Chip packaging device and automatic chip detection device

Abstract

The invention discloses a chip packaging device and an automatic chip detection device. The automatic chip detection device comprises a conveying unit which is at least used for conveying a base, a gland and a chip packaging device to a specified station; the assembling unit is at least used for packaging the chip by the chip packaging device and taking the chip out of the chip packaging device; and the pressure maintaining unit is at least used for applying pressure to the base and / or the gland before and in the packaging process of the chip by the chip packaging device through the assembling unit. According to the automatic chip detection device provided by the invention, automatic packaging and detection of the chip are fully automatically realized, the imaging efficiency and the detection efficiency during chip detection are improved, meanwhile, potential damage and pollution possibly caused to the chip in the chip detection process are also avoided, the detection accuracy is improved, and the detection efficiency is improved. The integration and automation degree of chip detection is improved, and then the cost of chip detection is reduced.

Description

Technical Field

[0001] The present invention particularly relates to a chip packaging device and an automatic chip detection device, belonging to the technical field of chip detection. Background Art

[0002] Biochips are used in research fields such as life sciences and analytical testing due to their advantages of high throughput, parallelism, automation, and low sample consumption. Nucleic acid or protein microarray chips are made by spotting at the bottom of a 96-well plate. The dot size is usually 100 microns to 1 mm, and microscopic imaging through the transparent bottom of the well is a common detection method for such biochips.

[0003] High-density peptide chips synthesized on the surface of silicon wafers using semiconductor technology are characterized by small single peptide sequence dots (usually 1 micron to 100 microns, preferably 5 microns to 20 microns) and high density. Tens to hundreds of thousands of different peptide sequence dots can be synthesized in situ at the bottom of a single well of a 96-well plate. In chips synthesized using semiconductor technology, the area of ​​the chip directly affects the production cost. This means that when producing chips, the area of ​​the chip needs to be fully utilized as much as possible to accommodate more probes with detection indicators per unit area, thereby reducing the cost of a single detection indicator.

[0004] During the detection process, the biochip needs to be loaded into the well plate fixture first, then reacted, and scanned by a microscope to collect signals and form an image. The well plate that holds the chip provides a fixed chip and sealing function during the detection process. Therefore, in order to achieve more efficient detection, a more advanced optical system is needed to improve the magnification and fluorescence collection efficiency.

[0005] Because the silicon wafer is opaque, it cannot be inspected from the back. At present, in the common 96-well plate detection system, detection from the top often faces the problem of difficulty in clear imaging due to insufficient working distance of high-power microscopes, especially for the wells close to the well wall. Due to the influence of surface tension, the liquid surface presents a concave or convex curved surface shape, which will seriously affect the imaging quality of the chip, making it impossible to fully utilize the bottom area of ​​a single well to achieve more indicators. Usually, in this case, the well plate of the chip needs to be disassembled before a fluorescent objective with a higher numerical aperture can be used for detection. Generally, the well plate fixture is manually disassembled by the inspector using a screwdriver. These manual operations are not only cumbersome and cannot be automated, but also easily introduce contamination. Summary of the invention

[0006] The main purpose of the present invention is to provide a chip packaging device and an automatic chip detection device, so as to overcome the deficiencies in the prior art.

[0007] In order to achieve the above-mentioned invention object, the technical solution adopted by the present invention includes:

[0008] In one aspect, the present invention provides a chip packaging device, comprising a base, a pressure cover, and a connecting mechanism, wherein the connecting mechanism is used to connect the base and the pressure cover, the pressure cover has a mounting hole, the connecting mechanism comprises a connecting component and a locking sleeve, a part of the connecting component is movably arranged in the locking sleeve, and the locking sleeve is movably arranged in the mounting hole.

[0009] The connecting component can be moved along a first direction relative to the locking sleeve under the driving of an external force and is detachably connected to the base, and when the connecting component moves along the first direction relative to the locking sleeve, at least a part of the locking sleeve can undergo a recoverable deformation along its own radial direction, the locking sleeve is in close contact with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a fixed combination state, or the locking sleeve is in movably contact or clearance fit with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a separable state.

[0010] Another aspect of the present invention further provides an automated chip detection device, comprising:

[0011] A conveying unit, at least used to convey the base, the pressure cover and the chip packaging device to a designated station;

[0012] an assembling unit, at least used to assemble the base and the pressure cover located at the designated station to form the chip packaging device, and to disassemble the chip packaging device into the base and the pressure cover;

[0013] The pressure-maintaining unit is at least used to apply pressure to the base and / or the pressure cover before and during the fixing process of the base and the pressure cover by the assembling unit, and the pressure can keep the base and the pressure cover in a combined state.

[0014] Compared with the prior art, the advantages of the present invention include: a chip packaging device provided by the present invention is more convenient to disassemble and assemble, has better structural stability, and can realize chip packaging more quickly; and an automatic chip detection device provided by the present invention fully automatically realizes automatic packaging and detection of chips, improves the imaging efficiency and detection efficiency during chip detection, and at the same time, avoids potential damage and contamination to the chip during the chip detection process, improves the accuracy of detection, and improves the integration and automation of chip detection, thereby reducing the cost of chip detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of a chip packaging device provided in a typical implementation case of the present invention;

[0016] Figure 2is a top view of a chip packaging device provided in a typical implementation case of the present invention;

[0017] Figure 3 yes Figure 2 Schematic diagram of the AA section structure;

[0018] Figure 4 It is a structural schematic diagram of a connection mechanism provided in a typical implementation case of the present invention;

[0019] Figure 5 It is a cross-sectional structural schematic diagram of a connection mechanism provided in a typical implementation case of the present invention;

[0020] Figure 6 It is a structural schematic diagram of an automated chip detection device provided in a typical implementation case of the present invention;

[0021] Figure 7 It is a structural schematic diagram of a conveying mechanism and a pressure-maintaining mechanism in an automated chip detection device provided in a typical implementation case of the present invention;

[0022] Figure 8 It is a structural schematic diagram of an assembly unit of an automated chip detection device provided in a typical implementation case of the present invention. DETAILED DESCRIPTION

[0023] In view of the deficiencies in the prior art, the inventor of this case has proposed the technical solution of the present invention after long-term research and extensive practice. The technical solution, its implementation process and principle will be further explained as follows.

[0024] In one aspect, the present invention provides a chip packaging device, comprising a base, a pressure cover, and a connecting mechanism, wherein the connecting mechanism is used to connect the base and the pressure cover, the pressure cover has a mounting hole, the connecting mechanism comprises a connecting component and a locking sleeve, a part of the connecting component is movably arranged in the locking sleeve, and the locking sleeve is movably arranged in the mounting hole.

[0025] The connecting component can be moved along a first direction relative to the locking sleeve under the driving of an external force and is detachably connected to the base, and when the connecting component moves along the first direction relative to the locking sleeve, at least a part of the locking sleeve can undergo a recoverable deformation along its own radial direction, the locking sleeve is in close contact with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a fixed combination state, or the locking sleeve is in movably contact or clearance fit with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a separable state.

[0026] Furthermore, the connecting component can move between a first position and a second position relative to the locking sleeve along a first direction under the driving force of an external force;

[0027] When the connecting component is located at the first position, the connecting component is connected to the base, the locking sleeve has a first radial dimension, the locking sleeve is in close contact with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a fixed combination state; when the connecting component is located at the second position, the connecting component is separated from the base, the locking sleeve has a second radial dimension, the locking sleeve is in active contact or clearance fit with the inner wall of the mounting hole, the locking sleeve and the pressure cover are in a separable state, and the first radial dimension is greater than or equal to the radial dimension of the mounting hole and greater than the second radial dimension.

[0028] Further, the locking sleeve includes an inner sleeve and an outer sleeve, the outer sleeve has a first hole, the inner sleeve has a second hole, the inner sleeve is movably arranged in the first hole, the connecting component is movably arranged in the second hole, the connecting component can move between the first position and the second position along the first direction relative to the outer sleeve together with the inner sleeve, and when the connecting component and the inner sleeve move together relative to the outer sleeve along the first direction, the inner sleeve and the outer sleeve can contact and squeeze each other along their own radial directions, and the outer sleeve can produce a recoverable deformation along its own radial direction when being squeezed.

[0029] Furthermore, the maximum outer diameter of the inner sleeve is greater than the minimum inner diameter of the first hole and smaller than the maximum inner diameter of the first hole.

[0030] Furthermore, the connecting component includes a connecting portion and a first limiting portion, the first limiting portion is fixedly arranged at one end of the connecting portion, the connecting portion can be detachably connected to the base, and the maximum outer diameter of the first limiting portion is larger than the inner diameter of the second channel and larger than the outer diameter of the connecting portion.

[0031] Furthermore, the connecting component is a threaded connecting piece, and the connecting component is connected to the base by a threaded connection.

[0032] Furthermore, the inner annular surface of the outer sleeve is inclined, the outer annular surface of the inner sleeve is inclined, the outer annular surface of the inner sleeve is in movable contact with the inner annular surface of the outer sleeve, the inner sleeve can move along the inner annular surface of the outer sleeve together with the connecting component, the inner annular surface of the outer sleeve encloses the first channel, wherein the outer diameter of the inner sleeve and the inner diameter of the first channel gradually decrease in the direction toward the base.

[0033] Furthermore, the outer sleeve includes at least two deformation parts, at least two of the deformation parts are arranged around the first channel, and there is a gap between two adjacent deformation parts, and the gap is connected to the first channel. When the deformation part contacts the inner sleeve and is squeezed in the radial direction, the deformation part can move in its own radial direction, thereby changing the maximum outer diameter of the outer sleeve.

[0034] Furthermore, the locking sleeve also includes an elastic limiting member, which is sleeved on the outside of the outer sleeve. The outer sleeve can expand and contract along the radial direction of the locking sleeve under the combined force of the pressure between the inner sleeve and the outer sleeve and the elastic force provided by the elastic limiting member.

[0035] Furthermore, the elastic limiting member is correspondingly sleeved on the periphery of the deformation portion of the outer sleeve.

[0036] Furthermore, a limiting groove is provided on the outer ring surface of the outer sleeve, and the elastic limiting member is arranged in the limiting groove.

[0037] Furthermore, a receiving groove is provided on the base, and when the base is combined with the pressure cover, the pressure cover and the receiving groove are enclosed to form a receiving space for accommodating the chip, wherein the receiving groove has an inclined guide surface at the groove mouth and / or the connection between the groove bottom and the groove wall, and the guide surface is inclined from the surrounding edges of the receiving groove to the central area.

[0038] Furthermore, the pressure cover is provided with a plurality of sample adding holes penetrating the pressure cover, and the sample adding holes are communicated with the receiving space.

[0039] Another aspect of the present invention further provides an automated chip detection device, comprising:

[0040] A conveying unit, at least used to convey the base, the pressure cover and the chip packaging device to a designated station;

[0041] an assembling unit, at least used to assemble the base and the pressure cover located at the designated station to form the chip packaging device, and to disassemble the chip packaging device into the base and the pressure cover;

[0042] The pressure-maintaining unit is at least used to apply pressure to the base and / or the pressure cover before and during the fixing process of the base and the pressure cover by the assembling unit, and the pressure can keep the base and the pressure cover in a combined state.

[0043] Furthermore, the conveying unit includes at least one conveying mechanism, which includes a guide rail and at least one carrier, and the carrier is at least used to carry the base, the pressure cover or the chip packaging device. The carrier is movably arranged on the guide rail and can move along the guide rail under the drive of a driving mechanism, and the designated workstation is located on the movement trajectory of the carrier.

[0044] Furthermore, the assembly unit includes a three-dimensional mobile platform, a first manipulator and a second manipulator, the first manipulator and the second manipulator are arranged on the three-dimensional mobile platform, the first manipulator and / or the second manipulator can move along at least one of the X-axis, Y-axis, and Z-axis of a three-dimensional coordinate system under the drive of the three-dimensional mobile platform, the first manipulator can detachably connect the chip, the base, the pressure cover, and the chip packaging device, and the second manipulator can detachably connect to the connecting component and drive the connecting component to move along the first direction.

[0045] Furthermore, the first manipulator has a mechanical clamping structure or a vacuum adsorption structure, and the mechanical clamping structure can grasp the chip, the base, the pressure cover or the chip packaging device by mechanical clamping, and the vacuum adsorption structure can adsorb the chip, the base, the pressure cover or the chip packaging device by negative pressure adsorption.

[0046] Furthermore, the second manipulator has a mechanical clamping structure or a vacuum adsorption structure. The mechanical clamping structure can be fixedly matched with the connecting component by mechanical clamping, and the vacuum adsorption structure can be fixedly matched with the connecting component by negative pressure adsorption. Of course, the second manipulator can also be fixedly matched with the connecting component by mortise and tenon connection, and when the connecting component is a threaded connection, the second manipulator can also rotate around its own axis, thereby driving the connecting component to rotate together, thereby realizing a threaded connection between the connecting component and the base.

[0047] The technical solution, its implementation process and principles, etc. will be further explained below in conjunction with the accompanying drawings and specific implementation cases. Unless otherwise specified, the three-dimensional mobile platform, motor, cylinder, controller, etc. used in the embodiments of the present invention are all known to those skilled in the art and can be purchased commercially. Their specific structures and models are not limited or described herein.

[0048] Example 1

[0049] See also Figure 1-Figure 3A chip packaging device includes a base 110, a pressure cover 120 and a connecting mechanism 130. The base 110 is provided with a receiving groove. The pressure cover 120 can be detachably covered on the base 110 along a first direction. The pressure cover 120 and the receiving groove are enclosed to form a receiving space for accommodating the chip. The connecting mechanism 130 is used to connect the base 110 and the pressure cover 120 to lock the base 110 and the pressure cover 120.

[0050] Specifically, the slot opening and / or the connection between the slot bottom and the slot wall of the receiving slot have an inclined guide surface, which is inclined from the surrounding edges of the receiving slot toward the central area, and the chip can directly slide along the guide surface to the bottom of the receiving slot.

[0051] Specifically, the pressure cover 120 is further provided with a plurality of sample adding holes 1210 penetrating the pressure cover 120 , and the sample adding holes 1210 are connected with the receiving space, wherein the sample adding holes 1210 are used for adding samples.

[0052] Specifically, mounting holes 1220 are provided at the four corners of the pressure cover 120. The mounting holes 1220 are through holes that penetrate the pressure cover 120 along the first direction. The connecting mechanism 130 is provided in the mounting hole 1220. One end of the connecting mechanism 130 extends from the mounting hole 1220 and can be detachably connected to the base 110, thereby realizing the connection and locking of the base 110 and the pressure cover 120.

[0053] Specifically, the connection mechanism 130 is movably disposed in the mounting hole 1220, and the connection mechanism 130 as a whole can be placed in the mounting hole and removed from the mounting hole 1220 along the first direction, wherein at least a part of the connection mechanism 130 can expand along its own radial direction, so that the connection structure 130 is in close contact with the inner wall of the mounting hole 1220 along its own radial direction, so that the connection mechanism 130 as a whole is relatively fixed to the gland 120. It should be noted that when the connection mechanism 130 does not expand, the radial dimension of the connection mechanism 130 is smaller than the radial dimension of the mounting hole 1220, and when the connection mechanism 130 expands, the radial dimension of the connection mechanism 130 is equal to the radial dimension of the mounting hole 1220, and the connection mechanism 130 and the mounting hole 1220 are interference fit, and the radial dimension can be a diameter, etc., and the first direction can be the axial direction of the mounting hole 1220.

[0054] For details, please refer to Figure 3 , Figure 4 and Figure 5The connecting mechanism 130 includes a connecting component 1310 and a locking sleeve. Part of the connecting component 1310 is movably arranged in the locking sleeve, and the locking sleeve is movably arranged in the mounting hole 1220. The connecting component 1310 can move relative to the locking sleeve along a first direction under the driving of an external force and be detachably connected to the base 110. Moreover, when the connecting component 1310 moves relative to the locking sleeve along the first direction, at least a part of the locking sleeve can undergo a recoverable deformation along its own radial direction (mainly expand along the radial direction), and make the locking sleeve closely contact with the inner wall of the mounting hole 1220, so that the locking sleeve and the pressure cover 120 are in a fixed combination state, or the locking sleeve is in movably contact or clearance fit with the inner wall of the mounting hole 1220, and the locking sleeve and the pressure cover 120 are in a separable state.

[0055] It can be understood that when the locking sleeve expands, the locking sleeve and the gland are in a fixed combination state, and when the locking sleeve is not expanded, the locking sleeve and the gland 120 are in a separable state.

[0056] Specifically, the connecting component 1310 can move between a first position and a second position relative to the locking sleeve along a first direction under the driving force of an external force;

[0057] When the connecting component 1310 is located at the first position, the connecting component 1310 is connected to the base 110, the locking sleeve has a first radial dimension, the locking sleeve is in close contact with the inner wall of the mounting hole 1220, and the locking sleeve and the pressure cover 120 are in a fixed combination state; when the connecting component 1310 is located at the second position, the connecting component 1310 is separated from the base 110, the locking sleeve has a second radial dimension, the locking sleeve is in active contact or clearance fit with the inner wall of the mounting hole 1220, the locking sleeve and the pressure cover 120 are in a separable state, and the first radial dimension is greater than or equal to the radial dimension of the mounting hole 1220 and greater than the second radial dimension.

[0058] For more details, please refer to Figure 3-Figure 5 The locking sleeve includes an inner sleeve 1320 and an outer sleeve 1330, the outer sleeve 1330 has a first channel 1331, the inner sleeve 1320 has a second channel, the inner sleeve 1320 is movably arranged in the first channel 1331, and the connecting component 1310 is movably arranged in the second channel. The connecting component 1310 can move between a first position and a second position along a first direction relative to the outer sleeve 1330 together with the inner sleeve 1320, and when the connecting component 1310 and the inner sleeve 1320 move together relative to the outer sleeve 1330 along the first direction, the inner sleeve 1320 and the outer sleeve 1330 can contact and squeeze each other along their own radial directions, and the outer sleeve 1330 can generate a recoverable deformation along its own radial direction when being squeezed.

[0059] Specifically, the maximum outer diameter of the inner sleeve 1320 is larger than the minimum inner diameter of the first channel 1331 but smaller than the maximum inner diameter of the first channel 1331. In this way, when the inner sleeve 1320 moves toward the base 110 along the first direction, the pressure along the radial direction between the inner sleeve 1320 and the outer sleeve 1330 will gradually increase, thereby making the outer sleeve 1330 more firmly contact the mounting hole 1220.

[0060] Specifically, in order to ensure that the inner sleeve 1320 can move together with the connecting component 1310 along the first direction toward the base 110, the connecting component 1310 includes a connecting portion 1311 and a first limiting portion 1312. The first limiting portion 1312 is fixedly arranged at one end of the connecting portion 1311, and the connecting portion 1311 can be detachably connected to the base 110, and the maximum outer diameter of the first limiting portion 1312 is greater than the inner diameter of the second channel and greater than the outer diameter of the connecting portion 1311. A second limiting portion 1321 is also provided on the inner sleeve 1320. The first limiting portion 1312 and the second limiting portion 1321 can conflict with each other along the first direction and form a stop structure to prevent the connecting component 1310 and the inner sleeve 1320 from continuing to move relative to each other along the first direction toward the base 110, thereby allowing the connecting component 1310 and the inner sleeve 1320 to move together as a whole along the first direction toward the base 110.

[0061] Specifically, the connecting component 1310 is a threaded connecting part, and the connecting component 1310 is connected to the base 110 by means of a threaded connection. Correspondingly, the base 110 has a threaded hole matching the connecting component 1310. It can be understood that when the connecting portion 1311 of the connecting component 1310 enters the threaded hole of the base 110 and the connecting component 1310 is screwed, the connecting component 1310 is connected to the base 110, and the connecting component 1310 as a whole moves toward the base 110 along a first direction, thereby driving the inner sleeve 1320 to move together. At this time, the outer sleeve 1330 is squeezed and deformed and presses against the inner wall of the mounting hole 1220 in the radial direction, thereby realizing the fixed combination and locking of the pressure cover and the base.

[0062] Specifically, the inner annular surface of the outer sleeve 1330 is inclined, and the outer annular surface of the inner sleeve 1320 is inclined. The outer annular surface of the inner sleeve 1320 is in movable contact with the inner annular surface of the outer sleeve 1330. The inner sleeve 1320 can move along the inner annular surface of the outer sleeve 1330 together with the connecting component 1310. The inner annular surface of the outer sleeve 1330 encloses a first channel 1331, wherein the outer diameter of the inner sleeve 1320 and the inner diameter of the first channel 1331 gradually decrease in the direction toward the base 110.

[0063] Specifically, the outer sleeve 1330 is an annular component formed by splicing more than two deformable parts, and the more than two deformable parts are movable relative to each other. When there is pressure in the radial direction between the outer sleeve 1330 and the inner sleeve 1320, the limiting part of the outer sleeve 1330 will be squeezed and move in the radial direction away from the inner sleeve 1320, thereby producing the aforementioned expansion. It can be understood that there is a gap 1333 between the more than two deformable parts constituting the outer sleeve 1330, and the gap is connected to the first channel 1331. When the deformable part contacts the inner sleeve 1320 and is squeezed in the radial direction, the deformable part can move in its own radial direction, so that the maximum outer diameter of the outer sleeve 1330 tends to increase.

[0064] It can be understood that the aforementioned inner sleeve and outer sleeve are both annular components.

[0065] Specifically, in order to ensure the stability and integrity of the overall structure of the locking sleeve, the locking sleeve also includes an elastic limiter 1340, which is sleeved on the outside of the outer sleeve 1330. The outer sleeve 1330 can expand and contract in the radial direction of the locking sleeve under the combined force of the pressure between the inner sleeve 1320 and the outer sleeve 1330 and the elastic force provided by the elastic limiter 1340. It can be understood that the elastic limiter 1340 is mainly sleeved on the periphery of the deformation part of the outer sleeve 1330.

[0066] Specifically, a limiting groove 1332 is further provided on the outer ring surface of the sleeve 1330, and an elastic limiting member 1340 is provided in the limiting groove 1332 to limit the position of the elastic limiting member 1340. It can be understood that the elastic limiting member 1340 is an annular elastic ring, such as a rubber ring.

[0067] Specifically, when the chip packaging device is used to fix the chip, the connecting component 1310 is first screwed counterclockwise, and the connecting component 1310 gradually comes out of the threaded hole of the base 110, and the connecting component 1310 and the inner sleeve 1320 move toward the gland 120 along the first direction, and the extrusion force between the inner sleeve 1320 and the outer sleeve 1330 gradually decreases, and the outer sleeve 1330 is tightened by the elastic stopper 1340 until the connecting component 1310 is completely separated from the base 110, at which time the gland 120 and the base 110 can be separated;

[0068] After placing the chip in the receiving groove of the base 110, cover the base 110 with the pressure cover 120 and screw the connecting component 1310 in a clockwise direction. The connecting component 1310 gradually approaches the threaded hole of the base 110 and is threadedly connected with the base 110. The connecting component 1310 and the inner sleeve 1320 move toward the base 110 along a first direction. The extrusion pressure between the inner sleeve 1320 and the outer sleeve 1330 gradually increases. The outer sleeve 1330 is squeezed and expanded by the inner sleeve 1320. The outer sleeve 1330 is fixedly combined with the pressure cover 120. At this time, the pressure cover 120 and the base 110 can be fixed.

[0069] Example 2

[0070] See also Figure 6-Figure 8 , an automated chip inspection device, comprising a conveying unit, an assembling unit, a pressure holding unit and a detection unit, wherein the conveying unit is at least used to convey a base 110, a pressure cover 120 and a chip packaging device to a designated workstation; the assembling unit is at least used to assemble the base 110 and the pressure cover 120 located at the designated workstation to form a chip packaging device, and to disassemble the chip packaging device into the base 110 and the pressure cover 120; the pressure holding unit is at least used to apply pressure to the base 110 and / or the pressure cover 120 before and during the fixing process of the base 110 and the pressure cover 120 by the assembling unit, and the pressure can keep the base 110 and the pressure cover 120 in a combined state; the detection unit is used to detect the chip in the chip packaging device.

[0071] Specifically, the conveying unit includes at least one conveying mechanism, which includes a guide rail 210 and at least one carrier 220. The carrier 220 is used to carry the base 110, the pressure cover 120 or the chip packaging device 100. The carrier 220 is movably arranged on the guide rail 210 and can move along the guide rail 210 under the drive of the driving mechanism. The designated workstation is located on the movement track of the carrier 220. More specifically, a plurality of carriers 220 can be provided, and a plurality of carriers 220 can be arranged on one or more guide rails. The structure of the carrier 220 is not specifically limited here, as long as it can carry the chip packaging device 100. The driving mechanism that drives the carrier 220 to move can be a motor or a cylinder, etc.

[0072] Specifically, the assembly unit includes a three-dimensional mobile platform 310, a first manipulator 320 and a second manipulator 330. The first manipulator 320 and the second manipulator 330 are arranged on the three-dimensional mobile platform 310. The first manipulator 320 and / or the second manipulator 330 can move along at least one of the X-axis, Y-axis, and Z-axis of a three-dimensional coordinate system driven by the three-dimensional mobile platform 310. The first manipulator 320 can detachably connect the chip, the base 110, the pressure cover 120, and the chip packaging device 100 to transfer any one of the chip, the base 110, the pressure cover 120, and the chip packaging device 100 to the carrier of the conveying mechanism, or grab any one of the chip, the base 110, the pressure cover 120, and the chip packaging device 100 located on the carrier. The second manipulator 330 can detachably connect with the connecting component 1310 and drive the connecting component 1310 to move along a first direction, for example, it can perform a screwing action on the connecting component 1310.

[0073] Specifically, the first manipulator 320 may have a mechanical clamping structure or a vacuum adsorption structure. The mechanical clamping structure can grasp the chip, the base 110, the pressure cover 120 or the chip packaging device 100 by mechanical clamping. The vacuum adsorption structure can adsorb the chip, the base 110, the pressure cover 120 or the chip packaging device 100 by negative pressure adsorption.

[0074] It can be understood that the first manipulator 320 can perform mechanical clamping actions or negative pressure adsorption actions. It should be noted that the first manipulator 320 may be known to those skilled in the art and can be purchased commercially, and its specific structure is not limited here.

[0075] Specifically, the second manipulator 330 may have a mechanical clamping structure or a vacuum adsorption structure. The mechanical clamping structure can be fixedly matched with the connecting component 1310 by mechanical clamping, and the vacuum adsorption structure can be fixedly matched with the connecting component 1310 by negative pressure adsorption. Of course, the second manipulator 330 can also be fixedly matched with the connecting component 1310 by mortise and tenon connection, and, when the connecting component 1310 is a threaded connection, the second manipulator 330 can also rotate around its own axis, thereby driving the connecting component 1310 to rotate together, thereby realizing the threaded connection between the connecting component 1310 and the base 110.

[0076] Specifically, the pressure holding unit includes a pressure holding mechanism 400, which is correspondingly arranged at the aforementioned designated workstation. The pressure holding mechanism may include a lifting mechanism and a pressure block. The pressure block is arranged on the lifting mechanism and lifted and lowered along the lifting mechanism. It should be noted that the chip packaging device 100 located at the designated workstation is located on the lifting and lowering trajectory of the pressure block.

[0077] Specifically, the two conveying mechanisms are defined as a first conveying mechanism and a second conveying mechanism. The first conveying mechanism and the second conveying mechanism are arranged in parallel. When the automated chip plate loading operation is implemented and the chip is inspected, the carrier on the first conveying mechanism moves to position 1#, and the first robot places the fixture base on it. The carrier will continue to move to position 2#, and the first robot loads the chip. The carrier returns to position 1#, and the first robot loads the pressure cover. The pressure holding mechanism presses the pressure cover, and the second robot performs an action on the connecting component to lock the pressure cover and the base to form a chip packaging device 100. The carrier moves to position 3#, and the first robot takes out the chip packaging device 100.

[0078] When implementing the automated unloading of the chip well plate, the carrier on the second conveying mechanism moves to position 4#, the first robot puts the chip packaging device 100 in, and the carrier moves to position 5#; the second robot performs an action on the connecting component to loosen the pressure cover and base of the chip packaging device 100, the first robot grabs the pressure cover and places it on the tray, and then grabs the base and the chip and places them in the mobile water tank, waiting for subsequent imaging operations.

[0079] It should be noted that the controller and numerical control program etc. adopted in the present invention may be known to those skilled in the art, and the specific control method etc. are not limited here.

[0080] The chip packaging device provided by the present invention is more convenient to assemble and disassemble, has better structural stability, and can realize chip packaging more quickly. In addition, the automatic chip detection device provided by the present invention can conveniently and reliably realize the fixation and sealing of the chip packaging device, improve the imaging efficiency of chip detection personnel, and increase the integration and automation level of chip detection.

[0081] The present invention provides an automated chip detection device, which fully automatically realizes automatic packaging and detection of chips, improves the imaging efficiency and detection efficiency during chip detection, and at the same time avoids potential damage and contamination to the chip during the chip detection process, improves the accuracy of detection, and improves the integration and automation level of chip detection, thereby reducing the cost of chip detection.

[0082] It should be understood that the above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip packaging device, comprising a base, a pressure cover and a connecting mechanism, wherein the connecting mechanism is used to connect the base and the pressure cover, and is characterized in that: The gland has a mounting hole, the connection mechanism comprises a connecting component and a locking sleeve, a portion of the connecting component is movably arranged in the locking sleeve, and the locking sleeve is movably arranged in the mounting hole. The connecting component can be moved along a first direction relative to the locking sleeve under the driving of an external force and is detachably connected to the base, and when the connecting component moves along the first direction relative to the locking sleeve, at least a part of the locking sleeve can undergo a recoverable deformation along its own radial direction, the locking sleeve is in close contact with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a fixed combination state, or the locking sleeve is in movably contact or clearance fit with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a separable state.

2. The chip packaging device according to claim 1, characterized in that: The connecting component can move between a first position and a second position relative to the locking sleeve along a first direction under the driving force of an external force When the connecting component is located at the first position, the connecting component is connected to the base, the locking sleeve has a first radial dimension, the locking sleeve is in close contact with the inner wall of the mounting hole, and the locking sleeve and the pressure cover are in a fixed combination state; when the connecting component is located at the second position, the connecting component is separated from the base, the locking sleeve has a second radial dimension, the locking sleeve is in active contact or clearance fit with the inner wall of the mounting hole, the locking sleeve and the pressure cover are in a separable state, and the first radial dimension is greater than or equal to the radial dimension of the mounting hole and greater than the second radial dimension.

3. The chip packaging device according to claim 1 or 2, characterized in that: The locking sleeve comprises an inner sleeve and an outer sleeve, the outer sleeve has a first hole, the inner sleeve has a second hole, the inner sleeve is movably arranged in the first hole, the connecting component is movably arranged in the second hole, the connecting component can move relative to the outer sleeve along the first direction between the first position and the second position together with the inner sleeve, and when the connecting component and the inner sleeve move relative to the outer sleeve along the first direction, the inner sleeve and the outer sleeve can contact and squeeze each other along their own radial directions, and the outer sleeve can generate a recoverable deformation along its own radial direction when being squeezed; And / or, the maximum outer diameter of the inner sleeve is greater than the minimum inner diameter of the first channel and smaller than the maximum inner diameter of the first channel.

4. The chip packaging device according to claim 3, characterized in that: The connecting component includes a connecting portion and a first limiting portion, wherein the first limiting portion is fixedly arranged at one end of the connecting portion, the connecting portion can be detachably connected to the base, and the maximum outer diameter of the first limiting portion is greater than the inner diameter of the second hole and greater than the outer diameter of the connecting portion; And / or, the connecting component is a threaded connector, and the connecting component is connected to the base by a threaded connection.

5. The chip packaging device according to claim 3, characterized in that: The inner annular surface of the outer sleeve is inclined, the outer annular surface of the inner sleeve is inclined, the outer annular surface of the inner sleeve is in movable contact with the inner annular surface of the outer sleeve, the inner sleeve can move along the inner annular surface of the outer sleeve together with the connecting component, the inner annular surface of the outer sleeve encloses the first channel, wherein the outer diameter of the inner sleeve and the inner diameter of the first channel gradually decrease in the direction toward the base.

6. The chip packaging device according to claim 3, characterized in that: The outer sleeve includes at least two deformation parts, at least two of the deformation parts are arranged around the first channel, and there is a gap between two adjacent deformation parts, and the gap is connected to the first channel. When the deformation part contacts the inner sleeve and is squeezed in the radial direction, the deformation part can move in its own radial direction, thereby changing the maximum outer diameter of the outer sleeve.

7. The chip packaging device according to claim 6, characterized in that: The locking sleeve further comprises an elastic limiting member, which is sleeved on the outer sleeve, and the outer sleeve can expand and contract along the radial direction of the locking sleeve under the combined force of the pressure between the inner sleeve and the outer sleeve and the elastic force provided by the elastic limiting member; And / or, the elastic limiting member is correspondingly sleeved on the periphery of the deformation portion of the outer sleeve; And / or, a limiting groove is further arranged on the outer ring surface of the outer sleeve, and the elastic limiting member is arranged in the limiting groove.

8. The chip packaging device according to claim 1, characterized in that: The base is provided with a receiving groove, and when the base is combined with the pressure cover, the pressure cover and the receiving groove are enclosed to form a receiving space for accommodating the chip, wherein the groove opening and / or the connection between the groove bottom and the groove wall of the receiving groove have an inclined guide surface, and the guide surface is inclined from the peripheral edge of the receiving groove to the central area; And / or, the pressure cover is further provided with a plurality of sample addition holes penetrating the pressure cover, and the sample addition holes are communicated with the receiving space.

9. An automated chip detection device, used in conjunction with the chip packaging device according to any one of claims 1 to 8, characterized in that: The automatic chip detection device comprises: A conveying unit, at least used to convey the base, the pressure cover and the chip packaging device to a designated station; an assembling unit, at least used to assemble the base and the pressure cover located at the designated station to form the chip packaging device, and to disassemble the chip packaging device into the base and the pressure cover; The pressure-maintaining unit is at least used to apply pressure to the base and / or the pressure cover before and during the fixing process of the base and the pressure cover by the assembling unit, and the pressure can keep the base and the pressure cover in a combined state.

10. The automated chip detection device according to claim 9, characterized in that: The conveying unit includes at least one conveying mechanism, the conveying mechanism includes a guide rail and at least one carrier, the carrier is used to carry at least the base, the pressure cover or the chip packaging device, the carrier is movably arranged on the guide rail, and can move along the guide rail under the drive of the driving mechanism, and the designated station is located on the movement track of the carrier; And / or, the assembly unit includes a three-dimensional mobile platform, a first manipulator and a second manipulator, the first manipulator and the second manipulator are arranged on the three-dimensional mobile platform, the first manipulator and / or the second manipulator can move along at least one of the X-axis, Y-axis, and Z-axis of a three-dimensional coordinate system under the drive of the three-dimensional mobile platform, the first manipulator can detachably connect the chip, the base, the pressure cover, and the chip packaging device, and the second manipulator can detachably connect to the connecting component and drive the connecting component to move along the first direction.

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