Multifunctional vehicle lamp data test system

Abstract

The invention belongs to the technical field of data test systems, and particularly relates to a multifunctional vehicle lamp data test system, which comprises a device to be detected, a data acquisition device and a computer upper computer, and is characterized in that the device to be detected is connected with the data acquisition device, and the data acquisition device is connected with the computer upper computer; the data acquisition equipment comprises a voltage acquisition board card, a current acquisition board card, a temperature acquisition board card and a switch; and the voltage acquisition board card, the current acquisition board card and the temperature acquisition board card are connected with the upper computer through the switch. The temperature, the voltage and the current of the vehicle lamp are tested by using one device, and the production efficiency, the quality control capability and the fault diagnosis capability can be remarkably improved. Firstly, through the automatic test system, rapid detection of various parameters of the vehicle lamp can be realized, and manual operation is reduced, so that the test speed and accuracy are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of data testing systems, and in particular relates to a multifunctional vehicle light data testing system. Background Art

[0002] Although current testing is one of the important indicators for evaluating the performance of vehicle lamps, existing technologies often lack the ability to monitor current fluctuations and current stability over a long period of time. For example, some tests may only focus on the performance of vehicle lamps at rated current, but fail to evaluate the impact of current fluctuations caused by load changes on the life and reliability of vehicle lamps in actual use. Although some advanced test systems (such as embedded vehicle electrical performance test systems based on CompactRIO) can achieve high-precision voltage, current, and temperature tests, these systems are usually suitable for laboratory environments and are difficult to adapt to field testing needs. In addition, although the modular design of these systems improves flexibility, it may require more debugging and configuration time in actual applications. Although existing test equipment can provide basic voltage, current, and temperature measurement functions, there is still room for improvement in accuracy, speed, and data recording capabilities. For example, some equipment may not be able to record data changes in real time during long-term tests, resulting in an inability to accurately evaluate the performance of vehicle lamps in actual use. Summary of the invention

[0003] In view of the technical problem that the above-mentioned prior art has certain limitations in the testing of vehicle lamp temperature, voltage and current, the present invention provides a multifunctional vehicle lamp data testing system.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] A multifunctional vehicle light data testing system comprises a device to be tested, a data acquisition device, and a computer host computer. The device to be tested is connected to the data acquisition device, which is connected to the computer host computer. The data acquisition device comprises a voltage acquisition board, a current acquisition board, a temperature acquisition board, and a switch. The voltage acquisition board, the current acquisition board, and the temperature acquisition board are all connected to the computer host computer through the switch. The device to be tested comprises a voltage device, a current device, and a temperature device. The voltage device is connected to the voltage acquisition board, the current device is connected to the current acquisition board, and the temperature device is connected to the temperature acquisition board.

[0006] The voltage device and the current device are electrically connected to the voltage acquisition board and the current acquisition board through the AD7616 chip. The AD7616 chip is powered by a single 5V power supply, accommodates true bipolar input signals of ±10V, ±5V and ±2.5V, and samples at a throughput rate of 1MSPS and 90.5dB SNR per channel.

[0007] The voltage acquisition board and the current acquisition board both use Hall elements, and the switch uses the RTL8211E Ethernet PHY chip, which supports 1000M / 100M / 10M Ethernet mode, and the transmission distance can reach 150 meters in 1000M mode. RTL8211E supports IEEE 802.3RGMII interface and supports 3.3V, 2.5V, 1.8V and 1.5V signals.

[0008] The temperature acquisition board includes a thermocouple sensor and an A / D acquisition circuit, wherein the thermocouple sensor is electrically connected to the switch through the A / D acquisition circuit; the A / D acquisition circuit includes an ADC chip, a jumper pad, a first resistor, a second resistor, and a first capacitor, wherein the AIN1(+) pin of the ADC chip is electrically connected to the jumper pad through the first resistor, the AIN1(-) pin of the ADC chip is electrically connected to the jumper pad through the second resistor, and a first capacitor is connected in parallel between the AIN1(+) pin and the AIN1(-) pin of the ADC chip.

[0009] It also includes a power supply part, which is electrically connected to the voltage acquisition board, the current acquisition board, and the temperature acquisition board respectively; the power supply part includes an EMI and protection circuit, an input voltage conversion circuit, an output voltage sampling circuit, a power protection circuit, and a board voltage stabilization circuit, the EMI and protection circuit is electrically connected to the input voltage conversion circuit, the input voltage conversion circuit is electrically connected to the output voltage sampling circuit, the output voltage sampling circuit is electrically connected to the power protection circuit, the power protection circuit is electrically connected to the board voltage stabilization circuit, and the board voltage stabilization circuit is electrically connected to the voltage acquisition board, the current acquisition board, and the temperature acquisition board respectively.

[0010] The EMI and protection circuit includes a fuse, a first X capacitor, a second X capacitor, a first Y capacitor, a second Y capacitor, a common mode inductor, an NTC thermistor, and a relay. The fuse is electrically connected to the first Y capacitor, the first Y capacitor and the second Y capacitor are connected in series, the fuse is electrically connected to the first X capacitor, the first X capacitor is connected in parallel to the common mode inductor, the common mode inductor is connected in parallel to the second X capacitor, the common mode inductor is electrically connected to the NTC thermistor, the NTC thermistor is connected in parallel to the normally open contact of the relay, and the coil of the relay is electrically connected to the 12V power supply.

[0011] The input voltage conversion circuit includes an AC live wire, an AC neutral wire, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a second capacitor, a seventh resistor, an eighth resistor, a ninth resistor, a tenth resistor and a third capacitor, the AC live wire is electrically connected to the third resistor, the third resistor is connected in series with the fourth resistor, the fourth resistor is grounded through the fifth resistor, the fourth resistor is electrically connected to the sixth resistor, the sixth resistor is grounded through the second capacitor, the AC neutral wire is electrically connected to the seventh resistor, the seventh resistor is connected in series with the eighth resistor, the eighth resistor is grounded through the ninth resistor, the ninth resistor is electrically connected to the tenth resistor, and the tenth resistor is grounded through the third capacitor.

[0012] The output voltage sampling circuit includes an eleventh resistor, a twelfth resistor, a thirteenth resistor, and a fourth capacitor. The eleventh resistor is grounded through the twelfth resistor. The eleventh resistor is connected to the fourth capacitor through the thirteenth resistor. The fourth capacitor is grounded.

[0013] The power protection circuit includes a first diode, a transistor, a second diode, a fifth capacitor, a fourteenth resistor, a sixth capacitor, a transient voltage suppression tube, a common-mode filter inductor, and a seventh capacitor. The first diode is connected in parallel between the collector and the emitter of the transistor, the second diode is connected in parallel between the first diode and the base of the transistor, the second diode is connected in parallel with the fifth capacitor, the first diode is electrically connected to a current protection device, the current protection device is electrically connected to the sixth capacitor, the sixth capacitor is electrically connected to the base of the transistor through the fourteenth resistor, the sixth capacitor is connected in parallel with a transient voltage suppression tube, the transient voltage suppression tube is connected in parallel with a common-mode filter inductor, the common-mode filter inductor is connected in parallel with the seventh capacitor, and the seventh capacitor is grounded.

[0014] The board voltage stabilization circuit includes a first-level voltage stabilization chip and a second-level voltage stabilization chip. Two second-level voltage stabilization chips are provided. The first-level voltage stabilization chip is electrically connected to the two second-level voltage stabilization chips respectively. The first-level voltage stabilization chip adopts a TPS5430 chip, and the second-level voltage stabilization chip adopts a TLV62130RGT chip.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The present invention uses a device to test the temperature, voltage and current of the car lamp, which can significantly improve production efficiency, quality control and fault diagnosis capabilities. First, through the automated testing system, rapid detection of various parameters of the car lamp can be achieved, reducing manual operations, thereby improving test speed and accuracy. In terms of temperature, the car lamp testing equipment of the present invention can monitor and record temperature changes in real time to ensure that the performance of the car lamp under different temperature conditions meets the standards. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0018] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0019] Figure 1 It is the overall structural diagram of the present invention;

[0020] Figure 2 It is a circuit diagram of the AD7616 chip of the present invention;

[0021] Figure 3 A circuit diagram of the A / D acquisition circuit of the present invention;

[0022] Figure 4 A circuit diagram of the EMI and protection circuit of the present invention;

[0023] Figure 5 A circuit diagram of an input voltage conversion circuit of the present invention;

[0024] Figure 6 is a circuit diagram of an output voltage sampling circuit of the present invention;

[0025] Figure 7 A circuit diagram of a power protection circuit of the present invention;

[0026] Figure 8 It is a connection block diagram of the board voltage stabilizing circuit of the present invention;

[0027] Fig. 9 The circuit diagram of the Ethernet PHY chip of the present invention is shown in FIG.

[0028] Among them: 1 is the device to be detected, 101 is the voltage device, 102 is the current device, 103 is the temperature device, 2 is the data acquisition device, 201 is the voltage acquisition board, 202 is the current acquisition board, 203 is the temperature acquisition board, 204 is the switch, 3 is the computer host, U1 is the ADC chip, P1 is the jumper pad, R1 is the first resistor, R2 is the second resistor, C1 is the first capacitor, FA is the fuse, CX1 is the first X capacitor, CX2 is the second X capacitor, CY1 is the first Y capacitor, CY2 is the second Y capacitor, LA is the common mode inductor, RA is the NTC thermistor, JKA1 is the relay, ACL is the AC live wire, ACN is the AC zero line, R3 is the third resistor, R4 is the fourth resistor, R5 is the fifth resistor, R6 is the sixth resistor, C2 is the second capacitor, R7 is the seventh resistor, R8 is the eighth resistor, R9 is the ninth resistor, R10 is the tenth resistor, C3 is the third capacitor, R11 is the eleventh resistor, R12 is the twelfth resistor, R13 is the thirteenth resistor, C4 is the fourth capacitor, D1 is the first diode, F1 is the current protection device, G is the transistor, D2 is the second diode, C5 is the fifth capacitor, R14 is the fourteenth resistor, C6 is the sixth capacitor, T is the transient voltage suppression tube, L is the common mode filter inductor, C7 is the seventh capacitor, S1 is the first stage voltage regulator chip, and S2 is the second stage voltage regulator chip. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. These descriptions are only to further illustrate the features and advantages of the present invention, rather than to limit the claims of the present invention. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0031] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0032] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] A multifunctional vehicle light data testing system, such as Figure 1 As shown, it includes a device to be detected 1, a data acquisition device 2, and a computer host 3. The output voltage signal is connected to the analog input port of the voltage acquisition board 201 through a cable. The voltage acquisition board 201 is responsible for conditioning the input analog voltage signal (such as amplification, filtering, etc.), and then converting it into a digital signal through an analog-to-digital converter (ADC). The output current signal is connected to the analog input port of the current acquisition board 202 through a cable. The current acquisition board 202 also conditions the input analog current signal and converts it into a digital signal through the ADC. The output temperature signal is connected to the analog input port of the temperature acquisition board 203 through a cable. The temperature acquisition board 203 conditions the input analog temperature signal and converts it into a digital signal through the ADC. The converted digital signal is transmitted to the computer host 3 through the switch 204. The switch 204 serves as a transfer station for data transmission, ensuring that the data transmission between each acquisition board and the computer is stable and efficient. After receiving the digital signal, the computer host 3 processes, stores and displays the data in real time through the data acquisition software. The host computer can analyze the collected data and generate charts or reports to help users intuitively understand the operating status of the equipment to be tested. The data acquisition system can not only monitor parameters such as voltage, current and temperature in real time, but also perform fault alarms and data analysis through the host computer to provide a basis for equipment maintenance and optimization. The system supports multi-channel data acquisition and can monitor multiple parameters at the same time to improve the efficiency and accuracy of data acquisition.

[0034] Further, preferably, the voltage device 101 and the current device 102 are electrically connected to the voltage acquisition board 201 and the current acquisition board 202 through the AD7616 chip. The AD7616 chip is powered by a single 5V power supply and accommodates true bipolar input signals of ±10V, ±5V and ±2.5V, while sampling at a throughput of 1MSPS and 90.5dB SNR per channel. The on-chip oversampling mode can achieve higher SNR performance (92dB at an oversampling rate (OSR) of 2). The input clamp protection circuit can withstand voltages up to ±21V. The AD7616 has an analog input impedance of 1MΩ, regardless of the sampling frequency. Single-power supply operation, on-chip filtering and high input impedance eliminate the need for a driver operational amplifier and an external bipolar power supply. The device includes analog input clamp protection, a dual 16-bit charge redistribution SAR analog-to-digital converter (ADC), a flexible digital filter, a 2.5V reference and reference buffer, and high-speed serial and parallel interfaces. The AD7616 schematic diagram is shown in Figure 2 As shown, the parameter indicators are as follows:

[0035] (1) 16-channel, dual-channel, synchronous sampling input

[0036] (2) Independently selectable channel input range

[0037] (3) True bipolar: ±10V, ±5V, ±2.5V

[0038] (4) 5V single analog power supply, V DRIVE Supply voltage: 2.3V to 3.6V

[0039] (5) Input buffer with 1MΩ analog input impedance

[0040] (6) Interface: SPI

[0041] The input current range is 0-20mA, 4-20mA, and the maximum analog input voltage is 100V. The voltage is divided by a voltage divider circuit, and the resistor obtains part of the voltage. The input voltage is I=ADC-IN / R2.

[0042] The input voltage range is 20mV, 60mV, 200mV, 1V, 2V, 6V, 20V, 50V, and 100V. The input voltage range of the ADC chip AD7616 is ±10V. The maximum analog input voltage is 100V, which is far beyond the input voltage range of the ADC chip. The input signal is divided by resistors, and 0.1 times the input voltage is input into the ADC chip and converted into a digital signal.

[0043] Further, preferably, Fig. 9As shown, the voltage acquisition board 201 and the current acquisition board 202 both use Hall elements, and the switch 204 uses the RTL8211E Ethernet PHY chip, which supports 1000M / 100M / 10M Ethernet mode. The transmission distance in the 1000M mode can reach 150 meters.

[0044] The RTL8211E supports the IEEE 802.3RGMII interface and supports 3.3V, 2.5V, 1.8V, and 1.5V signals.

[0045] Furthermore, the temperature acquisition board 203 includes a thermocouple sensor and an A / D acquisition circuit, and the thermocouple sensor is electrically connected to the switch 204 through the A / D acquisition circuit; the A / D acquisition circuit includes an ADC chip U1, a jumper pad P1, a first resistor R1, a second resistor R2, and a first capacitor C1. The AIN1+ pin of the ADC chip U1 is electrically connected to the jumper pad P1 through the first resistor R1, and the AIN1- pin of the ADC chip U1 is electrically connected to the jumper pad P1 through the second resistor R2. A first capacitor C1 is connected in parallel between the AIN1+ pin and the AIN1- pin of the ADC chip U1. Thermocouple sensors generate microvolt-level thermoelectric electromotive force according to the temperature change of the measured point. The R, S, B, K, E, J, T, N, W, L, U, thermocouple electromotive force is conditioned to a suitable voltage range through the amplification and filtering circuits in the signal conditioning module. The conditioned signal is selected by the multiplexer circuit, converted into a digital quantity through the A / D acquisition circuit, and finally sent to the FPGA part for further acquisition and processing. The ADC chip model selected is AD7793, which is a 24-bit analog-to-digital converter (ADC). AD7793 integrates a low-power, high-speed 24-bit sampling ADC, an internal conversion clock, and an internal reference voltage buffer. At the SCLK edge, the voltage difference between the IN+ and IN- pins is sampled. The reference voltage is applied to the device internally.

[0046] AD7793 schematic diagram Figure 3 shown.

[0047] It also includes a power supply part, which is electrically connected to the voltage acquisition board 201, the current acquisition board 202, and the temperature acquisition board 203 respectively; the power supply part includes EMI and protection circuit, input voltage conversion circuit, output voltage sampling circuit, power protection circuit and board voltage stabilization circuit, EMI and protection circuit are electrically connected to the input voltage conversion circuit, the input voltage conversion circuit is electrically connected to the output voltage sampling circuit, the output voltage sampling circuit is electrically connected to the power protection circuit, the power protection circuit is electrically connected to the board voltage stabilization circuit, and the board voltage stabilization circuit is electrically connected to the voltage acquisition board 201, the current acquisition board 202, and the temperature acquisition board 203. The power distribution board converts 220V AC into 24VDC, and then supplies 24V DC to other sub-modules. A stable and reliable power supply is a necessary condition to ensure the normal operation of the board. Therefore, when designing the power supply of the board, it is necessary to consider unexpected situations such as power reverse connection, short circuit of downstream devices, power supply voltage fluctuation, etc. that may occur during debugging and actual use, and have corresponding protection circuit design to ensure that the board will not fail to work properly or even be damaged. The rated, minimum, and maximum input voltages for PFC operation are defined as:

[0048] V acmon =220V

[0049] V acmin =176V

[0050] V acmax =253V

[0051] η=95%

[0052] PF=0.99

[0053] The frequency of PFC operation is defined as:

[0054] f s =45kHz

[0055] Further, if Figure 4As shown, the EMI and protection circuit includes a fuse FA, a first X capacitor CX1, a second X capacitor CX2, a first Y capacitor CY1, a second Y capacitor CY2, a common mode inductor LA, an NTC thermistor RA, and a relay JKA1. The fuse FA is used for circuit protection. When the current in the circuit exceeds its rated value, the fuse will melt, thereby cutting off the circuit to prevent the circuit from overheating or damage. In this circuit, the fuse FA is located at the front end of the entire circuit to ensure that the circuit can be protected in time when the current is abnormal. The first Y capacitor CY1 is connected in series with the second Y capacitor CY2 to eliminate common mode interference. The Y capacitor is usually connected between the input line and the ground line, and can effectively filter out common mode noise. The first X capacitor CX1 is connected in parallel to the common mode inductor LA to eliminate differential mode interference. The X capacitor is placed at both ends of the input line, which can effectively filter out differential mode interference. The common mode inductor LA is connected in parallel with the second X capacitor CX2 to further enhance the ability to suppress differential mode interference. The common mode inductor LA is also electrically connected to the NTC thermistor RA. The NTC thermistor RA is able to adjust its resistance when the circuit temperature changes, thereby dynamically monitoring and protecting the current in the circuit. The NTC thermistor RA is connected in parallel with the normally open contacts of relay JKA1. When the NTC thermistor RA detects an abnormal temperature, it changes its resistance, causing the contacts of relay JKA1 to close or open, thereby controlling the action of the relay. The coil of relay JKA1 is powered by a 12V power supply, enabling it to act according to the state of the NTC thermistor RA, thereby achieving further protection of the circuit.

[0056] Further, if Figure 5 As shown, the input voltage conversion circuit includes an AC live wire ACL, an AC neutral wire ACN, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a second capacitor C2, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10 and a third capacitor C3. According to the working principle of the rectifier bridge, when the input AC power is positive (i.e., the potential of ACL is higher than the potential of ACN), the voltage of ACL to PGND is the actual input voltage, and the voltage of ACN to PGND is 0; similarly, when the input AC power is negative (i.e., the potential of ACL is lower than the potential of ACN), the voltage of ACN to PGND is the actual input voltage, and the voltage of ACL to PGND is 0; therefore, the subtraction of ADC_ACL and ADC_ACN is numerically related to the actual input voltage and the voltage reduction multiple of the voltage component resistor.

[0057] Further, if Figure 6As shown, the output voltage sampling circuit includes an eleventh resistor R11, a twelfth resistor R12, a thirteenth resistor R13, and a fourth capacitor C4. The eleventh resistor R11 is grounded through the twelfth resistor R12, which means that R11 and R12 form a voltage-dividing network for transmitting the input voltage to the ground after voltage division. At the same time, the eleventh resistor R11 is also connected to the fourth capacitor C4 through the thirteenth resistor R13, and the fourth capacitor C4 is grounded. The function of this connection mode is to use the capacitor C4 to filter or store energy for the signal passing through R13, thereby realizing the sampling of the input voltage. Specifically, when the input voltage is applied to R11, a part of the voltage will flow to the ground through R12, and the other part of the voltage will be transmitted to the fourth capacitor C4 through R13. Since C4 is grounded, it will store the signal energy transmitted through R13 and may perform a certain smoothing process on the signal. This design is used in the voltage sampling circuit to ensure that the main control chip or other circuit modules can accurately read the instantaneous value of the input voltage. The design of this sampling circuit can effectively reduce the influence of high-frequency noise and improve the stability of the signal. By properly selecting the parameters of R13 and C4, the performance of the circuit can be further optimized, the sampling accuracy can be improved and the power consumption can be reduced.

[0058] Further, if Figure 7 As shown, the power protection circuit includes a first diode D1, a transistor G, a second diode D2, a fifth capacitor C5, a fourteenth resistor R14, a sixth capacitor C6, a transient voltage suppressor T, a common mode filter inductor L, and a seventh capacitor C7. The first diode D1 is connected in parallel between the collector and the emitter of the transistor G for rectification and protection. The second diode D2 is connected in parallel between the first diode D1 and the base of the transistor G, and D2 plays a freewheeling role to prevent voltage spikes from damaging the transistor. The second diode D2 is connected in parallel with the fifth capacitor C5, and C5 is used to filter and suppress high-frequency noise. The first diode D1 is connected to the sixth capacitor C6 through the current protection device F1, and F1 is used to limit current and protect the circuit from overcurrent impact. The sixth capacitor C6 is connected to the base of the transistor G through the fourteenth resistor R14, and R14 limits current to prevent the base from being damaged by excessive current. The sixth capacitor C6 is connected in parallel with the transient voltage suppressor T, and T is used to protect the circuit from damage by transient voltage spikes. The transient voltage suppression tube T is connected in parallel with the common mode filter inductor L, which is used to suppress common mode noise and improve the anti-interference ability of the circuit. The common mode filter inductor L is connected in parallel with the seventh capacitor C7, which is used to further filter out high-frequency noise and provide a discharge path to protect the circuit. The seventh capacitor C7 is grounded to ensure the stability and safety of the circuit.

[0059] When the power is turned on, the first diode D1 starts working and rectifies the AC power into DC power. Since D1 is connected in parallel with D2, D2 provides a freewheeling path when the power supply voltage suddenly changes or the voltage is reversed to protect the transistor G. The fifth capacitor C5 and the sixth capacitor C6 work together to filter out high-frequency noise and transient voltage spikes to ensure the stable operation of the circuit. The sixth capacitor C6 is connected to the base of the transistor G through the fourteenth resistor R14 to limit the base current and prevent the transistor from being damaged due to excessive current. The transient voltage suppression tube T responds quickly when the voltage is abnormal, clamps the voltage within a safe range, and protects the subsequent circuit. The filter network composed of the common-mode filter inductor L and the seventh capacitor C7 further suppresses common-mode noise and ensures the anti-interference ability of the circuit.

[0060] The current protection device F1 and the fourteenth resistor R14 work together to limit the current passing through the transistor G to prevent damage caused by excessive current. The transient voltage suppression tube T and the common mode filter inductor L provide double protection to ensure that the circuit can still work normally when facing transient voltage and common mode noise.

[0061] Further, if Figure 8 As shown, the board voltage stabilization circuit includes a first-stage voltage stabilization chip S1 and a second-stage voltage stabilization chip S2. Two second-stage voltage stabilization chips S2 are provided. The board power supply adopts a two-stage voltage stabilization structure. The first-stage voltage stabilization chip S1 uses a DC-DC switching voltage stabilization chip TPS5430 to convert the 24V input voltage into a +5V voltage for use by 5V devices. The second-stage voltage stabilization chip S2 consists of two TLV62130RGT chips that convert the 5V voltage into +3.3V and +1.2V respectively for use by FPGA and other devices.

[0062] Example

[0063] Software Design

[0064] 1. Modular design

[0065] Application of modular design in data acquisition and recording system

[0066] Modular design is a key concept in modern engineering and software development that allows systems to be built and expanded by combining multiple independent, standardized modules. The application of modular design in your data acquisition and recording system will bring the following key advantages:

[0067] Flexibility and customizability: By using a modular design, the system can be customized to specific needs and application scenarios. Users can select suitable I / O modules based on data type, acquisition frequency or other specific parameters and integrate them into the system. This approach enables the system to be easily adapted to different applications from simple laboratory settings to complex industrial environments.

[0068] Easy to upgrade and expand: As technology develops and user needs change, the modular design allows users to easily add new functions or upgrade existing modules without replacing the entire system. This not only saves costs, but also ensures the long-term effectiveness and competitiveness of the system.

[0069] Simplified maintenance and troubleshooting: In a modular system, if a module fails, it can be quickly identified and replaced without affecting other parts of the system. This greatly simplifies the maintenance process, reduces system downtime, and improves overall reliability and performance.

[0070] Standardized interfaces: Modular design is often accompanied by standardized interfaces, which means that various modules can be seamlessly integrated and exchanged. Standardized interfaces simplify system integration and configuration, making compatibility and integration with other systems (such as PLC and SCADA) easier.

[0071] Cost-effectiveness: Modular design can reduce initial investment costs by allowing users to purchase and install only the modules they need. In addition, with the increase in module options on the market, users can choose the modules with the best price-performance ratio, further optimizing the cost-effectiveness ratio.

[0072] 2. Efficient data processing

[0073] In data acquisition and recording systems, efficient data processing is a key element to ensure system performance and accuracy. The following are the main features and advantages of this system in this regard:

[0074] Data Collection Module: This module is the key starting point of the system and is responsible for collecting data from various sources. These sources include but are not limited to sensors, industrial equipment, laboratory instruments, etc. The collected data may involve various types, such as temperature readings, pressure indicators, machine operation data, etc.

[0075] Multi-source data access: The system is designed with the ability to connect and collect data from a variety of devices, including analog and digital signals.

[0076] Real-time data collection: In order to capture key performance indicators, the system supports real-time data collection to ensure timely acquisition of the latest information.

[0077] Preliminary data screening: Before the data is sent for further processing, the system can perform preliminary screening to eliminate noise or irrelevant data, thereby improving the efficiency and accuracy of data processing.

[0078] Ability to process various data types: The system is designed to be able to process various types of data, including analog signals, digital signals, temperature data, etc. This versatility enables the system to be suitable for a wide range of applications, from environmental monitoring to industrial automation.

[0079] High-frequency acquisition support: The system supports high-frequency data acquisition, which is essential for applications that require real-time monitoring and analysis. High-frequency acquisition ensures the real-time and accuracy of data, which is particularly important for monitoring and controlling dynamic processes.

[0080] Real-time data analysis: In addition to data collection, the system also has the ability to perform real-time data analysis. This can include basic data processing such as filtering and sorting, as well as more complex analysis such as trend identification and anomaly detection. Real-time analysis capabilities enable users to make data-driven decisions in a timely manner.

[0081] Efficient data processing algorithms: The system uses advanced data processing algorithms to ensure that data processing is both fast and accurate. These algorithms are optimized for different types of data and application scenarios to provide the best performance.

[0082] 3. Storage and Recording

[0083] Powerful storage and recording capabilities are another key feature of a data acquisition system. The following are the main features of your system in terms of storage and recording:

[0084] Large-capacity storage: The system has a built-in large-capacity storage device that can record a large amount of data for a long time. This is especially important for applications that require long-term data recording.

[0085] Data security and integrity: When storing data, the system uses advanced technologies to ensure data security and integrity. This includes data encryption, redundant storage, and error detection and correction mechanisms.

[0086] Easy to access and export data: Users can easily access and export stored data for further analysis or reporting. The system provides a variety of data formats and export options to meet the needs of different users.

[0087] 4. Communication and integration

[0088] In modern data acquisition and recording systems, communication and integration capabilities are crucial. They not only ensure the effective transmission of data, but also greatly improve the flexibility and compatibility of the system. The system of this embodiment has the following characteristics in this regard:

[0089] Gigabit Ethernet: The system uses UDP network protocol to enhance the flexibility of network connection. It can better adapt to different network environments, ensure the reliability and speed of data transmission, and provide more convenient network configuration and management options.

[0090] Seamless data transmission: The system's communication protocol ensures efficient and reliable data transmission. Whether through wired or wireless means, data transmission is optimized to ensure speed and reduce latency, ensuring the accuracy and integrity of real-time data.

[0091] Security considerations: When designing the communication protocol, the security of the system is given priority. Advanced encryption and authentication mechanisms are used to ensure the security of data transmission and prevent unauthorized access and data leakage.

[0092] 5. Safety and reliability

[0093] Advanced Data Security: The system uses multi-layered security mechanisms, including enhanced data encryption, secure authentication protocols, and policies to prevent unauthorized access. These measures protect the system from external attacks and data leaks while ensuring the confidentiality and integrity of user data.

[0094] Network security reinforcement: Considering the integration of multiple network services, the system of this embodiment will deploy the latest network security technologies, including firewalls, intrusion detection systems and security audits, to prevent network attacks and unauthorized access.

[0095] Enhanced stability and reliability: By introducing system redundancy design, automatic error detection and recovery mechanisms, the stability and reliability of the system have been significantly improved. This ensures that the system can continue to operate stably when the network environment changes or hardware fails, reducing the risk of data loss and service interruption.

[0096] Continuous monitoring and maintenance: The system will be monitored in real time to detect and respond to potential security threats or system anomalies in a timely manner. Regular maintenance and updates will also ensure that the system complies with the latest security standards and technical requirements.

[0097] 6. Scalability: Flexible design for the future

[0098] The software solution of this embodiment is designed with emphasis on scalability to adapt to future technological advances and changes in market demand. The following are specific scalability features:

[0099] Modular architecture: The modular design makes it easy and quick to add new features or upgrade existing features in the future. This design allows the system to adapt to new technical standards and integrate new tools or modules without large-scale reconstruction.

[0100] Easy to maintain and upgrade: The system maintenance and upgrade process is designed to be as simple and efficient as possible. Through clear documentation and user guides, as well as easy-to-operate interfaces, system maintenance and upgrades can be completed by users themselves without excessive technical support.

[0101] Continuous technology tracking and updates: The development team of this embodiment will continue to track technology trends and regularly update the system to include the latest technology and security features. This ensures that the system is not only advanced at present, but also remains at the forefront in the future.

[0102] Through these design considerations, the software solution of this embodiment leaves ample room for future development, and can ensure the long-term applicability and competitiveness of the system regardless of technological advancement or changes in market demand.

[0103] Only the preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention, and various changes should be included in the protection scope of the present invention.

Claims

1. A multifunctional vehicle light data testing system, characterized in that: The invention comprises a device to be detected (1), a data acquisition device (2), and a computer host computer (3); the device to be detected (1) is connected to the data acquisition device (2), the data acquisition device (2) is connected to the computer host computer (3), the data acquisition device (2) comprises a voltage acquisition board (201), a current acquisition board (202), a temperature acquisition board (203), and a switch (204); the voltage acquisition board (201), the current acquisition board (202), and the temperature acquisition board (203) are all connected to the computer host computer (3) via the switch (204); the device to be detected (1) comprises a voltage device (101), a current device (102), and a temperature device (103); the voltage device (101) is connected to the voltage acquisition board (201), the current device (102) is connected to the current acquisition board (202), and the temperature device (103) is connected to the temperature acquisition board (203).

2. A multifunctional vehicle light data testing system according to claim 1, characterized in that: The voltage device (101) and the current device (102) are both electrically connected to a voltage acquisition board (201) and a current acquisition board (202) via an AD7616 chip. The AD7616 chip is powered by a single 5V power supply, accommodates true bipolar input signals of ±10V, ±5V and ±2.5V, and simultaneously samples at a throughput rate of 1MSPS and a SNR of 90.5dB per channel.

3. The multifunctional vehicle light data testing system according to claim 1, characterized in that: The voltage acquisition board (201) and the current acquisition board (202) both use Hall elements, and the switch (204) uses an RTL8211E Ethernet PHY chip, which supports 1000M / 100M / 10M Ethernet modes, and the transmission distance in the 1000M mode can reach 150 meters; RTL8211E supports IEEE 802.3RGMII interface and supports 3.3V, 2.5V, 1.8V and 1.5V signals.

4. The multifunctional vehicle light data testing system according to claim 1, characterized in that: The temperature acquisition board (203) comprises a thermocouple sensor and an A / D acquisition circuit, wherein the thermocouple sensor is electrically connected to a switch (204) via the A / D acquisition circuit; the A / D acquisition circuit comprises an ADC chip (U1), a jumper pad (P1), a first resistor (R1), a second resistor (R2), and a first capacitor (C1); an AIN1(+) pin of the ADC chip (U1) is electrically connected to the jumper pad (P1) via the first resistor (R1), an AIN1(-) pin of the ADC chip (U1) is electrically connected to the jumper pad (P1) via the second resistor (R2), and a first capacitor (C1) is connected in parallel between the AIN1(+) pin and the AIN1(-) pin of the ADC chip (U1).

5. The multifunctional vehicle light data testing system according to claim 1, characterized in that: The system also comprises a power supply part, which is electrically connected to the voltage acquisition board (201), the current acquisition board (202), and the temperature acquisition board (203) respectively; the power supply part comprises an EMI and protection circuit, an input voltage conversion circuit, an output voltage sampling circuit, a power protection circuit, and a board voltage stabilization circuit; the EMI and protection circuit is electrically connected to the input voltage conversion circuit, the input voltage conversion circuit is electrically connected to the output voltage sampling circuit, the output voltage sampling circuit is electrically connected to the power protection circuit, the power protection circuit is electrically connected to the board voltage stabilization circuit, and the board voltage stabilization circuit is electrically connected to the voltage acquisition board (201), the current acquisition board (202), and the temperature acquisition board (203) respectively.

6. A multifunctional vehicle light data testing system according to claim 5, characterized in that: The EMI and protection circuit includes a fuse (FA), a first X capacitor (CX1), a second X capacitor (CX2), a first Y capacitor (CY1), a second Y capacitor (CY2), a common mode inductor (LA), an NTC thermistor (RA), and a relay (JKA1). The fuse (FA) is electrically connected to the first Y capacitor (CY1), the first Y capacitor (CY1) and the second Y capacitor (CY2) are connected in series, the fuse (FA) is electrically connected to the first X capacitor (CX1), the first X capacitor (CX1) is connected in parallel to the common mode inductor (LA), the common mode inductor (LA) is connected in parallel to the second X capacitor (CX2), the common mode inductor (LA) is electrically connected to the NTC thermistor (RA), the NTC thermistor (RA) is connected in parallel to a normally open contact of the relay (JKA1), and the coil of the relay (JKA1) is electrically connected to a 12V power supply.

7. The multifunctional vehicle light data testing system according to claim 5, characterized in that: The input voltage conversion circuit comprises an AC live line (ACL), an AC neutral line (ACN), a third resistor (R3), a fourth resistor (R4), a fifth resistor (R5), a sixth resistor (R6), a second capacitor (C2), a seventh resistor (R7), an eighth resistor (R8), a ninth resistor (R9), a tenth resistor (R10) and a third capacitor (C3), wherein the AC live line (ACL) is electrically connected to the third resistor (R3), the third resistor (R3) is connected in series with the fourth resistor (R4), and the fourth resistor (R4) is electrically connected to the third resistor (R3). ) is grounded through a fifth resistor (R5), the fourth resistor (R4) is electrically connected to a sixth resistor (R6), the sixth resistor (R6) is grounded through a second capacitor (C2), the AC neutral line (ACN) is electrically connected to a seventh resistor (R7), the seventh resistor (R7) is connected in series with an eighth resistor (R8), the eighth resistor (R8) is grounded through a ninth resistor (R9), the ninth resistor (R9) is electrically connected to a tenth resistor (R10), and the tenth resistor (R10) is grounded through a third capacitor (C3).

8. The multifunctional vehicle light data testing system according to claim 5, characterized in that: The output voltage sampling circuit comprises an eleventh resistor (R11), a twelfth resistor (R12), a thirteenth resistor (R13), and a fourth capacitor (C4); the eleventh resistor (R11) is grounded via the twelfth resistor (R12); the eleventh resistor (R11) is connected to the fourth capacitor (C4) via the thirteenth resistor (R13); and the fourth capacitor (C4) is grounded.

9. The multifunctional vehicle light data testing system according to claim 5, characterized in that: The power protection circuit comprises a first diode (D1), a transistor (G), a second diode (D2), a fifth capacitor (C5), a fourteenth resistor (R14), a sixth capacitor (C6), a transient voltage suppression tube (T), a common mode filtering inductor (L), and a seventh capacitor (C7); the first diode (D1) is connected in parallel between the collector and the emitter of the transistor (G); the second diode (D2) is connected in parallel between the first diode (D1) and the base of the transistor (G); the fifth capacitor (C5) is connected in parallel with the second diode (D2); The first diode (D1) is electrically connected to a current protection device (F1), the current protection device (F1) is electrically connected to a sixth capacitor (C6), the sixth capacitor (C6) is electrically connected to the base of the transistor (G) through a fourteenth resistor (R14), the sixth capacitor (C6) is connected in parallel with a transient voltage suppression tube (T), the transient voltage suppression tube (T) is connected in parallel with a common-mode filter inductor (L), the common-mode filter inductor (L) is connected in parallel with a seventh capacitor (C7), and the seventh capacitor (C7) is grounded.

10. The multifunctional vehicle light data testing system according to claim 5, characterized in that: The board voltage stabilization circuit comprises a first-level voltage stabilization chip (S1) and a second-level voltage stabilization chip (S2), two second-level voltage stabilization chips (S2) are provided, the first-level voltage stabilization chip (S1) is electrically connected to the two second-level voltage stabilization chips (S2) respectively, the first-level voltage stabilization chip (S1) adopts a TPS5430 chip, and the second-level voltage stabilization chip (S2) adopts a TLV62130RGT chip.

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