Hierarchical layout generation method and device for semiconductor production equipment

Abstract

The invention discloses a hierarchical layout generation method and device for semiconductor production equipment, and the method specifically comprises the steps: obtaining a layout demand of semiconductor production; determining element indexes for hierarchical layout of the semiconductor production equipment, classifying the element indexes, and giving a first class of element indexes and a second class of element indexes; obtaining attribute data of each semiconductor production device, and analyzing a layout level of each semiconductor production device in combination with a pre-constructed element evaluation model; and based on a hierarchical layout strategy, responding to layout level analysis of each semiconductor production device, and completing generation of a hierarchical semiconductor production device layout. According to the method, a qualitative layout scheme designed according to experience is overcome, and the hierarchical layout of the semiconductor production equipment is realized in a hierarchical layout evaluation mode of the production equipment in different links in the semiconductor field by dividing and joining element indexes and matching the layout level and hierarchical layout strategy of the semiconductor equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production equipment layout, and in particular relates to a method and device for generating a hierarchical layout of semiconductor production equipment. Background Art

[0002] The hierarchical layout of industrial production plants and related production equipment is also known as "industrial upstairs". Industrial upstairs can transfer industrial production activities from traditional single-story plants to multi-story or high-rise buildings, accommodating more industrial enterprises on a limited land area, greatly improving land utilization efficiency.

[0003] High-end manufacturing usually requires high-precision production equipment and a good production environment. For example, industries such as electronic information, biomedicine, and precision instruments have high requirements for the temperature, humidity, and cleanliness of the production environment. Multi-story or high-rise buildings can provide a stable production environment through centralized air-conditioning systems and purification equipment, and can also centrally carry out environmental governance and pollution control to better meet these requirements.

[0004] For example, patent CN116862316A provides a method and related equipment for evaluating industrial upstairs models, including obtaining the product process requirements and target industry type of the target industry, and determining the industry safety factor according to the product process requirements, the target industry is the industry that is about to be upstairs; predicting the R&D conditions, production conditions and test conditions according to the industry safety factor and product process requirements; calculating the R&D upstairs floor, production upstairs floor and test upstairs floor respectively through the industry type and R&D conditions, production conditions and test conditions; evaluating the upstairs of the target industry according to the R&D upstairs floor, production upstairs floor and test upstairs floor. This solves the problem of over-reliance on the judge's ability to evaluate industrial upstairs, and the solution has the effect of improving the efficiency and rationality of evaluating industrial upstairs.

[0005] However, in the current semiconductor field, the hierarchical layout of production equipment in different production links still needs to rely on qualitative judgments of empirical design. That is, technicians rely on experience to arrange the production equipment involved in each link of semiconductor production in layers. However, the problems of inconsistent hierarchical judgment standards, low accuracy, and low efficiency of hierarchical layout in the hierarchical layout of production equipment caused by empirical design have always been a problem that has plagued the development of "industrial upgrading" in the semiconductor industry.

[0006] Therefore, how to get rid of the qualitative judgment method and consider the different specifications of production equipment in the production links in the semiconductor field through unified and quantitative analysis to achieve efficient, accurate and standardized hierarchical layout of semiconductor production equipment is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0007] In view of the defects existing in the above-mentioned prior art, the present invention provides a method and device for generating a hierarchical layout of semiconductor production equipment. The hierarchical layout generation method specifically includes: obtaining the layout requirements of semiconductor production; determining the element indicators for hierarchical layout of semiconductor production equipment, and classifying the element indicators to provide a first-class element indicator and a second-class element indicator; obtaining the attribute data of each semiconductor production equipment, combining with the pre-built element evaluation model, analyzing the layout level of each semiconductor production equipment; based on the hierarchical layout strategy, responding to the layout level analysis of each semiconductor production equipment, and completing the generation of the hierarchical semiconductor production equipment layout. The present invention overcomes the qualitative layout scheme designed by experience, connects and matches the layout level of semiconductor equipment with the hierarchical layout strategy through the division of element indicators, and realizes the hierarchical layout of semiconductor production equipment in a hierarchical layout evaluation method of production equipment in different links of the semiconductor field.

[0008] In a first aspect, the present invention provides a method for generating a hierarchical layout of semiconductor production equipment, which specifically comprises the following steps: Obtain layout requirements for semiconductor production; Determine the factor indicators for hierarchical layout of semiconductor production equipment, classify the factor indicators, and provide first-class factor indicators and second-class factor indicators; Acquire attribute data of each semiconductor production equipment, and analyze the layout level of each semiconductor production equipment in combination with a pre-built factor evaluation model; Based on the hierarchical layout strategy, in response to the layout level analysis of each semiconductor production equipment, the generation of the hierarchical semiconductor production equipment layout is completed.

[0009] Furthermore, the layout requirements of semiconductor production specifically include: layout area requirements and supply requirements of semiconductor production.

[0010] Furthermore, the factor indicators for the hierarchical layout of semiconductor production equipment are determined, and the factor indicators are classified to provide first-class factor indicators and second-class factor indicators, including: Based on the layout requirements of semiconductor production, select factor indicators corresponding to the hierarchical layout of semiconductor production equipment; Classify each factor indicator to determine the first-category factor indicators and the second-category factor indicators; among them, the first-category factor indicators are conditional indicators, and the second-category factor indicators are quantitative indicators.

[0011] Furthermore, the attribute data of each semiconductor production equipment is obtained, and the layout level of each semiconductor production equipment is analyzed in combination with the pre-built factor evaluation model, which specifically includes the following steps: Based on the first-class factor indicators and the second-class factor indicators, the attribute parameters of each semiconductor production equipment are determined, which are specifically expressed as follows: ; Where f() is a matching array, E is a collection of element indicators, and P is a collection of attribute parameters of semiconductor production equipment. is the xth first-class factor index, is the yth attribute parameter, is the pth second-class factor index, is the qth attribute parameter, is the first kind of matching function, is the second type of matching function; Determine attribute data matching each semiconductor production equipment in combination with the attribute parameters; The attribute data is calculated and analyzed in a pre-built evaluation model to provide a layout grade for each semiconductor production equipment.

[0012] Furthermore, the construction of the factor evaluation model specifically includes the following steps: Determine the weight coefficient of each second-category factor indicator; Based on the correlation between the indicators of each category two factor, the weight relationship formulas of multiple category two factor indicators are constructed respectively; Based on the weight relationship of each second-class factor indicator, match each first-class factor indicator to form a fusion relationship; The fusion relationship is superimposed to form the factor evaluation relationship and construct the factor evaluation model.

[0013] Furthermore, the attribute data is calculated and analyzed in the pre-built evaluation model to provide the layout level of each semiconductor production equipment, which specifically includes the following steps: Normalizing the attribute data to form normalized attribute data; The normalized attribute data of each semiconductor production equipment is combined with the evaluation model to form an attribute data score; The attribute data scores of each semiconductor production equipment and the preset layout level are matched to determine the layout level results of each semiconductor production equipment.

[0014] Furthermore, based on the hierarchical layout strategy, in response to the layout level analysis of each semiconductor production equipment, the generation of the hierarchical semiconductor production equipment layout is completed, which specifically includes the following steps: Based on the hierarchical layout strategy, the layout level results of each semiconductor production equipment and the level of the hierarchical layout are associated, and the hierarchical label of each semiconductor production equipment is set; According to the hierarchical labels of various semiconductor production equipment, the hierarchical semiconductor production equipment layout is generated.

[0015] Further, the hierarchical layout strategy includes: In combination with the layout requirements of semiconductor production, the semiconductor layout areas to be laid out are divided into levels; Setting layout level thresholds of matched semiconductor production equipment in each divided level; Based on the layout level thresholds of the semiconductor production equipment set at each level, each semiconductor production equipment and the semiconductor layout area are associated.

[0016] Furthermore, based on the layout level thresholds of semiconductor production equipment set at each level, each semiconductor production equipment and semiconductor layout area are associated, specifically including the following steps: Determining candidate hierarchical labels for each semiconductor production equipment based on layout level thresholds of semiconductor production equipment set at each level; Combined with the layout requirements of semiconductor production, determine the connection relationship between semiconductor production equipment and form a semiconductor production equipment connection diagram; Determine the initial hierarchical label of each semiconductor production equipment by combining the candidate hierarchical label of each semiconductor production equipment and the semiconductor production equipment connection diagram; Optimizing the initial hierarchical labels of each semiconductor production equipment until the cumulative similarity threshold requirement is met and the hierarchical labels of each semiconductor production equipment are determined; Associating each semiconductor production equipment and semiconductor layout area based on the hierarchical label of each semiconductor production equipment; Among them, the requirement of satisfying the cumulative similarity threshold is that the cumulative similarity of the initial level labels of each semiconductor production equipment is not greater than the cumulative similarity threshold. The cumulative similarity is specifically expressed as: ; Among them, R is the cumulative similarity, are all possible similar pairs of semiconductor production equipment, m is the total number of similar types of semiconductor production equipment, i is the i-th similar type of semiconductor production equipment, j and k are the j-th and k-th semiconductor production equipment, is the initial level label of the jth and kth semiconductor production equipment, is the indicator function, if , the value is 1, otherwise the value is 0.

[0017] In a second aspect, the present invention further provides a device for generating a hierarchical layout of semiconductor production equipment, which adopts any of the above-mentioned methods for generating a hierarchical layout of semiconductor production equipment, and specifically comprises: A collection unit, used to obtain layout requirements for semiconductor production, and to obtain attribute data of each semiconductor production equipment; An analysis unit, used to determine factor indicators for hierarchical layout of semiconductor production equipment, classify the factor indicators, provide first-class factor indicators and second-class factor indicators, and analyze the layout level of each semiconductor production equipment in combination with a pre-built factor evaluation model; an association unit for responding to layout level analysis of each semiconductor manufacturing equipment based on a hierarchical layout strategy; A generation unit is used to generate a hierarchical semiconductor production equipment layout.

[0018] The present invention provides a method and device for generating a hierarchical layout of semiconductor production equipment, which at least have the following beneficial effects: (1) The present invention overcomes the qualitative layout scheme designed based on experience. By dividing the factor indicators, the layout level of the semiconductor equipment is connected and matched with the hierarchical layout strategy. The hierarchical layout of the semiconductor production equipment is realized by the hierarchical layout evaluation method of the production equipment in different links of the semiconductor field.

[0019] (2) In the factor evaluation model, the fusion relationship is the fusion of the weight relationship of the second-category factor index and the single first-category factor index. The superposition of the fusion relationship is achieved by multiplying the weight relationship of each first-category factor index with the second-category factor index. Therefore, the absolute characteristics of the first-category factor index and the relative specificity of the second-category factor index are fully considered in the factor evaluation model, and the factor evaluation that meets the layout level requirements is given.

[0020] (3) The cumulative similarity can measure the hierarchical accuracy of semiconductor production equipment of similar types in the process of optimizing the hierarchical labels of semiconductor production equipment. Only when the overall setting of the hierarchical labels of each semiconductor production equipment meets the cumulative similarity threshold, the hierarchical labels of the semiconductor production equipment meet the requirements. The best solution is selected from all solutions that meet the cumulative similarity threshold and determined as the label of each semiconductor production equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a process flow of a method for generating a hierarchical layout of semiconductor production equipment provided by the present invention; Figure 2 A schematic diagram of a flow chart of providing a first-class factor index and a second-class factor index in a certain embodiment provided by the present invention; Figure 3 A schematic diagram of a flow chart of analyzing the layout level of each semiconductor production equipment according to an embodiment of the present invention; Figure 4 An example diagram of factor evaluation for a certain embodiment of the present invention; Figure 5 A schematic diagram of a process flow of a hierarchical layout strategy of a certain embodiment provided by the present invention; Figure 6 A schematic diagram of a flow chart of a layout level associated with various semiconductor production equipment according to an embodiment of the present invention; Figure 7 An architectural diagram of a hierarchical layout generation device for semiconductor production equipment provided by the present invention. DETAILED DESCRIPTION

[0022] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0024] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0025] In the current semiconductor field, the standards for "industrial moving up to floors" are still mainly based on qualitative judgment. There is still a lack of hierarchical judgment standards for the hierarchical layout of production equipment in different production links in the semiconductor industry chain, and it is still necessary to rely on experience to design production equipment that can be arranged on different floors.

[0026] Overcoming the qualitative layout plan designed based on experience, through detailed classification of semiconductor production equipment and analysis of each floor in the "industrial building", the layout level of semiconductor production equipment can be connected with the hierarchical layout level of the "industrial building", thereby realizing the hierarchical layout of semiconductor production equipment.

[0027] like Figure 1 As shown, the present invention provides a method for generating a hierarchical layout of semiconductor production equipment, which specifically includes the following steps: Obtain layout requirements for semiconductor production; Determine the factor indicators for hierarchical layout of semiconductor production equipment, classify the factor indicators, and provide first-class factor indicators and second-class factor indicators; Acquire attribute data of each semiconductor production equipment, and analyze the layout level of each semiconductor production equipment in combination with a pre-built factor evaluation model; Based on the hierarchical layout strategy, in response to the layout level analysis of each semiconductor production equipment, the generation of the hierarchical semiconductor production equipment layout is completed.

[0028] The present invention overcomes the qualitative layout scheme designed based on experience, connects and matches the layout level of semiconductor equipment with the strategy of hierarchical layout through the division of factor indicators, and realizes the hierarchical layout of semiconductor production equipment in a hierarchical layout evaluation method of production equipment in different links of the semiconductor field.

[0029] Among them, the layout requirements of semiconductor production specifically include: layout area requirements and supply requirements of semiconductor production.

[0030] The layout area requirements of semiconductor production mainly include environmental requirements, functional zoning requirements, etc. Environmental requirements include carrying capacity, vibration control, fire protection performance, etc. Functional zoning requirements include production area, auxiliary area, power equipment area, logistics and storage area, etc.

[0031] The supply demand of semiconductor production mainly includes the supply demand of raw materials, the supply demand of production equipment, etc. Raw materials include both raw materials of semiconductor products and key auxiliary materials such as necessary chemicals and gases; the supply demand of production equipment includes the index requirements of the required production equipment determined according to the raw materials, environmental requirements, functional zoning requirements, etc.

[0032] By obtaining the above environmental requirements, functional zoning requirements, raw material supply requirements, production equipment supply requirements, etc., the semiconductor production equipment that meets the above requirements can be determined to form a set of semiconductor production equipment to be hierarchically laid out. And the semiconductor production equipment of different specifications in the semiconductor production equipment set is associated, that is, the connection relationship and connection method between each production equipment are determined.

[0033] For example, taking the midstream manufacturing, downstream packaging and testing, and modules in the semiconductor production process as an example, midstream manufacturing mainly involves integrated circuit chip manufacturing, discrete devices, optoelectronic devices, sensor manufacturing, etc., including photolithography equipment, etching equipment, thin film deposition equipment, ion implantation equipment, cleaning equipment, heat treatment equipment, detection and yield testing, etc.; downstream packaging and testing and modules mainly involve traditional packaging and testing and modules, advanced packaging and testing and modules, including thinning machines, dicing machines, placement machines, wire bonding machines, flip-chip machines, etc.

[0034] Through environmental requirements, functional zoning requirements, raw material supply requirements, production equipment supply requirements, etc., we first determine the various production equipment required for midstream manufacturing, downstream packaging and testing, and modules, and determine the specific types and models of various equipment based on the production equipment supply requirements to form a semiconductor production equipment collection. Then, we associate the production equipment reported with different specifications. The principle of association also follows the production requirements and functional zoning requirements of semiconductors. For example, photolithography equipment and etching equipment are close to each other, connected, and coordinated with each other, because the etching process needs to be based on photoresist patterns.

[0035] Based on the semiconductor production equipment set determined above, it is necessary to carry out hierarchical layout of each semiconductor production equipment of different models. First, element indicators should be set according to the own attributes of each semiconductor production equipment and the layout requirements of the above semiconductor production.

[0036] The specific factor indicator setting process, such as Figure 2 As shown, the factor indicators for the hierarchical layout of semiconductor production equipment are determined, and the factor indicators are classified to give the first-class factor indicators and the second-class factor indicators, which specifically include: Based on the layout requirements of semiconductor production, select factor indicators corresponding to the hierarchical layout of semiconductor production equipment; Classify each factor indicator to determine the first-category factor indicators and the second-category factor indicators; among them, the first-category factor indicators are conditional indicators, and the second-category factor indicators are quantitative indicators.

[0037] The first type of factor indicators mainly refer to absolute indicators, which can be called conditional indicators, such as access indicators of national standards and industry standards, and allowable indicators of safety and environmental protection; the second type of factor indicators mainly refer to relative indicators, which can also be called important indicators and quantitative indicators, such as civil engineering indicators used for hierarchical layout (for example, load, micro-vibration, floor height, etc.) and electromechanical indicators for water, electricity and gas matching of different models of semiconductor production equipment (for example, explosion-proof and distance of water, electricity and gas matching equipment).

[0038] Generally speaking, conditional indicators are veto indicators, while quantitative indicators are indicators for evaluating quality. Based on conditional indicators and quantitative indicators, a model for evaluating the layout of semiconductor production equipment can be constructed, thereby giving the layout level of each semiconductor production equipment.

[0039] Specifically, if Figure 3 As shown, the attribute data of each semiconductor production equipment is obtained, and the layout level of each semiconductor production equipment is analyzed by combining the pre-built factor evaluation model, which specifically includes the following steps: Based on the first-class factor indicators and the second-class factor indicators, the attribute parameters of each semiconductor production equipment are determined, which are specifically expressed as follows: ; Among them, f() is the matching array, E is the element index collection, and P is the attribute parameter collection of semiconductor production equipment. is the xth first-class factor index, is the yth attribute parameter, is the pth second-class factor index, is the qth attribute parameter, is the first kind of matching function, is the second type of matching function; Determine attribute data matching each semiconductor production equipment in combination with the attribute parameters; The attribute data is calculated and analyzed in a pre-built evaluation model to provide a layout grade for each semiconductor production equipment.

[0040] The attribute parameters of semiconductor production equipment refer to the performance indicators of semiconductor production equipment. The attribute parameters of the matching semiconductor production equipment are determined by the first-class factor indicators and the second-class factor indicators, that is, the performance indicators of the semiconductor production equipment related to the factor indicators are determined, and the various performance indicators of the determined semiconductor production equipment are matched with the first-class factor indicators and the second-class factor indicators. For example, for the civil engineering indicator-load in the second-class factor indicators, the performance indicators of the semiconductor production equipment that match it include the weight of the semiconductor production equipment; for the civil engineering indicator-microvibration in the second-class factor indicators, the performance indicators of the semiconductor production equipment that match it include the vibration isolation system performance indicators, the production equipment base performance indicators, etc.

[0041] The matching between the attribute parameters of semiconductor production equipment and the first-category factor indicators and the second-category factor indicators can be a one-to-one relationship, or a one-to-many, many-to-one, many-to-many, etc.

[0042] According to the attribute parameters of the matched semiconductor production equipment, attribute data corresponding to the attribute category of each semiconductor production equipment is given, and the attribute data is calculated and analyzed in a pre-built evaluation model to give the layout level of each semiconductor production equipment.

[0043] In one embodiment, if Figure 4 As shown, the different links in semiconductor production (taking midstream manufacturing as an example) are analyzed, and the attribute data corresponding to the attribute parameters of semiconductor production equipment under the first-class factor indicators such as safety and environmental protection and the second-class factor indicators such as load and micro-vibration are given. Of course, the attribute data of different semiconductor production equipment are different, and no specific numerical value is limited here.

[0044] Among them, safety and environmental protection are conditional indicators that must meet the requirements; load and micro-vibration are quantitative indicators. After that, the above attribute data are quantitatively processed. The quantitative processing method can adopt typical quantitative scoring, etc., which is not specifically limited here.

[0045] After obtaining the attribute data of semiconductor production equipment, the attribute data is calculated and analyzed in the pre-built evaluation model. The construction of the factor evaluation model specifically includes the following steps: Determine the weight coefficient of each second-category factor indicator; Based on the correlation between the indicators of each category two factor, the weight relationship formulas of multiple category two factor indicators are constructed respectively; Based on the weight relationship of each second-class factor indicator, match each first-class factor indicator to form a fusion relationship; The fusion relationship is superimposed to form the factor evaluation relationship and construct the factor evaluation model.

[0046] For a certain semiconductor production equipment, the weight coefficients of each second-category factor index involved are generally determined by importance. Different second-category factor indexes have different weight coefficients. The weight relationship formula of the second-category factor index corresponding to the semiconductor production equipment is established based on the correlation between the second-category factor indexes. The weight relationship formula of the second-category factor index is specifically expressed as:

[0047] Among them, S1 is the weight relationship formula of the second-category factor indicators, N is the total number of the second-category factor indicators, is the weight coefficient corresponding to the pth second-class factor index, is the pth second-class factor index.

[0048] In addition, after building the weight relationship formula for the second-category factor indicators of the semiconductor production equipment, it is also necessary to determine the matching first-category factor indicators and form a fusion relationship formula, and then superimpose the fusion relationship formula to form a factor evaluation relationship and obtain a factor evaluation model. The factor evaluation model is specifically expressed as: ; Among them, S is the factor evaluation model, S1 is the weight relationship formula of the two-category factor index, For the continuous multiplication operation, is the xth first-class factor index, M is the total number of first-class factor indexes, Indicates that x is an integer between 1 and M.

[0049] In the factor evaluation model, the fusion relationship is the fusion of the weight relationship of the second-class factor index and the single first-class factor index. The superposition of the fusion relationship is achieved by multiplying the weight relationship of each first-class factor index with the second-class factor index. Therefore, the absolute characteristics of the first-class factor index and the relative specificity of the second-class factor index are fully considered in the factor evaluation model, and the factor evaluation that meets the layout level requirements is given.

[0050] For the hierarchical layout of semiconductor production equipment, it is necessary to match the layout level of each semiconductor production equipment with the strategy of semiconductor hierarchical layout. Specifically, based on the strategy of hierarchical layout, in response to the layout level analysis of each semiconductor production equipment, the generation of hierarchical semiconductor production equipment layout is completed, which specifically includes the following steps: Based on the hierarchical layout strategy, the layout level results of each semiconductor production equipment and the level of the hierarchical layout are associated, and the hierarchical label of each semiconductor production equipment is set; According to the hierarchical labels of various semiconductor production equipment, the hierarchical semiconductor production equipment layout is generated.

[0051] The layout level of each semiconductor production equipment is associated through a hierarchical layout strategy, and each semiconductor production equipment is hierarchically labeled. Finally, the hierarchical layout of each semiconductor production equipment is arranged in sequence according to the hierarchical labels of each semiconductor production equipment, thereby finally realizing the hierarchical layout of semiconductor production equipment.

[0052] like Figure 5 As shown in the figure, the hierarchical layout strategy includes: In combination with the layout requirements of semiconductor production, the semiconductor layout areas to be laid out are divided into levels; Setting layout level thresholds of matched semiconductor production equipment in each divided level; Based on the layout level thresholds of the semiconductor production equipment set at each level, each semiconductor production equipment and the semiconductor layout area are associated.

[0053] In the hierarchical layout strategy, the factors that need to be considered in the hierarchical division of the semiconductor layout area mainly include three aspects: building height, floor height control, and production process restrictions on the corresponding floors.

[0054] Taking a 70m high factory building as an example, the number of floors that can be set is 10, and the height of each floor is divided into gradients, among which the heights of the first and second floors are higher than the third to sixth floors, and the heights of the third to sixth floors are higher than the seventh to tenth floors. In addition, the production functions of each floor are divided, the first to sixth floors are mainly used as production workshops, and the seventh to tenth floors are mainly used for research and development, design and testing. After that, the layout level threshold of the corresponding semiconductor production equipment is set for each floor. For example, the layout level of semiconductor production equipment required for the first and second floors is relatively low, and the layout level threshold set is relatively low. Almost all semiconductor production equipment can be laid out on the first and second floors; the layout level of semiconductor production equipment required for the seventh floor and above is relatively high, and the layout level threshold set is relatively high. Only a small part of the semiconductor production equipment can meet the requirements.

[0055] According to the layout level thresholds of the matching semiconductor production equipment set at each level, the layout level results of each semiconductor production equipment can be associated with the levels of the hierarchical layout, and the hierarchical labels can be set for each semiconductor production equipment.

[0056] Specifically, if Figure 6 As shown, based on the layout level thresholds of semiconductor production equipment set at each level, each semiconductor production equipment and semiconductor layout area are associated, specifically including the following steps: Determining candidate hierarchical labels for each semiconductor production equipment based on layout level thresholds of semiconductor production equipment set at each level; Combined with the layout requirements of semiconductor production, determine the connection relationship between semiconductor production equipment and form a semiconductor production equipment connection diagram; Determine the initial hierarchical label of each semiconductor production equipment by combining the candidate hierarchical label of each semiconductor production equipment and the semiconductor production equipment connection diagram; Optimizing the initial hierarchical labels of each semiconductor production equipment until the cumulative similarity threshold requirement is met and the hierarchical labels of each semiconductor production equipment are determined; Associating each semiconductor production equipment and semiconductor layout area based on the hierarchical label of each semiconductor production equipment; Among them, the requirement of satisfying the cumulative similarity threshold is that the cumulative similarity of the initial level labels of each semiconductor production equipment is not greater than the cumulative similarity threshold. The cumulative similarity is specifically expressed as: ; Among them, R is the cumulative similarity, are all possible similar pairs of semiconductor production equipment, m is the total number of similar types of semiconductor production equipment, i is the i-th similar type of semiconductor production equipment, j and k are the j-th and k-th semiconductor production equipment, is the initial level label of the jth and kth semiconductor production equipment, is the indicator function, if , the value is 1, otherwise the value is 0.

[0057] The layout level results based on the semiconductor production equipment are associated with the corresponding hierarchical layout levels, and a one-to-many situation may occur. For example, if the layout level threshold of the seventh layer is met, the layout level thresholds of the first to sixth layers may also be met at the same time.

[0058] In order to meet the layout requirements of semiconductor production and to rationalize the layout of semiconductor production equipment as much as possible, when associating semiconductor production equipment and semiconductor layout areas, the candidate hierarchical labels and the connection relationship between each semiconductor production equipment are considered at the same time. The optimization is performed on the basis of the initial hierarchical labels, and the most appropriate association scheme is given by accumulating the similarity threshold. Among them, the connection relationship between each semiconductor production equipment mainly refers to the connection of various semiconductor production equipment given to meet the functional zoning requirements and environmental requirements. Here, the semiconductor production equipment to be connected is summarized by the similar types of semiconductor production equipment.

[0059] The cumulative similarity can measure the hierarchical accuracy of semiconductor production equipment of similar types in the process of optimizing the hierarchical labels of semiconductor production equipment. Only when the overall setting of the hierarchical labels of each semiconductor production equipment meets the cumulative similarity threshold, the hierarchical labels of the semiconductor production equipment meet the requirements. The best solution is selected from all solutions that meet the cumulative similarity threshold and determined as the label of each semiconductor production equipment.

[0060] Second, as Figure 7 As shown, the present invention also provides a hierarchical layout generation device for semiconductor production equipment, which adopts any of the above-mentioned hierarchical layout generation methods for semiconductor production equipment, specifically comprising: A collection unit, used to obtain layout requirements for semiconductor production, and to obtain attribute data of each semiconductor production equipment; An analysis unit, used to determine factor indicators for hierarchical layout of semiconductor production equipment, classify the factor indicators, provide first-class factor indicators and second-class factor indicators, and analyze the layout level of each semiconductor production equipment in combination with a pre-built factor evaluation model; an association unit for responding to layout level analysis of each semiconductor manufacturing equipment based on a hierarchical layout strategy; A generation unit is used to generate a hierarchical semiconductor production equipment layout.

[0061] The present invention provides a method and device for generating a hierarchical layout of semiconductor production equipment, which at least have the following beneficial effects: (1) The present invention overcomes the qualitative layout scheme designed based on experience. By dividing the factor indicators, the layout level of the semiconductor equipment is connected and matched with the hierarchical layout strategy. The hierarchical layout of the semiconductor production equipment is realized by the hierarchical layout evaluation method of the production equipment in different links of the semiconductor field.

[0062] (2) In the factor evaluation model, the fusion relationship is the fusion of the weight relationship of the second-category factor index and the single first-category factor index. The superposition of the fusion relationship is achieved by multiplying the weight relationship of each first-category factor index with the second-category factor index. Therefore, the absolute characteristics of the first-category factor index and the relative specificity of the second-category factor index are fully considered in the factor evaluation model, and the factor evaluation that meets the layout level requirements is given.

[0063] (3) The cumulative similarity can measure the hierarchical accuracy of semiconductor production equipment of similar types in the process of optimizing the hierarchical labels of semiconductor production equipment. Only when the overall setting of the hierarchical labels of each semiconductor production equipment meets the cumulative similarity threshold, the hierarchical labels of the semiconductor production equipment meet the requirements. The best solution is selected from all solutions that meet the cumulative similarity threshold and determined as the label of each semiconductor production equipment.

[0064] Although preferred embodiments of the present invention have been described, additional changes and modifications may be made to these embodiments by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for generating a hierarchical layout of semiconductor production equipment, characterized in that: The specific steps include: Obtain layout requirements for semiconductor production; Determine the factor indicators for hierarchical layout of semiconductor production equipment, classify the factor indicators, and provide first-class factor indicators and second-class factor indicators; Acquire attribute data of each semiconductor production equipment, and analyze the layout level of each semiconductor production equipment in combination with a pre-built factor evaluation model; Based on the hierarchical layout strategy, in response to the layout level analysis of each semiconductor production equipment, the generation of the hierarchical semiconductor production equipment layout is completed.

2. The method for generating a hierarchical layout of semiconductor production equipment according to claim 1, characterized in that: The layout requirements of semiconductor production specifically include: layout area requirements and supply requirements of semiconductor production.

3. The method for generating a hierarchical layout of semiconductor production equipment according to claim 1, characterized in that: Determine the factor indicators for the hierarchical layout of semiconductor production equipment, classify the factor indicators, and give the first-class factor indicators and the second-class factor indicators, including: Based on the layout requirements of semiconductor production, select factor indicators corresponding to the hierarchical layout of semiconductor production equipment; Classify each factor indicator to determine the first-category factor indicators and the second-category factor indicators; among them, the first-category factor indicators are conditional indicators, and the second-category factor indicators are quantitative indicators.

4. The method for generating a hierarchical layout of semiconductor production equipment according to claim 3, characterized in that: Obtain the attribute data of each semiconductor production equipment, combine it with the pre-built factor evaluation model, and analyze the layout level of each semiconductor production equipment, which specifically includes the following steps: Based on the first-class factor indicators and the second-class factor indicators, the attribute parameters of each semiconductor production equipment are determined, which are specifically expressed as follows: ； Where f() is a matching array, E is a collection of element indicators, and P is a collection of attribute parameters of semiconductor production equipment. is the xth first-class factor index, is the yth attribute parameter, is the pth second-class factor index, is the qth attribute parameter, is the first kind matching function, is the second type of matching function; Determine attribute data matching each semiconductor production equipment in combination with the attribute parameters; The attribute data is calculated and analyzed in a pre-built evaluation model to provide a layout grade for each semiconductor production equipment.

5. The method for generating a hierarchical layout of semiconductor production equipment according to claim 4, characterized in that: The construction of the factor evaluation model includes the following steps: Determine the weight coefficient of each second-category factor indicator; Based on the correlation between the indicators of each category two factor, the weight relationship formulas of multiple category two factor indicators are constructed respectively; Based on the weight relationship of each second-class factor indicator, match each first-class factor indicator to form a fusion relationship; The fusion relationship is superimposed to form the factor evaluation relationship and construct the factor evaluation model.

6. The method for generating a hierarchical layout of semiconductor production equipment according to claim 5, characterized in that: The attribute data is calculated and analyzed in the pre-built evaluation model to give the layout level of each semiconductor production equipment, which specifically includes the following steps: Normalizing the attribute data to form normalized attribute data; The normalized attribute data of each semiconductor production equipment is combined with the evaluation model to form an attribute data score; The attribute data scores of each semiconductor production equipment and the preset layout level are matched to determine the layout level results of each semiconductor production equipment.

7. The method for generating a hierarchical layout of semiconductor production equipment according to claim 1, characterized in that: Based on the hierarchical layout strategy, in response to the layout level analysis of each semiconductor production equipment, the hierarchical semiconductor production equipment layout is generated, which specifically includes the following steps: Based on the hierarchical layout strategy, the layout level results of each semiconductor production equipment and the level of the hierarchical layout are associated, and the hierarchical label of each semiconductor production equipment is set; According to the hierarchical labels of various semiconductor production equipment, the hierarchical semiconductor production equipment layout is generated.

8. The method for generating a hierarchical layout of semiconductor production equipment according to claim 7, characterized in that: The hierarchical layout strategy includes: In combination with the layout requirements of semiconductor production, the semiconductor layout areas to be laid out are divided into levels; Setting layout level thresholds of matched semiconductor production equipment in each divided level; Based on the layout level thresholds of the semiconductor production equipment set at each level, each semiconductor production equipment and the semiconductor layout area are associated.

9. The method for generating a hierarchical layout of semiconductor production equipment according to claim 8, characterized in that: Based on the layout level thresholds of semiconductor production equipment set at each level, each semiconductor production equipment and semiconductor layout area are associated, specifically including the following steps: Determining candidate hierarchical labels for each semiconductor production equipment based on layout level thresholds of semiconductor production equipment set at each level; Combined with the layout requirements of semiconductor production, determine the connection relationship between semiconductor production equipment and form a semiconductor production equipment connection diagram; Determine the initial hierarchical label of each semiconductor production equipment by combining the candidate hierarchical label of each semiconductor production equipment and the semiconductor production equipment connection diagram; Optimizing the initial hierarchical labels of each semiconductor production equipment until the cumulative similarity threshold requirement is met and the hierarchical labels of each semiconductor production equipment are determined; Associating each semiconductor production equipment and semiconductor layout area based on the hierarchical label of each semiconductor production equipment; Among them, the requirement of satisfying the cumulative similarity threshold is that the cumulative similarity of the initial level labels of each semiconductor production equipment is not greater than the cumulative similarity threshold. The cumulative similarity is specifically expressed as: ; Among them, R is the cumulative similarity, are all possible similar pairs of semiconductor production equipment, m is the total number of similar types of semiconductor production equipment, i is the i-th similar type of semiconductor production equipment, j and k are the j-th and k-th semiconductor production equipment, is the initial level label of the jth and kth semiconductor production equipment, is the indicator function, if , the value is 1, otherwise the value is 0.

10. A hierarchical layout generation device for semiconductor production equipment, characterized in that: A method for generating a hierarchical layout of semiconductor production equipment according to any one of claims 1 to 9 is used, specifically comprising: A collection unit, used to obtain layout requirements for semiconductor production, and to obtain attribute data of each semiconductor production equipment; An analysis unit, used to determine factor indicators for hierarchical layout of semiconductor production equipment, classify the factor indicators, provide first-class factor indicators and second-class factor indicators, and analyze the layout level of each semiconductor production equipment in combination with a pre-built factor evaluation model; an association unit for responding to layout level analysis of each semiconductor manufacturing equipment based on a hierarchical layout strategy; A generation unit is used to generate a hierarchical semiconductor production equipment layout.

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