Printed circuit board inspection method and device and terminal equipment

Abstract

The embodiment of the invention provides a printed circuit board inspection method and device and terminal equipment. The method comprises the following steps: obtaining an inspection request, wherein the inspection request comprises a design rule file corresponding to a printed circuit board (PCB) to be inspected; according to the design rule file, at least one first signal and a bonding pad structure corresponding to each first signal in the PCB are determined, and the signal type of the first signal is a preset type; according to the design rule file, carrying out inspection processing on a bonding pad structure corresponding to each first signal to obtain a first inspection result corresponding to each bonding pad structure; and determining that the PCB inspection result corresponding to the inspection request comprises the first inspection result corresponding to each bonding pad structure. And the accuracy of PCB inspection is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computer technology, and in particular to a printed circuit board inspection method, apparatus, and terminal device. Background Art

[0002] Currently, users can design printed circuit boards (PCBs) through electronic design automation tools.

[0003] After the design is completed and the PCB structure is obtained, the PCB needs to be checked to determine whether there are errors and deficiencies in the design. In actual application, users manually check the structure of the PCB. Manual inspection may have errors or omissions, resulting in low accuracy of PCB inspection. Summary of the invention

[0004] The embodiments of the present application provide a printed circuit board inspection method, apparatus and terminal device to solve the problem of low accuracy in PCB inspection.

[0005] In a first aspect, an embodiment of the present application provides a printed circuit board inspection method, comprising:

[0006] Obtaining an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected;

[0007] Determine, according to the design rule file, at least one first signal and a pad structure corresponding to each first signal in the PCB, wherein a signal type of the first signal is a preset type;

[0008] According to the design rule file, the pad structure corresponding to each first signal is inspected and processed to obtain a first inspection result corresponding to each pad structure;

[0009] It is determined that the PCB inspection result corresponding to the inspection request includes a first inspection result corresponding to each pad structure.

[0010] According to the design rule file corresponding to the PCB, the pad structure corresponding to each first signal is automatically inspected and processed to obtain the first inspection result of each pad structure, thereby obtaining the PCB inspection result. This avoids the possibility of errors or omissions in manual inspection and improves the accuracy of PCB inspection. Compared with manual processing, the automatic PCB inspection result improves the efficiency of PCB inspection.

[0011] In a possible implementation manner, for any pad structure, the pad structure corresponding to the first signal is inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure, including:

[0012] Determine a structure type of a pad structure corresponding to the first signal;

[0013] If the structure type is an anti-pad type, then according to the design rule file, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed to obtain a first inspection result corresponding to the pad structure;

[0014] If the structure type is a non-functional type, the pad structure is inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure.

[0015] According to the structural type of the pad structure, the pad structure is inspected and processed accordingly, thereby improving the accuracy of the inspection.

[0016] In a possible implementation, according to the design rule file, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed to obtain a first inspection result corresponding to the pad structure, including:

[0017] Determining whether the pad structure is at a via position of the PCB;

[0018] If yes, obtaining the target size corresponding to the pad structure in the design rule file, and inspecting the pad structure according to the target size corresponding to the pad structure to obtain the first inspection result;

[0019] If not, it is determined whether the pad structure is located on the surface of the PCB, and the pad structure is inspected and processed according to whether the pad structure is located on the surface of the PCB and the design rule file to obtain the first inspection result.

[0020] In the pad structure of the anti-pad type, by checking and optimizing the pad structure at the via position and the pad structure on the surface, electromagnetic interference and signal reflection on the PCB can be reduced, further improving the stability of signal transmission.

[0021] In a possible implementation manner, the pad structure is inspected and processed according to the target size and position information corresponding to the pad structure to obtain the first inspection result, including:

[0022] Determining a first size of the pad structure;

[0023] If the first size matches the target size, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file;

[0024] If the first size does not match the target size, it is determined that the first inspection result includes the target size corresponding to the pad structure in the design rule file.

[0025] When it is found that the pad structure of the anti-pad type is missing or does not meet the design rules, the corresponding anti-pad can be automatically generated and corrected to ensure that the quality of the PCB design meets the requirements of high-speed signal transmission and improve the reliability and stability of the PCB design.

[0026] In a possible implementation manner, the pad structure is inspected and processed according to whether the pad structure is located on the surface of the PCB and the design rule file to obtain the first inspection result, including:

[0027] If the pad structure is located on the surface of the PCB, then in the design rule file, the pin area information corresponding to the pad structure is obtained, and the pin area information is used to indicate that there is no device in the pin area of ​​the pad structure, and the pin area is the area below the pin of the pad structure.

[0028] According to the design rule file, obtaining a preset volume;

[0029] If there is no device in the pin region of the pad structure, and the area of ​​the pin region is the preset volume, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file;

[0030] If there is a device in the pin region of the pad structure, and / or the area of ​​the pin region is not the preset volume, it is determined that the first inspection result includes the position of the pin region and the preset area.

[0031] If the pin area in the PCB design does not exist or does not meet the requirements, the appropriate pin area can be automatically generated according to the design rule file to ensure that the signal transmission performance is not affected.

[0032] In a possible implementation manner, the pad structure is inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure, including:

[0033] In the design rule file, determining indication information corresponding to the non-functional pad;

[0034] If the indication information corresponding to the non-functional pad is used to indicate that the pad structure is to be retained, determining that the first inspection result is used to indicate that the pad structure is to be retained;

[0035] If the indication information corresponding to the non-functional pad is used to instruct removal of the pad structure, it is determined that the first inspection result is used to instruct removal of the pad structure.

[0036] It can automatically obtain the indication information in the design rule file, and mark and process the non-functional pad structure accordingly according to the indication information, so that the PCB design can adapt to different manufacturing process requirements and improve the compatibility of the PCB design with the actual manufacturing process.

[0037] In a second aspect, an embodiment of the present application provides a printed circuit board inspection device, the device comprising:

[0038] An acquisition module is used to acquire an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected;

[0039] A first determination module, configured to determine, according to the design rule file, at least one first signal and a pad structure corresponding to each first signal in the PCB, wherein a signal type of the first signal is a preset type;

[0040] A processing module, configured to perform inspection processing on the pad structure corresponding to each first signal according to the design rule file, and obtain a first inspection result corresponding to each pad structure;

[0041] The second determining module is used to determine that the PCB inspection result corresponding to the inspection request includes a first inspection result corresponding to each pad structure.

[0042] In a possible implementation manner, the processing module is specifically used to:

[0043] Determine a structure type of a pad structure corresponding to the first signal;

[0044] If the structure type is an anti-pad type, then according to the design rule file, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed to obtain a first inspection result corresponding to the pad structure;

[0045] If the structure type is a non-functional type, the pad structure is inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure.

[0046] In a possible implementation manner, the processing module is specifically used to:

[0047] Determining whether the pad structure is at a via position of the PCB;

[0048] If yes, obtaining the target size corresponding to the pad structure in the design rule file, and inspecting the pad structure according to the target size corresponding to the pad structure to obtain the first inspection result;

[0049] If not, it is determined whether the pad structure is located on the surface of the PCB, and the pad structure is inspected and processed according to whether the pad structure is located on the surface of the PCB and the design rule file to obtain the first inspection result.

[0050] In a possible implementation manner, the processing module is specifically used to:

[0051] Determining a first size of the pad structure;

[0052] If the first size matches the target size, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file;

[0053] If the first size does not match the target size, it is determined that the first inspection result includes the target size corresponding to the pad structure in the design rule file.

[0054] In a possible implementation manner, the processing module is specifically used to:

[0055] If the pad structure is located on the surface of the PCB, then in the design rule file, the pin area information corresponding to the pad structure is obtained, and the pin area information is used to indicate that there is no device in the pin area of ​​the pad structure, and the pin area is the area below the pin of the pad structure.

[0056] According to the design rule file, obtaining a preset volume;

[0057] If there is no device in the pin region of the pad structure, and the area of ​​the pin region is the preset volume, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file;

[0058] If there is a device in the pin region of the pad structure, and / or the area of ​​the pin region is not the preset volume, it is determined that the first inspection result includes the position of the pin region and the preset area.

[0059] In a possible implementation manner, the processing module is specifically used to:

[0060] In the design rule file, determining indication information corresponding to the non-functional pad;

[0061] If the indication information corresponding to the non-functional pad is used to indicate that the pad structure is to be retained, determining that the first inspection result is used to indicate that the pad structure is to be retained;

[0062] If the indication information corresponding to the non-functional pad is used to instruct removal of the pad structure, it is determined that the first inspection result is used to instruct removal of the pad structure.

[0063] In a third aspect, an embodiment of the present application provides a terminal device, including:

[0064] at least one processor; and

[0065] a memory communicatively connected to the at least one processor; wherein,

[0066] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can perform any method described in the first aspect.

[0067] In a fourth aspect, an embodiment of the present application provides a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable the computer to execute any one of the methods described in the first aspect.

[0068] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program, which implements any method in the first aspect when executed by a processor.

[0069] The printed circuit board inspection method, device and terminal device provided in the embodiment of the present application can automatically inspect and process the pad structure corresponding to each first signal according to the design rule file corresponding to the PCB, obtain the first inspection result of each pad structure, and thus obtain the PCB inspection result. This avoids the possibility of errors or omissions in manual inspection and improves the accuracy of PCB inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0071] Figure 1 A schematic diagram of an application scenario provided by an embodiment of the present application;

[0072] Figure 2 A schematic diagram of a process flow of a printed circuit board inspection method provided in an embodiment of the present application;

[0073] Figure 3 A schematic diagram of the process of obtaining an inspection request provided in an embodiment of the present application;

[0074] Figure 4 A schematic flow chart of another printed circuit board inspection method provided in an embodiment of the present application;

[0075] Figure 5 A schematic diagram of a printed circuit board inspection process provided by an embodiment of the present application;

[0076] Figure 6 A schematic diagram of the structure of a printed circuit board inspection device provided in an embodiment of the present application;

[0077] Figure 7 A schematic diagram of the structure of a terminal device provided in an embodiment of the present application.

[0078] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0079] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0080] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0081] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant laws, regulations and standards, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0082] For ease of understanding, below, combined Figure 1 , the application scenarios to which the embodiments of the present application are applicable are described.

[0083] Figure 1 This is a schematic diagram of an application scenario provided by an embodiment of the present application. Figure 1, including a terminal device 101 which can be a computer. An application is set in the terminal device, and the application can be an electronic design automation tool. The user designs the PCB through the application of the terminal device 101. After the design is completed, the structure of the PCB is checked to avoid errors and unreasonable structures in the PCB.

[0084] In actual application, users manually check the structure of PCB. Manual inspection may contain errors or omissions, resulting in low accuracy of PCB inspection.

[0085] In the example of the present application, the pad structure corresponding to each first signal can be automatically inspected and processed according to the design rule file corresponding to the PCB, and the first inspection result of each pad structure can be obtained, thereby obtaining the PCB inspection result. This avoids the possibility of errors or omissions in manual inspection and improves the accuracy of PCB inspection.

[0086] The method shown in the present application is described below through specific embodiments. It should be noted that the following embodiments can exist independently or in combination with each other, and the same or similar contents will not be described repeatedly in different embodiments.

[0087] Figure 2 A schematic diagram of a printed circuit board inspection method provided in an embodiment of the present application. Figure 2 , the method may include:

[0088] S201: Get an inspection request.

[0089] The execution subject of the embodiment of the present application can be a terminal device, or a printed circuit board inspection device set in a data acquisition device. The printed circuit board inspection device can be implemented by software, or by a combination of software and hardware. The terminal device can be a computer.

[0090] The check request includes the design rule file corresponding to the PCB to be checked.

[0091] After the user completes the design of the PCB, the user can generate the design file of the PCB through the terminal device. The design file includes information such as the number of layers, routing, vias, and layout of the pads of the surface mount device. At the same time, the user can also obtain the file or database file of the PCB design rules. And based on the design file and the file or database file of the design rules, a design rule file is generated and stored in the storage area of ​​the terminal device. So that the user can directly obtain the design rule file when checking the PCB.

[0092] The format of the design file may be brd or pcb. The format of the design rule file or database file may be CSV, Excel or other structured formats. The design rule file or database file includes the size rules of the anti-pad, the processing rules of the non-functional pad, etc.

[0093] Next, combine Figure 3 , describes the process of obtaining an inspection request. Figure 3 A schematic diagram of the process of obtaining an inspection request provided in an embodiment of the present application. Figure 3 , including interface 301 and interface 302. Interface 301 and interface 302 may be pages provided by the terminal device. Referring to interface 301, the user may click an icon corresponding to the check application in the terminal device. The terminal device displays an operation page in response to the user's click operation. The operation page includes a drop-down selection menu corresponding to at least one design rule file, and a text input box.

[0094] Referring to interface 302, the user determines that the PCB to be checked is PCB1, and determines that the design rule file corresponding to PCB1 is file A1 in the drop-down selection menu corresponding to design rule file 1, and clicks the confirmation icon. The terminal device generates an inspection request in response to the user's input selection operation. The inspection request includes the design rule file A1 corresponding to the PCB1 to be checked.

[0095] S202: Determine at least one first signal and a pad structure corresponding to each first signal in the PCB according to the design rule file.

[0096] The signal type of the first signal is a preset type.

[0097] The preset type may be a high frequency and high speed type. The preset type may be set in advance and stored in a preset storage space of the terminal device.

[0098] If the signal type of the first signal is a high-frequency and high-speed type, it can be determined that the first signal is a high-speed signal or a high-frequency signal. For example, the first signal can be a PCIe signal, a Universal Serial Bus (USB) signal, a differential clock signal, a double data rate (DDR) signal, etc.

[0099] If the pad structure in the PCB can transmit the first signal, it can be determined that the pad structure is the pad structure corresponding to the first signal. The pad structure can be an anti-pad structure or a non-functional pad structure.

[0100] At least one first signal may be determined according to the design rule file and the preset type, and a pad structure for transmitting each first signal in the PCB may be determined according to the design rule file.

[0101] For example, according to the above example, the PCB to be checked is determined to be PCB1, and the design rule file is file A1. The terminal device determines at least one first signal in the PCB according to the preset type, and determines the pad structure of each first signal according to file A1, which can be specifically shown in Table 1:

[0102] Table 1

[0103]

[0104] S203 . According to the design rule file, check and process the pad structure corresponding to each first signal to obtain a first check result corresponding to each pad structure.

[0105] The pad structure corresponding to each first signal can be inspected and processed according to the design rule file to obtain the first inspection result corresponding to each pad structure in the following manner: determine the structural type of the pad structure corresponding to the first signal; if the structural type is an anti-pad type, then according to the design rule file, inspect and process the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure to obtain the first inspection result corresponding to the pad structure; if the structural type is a non-functional type, then according to the design rule file, inspect and process the pad structure to obtain the first inspection result corresponding to the pad structure.

[0106] According to the structural type of the pad structure, the pad structure is inspected and processed accordingly, thereby improving the accuracy of the inspection.

[0107] In a multi-layer PCB, the layer-changing via is an important node for the signal to go from one layer to another. It is necessary to set an anti-pad to adjust the signal impedance and ensure signal integrity. For the anti-pad type pad structure, according to the layer-changing via position of each first signal, determine whether the anti-pad of each via exists, and check whether its size and position meet the requirements of the design rule file.

[0108] There may usually be traces or power layers under the pins of surface mount pads, which need to be hollowed out to adjust impedance and ensure signal integrity. For surface mount pads, it is necessary to determine whether there is an area in the pin area of ​​the surface mount pad that does not include any devices (that is, whether there is a hollowed-out area in the pin area) to determine whether it meets the requirements in the design rule file.

[0109] In some scenarios, retaining non-functional pads can increase the parasitic capacitance of the system, thereby reducing the impedance of the signal. Retaining inner non-functional pads is a supplement to the anti-pad adjustment. In this way, the impedance can be adjusted to ensure signal integrity.

[0110] In some scenarios, removing non-functional pads can reduce parasitic effects. Especially in the process of high-speed signal transmission, removing surface non-functional pads can optimize the signal path, reduce signal stub interference, and improve signal integrity. For non-functional pad structures, it is necessary to determine whether to retain them based on the design rule file.

[0111] For example, according to the multiple pad structures shown in Table 1 above. For pad structure A1, it is determined that pad structure A1 is an anti-pad type, and the via position of pad structure A1 in PCB is determined. The terminal device determines that the size and position of pad structure A1 meet the requirements in file A1. Therefore, the terminal device determines that the first inspection result corresponding to pad structure A1 is that the design of pad structure A1 meets file A1. For pad structure A2, it is determined that pad structure A2 is a non-functional type. According to file A1, the terminal device determines that pad structure A2 needs to be retained. Therefore, the terminal device determines that the first inspection result corresponding to pad structure A2 is used to indicate that pad structure A2 is retained. For pad structure A3, it is determined that pad structure A3 is an anti-pad type, and the via position of pad structure A3 in PCB is determined. The terminal device determines that the size and position of pad structure A3 meet the requirements in file A3. Therefore, the terminal device determines that the first inspection result corresponding to pad structure A3 is that the design of pad structure A3 meets file A1.

[0112] S204: Determine that the PCB inspection result corresponding to the inspection request includes a first inspection result corresponding to each pad structure.

[0113] After the inspection results are determined, the inspection results can be displayed through the terminal device and stored according to the preset path. The user can make further adjustments based on the inspection results.

[0114] For example, according to the above example, the PCB inspection result corresponding to the inspection request may be specifically as shown in Table 2:

[0115] Table 2

[0116]

[0117] The terminal device can display the inspection results shown in Table 2 for the user to view.

[0118] The printed circuit board inspection method provided in the embodiment of the present application obtains an inspection request. According to the design rule file, at least one first signal and the pad structure corresponding to each first signal in the PCB are determined. According to the design rule file, the pad structure corresponding to each first signal is inspected and processed to obtain the first inspection result corresponding to each pad structure. It is determined that the PCB inspection result corresponding to the inspection request includes the first inspection result corresponding to each pad structure. In the above process, the pad structure corresponding to each first signal can be automatically inspected and processed according to the design rule file corresponding to the PCB, and the first inspection result of each pad structure is obtained, thereby obtaining the PCB inspection result. It avoids the possibility of errors or omissions in manual inspection, and improves the accuracy of PCB inspection.

[0119] Based on any of the above embodiments, Figure 4 , the detailed process of printed circuit board inspection is explained.

[0120] Figure 4 A flow chart of another printed circuit board inspection method provided in an embodiment of the present application. Figure 4 , the method comprising:

[0121] S401: Get an inspection request.

[0122] It should be noted that the execution process of S401 can refer to S201 and will not be repeated here.

[0123] S402: Determine at least one first signal and a pad structure corresponding to each first signal in the PCB according to the design rule file.

[0124] At least one first signal may be determined based on a signal identifier, a name, and the like.

[0125] At least one first signal is determined, and a pad structure corresponding to the first signal is checked to avoid signal integrity problems caused by PCB design defects and ensure transmission quality of the high-speed signal (first signal).

[0126] S403: Determine the structure type of the pad structure corresponding to the first signal.

[0127] The structure type of the pad structure corresponding to the first signal may be determined according to the design rule file.

[0128] For example, the structure type of the pad structure corresponding to the first signal may be specifically as shown in Table 3:

[0129] Table 3

[0130]

[0131] S404: If the structure type is an anti-pad type, determine whether the pad structure is at a via position of the PCB.

[0132] If the first position of the pad structure in the PCB matches the via position in the design rule file, the pad structure is determined to be at the via position of the PCB. If the first position of the pad structure in the PCB does not match the via position in the design rule file, it is determined that the pad structure is not at the via position of the PCB.

[0133] If there is no corresponding pad structure at the via position in the design rule file, it is determined that there is no pad structure at the via position of the PCB. At this time, a prompt message needs to be generated, indicating that there needs to be a pad structure of the anti-pad type at the via position.

[0134] For example, according to the above example, the first position of the pad structure of each anti-pad type may be determined as shown in Table 4:

[0135] Table 4

[0136]

[0137] Assume that in the design rule file, the via positions are position B1, position B2, and position B5. According to the first position shown in Table 4, it can be determined that the pad structure B1 and the pad structure B2 are at the via position, and the pad structure B4 is not at the via position. There is no pad structure at position B5 in the design rule file. Therefore, the terminal device generates a prompt message indicating that there needs to be a pad structure of the anti-pad type at position B5.

[0138] S405: If yes, then obtain the target size corresponding to the pad structure in the design rule file.

[0139] For example, according to the above example, the via positions of the pad structure B1 and the pad structure B2 on the PCB are determined. At this time, the terminal device obtains the target size corresponding to the pad structure as size B.

[0140] S406 , inspecting the pad structure according to the target size corresponding to the pad structure to obtain a first inspection result.

[0141] The pad structure may be inspected and processed according to the target size and position information corresponding to the pad structure to obtain a first inspection result in the following manner: a first size of the pad structure is determined; if the first size matches the target size, then the first inspection result is determined to indicate that the pad structure design complies with the design rule file; if the first size does not match the target size, then the first inspection result is determined to include the target size corresponding to the pad structure in the design rule file.

[0142] When it is found that the pad structure of the anti-pad type is missing or does not meet the design rules, the corresponding anti-pad can be automatically generated and corrected to ensure that the quality of the PCB design meets the requirements of high-speed signal transmission and improve the reliability and stability of the PCB design.

[0143] For example, according to the above example, the via positions of pad structure B1 and pad structure B2 on the PCB are determined. The size of pad structure B1 is size A, and the size of pad structure B2 is size B. For pad structure B1, it can be determined that the first size does not match the target size, and then it can be determined that the first inspection result corresponding to pad structure B1 includes the target size B corresponding to pad structure B1 in the design rule file. For pad structure B2, it can be determined that the first size matches the target size, and then it can be determined that the first inspection result corresponding to pad structure B2 is used to indicate that the design of pad structure B2 complies with the design rule file.

[0144] S407: If not, determine whether the pad structure is on the surface of the PCB.

[0145] If the structure type of the pad structure is an anti-pad type, and the pad structure is not at a via position of the PCB, it can be determined whether the pad structure is at a surface position of the PCB.

[0146] S408 , inspecting the pad structure according to whether the pad structure is on the surface of the PCB and the design rule file to obtain a first inspection result.

[0147] The pad structure can be inspected and processed according to whether the pad structure is on the surface of the PCB and the design rule file in the following manner to obtain a first inspection result: if the pad structure is on the surface of the PCB, then in the design rule file, the pin area information corresponding to the pad structure is obtained, and the pin area information is used to indicate that there is no device in the pin area of ​​the pad structure, and the pin area is the area below the pin of the pad structure. According to the design rule file, a preset volume is obtained; if there is no device in the pin area of ​​the pad structure, and the area of ​​the pin area is the preset volume, then it is determined that the first inspection result is used to indicate that the pad structure design complies with the design rule file; if there is a device in the pin area of ​​the pad structure, and / or the area of ​​the pin area is not the preset volume, then it is determined that the first inspection result includes the position and preset area of ​​the pin area.

[0148] If the pin area in the PCB design does not exist or does not meet the requirements, the appropriate pin area can be automatically generated according to the design rule file to ensure that the signal transmission performance is not affected.

[0149] For example, according to the above example, it is determined that the pad structure B4 is not at the via position. Therefore, the terminal device determines the surface position of the pad structure B4 on the PCB. At this time, the terminal device obtains the pin area information corresponding to the pad structure B4 in the design rule file, and obtains the preset volume as volume B. The terminal device determines that there is no device in the pin area of ​​the pad structure B4, and the volume of the pin area is volume B. Therefore, the terminal device determines that the first inspection result corresponding to the pad structure B4 is used to indicate that the design of the pad structure B4 complies with the design rule file.

[0150] S409: If the structure type is a non-functional type, the pad structure is inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure.

[0151] The pad structure can be inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure in the following manner: in the design rule file, the indication information corresponding to the non-functional pad is determined; if the indication information corresponding to the non-functional pad is used to indicate retaining the pad structure, then the first inspection result is determined to indicate retaining the pad structure; if the indication information corresponding to the non-functional pad is used to indicate removing the pad structure, then the first inspection result is determined to indicate removing the pad structure.

[0152] It can automatically obtain the indication information in the design rule file, and mark and process the non-functional pad structure accordingly according to the indication information, so that the PCB design can adapt to different manufacturing process requirements and improve the compatibility of the PCB design with the actual manufacturing process.

[0153] The indication information corresponding to the non-functional pad may be determined according to the field corresponding to the non-functional type in the design rule file.

[0154] For example, according to the above example, the pad structure of the non-functional type is determined to be the pad structure B3. The terminal device obtains the indication information corresponding to the pad structure B3 in the design rule file. And determines that the indication information corresponding to the pad structure B3 is used to indicate the reserved pad structure. Therefore, the terminal device determines that the first inspection result corresponding to the pad structure B3 is used to indicate the reserved pad structure B3.

[0155] S410: Determine that the PCB inspection result corresponding to the inspection request includes a first inspection result corresponding to each pad structure.

[0156] After the inspection results are determined, the photo-painting layer (Artwork) is generated according to the inspection results. The pad adjustment information of the adjusted anti-pad and non-functional pad is added to the photo-painting layer to ensure that the generated photo-painting file is synchronized with the design file to avoid human errors.

[0157] The photolithography files and inspection files can be stored in the terminal device.

[0158] For example, according to the above example, it is determined that the pad structure B4 is not at the via position. The prompt information can be added to the photo drawing layer. Since the first inspection result corresponding to the pad structure B1 includes the target size B corresponding to the pad structure B1 in the design rule file, the first inspection result corresponding to the pad structure B1 can be added to the photo drawing layer.

[0159] It should be noted that the printed circuit board inspection method provided in the embodiment of the present application is mainly aimed at automatically inspecting and optimizing the passive components in each signal path. Through automated inspection and optimization, the design efficiency can be significantly improved, errors can be reduced, and the design requirements of high-speed signal transmission can be met.

[0160] The printed circuit board inspection method provided in the embodiment of the present application obtains an inspection request. According to the design rule file, at least one first signal and the pad structure corresponding to each first signal in the PCB are determined. The structural type of the pad structure corresponding to the first signal is determined. If the structural type is an anti-pad type, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed according to the design rule file to obtain the first inspection result corresponding to the pad structure. If the structural type is a non-functional type, the pad structure is inspected and processed according to the design rule file to obtain the first inspection result corresponding to the pad structure. It is determined that the PCB inspection result corresponding to the inspection request includes the first inspection result corresponding to each pad structure. In the above process, the pad structure corresponding to each first signal can be automatically inspected and processed according to the design rule file corresponding to the PCB to obtain the first inspection result of each pad structure, thereby obtaining the PCB inspection result. It avoids the situation where there may be errors or omissions in manual inspection, and improves the accuracy of PCB inspection. And the automatic PCB inspection result improves the efficiency of PCB inspection compared with manual processing.

[0161] Based on any of the above embodiments, Figure 5 , the process of printed circuit board inspection is illustrated with an example.

[0162] Figure 5 A schematic diagram of the printed circuit board inspection process provided by the embodiment of the present application. Figure 5, including a terminal device 501. The terminal device 501 can be a computer. An inspection tool is provided in the terminal device 501, and the inspection tool can automatically inspect the PCB designed by the user. At least one design rule file is stored in the storage area of ​​the terminal device 501. After the user completes the design of the PCB, the design rule file is generated and stored in the storage area of ​​the terminal device 501. When the PCB needs to be inspected, the user can determine the design rule file in the inspection tool of the terminal device 501, and the inspection tool of the terminal device 501 generates an inspection request in response to the user's input selection operation. The inspection request includes the design rule file C corresponding to the PCB3 to be inspected.

[0163] The inspection tool of the terminal device 501 determines at least one first signal in PCB3 according to the high-speed signal identifier, and determines the pad structure of each first signal according to the file C, and the first position of each pad structure in PCB3 can be specifically shown in Table 5:

[0164] Table 5

[0165]

[0166] The inspection tool of the terminal device 501 determines that in the file C, the via positions are respectively position C1, position C4 and position C7. According to the first position shown in Table 5, the inspection tool of the terminal device 501 can determine that the pad structure C1 and the pad structure C4 are at the via position, and the pad structure C5 is not at the via position. There is no pad structure at position C7 in the design rule file. Therefore, the inspection tool of the terminal device 501 generates a prompt message, and the prompt message indicates that a pad structure of the anti-pad type needs to exist at position C7. The inspection tool of the terminal device 501 obtains the target size corresponding to the pad structure as size C. The inspection tool of the terminal device 501 determines that the first sizes of the pad structure C1 and the pad structure C4 are respectively size C. Therefore, the inspection tool of the terminal device 501 determines that the first size of the pad structure C1 matches the target size, and the first size of the pad structure C4 matches the target size. The inspection tool of terminal device 501 determines that the first inspection result corresponding to pad structure C1 is used to indicate that the design of pad structure C1 complies with file C, and the first inspection result corresponding to pad structure C4 is used to indicate that the design of pad structure C4 complies with file C.

[0167] The inspection tool of the terminal device 501 determines the surface position of the pad structure C5 on the PCB 3. The inspection tool of the terminal device 501 obtains the pin area information corresponding to the pad structure C5 in the file C, and obtains the preset volume as volume C. The inspection tool of the terminal device 501 determines that there is no device in the pin area of ​​the pad structure C5, and the area of ​​the pin area is volume C. Therefore, the inspection tool of the terminal device 501 determines that the first inspection result corresponding to the pad structure C5 is used to indicate that the design of the pad structure C5 complies with the file C.

[0168] As shown in Table 5, the inspection tool of the terminal device 501 determines that the pad structures of the non-functional type are pad structure C2 and pad structure C3. For pad structure C2, the inspection tool of the terminal device 501 obtains the indication information corresponding to pad structure C2 in file C. And it is determined that the indication information corresponding to pad structure C2 is used to indicate that the pad structure is retained. Therefore, the inspection tool of the terminal device 501 determines that the first inspection result corresponding to pad structure C2 is used to indicate that pad structure C2 is retained. For pad structure C3, the inspection tool of the terminal device 501 obtains the indication information corresponding to pad structure C3 in file C. And it is determined that the indication information corresponding to pad structure C3 is used to indicate the removal of the pad structure. Therefore, the inspection tool of the terminal device 501 determines that the first inspection result corresponding to pad structure C3 is used to indicate that pad structure C3 is retained. Based on the above-mentioned multiple first inspection results and prompt information, the inspection result generated by the inspection tool of the terminal device 501 can be specifically shown in Table 6:

[0169] Table 6

[0170]

[0171] The terminal device 501 may display the inspection results shown in Table 6, and store the inspection results shown in Table 6 according to a preset path.

[0172] The printed circuit board inspection process provided by the embodiment of the present application obtains an inspection request. According to the design rule file, at least one first signal and the pad structure corresponding to each first signal in the PCB are determined. The structural type of the pad structure corresponding to the first signal is determined. If the structural type is an anti-pad type, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed according to the design rule file to obtain the first inspection result corresponding to the pad structure. If the structural type is a non-functional type, the pad structure is inspected and processed according to the design rule file to obtain the first inspection result corresponding to the pad structure. It is determined that the PCB inspection result corresponding to the inspection request includes the first inspection result corresponding to each pad structure. In the above process, the pad structure corresponding to each first signal can be automatically inspected and processed according to the design rule file corresponding to the PCB to obtain the first inspection result of each pad structure, thereby obtaining the PCB inspection result. Avoiding the situation where there may be errors or omissions in manual inspection improves the accuracy of PCB inspection. And the automatic PCB inspection result improves the efficiency of PCB inspection compared with manual processing.

[0173] Figure 6 This is a schematic diagram of the structure of the printed circuit board inspection device provided in the embodiment of the present application. Figure 6 , the printed circuit board inspection device 10 may include:

[0174] An acquisition module 11 is used to acquire an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected;

[0175] A first determination module 12 is used to determine at least one first signal and a pad structure corresponding to each first signal in the PCB according to the design rule file, wherein the signal type of the first signal is a preset type;

[0176] A processing module 13, configured to perform inspection processing on the pad structure corresponding to each first signal according to the design rule file, and obtain a first inspection result corresponding to each pad structure;

[0177] The second determining module 14 is configured to determine that the PCB inspection result corresponding to the inspection request includes a first inspection result corresponding to each pad structure.

[0178] In a possible implementation manner, the processing module 13 is specifically used to:

[0179] Determine a structure type of a pad structure corresponding to the first signal;

[0180] If the structure type is an anti-pad type, then according to the design rule file, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed to obtain a first inspection result corresponding to the pad structure;

[0181] If the structure type is a non-functional type, the pad structure is inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure.

[0182] In a possible implementation manner, the processing module 13 is specifically used to:

[0183] Determining whether the pad structure is at a via position of the PCB;

[0184] If yes, obtaining the target size corresponding to the pad structure in the design rule file, and inspecting the pad structure according to the target size corresponding to the pad structure to obtain the first inspection result;

[0185] If not, it is determined whether the pad structure is located on the surface of the PCB, and the pad structure is inspected and processed according to whether the pad structure is located on the surface of the PCB and the design rule file to obtain the first inspection result.

[0186] In a possible implementation manner, the processing module 13 is specifically used to:

[0187] Determining a first size of the pad structure;

[0188] If the first size matches the target size, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file;

[0189] If the first size does not match the target size, it is determined that the first inspection result includes the target size corresponding to the pad structure in the design rule file.

[0190] In a possible implementation manner, the processing module 13 is specifically used to:

[0191] If the pad structure is located on the surface of the PCB, then in the design rule file, the pin area information corresponding to the pad structure is obtained, and the pin area information is used to indicate that there is no device in the pin area of ​​the pad structure, and the pin area is the area below the pin of the pad structure.

[0192] According to the design rule file, obtaining a preset volume;

[0193] If there is no device in the pin region of the pad structure, and the area of ​​the pin region is the preset volume, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file;

[0194] If there is a device in the pin region of the pad structure, and / or the area of ​​the pin region is not the preset volume, it is determined that the first inspection result includes the position of the pin region and the preset area.

[0195] In a possible implementation manner, the processing module 13 is specifically used to:

[0196] In the design rule file, determining indication information corresponding to the non-functional pad;

[0197] If the indication information corresponding to the non-functional pad is used to indicate that the pad structure is to be retained, determining that the first inspection result is used to indicate that the pad structure is to be retained;

[0198] If the indication information corresponding to the non-functional pad is used to instruct removal of the pad structure, it is determined that the first inspection result is used to instruct removal of the pad structure.

[0199] The printed circuit board inspection device provided in the embodiment of the present application can implement the technical solution shown in the above method embodiment, and its implementation principle and beneficial effects are similar, which will not be repeated here.

[0200] Figure 7 This is a schematic diagram of the structure of the terminal device provided in the embodiment of the present application. Figure 7 The terminal device 20 may include: a memory 21 and a processor 22. Exemplarily, the memory 21 and the processor 22 are interconnected via a bus 23.

[0201] The memory 21 is used to store program instructions;

[0202] The processor 22 is used to execute the program instructions stored in the memory, so as to enable the terminal device 20 to execute the method shown in the above method embodiment.

[0203] The data acquisition device provided in the embodiment of the present application can execute the technical solution shown in the above method embodiment, and its implementation principle and beneficial effects are similar, which will not be repeated here.

[0204] An embodiment of the present application provides a computer-readable storage medium, in which computer-executable instructions are stored. When the computer-executable instructions are executed by a processor, they are used to implement the above method.

[0205] The embodiment of the present application may also provide a computer program product, including a computer program, which can implement the above method when executed by a processor.

[0206] All or part of the steps of the above-mentioned method embodiments can be completed by hardware related to program instructions. The above-mentioned program can be stored in a readable memory. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the above-mentioned memory (storage medium) includes: read-only memory (ROM), random access memory (RAM), flash memory, hard disk, solid state drive, magnetic tape, floppy disk, optical disc and any combination thereof.

[0207] The embodiments of the present application are described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processing unit of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processing unit of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0208] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0209] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0210] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

[0211] In the present application, the term "include" and its variations may refer to non-restrictive inclusion; the term "or" and its variations may refer to "and / or". The terms "first", "second", etc. in the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. In the present application, "plurality" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previously associated objects are in an "or" relationship.

Claims

1. A printed circuit board inspection method, characterized in that: include: Obtaining an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected; Determine, according to the design rule file, at least one first signal and a pad structure corresponding to each first signal in the PCB, wherein a signal type of the first signal is a preset type; According to the design rule file, the pad structure corresponding to each first signal is inspected and processed to obtain a first inspection result corresponding to each pad structure; It is determined that the PCB inspection result corresponding to the inspection request includes a first inspection result corresponding to each pad structure.

2. The method according to claim 1, characterized in that For any pad structure; according to the design rule file, the pad structure corresponding to the first signal is inspected and processed to obtain a first inspection result corresponding to the pad structure, including: Determine a structure type of a pad structure corresponding to the first signal; If the structure type is an anti-pad type, then according to the design rule file, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed to obtain a first inspection result corresponding to the pad structure; If the structure type is a non-functional type, the pad structure is inspected and processed according to the design rule file to obtain a first inspection result corresponding to the pad structure.

3. The method according to claim 2, characterized in that According to the design rule file, the position of the pad structure, the size of the pad structure, and the pin area of ​​the pad structure are inspected and processed to obtain a first inspection result corresponding to the pad structure, including: Determining whether the pad structure is at a via position of the PCB; If yes, obtaining the target size corresponding to the pad structure in the design rule file, and inspecting the pad structure according to the target size corresponding to the pad structure to obtain the first inspection result; If not, it is determined whether the pad structure is located on the surface of the PCB, and the pad structure is inspected and processed according to whether the pad structure is located on the surface of the PCB and the design rule file to obtain the first inspection result.

4. The method according to claim 3, characterized in that According to the target size and position information corresponding to the pad structure, the pad structure is inspected and processed to obtain the first inspection result, including: Determining a first size of the pad structure; If the first size matches the target size, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file; If the first size does not match the target size, it is determined that the first inspection result includes the target size corresponding to the pad structure in the design rule file.

5. The method according to claim 3, characterized in that: According to whether the pad structure is located on the surface of the PCB and the design rule file, the pad structure is inspected to obtain the first inspection result, including: If the pad structure is located on the surface of the PCB, then in the design rule file, the pin area information corresponding to the pad structure is obtained, and the pin area information is used to indicate that there is no device in the pin area of ​​the pad structure, and the pin area is the area below the pin of the pad structure. According to the design rule file, obtaining a preset volume; If there is no device in the pin region of the pad structure, and the area of ​​the pin region is the preset volume, determining that the first inspection result is used to indicate that the pad structure design complies with the design rule file; If there is a device in the pin region of the pad structure, and / or the area of ​​the pin region is not the preset volume, it is determined that the first inspection result includes the position of the pin region and the preset area.

6. The method according to claim 2, characterized in that According to the design rule file, the pad structure is inspected and processed to obtain a first inspection result corresponding to the pad structure, including: In the design rule file, determining indication information corresponding to the non-functional pad; If the indication information corresponding to the non-functional pad is used to indicate that the pad structure is to be retained, determining that the first inspection result is used to indicate that the pad structure is to be retained; If the indication information corresponding to the non-functional pad is used to instruct removal of the pad structure, it is determined that the first inspection result is used to instruct removal of the pad structure.

7. A printed circuit board inspection device, characterized in that: The device comprises: An acquisition module is used to acquire an inspection request, wherein the inspection request includes a design rule file corresponding to a printed circuit board PCB to be inspected; A first determination module, configured to determine, according to the design rule file, at least one first signal and a pad structure corresponding to each first signal in the PCB, wherein a signal type of the first signal is a preset type; A processing module, configured to perform inspection processing on the pad structure corresponding to each first signal according to the design rule file, and obtain a first inspection result corresponding to each pad structure; The second determining module is used to determine that the PCB inspection result corresponding to the inspection request includes a first inspection result corresponding to each pad structure.

8. A terminal device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 6.

9. A non-transitory computer-readable storage medium storing computer instructions, characterized in that: in, The computer instructions are used to make a computer execute the method according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the method according to any one of claims 1 to 6 is implemented.

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