Single-side alternating type double-station wafer double-sided coating device and coating method

Abstract

The invention discloses a single-side alternating type double-station wafer double-face coating device and a coating method.The coating device comprises a working cavity, two carriers, a target material, a rotating mechanism and a transposition mechanism, the rotating mechanism is used for driving the carriers to rotate so that wafers can be turned over, and the transposition mechanism is used for driving the two carriers to revolve so that the wafers can be turned over conveniently; the positions of the two groups of carriers can be conveniently exchanged; according to the coating device and the coating method provided by the invention, double-sided coating of the wafer can be realized in one cavity, so that the production process is simplified, the occupied space of equipment is reduced, the material transfer time is shortened, and the production efficiency and the output capacity of the whole line are improved; through rotation and revolution of the two sets of carriers, on the basis of not changing the target material form, double-face coating of two wafers can be carried out through one-time cavity closing operation, the double-wafer coating procedure is further optimized, and the double-face coating efficiency of the wafers is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer coating technology, and in particular to a single-side alternating dual-station wafer double-sided coating device and a coating method. Background Art

[0002] Wafer coating is a technology that covers the surface of a wafer with one or more layers of thin films. These thin films can be made of different materials such as metals, non-metals, compounds, etc., with specific electrical, optical or mechanical properties. Coating can improve the performance of the wafer, making it more suitable for various application scenarios. Some special processes require coating on both sides of the wafer. In the prior art, if double-sided coating is required on the wafer, two process chambers are often set up, one of which is used to coat the front side of the wafer. After the front side coating is completed, the wafer is sent to another process chamber for back side coating. In this way, the coating on both sides of the wafer is finally completed.

[0003] Configuring two process chambers increases the equipment layout cost, increases the equipment footprint, and increases the wafer movement steps, which increases the possibility of wafer contamination and easily affects the process effect. Summary of the invention

[0004] The purpose of the present application is to overcome the deficiencies in the prior art and to provide a single-side alternating dual-station wafer double-sided coating device and a coating method.

[0005] The present application provides a single-side alternating double-station wafer double-sided coating device, comprising: a working chamber, for providing space for wafer coating; two groups of carriers, the two groups of carriers are arranged side by side in the working chamber along the vertical direction, and the carriers are used to receive and fix the wafers; a target material is arranged above the two groups of carriers; a rotating mechanism, for driving the carriers to rotate so that the carriers can rotate with the wafers, thereby realizing the flipping of the wafers; a transposition mechanism, for driving the two groups of carriers to revolve so that the two groups of carriers can exchange positions; wherein the wafer includes an A surface and a B surface; through the rotating mechanism, the wafer on the carrier can be changed from the A surface facing the target material to the B surface facing the target material, or, the wafer on the carrier can be changed from the B surface facing the target material to the A surface facing the target material; through the transposition mechanism, the positions of the two groups of carriers can be exchanged, and the wafer on the carrier can be changed from the A surface facing the target material to the B surface facing the target material, or, the wafer on the carrier can be changed from the B surface facing the target material to the A surface facing the target material;

[0006] Furthermore, the carrier includes: a material receiving piece for supporting the wafer; a magnetic suction piece for abutting against the material receiving piece and being able to fix the wafer between the material receiving piece and the magnetic suction piece by adsorbing the material receiving piece; wherein the middle part of the material receiving piece is open to expose the B side of the wafer, and the middle part of the magnetic suction piece is open to expose the A side of the wafer.

[0007] Furthermore, an electromagnet is provided on the magnetic attraction piece. When the electromagnet is energized, the magnetic attraction piece can absorb the material receiving piece. An elastic piece is provided between the material receiving piece and the magnetic attraction piece. After the electromagnet is powered off, the elastic piece recovers and can push the material receiving piece and the magnetic attraction piece apart.

[0008] Furthermore, the carrier also includes a moving drive component, which is used to drive the material receiving member and the magnetic attraction member to move closer to or away from each other.

[0009] Furthermore, the single-sided alternating double-station wafer double-sided coating device also includes: a main rotating support shaft, rotatably disposed on the cavity wall of the working chamber; a second mounting plate, disposed on the main rotating support shaft; two groups of auxiliary rotating support shafts, any one group of auxiliary rotating support shafts is rotatably disposed on the second mounting plate, the two groups of auxiliary rotating support shafts are symmetrically disposed, and any one group of carriers is connected to one group of auxiliary rotating support shafts.

[0010] Furthermore, the carrier includes a material receiving part and a magnetic attraction part, an electromagnet is provided on the magnetic attraction part, and an elastic part is provided between the material receiving part and the magnetic attraction part; a line channel is provided in the main rotating support shaft and the auxiliary rotating support shaft, and the cable of the electromagnet can be connected to an external power supply and controller through the line channel.

[0011] Furthermore, the single-side alternating double-station wafer double-sided coating device also includes: a connecting plate, which is connected to the transposition mechanism and can rotate in the working chamber under the drive of the transposition mechanism; a first transmission joint, which is connected to one of the groups of carriers and is rotatably arranged on the connecting plate; a second transmission joint, which is connected to the other group of carriers and is also rotatably arranged on the connecting plate; when the connecting plate rotates, the first transmission joint and the second transmission joint can carry the two groups of carriers to revolve around the rotation axis of the connecting plate; the rotating mechanism includes: a first rotating driving member, the movable end of the first rotating driving member is provided with a third transmission joint; a second rotating driving member, the movable end of the second rotating driving member is provided with a fourth transmission joint; a first translation driving member, which is used to drive Make the first rotation drive member approach or move away from the carrier; the second translation drive member is used to drive the second rotation drive member approach or move away from the carrier; when the two groups of carriers need to rotate, the first translation drive member drives the first rotation drive member approach the carrier, and the second translation drive member drives the second rotation drive member approach the carrier, the third transmission joint can connect with one of the first transmission joint and the second transmission joint, and the fourth transmission joint can connect with the other of the first transmission joint and the second transmission joint; when the two groups of carriers need to revolve, the first translation drive member drives the first rotation drive member away from the carrier, and the second translation drive member drives the second rotation drive member away from the carrier, so as to avoid the first rotation drive member and the second rotation drive member interfering with the rotation of the connecting plate.

[0012] Furthermore, the single-sided alternating double-station wafer double-sided coating device also includes: two groups of variable connection structures, any group of carriers is connected to one group of variable connection structures; a first mounting plate, the two groups of variable connection structures are connected through the first mounting plate; wherein the variable connection structure includes: a connecting seat, used to connect a group of carriers, a avoidance cavity is provided in the connecting seat, a threaded hole is also provided at the end of the connecting seat away from the carrier, the threaded hole is connected to the avoidance cavity, a key slot is also provided in the threaded hole, and the key slot extends horizontally toward the carrier; a connecting rod, connected to the first mounting plate and inserted in the connecting seat, a key is provided at the front section of the connecting rod, the key and the key slot extend coaxially, and the key can enter the avoidance cavity along the key slot The rear section of the connecting rod is provided with an external thread. After the key is inserted into the avoidance cavity, the external thread can be threadedly connected with the threaded hole; the single-sided alternating double-station wafer double-sided coating device also includes: a rotating drive member for driving the first mounting plate to rotate; a translation drive member for driving the first mounting plate to move along the extension direction of the key slot; when the transposition mechanism needs to work, the key is inserted in the key slot, and the rotating drive member drives the first mounting plate to rotate, and the two sets of variable connection structures revolve and exchange positions; when the rotating mechanism needs to work, the key leaves the key slot and enters the avoidance cavity, and the translation drive member continues to drive the first mounting plate and drive the connecting rod to translate toward the carrier, and the connecting seat rotates through thread transmission.

[0013] The present application also provides a coating method, which can be implemented using the above-mentioned single-sided alternating double-station wafer double-sided coating device, including the following steps: two groups of carriers respectively fix a wafer, and both wafers are in a state where the A side faces the target material; the first coating is performed, and the A side of the first wafer arranged on it is coated; the rotating mechanism is started, and the two groups of carriers rotate, so that the two wafers are changed to a state where the B side faces the target material; the second coating is performed, and the B side of the first wafer is coated; the position conversion mechanism is started, and the two groups of carriers revolve and exchange positions, so that the two wafers are changed to a state where the A side faces the target material; the third coating is performed, and the A side of the second wafer is coated; the rotating mechanism is started, and the two groups of carriers rotate, so that the two wafers are changed to a state where the B side faces the target material; the fourth coating is performed, and the B side of the second wafer is coated.

[0014] Furthermore, after the fourth coating is completed, the position exchange mechanism is started, and the two groups of carriers revolve again and exchange positions, and the two wafers are transformed into a state where the A surface faces the target 300; the two wafers are reset to facilitate the return of the wafer state.

[0015] The present application provides a single-side alternating double-station wafer double-sided coating device and a coating method. The coating device includes a working chamber, two groups of carriers, a target material, a rotating mechanism and a transposition mechanism. The rotating mechanism is used to drive the carrier to rotate so as to realize the flipping of the wafer. The transposition mechanism is used to drive the two groups of carriers to revolve so as to facilitate the two groups of carriers to exchange positions. The revolution can not only change the position of the carrier, but also replace the rotating mechanism to change the surface of the wafer when used reasonably. Through the coating device and coating method provided by the present application, double-sided coating of the wafer can be achieved in one chamber, which not only simplifies the production process, reduces the space occupied by the equipment, reduces the material transportation time, but also improves the production efficiency and output capacity of the entire line. Through the rotation and revolution of the two groups of carriers, without changing the form of the target material, double-sided coating of two wafers can be performed in one closed chamber operation, further optimizing the double-wafer coating procedure and improving the double-sided coating efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a single-side alternating dual-station wafer double-sided coating device provided in the present application; Figure 2 for Figure 1 The structural cross-sectional view of the single-side alternating double-station wafer double-side coating device shown; Figure 3 for Figure 2 The schematic diagram of the single-side alternating double-station wafer double-sided coating device after omitting the working chamber and target material; Figure 4 for Figure 3 Structural cross-sectional view of Figure 5 for Figure 4 A magnified view of the structure in the middle circle; Figure 6 A schematic diagram of the structure of another single-side alternating dual-station wafer double-sided coating device provided by the present application; Figure 7 A schematic diagram of the process status of a coating method provided in this application. DETAILED DESCRIPTION

[0017] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0018] The present application provides a single-side alternating double-station wafer double-sided coating device, comprising: a working chamber 100, which is used to provide space for wafer coating; two groups of carriers 200, which are arranged side by side in the working chamber 100 along the vertical direction, and the carriers 200 are used to receive and fix the wafers; a target material 300 is arranged above the two groups of carriers 200; a rotating mechanism, which is used to drive the carriers 200 to rotate, so that the carriers 200 can rotate with the wafers, thereby realizing the flipping of the wafers; a transposition mechanism, which is used to drive the two groups of carriers 200 to revolve, so that the two groups of carriers 200 can rotate. 0 exchange positions; wherein the wafer includes an A surface and a B surface; through the rotating mechanism, the wafer on the carrier 200 can be changed from the A surface facing the target material 300 to the B surface facing the target material 300, or, the wafer on the carrier 200 can be changed from the B surface facing the target material 300 to the A surface facing the target material 300; through the transposition mechanism, the positions of the two groups of carriers 200 can be exchanged, and the wafer on the carrier 200 can be changed from the A surface facing the target material 300 to the B surface facing the target material 300, or from the B surface facing the target material 300 to the A surface facing the target material 300.

[0019] For details, please refer to Figure 1 In the illustrated embodiment, the working chamber 100 is provided with two wafer inlets and outlets, and the two wafer inlets and outlets are arranged side by side in the vertical direction. Figure 2 Two groups of carriers 200 are arranged in the working chamber 100, and the two groups of carriers 200 are also arranged side by side in the vertical direction, and each group of carriers 200 is opposite to a wafer inlet and outlet. A wafer handling mechanism such as a robot can transfer wafers to the corresponding carrier 200 through the wafer inlet and outlet.

[0020] Furthermore, an air inlet channel and an air outlet channel are opened on the cavity wall of the working chamber 100. The air inlet channel connects the working chamber 100 and the gas supply equipment, and the air outlet channel connects the working chamber 100 and the gas exhaust equipment. The gas supply equipment can pass the reaction gas for coating into the working chamber 100 through the air inlet channel, and the gas exhaust equipment can extract the gas in the working chamber 100 through the air outlet channel; the gas supply equipment and the gas exhaust equipment cooperate to maintain the cavity air pressure required for coating.

[0021] Continue to refer to Figure 2 , the target 300 is arranged at the top of the working chamber 100, and the carrier 200 is arranged directly below the target 300. The target 300 is connected to the RF power supply. When working, the RF power supply supplies power to the target 300. After the target 300 is powered on, it can ionize the reaction gas. The electrons generated by the ionization bombard the target 300, and the metal atoms on the surface of the target 300 can be blasted out. The metal atoms move toward the carrier 200 and can be deposited on the surface of the wafer, thereby realizing the coating of the wafer.

[0022] For the convenience of description, Figure 2The group of carriers 200 disposed on the upper side is referred to as a first group of carriers 200A, and the other group of carriers 200 disposed on the lower side is referred to as a second group of carriers 200B.

[0023] Figure 2 In the illustrated embodiment, after both groups of carriers 200 obtain wafers, the front side of the wafers on the first group of carriers 200A faces the target 300 and can be coated, while the back side of the wafers on the first group of carriers 200A and the wafers on the second group of carriers 200B are blocked and cannot be coated.

[0024] The rotating mechanism may be any driving member capable of rotating the carrier 200, such as a rotating cylinder, a motor, or the like. Figure 6 The coating device includes two sets of rotating mechanisms, which are respectively connected to a set of carriers 200. When necessary, the rotating mechanisms work to realize the self-rotation of the required carrier 200, thereby realizing the required flipping of the wafer.

[0025] The transposition mechanism can be set in the form of a turntable, so that the two groups of carriers 200 are set relative to the rotation axis of the turntable. When necessary, the turntable is rotated 180° to swap the positions of the two groups of carriers 200, so that the first group of carriers 200A originally set on the top moves to the lower station, and the second group of carriers 200B originally set on the bottom moves to the upper station facing the target 300; because the carrier 200 performs a revolution, after rotating 180°, the wafer with the A side facing up and facing the target 300 will be simultaneously changed to the B side facing up. Therefore, the revolution can not only change the position of the carrier 200, but also replace the rotation mechanism to change the surface of the wafer when used reasonably.

[0026] In summary, the single-sided alternating double-station wafer double-sided coating device provided by the present application can realize double-sided coating of the wafer in one chamber, which not only simplifies the production process, reduces the space occupied by the equipment, and reduces the material transportation time, but also improves the production efficiency and output capacity of the entire line; through the rotation and revolution of the two groups of carriers 200, without changing the form of the target material 300, double-sided coating of two wafers can be performed in one closed chamber operation, further optimizing the double-wafer coating procedure and improving the double-sided coating efficiency of the wafer.

[0027] In the present application, the carrier 200 may be any supporting structure that is convenient for fixing the wafer, such as a clamp, a suction cup, etc.

[0028] In one embodiment, the carrier 200 is arranged in a circular ring shape, a slot for supporting is provided in the carrier 200, and an opening connected to the slot is provided on the side of the carrier 200; the wafer handling mechanism can place the wafer into the slot through the opening; the slot can support the edge of the wafer and allow the middle part of the wafer to be coated to be exposed to the outside through the inner ring of the circular ring.

[0029] At this time, the upper and lower sides and edges of the wafer are restricted by the slot; ensure that the slot depth is close to the thickness of the wafer. After the wafer is inserted into the slot, it can be stably inserted into the slot and is not easy to fall out of the slot even if it is rotated and turned over.

[0030] Furthermore, the rotation axis of the carrier 200 is parallel to the moving direction of the wafer transport mechanism (or the direction of the wafer entering and exiting the slot), which can prevent the wafer from deviating from the slot through the opening during the rotation or revolution of the carrier 200.

[0031] Alternatively, a door is provided on the opening; an elastic structure such as a torsion spring is used to enable the door to automatically cover the opening in the absence of external force; a driving structure such as an electromagnet is provided which can provide an external force to the door away from the opening when necessary and can remove the external force after the wafer is in place to facilitate active resetting of the door, thereby preventing the wafer from deviating from the slot through the opening during the rotation or revolution of the carrier 200.

[0032] In another embodiment, the carrier 200 includes: a material receiving member 210 for supporting the wafer; a magnetic member 220 for abutting against the material receiving member 210 and being able to fix the wafer between the material receiving member 210 and the magnetic member 220 by adsorbing the material receiving member 210; wherein the middle portion of the material receiving member 210 is open to expose the B surface of the wafer; and the middle portion of the magnetic member 220 is open to expose the A surface of the wafer.

[0033] The material receiving member 210 and the magnetic attraction member 220 may be in any shape as long as they can support the wafer and have an open portion to expose the surface of the wafer to be coated.

[0034] Figure 2 and Figure 3 In the illustrated embodiment, the material receiving member 210 and the magnetic member 220 are both arranged in a circular ring shape; a notch is provided on one side of the material receiving member 210, and the wafer handling mechanism can move through the notch to facilitate the placement and removal of the wafer. Specifically, when the material receiving member 210 receives the wafer, the edge of the wafer falls on the material receiving member 210; so that the magnetic member 220 abuts against the edge of the wafer from top to bottom, and the magnetic member 220 can cooperate with the material receiving member 210 to fix the wafer. The A side of the wafer can be exposed to the outside through the open inner ring of the magnetic member 220, and the B side can be exposed to the outside through the open inner ring of the material receiving member 210.

[0035] The magnetic member 220 can be made of a magnet or can be embedded with a magnet. The magnetic member 220 has the magnetism to absorb metal products. The receiving member 210 can be made of a metal material or can be embedded with a metal material. When the magnetic member 220 approaches the receiving member 210, it can attract the receiving member 210, so that the wafer is pressed between the two, and even if the carrier 200 rotates or revolves, the wafer is not easily displaced.

[0036] In order to prevent the magnetic force of the magnetic element 220 from being too strong and damaging the wafer, the magnetic element 220 is set to have a weak magnetic property.

[0037] In one embodiment, an electromagnet is provided on the magnetic suction member 220. When the electromagnet is energized, the magnetic suction member 220 can absorb the material receiving member 210. An elastic member is provided between the material receiving member 210 and the magnetic suction member 220. After the electromagnet is powered off, the elastic member recovers and can push the material receiving member 210 and the magnetic suction member 220 apart, so that the material receiving member 210 and the magnetic suction member 220 are away from each other, so as to facilitate loading and unloading of wafers.

[0038] The elastic member can be made of elastic materials such as rubber and plastic, or can be made of elastic structures such as springs and spring sheets. The elastic member is arranged between the material receiving member 210 and the magnetic member 220. When the electromagnet is powered on, the magnetic force generated can overcome the elastic force of the elastic member, thereby compressing the elastic member and making the material receiving member 210 and the magnetic member 220 approach each other; after the electromagnet is powered off and loses its magnetic force, the elastic member recovers and can separate the material receiving member 210 and the magnetic member 220.

[0039] In a specific embodiment, the magnetic member 220 is connected to the rotating mechanism and the transposition mechanism for receiving the wafer. The receiving member 210 is arranged above the magnetic member 220 through the elastic member. After the magnetic member 220 supports the wafer, the electromagnet is energized, the magnetic member 220 attracts the receiving member 210, the receiving member 210 compresses the elastic member and moves toward the magnetic member 220, and finally, the receiving member 210 abuts against the wafer and presses the wafer against the magnetic member 220. After the coating is completed, the electromagnet is powered off, the elastic member is restored, and the receiving member 210 is pushed open, so that the wafer handling mechanism can take away the wafer on the magnetic member 220.

[0040] In another embodiment, the carrier 200 further includes a moving driving component 230 , and the moving driving component 230 is used to drive the material receiving component 210 and the magnetic attraction component 220 to move closer to or away from each other.

[0041] Among them, the mobile driving component 230 can adopt any mechanism such as a clamp, a suction cup, a magnet, etc. to conveniently grasp the material receiving piece 210 and / or the magnetic attraction piece 220, and make the material receiving piece 210 and the magnetic attraction piece 220 move closer to or away from each other through lifting, translation or flipping.

[0042] The present application does not limit the specific configuration of the mobile driving assembly 230 .

[0043] In one embodiment, reference may be made to Figure 2 and Figure 3The receiving member 210 is connected to the rotating mechanism and the transposition mechanism for receiving the wafer. The receiving member 210 is connected to the moving driving assembly 230 and is arranged above the magnetic member 220. The moving driving assembly 230 includes: two sets of top plates 231, one set of top plates 231 is arranged under any magnetic member 220; and a lifting driving member 232, which is used to drive the two sets of top plates 231 to move synchronously in the vertical direction.

[0044] Specifically, during coating, the wafer falls on the receiving member 210, and the lifting drive member 232 drives the top plate 231 and the magnetic member 220 to descend, so that the magnetic member 220 approaches to adsorb the receiving member 210; the lifting drive member 232 drives the top plate 231 to continue to descend, and the top plate 231 is separated from the magnetic member 220, so that the magnetic member 220 can rotate with the receiving member 210.

[0045] The lifting drive member 232 may be any driving structure such as a cylinder or an electric cylinder that can drive the top plate 231 to perform lifting motion. Figure 2 In the illustrated embodiment, the fixed end of the lifting drive member 232 is arranged outside the working chamber 100, and the movable end is connected through a bellows sealed transmission connection, extending into the working chamber 100 and connected to the two groups of top plates 231; driven by the lifting drive member 232, the two groups of top plates 231 can perform synchronous lifting and lowering movements, thereby synchronously fixing or releasing the wafers by the two groups of carriers 200.

[0046] By setting the top plate 231 to lift the magnetic member 220, after the magnetic member 220 absorbs the material receiving member 210, the top plate 231 can be completely separated from the magnetic member 220. In this way, the mobile driving component 230 will not interfere with the rotation of the material receiving member 210 and the magnetic member 220.

[0047] The single-sided alternating double-station wafer double-sided coating device provided in the present application also includes: a main rotating support shaft 510, which is rotatably set on the cavity wall of the working chamber 100; a second mounting plate 520, which is set on the main rotating support shaft 510; two groups of auxiliary rotating support shafts 530, any one group of auxiliary rotating support shafts 530 is rotatably set on the second mounting plate 520, and the two groups of auxiliary rotating support shafts 530 are symmetrically arranged, and any one group of carriers 200 is connected to one group of auxiliary rotating support shafts 530.

[0048] For details, please refer to Figure 2 or Figure 6In the illustrated embodiment, the main rotating support shaft 510 is disposed on the left side wall of the working chamber 100, and is rotatably disposed on the working chamber 100 by means of a rotating support and a bearing. The second mounting plate 520 is disposed at the right end of the main rotating support shaft 510. Two sets of auxiliary rotating support shafts 530 are rotatably disposed at both ends of the length direction of the second mounting plate 520 by means of bearings. The two sets of auxiliary rotating support shafts 530 are symmetrically disposed with the main rotating support shaft 510 as the central axis. The two sets of auxiliary rotating support shafts 530 are respectively connected to a set of carriers 200.

[0049] When the carrier 200 rotates, the secondary rotation support shaft 530 can be driven to rotate. When the carrier 200 revolves, the second mounting plate 520 can rotate.

[0050] The secondary rotation support shaft 530 and the second mounting plate 520 can play the role of rotation support, which can not only stabilize the installation of the carrier 200, but also maintain support for the carrier 200 when the carrier 200 rotates, thereby improving the balance and reliability of the carrier 200.

[0051] In one embodiment, referring to Figure 2 The carrier 200 includes a material receiving member 210 and a magnetic member 220 . The material receiving member 210 is connected to the secondary rotation support shaft 530 . The magnetic member 220 can move closer to or farther from the material receiving member 210 under the drive of the mobile driving assembly 230 .

[0052] In another embodiment, the carrier 200 includes a material receiving member 210 and a magnetic member 220, an electromagnet is provided on the magnetic member 220, an elastic member is provided between the material receiving member 210 and the magnetic member 220, a line channel is provided in the main rotating support shaft 510 and the auxiliary rotating support shaft 530, and the cable of the electromagnet can be connected to an external power supply and a controller through the line channel.

[0053] For details, please refer to Figure 6 , the magnetic member 220 is connected to the secondary rotating support shaft 530, and the material receiving member 210 is arranged above the magnetic member 220 through an elastic member. The main rotating support shaft 510 and the secondary rotating support shaft 530 are both arranged in a cylindrical shape, and a line channel is arranged in the main rotating support shaft 510 and the secondary rotating support shaft 530, and the line channel penetrates the support shaft in the left and right direction. The cables of the two groups of magnetic members 220 can extend toward the main rotating support shaft 510 through the line channel in the secondary rotating support shaft 530 connected thereto, and then be connected to the external power supply and controller through the line channel in the main rotating support shaft 510.

[0054] The design of the line channel in the support shaft realizes the safe external connection of the cables, which not only facilitates the sealing design of the working chamber 100, but also can limit the relative positions of the cables and prevent the two groups of cables from being entangled with each other during the rotation of the carrier 200.

[0055] In one embodiment, the single-sided alternating double-station wafer double-sided coating device provided by the present application also includes: a connecting plate 401, which is connected to the transposition mechanism and can rotate in the working chamber 100 under the drive of the transposition mechanism; a first transmission joint 402, which is connected to one group of carriers 200 and is rotatably arranged on the connecting plate 401; a second transmission joint 403, which is connected to another group of carriers 200 and is also rotatably arranged on the connecting plate 401; when the connecting plate 401 rotates, the first transmission joint 402 and the second transmission joint 403 can carry the two groups of carriers 200 to revolve around the rotation axis of the connecting plate 401; the rotating mechanism includes: a first rotating driving member 404, and the movable end of the first rotating driving member 404 is provided with a third transmission joint 405; a second rotating driving member 406, and the movable end of the second rotating driving member 406 is provided with a fourth transmission joint 407; a first translation driving member 408, which is used to drive the first rotating driving member 404 approaches or moves away from the carrier 200; the second translation drive member 409 is used to drive the second rotation drive member 406 approaches or moves away from the carrier 200; when the two groups of carriers 200 need to rotate, the first translation drive member 408 drives the first rotation drive member 404 to approach the carrier 200, and the second translation drive member 409 drives the second rotation drive member 406 to approach the carrier 200, the third transmission joint 405 can connect with one of the first transmission joint 402 and the second transmission joint 403, and the fourth transmission joint 407 can connect with the other of the first transmission joint 402 and the second transmission joint 403; when the two groups of carriers 200 need to revolve, the first translation drive member 408 drives the first rotation drive member 404 away from the carrier 200, and the second translation drive member 409 drives the second rotation drive member 406 away from the carrier 200, thereby avoiding the first rotation drive member 404 and the second rotation drive member 406 from interfering with the rotation of the connecting plate 401.

[0056] For details, please refer to Figure 6 In the illustrated embodiment, the transposition mechanism may adopt a rotary drive member such as a rotary cylinder or a motor. The fixed end of the transposition mechanism is arranged outside the working chamber 100 for easy installation, commissioning and maintenance; the movable end is connected to the connecting plate 401 through a bellows sealed transmission connection and extends into the working chamber 100. The carrier 200 is rotatably arranged on the connecting plate 401 through a bearing, and two groups of carriers 200 are arranged side by side at both ends of the connecting plate 401, and the distances between the two groups of carriers 200 and the rotation center of the connecting plate 401 are consistent.

[0057] Continue to refer to Figure 4 A first transmission joint 402 is provided at the right end of the first group of carriers 200 arranged at the top, and a second transmission joint 403 is provided at the right end of the second group of carriers 200 arranged at the bottom.

[0058] Continue to refer to Figure 4, the first rotary drive member 404 and the second rotary drive member 406 can be rotary drive members such as rotary cylinders and motors. The fixed ends of the first rotary drive member 404 and the second rotary drive member 406 are arranged outside the working chamber 100, and the movable ends are connected by bellows sealing transmission and extend into the working chamber 100. The first rotary drive member 404 is arranged on the top, facing a group of carriers 200 at the upper station; the second rotary drive member 406 is arranged on the bottom, facing another group of carriers 200 at the lower station. The movable end of the first rotary drive member 404 is provided with a third transmission joint 405, and the movable end of the second rotary drive member 406 is provided with a fourth transmission joint 407, and the third transmission joint 405 and the fourth transmission joint 407 are arranged in the working chamber 100.

[0059] The first transmission joint 402 and the second transmission joint 403 are of the same type, and can be connected to and transmit torque with the third transmission joint 405 and the fourth transmission joint 407. The third transmission joint 405 and the fourth transmission joint 407 are of the same type.

[0060] The first transmission joint 402 and the third transmission joint 405 are used as examples for description. The first transmission joint 402 and the third transmission joint 405 can be a clutch, or a gear set or a gear rack, or any other structure that can transmit torque when in contact.

[0061] Figure 6 In the illustrated embodiment, the first transmission joint 402 and the third transmission joint 405 adopt a tooth clutch. The right end of the first transmission joint 402 is provided with engaging teeth, and the left end of the third transmission joint 405 is provided with engaging teeth. When the first transmission joint 402 and the third transmission joint 405 are against each other, the engaging teeth of the two can be engaged, thereby transmitting torque; when the first transmission joint 402 and the third transmission joint 405 are away from each other, the engaging teeth of the two are separated and no longer transmitted. After the two groups of carriers 200 revolve and exchange positions, the second transmission joint 403 originally at the bottom will come to the upper station and face the third transmission joint 405. When the carrier 200 needs to be displaced and rotated, the third transmission joint 405 can be engaged with the second transmission joint 403 for transmission. Similarly, the fourth transmission joint 407 can be engaged with the second transmission joint 403 for transmission, and can also be engaged with the first transmission joint 402 for transmission.

[0062] Continue to refer to Figure 6The first translation driver 408 and the second translation driver 409 can be translation drivers such as air cylinders and electric cylinders. The first translation driver 408 and the second translation driver 409 are arranged outside the working chamber 100 and are connected to the first rotation driver 404 and the second rotation driver 406, respectively. The first translation driver 408 can drive the first rotation driver 404 to translate in the left-right direction to approach or move away from a group of carriers 200 located at the upper station; the second translation driver 409 can drive the second rotation driver 406 to translate in the left-right direction to approach or move away from another group of carriers 200 located at the lower station.

[0063] by Figure 6 For example, when the carrier 200 needs to rotate, the first translation driver 408 drives the first rotation driver 404 to move toward the first group of carriers 200, so that the third transmission joint 405 is engaged with the first transmission joint 402; the second translation driver 409 drives the second rotation driver 406 to move toward the second group of carriers 200, so that the fourth transmission joint 407 is engaged with the second transmission joint 403. The first rotation driver 404 and the second rotation driver 406 are started, and torque is transmitted through the transmission joints, so that the two groups of carriers 200 can rotate, thereby realizing the flipping of the wafer.

[0064] Since the first rotation driving member 404 and the second rotation driving member 406 can be independently operated, if necessary, one of the carriers 200 can be rotated according to actual conditions.

[0065] Continue with Figure 6 For example, when the carrier 200 needs to revolve, the first translation driver 408 drives the first rotation driver 404 away from the first group of carriers 200, so that the third transmission joint 405 is disengaged from the first transmission joint 402; the second translation driver 409 drives the second rotation driver 406 away from the second group of carriers 200, so that the fourth transmission joint 407 is disengaged from the second transmission joint 403. Subsequently, the transposition mechanism drives the connecting plate 401 to rotate 180°, so that the positions of the two groups of carriers 200 can be swapped. Since the transmission joint is in a disengaged state, the revolution of the carrier 200 is not disturbed by the rotation mechanism and will not affect the rotation mechanism.

[0066] The detachable form of the transmission joint can not only simplify the installation of the rotating mechanism, avoid the two sets of rotating drive parts of the rotating mechanism from participating in the revolution and causing cable entanglement and other usage problems; it can also relatively fix the position of the rotating mechanism, avoid the rotating mechanism participating in the revolution and affecting the operation accuracy.

[0067] In another embodiment, the single-side alternating double-station wafer double-sided coating device further includes: two sets of variable connection structures 410, any set of carriers 200 is connected to one set of variable connection structures 410; a first mounting plate 420, the two sets of variable connection structures 410 are connected through the first mounting plate 420; wherein the variable connection structure 410 includes: a connection seat 411, used to connect a set of carriers 200, the connection seat 411 is provided with a avoidance cavity 411a, the connection seat 411 A threaded hole 411b is further provided at one end away from the carrier 200, the threaded hole 411b is connected to the avoidance cavity 411a, a key slot 411c is further provided in the threaded hole 411b, and the key slot 411c extends horizontally toward the carrier 200; a connecting rod 412 is connected to the first mounting plate 420 and inserted into the connecting seat 411, and a key 412a is provided at the front section of the connecting rod 412, and the key 412a extends coaxially with the key slot 411c, and the key 412a can be moved along the key slot 420. 11c enters the avoidance cavity 411a, and the rear section of the connecting rod 412 is provided with an external thread 412b. After the key 412a enters the avoidance cavity 411a, the external thread 412b can be threadedly connected with the threaded hole 411b; the single-side alternating double-station wafer double-sided coating device also includes: a rotating driving member 430, which is used to drive the first mounting plate 420 to rotate; a translation driving member 440, which is used to drive the first mounting plate 420 to move along the extension direction of the key slot 411c; When the positioning mechanism is working, the key 412a is inserted into the key slot 411c, and the rotating driving member 430 drives the first mounting plate 420 to rotate, and the two sets of variable connection structures 410 revolve and exchange positions; when the rotating mechanism needs to work, the key 412a leaves the key slot 411c and enters the avoidance cavity 411a, and the translation driving member 440 continues to drive the first mounting plate 420 and drives the connecting rod 412 to translate toward the carrier 200, and through threaded transmission, the connecting seat 411 rotates.

[0068] For details, please refer to Figure 1 and Figure 2 In the illustrated embodiment, the fixed end of the rotary drive member 430 is disposed outside the working chamber 100, and the movable end is connected to the first mounting plate 420 through a bellows sealed transmission connection and extends into the working chamber 100. The translation drive member 440 is disposed outside the working chamber 100 and connected to the rotary drive member 430, and is used to drive the rotary drive member 430 to drive the first mounting plate 420 to move horizontally.

[0069] The rotary drive member 430 may be a rotary cylinder, a motor or other rotary drive member, and the translation drive member 440 may be a linear drive member such as a cylinder or an electric cylinder.

[0070] Combined with reference Figure 3 A set of variant connection structures 410 are respectively provided at both ends of the first mounting plate 420, and the distances between the two sets of variant connection structures 410 and the rotation center of the first mounting plate 420 are consistent.

[0071] Combined with reference Figures 3 to 5 , the carrier 200 includes a material receiving member 210 and a magnetic member 220, and the magnetic member 220 is located above the material receiving member 210 with the support of the top plate 231. The material receiving member 210 is connected to the connecting seat 411. A avoidance cavity 411a is provided in the front section of the connecting seat 411 close to the material receiving member 210, and a threaded hole 411b is provided in the rear section away from the material receiving member 210. The front end of the threaded hole 411b is connected to the avoidance cavity 411a, and the rear end passes through the connecting seat 411. A keyway 411c is provided in the threaded hole 411b, and the keyway 411c extends axially and horizontally. A connecting rod 412 is inserted in the connecting seat 411. A key 412a is provided in the front section of the connecting rod 412 close to the material receiving member 210, and an external thread 412b is provided in the rear section away from the material receiving member 210. The front end of the connecting rod 412 is inserted in the connecting seat 411, and the rear end is fixedly arranged on the first mounting plate 420.

[0072] During actual use, the connecting rod 412 is always inserted into the connecting seat 411 .

[0073] Continue to refer to Figure 5 The key 412a extends coaxially with the keyway 411c, and the key 412a can move horizontally along the keyway 411c in the axial direction. The external thread 412b is thread-matched with the threaded hole 411b.

[0074] It is easy to understand that when the key 412a is in the key slot 411c, the key 412a can transmit radial force to the connection seat 411 through the key slot 411c. At this time, the rotary drive member 430 is started, and the two sets of carriers 100 can be driven to revolve through the first mounting plate 420.

[0075] When the carrier 100 needs to rotate, the first mounting plate 420 is driven to translate toward the carrier 200 through the translation drive 440, so that the front section of the connecting rod 412 with the key 412a enters the avoidance cavity 411a. Since the inner diameter of the avoidance cavity 411a is larger than the outer diameter of the front section of the connecting rod 412, the avoidance cavity 411a and the front section of the connecting rod 412 do not contact each other and cannot transmit. As the translation drive 440 drives the connecting rod 412 to move forward continuously, the rear section of the connecting rod 412 with the external thread 412b enters the threaded hole 411b, and the external thread 412b is threadedly connected to the threaded hole 411b. The external thread 412b is continuously translated, which can drive the connecting seat 411 with the threaded hole 411b to rotate, thereby realizing the rotation of the carrier 200. In addition, when the external thread 412b is in the threaded hole 411b, the first mounting plate 420 is driven to translate away from the carrier 200 by the translation driving member 440. As the external thread 412b continuously exits the threaded hole 411b, the connecting seat 411 can also be driven to rotate.

[0076] In this embodiment, two sets of modified connection structures 410 are used, and a set of rotating drive members 430 and a set of translating drive members 440 are used to realize the rotation and revolution of the carrier 200 as required. With such a configuration, the driving structure is reduced, which is conducive to simplifying electrical control and reducing equipment costs.

[0077] The present application also provides a coating method, which can be implemented by using the above-mentioned single-side alternating double-station wafer double-sided coating device, comprising the following steps: Two sets of carriers 200 fix a wafer respectively, and both wafers are in a state where the A surface faces the target 300; Perform the first coating, and complete the coating on the A side of the first wafer placed on top; The rotating mechanism is started, and the two sets of carriers 200 rotate, so that the two wafers are transformed into a state where the B surface faces the target 300; The second coating is performed, and the B side of the first wafer is coated; The position exchange mechanism is started, and the two sets of carriers 200 revolve and exchange positions, so that the two wafers are both changed to a state where the A surface faces the target material 300; The third coating is performed, and the A side of the second wafer is coated; The rotating mechanism is started, and the two sets of carriers 200 rotate, so that the two wafers are transformed into a state where the B surface faces the target 300; The fourth coating is performed and the B side of the second wafer is coated.

[0078] Please refer to the specific Figure 2 and Figure 6 After both sets of carriers 200 fix the wafers, the two wafers a and b are in a state where the A surface is upward and the B surface is downward. Since the first wafer a is facing the target 300, metal atoms can be deposited on the A surface of the first wafer a, thereby achieving coating on the A surface of the first wafer.

[0079] by Figure 4 and Figure 5 The embodiment shown in the figure is used to illustrate that in the initial state, the two sets of variant connection structures 410 are both in a state of threaded connection between the external thread 412b and the threaded hole 411b, the translation drive 440 is started, driving the connecting rod 412 to move backward away from the carrier 200, and the connecting seat 411 starts to rotate through the thread transmission; the two sets of connecting seats 411 rotate synchronously, driving the two sets of carriers 200 to rotate synchronously. Figure 6 , the carrier 200 rotates 180 degrees, so that both wafers are in a state where the B surface is upward and the A surface is downward. Since the first wafer a is facing the target 300, metal atoms can be deposited on the B surface of the first wafer a, thereby achieving coating on the B surface of the first wafer.

[0080] Continue to refer to Figure 4 and Figure 5 , the two sets of variant connection structures 410 are in a state where the key 412a is inserted into the key slot 411c, the rotary drive member 430 is started, the first mounting plate 420 drives the two sets of carriers 100 to start orbiting, the first mounting plate 420 rotates 180°, and the two sets of carriers 100 exchange positions. Figure 6 After the revolution, the second wafer b is located at the upper station, and the first wafer a is located at the lower station; both wafers are in a state where the A surface is upward and the B surface is downward. Since the second wafer b is facing the target material 300, metal atoms can be deposited on the A surface of the second wafer b, thereby achieving coating on the A surface of the second wafer.

[0081] Continue to refer to Figure 4 and Figure 5 , the translation drive member 440 is started, driving the connecting rod 412 to move forward toward the carrier 200, and after the external thread 412b enters the threaded hole 411b, the connecting seat 411 starts to rotate through the thread transmission; the two sets of connecting seats 411 rotate synchronously, driving the two sets of carriers 200 to rotate synchronously. Figure 6 , the carrier 200 rotates 180 degrees, so that both wafers are in a state where the B surface is upward and the A surface is downward. Since the second wafer b is still facing the target 300, metal atoms can be deposited on the B surface of the second wafer b, thereby achieving coating on the B surface of the second wafer.

[0082] At this point, both wafers have completed double-sided lamination.

[0083] Furthermore, after the fourth coating is completed, the position change mechanism is started, and the two sets of carriers 200 revolve again and exchange positions, so that both wafers are changed to a state where the A surface faces the target 300; the two wafers are reset to facilitate the return of the wafer state. After completing the double-sided lamination of the two wafers, the first group of carriers 200A carrying the first wafer a returns to the upper station, and the second group of carriers 200B carrying the second wafer b returns to the lower station, and both wafers are restored to the state with the A side facing up and the B side facing down.

[0084] This allows the wafer to return to the cavity state, making it easier for downstream to continue processing the wafer or record wafer information.

[0085] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A single-side alternating double-station wafer double-sided coating device, characterized in that: include: A working chamber (100), used to provide space for wafer coating; Two groups of carriers (200), the two groups of carriers (200) being arranged side by side in a vertical direction in the working chamber (100), the carriers (200) being used to receive and fix wafers; A target material (300) is disposed above the two sets of carriers (200); A rotating mechanism, used to drive the carrier (200) to rotate, so that the carrier (200) and the wafer can rotate, thereby realizing the flipping of the wafer; A transposition mechanism, used for driving the two groups of carriers (200) to revolve, so as to facilitate the two groups of carriers (200) to exchange positions; Among them, the wafer includes side A and side B; Through the rotating mechanism, the wafer on the carrier (200) can be transformed from the A surface facing the target material (300) to the B surface facing the target material (300), or the wafer on the carrier (200) can be transformed from the B surface facing the target material (300) to the A surface facing the target material (300); The position conversion mechanism can not only exchange the positions of the two groups of carriers (200), but also enable the wafer on the carrier (200) to be transformed from the A side facing the target material (300) to the B side facing the target material (300), or from the B side facing the target material (300) to the A side facing the target material (300).

2. The single-side alternating double-station wafer double-sided coating device according to claim 1, characterized in that: The carrier (200) comprises: A material receiving member (210) for supporting a wafer; A magnetic attraction member (220) is used to abut against the material receiving member (210) and can fix the wafer between the material receiving member (210) and the magnetic attraction member (220) by adsorbing the material receiving member (210); Wherein, the middle portion of the material receiving member (210) is open to expose the B surface of the wafer; The middle portion of the magnetic attraction member (220) is open to expose the A surface of the wafer.

3. The single-side alternating double-station wafer double-sided coating device according to claim 2, characterized in that: The magnetic attraction member (220) is provided with an electromagnet, and when the electromagnet is energized, the magnetic attraction member (220) can attract the material receiving member (210); An elastic member is provided between the material receiving member (210) and the magnetic attraction member (220); after the electromagnet is powered off, the elastic member recovers and is able to push the material receiving member (210) and the magnetic attraction member (220) apart.

4. The single-side alternating double-station wafer double-sided coating device according to claim 2, characterized in that: The carrier (200) further comprises a moving drive component (230), wherein the moving drive component (230) is used to drive the material receiving component (210) and the magnetic attraction component (220) to move closer to or farther from each other.

5. The single-side alternating double-station wafer double-sided coating device according to claim 1, characterized in that: Also includes: A main rotating support shaft (510) rotatably disposed on a cavity wall of the working cavity (100); A second mounting plate (520) is arranged on the main rotating support shaft (510); Two groups of auxiliary rotating support shafts (530), any group of the auxiliary rotating support shafts (530) is rotatably arranged on the second mounting plate (520), the two groups of the auxiliary rotating support shafts (530) are symmetrically arranged, and any group of the carriers (200) is connected to one group of the auxiliary rotating support shafts (530).

6. The single-side alternating double-station wafer double-sided coating device according to claim 5, characterized in that: The carrier (200) comprises a material receiving member (210) and a magnetic attraction member (220); an electromagnet is provided on the magnetic attraction member (220); and an elastic member is provided between the material receiving member (210) and the magnetic attraction member (220); The main rotating support shaft (510) and the auxiliary rotating support shaft (530) are provided with line channels, and the cables of the electromagnets can be connected to an external power source and a controller through the line channels.

7. The single-side alternating double-station wafer double-sided coating device according to any one of claims 1 to 6, characterized in that: Also includes: A connecting plate (401) connected to the transposition mechanism and capable of rotating in the working chamber (100) under the drive of the transposition mechanism; A first transmission joint (402) connected to one group of the carriers (200) and rotatably disposed on the connecting plate (401); A second transmission joint (403), connected to another set of the carriers (200), and also rotatably disposed on the connecting plate (401); When the connecting plate (401) rotates, the first transmission joint (402) and the second transmission joint (403) are capable of carrying two groups of carriers (200) to revolve around the rotation axis of the connecting plate (401); The rotating mechanism comprises: A first rotating driving member (404), wherein a third transmission joint (405) is provided at a movable end of the first rotating driving member (404); A second rotating driving member (406), wherein a fourth transmission joint (407) is provided at a movable end of the second rotating driving member (406); A first translation driving member (408), used for driving the first rotation driving member (404) to move closer to or farther away from the carrier (200); A second translation driving member (409), used for driving the second rotation driving member (406) to move closer to or farther away from the carrier (200); When two groups of the carriers (200) are required to rotate, the first translation drive member (408) drives the first rotation drive member (404) to approach the carrier (200), the second translation drive member (409) drives the second rotation drive member (406) to approach the carrier (200), the third transmission joint (405) is capable of docking with one of the first transmission joint (402) and the second transmission joint (403), and the fourth transmission joint (407) is capable of docking with the other of the first transmission joint (402) and the second transmission joint (403); When two groups of the carriers (200) are required to revolve, the first translation drive member (408) drives the first rotation drive member (404) away from the carrier (200), and the second translation drive member (409) drives the second rotation drive member (406) away from the carrier (200), thereby preventing the first rotation drive member (404) and the second rotation drive member (406) from interfering with the rotation of the connecting plate (401).

8. The single-side alternating double-station wafer double-sided coating device according to any one of claims 1 to 6, characterized in that: Also includes: Two sets of variant connection structures (410), any one set of the carriers (200) being connected to one set of the variant connection structures (410); A first mounting plate (420), wherein the two sets of the variant connection structures (410) are connected via the first mounting plate (420); Wherein, the variant connection structure (410) comprises: A connecting seat (411) is used to connect a group of the carriers (200), a position avoidance cavity (411a) is provided in the connecting seat (411), a threaded hole (411b) is further provided at one end of the connecting seat (411) away from the carrier (200), the threaded hole (411b) is connected to the position avoidance cavity (411a), a keyway (411c) is further provided in the threaded hole (411b), and the keyway (411c) extends horizontally toward the carrier (200); A connecting rod (412) is connected to the first mounting plate (420) and inserted into the connecting seat (411); a front section of the connecting rod (412) is provided with a key (412a); the key (412a) extends coaxially with the keyway (411c); the key (412a) can enter the avoidance cavity (411a) along the keyway (411c); a rear section of the connecting rod (412) is provided with an external thread (412b); after the key (412a) enters the avoidance cavity (411a), the external thread (412b) can be threadedly connected with the threaded hole (411b); The single-side alternating double-station wafer double-sided coating device also includes: A rotation driving member (430) used to drive the first mounting plate (420) to rotate; A translation driving member (440) used to drive the first mounting plate (420) to move along the extension direction of the key slot (411c); When the position change mechanism is required to work, the key (412a) is inserted into the key slot (411c), the rotary drive member (430) drives the first mounting plate (420) to rotate, and the two sets of the variable connection structures (410) revolve and exchange positions; When the rotating mechanism is required to work, the key (412a) leaves the key slot (411c) and enters the avoidance cavity (411a), and the translation drive member (440) continues to drive the first mounting plate (420) and the connecting rod (412) to translate toward the carrier (200), and the connecting seat (411) rotates through threaded transmission.

9. A coating method, which can be implemented by using the single-side alternating double-station wafer double-sided coating device according to any one of claims 1 to 8, characterized in that: The following steps are involved: Two groups of carriers (200) respectively fix a wafer, and both wafers are in a state where the A surface faces the target material (300); Perform the first coating, and complete the coating on the A side of the first wafer placed on top; The rotating mechanism is started, and the two sets of carriers (200) rotate, so that the two wafers are transformed into a state where the B surface faces the target material (300); The second coating is performed, and the B side of the first wafer is coated; The position exchange mechanism is activated, and the two sets of carriers (200) revolve and exchange positions, so that the two wafers are both changed to a state where the A surface faces the target material (300); The third coating is performed, and the A side of the second wafer is coated; The rotating mechanism is started, and the two sets of carriers (200) rotate, so that the two wafers are transformed into a state where the B surface faces the target material (300); The fourth coating is performed and the B side of the second wafer is coated.

10. The coating method according to claim 9, characterized in that: After the fourth coating is completed, the position exchange mechanism is started, and the two sets of carriers (200) revolve again and exchange positions, so that the two wafers are changed to a state where the A surface faces the target material 300; The two wafers are reset to correct the wafer status.

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