Method and device for automatically detecting appearance of ultra-miniature TEC

Abstract

The invention provides an automatic detection method and device for the appearance of an ultra-miniature TEC. The method comprises the following steps: carrying out visual positioning feeding on the ultra-miniature TEC; obtaining appearance images of different side surfaces of the ultra-miniature TEC; comparing and judging the appearance image with a standard image; scanning and detecting the external dimension of the ultra-miniature TEC; and carrying out classified blanking on the ultra-miniature TEC. The device and the method have the beneficial effects that manual work is replaced to realize automatic detection of the appearance defects and the appearance sizes of the ultra-miniature TEC, the detection efficiency and the detection accuracy are improved, manual intervention is avoided, introduction of the appearance defects is effectively avoided, six side surfaces can be detected without overturning in the whole detection process, and the detection efficiency and the detection accuracy are improved. The detection comprehensiveness is ensured, and the damage to the ultra-miniature TEC is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor cooling chip detection, and in particular relates to an automatic detection method and device for the appearance of an ultra-micro TEC. Background Art

[0002] Thermoelectric cooling components have the characteristics of compact structure, no moving parts, maintenance-free, and long life. They are widely used in aerospace, consumer electronics, and temperature-sensitive components for heat dissipation and temperature control. With the continuous improvement of integrated manufacturing accuracy and the upgrading and optimization of microsystem technology, ultra-micro semiconductor cooling chips (ultra-micro TEC) used in conjunction with optical modules have come out. However, correspondingly, since optical modules have high requirements for the appearance of ultra-micro TEC and the demand is large, it is necessary to detect and screen the appearance of a large number of micro TECs.

[0003] In the prior art, the appearance inspection method of conventional centimeter-level thermoelectric cooling components (TECs) is: in a well-lit environment, the appearance of the TEC is inspected from six directions with the naked eye; the external dimensions of the TEC are inspected using a vernier caliper and an outside micrometer. Ultra-micro TECs are smaller in size, so manual inspection is more difficult and less efficient, resulting in larger inspection errors. In addition, since most ultra-micro TECs have a metal layer, there is a risk of introducing appearance defects of the metal layer during manual inspection of the appearance of the ultra-micro TECs. Summary of the invention

[0004] To solve the above technical problems, the present invention provides an automatic detection method and device for the appearance of ultra-micro TECs, which effectively solves the technical problems of large manual detection errors, low detection efficiency, and easy introduction of metal layer appearance defects, and overcomes the shortcomings of the prior art.

[0005] The technical solution adopted by the present invention is: an automatic detection method for the appearance of an ultra-micro TEC, comprising the following steps:

[0006] Visual positioning and loading of ultra-micro TEC;

[0007] Acquire appearance images of different sides of the ultra-micro TEC;

[0008] Comparing and judging the appearance image with a standard image;

[0009] Scan and detect the appearance size of the ultra-micro TEC;

[0010] The ultra-micro TECs are classified and cut into pieces.

[0011] Furthermore, the step of visually positioning and loading the ultra-micro TEC includes:

[0012] Visually positioning the ultra-micro TEC placed on the loading tray;

[0013] Grabbing and loading the ultra-micro TEC;

[0014] The loading tray is collected.

[0015] Furthermore, the steps sequentially obtain appearance images of different sides of the ultra-micro TEC, grab the ultra-micro TEC to a detection station, and use different cameras to take pictures of different sides of the ultra-micro TEC. During the picture taking process, the ultra-micro TEC does not need to be flipped.

[0016] Furthermore, the detection station is made of a transparent material and is arranged in a ring shape, the camera is arranged along the circumference of the detection station, and the detection station can drive the ultra-micro TEC to rotate to different locations of the camera.

[0017] Furthermore, the detection station is provided with an electrostatic field for adsorbing and positioning the ultra-micro TEC.

[0018] Furthermore, when acquiring an image of the lower side of the ultra-micro TEC, the camera is arranged below the ultra-micro TEC; when acquiring an image of the upper side of the ultra-micro TEC, the camera is arranged above the ultra-micro TEC; when acquiring an image of the circumferential side of the ultra-micro TEC, the camera is arranged above the ultra-micro TEC and a reflective plate is used to align the camera with the side to be inspected.

[0019] Furthermore, in the step of comparing the appearance image with a standard image, when both the appearance images are qualified, the product is determined to be a good appearance product, otherwise, the product is determined to be a defective appearance product.

[0020] Furthermore, in the step of scanning and detecting the external dimensions of the ultra-micro TEC, an infrared scanning camera is used to scan the external dimensions of the ultra-micro TEC, the infrared scanning camera and the camera are arranged along the circumference of the detection station, and a scanning reference is provided on the detection station.

[0021] Furthermore, in the step of classifying and cutting the ultra-micro TECs, when the ultra-micro TECs are good in appearance and have qualified appearance dimensions, the ultra-micro TECs are cut as good products; otherwise, the ultra-micro TECs are cut as bad products, and the good products and bad products are placed separately.

[0022] The present invention also provides an automatic detection device for the appearance of an ultra-micro TEC, comprising:

[0023] Loading module, used for visual positioning and loading of ultra-micro TEC;

[0024] An appearance recognition module, used to obtain appearance images of different sides of the ultra-micro TEC;

[0025] An appearance determination module, used for comparing and determining the appearance image with a standard image;

[0026] A size measurement module, used for scanning and detecting the appearance size of the ultra-micro TEC;

[0027] A material unloading module is used to classify and unload the ultra-micro TECs.

[0028] The advantages and positive effects of the present invention are as follows: due to the adoption of the above technical solution, the automatic detection of the appearance defects and appearance dimensions of the ultra-micro TEC is realized instead of manual labor, the detection efficiency and detection accuracy are improved, the human intervention is eliminated, and the introduction of appearance defects is effectively avoided. During the entire detection process, six sides can be inspected without flipping, which not only ensures the comprehensiveness of the detection but also avoids damage to the ultra-micro TEC. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The present invention is a flowchart of an automatic detection method for the appearance of an ultra-micro TEC according to an embodiment of the present invention.

[0030] Figure 2 It is a schematic diagram of a detection station of an automatic detection method for the appearance of an ultra-micro TEC according to an embodiment of the present invention.

[0031] Figure 3 This is a schematic diagram of a fourth camera taking picture in an automatic detection method for the appearance of an ultra-micro TEC according to an embodiment of the present invention.

[0032] In the figure:

[0033] 1. First camera 2. Second camera 3. Third camera

[0034] 4. Fourth camera 5. Fifth camera 6. Sixth camera

[0035] 7. Infrared scanning camera 8. Inspection station 9. Light source

[0036] 10. Ultra-micro TEC 11. Reflective plate DETAILED DESCRIPTION

[0037] The embodiment of the present invention provides a method and device for automatically detecting the appearance of an ultra-micro TEC. The embodiment of the present invention is described below with reference to the accompanying drawings.

[0038] In the description of the embodiments of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "set" and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0039] like Figure 1 As shown, an embodiment of the present invention provides an automatic detection method for the appearance of an ultra-micro TEC, comprising the following steps: visually positioning and loading the ultra-micro TEC; obtaining appearance images of different sides of the ultra-micro TEC; comparing and judging the appearance images with standard images; scanning and detecting the appearance dimensions of the ultra-micro TEC; and classifying and unloading the ultra-micro TEC. This application scheme realizes the automatic detection of the appearance and dimensions of the ultra-micro TEC, ensuring the accuracy of the detection, which is described in detail below:

[0040] S1, visual positioning and loading of ultra-micro TEC;

[0041] When loading, the ultra-micro TEC is placed on the loading tray, and multiple loading trays are placed on the loading tray storage device. The visual positioning device is used to take a photo of the ultra-micro TEC to be inspected, and the loading robot grabs and loads the ultra-micro TEC to be inspected based on the recognition result of the visual positioning. After the ultra-micro TEC is grabbed and loaded, the remaining empty loading trays are placed in the empty tray collection device for centralized storage.

[0042] S2, obtaining appearance images of different sides of the ultra-micro TEC;

[0043] The loading robot places the ultra-micro TEC to be inspected on the inspection station, and uses a camera to take pictures of different sides of the ultra-micro TEC to obtain appearance images of different sides.

[0044] Preferably, a plurality of different cameras are used to take pictures of different sides, and the ultra-micro TEC does not need to be turned over during the picture taking process. By setting up a plurality of cameras for taking pictures, the ultra-micro TEC is prevented from being turned over, and the damage to the ultra-micro TEC during the turning process is reduced. In this embodiment, six cameras are provided to take pictures of the upper side, the lower side and the four circumferential sides of the ultra-micro TEC respectively.

[0045] Preferably, Figure 2 As shown, in order to facilitate the transportation of the ultra-micro TEC 10 during the inspection process and the installation of multiple cameras, and to avoid the multiple cameras from affecting each other during the shooting process, the inspection station 8 is made of transparent material and is arranged in a ring shape. Multiple cameras are arranged along the circumference of the inspection station 8. The inspection station 8 can drive the ultra-micro TEC 10 to rotate to different cameras for taking pictures. The multiple cameras are arranged separately for easy installation and will not affect the transportation of the ultra-micro TEC 10. The ring-shaped inspection station 8 makes the inspection more compact and saves space.

[0046] Preferably, in order to prevent the ultra-micro TEC 10 from moving relative to the detection station 8 when the ultra-micro TEC 10 rotates, an electrostatic field is provided on the detection station 8 to adsorb and position the ultra-micro TEC 10 .

[0047] Specifically, when acquiring an image of the lower side of the ultra-micro TEC 10, the camera is set below the ultra-micro TEC 10, when acquiring an image of the upper side of the ultra-micro TEC 10, the camera is set above the ultra-micro TEC 10, and when acquiring an image of the circumferential side of the ultra-micro TEC 10, the camera is set above the ultra-micro TEC 10 and the reflector 11 is used to align the side to be inspected. Figure 2 As shown, in this embodiment, the inspection station 8 can drive the ultra-micro TEC 10 to rotate clockwise, and along the rotation direction of the ultra-micro TEC 10, a first camera 1, a second camera 2, a third camera 3, a fourth camera 4, a fifth camera 5 and a sixth camera 6 are sequentially arranged. The first camera 1 is arranged below the transparent inspection station 8, and the inspection station 8 drives the ultra-micro TEC 10 to rotate to the top of the first camera 1, and the first camera 1 takes a picture of the lower side of the ultra-micro TEC 10. The third camera 3 is arranged above the transparent inspection station 8, and the inspection station 8 drives the ultra-micro TEC 10 to rotate to the bottom of the third camera 3, and the third camera 3 takes a picture of the upper side of the ultra-micro TEC 10. For the convenience of installation, the second camera 2, the fourth camera 4, the fifth camera 5 and the sixth camera 6 are all installed above the inspection station 8, and the second camera 2 and the fourth camera 4 are used to take pictures of the left and right sides of the ultra-micro TEC 10, and the fifth camera 5 and the sixth camera 6 are used to take pictures of the front and back sides of the ultra-micro TEC 10. In order to make the shooting light of the second camera 2, the fourth camera 4, the fifth camera 5 and the sixth camera 6 be aimed at the side to be photographed, the reflector 11 can be tilted and set on the side to be photographed. The shooting light of the camera is reflected by the reflector 11 to the side to be photographed, and the side to be photographed is photographed.

[0048] like Figure 3 As shown, taking the fourth camera 4 as an example, the fourth camera 4 is used to photograph the right side of the ultra-micro TEC 10, and the reflector 11 is tiltedly set on the right side of the ultra-micro TEC 10. The fourth camera 4 is set above the reflector 11. The tilt angle of the reflector 11 is adjusted so that the shooting light of the fourth camera 4 can be reflected to the right side of the ultra-micro TEC 10 through the reflector 11, and the right side of the ultra-micro TEC 10 is photographed. A certain distance is set between the reflector 11 and the detection station 8, which will not affect the rotation of the ultra-micro TEC 10 to the next camera. In order to ensure the shooting effect, a light source 9 can be set above the ultra-micro TEC 10. The light source 9, the reflector 11 and the camera can be fixed above the detection station 8 by a bracket. Similarly, the second camera 2 shoots the left side of the ultra-micro TEC 10, and the reflector 11 is set on the left side of the ultra-micro TEC 10. The fifth camera 5 shoots the front side of the ultra-micro TEC 10, and the reflector 11 is set on the front side of the ultra-micro TEC 10. The sixth camera 6 shoots the back side of the ultra-micro TEC 10, and the reflector 11 is set on the back side of the ultra-micro TEC 10.

[0049] S3, comparing the appearance image with the standard image;

[0050] The appearance images of the ultra-micro TECs are compared with the standard images in the image library. If all appearance images are qualified, they are judged as good appearance products, otherwise they are judged as defective appearance products.

[0051] S4, scanning and detecting the appearance size of the ultra-micro TEC;

[0052] The infrared scanning camera 7 is used to scan the appearance dimensions of the ultra-micro TEC. The infrared scanning camera 7 and the camera are arranged along the circumference of the inspection station. In this embodiment, the infrared scanning camera 7 is arranged close to the sixth camera. After all the cameras have finished inspecting each side of the ultra-micro TEC, the inspection station drives the ultra-micro TEC to rotate to the infrared scanning camera 7, and the infrared scanning camera 7 scans and inspects the appearance dimensions of the ultra-micro TEC, such as length, width, height or other appearance dimensions.

[0053] Preferably, a scanning reference is provided on the inspection station, and the infrared scanning camera can be calibrated by scanning the scanning reference. The specific form of the scanning reference is not limited, and it can be a height reference, a length reference or a width reference.

[0054] S5. Classify and cut the ultra-micro TECs.

[0055] When the ultra-micro TEC is a good product in appearance and all the appearance dimensions are qualified, the ultra-micro TEC is unloaded as a good product, otherwise it is unloaded as a bad product, and the good and bad products are placed separately. The unloading robot unloads the good products to the good product unloading tray and unloads the bad products to the bad product unloading tray.

[0056] An automatic detection device for the appearance of an ultra-micro TEC includes a loading module, an appearance recognition module, an appearance judgment module, a size measurement module and a blanking module. The loading module is used to visually position and load the ultra-micro TEC, the appearance recognition module is used to obtain appearance images of different sides of the ultra-micro TEC, the appearance judgment module is used to compare and judge the appearance image with a standard image, the size measurement module is used to scan and detect the appearance size of the ultra-micro TEC, and the blanking module is used to classify and blank the ultra-micro TEC.

[0057] Specifically, the loading module includes a loading tray storage device, a visual positioning device, a loading robot and an empty tray collection device. The loading tray storage device is used to store multiple loading trays, on which ultra-micro TECs are stored. The visual positioning device locates the ultra-micro TEC to be detected by taking pictures with a camera. The loading robot grabs the ultra-micro TEC to be detected from the loading tray to the detection station according to the recognition result of the visual positioning device. The empty tray collection device is used to collect the loading trays after loading.

[0058] Specifically, the appearance recognition module includes a detection station, a camera and a reflector. The detection station is specifically set to be made of transparent glass material, is set in a ring shape and can rotate horizontally. The electrode provides an electrostatic field adsorption force to the detection station, which can adsorb and fix the ultra-micro TEC to avoid displacement and separation from the detection station due to centrifugal force and inertia when the detection station drives the ultra-micro TEC to rotate. Multiple cameras are set along the circumference of the detection station. In order to ensure the shooting effect, each camera is equipped with a light source. In this embodiment, the detection station can drive the ultra-micro TEC to rotate clockwise. Along the rotation direction of the ultra-micro TEC, a first camera, a second camera, a third camera, a fourth camera, a fifth camera and a sixth camera are sequentially arranged. The first camera is set below the transparent detection station for taking pictures of the lower side of the ultra-micro TEC. The third camera is set above the transparent detection station for taking pictures of the upper side of the ultra-micro TEC. The second camera, the fourth camera, the fifth camera and the sixth camera are all installed above the detection station and are all equipped with a reflector. The second camera and the fourth camera are used to photograph the left and right sides of the ultra-micro TEC, and the fifth camera and the sixth camera are used to photograph the front and back sides of the ultra-micro TEC. The specific installation method of the reflector is as described above and will not be repeated here.

[0059] Specifically, the dimension measurement module includes an infrared scanning camera to scan and detect the appearance dimensions of the ultra-micro TEC. In this embodiment, the infrared scanning camera is arranged close to the sixth camera and is arranged in the circumference of the detection station like the camera. A scanning reference is installed on the detection station for calibration of the infrared scanning camera.

[0060] Specifically, the unloading module includes an unloading robot and an unloading tray, and the unloading tray is divided into a good unloading tray and a bad unloading tray. The unloading robot unloads good products to the good unloading tray and bad products to the bad unloading tray according to the judgment result.

[0061] The advantages and positive effects of the present invention are:

[0062] 1. It replaces manual work to realize the automatic detection of ultra-micro TEC appearance defects and appearance dimensions, improves the detection efficiency and accuracy, realizes no manual intervention, and effectively avoids the introduction of appearance defects.

[0063] 2. By setting up multiple cameras, rotating inspection stations and reflective plates, the ultra-micro TEC can be inspected on six sides without turning over during the entire inspection process, which ensures the comprehensiveness of the inspection and avoids damage to the ultra-micro TEC.

[0064] The embodiments of the present invention are described in detail above, but the contents described are only preferred embodiments of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An automatic detection method for the appearance of ultra-micro TEC, characterized in that: The following steps are involved: Visual positioning and loading of ultra-micro TEC; Acquire appearance images of different sides of the ultra-micro TEC; Comparing and judging the appearance image with a standard image; Scan and detect the appearance size of the ultra-micro TEC; The ultra-micro TECs are classified and cut into pieces.

2. The method for automatically detecting the appearance of an ultra-micro TEC according to claim 1, characterized in that: The steps of visually positioning and loading the ultra-micro TEC include: Visually positioning the ultra-micro TEC placed on the loading tray; Grabbing and loading the ultra-micro TEC; The loading tray is collected.

3. The method for automatically detecting the appearance of an ultra-micro TEC according to claim 1 or 2, characterized in that: The steps sequentially obtain appearance images of different sides of the ultra-micro TEC, grab the ultra-micro TEC to a detection station, and use different cameras to take pictures of different sides of the ultra-micro TEC. During the picture taking process, the ultra-micro TEC does not need to be turned over.

4. The method for automatically detecting the appearance of an ultra-micro TEC according to claim 3, characterized in that: The detection station is made of a transparent material and is arranged in a ring shape. The camera is arranged along the circumference of the detection station. The detection station can drive the ultra-micro TEC to rotate to different locations of the camera.

5. The method for automatically detecting the appearance of an ultra-micro TEC according to claim 4, characterized in that: The detection station is provided with an electrostatic field for adsorbing and positioning the ultra-micro TEC.

6. The method for automatically detecting the appearance of an ultra-micro TEC according to claim 5, characterized in that: When acquiring an image of the lower side of the ultra-micro TEC, the camera is arranged below the ultra-micro TEC; when acquiring an image of the upper side of the ultra-micro TEC, the camera is arranged above the ultra-micro TEC; when acquiring an image of the circumferential side of the ultra-micro TEC, the camera is arranged above the ultra-micro TEC and a reflector is used to align the camera with the side to be inspected.

7. The method for automatically detecting the appearance of an ultra-micro TEC according to any one of claims 4 to 6, characterized in that: In the step, the appearance image is compared with the standard image for determination. When both the appearance images are qualified, the product is determined to be a good appearance product, otherwise, the product is determined to be a defective appearance product.

8. The method for automatically detecting the appearance of an ultra-micro TEC according to claim 7, characterized in that: In the step of scanning and detecting the external dimensions of the ultra-micro TEC, an infrared scanning camera is used to scan the external dimensions of the ultra-micro TEC. The infrared scanning camera and the camera are arranged along the circumference of the detection station, and a scanning reference is provided on the detection station.

9. The method for automatically detecting the appearance of an ultra-micro TEC according to claim 8, characterized in that: In the step of classifying and cutting the ultra-micro TECs, when the ultra-micro TECs are good-looking products with qualified appearance dimensions, the ultra-micro TECs are cut as good-looking products; otherwise, the ultra-micro TECs are cut as bad-looking products, and the good-looking products and bad-looking products are placed separately.

10. An automatic detection device for the appearance of ultra-micro TEC, characterized in that: include: Loading module, used for visual positioning and loading of ultra-micro TEC; An appearance recognition module, used to obtain appearance images of different sides of the ultra-micro TEC; An appearance determination module, used for comparing and determining the appearance image with a standard image; A size measurement module, used for scanning and detecting the appearance size of the ultra-micro TEC; The unloading module is used for unloading the ultra-micro TEC by classification.

Images