A method for alkali boiling treatment of surface oxide layer of high temperature alloy chips

Abstract

The present invention provides an alkali boiling treatment method for the surface oxide layer of high-temperature alloy chips, comprising the following steps: step S1. sorting out the inclusions in the alloy, and then selecting the surface oxidized high-temperature alloy chips in the alloy for standby; step S2. adding alkali solution to the alkali boiling pool, controlling the concentration of the alkali solution to be not less than 30%, and then heating the alkali solution and keeping it warm; step S3. putting the high-temperature alloy chips into the hanging fence, and hanging the hanging fence into the alkali boiling pool through the suspension arm for alkali boiling; step S4. washing and drying the high-temperature alloy chips to obtain the high-temperature alloy chips with the surface oxide layer removed. The alkali boiling treatment method for the surface oxide layer of high-temperature alloy chips of the present invention develops a fast, efficient and pollution-free treatment technology by sorting, magnetically separating and selecting the surface oxidized high-temperature alloy chips, realizing the batch stable treatment and reuse of high-temperature alloy chips, greatly reducing the waste of resources and reducing the production cost, and is an effective way to expand the recycling channels of high-temperature alloys.

Description

Technical Field

[0001] The invention relates to the technical field of high-temperature alloys, and in particular to an alkali boiling treatment method for an oxide layer on the surface of a high-temperature alloy scrap. Background Art

[0002] High-temperature alloys are an important aerospace material with excellent high temperature resistance, high strength, and high corrosion resistance, and are widely used in engine manufacturing and other fields. However, during its processing, scraps are inevitably generated. How to effectively deal with these scraps and realize resource recycling has become a difficult problem. Overcoming this problem is of great significance to promoting the development of related industries.

[0003] Under the high temperature generated by turning, high-temperature alloy chips come into contact with the air and a layer of oxide is produced on the surface, which will have an adverse effect on the mechanical properties, corrosion resistance and thermal stability of the alloy material. At present, most high-temperature alloy chips can only be sold or downgraded for use, or the surface oil stains can be removed through alkaline washing process. However, due to the fast process of alkaline washing, the high-temperature alloy chips cannot be in contact and react with the alkaline solution for a long time, and the surface oxide layer cannot be removed. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for alkali boiling treatment of the surface oxide layer of high-temperature alloy chips. By sorting, magnetic separation and selecting the high-temperature alloy chips with oxidized surfaces, a fast, efficient and pollution-free treatment technology is developed to achieve batch stable treatment and reuse of high-temperature alloy chips, which greatly reduces resource waste and production costs. It is an effective way to expand the recycling channels of high-temperature alloys.

[0005] The technical solution adopted by the present invention is:

[0006] A method for alkali boiling treatment of the oxide layer on the surface of high-temperature alloy chips, comprising the following steps:

[0007] Step S1. sorting out the inclusions in the high-temperature alloy, and then selecting the high-temperature alloy chips with surface oxidation in the high-temperature alloy for standby use;

[0008] Step S2. Add alkali solution to the alkali boiling tank, control the alkali solution concentration to be not less than 30%, and then heat and keep the alkali solution in the alkali boiling tank warm;

[0009] Step S3. Place the high temperature alloy chips selected in step S1 into the hanging fence, and hang the hanging fence into the alkali boiling tank through the suspension arm for alkali boiling;

[0010] Step S4: The high-temperature alloy chips that have been alkali-boiled in step S3 are cleaned and then dried to obtain high-temperature alloy chips with the surface oxide layer removed.

[0011] Preferably, in the alkali boiling treatment method for the surface oxide layer of the high-temperature alloy chips, step S1 specifically comprises: confirming whether the high-temperature alloy chips are of the same grade by sorting, subjecting the high-temperature alloy chips of the same grade to magnetic separation and adsorption of iron-containing inclusions, and then selecting the high-temperature alloy chips with oxidized surfaces by surface color difference and surface state classification.

[0012] Preferably, in the alkali boiling treatment method for the surface oxide layer of the high-temperature alloy chips, the heating temperature of step S2 is 85° C. to 100° C., and the holding time is 1-2 hours.

[0013] Preferably, in the alkali boiling treatment method for the surface oxide layer of the high-temperature alloy chips, the alkali solution in step S2 is an aqueous solution of sodium hydroxide and potassium hydroxide, and the mass ratio of sodium hydroxide to potassium hydroxide is 3:3-4.

[0014] Preferably, in the alkali boiling treatment method for the surface oxide layer of the high-temperature alloy chips, the alkali boiling time in step S3 is 12 hours to 36 hours.

[0015] Preferably, in the alkali boiling treatment method for the surface oxide layer of the high-temperature alloy chips, the high-temperature alloy chips are cleaned by a high-pressure water gun in step S4, the drying temperature is 180-200° C., and the drying time is 30-40 min.

[0016] Preferably, in the alkali boiling treatment method for the surface oxide layer of the high-temperature alloy chips, the carbon residue on the surface of the high-temperature alloy chips after the surface oxide layer is removed in step S4 is ≤150ppm.

[0017] Advantages of the present invention:

[0018] The alkali boiling treatment method of the surface oxide layer of high-temperature alloy chips of the present invention develops a fast, efficient and pollution-free treatment technology by sorting, magnetically separating and selecting the high-temperature alloy chips with surface oxidation, so as to realize the reuse of high-temperature alloy chips after batch stable treatment, greatly reduce the waste of resources, reduce the production cost, and is an effective way to expand the recycling channels of high-temperature alloys. DETAILED DESCRIPTION

[0019] The present invention will be further described below in conjunction with specific embodiments.

[0020] Example 1

[0021] A method for alkali boiling treatment of an oxide layer on the surface of a high-temperature alloy scrap material comprises the following steps:

[0022] Step S1. Confirm whether the high-temperature alloy chips are of the same grade by sorting, separate and adsorb iron-containing inclusions from the GH4169 high-temperature alloy chips of the same grade by magnetic separation, and then select the high-temperature alloy chips with surface oxidation by surface color difference and surface state classification for standby use;

[0023] Step S2. Add alkali solution into the alkali boiling pool, the alkali solution is an aqueous solution of sodium hydroxide and potassium hydroxide, the mass ratio of sodium hydroxide to potassium hydroxide is 3:4, and the concentration of the alkali solution is controlled to be 30%, and then the alkali solution in the alkali boiling pool is heated and kept warm, the heating temperature is 85°C, and the insulation time is 1h;

[0024] Step S3. Place the high temperature alloy chips selected in step S1 into the hanging rail, and hang the hanging rail into the alkali boiling tank through the suspension arm for alkali boiling for 12 hours;

[0025] Step S4. The high-temperature alloy chips that have been alkali-boiled in step S3 are cleaned of residual alkali solution on the surface by a high-pressure water gun, and then dried at a temperature of 180° C. for 40 minutes to obtain high-temperature alloy chips with a surface carbon residue of ≤150ppm.

[0026] Example 2

[0027] A method for alkali boiling treatment of an oxide layer on the surface of a high-temperature alloy scrap material comprises the following steps:

[0028] Step S1. Confirm whether the high-temperature alloy chips are of the same grade by sorting, separate and adsorb iron-containing inclusions from the GH3625 high-temperature alloy chips of the same grade by magnetic separation, and then select the high-temperature alloy chips with oxidized surface by surface color difference and surface state classification for standby use;

[0029] Step S2. Add alkali solution into the alkali boiling tank, the alkali solution is an aqueous solution of sodium hydroxide and potassium hydroxide, the mass ratio of sodium hydroxide to potassium hydroxide is 3:4, and the concentration of the alkali solution is controlled to be 35%. Then, the alkali solution in the alkali boiling tank is heated and kept warm at a heating temperature of 90°C and a holding time of 1h;

[0030] Step S3. Place the high temperature alloy chips selected in step S1 into the hanging rail, and hang the hanging rail into the alkali boiling tank through the suspension arm for alkali boiling for 24 hours;

[0031] Step S4. The high-temperature alloy chips that have been alkali-boiled in step S3 are cleaned of residual alkali solution on the surface by a high-pressure water gun, and then dried at a temperature of 190° C. for 30 minutes to obtain high-temperature alloy chips with a surface carbon residue of ≤150ppm.

[0032] Example 3

[0033] A method for alkali boiling treatment of an oxide layer on the surface of a high-temperature alloy scrap material comprises the following steps:

[0034] Step S1. Confirm whether the high-temperature alloy chips are of the same grade by sorting, separate and adsorb iron-containing inclusions from the GH4099 high-temperature alloy chips of the same grade by magnetic separation, and then select the high-temperature alloy chips with surface oxidation by surface color difference and surface state classification for standby use;

[0035] Step S2. Add alkali solution into the alkali boiling tank, the alkali solution is an aqueous solution of sodium hydroxide and potassium hydroxide, the mass ratio of sodium hydroxide to potassium hydroxide is 1:1, and the concentration of the alkali solution is controlled to be 40%, and then the alkali solution in the alkali boiling tank is heated and kept warm, the heating temperature is 100°C, and the insulation time is 2h;

[0036] Step S3. Place the high temperature alloy chips selected in step S1 into the hanging rail, and hang the hanging rail into the alkali boiling tank through the suspension arm for alkali boiling for 36 hours;

[0037] Step S4. The high-temperature alloy chips that have been alkali-boiled in step S3 are cleaned of residual alkali solution on the surface by a high-pressure water gun, and then dried at a temperature of 200° C. for 30 minutes to obtain high-temperature alloy chips with a surface carbon residue of ≤150 ppm.

[0038] The high temperature alloy chips processed by Example 1, Example 2 and Example 3 were subjected to performance tests, and the test results are shown in Table 1.

[0039] Table 1

[0040]

[0041] It can be concluded from Table 1 that the oxide content and C residue of the high temperature alloy chips treated by Example 1, Example 2 and Example 3 can meet the technical requirements and are equivalent to the level of new materials, indicating that the present invention has a good treatment effect.

[0042] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A method for alkali boiling treatment of the surface oxide layer of high temperature alloy chips, characterized in that: The following steps are involved: Step S1. sorting out the inclusions in the high-temperature alloy, and then selecting the high-temperature alloy chips with surface oxidation in the high-temperature alloy for standby use; Step S2. Add alkali solution to the alkali boiling tank, control the alkali solution concentration to be not less than 30%, and then heat and keep the alkali solution in the alkali boiling tank warm; Step S3. Place the high temperature alloy chips selected in step S1 into the hanging fence, and hang the hanging fence into the alkali boiling tank through the suspension arm for alkali boiling; Step S4: The high-temperature alloy chips that have been alkali-boiled in step S3 are cleaned and then dried to obtain high-temperature alloy chips with the surface oxide layer removed.

2. The alkali boiling treatment method for the surface oxide layer of high temperature alloy chips according to claim 1, characterized in that: Step S1 specifically includes: confirming whether the high-temperature alloy chips are of the same grade by sorting, subjecting the high-temperature alloy chips of the same grade to magnetic separation and adsorption of iron-containing inclusions, and then selecting the high-temperature alloy chips with oxidized surfaces by surface color difference and surface state classification.

3. The alkali boiling treatment method for the surface oxide layer of high temperature alloy chips according to claim 1, characterized in that: The heating temperature of step S2 is 85° C. to 100° C., and the insulation time is 1 to 2 hours.

4. The alkali boiling treatment method for the surface oxide layer of high temperature alloy chips according to claim 1, characterized in that: The alkali solution in step S2 is an aqueous solution of sodium hydroxide and potassium hydroxide, and the mass ratio of sodium hydroxide to potassium hydroxide is 3:3-4.

5. The alkali boiling treatment method for the surface oxide layer of high temperature alloy chips according to claim 1, characterized in that: The alkali boiling time in step S3 is 12h to 36h.

6. The alkali boiling treatment method for the surface oxide layer of high temperature alloy chips according to claim 1, characterized in that: In step S4, the high temperature alloy chips are cleaned by a high pressure water gun, the drying temperature is 180-200° C., and the drying time is 30-40 minutes.

7. The alkali boiling treatment method for the surface oxide layer of high temperature alloy chips according to claim 1, characterized in that: In step S4, the carbon residue on the surface of the high-temperature alloy chips after the surface oxide layer is removed is ≤150ppm.

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