Rotating device for semiconductor equipment

Abstract

The invention discloses a rotating device for semiconductor equipment, and belongs to the technical field of semiconductor equipment. The semiconductor equipment comprises a cavity and a tray located in the cavity, the rotating device comprises a driving part and a transmission mechanism, the driving part is located outside the cavity, the input end of the transmission mechanism is connected with the driving part, the output end of the transmission mechanism is connected with the tray, and the driving part drives the tray to rotate through the transmission mechanism; the transmission mechanism is connected with the cavity in a sealed mode, and the transmission mechanism is made of high-temperature-resistant and abrasion-resistant metal materials. The rotating device for the semiconductor equipment is suitable for a silicon carbide epitaxial growth environment, ensures the uniformity and stability of the rotating speed of the tray, prevents particles and the like from influencing the process environment, and improves the product quality.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a rotating device for semiconductor equipment. Background Art

[0002] Silicon carbide epitaxial growth refers to the growth of a single crystal layer with certain requirements on a silicon carbide substrate. The chemical vapor deposition (CVD) process currently used has strict growth environment requirements (100mbar low pressure, 1600℃ high temperature), so the structure of the rotating tray used to carry silicon carbide has high requirements.

[0003] In the related art, the rotating tray includes a tray, a support member made of graphite and a center column. The middle part of the tray is arranged on the top of the center column and on the support member. An air passage is left inside the lower support member, and gas guide grooves are evenly distributed on the back of the tray. As the amount of gas in the air passage increases, the upper tray floats and rotates along the gas flow direction, that is, the airflow is used to drive the tray to rotate.

[0004] However, the uniformity of the tray rotation speed is closely related to the design of the air channel and the gas guide groove. Specifically, the number of air holes is 2 or 3, which cannot achieve completely uniform airflow distribution, which easily causes the tray to shake up and down, causing the tray rotation speed to change. In addition, since the air-floating tray will constantly rub against the support during the rotation process, graphite particles will be generated, which can easily enter the reaction chamber under the blowing of gas, affecting the process environment and causing fatal defects in the silicon carbide substrate. Summary of the invention

[0005] The object of the present invention is to provide a rotating device for semiconductor equipment, which is suitable for the silicon carbide epitaxial growth environment, ensures the uniformity and stability of the tray rotation speed, avoids particles and the like from affecting the process environment, and improves product quality.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A rotating device for semiconductor equipment, the semiconductor equipment comprising a cavity and a tray located in the cavity, the rotating device comprising:

[0008] A driving member, the driving member being located outside the cavity;

[0009] A transmission mechanism, wherein an input end of the transmission mechanism is connected to the driving member, an output end of the transmission mechanism is connected to the tray, and the driving member drives the tray to rotate through the transmission mechanism; the transmission mechanism is sealed and connected to the cavity;

[0010] The transmission mechanism is made of high temperature resistant and wear resistant metal material.

[0011] In some possible implementations, the transmission mechanism includes a rotating shaft assembly, which passes through and is sealedly connected to the cavity, with one end of the rotating shaft assembly extending into the cavity and the other end being connected to the driving member.

[0012] In some possible embodiments, the rotating shaft assembly includes at least two rotating shafts and a coupling for connecting two adjacent rotating shafts; the coupling is located in the cavity, one rotating shaft passes through the cavity, and at least one rotating shaft is located in the cavity.

[0013] In some possible embodiments, the transmission mechanism also includes a driving bevel gear and a driven bevel gear that are meshed with each other, and a center column that is perpendicular to the rotating shaft assembly, the tray and the driven bevel gear are both connected to the center column, and the driving bevel gear is connected to the rotating shaft assembly.

[0014] In some possible implementations, the rotating device further includes a bearing, the rotating shaft assembly is mounted on the cavity via the bearing, and the bearing is made of a high temperature resistant, self-lubricating material.

[0015] In some possible implementations, the high temperature resistant and wear resistant metal material is molybdenum; and / or the high temperature resistant and self-lubricating material is graphite or modified ceramics.

[0016] In some possible embodiments, the rotating device also includes a magnetic fluid sealing mechanism, the outer shell of the magnetic fluid sealing mechanism is sealingly connected to the outside of the cavity, the rotating shaft assembly passes through the magnetic fluid sealing mechanism, and one end extends out of the magnetic fluid sealing mechanism to extend into the cavity and connect with the transmission mechanism, and the other end extends out of the magnetic fluid sealing mechanism to connect with the driving member.

[0017] In some possible implementations, the magnetic fluid sealing mechanism is located outside the cavity, the magnetic fluid sealing mechanism includes a shell, and the driving member is fixed to the shell.

[0018] In some possible implementations, the rotating device further includes a speed measuring component, and the speed measuring component is used to measure the rotational speed of the rotating shaft assembly.

[0019] In some possible embodiments, the speed measuring assembly includes a sensor and a measuring block, the measuring block is disposed at one end of the rotating shaft assembly extending out of the cavity, the sensor is fixed to the outside of the cavity, and the sensor is used to detect the measuring block to measure the rotational speed of the rotating shaft assembly.

[0020] Beneficial effects of the present invention:

[0021] The present invention provides a rotating device for semiconductor equipment, which includes a driving member and a transmission mechanism. The input end of the transmission mechanism is connected to the driving member, and the output end of the transmission mechanism is connected to a tray. The driving member drives the tray to rotate through the transmission mechanism. The mechanical transmission of the driving member and the transmission mechanism replaces the airflow-driven tray rotation structure in the related technology, which can achieve uniformity and stability of the tray rotation speed and also avoid blowing particles into the cavity under the blowing of gas, thereby affecting product quality.

[0022] The driving part is located outside the cavity, and at least part of the transmission mechanism is located inside the cavity. The transmission mechanism and the cavity are sealed and connected to ensure the sealing requirements of the cavity. Since the driving part is located outside the cavity, the material requirements of the driving part are reduced. The transmission mechanism located inside the cavity is made of high-temperature resistant and wear-resistant metal materials, so that the transmission mechanism is suitable for the harsh epitaxial growth environment of silicon carbide (such as 100mbar low pressure and 1600℃ high temperature), so that the rotating device is suitable for the epitaxial growth environment. It solves the problem that the rotation of the tray in the low-pressure and high-temperature environment during the silicon carbide epitaxy process is difficult to achieve through conventional structures, such as the motor directly driving the tray to rotate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of a semiconductor device provided by a specific embodiment of the present invention;

[0024] Figure 2 is a cross-sectional view of a semiconductor device provided by a specific embodiment of the present invention;

[0025] Figure 3 yes Figure 2 A local enlarged view of point A;

[0026] Figure 4 yes Figure 2 A partial enlarged view of point B.

[0027] In the figure:

[0028] 100, rotating device; 110, driving member; 120, transmission mechanism; 121, driving bevel gear; 122, driven bevel gear; 124, center column; 130, rotating shaft assembly; 131, rotating shaft; 132, coupling; 140, bearing; 150, magnetic fluid sealing mechanism; 160, speed measuring assembly; 161, sensor; 162, measuring block; 170, belt transmission assembly; 171, driving pulley; 172, driven pulley; 173, synchronous belt; 180, fixed seat; 181, ear plate; 190, protective cover;

[0029] 200, cavity; 210, mounting block; 220, shell; 230, first cover plate; 240, second cover plate; 250, cylinder; 300, tray; 400, support member; 410, accommodating cavity; 420, first mounting hole; 430, second mounting hole; 440, limiting groove. DETAILED DESCRIPTION

[0030] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] like Figure 1-Figure 4As shown, the present embodiment provides a rotating device for semiconductor equipment, the semiconductor equipment includes a cavity 200 arranged in a horizontal direction and a tray 300 located in the cavity 200, the rotating device 100 includes a driving member 110 and a transmission mechanism 120, the input end of the transmission mechanism 120 is connected to the driving member 110, the output end of the transmission mechanism 120 is connected to the tray 300, and the driving member 110 drives the tray 300 to rotate through the transmission mechanism 120; the mechanical transmission of the driving member 110 and the transmission mechanism 120 replaces the airflow driven tray 300 rotation structure in the related art, which can not only achieve the uniformity and stability of the rotation speed of the tray 300, but also avoid blowing particles into the cavity 200 under the blowing of gas, thereby avoiding affecting the product quality.

[0034] The driving member 110 is located outside the cavity 200, and the transmission mechanism 120 is sealed and connected to the cavity 200, that is, at least part of the transmission mechanism 120 is located inside the cavity 200, thereby ensuring the sealing requirements of the cavity 200. Since the driving member 110 is located outside the cavity 200, the material requirements of the driving member 110 are reduced. The transmission mechanism 120 located inside the cavity 200 is made of high-temperature resistant and wear-resistant metal materials, so that the transmission mechanism 120 is suitable for the harsh epitaxial growth environment of silicon carbide (such as 100mbar low pressure and 1600℃ high temperature), so that the rotating device 100 is suitable for the epitaxial growth environment. The problem that the rotation of the tray 300 in a low-pressure and high-temperature environment during the silicon carbide epitaxy process is difficult to achieve through conventional structures, such as the motor directly driving the tray 300 to rotate.

[0035] The cavity 200 includes a shell 220, a first cover plate 230, a cylinder 250 and a second cover plate 240. The first cover plate 230 is installed at the opening of the shell 220, the cylinder 250 is installed outside the first cover plate 230, and the second cover plate 240 is installed at the other end of the cylinder 250. The tray 300 and part of the transmission mechanism 120 are installed in the shell 220. By setting two cover plates, the first cover plate 230 and the second cover plate 240, the sealing of the cavity 200 is improved; when the cavity 200 has a heating element for heating, the two cover plates can improve the insulation effect. The cavity 200 can be used as a reaction chamber for deposition reaction of silicon carbide placed on the tray 300, or the cavity 200 can also be used as other transfer chambers, etc., which are set according to needs without limitation.

[0036] The housing 220 has an opening on one side with a flange, on which the cylinder 250 and the first cover plate 230 are mounted. The cylinder 250 has a flange on one side facing the second cover plate 240, on which the second cover plate 240 is mounted, for easy installation.

[0037] The rotating device 100 includes a shaft assembly 130, which passes through and is sealed to the cavity 200. One end of the shaft assembly 130 is connected to the transmission mechanism 120, and the other end is connected to the driving member 110. That is, the shaft assembly 130 is the connection between the transmission mechanism 120 and the driving member 110. Since the shaft assembly 130 is partially located in the cavity 200, the shaft assembly 130, that is, the rotating shaft 131 and the coupling 132 are made of high-temperature resistant and wear-resistant metal materials, so that the shaft assembly 130 is suitable for the harsh epitaxial growth environment of silicon carbide.

[0038] The rotating shaft assembly 130 includes at least two rotating shafts 131 and a coupling 132 for connecting two adjacent rotating shafts 131; illustratively, the two rotating shafts 131 are coaxially arranged. The coupling 132 is located in the cavity 200, one rotating shaft 131 passes through the cavity 200, and at least one rotating shaft 131 is located in the cavity 200. Exemplarily, three rotating shafts 131 and two couplings 132 are provided, such as a slider coupling, two adjacent rotating shafts 131 are connected by a slider coupling, the first rotating shaft 131 extends from the second mounting hole 430 of the support member 400, the second rotating shaft 131 is respectively installed on the mounting block 210 and the first cover plate 230 through two bearings 140, and the third rotating shaft 131 passes through the second cover plate 240, a part of which is located in the cylinder 250, and the other part is arranged outside the cylinder 250 to connect with the driving member 110. By setting up multiple rotating shafts 131 and connecting adjacent rotating shafts 131 through couplings 132, the internal space of the cavity 200 can be matched, that is, the rotating shaft assembly 130 of the split structure can avoid the rotating shaft 131 of the single integrated structure being too long to affect the structural accuracy, and facilitates installation.

[0039] In one embodiment, the transmission mechanism 120 further includes a driving bevel gear 121 and a driven bevel gear 122 meshingly connected to each other, and a central column 124 perpendicular to the rotating shaft 131, the tray 300 and the driven bevel gear 122 are both connected to the central column 124, the driving bevel gear 121 is connected to the rotating shaft 131, the rotating shaft 131 passes through and is rotatably connected to the cavity 200, the driving bevel gear 121, the driven bevel gear 122, the central column 124 and at least part of the rotating shaft 131 are all located in the cavity 200, that is, the above structures are all made of high temperature resistant and wear-resistant metal materials. In this embodiment, the rotating shaft 131 passes through the first cover plate 230, the cylinder 250 and the second cover plate 240, one end of which is located in the cavity 200 and connected to the driving bevel gear 121, and the other end is located outside the cavity 200 and connected to the driving member 110. The driving bevel gear 121 and the driven bevel gear 122 are meshed and connected to realize transmission, which has a compact structure, high transmission efficiency and good stability. Exemplarily, the active bevel gear 121 and the rotating shaft 131 are separate structures, and the active bevel gear 121 is sleeved on the central column 124 and fixed by a plug screw. In addition, by the separate arrangement of the rotating shaft assembly 130, the transmission mechanism 120, i.e., the bevel gear assembly, has slight vibration during transmission, and the rotating shaft 131 is connected by the coupling 132 to buffer the vibration.

[0040] In other embodiments, the transmission mechanism 120 includes a worm wheel, a worm and a center column 124, the tray 300 and the worm wheel are both mounted on the center column 124, the worm wheel and the worm are meshed and connected, the worm and the center column 124 are perpendicular, the worm is connected to the driving member 110, passes through and is rotatably connected to the cavity 200, the worm wheel, the center column 124 and at least part of the worm are all located in the cavity 200, the driving member 110 drives the worm to rotate, drives the worm wheel and the center column 124 to rotate, and thus drives the tray 300 to rotate. In this embodiment, the worm passes through the first cover plate 230, the barrel 250 and the second cover plate 240, one end of which is located in the cavity 200 and meshes with the worm wheel, and the other end is located outside the cavity 200 and connected to the driving member 110.

[0041] The semiconductor device further comprises a support member 400 supported and installed in the cavity 200, the support member 400 is provided with a receiving cavity 410, the active bevel gear 121 and the driven bevel gear 122 are both located in the receiving cavity 410, the center column 124 and the rotating shaft 131 are respectively installed in the first mounting hole 420 and the second mounting hole 430 of the support member 400, one end of the center column 124 extends out of the support member 400 to connect with the tray 300, the tray 300 is supported on the support member 400, and the support member 400 is made of a high temperature resistant and self-lubricating material. The support member 400 plays a supporting role and is used to support the transmission mechanism 120 and the tray 300 in the cavity 200. By arranging the active bevel gear 121, the driven bevel gear 122 and the center column 124 in the receiving cavity 410, the structure is made more compact. Since the support member 400 has high temperature resistance, it can be applied to the environment of epitaxial growth.

[0042] Optionally, the support member 400 has a limiting groove 440, the circumferential limit of the tray 300 is located in the limiting groove 440, and the bottom is located on the limiting groove 440. Since the support member 400 has self-lubricating properties, the tray 300 and the limiting groove 440 are smoothly connected, reducing the rotation resistance. The center column 124 is smoothly connected to the hole wall of the first mounting hole 420, and the rotating shaft 131 is smoothly connected to the hole wall of the second mounting hole 430, thereby reducing the rotation resistance.

[0043] Optionally, the support member 400 is directly mounted on the inner wall of the cavity 200, ie, the shell 220, or is mounted on the inner wall of the shell 220 through an adapter, without limitation.

[0044] The rotating device 100 also includes a bearing 140, such as a fisheye ball bearing, and the rotating shaft 131 is installed in the cavity 200 through the bearing 140. Specifically, a mounting block 210 is provided in the cavity 200, and fisheye ball bearings are respectively installed on the mounting block 210 and the first cover plate 230. The multiple fisheye ball bearings guide, protect and reduce friction for the rotating shaft 131, ensure the transmission level, and improve the durability of the rotating device 100. The bearing 140 is made of a high-temperature resistant, self-lubricating material to ensure that the bearing 140 can be used in the epitaxial growth environment of silicon carbide. In addition, the bearing 140 in the vacuum reaction, grease lubrication will pollute the process, and it needs to be made of a self-lubricating material, and the high-temperature resistant, self-lubricating material is graphite or modified ceramics. The strength of parts made of graphite will also increase with increasing temperature.

[0045] The high temperature resistant and wear resistant metal material is molybdenum, which ensures the service life of the rotating device 100.

[0046] The rotating device 100 further includes a magnetic fluid sealing mechanism 150, the outer shell of which is sealingly connected to the outside of the cavity 200, and the rotating shaft 131 passes through the magnetic fluid sealing mechanism 150, and one end of which extends out of the magnetic fluid sealing mechanism 150 to extend into the cavity 200. Specifically, the outer shell of the magnetic fluid sealing mechanism 150 is installed on the outside of the second cover plate 240, and a sealing connection is achieved through a sealing ring, thereby achieving a sealed connection between the magnetic fluid sealing mechanism and the cavity 200. The third rotating shaft 131 passes through the magnetic fluid sealing mechanism 150, and a rotary sealing connection between the rotating shaft 131 and the magnetic fluid sealing mechanism 150 is achieved, thereby achieving a rotary sealing connection between the rotating shaft 131 and the cavity 200. The rotating shaft 131 and the cavity 200 achieve a dynamic seal with a vacuum leakage rate of less than 5e9mbar·L / s and the transmission of rotary motion through the magnetic fluid sealing mechanism 150. The specific description is as follows: under the action of a uniform and stable magnetic field, the magnetic fluid can form a multi-stage liquid "O-ring" around the rotating shaft 131. Even when the rotating shaft 131 rotates at a high speed, no friction between solids will occur, thereby forming a high-performance dynamic seal. The magnetic fluid sealing mechanism 150 is a prior art and can be purchased, so it will not be described in detail. The driving member 110 is fixed to the outer shell of the magnetic fluid sealing mechanism 150 located outside the cavity 200.

[0047] The driving member 110 is a motor such as a stepper motor or a servo motor, or the driving member 110 can also be a cylinder, etc., without limitation. The motor drive facilitates the rotation speed adjustment of the tray 300, and can provide the best working rotation speed during the epitaxial process, which is convenient and easy to control as a whole.

[0048] In this embodiment, the driving member 110 is taken as an example of a motor for illustrative description. A fixing seat 180 is installed on the housing, and the motor is installed through the fixing seat 180, so that the motor is stably installed.

[0049] Optionally, the fixed seat 180 is a hollow structure, and a belt transmission assembly 170 is installed inside it, including a driving pulley 171, a driven pulley 172 and a synchronous belt 173, and the synchronous belt 173 is wound around the driving pulley 171 and the driven pulley 172. The output shaft of the motor is used to drive the driving pulley 171, and the driven pulley 172 is connected to the rotating shaft 131, so that the motor drives the rotating shaft 131 to rotate through the belt transmission assembly 170. Optionally, the output shaft of the motor and the driving pulley 171 can be directly connected, or indirectly connected through a transmission shaft, such as the output shaft of the motor and the transmission shaft are connected through a coupling 132, and the transmission shaft is connected to the driving pulley 171. The driven pulley 172 and the rotating shaft 131 can be directly connected, or indirectly connected through an intermediate sleeve, such as the intermediate sleeve is connected between the driven gear and the rotating shaft 131.

[0050] The motor drives the belt transmission assembly 170 to drive the third rotating shaft 131 to rotate, drives the coupling 132 and the first and second rotating shafts 131 in the cavity 200 to rotate, drives the center column 124 to rotate through the active bevel gear 121 and the driven bevel gear 122, thereby driving the rotation of the tray 300.

[0051] The rotating device 100 also includes a speed measuring component 160, which is used to measure the rotation speed of the rotating shaft 131. The speed measuring component 160 can calculate the rotation speed of the current tray 300 in real time. Further, the speed measuring component 160 includes a sensor 161 and a measuring block 162. The sensor 161 is, for example, a non-contact proximity switch. The measuring block 162 is arranged at one end of the rotating shaft 131 extending out of the cavity 200. The sensor 161 is fixedly arranged outside the cavity 200. The sensor 161 is used to detect the measuring block 162 to measure the rotation speed of the rotating shaft 131. Exemplarily, the measuring block 162 is installed on the mounting sleeve, and the end of the third rotating shaft 131 located outside the cavity 200 is sleeved with a mounting sleeve, or the driven pulley 172 is installed with a mounting sleeve. Since the driven pulley 172 and the rotating shaft 131 are fixedly connected, the two rotate at the same time, so the mounting sleeve can be installed according to the needs. The fixing seat 180 is provided with an ear plate 181, on which a non-contact proximity switch is installed. The non-contact proximity switch senses the frequency of the measuring block 162 to measure the rotation speed of the rotating shaft 131, and then the rotation speed of the tray 300 can be calculated according to the transmission ratio of the driving bevel gear 121 and the driven bevel gear 122. A protective cover 190 is provided on the ear plate 181 to protect all structures at the rear of the rotating shaft 131.

[0052] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A rotating device for a semiconductor device, the semiconductor device comprising a cavity (200) and a tray (300) located in the cavity (200), characterized in that: The rotating device (100) comprises: A driving member (110), wherein the driving member (110) is located outside the cavity (200); a transmission mechanism (120), wherein an input end of the transmission mechanism (120) is connected to the driving member (110), an output end of the transmission mechanism (120) is connected to the tray (300), and the driving member (110) drives the tray (300) to rotate through the transmission mechanism (120); the transmission mechanism (120) and the cavity (200) are sealed and connected; The transmission mechanism (120) is made of a high temperature resistant and wear resistant metal material.

2. The rotating device for semiconductor equipment according to claim 1, characterized in that: The transmission mechanism (120) comprises a rotating shaft assembly (130), which passes through and is sealedly connected to the cavity (200), with one end of the rotating shaft assembly (130) extending into the cavity (200) and the other end being connected to the driving member (110).

3. The rotating device for semiconductor equipment according to claim 2, characterized in that: The rotating shaft assembly (130) comprises at least two rotating shafts (131) and a coupling (132) for connecting two adjacent rotating shafts (131); the coupling (132) is located in the cavity (200), one rotating shaft (131) passes through the cavity (200), and at least one rotating shaft (131) is located in the cavity (200).

4. The rotating device for semiconductor equipment according to claim 2, characterized in that: The transmission mechanism (120) further comprises a driving bevel gear (121) and a driven bevel gear (122) which are meshed and connected to each other, and a central column (124) which is perpendicular to the rotating shaft assembly (130); the tray (300) and the driven bevel gear (122) are both connected to the central column (124); and the driving bevel gear (121) is connected to the rotating shaft assembly (130).

5. The rotating device for semiconductor equipment according to claim 2, characterized in that: The rotating device (100) further comprises a bearing (140), the rotating shaft assembly (130) is mounted on the cavity (200) via the bearing (140), and the bearing (140) is made of a high temperature resistant and self-lubricating material.

6. The rotating device for semiconductor equipment according to claim 5, characterized in that: The high temperature resistant and wear resistant metal material is molybdenum; and / or the high temperature resistant and self-lubricating material is graphite or modified ceramic.

7. The rotating device for semiconductor equipment according to claim 2, characterized in that: The rotating device (100) further comprises a magnetic fluid sealing mechanism (150), the outer shell of which is sealingly connected to the outside of the cavity (200), the rotating shaft assembly (130) passes through the magnetic fluid sealing mechanism (150), and one end of the rotating shaft assembly (130) extends out of the magnetic fluid sealing mechanism (150) to extend into the cavity (200), and the other end of the rotating shaft assembly (130) extends out of the magnetic fluid sealing mechanism (150) to connect with the driving member (110).

8. The rotating device for semiconductor equipment according to claim 7, characterized in that: The magnetic fluid sealing mechanism (150) is located outside the cavity (200), and the magnetic fluid sealing mechanism (150) comprises a housing, and the driving member (110) is fixed to the housing.

9. The rotating device for semiconductor equipment according to any one of claims 2 to 8, characterized in that: The rotating device (100) further comprises a speed measuring component (160), wherein the speed measuring component (160) is used to measure the rotation speed of the rotating shaft component (130).

10. The rotating device for semiconductor equipment according to claim 9, characterized in that: The speed measuring component (160) comprises a sensor (161) and a measuring block (162); the measuring block (162) is arranged at one end of the rotating shaft component (130) extending out of the cavity (200); the sensor (161) is fixedly arranged outside the cavity (200); and the sensor (161) is used to detect the measuring block (162) to measure the rotation speed of the rotating shaft component (130).

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