A positioning and fixing device for semiconductor device processing

Abstract

The present invention relates to the technical field of semiconductor devices, and specifically to a positioning and fixing device for semiconductor device processing, including an operation box, a rotating cylinder, and a fixing mechanism. In the present invention, the wafer is first positioned by small-area contact with three positioning arc plates, and then the wafer is clamped and fixed by all the fixing arc plates in a large area. First, precise centering and positioning of the wafer are achieved through local contact, which can more finely adjust the position of the wafer and reduce the risk of wafer damage or deformation caused by excessive clamping. The subsequent large-area contact clamping helps to evenly distribute the clamping force to the circumferential edge of the wafer. Secondly, after local contact positioning, the problem of excessive local stress caused by the initial position deviation of the wafer during the clamping and fixing process is reduced. Finally, the adsorption unit is used for adsorption and fixing. In summary, the accuracy of wafer position adjustment and the stability during wafer processing are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and particularly to a positioning and fixing device for semiconductor device processing. Background Art

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor devices. They are usually made of high-purity monocrystalline silicon and are widely used in many fields such as computers, mobile phones, automotive electronics, medical devices, and aviation. The steps of grinding and polishing (or called planarization treatment) during the manufacturing process of wafers are very important, which can remove surface damage, improve flatness, reduce thickness differences, and improve electrical performance. Before this processing, it is necessary to position and fix the semiconductor wafer so that the center of the wafer is at a specified position and is firmly limited to ensure processing accuracy and prevent wafer damage during processing.

[0003] Currently, before processing, the circumferential edge of the wafer is mainly clamped by a fixture to complete the positioning process and the fixing and locking process of the wafer. For the above positioning and fixing process, there are the following problems: After placing the wafer, it is fixed and clamped by direct contact clamping, and at the same time, the positioning of the wafer is completed during the fixed clamping. In this process, due to the uncertain initial placement position of the wafer, if the initial placement position of a local area of the wafer is close to the clamping member, direct clamping is likely to cause the clamping member to come into contact with the local area of the wafer in advance and apply pressure, which is likely to cause over-clamping in the local area of the wafer, resulting in wafer damage or deformation. Secondly, in the above process, when directly clamping under the condition of uncertain initial placement position of the wafer, the overall clamping accuracy of the wafer is relatively low, and it is difficult to control the stability of the wafer during the clamping process. Summary of the Invention

[0004] Based on this, it is necessary to provide a positioning and fixing device for semiconductor device processing, aiming to solve the problems of the above-mentioned prior art.

[0005] The present application provides a positioning and fixing device for semiconductor device processing, including: an operation box, the upper end of the operation box is open, a sealing door for blocking the opening of the operation box is arranged at the upper end of the operation box, a rotating cylinder with a vertical axis is rotatably penetrated through the bottom wall of the inner cavity of the operation box, a circular plate located inside the operation box is fixedly sleeved on the rotating cylinder, and a fixing mechanism is jointly arranged on the rotating cylinder and the circular plate.

[0006] The fixing mechanism includes a positioning arc plate, three groups of circumferentially uniformly distributed positioning components are arranged above the circular plate, the positioning component includes a positioning arc plate and two fixing arc plates located on both sides of the positioning arc plate, the inner arc surfaces of the positioning arc plate and the fixing arc plates face the axis of the rotating cylinder, a driving unit is jointly arranged on the circular plate and the rotating cylinder, and a supporting plate is fixedly arranged on the common lower end surfaces of the two fixing arc plates in the same positioning component.

[0007] The fixing mechanism further includes an adsorption unit for adsorbing and fixing the wafer. The adsorption unit includes an adsorption table. The upper end face of the rotating cylinder is fixedly provided with an adsorption table with a cavity inside. The adsorption table communicates with the inner cavity of the rotating cylinder. A gas pump is fixedly provided on the bottom wall of the inner cavity of the working box.

[0008] According to an advantageous embodiment, the positioning arc plate is L-shaped, and the inner corner area of the positioning arc plate faces the circular plate. The lower end face of the positioning arc plate is flush with the upper end face of the supporting plate. The height of the vertical section of the positioning arc plate, the height of the fixed arc plate are the same as the thickness of the wafer.

[0009] According to an advantageous embodiment, the fixing mechanism further includes a T-shaped frame. The circular plate is fixedly provided with T-shaped frames corresponding to the positioning components one by one. The upper end face of the circular plate is slidably provided with sliding frames corresponding to the T-shaped frames one by one. The sliding frames slide along the corresponding T-shaped frames to between the rotating cylinders. The supporting plate is fixedly provided on the corresponding sliding frames. A supplementary block is slidably arranged up and down between two fixed arc plates within the same positioning component.

[0010] According to an advantageous embodiment, the driving unit includes an L-shaped frame. The L-shaped frame is slidably arranged on the T-shaped frame, and the horizontal section of the L-shaped frame penetrates through the corresponding T-shaped frame and is in the same sliding direction as the corresponding sliding frame. The positioning arc plate is fixedly provided on the end face of the L-shaped frame facing the rotating cylinder. A triangular plate that slides up and down and is located between the circular plate and the bottom of the working box is sleeved on the rotating cylinder. Hinge bars are jointly hinged between the triangular plate and the vertical sections of the three L-shaped frames. A fixed circular plate is rotatably arranged on the lower end face of the triangular plate. The rotating cylinder penetrates through the fixed circular plate. An electric push rod is jointly arranged between the fixed circular plate and the bottom of the working box.

[0011] According to an advantageous embodiment, the horizontal section of the T-shaped frame faces the rotating cylinder. The driving unit further includes a gear. The upper end face of the horizontal section of the T-shaped frame is rotatably provided with a gear through a rotating shaft. Two racks are slidably arranged on the upper end face of the horizontal section of the T-shaped frame along its horizontal direction, and the racks are symmetrically centered on the axis of the rotating shaft. One of the racks on the same T-shaped frame is fixedly connected to two adjacent fixed arc plates through a connecting frame. A driving bar is fixedly arranged on the other rack. A pushing bar for pushing the driving bar is fixedly arranged on the horizontal section of the L-shaped frame. Springs are jointly arranged between the racks and the vertical sections of the T-shaped frames.

[0012] According to an advantageous embodiment, the driving unit further includes a U-shaped frame. The lower end face of the horizontal section of the T-shaped frame is fixedly provided with a U-shaped frame. The U-shaped frame is located between the T-shaped frame and the adjacent sliding frame. A horizontal plate is fixedly arranged on the U-shaped frame. The lower end face of the supplementary block is fixedly provided with a mating block in the shape of an inverted right trapezoid. The inclined surface of the mating block slopes upward from the corresponding T-shaped frame to the direction of the rotating cylinder.

[0013] According to an advantageous embodiment, the height of the mating block is the same as the height of the fixed arc plate, and the upper end surface of the horizontal plate is flush with the lower end of the supplementary block.

[0014] According to an advantageous embodiment, the adsorption unit further includes a rotary jet diverter. The rotary jet diverter sleeved on the rotating cylinder is fixedly arranged on the lower end surface of the fixed circular plate. The rotary jet diverter is communicated with the inner cavity of the rotating cylinder. The rotary jet diverter is connected to an air pump through a first pipeline. A receiving cavity is formed in the supporting plate. The supporting plate and the adsorption table are connected through a second pipeline. The second pipeline connects the receiving cavity and the inner cavity of the adsorption table. A plurality of adsorption holes are formed through the upper end surface of the supporting plate and the upper end surface of the adsorption table.

[0015] According to an advantageous embodiment, a locking unit for locking all the fixed arc plates is arranged on the circular plate. The locking unit includes locking grooves. Locking grooves are formed at the ends of the lower end surfaces of the two fixed arc plates corresponding to the same supporting plate, which are far away from each other. After the adjacent two fixed arc plates are closed, the two corresponding locking grooves together form a locking position. Three fixing cylinders evenly distributed in the circumferential direction are fixedly arranged on the upper end surface of the circular plate. A sliding rod that slides up and down is arranged on the fixing cylinder. A locking block that cooperates with the locking position is fixedly arranged on the upper end surface of the sliding rod.

[0016] According to an advantageous embodiment, a sealing plate is fixedly arranged on the lower end surface of the sliding rod. The fixing cylinder is divided into upper and lower chambers by the sealing plate. The upper chamber of the fixing cylinder is communicated with the inner cavity of the adsorption table through a third pipeline. The lower chamber of the fixing cylinder is communicated with the outside.

[0017] In summary, the present invention includes at least one of the following beneficial effects: First, in the present invention, the wafer is first subjected to small-area contact positioning through three positioning arc plates, and then the wafer is subjected to large-area clamping and fixing through all the fixed arc plates (primary fixing). The precise centering and positioning of the wafer are realized through local contact first, which can more finely adjust the position of the wafer and reduce the risk of wafer damage or deformation caused by excessive clamping. The subsequent large-area contact clamping helps to evenly distribute the clamping force to the circumferential edge of the wafer. Secondly, after local contact positioning, the problem of excessive local stress caused by the initial position deviation of the wafer during the clamping and fixing process is reduced. Finally, the adsorption unit is used for adsorption and fixing (secondary fixing). In summary, the accuracy of wafer position adjustment and the stability during wafer processing are improved.

[0018] Second, after accurately positioning the wafer through initial local area contact in the present invention, and then through the way of large-area contact fixing, the stability and uniformity of clamping are increased, and the movement or deviation of the wafer during the processing is avoided, which affects the processing process.

[0019] III. The supporting plate provided in the present invention supports the wafer at the initial stage of wafer placement. After positioning is completed, the air pump operates to enable the adsorption holes on the adsorption table and the supporting plate to have an adsorption effect on the lower end of the wafer through Pipeline 1 and Pipeline 2, so as to fix and limit the wafer in the up and down directions, improving the stability during subsequent processing.

[0020] IV. In the present invention, the triangular locking of all fixed arc plates is achieved through the upward movement of three locking blocks. Thus, during subsequent processing, all fixed arc plates always lock the wafer tightly, reducing the influence of rotation on the wafer position during processing and improving the stability during processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only the embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0022] Figure 1 Shows a schematic structural diagram of a positioning and fixing device for semiconductor device processing provided according to an embodiment of the present invention.

[0023] Figure 2 Shows a partial cross-sectional structural schematic diagram among the operation box, the circular plate, and the driving unit provided according to an embodiment of the present invention.

[0024] Figure 3 Shows a front view of a partial cross-section among the operation box, the circular plate, and the rotating cylinder provided according to an embodiment of the present invention.

[0025] Figure 4 Shows a partial cross-sectional three-dimensional schematic diagram among the circular plate, the triangular plate, and the fixed arc plate provided according to an embodiment of the present invention.

[0026] Figure 5 Shows a three-dimensional structural schematic diagram among the triangular plate, the supporting plate, and the adsorption table provided according to an embodiment of the present invention.

[0027] Figure 6 Shows a schematic diagram among the L-shaped frame, the T-shaped frame, and the U-shaped frame provided according to an embodiment of the present invention.

[0028] Figure 7 Shows a partial cross-sectional exploded schematic diagram after the fixed arc plate, the positioning arc plate, and the locking block are locked provided according to an embodiment of the present invention.

[0029] Figure 8 Shows provided according to an embodiment of the present invention Figure 7 An enlarged view of part A.

[0030] Among them, the above-mentioned drawings include the following reference numerals: 1, operation box; 2, rotating cylinder; 20, circular plate; 3, fixing mechanism; 30, positioning arc plate; 31, fixing arc plate; 32, T-shaped frame; 320, sliding frame; 321, supplementary block; 33, driving unit; 330, L-shaped frame; 331, triangular plate; 332, hinged bar; 333, fixed circular plate; 334, electric push rod; 335, gear; 336, rack; 337, driving bar; 338, pushing bar; 339, spring; 340, U-shaped frame; 341, horizontal plate; 342, mating block; 35, supporting plate; 36, adsorption unit; 360, adsorption table; 361, air pump; 362, rotary jet diverter; 363, pipeline 1; 364, pipeline 2; 365, adsorption hole; 37, locking unit; 370, locking groove; 371, fixed cylinder; 372, sliding rod; 373, locking block; 374, sealing plate; 375, pipeline 3. Detailed implementation manners

[0031] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention in conjunction with the drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0032] As Figure 1 , Figure 2 and Figure 3 shown, a positioning and fixing device for semiconductor device processing includes: an operation box 1, the upper end of the operation box 1 is open, a sealing door for blocking the opening of the operation box 1 is provided at the upper end of the operation box 1, a rotating cylinder 2 with a vertical axis is rotatably penetrated through the bottom wall of the inner cavity of the operation box 1 (the rotating cylinder 2 is connected to an external motor), a circular plate 20 located inside the operation box 1 is fixedly sleeved on the rotating cylinder 2, and a fixing mechanism 3 is jointly provided on the rotating cylinder 2 and the circular plate 20.

[0033] As Figure 2 , Figure 3 and Figure 4As shown, the fixing mechanism 3 includes a positioning arc plate 30. Above the circular plate 20, there are three sets of circumferentially evenly distributed positioning components. The positioning component includes a positioning arc plate 30 and two fixing arc plates 31 located on both sides of the positioning arc plate 30. The inner arc surfaces of the positioning arc plate 30 and the fixing arc plates 31 face the axis of the rotating cylinder 2. A driving unit 33 is jointly provided on the circular plate 20 and the rotating cylinder 2. When the driving unit 33 operates, the three positioning arc plates 30 approach each other and perform centering operation on the wafer. Then all the fixing arc plates 31 clamp the wafer to form a complete circumferential ring, forming the first-level fixation. On the lower end surfaces of the two fixing arc plates 31 in the same positioning component, a supporting plate 35 is fixedly provided together.

[0034] As Figure 2 , Figure 3 and Figure 4 As shown, the fixing mechanism 3 further includes an adsorption unit 36 for adsorbing and fixing the wafer. The adsorption unit 36 includes an adsorption table 360. The upper end surface of the rotating cylinder 2 is fixedly provided with an adsorption table 360 with a cavity inside. The adsorption table 360 is communicated with the inner cavity of the rotating cylinder 2. A gas pump 361 is fixedly provided on the bottom wall of the inner cavity of the working box 1. When the gas pump 361 operates, the adsorption table 360 adsorbs the centered wafer, forming the second-level fixation.

[0035] It should be noted that before the wafer is processed (such as grinding the upper end surface of the wafer), first place the wafer on the supporting plate 35, close the sealing door, perform centering and fixed clamping on the wafer through the positioning and fixing device in this article, and then process the wafer through the existing processing equipment (not shown in the figure) located in the working box 1.

[0036] The specific implementation process of positioning and fixing the wafer in the above process is as follows: First, place the wafer on the supporting plate 35. The three supporting plates 35 jointly perform preliminary support on the wafer. Then the driving unit 33 operates, causing the three positioning arc plates 30 to approach the rotating cylinder 2 synchronously. Finally, the three positioning arc plates 30 perform preliminary positioning on the wafer, making the axis of the wafer coincide with the axis of the rotating cylinder 2, completing the positioning step. Then, as the driving unit 33 continues to operate, the positioning arc plates 30 move away from the wafer, while the fixing arc plates 31 approach the wafer. Finally, all the fixing arc plates 31 press tightly against the wafer and form a circular fixing frame, completing the first-level fixation of the wafer and exposing the upper end surface (this surface is the processing surface) of the wafer completely, facilitating subsequent processing. Then the gas pump 361 operates, causing the adsorption table 360 to adsorb the wafer, completing the second-level fixation of the wafer. Thus, the positioning and fixing action of the wafer is completed, so as to perform subsequent processing operations.

[0037] As Figure 1 , Figure 4 and Figure 6As shown, the positioning arc plate 30 is L-shaped, and the inner corner area of the positioning arc plate 30 faces the circular plate 20. The lower end surface of the positioning arc plate 30 is flush with the upper end surface of the supporting plate 35. The height of the vertical section of the positioning arc plate 30, the height of the fixed arc plate 31 are the same as the thickness of the wafer.

[0038] During the process of the three positioning arc plates 30 moving closer to the rotating cylinder 2, the inner arc surface of the vertical section of the positioning arc plate 30 gradually contacts and presses against the wafer. The three positioning arc plates 30 cooperate with each other to perform centering operation on the wafer. Finally, the horizontal section of the positioning arc plate 30 moves above the wafer and cooperates with the supporting plate 35 to limit the wafer in the up and down directions, ensuring the stability and accuracy during the centering process. After the centering operation is completed, the positioning arc plate 30 moves away from the wafer, and the horizontal section of the positioning arc plate 30 disengages from the wafer. Subsequently, the inner arc surface of the fixed arc plate 31 presses against the wafer for fixing and locking, avoiding interference from the horizontal section of the positioning arc plate 30 during subsequent processing.

[0039] As Figure 2 、 Figure 4 and Figure 5 shown, the fixing mechanism 3 further includes a T-shaped frame 32. The circular plate 20 is fixedly provided with T-shaped frames 32 corresponding to the positioning components one by one. The upper end surface of the circular plate 20 is slidably provided with sliding frames 320 corresponding to the T-shaped frames 32 one by one. The sliding frames 320 slide along the corresponding T-shaped frames 32 to between the rotating cylinder 2. The supporting plate 35 is fixedly provided on the corresponding sliding frames 320. A supplementary block 321 is slidably arranged up and down between the two fixed arc plates 31 in the same positioning component. When all the fixed arc plates 31 jointly clamp and fix the wafer, the supplementary block 321 moves upward to jointly form a circular fixing frame surrounding the wafer with the fixed arc plates 31. Refer to Figure 7 .

[0040] As Figure 2 、 Figure 3 、 Figure 4 and Figure 5 shown, the driving unit 33 includes an L-shaped frame 330. The L-shaped frame 330 is slidably arranged on the T-shaped frame 32, and the horizontal section of the L-shaped frame 330 penetrates the corresponding T-shaped frame 32 and has the same sliding direction as the corresponding sliding frame 320. The positioning arc plate 30 is fixedly provided on the end surface of the L-shaped frame 330 facing the rotating cylinder 2. A triangular plate 331 is sleeved on the rotating cylinder 2 and slides up and down between the circular plate 20 and the bottom of the working box 1. Hinge bars 332 are jointly hinged between the triangular plate 331 and the vertical sections of the three L-shaped frames 330. A fixed circular plate 333 is rotatably arranged on the lower end surface of the triangular plate 331. The rotating cylinder 2 penetrates the fixed circular plate 333. An electric push rod 334 is jointly arranged between the fixed circular plate 333 and the bottom of the working box 1.

[0041] In the initial state, the fixed arc plate 31 within the same positioning component is located between the positioning arc plate 30 and the corresponding T-shaped frame 32, and at this time, the positioning arc plate 30 does not perform positioning movement. After placing the wafer on the three supporting plates 35, the electric push rod 334 operates to synchronously lower the fixed circular plate 333 and the triangular plate 331. The triangular plate 331 pulls the L-shaped frame 330 through its hinge bar 332, causing the L-shaped frame 330 to drive the positioning arc plate 30 thereon to approach the wafer. Finally, the three positioning arc plates 30 press against the wafer, making the axis of the wafer collinear with the axis of the rotating cylinder 2. At this time, the horizontal section of the positioning arc plate 30 presses above the wafer, keeping the wafer horizontal. Thus, the preliminary positioning process of the wafer is completed.

[0042] As Figure 2 and Figure 5 shown, the horizontal section of the T-shaped frame 32 faces the rotating cylinder 2. The driving unit 33 further includes a gear 335. The upper end surface of the horizontal section of the T-shaped frame 32 is rotatably provided with a gear 335 through a rotating shaft. Two racks 336 are slidably provided on the upper end surface of the horizontal section of the T-shaped frame 32 along its horizontal direction, and the racks 336 are symmetric about the axis of the rotating shaft. One of the racks 336 on the same T-shaped frame 32 is fixedly connected to the adjacent two fixed arc plates 31 through a connecting frame. A driving bar 337 is fixedly provided on the other rack 336. A pushing bar 338 for pushing the driving bar 337 is fixedly provided on the horizontal section of the L-shaped frame 330. A spring 339 is jointly provided between the rack 336 and the vertical section of the T-shaped frame 32.

[0043] During operation, when the preliminary positioning process of the wafer is completed, the electric push rod 334 operates to synchronously raise the fixed circular plate 333 and the triangular plate 331, thereby causing the L-shaped frame 330 to drive the positioning arc plate 30 away from the wafer. As the L-shaped frame 330 continues to move, the positioning arc plate 30 moves out of the area above the corresponding supporting plate 35. Then, the L-shaped frame 330 drives the pushing bar 338 to move and makes the pushing bar 338 contact the driving bar 337, causing the driving bar 337 to drive the corresponding rack 336 to approach the vertical section of the T-shaped frame 32. Through the meshing between the rack 336 and the gear 335, the corresponding other rack 336 moves in a direction away from the vertical section of the T-shaped frame 32, causing the connecting frame to drive the corresponding fixed arc plate 31 and the supporting plate 35 to approach the wafer. Finally, the inner arc surface of the fixed arc plate 31 presses against the circumferential surface of the wafer, completing the first-level fixing action of the wafer. During the above process, the spring 339 deforms. After the subsequent processing operation is completed, the electric push rod 334 operates to reset the triangular plate 331, and the elastic force generated by the deformation of the spring 339 causes the fixed arc plate 31 to reset away from the wafer. Then, the wafer is taken out.

[0044] As Figure 2 and Figure 6As shown, the driving unit 33 further includes a U-shaped frame 340. The lower end surface of the horizontal section of the T-shaped frame 32 is fixedly provided with a U-shaped frame 340. The U-shaped frame 340 is located between the T-shaped frame 32 and the adjacent sliding frame 320. A horizontal plate 341 is fixedly provided on the U-shaped frame 340. The lower end surface of the supplementary block 321 is fixedly provided with a mating block 342 in the shape of an inverted right trapezoid. The inclined surface of the mating block 342 slopes upward from the corresponding T-shaped frame 32 to the direction of the rotating cylinder 2.

[0045] As Figure 6 shown, the height of the mating block 342 is the same as that of the fixed arc plate 31, and the upper end surface of the horizontal plate 341 is flush with the lower end of the supplementary block 321.

[0046] During the process of the connecting frame driving the fixed arc plate 31 and the supporting plate 35 to approach the wafer, as the fixed arc plate 31 continues to move, the fixed arc plate 31 drives the supplementary block 321 and the mating block 342 to move and makes the mating block 342 contact the horizontal plate 341. As the mating block 342 continues to move, the horizontal plate 341 presses the inclined surface of the mating block 342, causing the mating block 342 to drive the supplementary block 321 thereon to move upward. Finally, the lower end surface of the mating block 342 is in close contact with the upper end surface of the horizontal plate 341. At this time, the upper end of the supplementary block 321 is flush with the upper end of the fixed arc plate 31, so that all the supplementary blocks 321 and all the fixed arc plates 31 together form a circular fixing frame.

[0047] After the processing operation is completed, the fixed arc plate 31 resets and moves away from the wafer. The fixed arc plate 31 drives the supplementary block 321 and the mating block 342 to move synchronously. When the supplementary block 321 and the mating block 342 move out of the directly above the horizontal plate 341, the supplementary block 321 and the mating block 342 move downward and reset under their own gravity, avoiding hindering the reset process of the subsequent positioning arc plate 30.

[0048] As Figure 2 、 Figure 3 and Figure 5 shown, the adsorption unit 36 further includes a rotary jet shunt 362 (which is a prior art). The lower end surface of the fixed circular plate 333 is fixedly provided with a rotary jet shunt 362 sleeved on the rotating cylinder 2. The rotary jet shunt 362 is communicated with the inner cavity of the rotating cylinder 2. The rotary jet shunt 362 is connected to the air pump 361 through a pipe 363. A receiving cavity is formed in the supporting plate 35. The supporting plate 35 is connected to the adsorption table 360 through a pipe 364. The pipe 364 connects the receiving cavity and the inner cavity of the adsorption table 360. A plurality of adsorption holes 365 are formed through the upper end surface of the supporting plate 35 and the upper end surface of the adsorption table 360.

[0049] During operation, after the first-level fixation of the wafer is completed, the air pump 361 operates to cause the adsorption holes 365 on the adsorption table 360 and the supporting plate 35 to have an adsorption effect on the lower end of the wafer through the first pipeline 363 and the second pipeline 364, providing limit fixation in the vertical direction for the wafer, completing the second-level fixation of the wafer, and improving the stability during subsequent processing.

[0050] Secondly, it should be noted that during the subsequent processing operation, the rotating cylinder 2 needs to drive the circular plate 20 and the wafer to rotate a full circle. By means of the arranged swirl spray diverter 362, the air pump 361 can continuously operate to ensure that the wafer is firmly adsorbed during the processing.

[0051] As Figure 2 、 Figure 4 、 Figure 7 and Figure 8 shown, a locking unit 37 for locking all the fixed arc plates 31 is arranged on the circular plate 20. The locking unit 37 includes locking grooves 370. Locking grooves 370 are formed at the ends of the lower end faces of two fixed arc plates 31 corresponding to the same supporting plate 35 that are far away from each other. After two adjacent fixed arc plates 31 are closed, the two corresponding locking grooves 370 together form a locking position. Three fixing cylinders 371 evenly distributed in the circumferential direction are fixedly arranged on the upper end face of the circular plate 20. A sliding rod 372 that slides up and down is arranged on the fixing cylinder 371. A locking block 373 that cooperates with the locking position is fixedly arranged on the upper end face of the sliding rod 372.

[0052] As Figure 5 、 Figure 7 and Figure 8 shown, a sealing plate 374 is fixedly arranged on the lower end face of the sliding rod 372. The fixing cylinder 371 is divided into upper and lower chambers by the sealing plate 374. The upper chamber of the fixing cylinder 371 is communicated with the inner cavity of the adsorption table 360 through a third pipeline 375, and the lower chamber of the fixing cylinder 371 is communicated with the outside.

[0053] When the fixed arc plate 31 presses against the wafer, the locking grooves 370 of two adjacent fixed arc plates 31 on different supporting plates 35 cooperate with each other to form a locking position, and at this time, the locking position is directly above the corresponding locking block 373.

[0054] During the process of adsorbing the wafer, as the air pump 361 operates, through the third pipeline 375, the sealing plate 374 drives the sliding rod 372 to move upward. The sliding rod 372 drives the locking block 373 thereon to be inserted into the corresponding locking positions, thereby locking and positioning the two corresponding fixed arc plates 31 above. Through the upward movement of the three locking blocks 373, the triangular locking of all the fixed arc plates 31 is achieved, so that during the subsequent rotational processing, the fixed arc plates 31 always tightly lock the wafer, improving the stability during the processing. After the processing operation is completed, the air pump 361 operates to inflate, so that the air pressure in the upper chambers of the adsorption table 360, the supporting plate 35, and the fixed cylinder 371 is restored, and the locking block 373 resets, releasing the locking of the two fixed arc plates 31 above.

[0055] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the protection scope of the present invention; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0056] In addition, the terms "first", "second", "No. 1", "No. 2" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", "No. 1", "No. 2" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0057] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "connected", "installed", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The embodiments of this specific implementation manner are all preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A positioning and fixing device for semiconductor device processing, characterized in that: include: A work box, wherein the upper end of the work box is open, and a sealing door for sealing the opening of the work box is arranged at the upper end of the work box, a rotating cylinder with a vertical axis is rotatably penetrated on the bottom wall of the inner cavity of the work box, a circular plate located in the work box is fixedly sleeved on the rotating cylinder, and a fixing mechanism is arranged on the rotating cylinder and the circular plate; The fixing mechanism includes a positioning arc plate, and three groups of positioning components evenly distributed in the circumferential direction are arranged above the circular plate. The positioning components include a positioning arc plate and two fixed arc plates located on both sides of the positioning arc plate. The inner arc surfaces of the positioning arc plate and the fixed arc plate are both facing the axis of the rotating cylinder. A driving unit is commonly arranged on the circular plate and the rotating cylinder. The driving unit works so that the three positioning arc plates are close to each other and perform centering operations on the wafer. All the fixed arc plates then clamp the wafer and form a full-circle circular ring to form a first-level fixation. A supporting plate is commonly fixed on the lower end surfaces of the two fixed arc plates in the same positioning component. The fixing mechanism also includes an adsorption unit for adsorbing and fixing the wafer, and the adsorption unit includes an adsorption table. The upper end surface of the rotating cylinder is fixedly provided with an adsorption table with a cavity inside, and the adsorption table is connected with the inner cavity of the rotating cylinder. An air pump is fixedly provided on the bottom wall of the inner cavity of the working box. When the air pump works, the adsorption table adsorbs the wafer after centering, forming a second-level fixation. The circular plate is fixedly provided with a T-shaped frame corresponding to the positioning components one by one; The driving unit includes an L-shaped frame, an L-shaped frame is slidably arranged on the T-shaped frame, and the horizontal section of the L-shaped frame passes through the corresponding T-shaped frame and has the same sliding direction as the corresponding sliding frame, the positioning arc plate is fixedly arranged on the end surface of the L-shaped frame facing the rotating cylinder, a triangular plate is sleeved on the rotating cylinder, which slides up and down and is located between the circular plate and the bottom of the working box, and hinge bars are hingedly arranged between the triangular plate and the vertical sections of the three L-shaped frames, a fixed circular plate is rotatably arranged on the lower end surface of the triangular plate, the rotating cylinder passes through the fixed circular plate, and an electric push rod is commonly arranged between the fixed circular plate and the bottom of the working box.

2. A positioning and fixing device for semiconductor device processing according to claim 1, characterized in that: The positioning arc plate is L-shaped, and the inner corner area of ​​the positioning arc plate faces the circular plate. The lower end surface of the positioning arc plate is flush with the upper end surface of the supporting plate. The vertical section height of the positioning arc plate and the height of the fixed arc plate are the same as the thickness of the wafer.

3. A positioning and fixing device for semiconductor device processing according to claim 1, characterized in that: A sliding frame corresponding to the T-shaped frame is slidably arranged on the upper end surface of the circular plate. The sliding frame slides along the corresponding T-shaped frame to the rotating cylinder. The supporting plate is fixedly arranged on the corresponding sliding frame. A supplementary block is slidably arranged between two fixed arc plates in the same positioning assembly. When all the fixed arc plates are used to clamp and fix the wafer, all the supplementary blocks are moved up to form a circular fixed frame surrounding the wafer together with all the fixed arc plates.

4. A positioning and fixing device for semiconductor device processing according to claim 1, characterized in that: The horizontal section of the T-shaped frame faces the rotating cylinder, and the driving unit also includes a gear. The upper end surface of the horizontal section of the T-shaped frame is provided with a gear through a rotating shaft, and the upper end surface of the horizontal section of the T-shaped frame is provided with two racks for sliding along its horizontal direction, and the racks are symmetrical about the axis of the rotating shaft. One of the racks on the same T-shaped frame is fixedly connected to two adjacent fixed arc plates through a connecting frame, and a driving bar is fixedly provided on the other rack. A pushing bar for pushing the driving bar is fixedly provided on the horizontal section of the L-shaped frame, and a spring is commonly provided between the rack and the vertical section of the T-shaped frame.

5. A positioning and fixing device for semiconductor device processing according to claim 3, characterized in that: The driving unit also includes a U-shaped frame, a U-shaped frame is fixedly provided on the lower end surface of the horizontal section of the T-shaped frame, the U-shaped frame is located between the T-shaped frame and the adjacent sliding frame, a horizontal plate is fixedly provided on the U-shaped frame, and an inverted right-angled trapezoidal matching block is fixedly provided on the lower end surface of the supplementary block, and the inclined surface of the matching block is inclined upward from the direction corresponding to the T-shaped frame to the rotating cylinder.

6. A positioning and fixing device for semiconductor device processing according to claim 5, characterized in that: The height of the matching block is the same as that of the fixed arc plate, and the upper end surface of the horizontal plate is flush with the lower end of the supplementary block.

7. A positioning and fixing device for semiconductor device processing according to claim 4, characterized in that: The adsorption unit also includes a rotary jet diverter. The lower end surface of the fixed circular plate is fixedly provided with a rotary jet diverter sleeved on the rotating cylinder. The rotary jet diverter is connected to the inner cavity of the rotating cylinder. The rotary jet diverter is connected to the air pump through a pipeline 1. A accommodating cavity is opened in the support plate. The support plate and the adsorption platform are connected through a pipeline 2. The pipeline 2 connects the accommodating cavity and the inner cavity of the adsorption platform. A plurality of adsorption holes are penetrated by the upper end surface of the support plate and the upper end surface of the adsorption platform.

8. A positioning and fixing device for semiconductor device processing according to claim 1, characterized in that: The circular plate is provided with a locking unit for locking all fixed arc plates, and the locking unit includes a locking groove. A locking groove is provided at one end of the lower end surfaces of the two fixed arc plates corresponding to the same supporting plate and away from each other. When two adjacent fixed arc plates are closed, the corresponding two locking grooves jointly form a locking position. Three circumferentially evenly distributed fixed cylinders are fixedly provided on the upper end surface of the circular plate, and a sliding rod that slides up and down is provided on the fixed cylinder. A locking block that cooperates with the locking position is fixedly provided on the upper end surface of the sliding rod.

9. A positioning and fixing device for semiconductor device processing according to claim 8, characterized in that: A sealing plate is fixedly arranged on the lower end surface of the sliding rod, and the fixing cylinder is divided into two upper and lower chambers by the sealing plate. The upper chamber of the fixing cylinder is connected to the inner cavity of the adsorption platform through a pipeline, and the lower chamber of the fixing cylinder is connected to the outside.

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