A temperature testing device and a temperature testing system for a circuit board

Abstract

The present invention provides a temperature testing device and a temperature testing system for a circuit board, wherein the temperature testing device comprises a bearing base, a positioning base, a temperature measuring module and an adjusting module; the positioning base is used to place the circuit board and is arranged on the bearing base; the temperature measuring module is arranged on the bearing base through an adjusting module, and the temperature measuring module is adjusted to be directly above the circuit board through the adjusting module; wherein the temperature measuring module comprises a plurality of temperature probes arranged in a matrix. The present invention can measure the temperature of a plurality of key circuit components at the same time, greatly improving the test efficiency; at the same time, the temperature detection is performed in a contactless manner, and there is no need to manually paste the temperature sensor, which greatly improves the detection efficiency, and also eliminates the risk of short circuit caused by the temperature sensor falling off.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board temperature testing, and in particular to a temperature testing device and a temperature testing system for a circuit board. Background Art

[0002] The rapid development of new energy vehicles has led to an increasing demand for high-power, high-efficiency automotive motor components. These components, such as electronic water pumps and oil pumps, are also subject to increasingly stringent temperature requirements for thermal management systems. During controller circuit design, many electronic components operate in high-current loops, which results in high self-heating. Severe ambient temperatures and component self-heating pose significant challenges to controller reliability; therefore, testing the performance of key electronic components under extreme temperatures is crucial to ensuring product reliability and stability.

[0003] To prevent the operating temperature of key components of the controller from exceeding the data sheet or design range during operation, resulting in a shortened lifespan or abnormality of the controller, it is necessary to measure the operating temperature of each component in the PCBA (printed circuit board) during the design and development process to ensure that it is within the predetermined temperature range. Currently, the commonly used testing method in test environments such as high and low temperature chambers is to use devices such as temperature sensors, thermistors, or thermocouples to monitor the surface temperature of the device. However, existing methods have the following drawbacks:

[0004] Complicated operation: One or more temperature sensors need to be manually attached to different control panels, and the environment needs to be manually configured, which increases the difficulty of operation.

[0005] Reliability issues: Temperature sensors are prone to falling off in high-temperature environments, which may cause short-circuit risks.

[0006] Complexity: When testing multiple devices, the wiring harness is complex and difficult to organize, resulting in low test efficiency.

[0007] In summary, there is an urgent need for a temperature testing device and a temperature testing system for a circuit board to solve the problems existing in the prior art. Summary of the Invention

[0008] The present invention aims to provide a temperature testing device and a temperature testing system for a circuit board, aiming to solve the shortcomings of the existing method for measuring whether the operating temperature of each component in the PCBA is within a predetermined temperature range. The specific technical solution is as follows:

[0009] A temperature testing device for a circuit board comprises a supporting base, a positioning base, a temperature measuring module and an adjustment module; the positioning base is used to place the circuit board and is arranged on the supporting base; the temperature measuring module is arranged on the supporting base via an adjustment module, and the temperature measuring module is adjusted to be directly above the circuit board via the adjustment module; wherein the temperature measuring module comprises a plurality of temperature probes arranged in a matrix.

[0010] Preferably, the positioning base and the supporting base, as well as the temperature measurement module and the adjustment module are detachably connected; the positioning base and the temperature measurement module are both provided with a variety of specifications and models.

[0011] Preferably, a positioning cavity is provided on the positioning base, and the positioning cavity is used to place a test product with a circuit board.

[0012] Preferably, the adjustment module includes a Y-direction adjustment component and a Z-direction adjustment component to enable the temperature measurement module to perform translational movement in the Y and Z directions; or, the adjustment module includes a Y-direction adjustment component, a Z-direction adjustment component and an X-direction adjustment component to enable the temperature measurement module to perform translational movement in the X, Y and Z directions.

[0013] Preferably, the Z-direction adjustment assembly, the Y-direction adjustment assembly and the X-direction adjustment assembly all include a sliding rod and a sliding sleeve, and the sliding sleeve is slidably mounted on the sliding rod and is limited by a locking member.

[0014] Preferably, the locking member is a limiting bolt, a threaded hole is provided on the sliding sleeve, and a groove along its own length direction is provided on the sliding rod; after the limiting bolt is screwed into the threaded hole, its end presses against the bottom surface of the groove to realize the upper limit of the sliding sleeve on the sliding rod.

[0015] Preferably, the bottom surface of the groove and the end surface of the limiting bolt that presses against the bottom surface of the groove are both rough surfaces; or, the end of the limiting bolt is provided with an anti-slip sleeve, the bottom surface of the groove is a rough surface, and the limiting bolt presses against the bottom surface of the groove through the anti-slip sleeve.

[0016] Preferably, the Z-direction adjustment assembly, the Y-direction adjustment assembly and the X-direction adjustment assembly all include a driving member, a slide rail and a slide table, the slide table is slidably arranged on the slide rail, and the driving member is used to drive the slide table to slide on the slide rail.

[0017] The present invention also provides a temperature testing system for a circuit board, comprising a multi-channel acquisition recorder and the temperature testing device, wherein the temperature measurement module is connected to the multi-channel acquisition recorder via a data line, and the multi-channel acquisition recorder is used to display and store the temperature value measured by the temperature measurement module.

[0018] Preferably, the multi-channel acquisition recorder includes an MCU and a signal amplification functional unit, an analog-to-digital conversion functional unit, an FIR filtering functional unit, a user interaction functional unit and a storage chip, all of which are electrically connected to the MCU.

[0019] The application of the technical solution of the present invention has the following beneficial effects:

[0020] In the temperature testing device of the present invention, the temperature measurement module includes multiple temperature probes arranged in a matrix, which can measure the temperatures of multiple key circuit components at the same time, greatly improving the testing efficiency; at the same time, the temperature measurement module can flexibly adjust its position by adjusting the module, and the temperature measurement module and the positioning base are both installed in a detachable manner, so that the temperature testing device of the present invention can meet the testing requirements of different types of products with circuit boards; the temperature measurement module uses a non-contact form to perform temperature detection on the devices on the circuit board, and there is no need to manually stick the temperature sensor, which greatly improves the detection efficiency and also eliminates the risk of short circuit caused by the temperature sensor falling off.

[0021] The temperature testing system of the present invention can store and display the temperature of each device on the circuit board, and eliminate interference signals from the environment or other heat sources through signal amplification, analog-to-digital conversion, modulation, filtering and other processing to ensure the accuracy of measurement; wherein, the temperature testing device and the multi-channel acquisition recorder are connected through a wiring harness set, and the multi-channel acquisition recorder is placed outside the high-temperature environment to avoid the influence of extreme temperature on the multi-channel acquisition recorder, and also solves the problem of complex and difficult to organize wiring harnesses in the prior art.

[0022] In addition to the above-described objects, features and advantages, the present invention has other objects, features and advantages. The present invention will be further described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 1 is a schematic structural diagram of the temperature testing device in Example 1;

[0025] Figure 2 is a cross-sectional view between the sliding rod and the sliding sleeve in Example 1;

[0026] Figure 3 2 is a schematic structural diagram of the temperature testing system in Example 2;

[0027] Figure 4 is a framework diagram of the temperature testing system in Example 2;

[0028] Among them, 1. Load-bearing base, 2. Positioning base, 3. Temperature measurement module, 4. Y-axis adjustment component, 5. Z-axis adjustment component, 6. Multi-channel acquisition recorder, 7. Slide rod, 8. Slide sleeve, 9. Limit bolt, 10. Groove, 11. Anti-slip sleeve. DETAILED DESCRIPTION

[0029] To facilitate understanding of the present invention, the present invention will be described more fully below, along with preferred embodiments thereof. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present invention.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0031] Example 1:

[0032] See also Figure 1-Figure 2 This embodiment provides a temperature testing device for a circuit board, comprising a supporting base 1, a positioning base 2, a temperature measuring module 3 and an adjustment module; the positioning base 2 is used to place the circuit board to be tested and is arranged on the supporting base 1; the temperature measuring module 3 is arranged on the supporting base 1 through the adjustment module, and the temperature measuring module 3 is adjusted to be directly above the circuit board through the adjustment module; wherein, the temperature measuring module 3 includes a plurality of temperature probes arranged in a matrix.

[0033] Specifically, the supporting base 1 is used to provide physical support for the entire temperature testing device, so that the temperature testing device can be stably placed on a laboratory bench, a high-temperature box or other work platform; when designing the supporting base 1, it is necessary to consider not only the supporting function, but also the impact of temperature changes during the test on the supporting base 1 itself.

[0034] Furthermore, a positioning cavity is provided on the positioning base 2, and the positioning cavity is used to place the test product with a circuit board (such as an electronic water pump, an electronic oil pump, etc.), such as Figure 1 The positioning base 2 is used to carry and position the test product, providing a stable and safe supporting environment for the test product to ensure that the test product is not disturbed during the test process and performs the test task stably.

[0035] Preferably, the positioning base 2 and the supporting base 1, as well as the temperature measurement module 3 and the adjustment module are all detachably connected; the positioning base 2 and the temperature measurement module 3 are both provided with a variety of specifications and models. By replacing the positioning base 2 and the temperature measurement module 3 of different specifications and models, it is possible to test circuit boards on different types of test products.

[0036] Specifically, the temperature measurement module includes multiple infrared temperature sensors arranged in a matrix, which can simultaneously measure the temperature of multiple key circuit components, greatly improving the test efficiency; depending on the different circuit boards, a temperature measurement module 3 with appropriate resolution can be selected for temperature testing.

[0037] Preferably, the adjustment module is used to flexibly adjust the position of the temperature measurement module 3 to accommodate test products of different types and heights. Depending on actual needs, the adjustment module may include a Y-axis adjustment component 4 and a Z-axis adjustment component 5 to enable translational movement of the temperature measurement module 3 in the Y and Z directions. Alternatively, the adjustment module may include a Y-axis adjustment component 4, a Z-axis adjustment component 5, and an X-axis adjustment component to enable translational movement of the temperature measurement module 3 in the X, Y, and Z directions. Furthermore, the X, Y, and Z directions are perpendicular to each other.

[0038] Specifically, the structures of the Y-direction adjustment component 4, the Z-direction adjustment component 5 and the X-direction adjustment component can be designed according to actual conditions, and can adopt an automatic adjustment method or a manual adjustment method.

[0039] When manual adjustment is used, the Z-axis adjustment assembly 5, the Y-axis adjustment assembly 4, and the X-axis adjustment assembly each include a slide bar 7 and a sleeve 8. The sleeve 8 is slidably mounted on the slide bar 7 and secured in place by a locking member. Specifically, the position of the sleeve 8 on the slide bar 7 is manually adjusted, and when the sleeve 8 is adjusted to the target position, the locking member locks the sleeve 8 in place, thereby preventing relative movement between the sleeve 8 and the slide bar 7.

[0040] Furthermore, the locking member is a limit bolt 9, a threaded hole is provided on the sliding sleeve 8, and a groove 10 is provided on the sliding rod 7 along its own length direction; after the limit bolt 9 is screwed into the threaded hole, its end portion presses against the bottom surface of the groove 10 to achieve the upper limit position of the sliding sleeve 8 on the sliding rod 7. Since the limit bolt 9 is locked and limited by tightening the sliding rod 7, if the groove 10 is not provided, the limit bolt 9 will directly press against the surface of the sliding rod 7, and the rigid contact between the limit bolt 9 and the surface of the sliding rod 7 may cause the surface of the sliding rod to be damaged, resulting in unevenness, thereby affecting the free sliding of the sliding sleeve 8 on the sliding rod 7; after the groove 10 is provided, the end portion of the limit bolt 9 is in rigid contact with the bottom surface of the groove 10, and the surface of the sliding rod 7 that cooperates with the sliding sleeve 8 will not be damaged by the limit bolt 9, which can ensure the normal sliding cooperation between the sliding rod 7 and the sliding sleeve 8.

[0041] Furthermore, in order to prevent the limiting bolt 9 from sliding after being tightened against the bottom surface of the groove, in this embodiment, the bottom surface of the groove 10 and the end surface of the limiting bolt 9 against the bottom surface of the groove are both set to rough surfaces, thereby increasing the friction between the end surface of the limiting bolt and the bottom surface of the groove; the rough surface can be achieved by sandblasting, wire drawing, etc. In this embodiment, the surface roughness of the rough surface is controlled to be greater than or equal to Ra12.5, and more preferably the surface roughness is greater than or equal to Ra25.

[0042] In addition, a method for preventing the limiting bolt from sliding after being tightened may also be: an anti-slip sleeve 11 is provided on the end of the limiting bolt 9, the bottom surface of the groove 10 is a rough surface, and the limiting bolt 9 is pressed against the bottom surface of the groove 10 through the anti-slip sleeve 11; the anti-slip sleeve 11 is made of a flexible material, which can deform under pressure and can be pressed against the bottom surface of the groove to generate a large friction force. At the same time, the deformation of the anti-slip sleeve 11 will also generate an elastic force on the limiting bolt 9, which can prevent the limiting bolt 9 from loosening due to self-rotation. Preferably, the flexible material can be silicone or rubber.

[0043] Preferably, in addition to the limiting bolt 9, the locking member may also be a latch. Specifically, a positioning hole 1 is provided on the sliding sleeve, and a plurality of positioning holes 2 are provided on the sliding rod along its length direction. The positioning hole 1 is aligned with a positioning hole 2 on the sliding rod and then locked using a latch; the position of the sliding sleeve on the sliding rod is changed by aligning the positioning hole 1 with positioning holes 2 at different positions and then locking using a latch.

[0044] Specifically, in this embodiment Figure 1The diagram shows that the adjustment module can realize the translational movement of the temperature measurement module 3 in the Y and Z directions, that is, the adjustment module includes a Y-direction adjustment component 4 and a Z-direction adjustment component 5, wherein the slide rod 7 in the Z-direction adjustment component is fixedly arranged on the supporting base 1, the slide rod 7 of the Y-direction adjustment component 4 is fixedly arranged on the slide sleeve 8 of the Z-direction adjustment component, and the temperature measurement module 3 is fixedly arranged on the slide sleeve 8 of the Y-direction adjustment component 4; further, the slide rod 7 of the Y-direction adjustment component 4 and the slide sleeve 8 of the Z-direction adjustment component can both adopt an integral molding design, that is, a slide sleeve 8 is provided at the end of the slide rod 7 of the Y-direction adjustment component 4, and the slide sleeve 8 is directly sleeved on the slide rod of the Z-direction adjustment component.

[0045] Furthermore, when an automatic adjustment method is adopted, the Z-direction adjustment component 5, the Y-direction adjustment component 4, and the X-direction adjustment component all include a driving member, a slide rail, and a slide table. The slide table is slidably arranged on the slide rail, and the driving member is used to drive the slide table to slide on the slide rail. When designing the specific structure, the X-direction adjustment component, the Z-direction adjustment component 5, and the Y-direction adjustment component 4 are generally stacked. The slide rail of the bottom adjustment component is fixedly set on the supporting base 1, the slide rail of the upper adjustment component is set on the slide table of the lower adjustment component, and the temperature measurement module 3 is set on the slide table of the upper adjustment component. In this way, the temperature measurement module 3 can be adjusted in the three directions of X, Y, and Z. For example, the X-direction adjustment component, the Z-direction adjustment component 5 and the Y-direction adjustment component 4 are stacked from bottom to top, the slide rail in the X-direction adjustment component is fixedly installed on the supporting base 1, the slide rail of the Z-direction adjustment component is fixedly set on the slide table of the X-direction adjustment component, the slide rail of the Y-direction adjustment component is fixedly set on the slide table of the Z-direction adjustment component, and the temperature measurement module 3 is fixedly set on the slide table of the Y-direction adjustment component.

[0046] Preferably, the driving member can be one of an oil cylinder, an air cylinder or an electric cylinder; at the same time, the driving member can also be a combination of a motor, a screw and a screw nut, or a combination of a motor, a gear and a rack. When a combination of a motor and a screw is used, the screw is arranged parallel to the slide rail, and the screw nut is installed on the slide. The motor drives the screw to rotate, thereby driving the slide to move along the slide rail; when a combination of a motor, a gear and a rack is used, the rack is arranged parallel to the slide rail, the motor is arranged on the slide and a gear is set at the output end of the motor. After the gear and the rack are meshed, the motor can drive the slide to move on the slide rail by forward and reverse rotation.

[0047] The advantages of the temperature testing device in this embodiment are: the temperature probe in the temperature measurement module can be adjusted according to the device layout of different circuit boards to ensure that it can meet the testing requirements of various test products and has high adaptability; it adopts a contactless acquisition method to prevent the temperature sensor from falling off at high temperatures and causing the risk of short circuit, thereby improving the safety of the test process and increasing reliability; the temperature measurement module can test multiple devices at the same time, reducing the time required for testing and improving test efficiency; it can realize an automated monitoring system, reduce manual intervention, and reduce operational complexity; through centralized monitoring, it can more accurately evaluate the performance of key circuit components under extreme ambient temperatures with high accuracy.

[0048] Example 2:

[0049] See also Figure 3 and Figure 4 This embodiment provides a temperature testing system for a circuit board, including a multi-channel acquisition recorder 6 and the temperature testing device of Example 1. The temperature measurement module 3 is connected to the multi-channel acquisition recorder 6 via a data line. The multi-channel acquisition recorder 6 is used to display and store the temperature value measured by the temperature measurement module 3.

[0050] Specifically, the temperature measurement module converts infrared radiation into electrical signals using the infrared radiation principle and the Stefan-Boltzmann law. The multi-channel acquisition recorder is used to convert the electrical signals of the temperature measurement module 3 into actual temperature values ​​and display and store them.

[0051] Furthermore, the Stefan-Boltzmann law states that the radiated power (P) of a black body (ideal radiator) is proportional to the fourth power of its absolute temperature (T):

[0052] P=εσT 4

[0053] Where P is the radiant power in watts per square meter (W / m 2 ); ε is the emissivity of the object (0≤ε≤1), which indicates the radiation ability of the object relative to an ideal black body; σ is the Stefan-Boltzmann constant, which is approximately 5.67×10-8W / (m 2 ·K 4 ); T is the absolute temperature of the object, measured in Kelvin (K).

[0054] The Stefan-Boltzmann law states that the intensity of infrared radiation from the surface of an object increases significantly with increasing temperature.

[0055] See also Figure 4The multi-channel acquisition recorder 6 includes an MCU (microcontroller unit) and a signal amplification function unit, an analog-to-digital conversion function unit, an FIR filtering function unit, a user interaction function unit and a storage chip, all of which are electrically connected to the MCU; wherein, the working principle of the multi-channel acquisition recorder 6 is: the analog signal output by the temperature measurement module 3 (i.e., the infrared temperature sensor) is input to the signal amplification function unit for amplification, the amplified analog signal is input to the analog-to-digital conversion function unit for conversion into a digital signal, the digital signal is input to the FIR filtering function unit for filtering processing and then transmitted to the MCU, the MCU performs modulation and secondary filtering processing and then outputs the measured temperature to the user interaction function unit for display; the storage chip is used to store the measured temperature output by the MCU.

[0056] The multi-channel acquisition recorder 6 of this embodiment is further described in detail below:

[0057] Since the signal collected by the temperature measurement module 3 (i.e., the infrared temperature sensor) is usually a weak analog signal, it needs to be processed by a signal amplification function unit for further analysis and processing. The signal amplification function unit is used to increase the weak electrical signal output by the temperature measurement module 3 to a processable range; a component circuit such as an operational amplifier (Op-Amp) is usually used to achieve amplification. The amplified signal will have sufficient amplitude to facilitate subsequent signal acquisition and digital processing. Since the amplified signal is a continuous analog signal, it needs to be converted into a digital signal by an analog-to-digital conversion function unit (i.e., an A / D converter). However, the digital signal may contain noise or irregular fluctuations after being processed by the analog-to-digital conversion function unit, so it is also necessary to use an FIR filtering function unit for filtering processing; in order to ensure smooth detection of temperature changes, filtering processing is very important for multi-channel acquisition recorders. The FIR filtering function unit (finite impulse response filter) has a linear phase characteristic and can effectively remove low-frequency noise without changing the time domain characteristics of the signal to smooth the signal and remove noise.

[0058] At the same time, to ensure that the temperature test system can still provide accurate measurement results under different ambient temperatures, the zero drift, gain drift, etc. generated by the temperature probe itself are usually corrected. Specifically, the temperature compensation data at different ambient temperatures are preset in the algorithm of the temperature test system. The temperature output by MCU modulation and secondary filtering needs to be added with the temperature compensation data before the measured temperature is displayed on the user interaction function unit to ensure the accuracy of the measurement.

[0059] Preferably, the signal amplification function unit, analog-to-digital conversion function unit, FIR filtering function unit, user interaction function unit, and the modulation algorithm and secondary filtering algorithm configured in the MCU are all existing technologies, so they are not described in detail in this embodiment.

[0060] Preferably, the temperature data obtained from the test is stored in a memory chip to ensure that the data is not lost and to facilitate subsequent review; at the same time, the data in the memory chip can be copied and transferred to a computer via a USB flash drive, which facilitates better data analysis of the temperature detection of each device on the circuit board.

[0061] Preferably, the user interaction function unit can enable the user to obtain the operating temperature of each component to be detected on the circuit board, and supports graphical display, which is convenient for the user to quickly understand and operate.

[0062] In actual applications, the temperature testing device is generally placed in a high-temperature environment to test the circuit board, while the multi-channel acquisition recorder 6 is placed outside the high-temperature environment. The temperature testing device and the multi-channel acquisition recorder are connected by a wiring harness to prevent extreme temperatures from affecting the multi-channel acquisition recorder 6. Preferably, the temperature testing range of the temperature testing device can be set to a test temperature range of -40°C to 150°C to meet the needs of different application environments.

[0063] In this embodiment, filtering technology is used to select the infrared radiation range required for measurement, helping to eliminate interference signals from the environment or other heat sources and ensure the accuracy of measurement; modulation technology is used to further enhance the signal and reduce noise. Modulation can be achieved by changing the signal frequency or pulse mode received by the sensor, thereby improving the signal-to-noise ratio and improving the stability and accuracy of the measurement.

[0064] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A temperature testing device for a circuit board, characterized in that: The invention comprises a bearing base (1), a positioning base (2), a temperature measurement module (3) and an adjustment module; the positioning base (2) is used to place a circuit board and is arranged on the bearing base (1); the temperature measurement module (3) is arranged on the bearing base (1) via the adjustment module, and the temperature measurement module (3) is adjusted to be directly above the circuit board via the adjustment module; wherein the temperature measurement module (3) comprises a plurality of temperature probes arranged in a matrix.

2. The temperature testing device for a circuit board according to claim 1, characterized in that: The positioning base (2) and the supporting base (1) as well as the temperature measurement module (3) and the regulating module are all detachably connected; the positioning base (2) and the temperature measurement module (3) are both provided with a variety of specifications and models.

3. The temperature testing device for a circuit board according to claim 2, characterized in that: The positioning base (2) is provided with a positioning cavity, and the positioning cavity is used for placing a test product with a circuit board.

4. The temperature testing device for a circuit board according to claim 1, characterized in that: The adjustment module comprises a Y-direction adjustment component (4) and a Z-direction adjustment component (5), so as to enable the temperature measurement module (3) to perform translational movement in the Y and Z directions; or, the adjustment module comprises a Y-direction adjustment component (4), a Z-direction adjustment component (5) and an X-direction adjustment component, so as to enable the temperature measurement module (3) to perform translational movement in the X, Y and Z directions.

5. The temperature testing device for a circuit board according to claim 4, characterized in that: The Z-axis adjustment component (5), the Y-axis adjustment component (4) and the X-axis adjustment component all comprise a sliding rod (7) and a sliding sleeve (8); the sliding sleeve (8) is slidably mounted on the sliding rod (7) and is limited in position by a locking member.

6. The temperature testing device for a circuit board according to claim 5, characterized in that: The locking member is a limit bolt (9), the sliding sleeve (8) is provided with a threaded hole, and the sliding rod (7) is provided with a groove (10) along its length direction; after the limit bolt (9) is screwed into the threaded hole, its end portion abuts against the bottom surface of the groove (10) to achieve the limit position of the sliding sleeve (8) on the sliding rod (7).

7. The temperature testing device for a circuit board according to claim 6, characterized in that: The bottom surface of the groove (10) and the end surface of the limiting bolt (9) that presses against the bottom surface of the groove are both rough surfaces; or, the end of the limiting bolt (9) is provided with an anti-slip sleeve (11), the bottom surface of the groove (10) is a rough surface, and the limiting bolt (9) presses against the bottom surface of the groove (10) through the anti-slip sleeve (11).

8. The temperature testing device for a circuit board according to claim 4, characterized in that: The Z-direction adjustment component (5), the Y-direction adjustment component (4) and the X-direction adjustment component all comprise a driving member, a slide rail and a slide table. The slide table is slidably arranged on the slide rail, and the driving member is used to drive the slide table to slide on the slide rail.

9. A temperature testing system for a circuit board, characterized in that: It comprises a multi-channel acquisition recorder (6) and a temperature testing device as claimed in any one of claims 1 to 8, wherein the temperature measurement module (3) is connected to the multi-channel acquisition recorder (6) via a data line, and the multi-channel acquisition recorder (6) is used to display and store the temperature value measured by the temperature measurement module (3).

10. The temperature testing system for a circuit board according to claim 9, characterized in that: The multi-channel acquisition recorder (6) comprises an MCU and a signal amplification function unit, an analog-to-digital conversion function unit, an FIR filtering function unit, a user interaction function unit and a storage chip, all of which are electrically connected to the MCU.

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