installation slot to rotate, so that the dust suction plate can flexibly adjust its position, and the dust at different heights and areas can be fully absorbed. The filter plate effectively intercepts and collects the dust to prevent it from escaping. The efficient cleaning system can not only keep the processing environment clean and hygienic, reduce the adhesion and scratches of dust particles on the surface of the chip, and reduce the scrap rate, but also provide a good working environment for operators, ensure the stability and continuity of the processing process, and improve the overall production efficiency and economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a partial structural schematic diagram of the present invention;

[0026] Figure 3It is a schematic diagram of the back side of a part of the structure of the present invention;

[0027] Figure 4 It is a schematic diagram of the storage box structure of the present invention;

[0028] Figure 5 This is a schematic diagram of the installation of some structures of the present invention

[0029] Figure 6 It is a schematic diagram of the bottom part of the structure of the present invention.

[0030] In the figure: 1. installation box; 2. connecting rod; 3. first control motor; 4. second control motor; 5. third control motor; 6. wafer; 7. supporting chassis; 8. universal wheel; 9. supporting rod; 10. installation box; 11. first guide rod; 12. first guide groove; 13. grinding disc; 14. fourth control motor; 15. dust collecting plate; 16. installation plate; 17. air pipe; 18. air groove; 19. storage box; 20. guide pipe; 21. connecting block; 22. placement plate; 23. second guide groove; 24. filter plate; 25. second guide rod; 26. guide plate; 27. installation block; 28. guide rail; 29. ​​installation groove; 30. centering positioning device; 31. suction pump. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] The following describes an embodiment of the present invention based on its overall structure.

[0033] A glass wafer edge processing device, such as Figure 1-6The device shown includes an installation box 1, an installation box 10 is arranged on one side of the installation box 1, a control device is arranged on the side of the installation box 10 close to the installation box 1, the control device includes a mounting block 27, the mounting block 27 is provided with a guide rail 28 away from the installation box 10, a connecting rod 2 is arranged on one side of the guide rail 28, a grinding disc 13 is arranged at the bottom of the connecting rod 2, a first control motor 3 is arranged on the top of the connecting rod 2 to cooperate with the grinding disc 13, a mounting plate 16 is arranged on the installation box 1, a supporting chassis 7 is arranged on the mounting plate 16, a wafer 6 is arranged on the supporting chassis 7, and a connecting block is arranged at the bottom of the mounting plate 16 to cooperate with it 21, a second guide groove 23 is provided on one side of the connecting block 21, and a fourth control motor 14 is provided on one side of the second guide groove 23. The grinding disc 13 is controlled to rotate to grind the wafer 6 by the first control motor 3. A third control motor 5 is provided on the mounting block 27 that cooperates with the connecting rod 2. A second control motor 4 is provided on one side of the mounting block 27. The mounting block 27 is controlled to move horizontally by the second control motor 4, and the connecting rod 2 is controlled to move up and down by the third control motor 5, thereby controlling the grinding disc 13 to move up, down, left and right, and grinding the wafer 6 according to the grinding position requirements of the wafer 6.

[0034] Furthermore, a cleaning device is provided in the installation box 1 in cooperation with the wafer 6, and the cleaning device includes a pair of first guide rods 11, a dust collecting plate 15 is provided between the pair of first guide rods 11, a first guide groove 12 is provided on the first guide rod 11 in cooperation with the dust collecting plate 15, and the dust collecting plate 15 moves in the first guide groove 12, thereby ensuring that the dust collecting plate 15 moves in the installation box 1, and further, an air supply pipe 17 is connected to the dust collecting plate 15, and the air supply pipe 17 extends into the installation box 10, and the storage box An air suction pump 31 is provided in 19 to cooperate with the air pipe 17, and a storage box 19 is provided in the installation box 10 to cooperate with the air pipe 17. The air pipe 17 extends into the storage box 19, and a guide plate 26 is provided in the storage box 19. Second guide rods 25 are symmetrically provided on both sides of the guide plate 26, and a filter plate 24 is provided on the guide plate 26. The gas is filtered by the filter plate 24, and the grinding dust is collected on the filter plate 24. The guide plate 26 is taken out by the second guide rod 25, and the dust is recycled.

[0035] The mounting box 1 is provided with a mounting groove 29 to cooperate with the first guide rod 11, and a fourth control motor 14 is provided on the top of the mounting groove 29. The corresponding mounting groove 29 is driven to rotate by the fourth control motor 14, thereby driving the first guide rod 11 to move up and down, so as to absorb dust according to the surface of the chip 6 at different positions to ensure the cleanliness of the lens surface.

[0036] A support rod 9 is provided at the bottom of the installation box 1 and the installation box 10, and a plurality of universal wheels 8 are provided at the bottom of the support rod 9. The installation box 1 and the installation box 10 are supported by the support rod 9 to ensure the normal operation of the device. At the same time, the universal wheels 8 are provided to enable the entire device to move in space.

[0037] A guide tube 20 is provided at the bottom of the connecting block 21, and the bottom of the guide tube 20 extends to the outside of the installation box 1 to connect to the air supply groove 18. The guide tube 20 is connected to the placement plate 22. In actual use, an external air pump can be connected to generate negative pressure to suck and fix the chip 6 on the placement plate 22 to ensure the stability of the chip 6 when the grinding disc is polished.

[0038] A pair of centering positioning devices 30 are provided in the installation box 1 to cooperate with the wafer 6. The centering positioning devices 30 are used to center the wafer 6 on the placement plate 22 to ensure the accuracy of the subsequent grinding position;

[0039] In actual use, the device is moved to a suitable working position through the universal wheels 8 at the bottom, and the surrounding environment is ensured to be clean and free of obstacles to ensure the smooth progress of the processing process. Check whether the various components of the device are in normal condition, including the wear of the grinding disc 13, whether the connection of each control motor is firm, and the integrity of the cleaning device, etc., turn on the external air pump connected to the guide tube 20 at the bottom of the connecting block 21 to generate negative pressure, and place the wafer 6 on the placement plate 22 on the supporting chassis 7. The negative pressure is used to firmly absorb and fix the wafer 6 to ensure that the wafer 6 will not be displaced during the subsequent grinding process. At this time, a pair of centering positioning devices 30 in the installation box 1 perform a centering operation on the wafer 6 to accurately adjust the position of the wafer 6, laying the foundation for subsequent precise grinding;

[0040] Then, the parameters of the machine during grinding are set. According to the material, size and required grinding accuracy of the wafer 6, the speed of the first control motor 3, the lifting stroke and speed of the third control motor 5 and the lateral movement parameters of the second control motor 4 are set on the control device. The first control motor 3 is started to drive the grinding disc 13 to rotate at a high speed, and the wafer 6 is prepared to be ground.

[0041] In the actual grinding process, the second control motor 4 controls the installation block 27 to move horizontally, and the third control motor 5 controls the connecting rod 2 to move up and down, so as to accurately adjust the position of the grinding disc 13 so that it contacts the edge of the wafer 6, and then the wafer 6 starts to be ground. During the grinding process, the grinding situation is closely observed, and the parameters of each control motor are adjusted in time according to actual needs to ensure the accuracy and quality of the grinding. The dust generated by the grinding will fly in the installation box 1, and the cleaning device starts to work at this time. Synchronously, the suction pump 31 in the storage box 19 in the installation box 10 is started, and the air supply pipe 17 is used to supply air to the storage box 19 in the installation box 10. Suction is generated at the dust collecting plate 15, and the fourth control motor 14 drives the installation slot 29 to rotate, thereby causing the first guide rod 11 to move up and down, and the dust collecting plate 15 moves in the first guide slot 12 accordingly, and dust at different positions in the installation box 1 is sucked, and the gas containing dust enters the storage box 19 through the gas pipe 17, and is filtered by the filter plate 24, and the dust is collected on the filter plate 24, and the gas is discharged. After the grinding work is carried out for a period of time, the guide plate 26 can be taken out of the storage box 19 through the second guide rod 25, and the collected dust can be recycled to ensure the continuous and efficient operation of the cleaning device;

[0042] After the grinding is completed, when the edge grinding of the wafer 6 meets the predetermined process requirements, stop the operation of the first control motor 3, the second control motor 4 and the third control motor 5, stop the grinding disc 13 from rotating and return to the initial position, turn off the external air pump, release the negative pressure adsorption on the wafer 6, carefully take the polished wafer 6 out of the placement plate 22, and place it in the designated storage position to prevent the wafer 6 from being hit or scratched. Perform a comprehensive cleaning and maintenance of the device, check the degree of wear of the grinding disc 13, and replace it if necessary; clean the dust remaining on the dust collection plate 15 and the filter plate 24 to ensure that all components of the device are in good condition and prepare for the next wafer grinding work.

[0043] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A glass wafer edge processing device, comprising a mounting box (1), characterized in that: An installation box (10) is arranged on one side of the installation box (1); a control device is arranged on the side of the installation box (10) close to the installation box (1); the control device comprises an installation block (27); a guide rail (28) is arranged on the installation block (27) away from the installation box (10); a connecting rod (2) is arranged on one side of the guide rail (28); a grinding disc (13) is arranged at the bottom of the connecting rod (2); a first control motor (3) is arranged on the top of the connecting rod (2) in coordination with the grinding disc (13); and an installation motor (2) is arranged on the installation box (1). A plate (16) is provided on the mounting plate (16), a supporting chassis (7) is provided on the supporting chassis (7), a chip (6) is provided on the mounting plate (16), a connecting block (21) is provided at the bottom of the mounting plate (16) to cooperate with it, a second guide groove (23) is provided on one side of the connecting block (21) to cooperate with it, a fourth control motor (14) is provided on one side of the second guide groove (23), a cleaning device is provided in the mounting box (1) to cooperate with the chip (6), and a pair of centering positioning devices (30) are provided in the mounting box (1) to cooperate with the chip (6).

2. A glass wafer edge processing device according to claim 1, characterized in that: The cleaning device comprises a pair of first guide rods (11), a dust collecting plate (15) is arranged between the pair of first guide rods (11), and a first guide groove (12) is provided on the first guide rod (11) to cooperate with the dust collecting plate (15).

3. The glass wafer edge processing device according to claim 1, characterized in that: The installation box (1) is provided with an installation groove (29) in cooperation with the first guide rod (11), and a fourth control motor (14) is provided at the top of the installation groove (29).

4. The glass wafer edge processing device according to claim 1, characterized in that: A third control motor (5) is provided on the mounting block (27) in cooperation with the connecting rod (2), and a second control motor (4) is provided on one side of the mounting block (27) in cooperation with the connecting rod (2).

5. The glass wafer edge processing device according to claim 1, characterized in that: A support rod (9) is arranged at the bottom of the installation box (1) and the installation case (10), and a plurality of universal wheels (8) are arranged at the bottom of the support rod (9).

6. The glass wafer edge processing device according to claim 1, characterized in that: The dust suction plate (15) is connected to an air supply pipe (17), the air supply pipe (17) extends into the installation box (10), a storage box (19) is provided in the installation box (10) in coordination with the air supply pipe (17), the air supply pipe (17) extends into the storage box (19), an air suction pump (31) is provided in the storage box (19) in coordination with the air supply pipe (17), a guide plate (26) is provided in the storage box (19), second guide rods (25) are symmetrically provided on both sides of the guide plate (26), and a filter plate (24) is provided on the guide plate (26).

7. The glass wafer edge processing device according to claim 1, characterized in that: A guide tube (20) is provided at the bottom of the connection block (21), the bottom of the guide tube (20) extends to the outside of the installation box (1) to connect to the gas delivery groove (18), and the guide tube (20) is connected to the placement plate (22).

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