Directional arrangement device and method for chip-type three-terminal multilayer ceramic filter

Abstract

The present application relates to a directional arrangement device and method for a chip-type three-terminal multilayer ceramic filter, which is configured by manually / equipment shaking / vibrating left and right, front and back so that the chip-type three-terminal multilayer ceramic filter chip CD faces the cut inner electrode surface / EF faces the cover surface, and either side faces the magnetic plate surface, and the CD of the chip-type three-terminal multilayer ceramic filter chip faces the cut inner electrode surface through the magnetic adsorption force of the magnetic plate, and the chip-type three-terminal multilayer ceramic filter chip EF faces the cover surface in contact with the ferromagnetic plate surface is separated from the vibration screen plate vibration screen hole by shaking / vibrating, and the operation is repeated multiple times to make the chip-type three-terminal multilayer ceramic filter chip with CD facing the cut inner electrode surface and in contact with the magnetic plate surface arranged in the vibration screen hole of the vibration screen plate, and make the CD of the chip-type three-terminal multilayer ceramic filter chip face the cut inner electrode surface in the up and down direction, thereby realizing the directional arrangement of chip-type three-terminal multilayer ceramic filter chips with uniform width and thickness, and improving the arrangement accuracy and production efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of slurry dipping of a chip-type three-terminal multilayer ceramic filter, and in particular to a directional arrangement device and method for a chip-type three-terminal multilayer ceramic filter. Background Art

[0002] With the rapid development of electronic information technology, multi-layer ceramic capacitors (MLCC), as one of the three major electronic components, are constantly developing in the direction of miniaturization, high capacitance, and high frequency. In various electronic circuit applications, a variety of multi-layer ceramic filters (MLCF) with a three-terminal appearance structure have developed rapidly. According to the internal structure, they include T-type multi-layer LC filter, π-type multi-layer LC filter, and C-type multi-layer filter (i.e., three-terminal capacitor filter). Compared with MLCC, three-terminal capacitor filters have better high-frequency characteristics, lower equivalent series inductance (ESL), and less mounting area, and are gradually replacing some high-capacitance MLCCs in some applications.

[0003] Both MLCF and MLCC are made of multi-layer dielectric films that are stacked in an interlaced manner. In addition to leading out the internal electrodes in the length direction of the chip, the internal electrodes are also led out in the width direction. By setting up the ground electrode, the current can flow in from both ends of the MLCF and flow out from the middle ground electrode, thereby shortening the current path by half. At the same time, because the current can flow out from the four electrode directions and the existence of self-inductance, the equivalent series inductance (ESL) of the MLCF can be greatly reduced.

[0004] The MLCF ground electrode dipping operation is usually carried out by arranging the MLCF ceramic chip in an array through a SUS carrier, a JIG carrier, a thin rubber plate and other tooling, so that the electrode surface to be dipped in the slurry is exposed at the waist. The ground electrode is coated on the electrode surface of the chip through a specific dipping process, and then the ground electrode on the other side is silver-dipped and dried, thereby obtaining an MLCF chip coated with a ground external electrode.

[0005] Usually, for some MLCFs ​​with inconsistent width and thickness, the ground electrode is usually made through physical methods, that is, through processing high-precision tooling, using the size difference of the chip in the width and thickness directions to identify and control the placement direction of the chip. After directional identification of the chip in the width and thickness directions and array arrangement, it can be ensured that when the chip is loaded by SUS carriers, JIG carriers, thin rubber plates and other tooling, the electrode surface in the thickness direction is exposed at the waist. However, for some MLCFs ​​with consistent width and thickness, there is no dimensional deviation in the width and thickness directions, and it is impossible to identify, orient and arrange the width and thickness directions through simple physical methods. It can only rely on manual visual identification and arrangement to ensure that the electrode surface is exposed at the waist when it is loaded by the tooling, which makes the arrangement time long, the efficiency low, the production cost high, and it is difficult to achieve mass production. Summary of the invention

[0006] Based on this, the present application provides a directional arrangement device and a directional arrangement method for a chip-type three-terminal multilayer ceramic filter that can solve the above-mentioned technical problems, and can directional arrange MLCF chips with consistent width and thickness, thereby improving production efficiency and reducing production costs.

[0007] The above-mentioned purpose of the present application is achieved through the following technical solutions:

[0008] In a first aspect, the present application provides a directional arrangement device for a chip-type three-terminal multilayer ceramic filter, wherein the width and thickness of the chip-type three-terminal multilayer ceramic filter are the same, and the inner electrodes are exposed on both sides in the thickness direction; the device comprises:

[0009] A vibration screen plate, the vibration screen plate having an upper surface, the upper surface being arranged with a plurality of vibration screen holes that penetrate the vibration screen plate in an array, the lateral dimensions of the vibration screen holes being larger than the lateral dimensions of the chip-type three-terminal multilayer ceramic filter, so that the chip-type three-terminal multilayer ceramic filter can enter the vibration screen holes laterally from the upper surface, or be moved out from the vibration screen holes to the upper surface;

[0010] A magnetic plate, the magnetic plate is arranged below the vibration screen plate, the magnetic plate supports the chip-type three-terminal multilayer ceramic filter located in the vibration screen hole, and applies a magnetic adsorption force to the chip-type three-terminal multilayer ceramic filter to keep it in the vibration screen hole;

[0011] The loading plate comprises a loading part, and the loading part is used for loading a chip-type three-terminal multilayer ceramic filter laterally located in the vibration screen hole from above.

[0012] In a second aspect, the present application further provides a method for directional arrangement of a chip-type three-terminal multilayer ceramic filter, which is performed by using the directional arrangement device for the chip-type three-terminal multilayer ceramic filter described in the first aspect of the present application, and the method comprises:

[0013] S01: Obtain a chip-type three-terminal multilayer ceramic filter, wherein the length, width and thickness of the chip-type three-terminal multilayer ceramic filter are a1, b1 and c1 respectively, wherein a1>b1=c1, and the inner electrodes are exposed on two side surfaces in the thickness direction of the chip-type three-terminal multilayer ceramic filter;

[0014] S02: placing the chip-type three-terminal multilayer ceramic filter on the upper surface of the vibration screen plate;

[0015] S03: allowing the chip-type three-terminal multilayer ceramic filter to enter the vibration screen hole from the upper surface of the vibration screen plate, so that the chip-type three-terminal multilayer ceramic filter is horizontally placed in the vibration screen hole in a manner including a first state or a second state, wherein the first state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the thickness, and the second state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the width;

[0016] S04: vibrating the vibration screen plate and the magnetic plate up and down, so that the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state is moved out of the vibration screen hole from above to the upper surface of the vibration screen plate;

[0017] S05: Repeat steps S03-S04 multiple times;

[0018] S06: moving the loading plate to above the vibration screen plate, so that the loading part loads the chip-type three-terminal multilayer ceramic filter in the first state laterally located in the vibration screen hole from above.

[0019] This application has the following beneficial effects:

[0020] The directional arrangement device and directional arrangement method of the chip three-terminal multilayer ceramic filter in the embodiment of the present application are configured to manually / equipment shake / vibrate left and right, front and back so that the chip three-terminal multilayer ceramic filter chip CD faces the cut inner electrode surface / EF faces the cover surface or any one side faces the magnetic plate surface, and the CD of the chip three-terminal multilayer ceramic filter chip faces the cut inner electrode surface through the magnetic adsorption force of the magnetic plate, and the chip three-terminal multilayer ceramic filter chip EF faces the cover surface in contact with the ferromagnetic plate surface is separated from the vibration screen hole of the vibration screen plate by shaking / vibrating, and the operation is repeated multiple times to arrange the chip three-terminal multilayer ceramic filter chip with CD facing the cut inner electrode surface and in contact with the magnetic plate surface in full vibration screen hole of the vibration screen plate, so that the CD of the chip three-terminal multilayer ceramic filter chip faces the cut inner electrode surface in the up and down direction, thereby realizing the directional arrangement of chip three-terminal multilayer ceramic filter chips with uniform width and thickness, and improving the arrangement accuracy and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1is a schematic structural diagram of a chip-type three-terminal multilayer ceramic filter with uniform width and thickness in an exemplary embodiment;

[0022] Figure 2 is a schematic structural diagram of a vibrating screen plate in an exemplary embodiment;

[0023] Figure 3 is a schematic structural diagram of a vibrating screen hole in an exemplary embodiment;

[0024] Figure 4 is a schematic structural diagram of a magnetic plate in an exemplary embodiment;

[0025] Figure 5 is a schematic structural diagram of a loading plate in an exemplary embodiment;

[0026] Figure 6-9 is a schematic diagram of the working process of a directional arrangement device for a chip-type three-terminal multilayer ceramic filter in an exemplary embodiment;

[0027] Figure 10-11 FIG. 4 is a schematic diagram of the working process of a directional arrangement device for a chip-type three-terminal multilayer ceramic filter in an exemplary embodiment.

[0028] Description of Figure Numbers:

[0029] 100. Directional arrangement device for chip-type three-terminal multilayer ceramic filter;

[0030] 110, vibrating screen plate; 111, vibrating screen hole; 1111, chamfer; 112, upper surface;

[0031] 120. Magnetic plate; 121. Ejector hole;

[0032] 130. loading plate; 131. loading hole;

[0033] 140. Lifting assembly; 141. Base plate; 142. Ejector pin;

[0034] 200. Chip-type three-terminal multilayer ceramic filter. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0036] In addition, the terms "first" and "first" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "first" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present application belongs. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0038] In response to the technical problems in the background technology, the present application provides a directional arrangement device and a directional arrangement method for a chip-type three-terminal multilayer ceramic filter, which can be used to directional arrange chip-type three-terminal multilayer ceramic filters with consistent width and thickness in batches according to a specified width and thickness direction, so that the exposed waist grounding electrode of the chip-type three-terminal multilayer ceramic filter (hereinafter referred to as MLCF chip) with consistent width and thickness can be quickly loaded and the slurry dipping operation can be performed, thereby improving production efficiency and reducing production costs.

[0039] like Figure 1 As shown in FIG. 2 , it is a schematic diagram of the structure of a MLCF chip 200 with uniform width and thickness, wherein the length, width and thickness (height) are a1, b1 and c1 respectively, wherein a1>b1=c1. The production process of MLCF chips generally includes batching, casting, printing, lamination, cutting, debonding, sintering, and end-capping. Figure 1 The product shown is a semi-finished ceramic product after sintering and chamfering. Its two ends in the length direction are AB facing the inner electrode surface, exposing the end electrode; its two ends in the thickness direction are CD facing the cut inner electrode surface, exposing the ground electrode with a waist; its two ends in the width direction are EF facing the cover surface, without exposing the inner electrode, and the inner electrode inside is parallel to Figure 1 The height direction setting.

[0040] Capping is the process of applying slurry to the inner electrode surface of the ceramic semi-finished product AB and the cut inner electrode surface CD after sintering and chamfering, so as to connect the electrodes exposed on the same side to form an external electrode. Before performing the capping process of the waist grounding electrode, the MLCF chip 200 needs to be arranged in an array in a uniform arrangement so that the side of the waist with the exposed inner electrode is uniformly oriented, for example, downward.

[0041] In the conventional technology such as patent number CN117116676A, a through hole for loading MLCF chip is provided on the carrier board, and the MLCF chip is placed in a manner as shown in FIG. Figure 1 After being arranged in an array in the direction of the through hole, they are loaded into the through hole in batches, so that the CD faces the cut inner electrode surface toward the outside of the through hole, and the slurry dipping operation can be performed on the CD facing the cut inner electrode surface.

[0042] The traditional technology adjusts the MLCF chip with inconsistent width and thickness to Figure 1 The arrangement method can be achieved through high-precision tooling, using the size difference of the chip in the width and thickness direction to identify and control the placement direction of the chip, and perform directional identification of the chip width and thickness direction and arrange it in an array. However, for MLCF chips with the same width and thickness, traditional technology cannot arrange them.

[0043] In view of this technical problem, the embodiment of the present application provides a directional arrangement device 100 and a directional arrangement method for a chip-type three-terminal multilayer ceramic filter, such as Figure 2-9 As shown, in one embodiment, the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter includes a vibration screen plate 110 , a magnetic plate 120 and a loading plate 130 .

[0044] like Figure 2 As shown, the vibration screen plate 110 has an upper surface 112, and a plurality of vibration screen holes 111 are arranged through the upper surface 112 of the vibration screen plate 110. The vibration screen holes 111 are arranged in an array, and each vibration screen hole 111 can allow one of the MLCF chips to enter from the surface of the vibration screen plate 110 and be placed horizontally in a first state or a second state, wherein the first state is that the MLCF chip is in the up and down direction along both sides of the thickness, for example Figure 1 That is, the MLCF chip is placed in the first state, with the ground electrode at its waist exposed in the up-down direction; the second state is that the ground electrode is exposed in the up-down direction along both sides of its width. Figure 1 The MLCF chip has its EF facing the cover surface on the upper and lower sides, and the ground electrode at its waist is exposed on the left and right sides.

[0045] In this embodiment, the vibration screen hole 111 can be a rectangular hole, a circular hole or a special-shaped hole, and its lateral dimension is larger than the lateral dimension of the MLCF chip, so that the MLCF chip can enter the vibration screen hole 111 laterally from the upper surface 112, or be moved out of the vibration screen hole 111 to the upper surface 112. In this embodiment, the cross-sectional area of ​​each part of the vibration screen hole 111 is larger than the cross-sectional area of ​​the MLCF chip. If the vibration screen hole 111 is a rectangular hole, the length and width of the vibration screen hole 111 are larger than the length and thickness (width) of the MLCF chip. If the vibration screen hole 111 is a circular hole, its diameter is not less than the diagonal length of the lateral dimension of the MLCF chip, so that an MLCF chip can enter from the top and be placed laterally in the vibration screen hole 111.

[0046] The magnetic plate 120 is coated with a magnetic material or has embedded magnetic elements, and can absorb magnets or magnetic objects. It can be a permanent magnetic material or an electromagnetic material. The magnetic plate 120 is arranged below the vibration screen plate 110. The coverage area of ​​the magnetic plate 120 is larger than the coverage area of ​​the vibration screen hole 111, so that the MLCF chip located in the vibration screen hole 111 can be supported from below, and a magnetic adsorption force is applied to the MLCF chip to keep it in the vibration screen hole 111. Preferably, the magnetic plate 120 is configured to have approximately the same magnetic adsorption force on the MLCF chip in each vibration screen hole 111 in different areas. Specifically, the area of ​​the magnetic plate 120 can be set to be larger, or the magnetic field on the upper surface 112 of the magnetic plate 120 can be set to be more uniform.

[0047] In a conventional chip-type multilayer ceramic capacitor, the inner electrode is generally made of metal material, and the external magnet has a small magnetic attraction to it. In the embodiment of the present application, in order to increase the magnetic attraction, magnetic materials such as iron, nickel or cobalt can be added to the inner electrode to make the inner electrode have a stronger magnetic property. For an ordinary chip-type multilayer ceramic capacitor, the magnetism on both sides of the width parallel to the arrangement direction of the inner electrode is greater than the magnetism on both sides of the height, corresponding to Figure 1 The magnetism of the EF surface is greater than that of the CD surface. However, the applicant has found that in a chip-type three-terminal multilayer ceramic capacitor, the magnetism of the CD surface facing the cut inner electrode is greater than that of the EF surface facing the cover sheet, so that the magnetic adsorption force of the magnetic plate 120 on the CD surface facing the cut inner electrode is greater than the magnetic adsorption force of the EF surface facing the cover sheet.

[0048] The loading plate 130 includes a loading portion. The loading plate 130 can be moved above the vibration screen plate 110 . The loading portion is used to load the MLCF chips laterally located in the vibration screen holes 111 .

[0049] The loading plate 130 of this embodiment is used to load the MLCF chip placed horizontally in the vibration screen hole 111 in the first state from above through the loading part, and then perform the external electrode slurry dipping operation on the chip with the CD facing the cut inner electrode surface. Therefore, the loading part is used to load the MLCF chip in a manner of exposing the CD facing the cut inner electrode surface. Specifically, the loading part can be a hole or groove formed on the loading plate 130 corresponding to the vibration screen hole 111, or an adhesive plane set on the loading plate 130.

[0050] The working process of the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter of this embodiment is as follows:

[0051] Step 1, place a plurality of MLCF chips of uniform width and thickness on the upper surface 112 of the vibrating screen plate 110, at which time the MLCF chips are located on the surface of the vibrating screen plate 110 in a horizontal or vertical manner, and the vibrating screen plate 110 can be horizontally vibrated left and right or swept with an external tool, so that the MLCF chips are all placed horizontally on the upper surface 112 of the vibrating screen plate 110; Step 2, vibrate the vibrating screen plate 110 horizontally, so that the MLCF chips enter the vibrating screen hole 111, and are placed horizontally in the vibrating screen hole 111, at which time part of the MLCF chips are placed horizontally in the first state, and part of them are placed horizontally in the second state; Step 3, vibrate the vibrating screen plate 110 up and down at a predetermined frequency 0 and the magnetic plate 120, so that the MLCF chip in the second state which is placed horizontally in the vibration screen hole 111 overcomes the magnetic adsorption force of the magnetic plate 120, is moved out of the vibration screen hole 111 from above the vibration screen hole 111 and moves to the upper surface 112 of the vibration screen plate 110, while the MLCF chip placed in the first state is retained in the vibration screen hole 111 because the magnetic adsorption force plus the gravity force is greater than the vibration force; repeat step 3 multiple times, so that the MLCF chips in the vibration screen hole 111 are all placed horizontally in the first state; step 4, move the loading plate 130 to above the vibration screen plate 110, and load the MLCF chip which is located horizontally in the vibration screen hole 111 in the first state through the loading part.

[0052] In this embodiment, for chip-type three-terminal multilayer ceramic filters of different specifications and models with consistent width and thickness, it is necessary to configure the corresponding vibration frequency and / or magnetic force in advance, adsorb with a predetermined magnetic force, and vibrate at a predetermined vibration frequency, so that the MLCF chip placed in the second state can be vibrated out of the vibration screen hole 111, and the MLCF chip placed in the first state will not be vibrated out of the vibration screen hole 111. The specific vibration frequency or magnetic force can be obtained through experiments, or obtained through calculations, and verified through experiments.

[0053] In the embodiment of the present application, after the MLCF chip is loaded in the loading part, the chip in the loading plate 130 is leveled, and a grounded external electrode can be prepared on the CD of the MLCF chip on the loading plate 130 facing the cut internal electrode surface.

[0054] The directional arrangement device of the chip three-terminal multilayer ceramic filter in the embodiment of the present application makes the chip three-terminal multilayer ceramic filter chip CD face the cut inner electrode surface / EF face the cover surface or any one side face the magnetic plate surface by manual / equipment shaking / vibrating left and right and front and back, and adsorbs the chip three-terminal multilayer ceramic filter chip CD facing the cut inner electrode surface by the magnetic adsorption force of the magnetic plate, and separates the chip three-terminal multilayer ceramic filter chip EF facing the cover surface in contact with the ferromagnetic plate surface out of the vibration screen hole of the vibration screen plate by shaking / vibrating, and repeats the operation multiple times to make the chip three-terminal multilayer ceramic filter chip with CD facing the cut inner electrode surface and in contact with the magnetic plate surface arranged in the vibration screen hole of the vibration screen plate, and make the CD of the chip three-terminal multilayer ceramic filter chip face the cut inner electrode surface in the up and down direction, thereby realizing the directional arrangement of chip three-terminal multilayer ceramic filter chips with uniform width and thickness, and improving the arrangement accuracy and production efficiency.

[0055] In the embodiment of the present application, the horizontal vibration of the sieve plate 110 in step 2 and the up and down vibration of the sieve plate 110 and the magnetic plate 120 at a predetermined frequency in step 3 can be completed manually or automatically by a vibration mechanism.

[0056] In a preferred embodiment, the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter also includes a first vibration mechanism, which is connected to the vibration screen plate 110 and the magnetic plate 120, and the first vibration mechanism drives the vibration screen plate 110 and the magnetic plate 120 to vibrate up and down together at a set frequency.

[0057] Preferably, a second vibration mechanism is further included, the second vibration mechanism is connected to the vibration screen plate 110 and the magnetic plate 120, and the second vibration mechanism drives the vibration screen plate 110 and the magnetic plate 120 to vibrate horizontally together at a set frequency.

[0058] The first vibration mechanism and the second vibration mechanism may be implemented by the same mechanism or by different vibration mechanisms.

[0059] In one embodiment, if Figure 2-3 As shown, in order to facilitate loading of the loading plate 130, the upper end of the MLCF chip needs to expose the vibration screen hole 111 during loading, but this requires that the thickness of the vibration screen plate 110 be made shallower and smaller than the width or thickness of the MLCF chip, thereby causing the vibration screen plate 110 to vibrate horizontally, so that when the MLCF chip enters the vibration screen hole 111, the MLCF chip is easier to detach from the vibration screen hole 111, and the MLCF chip placed in the first state is also easily vibrated out of the vibration screen hole 111, and the accuracy requirements for the vibration frequency and the magnetic adsorption force are also higher.

[0060] To solve this problem, in this embodiment, Figure 6-8As shown, the thickness of the vibration plate 110 is less than the thickness of the chip-type three-terminal multilayer ceramic filter, and the magnetic plate 120 has a first position close to the vibration plate 110 and a second position away from the vibration plate 110. Figure 6-7 As shown, corresponding to the above steps 2-3, when the magnetic plate 120 is located at the second position, there is a spacing distance between the magnetic plate 120 and the vibration screen plate 110, and the spacing distance is smaller than the width or thickness of the MLCF chip, so that the MLCF chip located in the vibration screen hole 111 will not be separated from the vibration screen hole 111 from below. Figure 8 As shown, in the above step 4, the magnetic plate 120 is located at the first position close to the bottom of the vibration screen plate 110. Figure 8 In the process, the magnetic plate 120 moves upward to be close to the bottom of the vibration screen plate 110, and at the same time, the MLCF chip is lifted upward so that its upper end is exposed outside the vibration screen hole 111, so as to facilitate loading on the loading plate 130.

[0061] In this embodiment, the magnetic plate 120 is configured to be movable, and the thickness of the vibration screen plate 110 is less than that of the MLCF, so that the wide and thick consistent chip-type three-terminal multilayer ceramic filter chip can be oriented and arranged efficiently.

[0062] In a preferred embodiment, the thickness of the vibration screen plate 110 is 2 / 3 to 3 / 4 of the width (thickness) of the chip-type three-terminal multilayer ceramic filter, and the spacing distance is 1 / 4 to 1 / 3 of the width (thickness) of the chip-type three-terminal multilayer ceramic filter.

[0063] In other embodiments, the thickness of the vibration screen plate 110 may also be close to or even slightly greater than the thickness of the chip-type three-terminal multilayer ceramic filter. The magnetic plate 120 is arranged close to the bottom of the vibration screen plate 110, and the MLCF chip is pushed upward by other external lifting parts to expose the vibration screen hole 111.

[0064] like Figure 10-11 As shown, specifically, a plurality of ejector pin holes 121 are provided on the magnetic plate 120, and the ejector pin holes 121 correspond to the vibration screen holes 111 one by one;

[0065] The directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter of this embodiment also includes a lifting component 140, which includes a substrate 141 and a plurality of ejector pins 142 arranged on the substrate 141, and the ejector pins 142 correspond to the ejector pin holes 121 one by one; the substrate 141 is movably arranged below the magnetic plate 120 up and down, and the substrate 141 can be moved to a distance from the magnetic plate 120, or close to the magnetic plate 120, so as to drive the ejector pins 142 to pass through the ejector pin holes 121 and then lift up the MLCF chip located in the vibration screen hole 111.

[0066] exist Fig.10 In the above steps 2-3, the ejector pin 142 does not pass through the ejector pin hole 121. Fig.11 In step 4 above, the loading plate 130 is moved above the vibration screen plate 110, and the substrate 141 is moved upward, pushing up the MLCF chip so that the upper part thereof is exposed to the vibration screen hole 111.

[0067] Preferably, the thickness of the vibration screen plate 110 is 9 / 10 to 11 / 10 of the width (thickness) of the MLCF chip.

[0068] In this embodiment, the magnetic plate 120 is fixedly arranged at the bottom of the vibration screen plate 110, and a lifting assembly 140 is additionally provided, so that the directional arrangement of the three-terminal multilayer ceramic filter chips with uniform width and thickness can be efficiently achieved while facilitating loading.

[0069] In order to make the arrangement direction of the MLCF chips placed horizontally in the first state in each positioning hole the same, in a preferred example, Figure 2-3 As shown, the vibration screen holes 111 are rectangular holes, and the arrangement direction of each vibration screen hole 111 is the same.

[0070] At the same time, considering the condition of neat loading, in order to facilitate the MLCF chip to enter or be moved out of the vibration screen hole 111, the length and width of the vibration screen hole 111 are respectively 0.01 to 0.1 mm larger than the length and width of the chip-type three-terminal multilayer ceramic filter.

[0071] In a preferred embodiment, Figure 8 , 9 As shown in Figure 11, the loading portion includes a plurality of loading holes 131 corresponding to the vibration screen holes 111. The loading holes 131 are also rectangular holes corresponding to the vibration screen holes 111, and are arranged in the same direction. The size of the loading holes 131 is smaller than the size of the MLCF chip. The loading holes 131 are used to load the MLCF chip that is horizontally placed in the vibration screen holes 111 and partially exposed from the vibration screen holes 111 from above. In this embodiment, the size of the vibration screen holes 111 is larger than the size of the MLCF chip, and the size of the loading holes 131 is slightly smaller than the size of the MLCF chip so that the MLCF chip will not fall off. In other examples, the loading holes 131 are not limited to square, and can be round or special-shaped holes corresponding to the vibration screen holes 111.

[0072] Preferably, the length and width of the loading hole 131 are 0.01-0.08 mm smaller than the length and width of the MLCF chip.

[0073] To facilitate the MLCF chip to fall into the vibration screen hole 111, Figure 3 As shown, the upper edge of the vibration screen hole 111 is provided with a chamfer 1111. Preferably, the chamfer 1111 is an oblique chamfer 1111 of 30 to 45 degrees.

[0074] exist Figure 8 and Fig.11In the example, since the size of the loading hole 131 is smaller than the size of the MLCF chip, step 4 is to first move the loading plate 130 to above the vibration screen plate 110 so that the loading hole 131 corresponds to the vibration screen hole 111 one by one. At this time, the magnetic plate 120 is moved upward, or the substrate 141 is moved upward, so that the bottom of the MLCF chip is subjected to an upward extrusion force and enters the loading hole 131 smaller than the size of the MLCF chip from the bottom to achieve loading.

[0075] In a specific embodiment, referring to Figure 6-9 , a chip-type three-terminal multilayer ceramic filter chip directional arrangement device realizes the automatic arrangement of MLCF chips through the following steps:

[0076] Step 1: Assemble the vibration screen plate 110 and the magnetic plate 120 together at an interval of 1 / 4 to 1 / 3 of the width / thickness of the MLCF chip, with the vibration screen hole 111 having the chamfer 1111 facing upwards.

[0077] Step 2: Place the MLCF chip on the surface of the vibration screen plate 110 , with any end face of the MLCF chip randomly facing the upper surface 112 of the vibration screen plate 110 .

[0078] Step three: Use manual / vibration mechanism to shake / vibrate the MLCF chip left and right and front and back to make it fall into the vibration screen hole 111, and either the CD facing the cut inner electrode surface / EF facing the cover surface faces the magnetic plate 120 surface, and use the magnetic adsorption force of the magnetic plate 120 to adsorb the MLCF chip's CD facing the cut inner electrode surface, and use shaking / vibration to separate the MLCF chip with the EF facing the cover surface in contact with the magnetic plate 120 surface out of the vibration screen hole 111 of the vibration screen plate 110, repeat the operation for more than N times, so that the MLCF chips with CD facing the cut inner electrode surface and in contact with the magnetic plate 120 surface are arranged in the vibration screen hole 111 of the vibration screen plate 110, and all the MLCF chips with CD facing the cut inner electrode surface face upwards.

[0079] Step 4: Combine the loading plate 130 with the vibration screen plate 110 which is fully filled with MLCF chips, so that the MLCF chips are aligned with the center lines of the loading holes 131 of the loading plate 130 or are in contact with and adhered to the adhesive surface of the loading plate 130 .

[0080] Step 5: Push the magnetic plate 120 toward the vibration screen plate 110, so that the MLCF chip in the vibration screen hole 111 of the vibration screen plate 110 is pushed out of the vibration screen hole 111 of the vibration screen plate 110, and the MLCF chip in the vibration screen hole 111 of the vibration screen plate 110 is pushed into the loading hole 131 of the loading plate 130 / firmly adhered to the adhesive surface of the loading plate 130.

[0081] Step 6: Separate and remove the loading plate 130 holding the MLCF chip, flatten the MLCF chip in the loading plate 130, and prepare a grounded external electrode on the CD of the MLCF chip on the loading plate 130 facing the cut inner electrode surface. The punch passes through the loading hole 131 of the loading plate 130 to push the MLCF chip to the other direction of the loading plate 130, and prepare a grounded external electrode on the CD of the MLCF chip facing the cut inner electrode surface.

[0082] In this embodiment, when the vibration screen plate 110 is combined with the magnetic plate 120, the MLCF chip can be easily introduced into the vibration screen hole 111 through horizontal vibration. Since the chip has an inner electrode exposed on the surface in the thickness direction to form a ground electrode, there is a difference in the magnetism of the chip in the width direction and the thickness direction, and the magnetism of the electrode surface exposed in the thickness direction is greater than that in the width direction. By adjusting the vibration frequency of the device and the magnetic size of the magnetic plate 120, the surface of the chip with the inner electrode exposed is facing down and adsorbed by the magnetic plate 120, while the width surface without the inner electrode exposed is vibrated out by the vibration function due to the small magnetic attraction. Repeated vibration and magnetic adsorption are coordinated to achieve the vertical directional arrangement of all the surfaces with the inner electrode exposed. When the loading plate 130 is combined with the vibration screen plate 110, the chip in the vibration screen hole 111 of the vibration screen plate 110 can be transferred to the vibration screen hole 111 of the loading plate 130 or adhered to the adhesive surface of the loading plate 130 by reversing / stamping.

[0083] The present application also provides a method for directional arrangement of a chip-type three-terminal multilayer ceramic filter, which is arranged using the above-mentioned directional arrangement device of the chip-type three-terminal multilayer ceramic filter. In one embodiment, the method includes the following steps:

[0084] S01: Obtain a chip-type three-terminal multilayer ceramic filter, wherein the length, width and thickness of the chip-type three-terminal multilayer ceramic filter are a1, b1 and c1 respectively, wherein a1>b1=c1, and the inner electrodes are exposed on two side surfaces in the thickness direction of the chip-type three-terminal multilayer ceramic filter;

[0085] S02: placing the chip-type three-terminal multilayer ceramic filter on the upper surface of the vibration screen plate;

[0086] S03: allowing the chip-type three-terminal multilayer ceramic filter to enter the vibration screen hole from the upper surface of the vibration screen plate, so that the chip-type three-terminal multilayer ceramic filter is horizontally placed in the vibration screen hole in a manner including a first state or a second state, wherein the first state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the thickness, and the second state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the width;

[0087] S04: vibrating the vibration screen plate and the magnetic plate up and down, so that the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state is moved out of the vibration screen hole from above to the upper surface of the vibration screen plate;

[0088] S05: Repeat steps S03-S04 multiple times;

[0089] S06: moving the loading plate to above the vibration screen plate, so that the loading part loads the chip-type three-terminal multilayer ceramic filter in the first state laterally located in the vibration screen hole from above.

[0090] In a preferred embodiment, the thickness of the vibration screen plate is less than the thickness of the chip-type three-terminal multilayer ceramic filter;

[0091] The magnetic plate has a first position close to the bottom of the vibration screen plate and a second position away from the bottom of the vibration screen plate, and the second position is a spacing distance between the magnetic plate and the vibration screen plate, and the spacing distance is less than the thickness of the chip-type three-terminal multilayer ceramic filter;

[0092] After the loading plate is moved to above the vibrating plate in step S06, the following steps are also included:

[0093] The magnetic plate is moved from the second position to the first position.

[0094] In a preferred embodiment, the magnetic plate is arranged close to the bottom of the vibrating screen plate;

[0095] The magnetic plate is provided with a plurality of ejector pin holes, and the ejector pin holes correspond one to one with the vibration screen holes;

[0096] The device also includes a lifting assembly, which includes a substrate and a plurality of ejector pins arranged on the substrate, wherein the ejector pins correspond to the ejector pin holes one by one; the substrate is used to drive the ejector pins to pass through the ejector pin holes to lift up the chip-type three-terminal multilayer ceramic filter located in the vibration screen hole;

[0097] After the loading plate is moved to above the vibrating plate in step S06, the following steps are also included:

[0098] The substrate is driven to move upward, and the ejector pin passes through the ejector pin hole to lift up the chip-type three-terminal multilayer ceramic filter located in the vibration screen hole, so that the chip-type three-terminal multilayer ceramic filter is exposed on the upper surface of the vibration screen, or the portion of the chip-type three-terminal multilayer ceramic filter exposed on the upper surface of the vibration screen is increased.

[0099] In this embodiment, the order in which the steps are described does not constitute a limitation on the order in which the steps are executed, and changes in the order within a feasible range are still within the protection scope of this application.

[0100] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0101] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims, and the description may be used to interpret the contents of the claims.

Claims

1. A directional arrangement device for a chip-type three-terminal multilayer ceramic filter, wherein the width and thickness of the chip-type three-terminal multilayer ceramic filter are the same, and the inner electrodes are exposed on both sides of the thickness direction; characterized in that: include: A vibration screen plate, the vibration screen plate having an upper surface, the upper surface being arranged with a plurality of vibration screen holes that penetrate the vibration screen plate in an array, the lateral dimensions of the vibration screen holes being larger than the lateral dimensions of the chip-type three-terminal multilayer ceramic filter, so that the chip-type three-terminal multilayer ceramic filter can enter the vibration screen holes laterally from the upper surface, or be moved out from the vibration screen holes to the upper surface; A magnetic plate, the magnetic plate is arranged below the vibration screen plate, the magnetic plate supports the chip-type three-terminal multilayer ceramic filter located in the vibration screen hole, and applies a magnetic adsorption force to the chip-type three-terminal multilayer ceramic filter to keep it in the vibration screen hole; A loading plate includes a loading portion, and the loading portion is used to load a chip-type three-terminal multilayer ceramic filter laterally located in the vibration screen hole from above.

2. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: Also includes: The first vibration mechanism is connected with the vibration screen plate and the magnetic plate, and the first vibration mechanism drives the vibration screen plate and the magnetic plate to vibrate up and down together at a set frequency.

3. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 1 or 2, characterized in that: The thickness of the vibration screen plate is less than the thickness of the chip-type three-terminal multilayer ceramic filter; The magnetic plate has a first position close to the bottom of the vibration screen plate and a second position away from the bottom of the vibration screen plate. The second position is a spacing distance between the magnetic plate and the vibration screen plate, and the spacing distance is less than the thickness of the chip-type three-terminal multilayer ceramic filter.

4. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 3, characterized in that: The thickness of the vibration screen plate is 2 / 3 to 3 / 4 of the thickness of the chip-type three-terminal multilayer ceramic filter, and the spacing distance is 1 / 4 to 1 / 3 of the thickness of the chip-type three-terminal multilayer ceramic filter.

5. The directional arrangement device of a chip-type three-terminal multilayer ceramic filter according to claim 1 or 2, characterized in that: The magnetic plate is arranged close to the bottom of the vibrating screen plate; The magnetic plate is provided with a plurality of ejector pin holes, and the ejector pin holes correspond one to one with the vibration screen holes; The device also includes a lifting component, which includes a substrate and a plurality of ejector pins arranged on the substrate, and the ejector pins correspond to the ejector pin holes one by one; the substrate is used to drive the ejector pins to pass through the ejector pin holes, and lift up the chip-type three-terminal multilayer ceramic filter located in the vibration screen hole, so that the chip-type three-terminal multilayer ceramic filter is exposed on the upper surface of the vibration screen plate, or the portion of the chip-type three-terminal multilayer ceramic filter exposed on the upper surface of the vibration screen is increased.

6. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 5, characterized in that: The thickness of the vibration screen plate is 9 / 10 to 11 / 10 of the thickness of the chip-type three-terminal multilayer ceramic filter.

7. The directional arrangement device for a chip-type three-terminal multilayer ceramic filter according to claim 1 or 2, characterized in that: The vibration screen holes are rectangular holes, each of the vibration screen holes is arranged in the same direction, and the length and width of the vibration screen holes are respectively 0.01 to 0.1 mm larger than the length and width of the chip-type three-terminal multilayer ceramic filter.

8. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 7, characterized in that: The loading part includes a plurality of loading holes corresponding to the vibration screen holes one by one, the loading holes are rectangular holes, and the length and width of the loading holes are 0.01 to 0.08 mm smaller than the length and width of the chip-type three-terminal multilayer ceramic filter.

9. The directional arrangement device of a chip-type three-terminal multilayer ceramic filter according to claim 7, characterized in that: The upper edges of the vibration screen holes are provided with chamfers.

10. The directional arrangement device of a chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: Also includes: The second vibration mechanism is connected to the vibration screen plate and the magnetic plate, and the second vibration mechanism drives the vibration screen plate and the magnetic plate to vibrate horizontally together at a set frequency.

11. A method for directional arrangement of a chip-type three-terminal multilayer ceramic filter, characterized in that: The directional arrangement device for the chip-type three-terminal multilayer ceramic filter according to claim 1 is used for arrangement, and the method comprises: S01: Obtain a chip-type three-terminal multilayer ceramic filter, wherein the length, width and thickness of the chip-type three-terminal multilayer ceramic filter are a1, b1 and c1 respectively, wherein a1>b1=c1, and the inner electrodes are exposed on two side surfaces in the thickness direction of the chip-type three-terminal multilayer ceramic filter; S02: placing the chip-type three-terminal multilayer ceramic filter on the upper surface of the vibration screen plate; S03: allowing the chip-type three-terminal multilayer ceramic filter to enter the vibration screen hole from the upper surface of the vibration screen plate, so that the chip-type three-terminal multilayer ceramic filter is horizontally placed in the vibration screen hole in a manner including a first state or a second state, wherein the first state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the thickness, and the second state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the width; S04: vibrating the vibration screen plate and the magnetic plate up and down, so that the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state is moved out of the vibration screen hole from above to the upper surface of the vibration screen plate; S05: Repeat steps S03-S04 multiple times; S06: moving the loading plate to above the vibration screen plate, so that the loading part loads the chip-type three-terminal multilayer ceramic filter in the first state laterally located in the vibration screen hole from above.

12. The method for directional arrangement of a chip-type three-terminal multilayer ceramic filter according to claim 11, characterized in that: The thickness of the vibration screen plate is less than the thickness of the chip-type three-terminal multilayer ceramic filter; The magnetic plate has a first position close to the bottom of the vibration screen plate and a second position away from the bottom of the vibration screen plate, and the second position is a spacing distance between the magnetic plate and the vibration screen plate, and the spacing distance is less than the thickness of the chip-type three-terminal multilayer ceramic filter; After the loading plate is moved to above the vibrating plate in step S06, the following steps are also included: The magnetic plate is moved from the second position to the first position.

13. The method for directional arrangement of a chip-type three-terminal multilayer ceramic filter according to claim 11, characterized in that: The magnetic plate is arranged close to the bottom of the vibrating screen plate; The magnetic plate is provided with a plurality of ejector pin holes, and the ejector pin holes correspond one to one with the vibration screen holes; The device also includes a lifting assembly, which includes a substrate and a plurality of ejector pins arranged on the substrate, wherein the ejector pins correspond to the ejector pin holes one by one; the substrate is used to drive the ejector pins to pass through the ejector pin holes to lift up the chip-type three-terminal multilayer ceramic filter located in the vibration screen hole; After the loading plate is moved to above the vibrating plate in step S06, the following steps are also included: The substrate is driven to move upward, and the ejector pin passes through the ejector pin hole to lift up the chip-type three-terminal multilayer ceramic filter located in the vibration screen hole, so that the chip-type three-terminal multilayer ceramic filter is exposed on the upper surface of the vibration screen, or the portion of the chip-type three-terminal multilayer ceramic filter exposed on the upper surface of the vibration screen is increased.

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