Space-time resolution multimode curing monitoring method and system

Abstract

The invention aims to provide a time-space resolution multimode curing monitoring method and system, and the method comprises the steps: uniformly spraying fluorescent speckles on the surface of a sample by using an airbrush to obtain a to-be-detected sample; fixing the to-be-measured sample, and adjusting the positions of the industrial gray-spot camera, the OCT measuring device and the optical filter so that the speckle pattern on the surface of the to-be-measured sample and the cross-sectional view of the to-be-measured sample are clear and visible; diffuse light is emitted behind the to-be-detected sample, the photocuring process of the to-be-detected material is triggered, meanwhile, OCT curing monitoring, FDIC curing monitoring and OCT curing monitoring based on speckle tracking are carried out, and surface and internal change data of the to-be-detected sample are obtained. According to the invention, the synchronization of DIC and OCT measurement can be realized, so that the consistent monitoring result of the surface and the interior can be obtained, and richer experimental data can be provided for polymer curing monitoring.

Description

Technical Field

[0001] The present invention relates to the technical field of material measurement, and in particular to a multi-mode curing monitoring method and system with time-space resolution. Background Art

[0002] Polymers (such as rubber, resin and fiber) are widely used in daily life, industry and medicine due to their excellent properties. The curing and molding process of polymers directly determines their final microstructure and macroscopic properties, especially in high-end application fields such as aerospace, electronic devices and biomedical materials. However, the curing process is accompanied by complex physical state changes and performance evolution, which puts higher requirements on the precise control and reliability of material processing. Therefore, real-time monitoring and in-depth analysis of the polymer curing process can not only reveal the inherent laws of its curing mechanism, but also provide a solid theoretical basis for the optimization design of material properties and the improvement of reliability in practical applications.

[0003] Existing polymer curing monitoring technologies are mainly divided into two categories: contact and non-contact:

[0004] Contact techniques obtain physical or chemical signals by directly contacting the surface or interior of the sample, such as differential scanning calorimetry (DSC), dielectric analysis (DEA) and dynamic mechanical analysis (DMA). These techniques monitor the curing process by measuring certain physical quantities of the polymer in real time, and can provide detailed information about the curing reaction kinetics and microscopic performance changes. However, contact techniques have some limitations: interfering with the curing process of the material itself, poor environmental adaptability, and lack of spatial distribution measurement capabilities, which limit their promotion in complex environments or special applications.

[0005] Non-contact technology has gradually become a research hotspot in recent years, especially DIC (digital image correlation) technology and OCT (optical coherence tomography) technology:

[0006] 1) DIC technology is based on the measurement of surface deformation and displacement field. By tracking the evolution of the speckle pattern on the sample surface, the full-field strain distribution of the sample during the curing process can be obtained in real time. Its advantage is that it does not require contact with the sample, is applicable to a variety of materials and complex geometric structures, and can provide high-resolution information at both macro and micro scales.

[0007] 2) OCT technology relies on the principle of optical interference. The reflected light from different depths of the sample interferes with the reference arm beam to form an interference spectrum. The microstructure information of the sample is obtained by Fourier transforming the interference spectrum. OCT can not only non-destructively measure the depth information inside the material, but also provide nanoscale displacement and dynamic change characterization in combination with phase analysis. It is an important development direction in the field of curing monitoring.

[0008] The two technologies are considered to be the most promising solidification monitoring methods due to their high precision, real-time performance and multi-scenario adaptability.

[0009] Although DIC and OCT technologies can realize non-contact full-field curing monitoring, the curing process of polymers has significant spatial distribution characteristics. The displacement and deformation of the surface and the interior may show different dynamic change laws, and it is difficult to fully grasp the complexity of the curing process by relying on a single technology. Therefore, in order to achieve precise control of the polymer curing process, it is necessary to monitor the deformation characteristics of the surface and the interior at the same time.

[0010] However, in the prior art, if DIC technology is used to monitor the surface and OCT technology is used to monitor the cross-section, the two experimental results cannot match well due to the unidirectionality of the polymerization process and the slight differences in the sample environment. The combination of OCT and DVC (digital volume correlation) technology can realize three-dimensional full-field curing monitoring, which is an effective method to characterize the internal and surface behavior of polymer curing and can achieve precise control of the polymer curing process. However, three-dimensional full-field measurement requires the collection of a large amount of data in each curing state, and the amount of data is hundreds or thousands of times that of two-dimensional monitoring data, which cannot meet the needs of dynamic monitoring.

[0011] Based on this, a multi-mode solidification monitoring method that can achieve synchronization of DIC and OCT measurements and obtain consistent monitoring results on the surface and inside needs to be developed urgently. Summary of the invention

[0012] The object of the present invention is to provide a multi-mode curing monitoring method and system with time and space resolution to at least solve one technical problem in the prior art.

[0013] The technical solution of the present invention is:

[0014] A multi-mode curing monitoring method with time and space resolution, comprising:

[0015] Use an airbrush to evenly spray fluorescent speckles on the surface of the sample to obtain a sample to be tested;

[0016] Fixing the sample to be tested, adjusting the positions of the industrial gray point camera, the OCT measuring device and the filter so that the speckle pattern on the surface of the sample to be tested and the cross-sectional view of the sample to be tested are clearly visible;

[0017] Diffuse light is emitted directly below the sample to trigger the photocuring process of the material to be tested, and OCT curing monitoring, FDIC curing monitoring and OCT curing monitoring based on speckle tracking are performed simultaneously to obtain surface and internal change data of the sample to be tested.

[0018] The OCT curing monitoring process includes:

[0019] During the curing process, collecting the interference spectrum of the sample to be tested by OCT;

[0020] Performing Fourier transformation on the collected interference spectrum to extract its phase information, and performing differential calculation on the phase-frequency characteristics before and after the Fourier transformation change to obtain the phase difference distribution of the package of the reaction cross-section change information;

[0021] The phase difference distribution is processed by phase unwrapping to obtain the shrinkage strain at any point on the material, and the shrinkage strain is differentiated with respect to time to obtain the curing rate of the sample to be tested.

[0022] The method of processing the phase difference distribution by phase unwinding to obtain the shrinkage strain at any point on the material, and differentiating the shrinkage strain with respect to time to obtain the curing rate of the sample to be tested includes:

[0023] The phase demodulated by the differential phase formula is a warped phase distributed in [-π, π]. The relationship between the phase difference and the optical path difference after unwinding is expressed as:

[0024]

[0025] Where umwrap represents phase unwrapping; λ c Represents the central wavelength of the broadband light source of the OCT system; ΔФ j (t) represents the phase difference before and after the change;

[0026] According to the physical relationship between optical path difference and deformation, the strain at point z on the material can be expressed as:

[0027]

[0028] Among them, ε z (t) is the shrinkage strain of the material, d is the distance between point z and the lower surface of the sample to be tested;

[0029] The measured phase change can be used to estimate the shrinkage strain of the polymer during the curing process. Differentiating the shrinkage strain with respect to time can give the curing rate v, which is:

[0030]

[0031] The FDIC solidifies the monitoring process, including:

[0032] Select one of the obtained surface images of the material to be tested as a reference image, and select a region of interest in the reference image as a search window;

[0033] Dividing the search window into at least one sub-region, and calculating the correlation between each sub-region of the deformed image and the reference sub-region using a normalized cross-correlation function;

[0034] By taking the maximum value of the correlation function calculation result, the best matching position of the deformed sub-region is determined; and the displacement of the sub-region at the pixel level is preliminarily determined by the offset between the matching position and the original position of the reference sub-region;

[0035] Use sub-pixel interpolation processing to obtain high-precision sub-pixel displacement of sub-regions;

[0036] After calculating the displacement of each sub-region, the displacements of all sub-regions are combined into the displacement field of the entire search window;

[0037] By numerically differentiating the displacement field, the strain field of the entire search window is obtained.

[0038] The step of dividing the search window into at least one sub-region and calculating the correlation between each sub-region of the deformed image and the reference sub-region using a normalized cross-correlation function comprises:

[0039] The normalized cross-correlation function can be expressed as:

[0040]

[0041] Among them, I f (i, j) is the gray value of the reference sub-region, I r (i′, j′) is the grayscale value of the sub-region after deformation, Γ f is the average grayscale of the reference sub-region, Γ r is the average grayscale of the sub-region after deformation.

[0042] The process of OCT curing monitoring based on speckle tracking includes:

[0043] Collecting the interference spectrum of the sample to be tested that varies with time through the OCT system;

[0044] After demodulating the interference spectrum by Fourier transform, the amplitude of the interference signal is obtained, and the amplitude-frequency characteristic of the interference signal along the wave number axis is used as the cross-sectional profile of the sample to be tested;

[0045] According to the cross-sectional profile of the sample to be tested, a suitable search window is selected in the cross-sectional profile, and the size of the sub-area in the search window is determined, and the full-field displacement is obtained through DIC calculation;

[0046] The full-field strain is obtained by differentiating the full-field displacement.

[0047] The time-space resolved multi-mode curing monitoring method comprises:

[0048] The amplitude of the interference signal is:

[0049]

[0050] Where k is the wave number of light, M is the number of surfaces of the material being measured that participate in the interference, and I R and I j are the intensities of the reflected light from the reference surface and the scattered light from the jth surface inside the sample to be tested, respectively; f represents the frequency of change of the interference signal along the wave number direction; f Rj represents the frequency corresponding to the optical path difference between the jth surface and the reference surface; Δk is the wave number bandwidth.

[0051] A monitoring system based on the multi-mode curing monitoring method as described above comprises:

[0052] A bracket, used for fixing the sample to be tested with the fluorescent speckle sprayed on the surface;

[0053] A backlight, arranged directly below the sample to be measured, for emitting uniform diffuse light to excite the fluorescent speckle of the sample to be measured;

[0054] The red filter is located directly above the sample to be tested;

[0055] An OCT measuring device, disposed directly above the red filter, for emitting light and receiving light filtered by the red filter to detect cross-sectional information of the sample to be measured;

[0056] The DIC device is arranged on one side of the red filter and is used to capture the reflected light after being reflected by the red filter; the reflected light includes the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight.

[0057] The support comprises:

[0058] The bracket body;

[0059] A first fixing mechanism, one end of which is rotatably connected to the support body and the other end of which is detachably fixed to the sample to be tested;

[0060] A second fixing mechanism, one end of which is rotatably connected to the bracket body and the other end of which is detachably fixed to the red filter;

[0061] The first fixing mechanism is closer to the backlight than the second fixing mechanism.

[0062] The DIC device comprises:

[0063] A lens group, used for receiving the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight;

[0064] A blue filter, arranged behind the lens group, for filtering the blue light;

[0065] The sensor is arranged behind the blue filter and is used for collecting the light filtered by the blue filter.

[0066] The beneficial effects of the present invention include at least:

[0067] The method described in the present invention triggers the photocuring process of the material to be tested by emitting diffuse light directly below the sample to be tested, and simultaneously performs OCT curing monitoring, FDIC curing monitoring and OCT curing monitoring based on speckle tracking to obtain surface and internal change data of the sample to be tested; the method described in the present invention utilizes the fluorescence speckle penetration ability, mirror reflection elimination ability and speckle contrast enhancement ability of fluorescence imaging to achieve synchronization of DIC and OCT measurements, thereby obtaining consistent monitoring results for the surface and the interior, and providing richer experimental data for polymer curing monitoring. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 It is a flow chart of the multi-mode curing monitoring method of the present invention;

[0069] Figure 2 This is the schematic diagram of PhS-OCT curing monitoring;

[0070] Figure 3 Solidify monitoring schematics for FDIC;

[0071] Figure 4 This is the principle diagram of OCT solidification monitoring based on speckle tracking;

[0072] Figure 5 It is a schematic diagram of the structure of the multimodal measurement system of the present invention;

[0073] Figure 6 It is the strain rate curve after normalization using FDIC technology;

[0074] Figure 7 It is the normalized strain rate curve using speckle tracking-based OCT technology;

[0075] Figure 8 This is the strain rate curve normalized using PhS-OCT technology. DETAILED DESCRIPTION

[0076] The present application is further described below in conjunction with the accompanying drawings. Specific embodiment 1:

[0078] The present invention provides an embodiment:

[0079] like Figure 1A time-space resolved multi-mode curing monitoring method comprises: using an airbrush to uniformly spray fluorescent speckles on a sample surface to obtain a sample to be tested; fixing the sample to be tested, adjusting the positions of an industrial gray point camera, an OCT measuring device and a filter to make the speckle pattern on the surface of the sample to be tested and the cross-sectional view of the sample to be tested clearly visible; emitting diffuse light behind the sample to be tested to trigger the photocuring process of the material to be tested, and simultaneously performing OCT curing monitoring, FDIC curing monitoring and OCT curing monitoring based on speckle tracking to obtain surface and internal change data of the sample to be tested.

[0080] Specifically, Figure 2 , the PhS-OCT curing monitoring principle is as follows:

[0081] First, the interference spectrum collected during the curing process is Fourier transformed to extract its phase information. Then, the phase-frequency characteristics before and after the change are differentially calculated to obtain the phase difference distribution of the reaction cross-section change information. The phase demodulated by the differential phase formula is a wrapped phase distributed in [-π, π]. To restore the true phase, it is necessary to perform phase unwrapping. The relationship between the phase difference and the optical path difference after unwrapping can be expressed as:

[0082]

[0083] Among them, unwrap represents phase unwinding. According to the physical relationship between optical path difference and deformation, the strain at point z on the material can be expressed as:

[0084]

[0085] Among them, ε z (t) is the shrinkage strain of the material, d is the distance between point z and the lower surface, and the shrinkage strain of the polymer during the curing process can be estimated by the measured phase change. The curing rate v can be obtained by differentiating the shrinkage strain with respect to time, and the formula is:

[0086]

[0087] FDIC solidification monitoring principle, such as Figure 3 As shown:

[0088] The FDIC technique first needs to select one of the obtained material surface images as a reference image, usually the first frame image, and select the region of interest (ROI) in the reference image as the search window. Then the ROI is divided into several sub-regions, and the normalized cross-correlation function is used to calculate the correlation between each sub-region of the deformed image and the reference sub-region. The closer the value of the normalized cross-correlation function is to 1, the more accurate the matching result is. The normalized cross-correlation function can be expressed as:

[0089]

[0090] Among them, I f (i, j) is the gray value of the reference sub-region, I r (i′, j′) is the gray value of the sub-region after deformation, is the average grayscale of the reference sub-region, is the average grayscale of the deformed sub-region. By taking the maximum value of the correlation function calculation result, the best matching position of the deformed sub-region can be determined. The pixel-level displacement can be preliminarily determined by the offset between the matching position and the original position of the reference sub-region. Then, sub-pixel interpolation processing is used to obtain high-precision sub-pixel displacement. After calculating the displacement of each sub-region, the displacements of all sub-regions are combined into the displacement field of the entire ROI. By numerically differentiating the displacement field, the strain field of the entire ROI can be obtained.

[0091] OCT solidification monitoring principle based on speckle tracking, such as Figure 4 :

[0092] The frequency of the interference signal collected by the OCT system along the wave number direction corresponds to the depth information of the sample. After the signal is demodulated using the Fourier transform method, the amplitude of the interference signal can be expressed as:

[0093]

[0094] Where k is the wave number of light, M is the number of surfaces of the material being measured that participate in the interference, and I R and I j are the intensities of the reflected light from the reference surface and the scattered light from the jth surface inside the material under test. It can be seen that only when f=f Rj The signal in the time-frequency domain has an amplitude, and its intensity is related to the intensity of the light scattered by the material. The frequency is proportional to the optical path difference, so the amplitude-frequency characteristic of the interference signal along the wave number axis is the cross-sectional profile of the material being measured.

[0095] After obtaining the cross-sectional profile of the material being tested, select a suitable ROI in the image and determine the size of the sub-region. The full-field displacement can be obtained by DIC calculation, and the full-field strain can be obtained by differential calculation of the full-field displacement. The process of using speckle tracking-based OCT technology for curing monitoring is as follows: Figure 4 Shown:

[0096] Unlike thermal deformation measurement, the curing process of polymers is a unidirectional process with strong spatial distribution characteristics such as global or local non-uniform displacement. It is necessary to provide non-contact full-field curing monitoring for the complex deformation behavior of the polymer surface and interior. The method described in this embodiment, through the combination of three imaging technologies, can simultaneously realize the curing characterization based on three technologies: PhS-OCT (Phase-sensitive OCT), FDIC (Fluorescent DIC) and OCT based on speckle tracking, and simultaneously obtain the spatiotemporal resolution of curing information on the surface and interior to ensure the consistency of the curing environment. In addition, the multiple curing monitoring results and rich experimental basis obtained in this way can be calibrated with each other and cross-validated for multiple sets of data, providing high measurement accuracy for the curing monitoring of polymers. Specific embodiment 2:

[0098] The present invention provides an embodiment:

[0099] like Figure 5 , a monitoring system based on the multi-mode curing monitoring method as described in specific embodiment 1, comprising: a bracket 1, a backlight 2, a red filter 3, an OTC measuring device 4 and a DIC device 5; wherein the bracket 1 is used to fix the sample to be measured with fluorescent speckles sprayed on the surface; the backlight 2 is arranged on one side of the sample to be measured, and is used to emit uniform diffuse light to excite the fluorescent speckles of the sample to be measured; the red filter 3 is located on the opposite side of the backlight 2; the OTC measuring device 4 is arranged behind the red filter 3, and the height can be adjusted, such as Figure 5 The M in the figure is used to receive the light filtered by the red filter 3 to detect the cross-sectional information of the sample to be tested; the DIC device 5 is arranged on one side of the red filter 3 to capture the reflected light after being reflected by the red filter 3; the reflected light includes the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight.

[0100] Specifically, the bracket 1 includes: a bracket body 101, a first fixing mechanism 102 and a second fixing mechanism 103; wherein one end of the first fixing mechanism 102 is connected to the bracket body 101 through a pin structure, such as Figure 5 At S in the figure, the other end is fixed to the sample to be tested by a clamping mechanism, such as a clip; one end of the second fixing mechanism 103 is connected to the bracket body 101 by a pin structure, and the other end is fixed to the red filter 3 by a clamping mechanism, such as a clip; preferably, a bending point is provided in the middle of the second fixing mechanism 103, which can be a pin structure, to facilitate adjustment of the angle of the red filter 3, such as 45°; wherein the first fixing mechanism 102 is closer to the backlight 2 than the second fixing mechanism 103.

[0101] Specifically, the DIC device 5 includes: a lens group 501, a blue filter 502 and a sensor 503; wherein the lens group 501 is used to receive the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight; the blue filter 502 is arranged behind the lens group 501 to filter the blue light; the sensor 503 is arranged behind the blue filter 502 to collect the light filtered by the blue filter 502. Preferably, the lens group 501 can be selected as needed, such as Figure 5 The first lens L1 and the second lens L2.

[0102] When using, according to Figure 5 The multimodal measurement system was built as shown in the optical path structure diagram, and the dental resin material CharmFil was selected as the sample to be tested for the curing detection experiment.

[0103] First, use an airbrush to evenly spray fluorescent speckles on the surface of the CharmFil material, and fix the sprayed sample on the stage. Adjust the position of the industrial gray dot camera, OCT measurement device, and filter to make the speckle pattern on the surface of the material and the cross-sectional view of the material clearly visible. Then turn on the 395nm backlight to trigger the light curing process of the CharmFil material. Use a multimodal measurement system to monitor the curing process in real time, including changes on the surface and inside the material.

[0104] Then, the strain fields of the CharmFil material calculated by the three techniques described in Specific Example 1 are obtained.

[0105] Then, a point in the strain field is selected to generate a strain curve that changes with time, the strain curve is derived to obtain the relative strain rate curve, and the strain rate curve is normalized, such as Figure 6-8 shown.

[0106] Finally, the experimental results were analyzed, and the strain-time curves and strain rate-time curves obtained by the three technologies have consistent trends. The strain starts from 0 and gradually accumulates to about -0.013; the strain rate also starts from 0, reaches a peak at about 20s, and then decays to 0 over time. The curing information obtained from the three sets of data is consistent with the curing information given in the material manual, which shows that the monitoring results of the three technologies during the curing process have good consistency and reliability.

[0107] The above disclosures are only several specific implementation scenarios of the present invention, but the present invention is not limited thereto, and any changes that can be thought of by a person skilled in the art should fall within the protection scope of the present invention. The above serial numbers of the present invention are only for description and do not represent the advantages and disadvantages of the implementation scenarios.

Claims

1. A multi-mode curing monitoring method with time and space resolution, characterized in that: include: Use an airbrush to evenly spray fluorescent speckles on the surface of the sample to obtain a sample to be tested; Fixing the sample to be tested, adjusting the positions of the industrial gray point camera, the OCT measuring device and the filter so that the speckle pattern on the surface of the sample to be tested and the cross-sectional view of the sample to be tested are clearly visible; Diffuse light is emitted below the sample to be tested to trigger the light curing process of the material to be tested, and OCT curing monitoring, FDIC curing monitoring and OCT curing monitoring based on speckle tracking are performed simultaneously to obtain surface and internal change data of the sample to be tested.

2. The time-space resolved multi-mode curing monitoring method according to claim 1, characterized in that: The OCT curing monitoring process includes: During the curing process, collecting the interference spectrum of the sample to be tested by OCT; Performing Fourier transform on the collected interference spectrum to extract its phase information, and performing differential calculation on the phase-frequency characteristics before and after the Fourier transform change to obtain the phase difference distribution of the package of the reaction cross-section change information; The phase difference distribution is processed by phase unwrapping to obtain the shrinkage strain at any point on the material, and the shrinkage strain is differentiated with respect to time to obtain the curing rate of the sample to be tested.

3. The time-space resolved multi-mode curing monitoring method according to claim 2, characterized in that: The method of processing the phase difference distribution by phase unwinding to obtain the shrinkage strain at any point on the material, and differentiating the shrinkage strain with respect to time to obtain the curing rate of the sample to be tested includes: The phase demodulated by the differential phase formula is a warped phase of [-π,π] distribution. The relationship between the phase difference and the optical path difference after unwinding is expressed as: Where umwrap represents phase unwrapping; λ c Represents the central wavelength of the broadband light source of the OCT system; ΔФ j (t) represents the phase difference before and after the change; According to the physical relationship between optical path difference and deformation, the strain at point z on the material can be expressed as: Among them, ε z (t) is the shrinkage strain of the material, d is the distance between point z and the lower surface of the sample to be tested; The measured phase change can be used to estimate the shrinkage strain of the polymer during the curing process. Differentiating the shrinkage strain with respect to time can give the curing rate v, which is:

4. The time-space resolved multi-mode curing monitoring method according to claim 1, characterized in that: The FDIC solidifies the monitoring process, including: Select one of the obtained surface images of the material to be tested as a reference image, and select a region of interest in the reference image as a search window; Dividing the search window into at least one sub-region, and calculating the correlation between each sub-region of the deformed image and the reference sub-region using a normalized cross-correlation function; By taking the maximum value of the correlation function calculation result, the best matching position of the deformed sub-region is determined; and the displacement of the sub-region at the pixel level is preliminarily determined by the offset between the matching position and the original position of the reference sub-region; Use sub-pixel interpolation processing to obtain high-precision sub-pixel displacement of sub-regions; After calculating the displacement of each sub-region, the displacements of all sub-regions are combined into the displacement field of the entire search window; By numerically differentiating the displacement field, the strain field of the entire search window is obtained.

5. The time-space resolved multi-mode curing monitoring method according to claim 4, characterized in that: The step of dividing the search window into at least one sub-region and calculating the correlation between each sub-region of the deformed image and the reference sub-region using a normalized cross-correlation function comprises: The normalized cross-correlation function can be expressed as: Among them, I f (i, j) is the grayscale value of the reference sub-region, I r (i′, j′) is the gray value of the sub-region after deformation, is the average grayscale of the reference sub-region, is the average grayscale of the sub-region after deformation.

6. The time-space resolved multi-mode curing monitoring method according to claim 1, characterized in that: The process of OCT curing monitoring based on speckle tracking includes: The interference spectrum that changes with time is collected by an OCT system, and the amplitude of the interference signal is obtained after signal demodulation of the interference spectrum by Fourier transform, and the amplitude-frequency characteristic of the interference signal along the wave number axis is used as the cross-sectional profile of the sample to be tested; According to the cross-sectional profile of the sample to be tested, a suitable search window is selected in the cross-sectional profile, and the size of the sub-area in the search window is determined, and the full-field displacement is obtained through DIC calculation; The full-field strain is obtained by differentiating the full-field displacement.

7. The time-space resolved multi-mode curing monitoring method according to claim 6, characterized in that: include: The amplitude of the interference signal is: Where k is the wave number of light, M is the number of surfaces of the material being measured that participate in the interference, and I R and I j are the intensities of the reflected light from the reference surface and the scattered light from the jth surface inside the sample to be tested; f represents the frequency of change of the interference signal along the wave number direction; f Rj represents the frequency corresponding to the optical path difference between the jth surface and the reference surface; Δk is the wave number bandwidth.

8. A monitoring system based on the multi-mode curing monitoring method according to any one of claims 1 to 7, characterized in that: include: A bracket, used for fixing the sample to be tested with the fluorescent speckle sprayed on the surface; A backlight, disposed below the sample to be measured, for emitting uniform diffuse light to excite the fluorescent speckle of the sample to be measured; A red filter is located directly above the sample to be tested; An OCT measuring device, disposed directly above the red filter, for emitting light and receiving light filtered by the red filter to detect cross-sectional information of the sample to be measured; The DIC device is arranged on one side of the red filter and is used to capture the reflected light after being reflected by the red filter; the reflected light includes the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight.

9. The monitoring system according to claim 8, characterized in that: The support comprises: The bracket body; A first fixing mechanism, one end of which is rotatably connected to the support body and the other end of which is detachably fixed to the sample to be tested; A second fixing mechanism, one end of which is rotatably connected to the bracket body and the other end of which is detachably fixed to the red filter; The first fixing mechanism is closer to the backlight than the second fixing mechanism.

10. The monitoring system according to claim 8, characterized in that: The DIC device comprises: A lens group, used for receiving the blue light generated after the fluorescent speckle is excited and the purple light emitted by the backlight; A blue filter, arranged behind the lens group, for filtering the blue light; The sensor is arranged behind the blue filter and is used for collecting the light filtered by the blue filter.

Images