TEC testing equipment

Abstract

The present invention relates to a TEC testing device, including a shell mechanism and a testing mechanism, wherein the shell mechanism includes a shell, a fixing seat embedded in the inner side of the shell, and an anti-frost component for conveying dry gas to the tested product; the anti-frost component includes an air inlet opened in the side wall of the shell and used to connect to a dry gas supply device, a first air flow channel formed between the inner side wall of the shell and the outer side wall of the fixing seat and connected to the air inlet, a plurality of second air flow channels opened in the fixing seat and the air inlet ends are connected to the first air flow channels, the air outlet ends of the second air flow channels extend to the bottom surface of the fixing seat, and the air outlet ends of the plurality of second air flow channels are symmetrically distributed relative to the central axis of the fixing seat and distributed around the contact copper head. The present invention expands the test temperature range, simplifies the structure, reduces the manufacturing cost and difficulty, and improves portability, flexibility of use and versatility.

Description

Technical Field

[0001] The invention relates to a TEC testing device, which is applicable to the technical field of electronic device testing. Background Art

[0002] The TEC test device is a device that uses semiconductor coolers to test electronic devices such as GPUs and CPUs, optical modules, etc. The precise temperature control of the semiconductor cooler provides an accurate test environment for the device under test to ensure the stability of the test results. TEC test devices usually use copper contact heads as the medium for heat transfer, and the semiconductor cooler is mounted on the back of the contact head, and the front of the contact head is attached to the product under test, so as to transfer the cooling provided by the cooler to the product under test. The low temperature that the semiconductor cooler can reach is usually up to -80℃. Even after the transmission attenuation of the contact head, the cooling capacity it can output can reach -70℃. Therefore, when performing low-temperature tests, the TEC test device usually needs to isolate moisture in the air to prevent the contact head and the product under test from frosting.

[0003] Existing TEC test devices are usually equipped with a sealing cover around the contact head. When the contact head contacts the product under test, the sealing cover can cover the contact head and the product under test to isolate moisture in the air. However, although the manufacturing cost and difficulty of the sealing cover are relatively low, on the one hand, the sealing cover has poor isolation ability from the outside air, resulting in the test device being able to perform low-temperature tests in a small range. When the test temperature is as low as minus 40 to 50 degrees, or even 60 to 70 degrees, the sealing cover cannot effectively avoid the frost problem; on the other hand, since the sealing cover is fixed around the contact head, the height of the sealing cover limits the distance between the contact head and the work surface. Therefore, the test device equipped with the sealing cover can only test products with characteristic size specifications. When the total height of the product under test does not match that of the loading platform, the contact head cannot be completely attached to the product under test, or there is a gap between the bottom of the sealing cover and the work surface, and isolation cannot be achieved, thereby affecting the normal progress of the test.

[0004] In addition to the above methods, the prior art also uses a sealed box for isolation, in which the loading platform and contact head of the product to be tested are both placed in the sealed box to achieve isolation from the outside air. Although this method can ensure the isolation effect and avoid frost, the manufacturing cost and difficulty are high, and the existence of the sealed box makes it impossible to manually operate the contact head to fit the product to be tested, and additional facilities such as a drive mechanism need to be added, which will increase the volume and weight of the test device, and the flexibility and portability of use are relatively poor. Summary of the invention

[0005] In order to solve the defects of the prior art mentioned above, the present invention proposes a TEC testing device.

[0006] The technical solution adopted by the present invention is a TEC testing device, including a mainframe, a shell mechanism connected to the mainframe, and a testing mechanism arranged inside the shell mechanism. The testing mechanism includes a contact copper head for contacting a product to be tested, a semiconductor refrigeration component for providing a test temperature, and a refrigeration and heat dissipation component for dissipating heat for the semiconductor refrigeration component, which are arranged in sequence from bottom to top. Specifically, the mainframe is provided with a control device, a dry gas supply device, a power supply device for supplying power to the semiconductor refrigeration component, a refrigeration system for providing a refrigeration medium for the refrigeration and heat dissipation component, etc. The shell mechanism includes an outer shell, a fixed seat embedded in the inner side of the outer shell, and an anti-frost component for conveying dry gas to the product under test. The anti-frost component includes an air inlet opened on the side wall of the outer shell and used to connect to the dry gas supply device, a first air flow channel formed in an annular shape between the inner side wall of the outer shell and the outer side wall of the fixed seat and connected to the air inlet, a plurality of second air flow channels opened in the fixed seat and the air inlet ends are connected to the first air flow channels, the air outlet ends of the second air flow channels extend to the bottom surface of the fixed seat, and the air outlet ends of the plurality of second air flow channels are centrally symmetrically distributed with the central axis of the fixed seat as the center and distributed around the contact copper head. A shell mechanism is arranged outside the test mechanism to facilitate handheld operation by the test personnel, an anti-frost assembly is arranged inside the shell mechanism, and dry gas is provided by an external dry gas supply device. During low-temperature testing, the dry gas flows from the air inlet into the annular first airflow channel, and then flows from the first airflow channel into a plurality of second airflow channels respectively. By arranging the air outlet end of the second airflow channel on the bottom surface of the fixed seat, the dry gas can form an airflow downward and directly reach the work surface after being blown out from the air outlet end of the second airflow channel, and diffuse to the surroundings after being blocked by the work surface to form an air mass, and the air outlet end of the second airflow channel is symmetrically distributed around the contact copper head, so that the product under test will be covered by the air mass of dry gas around it, and the continuous blowing of dry gas will expel the moist air around the contact copper head and the product under test, forming a continuous and stable dry environment in the area, completely isolating the moist air, thereby avoiding frost on the contact copper head and the product under test during low-temperature testing, greatly expanding the temperature range that the test device can achieve when performing low-temperature testing. The above scheme avoids the problem of frosting. On the one hand, there is no need to set a sealing cover or a sealing box, which simplifies the structure of the test device, reduces the size and weight of the equipment, and on the basis of ensuring the anti-frost effect, not only reduces the manufacturing cost and difficulty, but also improves the portability and flexibility of use; on the other hand, the air mass formed by the dry gas shields the wet air, avoiding structural limitations, so that the test device can be used for the tested products of any specifications and sizes, and on the basis of ensuring the anti-frost effect, improves the flexibility and versatility of use.

[0007] Furthermore, at least two sealing rings arranged up and down are provided between the outer wall of the fixing seat and the inner wall of the shell, and the outer wall of the fixing seat, the inner wall of the shell and the at least two sealing rings together enclose a first airflow channel. By providing the sealing ring, the first airflow channel is formed together with the outer wall of the fixing seat and the inner wall of the shell, which not only ensures the sealing of the first airflow channel, but also ensures the simplicity of the structure, reducing the processing cost and difficulty.

[0008] Furthermore, the fixing seat has a receiving groove that passes through the fixing seat in the up-down direction, and the cooling and heat dissipation component, the semiconductor cooling component, and the contact copper head are all embedded in the receiving groove. The components in the test mechanism are embedded in the receiving groove so as to be connected to the outer shell through the fixing seat to ensure the structural stability of the test device.

[0009] Furthermore, a threading area for a wire harness or a pipe fitting to pass through is provided between the top surface of the fixing seat and the top wall of the shell, a wire inlet connected to the threading area is provided on the side wall of the shell, and the shell mechanism also includes a connector seat fixed to the outer wall of the shell and provided with an interface for connecting to the host, and the wire inlet and the air inlet are both located on the inner side of the interface of the connector seat. Specifically, the connector seat is configured as a bellows connector seat, and the shell mechanism is connected to the host through the connector seat, so that the components such as the wire harness, the dry gas delivery pipe, and the heat dissipation medium delivery pipe connected to the test mechanism are conveniently concentrated in the bellows, wherein the dry gas delivery pipe can be directly connected to the air inlet, and the wire harness and the heat dissipation medium delivery pipe can enter the threading area from the wire inlet and be connected to the semiconductor refrigeration component and the refrigeration and heat dissipation component respectively.

[0010] Furthermore, the contact copper head has a mounting plate and a contact head arranged on the bottom surface of the mounting plate, the mounting plate is embedded in the receiving groove and the contact head protrudes downward from the bottom surface of the fixing seat. By embedding the mounting plate in the receiving groove, the outlet end of the second airflow channel is avoided from being blocked.

[0011] Furthermore, the material of the fixing seat is set to be a heat-insulating material. Since the semiconductor refrigeration component itself will also dissipate a large amount of heat during work, although the heat can be dissipated through the refrigeration and heat dissipation component, the semiconductor refrigeration component will still dissipate a large amount of heat when operating at high power and for a long time. By setting the test mechanism on the inside of the fixing seat and setting the fixing seat to be a heat-insulating material, the heat generated by the test mechanism will not be transferred to the outer shell, preventing the outer shell from being too hot and becoming unable to be held, making it convenient for the tester to hold the outer shell for operation without adding additional hand-held components, thereby simplifying the structure of the test device and improving portability and flexibility of use.

[0012] Furthermore, the test mechanism also includes at least one pair of connection components for connecting electrical signals to the semiconductor refrigeration component, each connection component includes a first connection member whose middle part is inserted into the fixing seat and connected to the host through its upper part, and a second connection member whose upper end can be inserted into the first connection member from the lower end of the first connection member and whose lower end is fixed to the contact copper head. Specifically, the first connection member and the second connection member are both conductive materials. In order to ensure good contact between the semiconductor refrigeration component and the contact copper head, thermal conductive glue is usually required to be applied between the two. However, since the thermal conductive glue is exposed to extremely hot or extremely cold temperatures for a long time, it is easy to age and solidify, which has an adverse effect on the heat transfer efficiency. Therefore, the test device needs to be disassembled frequently and re-applied with thermal conductive glue. By setting the first connection member and the second connection member, the semiconductor refrigeration component that has been disassembled can be quickly electrically connected when it is re-installed into the shell mechanism, without the need to re-weld the wiring harness, so that quick plugging and unplugging can be achieved, simplifying the difficulty and workload of disassembly and assembly, and improving efficiency.

[0013] Furthermore, an insulating block is fixedly provided at the lower end of the second connecting member, and the second connecting member is connected to the contact copper head through the insulating block, thereby avoiding a short circuit between the second connecting member and the contact copper head.

[0014] Furthermore, the semiconductor refrigeration component includes a mounting frame fixed to the refrigeration and heat dissipation component, a semiconductor refrigeration sheet embedded in the mounting frame and having a hot surface in contact with the heat dissipation surface of the refrigeration and heat dissipation component, and a temperature sensor embedded in the contact copper head from top to bottom, wherein the cold surface of the semiconductor refrigeration sheet is in contact with the upper surface of the contact copper head. The refrigeration and heat dissipation component dissipates heat from the hot surface of the semiconductor refrigeration sheet to increase the cooling capacity of the cold surface of the semiconductor refrigeration sheet, and the temperature sensor embedded in the contact copper head can monitor the temperature output by the contact copper head to adjust the test temperature.

[0015] Furthermore, at least two pairs of connection components are provided, and the positive and negative terminals of the semiconductor cooling plate and the positive and negative terminals of the temperature sensor are electrically connected to a pair of connection components respectively. At least two pairs of connection components are convenient for providing power and signals to the semiconductor cooling plate and the temperature sensor respectively.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The TEC test device of the present invention, by providing an anti-frost component, uses dry gas to form an air mass to cover the product under test and the contact copper head, thereby isolating the wet air and expanding the temperature range that the test device can reach when performing low-temperature testing. On the one hand, there is no need to provide a sealing cover or a sealing box, which simplifies the structure of the test device, reduces the volume and weight of the equipment, and on the basis of ensuring the anti-frost effect, not only reduces the manufacturing cost and difficulty, but also improves the portability and flexibility of use; on the other hand, the air mass formed by the dry gas shields the wet air, avoiding structural limitations, so that the test device can be used for the tested products of any specifications and sizes, and on the basis of ensuring the anti-frost effect, improves the flexibility and versatility of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings: Figure 1 The structure of an embodiment of the present invention is shown in FIG. Figure 1 ; Figure 2 yes Figure 1 An exploded view of the structure of the embodiment shown; Figure 3 yes Figure 1 The structure of the embodiment shown is schematically shown Figure 2 ; Figure 4 yes Figure 1 A schematic structural diagram of the housing mechanism in the illustrated embodiment; Figure 5 yes Figure 1 A schematic diagram of the structure inside the housing in the illustrated embodiment; Figure 6 yes Figure 1 A schematic diagram of the structure of the test mechanism in the illustrated embodiment; Figure 7 yes Figure 1 A schematic diagram of the internal structure of the testing mechanism in the illustrated embodiment; The reference numerals are described as follows: 1. Shell mechanism; 11. Shell; 111. Wire inlet; 112. Connector seat; 12. Fixing seat; 121. Receiving groove; 122. Threading area; 13. Anti-frost assembly; 131. Air inlet; 132. First air flow channel; 133. Second air flow channel; 134. Sealing ring; 2. Testing mechanism; 21. Connecting assembly; 211. First connecting piece; 212. Second connecting piece; 213. Insulating block; 3. Contact copper head; 31. Mounting plate; 32. Contact head; 4. Semiconductor refrigeration assembly; 41. Mounting frame; 42. Semiconductor refrigeration sheet; 43. Temperature sensor; 5. Refrigeration and heat dissipation assembly. DETAILED DESCRIPTION

[0018] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "upper" and "lower" related to the direction are defined according to the use direction of the test device. Specifically, when the test device is in normal use, the side facing the tested product is "lower", and the opposite is "upper"; the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Reference Figure 1-7 This embodiment provides a TEC test device, including a host (not shown in the drawings), a housing mechanism 1 connected to the host, and a test mechanism 2 arranged inside the housing mechanism 1. The test mechanism 2 includes a contact copper head 3 for contacting the product to be tested, a semiconductor refrigeration component 4 for providing the test temperature, and a refrigeration and heat dissipation component 5 for dissipating heat from the semiconductor refrigeration component 4. Specifically, the host is provided with a control device, a dry gas supply device, a power supply device for powering the semiconductor refrigeration component, a refrigeration system for providing a refrigeration medium for the refrigeration and heat dissipation component, etc. The housing mechanism 1 includes a shell 11, a fixing seat 12 embedded inside the shell 11, and an anti-frost component 13 for delivering dry gas to the product to be tested.

[0021] The anti-frost component 13 includes an air inlet 131 opened on the side wall of the outer shell 11 and used to connect to the dry gas supply device, a first air flow channel 132 formed in an annular shape between the inner wall of the outer shell 11 and the outer wall of the fixed seat 12 and connected to the air inlet 131, and a plurality of second air flow channels 133 opened in the fixed seat 12 and the air inlet ends are connected to the first air flow channel 132, the air outlet ends of the second air flow channels 133 extend to the bottom surface of the fixed seat 12, and the air outlet ends of the plurality of second air flow channels 133 are centrally symmetrically distributed around the central axis of the fixed seat 12 and distributed around the contact copper head 3. A shell mechanism 1 is arranged outside the test mechanism 2 to facilitate handheld operation by the test personnel. An anti-frost assembly 13 is arranged inside the shell mechanism 1, and dry gas is provided by an external dry gas supply device. During low temperature testing, the dry gas flows from the air inlet 131 into the annular first air flow channel 132, and then flows from the first air flow channel 132 into a plurality of second air flow channels 133 respectively. By arranging the outlet end of the second air flow channel 133 on the bottom surface of the fixing seat 12, the dry gas can be blown out from the outlet end of the second air flow channel 133 to form an air flow downward. And directly reach the work surface, and diffuse to the surroundings after being blocked by the work surface to form an air mass, and the outlet end of the second air flow channel 133 is symmetrically distributed around the contact copper head, so that the product under test will be enveloped by the air mass of dry gas around it, and the continuous blowing of dry gas will drive out the wet air around the contact copper head and the product under test, forming a continuous and stable dry environment in this area, completely isolating the wet air, thereby avoiding the contact copper head and the product under test from frosting during low-temperature testing, greatly expanding the temperature range that the test device can achieve when conducting low-temperature testing. The above scheme avoids the problem of frosting. On the one hand, there is no need to set a sealing cover or a sealing box, which simplifies the structure of the test device, reduces the volume and weight of the equipment, and on the basis of ensuring the anti-frost effect, not only reduces the manufacturing cost and difficulty, but also improves the portability and flexibility of use; on the other hand, the air mass formed by the dry gas shields the wet air, avoiding structural limitations, so that the test device can be used in the tested products of any specifications and sizes, and on the basis of ensuring the anti-frost effect, improves the flexibility and versatility of use.

[0022] In a more preferred embodiment, at least two sealing rings 134 arranged vertically are provided between the outer side wall of the fixing seat 12 and the inner side wall of the outer shell 11, and the outer side wall of the fixing seat 12, the inner side wall of the outer shell 11 and the at least two sealing rings 134 together enclose a first airflow channel 132. By providing the sealing ring 134, the first airflow channel is formed together with the outer side wall of the fixing seat 12 and the inner side wall of the outer shell 11, which not only ensures the sealing of the first airflow channel, but also ensures the simplicity of the structure, reducing the processing cost and difficulty.

[0023] In a more preferred embodiment, the fixing seat 12 has a receiving groove 121 that passes through the fixing seat 12 in the up-down direction, and the cooling and heat dissipation component 5, the semiconductor cooling component 4, and the contact copper head 3 are all embedded in the receiving groove 121. The components in the test mechanism are embedded in the receiving groove 121 so as to be connected to the housing 11 through the fixing seat 12, thereby ensuring the structural stability of the test device.

[0024] In a more preferred embodiment, there is a threading area 122 for the wire harness or pipe fittings to pass through between the top surface of the fixing seat 12 and the top wall of the shell 11, and a wire inlet 111 connected to the threading area 122 is provided on the side wall of the shell 11. The shell mechanism 1 also includes a connector seat 112 fixed to the outer wall of the shell 11 and provided with an interface for connecting to the host, and the wire inlet 111 and the air inlet 131 are both located on the inner side of the interface of the connector seat 112. Specifically, the connector seat 112 is configured as a bellows connector seat, and the shell mechanism is connected to the host through the connector seat, so that the components such as the wire harness, dry gas delivery pipe, and heat dissipation medium delivery pipe connected to the test mechanism are conveniently concentrated in the bellows, wherein the dry gas delivery pipe can be directly connected to the air inlet, and the wire harness and the heat dissipation medium delivery pipe can enter the threading area from the wire inlet and be connected to the semiconductor refrigeration component and the refrigeration and heat dissipation component respectively.

[0025] In a more preferred embodiment, the contact copper head 3 has a mounting plate 31 and a contact head 32 disposed on the bottom surface of the mounting plate 31. The mounting plate 31 is embedded in the receiving groove 121 and the contact head 32 protrudes downward from the bottom surface of the fixing seat 12. By embedding the mounting plate 31 in the receiving groove 121, the air outlet end of the second air flow channel is prevented from being blocked.

[0026] In a more preferred embodiment, the material of the fixing seat 12 is set to be a heat-insulating material. Since the semiconductor refrigeration component itself will also emit a large amount of heat during operation, although the heat can be dissipated through the refrigeration and heat dissipation component, the semiconductor refrigeration component will still emit a large amount of heat to the outside under high-power and long-term operation. By setting the test mechanism on the inside of the fixing seat and setting the fixing seat to be a heat-insulating material, the heat generated by the test mechanism will not be transferred to the outer shell, preventing the outer shell from being too hot and becoming unable to be held, making it convenient for the tester to hold the outer shell for operation without adding additional hand-held components, simplifying the structure of the test device, and improving portability and flexibility of use.

[0027] In a more preferred embodiment, the test mechanism 2 further includes at least one pair of connection components 21 for connecting electrical signals to the semiconductor refrigeration component 4. Each connection component 21 includes a first connection member 211 whose middle part is inserted into the fixing seat 12 and connected to the host through its upper part, and a second connection member 212 whose upper end is detachably inserted into the first connection member 211 from the lower end of the first connection member 211 and whose lower end is fixed to the contact copper head 3. Specifically, the first connection member and the second connection member are both made of conductive materials. In order to ensure good contact between the semiconductor refrigeration component and the contact copper head, thermal conductive glue is usually applied between the two. However, since the thermal conductive glue is exposed to extremely hot or extremely cold temperatures for a long time, it is easy to age and solidify, which has an adverse effect on the heat transfer efficiency. Therefore, the test device needs to be disassembled frequently and the thermal conductive glue is reapplied. By providing the first connection member and the second connection member, the semiconductor refrigeration component that has been disassembled can be quickly electrically connected when it is reinstalled into the housing mechanism, without the need to re-weld the wiring harness, so that quick plugging and unplugging can be achieved, simplifying the difficulty and workload of disassembly and assembly, and improving efficiency.

[0028] In a more preferred embodiment, an insulating block 213 is fixedly provided at the lower end of the second connecting member 212, and the second connecting member 212 is connected to the contact copper head 3 through the insulating block 213, thereby avoiding a short circuit between the second connecting member and the contact copper head.

[0029] In a more preferred embodiment, the semiconductor refrigeration component 4 includes a mounting frame 41 fixed to the refrigeration and heat dissipation component 5, a semiconductor refrigeration sheet 42 embedded in the mounting frame 41 and having its hot surface in contact with the heat dissipation surface of the refrigeration and heat dissipation component 5, and a temperature sensor 43 embedded in the contact copper head 3 from top to bottom, and the cold surface of the semiconductor refrigeration sheet 42 is in contact with the upper surface of the contact copper head 3. The refrigeration and heat dissipation component dissipates heat from the hot surface of the semiconductor refrigeration sheet to increase the cooling capacity of the cold surface of the semiconductor refrigeration sheet, and the temperature sensor embedded in the contact copper head can monitor the temperature output by the contact copper head to adjust the test temperature.

[0030] In a more preferred embodiment, at least two pairs of connection components 21 are provided, and the positive and negative terminals of the semiconductor cooling plate 42 and the positive and negative terminals of the temperature sensor 43 are electrically connected to a pair of connection components 21 respectively. At least two pairs of connection components are convenient for providing power and signals to the semiconductor cooling plate and the temperature sensor respectively.

[0031] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The TEC test device of the present invention, by providing an anti-frost component, uses dry gas to form an air mass to cover the product under test and the contact copper head, thereby isolating the wet air and expanding the temperature range that the test device can reach when performing low-temperature testing. On the one hand, there is no need to provide a sealing cover or a sealing box, which simplifies the structure of the test device, reduces the volume and weight of the equipment, and on the basis of ensuring the anti-frost effect, not only reduces the manufacturing cost and difficulty, but also improves the portability and flexibility of use; on the other hand, the air mass formed by the dry gas shields the wet air, avoiding structural limitations, so that the test device can be used for the tested products of any specifications and sizes, and on the basis of ensuring the anti-frost effect, improves the flexibility and versatility of use.

[0032] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the contents of the present invention and implement them accordingly. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A TEC testing device, comprising a host, a housing structure (1) connected to the host, and a testing structure (2) arranged inside the housing structure (1), wherein the testing structure (2) comprises, arranged in order from bottom to top, a contact copper head (3) for contacting a product to be tested, a semiconductor refrigeration component (4) for providing a test temperature, and a refrigeration and heat dissipation component (5) for dissipating heat for the semiconductor refrigeration component (4), characterized in that: The housing structure (1) comprises an outer shell (11), a fixing seat (12) embedded inside the outer shell (11), and an anti-frost component (13) for conveying dry gas to the product to be tested; The anti-frost component (13) comprises an air inlet (131) formed in the side wall of the outer shell (11) and used for connecting to a dry gas supply device, a first air flow channel (132) formed between the inner side wall of the outer shell (11) and the outer side wall of the fixed seat (12) and in an annular shape and connected to the air inlet (131), and a plurality of second air flow channels (133) formed in the fixed seat (12) and having air inlet ends connected to the first air flow channel (132), the air outlet ends of the second air flow channels (133) extending to the bottom surface of the fixed seat (12), and the air outlet ends of the plurality of second air flow channels (133) being centrally symmetrically distributed around the central axis of the fixed seat (12) and distributed around the contact copper head (3).

2. The TEC testing device according to claim 1, characterized in that: At least two sealing rings (134) arranged vertically are provided between the outer side wall of the fixing seat (12) and the inner side wall of the outer shell (11); the outer side wall of the fixing seat (12), the inner side wall of the outer shell (11) and the at least two sealing rings (134) together enclose the first airflow channel (132).

3. The TEC testing device according to claim 1, characterized in that: The fixing seat (12) has a receiving groove (121) that passes through the fixing seat (12) in the up-down direction, and the refrigeration and heat dissipation component (5), the semiconductor refrigeration component (4), and the contact copper head (3) are all embedded in the receiving groove (121).

4. The TEC testing device according to claim 3, characterized in that: A wire threading area (122) for passing a wire harness or a pipe is provided between the top surface of the fixing seat (12) and the top wall of the outer shell (11); a wire inlet (111) communicating with the wire threading area (122) is provided on the side wall of the outer shell (11); the housing mechanism (1) further comprises a connector seat (112) fixed to the outer wall of the outer shell (11) and provided with an interface for connecting to the host; the wire inlet (111) and the air inlet (131) are both located on the inner side of the interface of the connector seat (112).

5. The TEC testing device according to claim 3, characterized in that: The contact copper head (3) comprises a mounting plate (31) and a contact head (32) arranged on the bottom surface of the mounting plate (31); the mounting plate (31) is embedded in the receiving groove (121) and the contact head (32) protrudes downward from the bottom surface of the fixing seat (12).

6. The TEC testing device according to claim 1, characterized in that: The material of the fixing seat (12) is set to be a heat-insulating material.

7. The TEC testing device according to claim 1, characterized in that: The test mechanism (2) further comprises at least one pair of connection components (21) for connecting an electrical signal to the semiconductor refrigeration component (4), each of the connection components (21) comprising a first connection member (211) whose middle portion is inserted into the fixing seat (12) and connected to the host through its upper portion, and a second connection member (212) whose upper end is detachably inserted into the first connection member (211) from the lower end of the first connection member (211) and whose lower end is fixed to the contact copper head (3).

8. The TEC testing device according to claim 7, characterized in that: An insulating block (213) is fixedly provided at the lower end of the second connecting member (212), and the second connecting member (212) is connected to the contact copper head (3) via the insulating block (213).

9. The TEC testing device according to claim 7, characterized in that: The semiconductor refrigeration component (4) comprises a mounting frame (41) fixed to the refrigeration and heat dissipation component (5), a semiconductor refrigeration sheet (42) embedded in the mounting frame (41) and having a hot surface in contact with a heat dissipation surface of the refrigeration and heat dissipation component (5), and a temperature sensor (43) embedded in the contact copper head (3) from top to bottom, wherein the cold surface of the semiconductor refrigeration sheet (42) is in contact with the upper surface of the contact copper head (3).

10. The TEC testing device according to claim 9, characterized in that: The connection components (21) are provided with at least two pairs, and the positive and negative terminals of the semiconductor cooling sheet (42) and the positive and negative terminals of the temperature sensor (43) are electrically connected to a pair of the connection components (21) respectively.

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