A wafer testing method and system for a multi-port device based on an adsorbable retractable knob-type carrier

Abstract

The present invention discloses a wafer testing method and system for a multi-port device based on an adsorbable retractable knob type carrier. The adsorbable retractable knob type carrier includes: a carrier, a slot bead; two slot beadings are symmetrically and movably distributed on the front of the carrier, and the middle area of ​​the two slot beadings is a chip placement area. The chip slot beading is pushed forward by an adjustable screw knob so that the two beadings are close to the chip placement area, and the module to be tested is clamped and fixed firmly. The system of the present invention includes a vector network analyzer, a probe, and a probe station chuck, which can adsorb a retractable knob type carrier. The "M"-shaped air holes on the carrier and the probe station chuck are firmly adsorbed, and the chip position on the module to be tested fixed on the carrier is tested by the probe. The present invention can be compatible with the fixing of modules of different sizes, and can provide a stable state for the probe, protect the probe from damage, and support multi-port device modules, and support multi-port device module port positions as probes and coaxial.

Description

Technical Field

[0001] The invention belongs to the field of multi-port device carrier testing, and in particular relates to a carrier testing method and system for a multi-port device based on an adsorbable retractable knob-type carrier. Background Art

[0002] During the wafer test, the probe is the only part that contacts the chip surface. The anti-shake stability of the test system is very high. The slightest carelessness will cause damage to the chip and the probe. The price of the probe is relatively expensive, the procurement cycle is long, and the operator requirements are extremely high. For multi-port devices installed on the module, the "M"-shaped suction hole on the surface of the probe station CHUCK cannot firmly absorb the module. Therefore, during the test, the main force will be distributed on the probe, and the probe is easily damaged. If the probe contacts the chip Figure 3 Before the test starts, the probe does not touch the chip and is in a normal state. After the test starts, the probe contacts the chip with a certain force and is in a compressed state. Summary of the invention

[0003] The present invention aims at the problems existing in the prior art and provides a wafer testing method and system for a multi-port device based on an absorbable retractable knob-type carrier, which can better fix the modules to be tested of different sizes, provide a stable state for the probe, and protect the probe from damage. It can also support multi-port device modules and support the port positions of multi-port device modules as probes and coaxial.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: an adsorbable retractable knob type carrier, comprising: a carrier, two card slot pressure strips, and an adjustable screw knob; the two card slot pressure strips are symmetrically and movably distributed on the front of the carrier, the middle area of ​​the two card slot pressure strips is the chip placement area, and the adjustable screw knobs are respectively located in the outer areas of the two card slot pressure strips, and the two card slot pressure strips are pushed along the thread direction by the adjustable screw knob to make the two card slot pressure strips approach the chip placement area, clamp the module to be detected on the chip placement area, and fix the module to be detected firmly;

[0005] The shape of the carrier is the same as that of the probe station chuck. The back of the carrier is smooth and in contact with the probe station chuck. The bottom plate is adsorbed through the pores of the probe station chuck. The pore adsorption ensures that the carrier is fully in contact and more firmly.

[0006] Furthermore, there are four adjustable screw knobs, which are symmetrically distributed on the outer sides of the two card slot moldings.

[0007] Furthermore, the air hole of the aforementioned probe station chuck is in the shape of a "M".

[0008] Furthermore, the shape of the aforementioned carrier plate and the shape of the probe station chuck are both circular.

[0009] Another aspect of the present invention provides a wafer test system for a multi-port device based on an absorbable retractable knob type carrier, comprising: a vector network analyzer, a cable, a probe, a probe station chuck, and an absorbable retractable knob type carrier;

[0010] The adsorbable retractable knob type carrier and the probe station chuck are firmly adsorbed through the "M"-shaped air holes on the probe station chuck, and the mixer module to be tested is fixed in the middle area of ​​the two card slot strips on the adsorbable retractable knob type carrier, and the chip port on the module to be tested is tested through the probe.

[0011] Furthermore, the aforementioned chip port of the module to be detected is 3, and the port names are P1, P2, and P3 respectively.

[0012] Furthermore, the number of ports of the aforementioned vector network analyzer is greater than or equal to the number of chip ports of the module carrier to be detected, and the number of probes corresponds to the ports P1, P2, and P3 of the module to be detected.

[0013] The present invention also provides a wafer testing method for a multi-port device based on an adsorbable retractable knob-type carrier, comprising the following steps:

[0014] S1. Build the test system and install the test probe;

[0015] S2. Calibrate the probe of the vector network analyzer;

[0016] S3, place the port module to be tested into the chip placement area of ​​the adsorbable retractable knob type carrier, place the two card slot pressure strips close to the module to be tested, and then apply force to the two chip card slot pressure strips through the adjustable screw knob to fix the module to be tested firmly;

[0017] S4, placing the module to be tested fixed in step S3 on the adsorbable retractable knob-type carrier on the chuck of the probe station, turning on the air pump of the chuck of the probe station, and moving the adsorbable retractable knob-type carrier through the "M"-shaped air hole on the chuck of the probe station;

[0018] S5. Detect the adsorption strength, observe the adsorption strength through the probe station air pressure value indicator, and confirm that the probe station chuck can adsorb the retractable knob type carrier and adsorb it firmly;

[0019] S6, move the probe station chuck to move the adsorption carrier to the bottom of the microscope, and find the positions of the ports P1, P2, and P3 of the module to be tested through the probe station microscope;

[0020] S7, the probe contacts the ports P1, P2, and P3 of the module to be tested, writes an automated test program, automatically collects and completes the test and saves the test data;

[0021] S8. Determine the test results and display the changes in loss and frequency.

[0022] Compared with the prior art, the beneficial technical effects of the above technical solutions adopted by the present invention are as follows: The present invention is a wafer test method and system for a multi-port device based on an adsorbable retractable knob-type carrier, which can flexibly realize the design and construction of various systems. The advantages of the present invention are: 1. Compatible modules of different sizes can be fixed. 2. It can provide a stable state for the probe to protect the probe from damage. 3. Support multi-port device modules. 4. Support multi-port device module port positions as probes and coaxial. The knob is convenient to adjust. The module is fixed safely and reliably, saving design and testing costs, and easy to promote and apply. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of an adsorbable retractable knob type carrier.

[0024] Figure 2 It is a schematic diagram of the test system.

[0025] Figure 3 This is a schematic diagram of the contact between the probe and the chip.

[0026] Figure 4 This is a test result diagram of the test system of the present invention.

[0027] Figure 5 The figure is a flow chart of the method of the present invention. DETAILED DESCRIPTION

[0028] like Figure 3 As shown in the figure, during the test of the millimeter-wave mixer, the module under test can be stably adsorbed on the CHUCK, which will be of great help to the tester and can also effectively protect the waveguide probe. Therefore, a retractable knob-type carrier is used to fix the module, and the 8-inch carrier is completely adsorbed by the "M"-shaped air holes on the CHUCK. The adsorption strength is detected, and the air pressure value index meets the test requirements. The advantage of making the retractable knob-type carrier compatible with modules of a certain size.

[0029] like Figure 1 As shown, an adsorbable retractable knob type carrier comprises: a carrier, two slot pressure strips, and an adjustable screw knob; the two slot pressure strips are symmetrically and movably distributed on the front side of the carrier, the middle area of ​​the two slot pressure strips is the chip placement area, and four adjustable screw knobs are symmetrically located on the outer areas of the two slot pressure strips, and the two slot pressure strips are pushed along the thread direction by the adjustable screw knobs to make the two slot pressure strips approach the chip placement area, clamp the module to be detected on the chip placement area, and fix the module to be detected firmly; the shape of the carrier is the same as that of the probe station chuck, both are round, the back of the carrier is smooth and in contact with the probe station chuck, and the chassis is adsorbed through the "M"-shaped air holes of the probe station chuck, and the "M"-shaped air hole adsorption ensures that the carrier is fully in contact and more firmly.

[0030] like Figure 2 , On the other hand, the present invention provides a wafer test system for a multi-port device based on an absorbable retractable knob type carrier, comprising: a vector network analyzer, a cable, a probe, a probe station chuck, and an absorbable retractable knob type carrier;

[0031] The adsorbable retractable knob type carrier and the probe station chuck are firmly adsorbed through the "M" shaped air holes on the probe station chuck. The mixer module to be tested is fixed in the middle area of ​​the two card slot pressure strips on the adsorbable retractable knob type carrier, and the chip port on the module to be tested is tested through the probe. The number of chip ports of the module to be tested is 3, and the port names are P1, P2, and P3 respectively. The number of ports of the vector network analyzer must be greater than or equal to the number of chip ports of the carrier of the module to be tested, and the number of probes corresponds to the ports P1, P2, and P3 of the module to be tested.

[0032] like Figure 5 As shown, the present invention also provides a wafer testing method for a multi-port device based on an adsorbable retractable knob-type carrier, comprising the following steps:

[0033] S1. Build the test system and install the test probe;

[0034] S2. Calibrate the probe of the vector network analyzer;

[0035] S3, place the port module to be tested into the chip placement area of ​​the adsorbable retractable knob type carrier, place the two card slot pressure strips close to the module to be tested, and then apply force to the two chip card slot pressure strips through the adjustable screw knob to fix the module to be tested firmly;

[0036] S4, placing the module to be tested fixed in step S3 on the adsorbable retractable knob-type carrier on the chuck of the probe station, turning on the air pump of the chuck of the probe station, and moving the adsorbable retractable knob-type carrier through the "M"-shaped air hole on the chuck of the probe station;

[0037] S5. Detect the adsorption strength, observe the adsorption strength through the probe station air pressure value indicator, and confirm that the probe station chuck can adsorb the retractable knob type carrier and adsorb it firmly;

[0038] S6, move the probe station chuck to move the adsorption carrier to the bottom of the microscope, and find the positions of the ports P1, P2, and P3 of the module to be tested through the probe station microscope;

[0039] S7, the probe contacts the ports P1, P2, and P3 of the module to be tested, writes an automated test program, automatically collects and completes the test and saves the test data;

[0040] S8. Determine the test results and display the loss and frequency changes. Figure 4As shown, it shows the change of loss VS frequency, and the test results are in line with expectations.

Claims

1. An adsorbable retractable knob type carrier, characterized in that: Including: A carrier plate, two card slot pressing strips, and adjustable screw knobs; The two card slot pressing strips are symmetrically and movably distributed on the front of the carrier plate. The middle area between the two card slot pressing strips is the chip placement area. The adjustable screw knobs are respectively located in the outer areas of the two card slot pressing strips. By advancing the adjustable screw knobs along the thread direction, the two card slot pressing strips are moved closer to the chip placement area to clamp the module to be tested on the chip placement area and firmly fix the module to be tested; The shape of the carrier plate is the same as that of the chuck of the probe station. The back of the carrier plate is smooth and contacts the chuck of the probe station. The chassis is adsorbed through the air holes of the chuck of the probe station, and this air hole adsorption ensures that the carrier plate is in full contact and more firmly fixed.

2. The adsorbable retractable knob type carrier according to claim 1, characterized in that: There are 4 adjustable screw knobs, which are symmetrically distributed in the outer areas of the two card slot pressing strips respectively.

3. The adsorbable retractable knob type carrier according to claim 1, characterized in that: The air holes of the chuck of the probe station are in a "rice" shape.

4. The adsorbable retractable knob type carrier according to claim 1, characterized in that: The shapes of both the carrier plate and the chuck of the probe station are circular.

5. A wafer test system for a multi-port device based on an adsorbable retractable knob-type carrier, characterized in that: The system includes: a vector network analyzer, a cable, a probe, a chuck of the probe station, and an adsorbable and telescopic knob-type carrier plate; The adsorbable and telescopic knob-type carrier plate is firmly adsorbed to the chuck of the probe station through the "rice"-shaped air holes on the chuck of the probe station. A to-be-tested mixer module is fixed in the middle area between the two card slot pressing strips on the adsorbable and telescopic knob-type carrier plate, and the chips on the module to be tested are tested through the probes.

6. A wafer test system for a multi-port device based on an adsorbable retractable knob-type carrier according to claim 5, characterized in that: The number of chip ports of the module to be tested is 3, and the port names are P1, P2, and P3 respectively.

7. A wafer test system for a multi-port device based on an adsorbable retractable knob-type carrier according to claim 5, characterized in that: The number of ports of the vector network analyzer is greater than or equal to the number of chip ports of the carrier of the module to be tested, and the number of probes corresponds one by one to the ports P1, P2, and P3 of the module to be tested.

8. A wafer testing method for a multi-port device based on an adsorbable retractable knob-type carrier, characterized in that: Including the following steps: S1. Build a test system and install the test probes; S2. Calibrate the probes on the vector network analyzer; S3. Place the port module to be tested in the chip placement area of the adsorbable and telescopic knob-type carrier plate, press the two card slot pressing strips tightly against the module to be tested, and then apply force to the two chip card slot pressing strips through the adjustable screw knobs to firmly fix the module to be tested; S4. Place the module to be tested fixed in step S3 on the adsorbable and telescopic knob-type carrier plate placed on the chuck of the probe station, turn on the air pump of the chuck of the probe station, and adsorb the adsorbable and telescopic knob-type carrier plate through the "rice"-shaped air holes on the chuck of the probe station; S5. Detect the adsorption force, observe the adsorption strength through the air pressure value index of the probe station, and determine that the chuck of the probe station firmly adsorbs the adsorbable and telescopic knob-type carrier plate; S6. Move the chuck of the probe station to move the adsorbable carrier plate under the microscope, and find the positions of the ports P1, P2, and P3 of the module to be tested through the microscope of the probe station; S7. The probes contact the positions of the ports P1, P2, and P3 of the module to be tested, write an automated test program, automatically collect and complete the test, and save the test data; S8. Judge the test results and display the transformation of loss and frequency.

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