RF front-end chip mass production test method and RF front-end chip mass production test method based on multi-site test mass production board
By combining the RF paths under the same test conditions and using multi-site test mass production boards, the problem of excessively long production and testing time of RF front-end chips is solved, and efficient multi-site testing is achieved, which improves testing efficiency and extends the equipment life.
Patent Information
- Application Number
- CN202510094163.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-04-04
AI Technical Summary
The mass production and testing time of RF front-end chips is too long, resulting in low testing efficiency and excessive RF resources, making it difficult to achieve multi-site testing.
By combining radio frequency paths under the same test conditions, using multiple Site test mass production boards, determining radio frequency paths with the same mass production test conditions, and controlling the opening of the test path through digital signal sequences to achieve the simultaneous testing of multiple test paths.
This greatly reduces the mass production test time under the same test conditions, improves the mass production test efficiency, reduces equipment losses, and extends the service life of the equipment.
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Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of chip mass production testing, and more specifically, relates to a radio frequency front-end chip mass production testing method and a radio frequency front-end chip batch production testing method based on a multi-site test mass production board. Background Art
[0002] At present, RF front-end chips have been widely used in various electronic devices, such as mobile phones, tablets, routers, etc., and each RF front-end chip needs to undergo rigorous mass production testing before formal shipment to ensure that the quality and performance of the chip can meet customer requirements. RF switches are widely used for band selection and frequency signal switching between various RF input / output ports. These components support high signal quality and strength in various applications. The most critical performance indicators of RF switches are extremely low insertion loss (IL), high isolation (ISO) and low harmonics. These three items must be tested during mass production testing.
[0003] The mass production tests of RF front-end chips are all conducted using ATE (Automatic Test Equipment). Through computer programming, ATE can be controlled to conduct customized tests, thereby testing different types of production lines. Compared with other RF front-end products, such as RF amplifiers, low-noise amplifiers, and WIFI modules, etc.
[0004] The mass production test items of RF switches are relatively simple. After the electrical performance test, the RF performance test usually only needs to test the insertion loss, isolation and harmonics.
[0005] The longer the test time for a single material is during the mass production test, the lower the efficiency of the mass production test, which will directly affect the test output of the factory. At the same time, the RF switch combination has more channels. For example, a 3P3T RF switch product, such as Figure 8 As shown in the figure, the input ports are RF1, RF3, and RF5, and the output ports are RF2, RF4, and RF6. The combination of the two has 9 RF paths. Traditional testing uses a method of testing each RF path once, which usually takes a long test time and occupies more RF resources, which is not conducive to multi-site testing.
[0006] As the number of communication frequency bands supported by RF front-end systems increases, the design becomes more and more complex. Under this demand, the modularization of RF front-end chips has become an inevitable trend. As a result, the number of interfaces of RF front-end chips increases. The RF resources of each ATE are limited. As the complexity of RF front-end chips increases, when a chip has too many RF interfaces, it will occupy more ATE test resources, resulting in insufficient test resources. At the same time, in order to improve test efficiency, multi-site testing is usually used, which requires more RF resources. For example, a certain RF PA product, such as Fig. 9 As shown, it has 18 external RF interfaces. Taking PAxRD, a common RF tester on the market, as an example, it has only 32 RF resources. The traditional test method can only perform single-site testing, and multi-site testing is not possible. According to the RF path and test items of the chip to be tested, all ports of the chip are divided into signal input ports, signal output ports, and signal input and output ports. The signal input ports are Tx_HB_IN and Tx_LB_IN, the signal output ports are ANT and CPL, and the signal input and output ports are TRX1-TRX14. According to the above path analysis, the same type of RF interfaces can be combined through a single-pole, multi-throw onboard RF switch. The specific solution is as follows: Fig. 9 As shown, the 18 RF interfaces of the product can be combined into 3 RF interfaces and connected to ATE, which greatly reduces the test resource utilization of ATE, that is, the single-site test of the product only requires 3 RF test resources of ATE, thereby providing a multi-site test solution for the product. In order to improve the efficiency of mass production testing, when the ATE RF board resources, DC board resources, and digital board resources are sufficient, multi-site test solutions should be provided as much as possible. According to the above solution, the wiring can be reasonably laid out in the same PCB to complete the resource allocation of the multi-site solution. According to the above technical background statement, it can be found that whether it is a single-site RF switch or other complex RF front-end chips at multiple sites, there is a situation, namely: multiple test paths have measurements under the same test conditions, where the same test conditions are usually the signal input end is set to the same power, the same frequency, and the same waveform, and the signal measurement end setting parameters are also the same, that is, the measurement conditions of the signal output end are set to be consistent. For example Figure 8 When the same test items are tested in each channel of the 3P3T RF switch test, the transmission conditions of the input terminals RF1, RF3, and RF5 are set to be consistent, and the measurement conditions of the signal output terminals RF2, RF4, and RF6 are set to be consistent; for example, through Fig.10 When the multi-site test mass production board shown in the figure tests the same channel and the same test item, the emission conditions of its input terminals P1, P4, P7, and P10 are set to be consistent, and the measurement conditions of its signal output terminals P2, P5, P8, and P11 are set to be consistent.
[0007] If the same test conditions and different test paths are divided into multiple tests to complete, it will usually take a lot of time and cause a huge loss in efficiency of mass production testing.
[0008] The information disclosed in the background technology section of the present invention is only intended to deepen the understanding of the general background technology of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to those skilled in the art. Summary of the invention
[0009] The purpose of the present invention is to propose a mass production test method for RF front-end chips and a mass production test method for RF front-end chips based on a multi-site test mass production board, so as to solve the problem of long test time for mass production test, greatly reduce the mass production test time under the same test conditions, and improve the mass production test efficiency.
[0010] To achieve the above objectives, the present invention proposes a RF front-end chip mass production test method and a RF front-end chip mass production test method based on a multi-site test mass production board.
[0011] According to a first aspect of the present invention, a method for mass production testing of a radio frequency front-end chip is proposed, comprising:
[0012] Determine the RF path in the RF front-end chip that has the same mass production test conditions based on the mass production test project;
[0013] Determining the number of test channels for each mass production test based on the number of signal input ports of the radio frequency channel;
[0014] Determining the number of mass production tests based on the number of the test paths and the number of the RF paths;
[0015] Based on the mass production test times, mass production tests of RF front-end chips are carried out.
[0016] Optionally, the mass production test conditions include:
[0017] Use test signals of the same power, frequency, and waveform;
[0018] The setting parameters of the signal measurement end are the same.
[0019] Optionally, each of the mass production tests includes:
[0020] Outputting a test signal to each of the test paths based on the mass production test items and the corresponding mass production test conditions;
[0021] Based on the calibrated line loss value, the output power of the corresponding test signal is compensated through the adjustable attenuator corresponding to each test path, so that the test signal at each signal input port meets the mass production test condition;
[0022] Determining the signal receiving time length of each of the test paths based on the length of the test signal;
[0023] Controlling the opening of each of the test paths using a digital signal sequence based on the signal reception duration;
[0024] The output signal corresponding to the test path is collected based on the signal reception duration.
[0025] Optionally, the signal reception duration includes:
[0026] Signal sampling duration, including actual sampling duration and signal switching duration;
[0027] Collecting the output signal corresponding to the test path based on the actual sampling duration;
[0028] The test path is switched based on the signal switching duration for acquisition.
[0029] Optionally, the output signal corresponding to the set middle time period in the actual sampling duration is demodulated as a valid test signal to obtain the test result of each test path.
[0030] According to a second aspect of the present invention, a method for testing mass production of RF front-end chips based on a multi-site test production board is proposed, comprising:
[0031] Place multiple identical RF front-end chips at corresponding positions on multi-site test production boards;
[0032] Determining the number of test channels for each batch production test based on the number of the RF front-end chips;
[0033] Wherein, each batch production test tests one RF path of each RF front-end chip;
[0034] Determine, according to the mass production test items, a radio frequency path in the radio frequency front-end chip that has the same mass production test conditions;
[0035] Determining the number of batch production tests based on the number of the radio frequency paths;
[0036] Based on the number of mass production tests, carry out mass production tests on RF front-end chips.
[0037] Optionally, the mass production test conditions include:
[0038] Use test signals of the same power, frequency, and waveform;
[0039] The setting parameters of the signal measurement port are the same.
[0040] Optionally, each batch production test includes:
[0041] Outputting test signals to the same test path of each of the RF front-end cores based on the mass production test conditions and the corresponding mass production test conditions;
[0042] Based on the calibrated line loss value, the output power of the corresponding test signal is compensated through the adjustable attenuator corresponding to each of the RF front-end chips, so that the test signal at the signal input port of each of the RF front-end chips meets the mass production test conditions;
[0043] Determining the sampling duration of each of the test paths based on the length of the test signal;
[0044] The output signal corresponding to the test path is collected based on the sampling duration.
[0045] Optionally, the signal reception duration includes:
[0046] Signal sampling duration, including actual sampling duration and signal switching duration;
[0047] Collecting the output signal corresponding to the test path based on the actual sampling duration;
[0048] The test path is switched based on the signal switching duration for acquisition.
[0049] Optionally, the output signal corresponding to the set middle time period in the actual sampling duration is demodulated as a valid test signal to obtain the test result of each test path.
[0050] The beneficial effects of the present invention are as follows: the present invention realizes simultaneous testing of multiple test paths by merging RF paths under the same test conditions, which can greatly reduce the mass production test time under the same test conditions, improve mass production test efficiency, reduce equipment loss, and extend equipment service life.
[0051] The system of the present invention has other characteristics and advantages, which will be apparent from the drawings incorporated herein and the following detailed description, or will be described in detail in the drawings incorporated herein and the following detailed description, which together serve to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0052] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which like reference numerals generally represent like components.
[0053] Figure 1 A flow chart showing the steps of a radio frequency front-end chip mass production testing method according to Example 1.
[0054] Figure 2 A flowchart showing the steps of a method for mass production testing of RF front-end chips based on a multi-site test production board in Example 2 is shown.
[0055] Figure 3 A schematic diagram of a radio frequency front-end chip mass production test method of Example 1 is shown.
[0056] Figure 4 A timing diagram of a digital signal sequence of Example 1 is shown.
[0057] Figure 5 A schematic diagram showing the demodulation of a valid signal by the signal measuring terminal SA of Embodiment 1 is shown.
[0058] Figure 6 A schematic diagram of a method for mass production testing of RF front-end chips based on a multi-site test production board according to Example 2 is shown.
[0059] Figure 7 A schematic diagram showing the demodulation of a valid signal by the signal measurement terminal SA of the second embodiment is shown.
[0060] Figure 8 A schematic diagram of a 3P3T radio frequency switch of the background art is shown.
[0061] Fig. 9 A schematic diagram of a single-site test mass production board of the background art is shown.
[0062] Fig.10 A schematic diagram of a multi-site test mass production board of the background art is shown. DETAILED DESCRIPTION
[0063] The present invention will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.
[0064] Example 1
[0065] like Figure 1As shown, this embodiment provides a method for mass production testing of a radio frequency front-end chip, including:
[0066] S1. Determine the RF path in the RF front-end chip that has the same mass production test conditions based on the mass production test project;
[0067] In this step, the mass production test conditions include: using test signals with the same power, frequency and waveform; and setting parameters of the signal measurement end are the same.
[0068] Specifically, the RF path refers to a series of components that the RF signal passes through from input to output, including filters, amplifiers, mixers, etc. The mass production test conditions of different mass production test items are different, and the tested RF paths are also different. The RF paths with the same mass production test conditions in the RF front-end chip are determined according to the mass production test items, so that the RF paths with the same mass production test conditions are grouped together for testing. When switching different path tests, there is no need to frequently readjust the power, frequency, waveform of the test signal, and the setting parameters of the signal measurement end. Originally, when testing each different RF path separately, it took several minutes to configure these parameters each time, but now it only needs to be configured once in the same group. For large-scale mass production testing, it can save a lot of configuration time overall and speed up the advancement of the test process. At the same time, multiple RF paths with the same conditions are tested, and the operation is more convenient and efficient.
[0069] by Figure 8 Taking the 3P3T RF switch shown as an example, there are 9 actual RF paths, namely RF1-RF2, RF1-RF4, RF1-RF6, RF3-RF2, RF3-RF4, RF3-RF6, RF5-RF2, RF5-RF4, and RF5-RF6, and the test items are insertion loss, isolation, and harmonics. Since the test items are the same, these 9 RF paths can be tested using test signals of the same power, frequency, and waveform, and the setting parameters of the signal measurement end are the same. Therefore, RF1-RF2, RF1-RF4, RF1-RF6, RF3-RF2, RF3-RF4, RF3-RF6, RF5-RF2, RF5-RF4, and RF5-RF6 are determined to be RF paths with the same mass production test conditions.
[0070] S2. Determine the number of test channels for each mass production test based on the number of signal input ports of the RF channel;
[0071] Specifically, one signal input port corresponds to multiple RF paths, but each signal input port represents only one RF path during mass production testing. Therefore, the number of test paths for each mass production test can be determined based on the number of signal input ports of the RF path. Figure 8As shown, the RF switch has three signal input ports, namely, signal input ports RF1, RF3 and RF5. Therefore, the number of test paths for each mass production test is 3. S3, determining the number of mass production tests based on the number of test paths and the number of RF paths;
[0072] Specifically, the number of test channels for each mass production test is determined, and the number of RF channels with the same mass production test conditions is also determined. The number of RF channels divided by the number of test channels for each mass production test can be used to obtain the number of mass production tests. Figure 8 As shown, the RF paths with the same mass production test conditions are RF1-RF2, RF1-RF4, RF1-RF6, RF3-RF2, RF3-RF4, RF3-RF6, RF5-RF2, RF5-RF4, and RF5-RF6, for a total of 9 paths; the number of test paths for each mass production test is 3, so the number of mass production tests is 9 divided by 3, which is equal to 3.
[0073] S4. Carry out mass production testing of RF front-end chips based on the number of mass production tests.
[0074] In this step, each mass production test outputs a test signal to each test channel based on the mass production test items and the corresponding mass production test conditions; based on the calibrated line loss value, the output power of the corresponding test signal is compensated through the adjustable attenuator corresponding to each test channel, so that the test signal at each signal input port meets the mass production test conditions; based on the length of the test signal, the signal reception time of each test channel is determined; based on the signal reception time, the opening of each test channel is controlled by using a digital signal sequence; and based on the signal reception time, the output signal of the corresponding test channel is collected.
[0075] Among them, the signal receiving duration includes: signal sampling duration, including actual sampling duration and signal switching duration; collecting the output signal of the corresponding test path based on the actual sampling duration; switching the test path for collection based on the signal switching duration.
[0076] The output signal corresponding to the set middle time period in the actual sampling duration is demodulated as a valid test signal to obtain the test results of each test channel.
[0077] Specifically, the signal receiving time of each test path is determined according to the length of the test signal, wherein the signal receiving time of each test path is the same to ensure the accuracy of the test, and then the opening of each test path is controlled by a digital signal sequence according to the signal receiving time, and the output signal of the corresponding test path is collected during the signal receiving time; it should be noted that the opening state of the chip needs to comply with strict timing. In this embodiment, the opening of the chip is controlled by a digital signal sequence (the chip is usually controlled by GPIO and MIPI interface). When the signal source SG of the ATE emits power, it is synchronized to the digital signal sequence to start working. At this time, it is necessary to make timing control of the digital signal sequence. At the same time, the signal source SG needs to send a trigger signal synchronization signal at the moment of operation to enable the signal measurement terminal SA to collect signals, such as Figure 4 As shown, the length of the test signal is T1+T2+T3, T1 is the signal reception time of the radio frequency path RF1-RF2, T2 is the signal reception time of the radio frequency path RF3-RF4, and T3 is the signal reception time of the radio frequency path RF5-RF6. During the T1 period, the digital signal 001 is sent to control the opening of the radio frequency path RF1-RF2, and the other two are closed. During the T1 period, the output signal of the radio frequency path RF1-RF2 is collected; during the T2 period, the digital signal 010 is sent to control the opening of the radio frequency path RF3-RF4, and the other two are closed. During the T2 period, the output signal of the radio frequency path RF3-RF4 is collected; during the T3 period, the digital signal 011 is sent to control the opening of the radio frequency path RF5-RF6, and the other two are closed. During the T3 period, the output signal of the radio frequency path RF5-RF6 is collected. Through the above steps, the output signal of the corresponding test path can be accurately collected, thereby improving the accuracy of the test.
[0078] The signal receiving duration is the signal sampling duration of the signal measuring end. When the signal measuring end collects the output signal of each test channel, it needs to switch to each test channel for corresponding collection. Therefore, the signal sampling duration includes the actual sampling duration of the output signal, and also includes the switching time of the signal measuring end, that is, the signal switching duration. The output signal collected during the switching process of the signal measuring end is an invalid signal. The output signal of the corresponding test channel is collected according to the actual sampling duration to ensure the effectiveness of signal collection. The output signals collected in the time periods before and after the actual sampling duration may be missing and invalid. To ensure that the signal is complete and valid, this embodiment selects the output signal corresponding to the middle time period set in the actual sampling duration as the valid test signal for demodulation, and obtains the test results of each test channel, thereby ensuring the accuracy of the test results. Figure 5As shown, the effective signal for SA demodulation is only the parts of t1, t2, and t3. Here, t1 < T1, t2 < T2, and t3 < T3. This part of the signal needs to ensure the integrity and effectiveness of the signal. Demodulate the above effective signal according to the preset parameters of the ATE, and assign the test results to the test items corresponding to each path to complete the test. Comparing the test speed, the traditional test method requires 3 times to complete the mass production test of 3 RF paths. This embodiment only needs 1 test to complete the mass production test of 3 RF paths. By combining the RF paths under the same test items and the same test conditions, multiple test paths can be tested simultaneously, which can greatly reduce the mass production test time under the same test conditions and improve the mass production test efficiency. The difference in the harmonic test is that the test frequency point is modified to the harmonic frequency point, and the difference in the isolation test is that the measurement port is modified from the main path port to the isolation port. This embodiment greatly reduces the mass production test time under the same test conditions and improves the mass production efficiency.
[0079] Embodiment 2
[0080] As Figure 2 shown, this embodiment provides a method for batch mass production testing of RF front-end chips based on a multi-Site test mass production board, including:
[0081] S1. Place multiple identical RF front-end chips at the corresponding positions on the multi-Site test mass production board;
[0082] Specifically, the multi-Site test mass production board is provided with multiple single-Site test mass production boards. Place multiple identical RF front-end chips at the corresponding positions on the multi-Site test mass production board, that is, place them on the single-Site test mass production board. One RF front-end chip corresponds to one single-Site test mass production board, where the number of RF front-end chips is not greater than the number of single-Site test mass production boards. This embodiment takes the 4-Site mass production test as an example. As Fig.10 shown, place 4 RF front-end chips on the 4 single-Site test mass production boards of the multi-Site test mass production board. The single-Site test mass production board is as Fig. 9 shown, where Fig.10 the input ends P1, P4, P7, and P10 in Fig. 9 correspond to the input end PORT1 in Fig.10 the output ends P2, P5, P8, and P11 in Fig. 9 correspond to the output end PORT2 in Fig.10 the output ends P3, P6, P9, and P12 in Fig. 9 correspond to the output end PORT3 in
[0083] S2. Determine the number of test paths for each batch mass production test based on the number of RF front-end chips;
[0084] Among them, each batch production test tests one RF path of each RF front-end chip;
[0085] Specifically, during the test, only one RF channel of each RF front-end chip is in an open state. Therefore, the number of test channels for each batch production test can be determined according to the number of RF front-end chips, and each batch production test tests one RF channel in each RF front-end chip; Fig.10 As shown in the figure, there are 4 RF front-end chips in total, so the number of test paths for each batch production test is 4. In order to facilitate the subsequent comparative analysis of the test results, each batch production test can select the same RF path of each RF front-end chip for testing, such as Fig. 9 As shown, the first batch production test selects the RF path TRX1 for testing, the second batch production test selects the RF path TRX2 for testing, and so on.
[0086] S3. Determine the RF path in the RF front-end chip that has the same mass production test conditions according to the mass production test items;
[0087] In this step, the mass production test conditions include: using test signals with the same power, frequency and waveform; and setting parameters of the signal measurement ports are the same.
[0088] Specifically, according to the mass production test conditions of each RF channel in the RF front-end chip of the mass production test project, including the test signal power, frequency, waveform and other information required by each channel, as well as the setting parameters of the signal measurement port. According to the mass production test conditions of each RF channel, the RF channels with the same mass production test conditions are determined. After the RF channels with the same mass production test conditions are determined, these channels can be grouped together for testing. Compared with setting test parameters for each channel individually, only one parameter configuration is required for a group of channels, which greatly reduces the test preparation time. It reduces the frequent switching and reconfiguration of test equipment, reduces equipment loss, and extends the service life of equipment. It greatly shortens the overall test time and improves production efficiency. The simplified test process reduces the workload of operators, and there is no need to spend a lot of time on complex parameter settings and channel switching. This not only reduces labor costs, but also reduces errors that may be caused by frequent manual operations, and improves the accuracy of test results. Such as Fig. 9 As shown, the radio frequency path between the signal input terminal PORT1 and the signal output terminal PORT2 is a radio frequency path with the same mass production test conditions.
[0089] S4. Determine the number of batch production tests based on the number of RF channels;
[0090] Specifically, the number of batch production tests is determined according to the number of RF paths. For example, the number of RF front-end chips to be tested is 4, and the number of RF paths with the same mass production test conditions in a certain test item is 10. Then each chip has 10 test paths, and each batch production test tests the test paths of 4 chips at the same time, for a total of 10 measurements, which is less than 40 times using the traditional test scheme. This greatly reduces the mass production test time under the same test conditions and improves the mass production test efficiency.
[0091] S5. Carry out mass production testing of RF front-end chips based on the number of mass production tests.
[0092] In this step, each batch production test includes:
[0093] Based on the mass production test conditions and the corresponding mass production test conditions, the test signals are output to the same test path of each RF front-end core respectively; based on the calibrated line loss value, the output power of the corresponding test signal is compensated through the adjustable attenuator corresponding to each RF front-end chip, so that the test signal at the signal input port of each RF front-end chip meets the mass production test conditions; based on the length of the test signal, the sampling duration of each test path is determined; based on the sampling duration, the output signal of the corresponding test path is collected.
[0094] The signal receiving duration includes: signal sampling duration, including actual sampling duration and signal switching duration; collecting the output signal of the corresponding test path based on the actual sampling duration; switching the test path for collection based on the signal switching duration. The output signal corresponding to the middle time period set in the actual sampling duration is demodulated as a valid test signal to obtain the test results of each test path.
[0095] Specifically, batch production tests of RF front-end chips are carried out according to the number of batch production tests. During each batch production test, in order to ensure the accuracy of the test, test signals are output to the same test channel of each RF front-end core according to the mass production test conditions and the corresponding mass production test conditions, which is convenient for later comparison and analysis of the test results. During the signal transmission process, the test signals arriving at the signal input port of each chip are attenuated to varying degrees due to line loss, resulting in inconsistent power of the test signals arriving at each signal input port. Therefore, the output power of the corresponding test signal is compensated through the adjustable attenuator corresponding to each chip according to the calibrated line loss value, so that the test signal at each signal input port meets the mass production test conditions, that is, the power of the test signal arriving at each signal input port is the same. The sampling time of each test channel is determined according to the length of the test signal, wherein the sampling time of each test channel is the same to ensure the accuracy of the test, wherein each test channel belongs to each chip, and each test channel can receive the test signal at the same time, that is, the length of the test signal is the signal reception time. The output signal of the corresponding test channel is collected based on the sampling time. Figure 6 As shown, the single-site test production boards Site1, Site2, Site3, and Site4 are placed on the multi-site test production board. Each single-site test production board is equivalent to a two-port network, including a P-end input and an M-end output. The P-end input includes input terminals P1, P2, P3, and P4, corresponding to Fig.10 The input terminals P1, P4, P7, and P10 in the M-terminal output include output terminals M1, M2, M3, and M4, corresponding to Fig. 9 P2, P5, P8, P11 of ATE; connect the signal source SG of ATE to the input terminals P1, P2, P3, P4, connect the signal measurement terminal SA of ATE to the output terminals M1, M2, M3, M4, set the signal source SG to load a specific test waveform according to the test conditions, select the output waveform as a carrier or a specific modulation wave, and set the appropriate output power. The channels under the same test conditions adopt a unified test standard to ensure the consistency and comparability of the test results of different channels. This helps to more accurately evaluate the performance of the chip and discover potential quality problems in a timely manner. For example, if the test results of some channels in a group of channels are abnormal, it can be quickly determined whether it is a common problem under the test conditions of the group or a special fault of an individual channel, so as to analyze and solve it in a targeted manner. When the chip has performance problems, the grouping of channels based on the same test conditions can more accurately locate the problem. For example, if a group of channels has abnormal signals under specific test conditions, the scope of investigation can be narrowed to the circuit modules or process links related to the test conditions of the group, speeding up the problem solving speed and improving product quality and reliability. For the convenience of description, it is divided into four waveforms in the time domain, corresponding to the signal acquisition time of the subsequent 4 sites; according to the line loss value calibrated by ATE, the adjustable attenuator of each port inside the machine is used to make the signal reach the chip input port with the same power, that is, the input signal power of the input terminals P1, P2, P3, and P4 is consistent and meets the test conditions, such as Figure 6 As shown in the input signal; according to the test conditions, each chip under test is in a normal working state, that is, the P port to the M port is in a conducting state, and the output terminal signal of each chip under test is as follows Figure 6 As shown in the output signal: According to the preset sampling parameters of the signal measurement terminal SA, the signal measurement terminal SA switches the output terminals M1, M2, M3, and M4 in real time to sample the signal, and samples the output signals of the output terminals M1, M2, M3, and M4 at the time T1, T2, T3, and T4 respectively. At this time, the ideal signal collected by the signal measurement terminal SA is as follows Figure 6 As shown in the SA demodulation signal; T1, T2, T3, and T4 correspond to the sampling time of the signal measurement end SA on the single-site test mass production board Site1, Site2, Site3, and Site4 respectively. The signal collected during the switching process of the signal measurement end SA is an invalid signal, such as Figure 7The signal shown in the SA switching time is to avoid invalid signals affecting the test results. Figure 7 The SA demodulation valid signal is only shown in the middle part of T1, T2, T3, and T4. This part of the signal needs to ensure that the signal is complete and valid. The above valid signal is demodulated according to the preset parameters of ATE, and the test results are assigned to each site; the method of this embodiment can complete the 4Site test through one signal transmission, one signal acquisition and one signal demodulation. Compared with the traditional test method, the 4Site test requires four signal transmissions, four signal acquisitions and four signal demodulations to complete. The method of this embodiment greatly reduces the mass production test time and improves the mass production efficiency in terms of the reception and demodulation of the test signal. It should be noted that the above sampling is all based on the synchronization of the ATE's own signals to ensure that the measurement signal will not be disordered during demodulation. That is, the signal source SG needs to trigger the DC and Digital signals while emitting the waveform to make the chip in the on state, and at the same time, it needs to trigger the signal measurement end SA for time domain sampling. Only when the above conditions are met can the signal measurement end SA sampling signal be a valid signal. At the same time, according to the start-up time of different chips and the start-up time of different test schemes, it is necessary to set a reasonable invalid signal time for signal switching and stabilization, that is Figure 7 SA switching time in. This embodiment can significantly reduce the test preparation time, make full use of the resources of the test equipment, greatly shorten the overall test time, and improve production efficiency; reduce the frequent switching and reconfiguration of the test equipment, reduce equipment loss, and extend the service life of the equipment. The simplified test process reduces the workload of operators, and there is no need to spend a lot of time on complex parameter settings and channel switching. This not only reduces labor costs, but also reduces errors that may be caused by frequent manual operations, and improves the accuracy of test results. The use of a unified test standard for channels with the same test conditions ensures the consistency and comparability of test results for different channels. This helps to more accurately evaluate chip performance and promptly discover potential quality problems.
[0096] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.
Claims
1. A method for mass production testing of radio frequency front-end chips, applied to mass production testing of radio frequency front-end chips, characterized in that: include: Determine the RF path in the RF front-end chip that has the same mass production test conditions based on the mass production test project; Determining the number of test channels for each mass production test based on the number of signal input ports of the radio frequency channel; Determining the number of mass production tests based on the number of the test paths and the number of the RF paths; Based on the mass production test times, mass production tests of RF front-end chips are carried out.
2. The RF front-end chip mass production test method according to claim 1, characterized in that: The mass production test conditions include: Use test signals of the same power, frequency, and waveform; The setting parameters of the signal measurement end are the same.
3. The RF front-end chip mass production test method according to claim 2, characterized in that: Each of the mass production tests includes: Outputting a test signal to each of the test paths based on the mass production test items and the corresponding mass production test conditions; Based on the calibrated line loss value, the output power of the corresponding test signal is compensated through the adjustable attenuator corresponding to each test path, so that the test signal at each signal input port meets the mass production test condition; Determining the signal receiving time length of each of the test paths based on the length of the test signal; Controlling the opening of each of the test paths using a digital signal sequence based on the signal reception duration; The output signal corresponding to the test path is collected based on the signal reception duration.
4. The RF front-end chip mass production test method according to claim 3, characterized in that: The signal reception duration includes: Signal sampling duration, including actual sampling duration and signal switching duration; Collecting the output signal corresponding to the test path based on the actual sampling duration; The test path is switched based on the signal switching duration for acquisition.
5. The RF front-end chip mass production test method according to claim 4, characterized in that: The output signal corresponding to the set middle time period in the actual sampling duration is demodulated as a valid test signal to obtain the test result of each test path.
6. A method for mass production testing of RF front-end chips based on a multi-site test production board, characterized in that: include: Place multiple identical RF front-end chips at corresponding positions on multi-site test production boards; Determining the number of test channels for each batch production test based on the number of the RF front-end chips; Wherein, each batch production test tests one RF path of each RF front-end chip; Determine, according to the mass production test items, a radio frequency path in the radio frequency front-end chip that has the same mass production test conditions; Determining the number of batch production tests based on the number of the radio frequency paths; Based on the number of mass production tests, carry out mass production tests on RF front-end chips.
7. The method for mass production testing of RF front-end chips based on a multi-site test production board according to claim 6 is characterized in that: The mass production test conditions include: Use test signals of the same power, frequency, and waveform; The setting parameters of the signal measurement port are the same.
8. The method for mass production testing of RF front-end chips based on a multi-site test production board according to claim 7 is characterized in that: Each batch production test includes: Outputting test signals to the same test path of each of the RF front-end cores based on the mass production test conditions and the corresponding mass production test conditions; Based on the calibrated line loss value, the output power of the corresponding test signal is compensated through the adjustable attenuator corresponding to each of the RF front-end chips, so that the test signal at the signal input port of each of the RF front-end chips meets the mass production test conditions; Determining the sampling duration of each of the test paths based on the length of the test signal; The output signal corresponding to the test path is collected based on the sampling duration.
9. The method for mass production testing of RF front-end chips based on a multi-site test production board according to claim 8 is characterized in that: The signal reception duration includes: Signal sampling duration, including actual sampling duration and signal switching duration; Collecting the output signal corresponding to the test path based on the actual sampling duration; The test path is switched based on the signal switching duration for acquisition.
10. The method for mass production testing of RF front-end chips based on a multi-site test production board according to claim 9 is characterized in that: The output signal corresponding to the set middle time period in the actual sampling duration is demodulated as a valid test signal to obtain the test result of each test path.