Chip inductor and production process thereof

Abstract

The application relates to the technical field of electronic components, and particularly discloses a patch inductor and a production process thereof. The patch inductor comprises an I-shaped magnetic core and a winding coil. The I-shaped magnetic core comprises an electrode blade, a middle column and an inscription blade which are sequentially connected. An operating surface is arranged at the end of the electrode blade away from the middle column. An edge of the operating surface is provided with an edge chamfer. A wire slot is concavely arranged on the operating surface. The bottom of the wire slot and the sidewall of the wire slot are connected through a bottom chamfer. The sidewall of the wire slot and the operating surface are connected through a top chamfer. Two electrodes are arranged on the electrode blade, and the electrodes are at least partially arranged in the wire slot. The winding coil comprises an enameled wire wound on the middle column. Two lead ends of the winding coil are connected to the electrode blade and extend into the slot cavity of the wire slot from the bottom of the wire slot. Each lead end is electrically connected to one electrode. The patch inductor is provided with a welding chamfer on the I-shaped magnetic core, which helps to ensure the continuity of the metallization layer on the I-shaped magnetic core and improve the adhesion of the electrode.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, in particular to a patch inductor and a production process thereof. BACKGROUND

[0002] At present, the basic manufacturing process of the coated bottom surface welding power inductor includes the steps of winding (i.e. winding the coil on the magnetic core), welding electrode and coating glue. The magnetic core is the core substrate of the inductor, and its importance is self-evident. The shape of the magnetic core is an I-shaped type, the coil is wound on the core column part, the starting line and the terminal line are led out and hung on the electrode blade of the I-shaped magnetic core, and are combined with the solder through the welding process to form the inductor electrode for SMD patch. However, if the electrode blade of the magnetic core is only a simple plane, a series of problems will be caused. First, it is difficult to firmly fix the coil by hot dip welding only, and the coil may be loose. Second, the coplanarity of the product cannot be guaranteed, especially when the coil wire diameter is thick, the coplanarity problem is more prominent.

[0003] In the prior art, in the process of bottom surface welding power inductor, the design of the magnetic core electrode blade is not completely flat. At the wire hanging position, a wire slot with a certain width and depth is concavely arranged. The wire slot is subjected to a metallization process, the lead wire is hung inside the concave surface, the coil is firmly fixed by hot dip welding, and the bottom surface welding electrode is formed. Although the arrangement of the wire slot solves the problems of coil fixation and coplanarity, it also brings challenges to the continuity of the metallization of the magnetic core. The discontinuity of the metallization may cause uneven distribution of the inductor current, affect the working efficiency of the inductor, and to some extent, weaken the adhesion of the electrode to the base material, and reduce the reliability of the product.

[0004] Therefore, ensuring the continuity of the metallization of the inductor magnetic core is an important problem to be solved in the current manufacturing of coated power inductors. SUMMARY

[0005] The purpose of the present application is to provide a patch inductor and a production process thereof, to realize the optimized design of the I-shaped magnetic core, to form a welding fillet, to help ensure the continuity of the metallization layer on the I-shaped magnetic core, and to increase the welding area of the patch inductor on the PCB and improve the adhesion of the electrode.

[0006] To achieve this purpose, the present application adopts the following technical solutions:

[0007] The patch inductor comprises a I-shaped magnetic core and a winding coil; the I-shaped magnetic core comprises an electrode blade, a middle column and an inscription blade connected in sequence, an operating surface is arranged at an end of the electrode blade away from the middle column, an edge of the operating surface is provided with an edge chamfer, a wire slot is concavely arranged on the operating surface, a bottom of the wire slot and a side wall of the wire slot are connected through a bottom chamfer, the side wall of the wire slot and the operating surface are connected through a top chamfer, two electrodes are arranged on the electrode blade, and the electrodes are at least partially arranged in the wire slot; the winding coil comprises an enameled wire wound on the middle column, two lead ends of the winding coil are connected to the electrode blade and extend into a cavity of the wire slot from the bottom of the wire slot, and each lead end is electrically connected to one electrode.

[0008] As an optional technical solution of the patch inductor, the opening of the wire slot gradually expands in the direction from the bottom of the wire slot to the top of the wire slot, and the included angle between the bottom of the wire slot and the side wall of the wire slot is θ, θ≥135°.

[0009] As an optional technical solution of the patch inductor, the distance between the top of the wire slot and the edge of the operating surface is constant; the radius of the edge chamfer is R1, 0.05mm≤R1

[0010] As an optional technical solution of the patch inductor, the radius of the bottom chamfer is R2, the radius of the top chamfer is R3, and R2=R3.

[0011] As an optional technical solution of the patch inductor, 0.05mm≤R2

[0012] As an optional technical solution of the patch inductor, the wire slot, the operating surface and the side surface of the electrode blade are all provided with a continuous and jointless metallization layer.

[0013] As an optional technical solution of the patch inductor, the material of the I-shaped magnetic core is ferrite.

[0014] The patch inductor production process is used for manufacturing the patch inductor, and comprises the following steps:

[0015] S10: adopting a mold forming method to manufacture the I-shaped magnetic core;

[0016] S20: chamfering the edge of the working surface of the E-shaped core, chamfering the groove bottom and the groove top at the wire slot;

[0017] S30: forming a metallization layer on the groove wall of the wire slot, the working surface and the side surface of the electrode blade;

[0018] S40: mounting a winding coil on the column, tin dipping the groove wall of the wire slot, the working surface and the side surface of the electrode blade, and gluing the surface of the winding coil to form a glue layer.

[0019] As an optional technical solution of the production process of the patch inductor, the metallization layer comprises a first metallization layer, and S30 comprises the following detailed steps:

[0020] S31: preparing a metal paste and an inductor embryo, transferring the metal paste to the inductor embryo, and sintering to solidify the metal paste to form a first metallization layer.

[0021] As an optional technical solution of the production process of the patch inductor, the metallization layer further comprises a second metallization layer and a third metallization layer, the second metallization layer is formed on the first metallization layer, and the third metallization layer is formed on the second metallization layer; the following steps are further included after S31:

[0022] S32: electroplating to form the second metallization layer;

[0023] S33: electroplating to form the third metallization layer.

[0024] The beneficial effects of the present application are as follows:

[0025] The design of the lead terminal inserted into the wire slot of the patch inductor makes the stable connection of the electrode and the winding coil, improves the reliability of the electrical connection, and reduces the failure rate. The configuration of the rounded corner of the slot bottom and the rounded corner of the slot top on the electrode blade can improve the adhesion of the electrode in the wire slot, optimize the connection of the electrode and the winding coil, and ensure the stability of the current transmission. The electrical connection of the electrode and the lead terminal makes the connection between the internal components of the patch inductor more firm, reducing the probability of failure. Moreover, by setting the rounded corner, the rounded corner of the slot bottom and the rounded corner of the slot top, the difficulty of forming the metal layer on the surface of the electrode blade is reduced, the metal layer is not easy to cause virtual welding and has good conductivity, which can improve the discontinuity of the metal layer and improve the reliability of the patch inductor. The structure improvement of the rounded corner helps to increase the welding area of the patch inductor when installed on the external component, and improves the mechanical impact resistance. At the same time, the winding coil provided on the middle column ensures the inductance effect of the patch inductor, combined with the optimization design of the above I-shaped magnetic core structure, excellent inductance performance and higher working efficiency are provided, the efficiency and stability of the patch inductor are effectively improved, and efficient electrical signal conversion and stable inductance performance are realized.

[0026] The production process of the patch inductor forms the I-shaped magnetic core by molding, improves the production efficiency and the quality of the I-shaped magnetic core, and ensures the consistency of the structure. The I-shaped magnetic core is processed with the rounded corner of the edge, the rounded corner of the slot bottom and the rounded corner of the slot top to ensure the smooth surface of the I-shaped magnetic core and reduce the defective rate in production. Through the formation of the multi-layer metal layer, the conductivity and stability of the patch inductor are enhanced. The winding coil is installed on the middle column, the winding coil is coated with glue, and the electrode blade surface is treated with tin immersion in multiple places, which can ensure that the continuous and fault-free bottom and side electrodes are formed on the slot wall, working surface and side surface of the electrode blade, and realize the reliable sealing of the glue layer to the winding coil. The above steps realize efficient and accurate production of the patch inductor, complete the process refinement and product quality improvement, and make the production process more standardized and efficient. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is the cross-sectional view of the patch inductor provided by the embodiment of the present application;

[0028] Figure 2 is the cross-sectional view of the I-shaped magnetic core provided by the embodiment of the present application;

[0029] Figure 3 is Figure 2 the partial enlarged view of A in the middle.

[0030] In the figure:

[0031] 100, I-beam core; 110, electrode blade; 1101, edge chamfer; 111, wire slot; 1111, slot bottom chamfer; 1112, slot top chamfer; 120, center column; 130, printing blade; 200, glue layer; 300, lead end; 400, electrode; 510, first metallization layer; 520, second metallization layer; 530, third metallization layer. DETAILED DESCRIPTION

[0032] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0033] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and moreover, the "above", "above" and "above" of the first feature on the second feature include the first feature above and obliquely above the second feature, or only indicate that the first feature is higher than the second feature in horizontal height. The "below", "below" and "below" of the first feature on the second feature include the first feature below and obliquely below the second feature, or only indicate that the first feature is lower than the second feature in horizontal height.

[0034] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation on the present application.

[0036] like Figures 1 to 3 As shown, this embodiment provides a surface mount inductor, including an I-core 100 and a wound coil. The I-core 100 includes an electrode blade 110, a central column 120, and a printing blade 130 connected in sequence. The end of the electrode blade 110 away from the central column 120 is provided with a working surface. The edge of the working surface is provided with an edge rounded corner 1101. The working surface is recessed with a groove 111. The bottom of the groove 111 and the side wall of the groove 111 transition through the bottom rounded corner 1111. The side wall of the groove 111 and the working surface transition through the top rounded corner 1112. Two electrodes 400 are provided on the electrode blade 110. The electrodes 400 are at least partially placed in the groove 111. The wound coil includes enameled wire wound on the central column 120. The two lead ends 300 of the wound coil pass through the electrode blade 110 and extend from the bottom of the groove 111 into the groove cavity of the groove 111. Each lead end 300 is electrically connected to one electrode 400. Specifically, the lead end 300 is made of copper.

[0037] The surface mount inductor's design, with its lead end 300 inserted into the slot 111, ensures a stable connection between the electrode 400 and the wound coil, improving electrical connection reliability and reducing the failure rate. The rounded corners 1111 at the bottom and 1112 at the top of the slot on the electrode blades 110 enhance the adhesion of the electrode 400 within the slot 111, optimizing the connection between the electrode 400 and the wound coil and ensuring stable current transmission. The electrical connection between the electrode 400 and the lead end 300 further strengthens the connection between the internal components of the surface mount inductor, reducing the probability of failure. Moreover, the rounded corners 1101, 1111 at the bottom, and 1112 at the top reduce the difficulty of forming the metallization layer on the electrode blades 110, reducing the likelihood of cold solder joints and improving conductivity. This addresses the issue of discontinuous metallization layers, contributing to improved reliability. The improved rounded corner structure also increases the soldering area when mounting the surface mount inductor on external components, enhancing its resistance to mechanical shock. Meanwhile, the winding coil on the central column 120 ensures the inductance effect of the surface mount inductor. Combined with the above-mentioned optimized design of the I-core 100 structure, it provides excellent inductance performance and higher operating efficiency, effectively improving the efficiency and stability of the surface mount inductor, and achieving efficient electrical signal conversion and stable inductance performance.

[0038] When the surface mount inductor with excellent continuous metallization layer provided in this embodiment is soldered onto the PCB board, a smooth solder fillet is formed to increase the soldering area of ​​the surface mount inductor on the PCB, thereby significantly enhancing the adhesion of the surface mount inductor to external components and greatly improving its resistance to mechanical shock.

[0039] In the embodiment, the opening of the wire slot 111 gradually expands in the direction from the slot bottom to the slot top of the wire slot 111, and the angle between the slot bottom and the side wall of the wire slot 111 is θ, θ≥135°.

[0040] The wire slot 111 gradually expands in the direction from the slot bottom to the slot top, and the angle θ between the slot bottom and the side wall is ≥135°. The above design simplifies the specific structure of the wire slot 111, reduces the difficulty of arranging the electrode 400 in the wire slot 111, and improves the stability and reliability of the chip inductor. The limitation of the angle between the slot bottom and the side wall can effectively reduce the resistance and improve the heat dissipation performance of the chip inductor, thereby improving the overall service life and stability.

[0041] If the size of the chamfer is too small, the I-beam magnetic core 100 is prone to collapse defects; and if the size is too large, the magnetic path area is reduced, which adversely affects the inductance value of the chip inductor. In addition, each chamfer and other structural elements of the I-beam magnetic core 100 (such as the thickness of the electrode blade 110 and the depth of the wire slot 111) have certain mutual constraints. At the same time, different chamfers also have mutual constraints, which need to be considered comprehensively to ensure the rationality of the overall design.

[0042] Further, the distance from the slot top of the wire slot 111 to the edge of the working surface is equal everywhere; the radius of the edge chamfer 1101 is R1, 0.05 millimeters≤R1<K, wherein K is the smaller one of a and b-R3 / (tanθ / 2), a is the thickness of the electrode blade 110 in the direction perpendicular to the working surface, and b is the distance from the slot top of the wire slot 111 to the edge of the working surface.

[0043] By accurately controlling the thickness of the electrode blade 110, the distance from the slot top of the wire slot 111 to the edge of the working surface, and the radius R1 of the edge chamfer 1101, the smoothness of the working surface is ensured, which can effectively prevent electromagnetic interference, improve the stability of the chip inductor, and enhance the mechanical impact resistance of the chip inductor, thereby realizing the perfect combination of the electrode blade 110 and the working surface, ensuring the efficiency of current transmission, reducing production costs, improving product qualification rate, and prolonging service life. The limitation that the distance from the slot top of the wire slot 111 to the edge of the working surface is equal everywhere ensures the uniformity of the chip inductor. At the same time, the design of the edge chamfer 1101 can effectively reduce stress concentration, thereby improving the durability of the electrode blade 110.

[0044] Exemplarily, the radius of the slot bottom chamfer 1111 is R2, and the radius of the slot top chamfer 1112 is R3, R2=R3.

[0045] By setting the chamfer radius R2 of the groove bottom 1111 and the chamfer radius R3 of the groove top 1112 to be equal, the internal structure of the chip inductor is optimized, the overall structural durability is enhanced, the process consistency and structural symmetry are achieved, the chip inductor overall structure is more compact, the eddy current loss is further reduced, and the operation efficiency and stability of the chip inductor are improved. The above improvements also help to simplify the production process and improve the production efficiency.

[0046] Further, 0.05mm≤R2

[0047] By precisely controlling R2 and R3, the integrity and strength of the internal structure of the wire groove 111 can be ensured, making the design of the wire groove 111 more reasonable, ensuring the performance of the chip inductor, and avoiding technical difficulties in the production process, improving the controllability of production and product quality.

[0048] In this embodiment, the wire groove 111 has a continuous and faultless metallization layer on the groove wall, working surface and electrode blade 110 side surface.

[0049] The continuous and faultless metallization layer covers the I-shaped magnetic core 100 and the wire groove 111, improving the conductivity and stability of the chip inductor, enhancing the durability and corrosion resistance of the chip inductor. At the same time, this process simplifies the production process, improves the production efficiency, and improves the safety performance and service life of the chip inductor.

[0050] Exemplarily, the material of the I-shaped magnetic core 100 is ferrite.

[0051] The I-shaped magnetic core 100 made of ferrite material has high magnetic permeability and stability, which can improve the inductive efficiency and anti-interference ability of the chip inductor, and enhance the reliability and accuracy of the product.

[0052] This embodiment takes a coated power inductor with an I-shaped magnetic core 100 size of 6.00mmx6.00mmx4.50mm, R1=0.10mm, R2=0.10mm, R3=0.10mm and θ=135° as an example, and compares it with a traditional coated inductor. The metallization layer of the traditional coated inductor generally has faults.

[0053] The reliability test project includes terminal strength and mechanical impact test. The terminal strength test condition is that three reflow soldering pretreatments are performed, and the clamp is used to push the terminal in two perpendicular directions with a force of 17.70 N for 59.00-61.00 seconds (the radius of the push head of the clamp is 0.50 mm). The detection result is that the patch inductor provided in the embodiment meets the test requirement, and the traditional coated inductor does not meet the test requirement.

[0054] The mechanical impact test condition is that the following three kinds of half-sine wave impact tests are performed in three groups:

[0055] 1) half-sine wave with a peak acceleration of 100 g and a pulse width of 6.00 ms;

[0056] 2) half-sine wave with a peak acceleration of 2000 g and a pulse width of 0.30 ms;

[0057] 3) half-sine wave with a peak acceleration of 3000 g and a pulse width of 0.30 ms.

[0058] In the XYZ three-dimensional space, the above-mentioned half-sine wave is emitted from six different directions of ±X, ±Y and ±Z. Each group of tests emits three times in each direction, a total of eighteen times.

[0059] The detection result is that the patch inductor provided in the embodiment meets the test requirement, and the traditional coated inductor does not meet the test requirement.

[0060] The patch inductor provided in the embodiment has stronger terminal strength and higher mechanical impact resistance due to the use of the terminal design without faults, thereby showing more stable and reliable performance in actual application.

[0061] The embodiment also provides a patch inductor production process for manufacturing the above-mentioned patch inductor, including the following steps:

[0062] Step one: using a mold forming method to make the I-shaped magnetic core 100.

[0063] Step two: processing the edge chamfer 1101 on the edge of the working surface of the I-shaped magnetic core 100, and processing the groove bottom chamfer 1111 and the groove top chamfer 1112 at the wire slot 111.

[0064] Step three: forming a metallization layer on the groove wall of the wire slot 111, the working surface and the side surface of the electrode blade 110.

[0065] Step four: installing a winding coil on the middle column 120, performing tin immersion treatment on the groove wall of the wire slot 111, the working surface and the side surface of the electrode blade 110, and coating glue on the surface of the winding coil to form a glue layer 200.

[0066] The production process of the patch inductor improves the production efficiency and the quality of the I-shaped magnetic core 100, and guarantees the consistency of the structure. The I-shaped magnetic core 100 is processed to have an edge chamfer 1101, a groove bottom chamfer 1111 and a groove top chamfer 1112, so as to ensure the smooth surface of the I-shaped magnetic core 100 and reduce the defective rate in production. The formation of the multiple metalized layers enhances the conductivity and stability of the patch inductor. The processes of installing the winding coil on the middle column 120, coating the winding coil with glue, and tin immersion treatment on the surface of the electrode blade 110, etc. can ensure the formation of continuous and joint-free bottom surface and side surface electrodes on the groove wall, working surface and side surface of the electrode blade 110, and realize the reliable sealing of the glue layer 200 to the winding coil. The above steps realize efficient and accurate production of the patch inductor, complete the process refinement and product quality improvement, and make the production process more standardized and efficient.

[0067] In the embodiment, the metalized layer includes a first metalized layer 510, and step three includes the following detailed steps: preparing a metal paste and an inductor blank, transferring the metal paste to the inductor blank, and sintering to solidify the metal paste to form the first metalized layer 510.

[0068] Through the detailed steps of preparing a metal paste, transferring and sintering, the first metalized layer 510 is formed in a continuous and joint-free manner. This scheme ensures the bonding force between the metalized layer and the electrode blade 110, so that the metalized layer is more uniform and dense, thereby improving the electrical performance and corrosion resistance of the patch inductor, and ensuring the feasibility of the patch inductor production process and the stability of the product. The above detailed steps not only enhance the electrical conductivity of the patch inductor, but also ensure the close combination between the metalized layers.

[0069] Further, the metalized layer further includes a second metalized layer 520 and a third metalized layer 530, the second metalized layer 520 is formed on the first metalized layer 510, and the third metalized layer 530 is formed on the second metalized layer 520; after sintering to solidify the metal paste to form the first metalized layer 510, the following steps are further included: electroplating to form the second metalized layer 520; and electroplating to form the third metalized layer 530.

[0070] The second metalized layer 520 and the third metalized layer 530 are formed in a continuous and joint-free manner by electroplating. This scheme ensures the bonding force between the metalized layers, and further improves the electrical performance and corrosion resistance of the patch inductor.

[0071] In one implementation of the embodiment, the material of the first metalized layer 510 is silver, and the metal paste is silver paste; the material of the second metalized layer 520 is nickel; and the material of the third metalized layer 530 is tin.

[0072] The first metallization layer 510 is made of silver, has excellent conductivity and oxidation resistance, and plays a role in reducing resistance; the second metallization layer 520 is made of nickel, enhances the overall adhesion and corrosion resistance; the third metallization layer 530 is made of tin, enhances the solderability and reliability of the product, ensures good soldering performance, and optimizes the production process of the surface mount inductor. The selection of different materials for the first metallization layer 510, the second metallization layer 520 and the third metallization layer 530 provides different performance optimization options for the surface mount inductor, so that the surface mount inductor can adapt to different application scenarios.

[0073] In other embodiments of the present embodiment, only the materials of at most two of the first metallization layer 510, the second metallization layer 520 and the third metallization layer 530 are limited.

[0074] Obviously, the above embodiments of the present application are only examples for the purpose of clear illustration, and are not a limitation on the embodiments of the present application. Based on the above description, those skilled in the art can make other different forms of changes or modifications. Here, it is not necessary and impossible to exhaust all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principles of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A chip inductor, characterized by The I-beam core (100) comprises an electrode blade (110), a middle column (120) and an inscription blade (130) connected in sequence, the electrode blade (110) is provided with a working surface at one end away from the middle column (120), the edge of the working surface is provided with an edge chamfer (1101), the working surface is concavely provided with a wire slot (111), the slot bottom of the wire slot (111) and the sidewall of the wire slot (111) are transitioned through a slot bottom chamfer (1111), the sidewall of the wire slot (111) and the working surface are transitioned through a slot top chamfer (1112), the electrode blade (110) is provided with two electrodes (400), and the electrodes (400) are at least partially arranged in the wire slot (111); The wire coil comprises an enameled wire wound on the middle column (120), two lead ends (300) of the wire coil are connected to the electrode blade (110) and extend into the slot cavity of the wire slot (111) from the slot bottom of the wire slot (111), and each lead end (300) is electrically connected to one electrode (400); In the direction from the slot bottom of the wire slot (111) to the slot top of the wire slot (111), the opening of the wire slot (111) gradually expands, and the included angle between the slot bottom of the wire slot (111) and the sidewall of the wire slot (111) is θ, θ≥135°; The distance between the slot top of the wire slot (111) and the edge of the working surface is equal everywhere, the radius of the edge chamfer (1101) is R1, 0.05mm≤R1 The radius of the slot bottom chamfer (1111) is R2, and the radius of the slot top chamfer (1112) is R3, R2=R3.

2. The patch inductor of claim 1, wherein, 0.05mm≤R2 3. The patch inductor of claim 2, wherein, The sidewall of the wire slot (111), the working surface and the side surface of the electrode blade (110) are all provided with a continuous and jointless metallization layer.

4. The patch inductor of claim 1, wherein, The material of the I-beam core (100) is ferrite.

5. The patch inductor according to any one of claims 1-4, wherein, The method comprises the following steps:

6. A process for the production of a patch inductor for the manufacture of a patch inductor according to any one of claims 1 to 5, characterized in that S10: forming the I-beam core (100) by a mold forming method; S20: processing the edge chamfer (1101) at the edge of the working surface of the I-beam core (100) and processing the slot bottom chamfer (1111) and the slot top chamfer (1112) at the wire slot (111); S30: forming a metallization layer on the sidewall of the wire slot (111), the working surface and the side surface of the electrode blade (110); ​ S40: mounting a winding coil on the center column (120), tin-plating the slot wall of the wire slot (111), the working surface and the side surface of the electrode blade (110), and gluing the surface of the winding coil to form a glue layer (200).

7. The patch inductor production process of claim 6, wherein, The metallized layer comprises a first metallized layer (510), and S30 comprises the following detailed steps: S31: preparing a metal paste and an inductor body, transferring the metal paste to the inductor body, and sintering to solidify the metal paste to form the first metallized layer (510).

8. The patch inductor production process of claim 7, wherein, The metallized layer further comprises a second metallized layer (520) and a third metallized layer (530), the second metallized layer (520) is formed on the first metallized layer (510), and the third metallized layer (530) is formed on the second metallized layer (520); and S31 is followed by the following steps: S32: electroplating to form the second metallized layer (520); S33: electroplating to form the third metallized layer (530).

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