A photolithography machine plate positioning mechanism

Abstract

The present invention discloses a plate positioning mechanism for a photolithography machine, which relates to the technical field of photolithography machines, and includes a mask docking station and a wafer docking station that can be synchronously moved in opposite directions, wherein the mask docking station and the wafer docking station are connected by the same driving unit, and a mask carrier and a wafer carrier are respectively arranged on the mask docking station and the wafer docking station, and when the driving unit controls the mask docking station to move and dock with the wafer docking station, the mask carrier is located directly above the wafer carrier. An auxiliary material changing unit that can control the lifting and lowering movement of the mask carrier is arranged on the mask docking station. The present invention can make the mask docking station and the wafer docking station move synchronously through the setting of the driving unit, so as to achieve the purpose of quickly positioning the mask plates and wafers distributed above and below. The accuracy of the docking operation of the mask docking station and the wafer docking station is improved, the docking error is reduced, and the working quality of the photolithography processing is effectively guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of photolithography machines, and in particular to a plate positioning mechanism for a photolithography machine. Background Art

[0002] The photolithography machine is one of the most core equipment in semiconductor manufacturing, used to transfer the circuit pattern of the chip design to the silicon wafer. It is a key tool in modern integrated circuit manufacturing and directly determines the process node and performance of the chip. The core principle of the photolithography machine is to use optical projection technology to project the circuit pattern on the mask onto the wafer coated with photoresist through light source illumination and optical system reduction. After exposure and development, the pattern on the photoresist will be transferred to the surface of the wafer, and then the actual circuit structure will be formed through etching, ion implantation and other processes.

[0003] The mask and wafer in the lithography machine are two core components in the lithography process, and the relationship between them runs through the entire chip manufacturing process. The mask is the carrier of the pattern, and the wafer is the receiver of the pattern. The precise coordination of the two is the key to the success of the lithography process. With the continuous development of semiconductor technology, the relationship between the mask and the wafer will become closer, and the requirements for precision and process control will become higher and higher.

[0004] In existing photolithography machines, when installing the mask and wafer, it is necessary to use a mechanical arm or a transmission system to take the mask out of the protective box and transfer it to the mask stage, and then move the mask stage to the top of the wafer stage to achieve the docking of the mask and the wafer. During the processing, depending on the processing requirements, if the mask needs to be replaced, it is necessary to wait for the mask stage to return to the initial position and then perform the material replacement operation. During the material replacement process, a certain amount of time is required, which affects the efficiency of the photolithography process. Therefore, the present invention provides a photolithography machine plate positioning mechanism to meet the needs. Summary of the invention

[0005] In response to the above problems, the present application provides a lithography machine plate positioning mechanism.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a lithography machine plate positioning mechanism, comprising a mask docking table and a wafer docking table which can move synchronously in opposite directions, the mask docking table and the wafer docking table are connected by the same driving unit, and the mask docking table and the wafer docking table are respectively provided with a mask carrier and a wafer carrier, when the driving unit controls the mask docking table to move and dock with the wafer docking table, the mask carrier is located directly above the wafer carrier.

[0007] The mask docking station is provided with an auxiliary material changing unit which can control the lifting and lowering movement of the mask carrier. When the mask docking station moves to the initial position, the auxiliary material changing unit can control the mask carrier carrying the mask to rise until the mask is separated from the mask docking station.

[0008] Furthermore, the mask docking platform is provided with a mask guide seat that can move synchronously therewith, and a first sliding seat is provided at the bottom of the mask guide seat. The first sliding seat is provided with a first follower arm and a first roller group distributed along the moving direction of the mask docking platform, and a first guide rack is provided on the inner side of the first follower arm.

[0009] Furthermore, the wafer docking table is provided with a wafer guide seat that can move synchronously therewith, a second sliding seat is provided at the bottom of the wafer guide seat, the second sliding seat is provided with a second follower arm and a second roller group distributed along the moving direction of the wafer docking table, the first follower arm is located above the second follower arm, and a second guide rack is provided on the inner side of the second follower arm.

[0010] Furthermore, the driving unit includes a first driving gear and a second driving gear arranged in the relative space between the first guide rack and the second guide rack, the first driving gear and the second driving gear are coaxially distributed from top to bottom, and the central axis positions of the first driving gear and the second driving gear are connected by the same driving shaft, and the bottom end of the driving shaft is provided with a second motor matched therewith.

[0011] The first guide rack and the second guide rack are located on both sides of the driving shaft, and the first guide rack and the second guide rack are respectively engaged with the first driving gear and the second driving gear. When the first driving gear and the second driving gear rotate synchronously with the driving shaft, the first guide rack and the second guide rack move in opposite directions.

[0012] Furthermore, a frame that can carry a second motor is provided below the mask docking station and the wafer docking station, and the frame is provided with two groups of support rods and tracks from top to bottom, the first sliding seat and the second sliding seat are respectively mounted on the two groups of support rods, and the first roller group and the second roller group are respectively connected to the two groups of tracks.

[0013] Furthermore, the auxiliary material changing unit includes an intercepting vertical plate arranged on the mask docking table, the intercepting vertical plate is provided with a channel, and two limiting pressure blocks parallel to the mask carrier are provided on the side of the intercepting vertical plate away from the mask carrier, and the mask carrier is provided with a first connecting support passing through the channel at one end close to the intercepting vertical plate, and the first connecting support is provided with two guide columns running through the first connecting support, the limiting pressure block and the first connecting support are connected by a pressure spring, and the pressure spring is located on the outside of the guide column, and as the mask carrier rises, the first connecting support moves toward the limiting pressure block, and the pressure spring is squeezed and contracted.

[0014] Furthermore, the auxiliary material changing unit also includes two guide rollers respectively arranged at the two ends of the first connecting support, and guide cams are arranged under the guide rollers. The guide cams are installed on the intercepting vertical plate through a rotating shaft, and synchronous rotating wheels are arranged on the two rotating shafts located on one side of the intercepting vertical plate. The two synchronous rotating wheels are connected by a synchronous belt, and one of the two rotating shafts is installed with a first motor, and the first motor is installed on the mask docking table.

[0015] Furthermore, the mask carrier is provided with a second engaging support protruding upward at one end away from the intercepting vertical plate. When the mask is placed on the mask carrier, the first engaging support and the second engaging support abut against two sides of the mask.

[0016] In summary, the technical effects and advantages of the present invention are as follows:

[0017] 1. The present invention can make the mask docking station and the wafer docking station move synchronously through the setting of the driving unit, so as to achieve the purpose of quickly positioning the mask plates and wafers distributed above and below. The accuracy of the docking operation of the mask docking station and the wafer docking station is improved, the docking error is reduced, and the work quality of the lithography processing is effectively guaranteed.

[0018] 2. The present invention provides an auxiliary material changing unit on the mask docking platform which can control the lifting and lowering of the mask carrier. During the movement of the mask docking platform, the mask can be taken out without waiting for the mask to move to the initial position before performing the replacement operation. This reduces the friction damage to the mask caused by manual material removal, improves the speed of the material changing operation, and further improves the efficiency of the photolithography process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the structure from the second viewing angle of the present invention.

[0022] Figure 3 It is a schematic diagram of the connection between the mask docking station, the wafer docking station and the driving unit of the present invention.

[0023] Figure 4 It is a schematic diagram of the connection between the shell mask docking platform and the mask guide seat of the present invention.

[0024] Figure 5It is a schematic diagram of the connection between the wafer docking station and the wafer guide seat of the present invention.

[0025] Figure 6 It is a schematic diagram of the structure of the mask guide seat of the present invention.

[0026] Figure 7 Schematic diagram of the mask carrier structure of the present invention.

[0027] Figure 8 For the present invention Figure 7 Enlarged structural diagram at A in the middle.

[0028] Fig. 9 It is a schematic diagram of the frame structure of the present invention.

[0029] In the figure: 1, mask docking station; 11, mask carrier; 111, first docking support; 112, guide column; 113, pressure spring; 114, guide roller; 12, intercepting vertical plate; 13, limiting pressure block; 14, guide cam; 15, rotating shaft; 16, synchronous rotating wheel; 17, synchronous belt; 18, first motor; 19, second docking support; 2, wafer docking station; 21, wafer carrier; 3, mask guide seat; 31, first sliding seat; 32, first follower arm; 33, first guide rack; 34, first roller group; 4, wafer guide seat; 41, second sliding seat; 42, second follower arm; 43, second guide rack; 44, second roller group; 5, first driving gear; 6, second driving gear; 7, driving shaft; 8, second motor; 9, frame; 91, support rod; 92, track. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Example 1: Reference Figure 1-4A plate positioning mechanism for a photolithography machine shown in the figure includes a mask docking table 1 and a wafer docking table 2 which can move synchronously in opposite directions. The mask docking table 1 and the wafer docking table 2 are connected by the same driving unit, and a mask carrier 11 and a wafer carrier 21 are respectively provided on the mask docking table 1 and the wafer docking table 2. In actual operation, the photolithography machine will calibrate the initial positions of the mask docking table and the wafer docking table 2 before starting, use a laser interferometer or a high-precision encoder to measure the absolute positions of the two, and establish a unified alignment reference through coordinate system alignment (such as a Cartesian coordinate system or a polar coordinate system). When the driving unit controls the mask docking table 1 and the wafer docking table 2 to move and dock, the mask carrier 11 is located directly above the wafer carrier 21.

[0032] The mask is a transparent quartz substrate with a pattern formed by chrome or other light-shielding materials. These patterns are the physical embodiment of the chip design and contain key information such as circuit layout and transistor structure. The wafer is a round piece made of silicon material with a photoresist coated on the surface. During the operation of the lithography machine, the pattern on the mask is projected onto the wafer through the optical system of the lithography machine to form an exposure area of ​​the photoresist. The pattern on the mask is transferred to the wafer through the exposure process of the lithography machine, and finally the actual circuit structure is formed through processes such as etching and ion implantation.

[0033] In the present invention, the mask carrier 11 can be quickly docked with the wafer carrier 21 through the synchronous movement of the mask docking station 1 and the wafer docking station 2, so as to achieve the purpose of quickly positioning the mask plates and wafers distributed above and below, and improve the speed of the plate positioning and docking process. When the mask docking station 1 and the wafer docking station 2 are separated, the mask plates and the wafers can be replaced at the same time, thereby improving the working efficiency of the photolithography process.

[0034] Based on different processing requirements, if it is necessary to replace the mask plate coated with other patterns, the original mask plate needs to be taken out and the mask plate replacement operation is implemented. In this application document, the docking station 1 is provided with an auxiliary material replacement unit that can control the lifting and lowering movement of the mask carrier 11. When the mask docking station 1 moves to the initial position, the auxiliary material replacement unit can control the mask carrier 11 carrying the mask plate to rise until the mask plate is separated from the mask docking station 1, so that the staff can quickly replace the mask plate.

[0035] Specifically, Figure 4As shown, the mask docking platform 1 is provided with a mask guide seat 3 that can move synchronously therewith, a first sliding seat 31 is provided at the bottom of the mask guide seat 3, a first follower arm 32 and a first roller group 34 distributed along the moving direction of the mask docking platform 1 are provided on the first sliding seat 31, and a first guide rack 33 is provided inside the first follower arm 32. When the first guide rack 33 moves, the first follower arm 32, the first sliding seat 31 and the first roller group 34 can all move toward the direction of the wafer docking platform 2, so that the mask guide seat 3 carrying the mask carrier 11 can move toward the wafer carrier 21.

[0036] like Figure 4-6 As shown, the wafer docking stage 2 is provided with a wafer guide seat 4 that can move synchronously therewith, a second sliding seat 41 is provided at the bottom of the wafer guide seat 4, and a second follower arm 42 and a second roller group 44 are provided on the second sliding seat 41 along the moving direction of the wafer docking stage 2. In order to avoid interference between the first follower arm 32 and the second follower arm 42 during the movement, the first follower arm 32 is located above the second follower arm 42, and a second guide rack 43 is provided inside the second follower arm 42. When the second guide rack 43 moves, the second follower arm 42, the second sliding seat 41 and the second roller group 44 can all move toward the direction of the mask docking stage 1, so that the wafer docking stage 2 carrying the wafer carrier 21 can move toward the mask carrier 11 until the mask carrier 11 moves above the wafer carrier 21.

[0037] The driving unit includes a first driving gear 5 and a second driving gear 6 arranged in the relative space between the first guide rack 33 and the second guide rack 43. The first driving gear 5 and the second driving gear 6 are coaxially distributed from top to bottom, and the central axis positions of the first driving gear 5 and the second driving gear 6 are connected by the same driving shaft 7. The bottom end of the driving shaft 7 is provided with a second motor 8 matched therewith.

[0038] The first guide rack 33 and the second guide rack 43 are located on both sides of the driving shaft 7, and the first guide rack 33 and the second guide rack 43 are respectively meshed with the first driving gear 5 and the second driving gear 6. When the first driving gear 5 and the second driving gear 6 rotate synchronously with the driving shaft 7, the first guide rack 33 and the second guide rack 43 move in opposite directions, so as to achieve the purpose of driving the first sliding seat 31 and the second sliding seat 41 to move in opposite directions.

[0039] The setting of the driving unit can make the mask docking station 1 and the wafer docking station 2 perform docking operations synchronously and quickly, thereby improving the accuracy of the docking operations of the mask docking station 1 and the wafer docking station 2, reducing docking errors, and effectively ensuring the work quality of lithography processing.

[0040] It is worth mentioning that Fig. 9As shown, in order to ensure the stability of the driving unit, a frame 9 capable of carrying a second motor 8 is provided below the mask docking station 1 and the wafer docking station 2. In order to improve the stability of the first sliding seat 31 and the second sliding seat 41 during movement, the frame 9 is provided with two groups of support rods 91 and tracks 92 from top to bottom. The first sliding seat 31 and the second sliding seat 41 are respectively sleeved on the two groups of support rods 91, and the first roller group 34 and the second roller group 44 are respectively connected to the two groups of tracks 92. When the mask docking station 1 and the wafer docking station 2 move synchronously, the first sliding seat 31 and the second sliding seat 41 are respectively located on the surfaces of the two groups of support rods 91 and slide, and the first roller group 34 and the second roller group 44 are respectively located in the two groups of tracks 92 and slide, which can effectively prevent the mask docking station 1 and the wafer docking station 2 from offsetting and shaking during movement.

[0041] Example 2: Figure 7 , Figure 8 As shown, on the basis of Example 1, the auxiliary material changing unit includes an intercepting vertical plate 12 arranged on the mask docking station 1, a channel is arranged on the intercepting vertical plate 12, and two limiting pressure blocks 13 parallel to the mask carrier 11 are arranged on the side of the intercepting vertical plate 12 away from the mask carrier 11, and the mask carrier 11 is provided with a first connection support 111 passing through the channel at one end close to the intercepting vertical plate 12, and the first connection support 111 is provided with two guide columns 112 penetrating the first connection support 111, and the limiting pressure block 13 and the first connection support 111 are connected by a pressure spring 113, and the pressure spring 113 is located outside the guide column 112. When the mask carrier 11 rises, the first connection support 111 moves toward the limiting pressure block 13, and the guide column 112 slides in the limiting pressure block 13 until the pressure spring 113 is squeezed and contracted.

[0042] Specifically, the auxiliary material changing unit also includes two guide rollers 114 respectively arranged at the two ends of the first connecting support 111, and a guide cam 14 is arranged under the guide roller 114. The guide cam 14 is installed on the intercepting vertical plate 12 through a rotating shaft 15. The two rotating shafts 15 located on one side of the intercepting vertical plate 12 are provided with synchronous rotating wheels 16. The two synchronous rotating wheels 16 are connected by a synchronous belt 17. One of the two rotating shafts 15 is installed with a first motor 18, and the first motor 18 is installed on the mask docking table 1.

[0043] When the first motor 18 is running, one of the rotating shafts 15 can be driven to rotate. Under the connection of the two synchronous wheels 16 and the synchronous belt 17, the two rotating shafts 15 can be driven to rotate at the same time, so as to achieve the purpose of driving the two guide cams 14 to rotate synchronously. During the rotation of the guide cam 14, the guide roller 114 located above it rolls and contacts with it. Under the squeezing force of the guide cam 14, the first engagement bracket 111 and the mask carrier 11 rise smoothly, and the mask is completely exposed, so as to facilitate the replacement operation of the mask.

[0044] After the mask is replaced, the first motor 18 is turned on again, the two rotating shafts 15 rotate again, and the two guide cams 14 are released from contact with the guide rollers 114. At this time, under the elastic potential energy of the pressure spring 113, the first docking support 111 and the guide column 112 can be quickly lowered and reset, and the mask carrier 11 carrying the replaced mask falls into the mask docking station 1.

[0045] The auxiliary material changing unit is set up, and there is no need to wait for the mask to move to the initial position before performing the changing operation. The mask can be taken out during the movement of the mask docking station 1, which reduces the friction damage to the mask caused by manual material removal, improves the speed of the material changing operation, and further improves the efficiency of the photolithography processing.

[0046] The mask carrier 11 is provided with a second engagement support 19 protruding upward at one end away from the interception vertical plate 12. When the mask is placed on the mask carrier 11, the first engagement support 111 and the second engagement support 19 abut against both sides of the mask. The combination of the first engagement support 111 and the second engagement support 19 can accurately position the mask, ensuring that the mask can fall accurately as the mask carrier 11 descends, thereby improving the accuracy of the mask placement operation.

[0047] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A photolithography machine plate positioning mechanism, characterized in that: The invention comprises a mask docking platform (1) and a wafer docking platform (2) which can be synchronously moved in opposite directions, the mask docking platform (1) and the wafer docking platform (2) are connected via a common driving unit, and a mask carrier (11) and a wafer carrier (21) are respectively provided on the mask docking platform (1) and the wafer docking platform (2), and when the driving unit controls the mask docking platform (1) and the wafer docking platform (2) to move and dock, the mask carrier (11) is located directly above the wafer carrier (21); The mask docking platform (1) is provided with an auxiliary material changing unit capable of controlling the lifting and lowering movement of the mask carrier (11); when the mask docking platform (1) moves to an initial position, the auxiliary material changing unit can control the mask carrier (11) carrying the mask to rise until the mask is detached from the mask docking platform (1).

2. The photolithography machine plate positioning mechanism according to claim 1, characterized in that: The mask docking platform (1) is provided with a mask guide seat (3) which can move synchronously therewith, the bottom of the mask guide seat (3) is provided with a first sliding seat (31), the first sliding seat (31) is provided with a first follower arm (32) and a first roller group (34) distributed along the moving direction of the mask docking platform (1), and the inner side of the first follower arm (32) is provided with a first guide rack (33).

3. The photolithography machine plate positioning mechanism according to claim 2, characterized in that: The wafer docking platform (2) is provided with a wafer guide seat (4) which can move synchronously therewith; a second sliding seat (41) is provided at the bottom of the wafer guide seat (4); a second follower arm (42) and a second roller group (44) are provided on the second sliding seat (41) and are distributed along the moving direction of the wafer docking platform (2); the first follower arm (32) is located above the second follower arm (42); and a second guide rack (43) is provided on the inner side of the second follower arm (42).

4. The photolithography machine plate positioning mechanism according to claim 3, characterized in that: The driving unit comprises a first driving gear (5) and a second driving gear (6) which are arranged in a relative space between the first guide rack (33) and the second guide rack (43); the first driving gear (5) and the second driving gear (6) are coaxially distributed from top to bottom, and the middle axis positions of the first driving gear (5) and the second driving gear (6) are connected via a same driving shaft (7); a second motor (8) adapted thereto is provided at the bottom end of the driving shaft (7); The first guide rack (33) and the second guide rack (43) are located on both sides of the drive shaft (7), and the first guide rack (33) and the second guide rack (43) are respectively meshed with the first drive gear (5) and the second drive gear (6); when the first drive gear (5), the second drive gear (6) and the drive shaft (7) rotate synchronously, the first guide rack (33) and the second guide rack (43) move in opposite directions.

5. The photolithography machine plate positioning mechanism according to claim 4, characterized in that: A frame (9) capable of carrying a second motor (8) is provided below the mask docking platform (1) and the wafer docking platform (2); the frame (9) is provided with two groups of support rods (91) and rails (92) from top to bottom; the first sliding seat (31) and the second sliding seat (41) are respectively sleeved on the two groups of support rods (91); and the first roller group (34) and the second roller group (44) are respectively connected to the two groups of rails (92).

6. The photolithography machine plate positioning mechanism according to claim 1, characterized in that: The auxiliary material exchange unit comprises an intercepting vertical plate (12) arranged on the mask docking platform (1), the intercepting vertical plate (12) being provided with a channel, and two limiting pressure blocks (13) arranged in parallel with the mask carrier (11) are arranged on the side of the intercepting vertical plate (12) away from the mask carrier (11), the mask carrier (11) having a first connection support (111) passing through the channel arranged on one end close to the intercepting vertical plate (12), the first connection support (111) being provided with two guide columns (112) penetrating the first connection support (111), the limiting pressure block (13) and the first connection support (111) being connected via a pressure spring (113), the pressure spring (113) being located outside the guide column (112), and as the mask carrier (11) rises, the first connection support (111) moves towards the limiting pressure block (13), and the pressure spring (113) is squeezed and contracted.

7. The photolithography machine plate positioning mechanism according to claim 6, characterized in that: The auxiliary material replacement unit further comprises two guide rollers (114) respectively arranged at the two ends of the first docking support (111); a guide cam (14) is arranged below each of the guide rollers (114); each of the guide cams (14) is mounted on the intercepting vertical plate (12) via a rotating shaft (15); two rotating shafts (15) located on one side of the intercepting vertical plate (12) are each provided with a synchronous rotating wheel (16); the two synchronous rotating wheels (16) are connected via a synchronous belt (17); one of the two rotating shafts (15) is provided with a first motor (18); and the first motor (18) is mounted on the mask docking platform (1).

8. The photolithography machine plate positioning mechanism according to claim 7, characterized in that: The mask carrier (11) is provided with a second connecting bracket (19) protruding upward at one end away from the intercepting vertical plate (12); when the mask is placed on the mask carrier (11), the first connecting bracket (111) and the second connecting bracket (19) abut against two sides of the mask.

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