PCB back drill anti-warping cover plate and fitting forming equipment

Abstract

The invention discloses a PCB back drill anti-warping cover plate and a fitting forming device. A hard patch roller and an elastic patch roller are arranged in a fitting manner; the metal sheet discharging roller and the fiber discharging roller are located on the two sides of the hard patch roller and the elastic patch roller respectively. The gluing device is located above the center of the hard patch roller and the center of the elastic patch roller and conducts glue discharging work downwards. And the receiving roller is arranged at the lower ends of the hard patch roller and the elastic patch roller. According to the production line, materials are discharged from the discharging roller, coated with the PEG hot melt adhesive through the gluing device, extruded and attached through the patch roller and finally wound through the receiving roller, the whole process is coherent and efficient, waiting and stagnation between procedures can be effectively avoided, the production cycle is shortened, and the production efficiency is improved. Meanwhile, continuous processing enables the material to be in a stable environment, avoids quality fluctuation, ensures uniform coating and tight fitting of the PEG hot melt adhesive, ensures the consistency and stability of product quality, and improves the overall process level.

Description

Technical Field

[0001] The invention belongs to the technical field of PCB cover plates, and relates to a PCB back-drilling anti-warping cover plate and a bonding and molding device. Background Art

[0002] In the field of printed circuit boards (PCBs), PCB cover plates have many important uses. During the PCB drilling process, the cover plate is tightly covered on top of the production board. On the one hand, it can provide a stable support plane for the drilling operation, effectively preventing the production board from excessive vibration or displacement due to the cutting force of the drill bit during the drilling process, thereby ensuring the accuracy of the drilling position and the quality of the drilling, so that the drilled holes meet the design requirements for aperture, hole position accuracy and other standards. On the other hand, the cover plate can protect the circuits and components on the surface of the production board, prevent foreign objects such as debris and dust generated by drilling from scratching, contamination or short circuit, maintain the electrical performance and physical integrity of the production board, and ensure the reliability and stability of the PCB during subsequent assembly, testing and use, thereby improving the performance and quality of the entire electronic product.

[0003] There are various PCB cover plates and manufacturing methods thereof in the prior art;

[0004] For example, the Chinese invention patent: A cover plate for PCB back drilling and its manufacturing method (201410839756.5) states: Phenolic resin is impregnated on paper and then baked to form a semi-cured sheet, adhesive is applied between the phenolic resin and aluminum foil, and then pressed together to obtain a phenolic cover plate with a single side covered with aluminum foil;

[0005] Chinese invention patent: A multifunctional cover plate for back drilling and through-hole drilling (202310965945.6) states: A complexing solution is applied to react with the aluminum sheet to form a complexing film, and then the coating is applied and baked in an oven at 195-245°C for 2-3 minutes to solidify to form a multifunctional cover plate.

[0006] However, these existing technologies all have many disadvantages. First, the manufacturing process is extremely cumbersome, requiring a large amount of equipment and professional technicians, resulting in high production costs. Secondly, when preparing parts in pieces, a large amount of space and equipment are required for storage and transfer, and when assembling and merging with other parts, materials need to be taken many times. The process is time-consuming and labor-intensive, requires high precision fusion, and is prone to produce defective products. Finally, due to the use of piece-by-piece preparation and step-by-step implementation, it is impossible to achieve continuous, assembly-line, one-piece molding, batch and rapid manufacturing, which seriously affects production efficiency. Summary of the invention

[0007] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0008] A PCB back-drilling anti-warping cover plate comprises: a metal sheet layer and a fiber layer; the metal sheet layer and the fiber layer are bonded by hot-melt adhesive.

[0009] As a further solution of the present invention: the metal sheet layer is made of aluminum foil or copper foil.

[0010] As a further solution of the present invention: the fiber layer is made of paper or polyester fiber.

[0011] As a further solution of the present invention: the hot melt adhesive adopts PEG hot melt adhesive.

[0012] A bonding and forming device for a PCB back-drilling anti-warping cover plate, comprising: a glue coating device, a metal sheet feeding roller, a fiber feeding roller, a hard patch roller, an elastic patch roller and a receiving roller;

[0013] The hard patch roller and the elastic patch roller are arranged in a close fit; the metal sheet unloading roller and the fiber unloading roller are respectively located on both sides of the hard patch roller and the elastic patch roller; the gluing device is located above the center of the hard patch roller and the elastic patch roller, and performs the gluing work downward; the receiving roller is arranged at the lower end of the hard patch roller and the elastic patch roller.

[0014] As a further solution of the present invention: the hard patch roller and the elastic patch roller are arranged in a manner of initial non-external force bonding or pressure bonding.

[0015] As a further solution of the present invention: the hard patch roller adopts a heated roller shaft structure.

[0016] The beneficial effects of the present invention are as follows: the material is discharged from the discharge roller, the PEG hot melt adhesive is coated by the glue coating device, and then the patch roller extrude and fit the material, and finally the material is rolled up by the receiving roller. The whole process is coherent and efficient, which can effectively avoid waiting and stagnation between processes, shorten the production cycle, and improve production efficiency. At the same time, continuous processing keeps the material in a stable environment, avoids quality fluctuations, ensures that the PEG hot melt adhesive is evenly coated and tightly fitted, ensures the consistency and stability of product quality, and improves the overall process level. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the cover plate of the present invention.

[0018] Figure 2 It is a structural schematic diagram of the molding equipment of the present invention. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. It should be understood that the present application is not limited to the example embodiments disclosed herein. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] See also Figures 1-2 In an embodiment of the present invention, a cover plate for preventing PCB back drilling from warping is mainly composed of a metal sheet layer 1 in contact with a drill bit and a fiber layer 3 in contact with a PCB board, and the two are bonded by a hot melt adhesive 2;

[0024] The metal sheet layer 1 is made of aluminum foil or copper foil, which has good strength and rigidity. During the drilling process of the PCB board, it provides a stable support structure for the PCB board, so that during the drilling operation, the PCB board is not easily deformed or displaced due to the impact force of the drilling, thereby ensuring the accuracy of the drilling position; at the same time, it has good thermal conductivity, which can conduct the heat generated during drilling, prevent the PCB board from being locally overheated, and extend the life of the drill bit;

[0025] The fiber layer 3 is made of paper or polyester fiber, which has flexibility and buffering performance during the drilling process of the PCB board, and can better adapt to various processing operations and product shapes; it can also buffer the impact and vibration of drilling, protect the circuits and components, and prevent short circuits during drilling, thereby ensuring the electrical performance of the PCB and improving the yield rate;

[0026] The hot melt adhesive 2 is PEG hot melt adhesive, which has good fluidity and can fully fill the space between the metal sheet layer 1 and the fiber layer 3 to make the two tightly bonded.

[0027] In order to realize the preparation of the above-mentioned PCB back-drilling anti-warping cover plate, the present invention also provides a PCB back-drilling anti-warping cover plate bonding and molding equipment, which includes: a glue coating device 6, a metal sheet discharge roller 4, a fiber discharge roller 10, a hard patch roller 7, an elastic patch roller 8 and a receiving roller 11.

[0028] The hard patch roller 7 and the elastic patch roller 8 are fitted together. The hard patch roller 7 is made of metal, and the elastic patch roller 8 is covered with an elastic material (rubber). This combination of soft and hard can make the metal sheet and the fiber fit tightly under a certain pressure, ensuring that the PEG hot melt adhesive can be evenly distributed between the two, making the bonding between the metal sheet and the fiber after adhesive coating more firm and uniform, thereby improving the quality of the product.

[0029] Furthermore, the hard patch roller 7 and the elastic patch roller 8 can be initially bonded without external force or can be arranged in a pressurized bonding manner by precisely adjusting the bonding pressure according to different product requirements to meet different bonding requirements.

[0030] The metal sheet unloading roller 4 and the fiber unloading roller 10 are located on both sides of the hard patch roller 7 and the elastic patch roller 8, and are used to place the metal sheet material roll 5 and the paper material roll or the polyester fiber roll 9; the metal sheet and the fiber material are separately conveyed to the gap between the hard patch roller 7 and the elastic patch roller 8;

[0031] The glue coating device 6 is located above the center of the hard patch roller 7 and the elastic patch roller 8. A glue box is provided in the glue coating device 6 to store PEG hot melt glue. The glue coating device 6 can discharge glue to the gap between the hard patch roller 7 and the elastic patch roller 8. The hard patch roller 7 and the elastic patch roller 8 are then used to extrude the metal sheet and the fiber so that the two are closely attached after the glue coating.

[0032] The receiving roller 11 is arranged at the lower end of the hard patch roller 7 and the elastic patch roller 8, and is driven by a motor to roll up the laminated composite cover plate to complete the processing.

[0033] Furthermore, when the hot melt adhesive 2 adopts PEG hot melt adhesive, the hard patch roller 7 can cooperate with it by adopting a heated roller structure; during processing, the hard patch roller 7 generates heat to improve the fluidity of the PEG hot melt adhesive, making its distribution more even, thereby enhancing the wettability and bonding effect.

[0034] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "including a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0035] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cover plate for PCB back drilling to prevent warping, characterized in that: include: Metal sheet layer and fiber layer; The metal sheet layer and the fiber layer are bonded by hot melt adhesive.

2. A PCB backdrilling anti-warping cover plate according to claim 1, characterized in that: The metal sheet layer is made of aluminum foil or copper foil.

3. A PCB backdrilling anti-warping cover plate according to claim 1, characterized in that: The fiber layer is made of paper or polyester fiber.

4. A PCB backdrilling anti-warping cover plate according to claim 1, characterized in that: The hot melt adhesive is PEG hot melt adhesive.

5. A bonding and molding device for a PCB back-drilling anti-warping cover plate, used for preparing a PCB back-drilling anti-warping cover plate according to any one of claims 1 to 4, comprising: Gluing device, metal sheet unwinding roller, fiber unwinding roller, hard patch roller, elastic patch roller and receiving roller; The hard patch roller and the elastic patch roller are arranged in a close fit; the metal sheet unloading roller and the fiber unloading roller are respectively located on both sides of the hard patch roller and the elastic patch roller; the gluing device is located above the center of the hard patch roller and the elastic patch roller, and performs the gluing work downward; the receiving roller is arranged at the lower end of the hard patch roller and the elastic patch roller.

6. The bonding and forming equipment for a PCB back-drilled anti-warping cover plate according to claim 5, characterized in that: The hard patch roller and the elastic patch roller are arranged in a manner of initial non-external force bonding or pressure bonding.

7. The bonding and forming equipment for a PCB back-drilled anti-warping cover plate according to claim 5, characterized in that: The hard patch roller adopts a heated roller shaft structure.

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