Semiconductor assembly

Abstract

The invention discloses a semiconductor assembly. The semiconductor assembly comprises a chip body, a substrate, a shell, a heat dissipation piece and a circuit board, the upper surface of the substrate is bonded to the lower surface of the circuit board, the chip body is welded to the lower surface of the substrate in an inverted mode, the top of the shell is bonded to the substrate, and heat dissipation holes are formed in the bottom of the shell; the heat dissipation piece is provided with a heat dissipation boss, the heat dissipation boss penetrates through the heat dissipation hole so that the heat dissipation face of the heat dissipation boss can be bonded to the bottom of the chip body, and the width of the heat dissipation face is smaller than that of the substrate and larger than that of the chip body. According to the semiconductor assembly, the heat dissipation effect on the chip body can be guaranteed, and meanwhile, the problem that heat-conducting glue is prone to cracking when the chip is warped and deformed due to the fact that the contact area between the heat dissipation piece and the packaging chip is too large in the prior art is solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a semiconductor component. Background Art

[0002] In FCBGA packaging (Flip Chip Ball Grid Array), the electrical connection between the chip body and the substrate adopts the flip chip (FC) installation method. For example, the chip is pasted on the substrate in a flip-chip form, and the packaging technology uses spherical solder (i.e. solder balls) as electrical connection points. It is mainly used in the field of high-density, high-speed, and multi-functional large-scale integrated circuit chip packaging.

[0003] For high-power chip types (for example, automotive FCBGA chips), the packaged chips will warp and deform at high and low temperatures. Since the contact area between the water cooling plate and the packaged chip is large, when the packaged chip warps greatly, it is easy to cause the thermal conductive adhesive between the packaged chip and the water cooling plate to crack, resulting in a sharp increase in thermal resistance and causing the chip to overheat.

[0004] Therefore, for high-power chips with high heat dissipation requirements, how to avoid the inability to effectively dissipate heat for high-power chips due to cracking of the thermal conductive adhesive between the packaged chip and the water cooling plate is a problem that needs to be solved. Summary of the invention

[0005] The technical problem to be solved by the present application is to provide a semiconductor component to solve the existing problem that high power consumption chips cannot be effectively cooled due to cracking of the thermal conductive adhesive between the packaged chip and the water cooling plate.

[0006] According to one aspect of the present invention, there is provided a semiconductor component, comprising: a chip body, a substrate, a housing, a heat sink, and a circuit board;

[0007] The upper surface of the substrate is bonded to the lower surface of the circuit board, the chip body is soldered to the lower surface of the substrate in a flip-chip form, the top of the shell is bonded to the substrate, and the bottom of the shell includes a heat dissipation hole;

[0008] The heat sink is provided with a heat dissipation boss, which passes through the heat dissipation hole so that its heat dissipation surface is bonded to the bottom of the chip body, the width of the heat dissipation surface is not less than the width of the chip body, and the difference between the width of the chip body and the width of the heat dissipation surface is less than a predetermined threshold.

[0009] In one embodiment, the shape of the heat dissipation surface includes a rectangular structure with chamfered or arc-shaped edges.

[0010] In one embodiment, the missing size of the chamfered or arc-shaped rectangular-like structure compared to the rectangular structure is greater than a preset threshold.

[0011] In one embodiment, the heat dissipation surface is bonded to the bottom of the chip body by phase change thermal conductive adhesive.

[0012] In one embodiment, the heat dissipation boss is a stepped structure, the heat dissipation surface is located at the top of the stepped structure, and thermal conductive adhesive is filled between the stepped surface of the stepped structure and the peripheral area of ​​the heat dissipation hole of the shell.

[0013] In one embodiment, the size of the step surface and the distance between the step surface and the shell match the auxiliary heat dissipation requirement and / or auxiliary bonding requirement of the peripheral area of ​​the heat dissipation hole of the shell.

[0014] In one embodiment, the width of the heat dissipation surface is greater than the width of the chip body.

[0015] In one embodiment, the size of the heat dissipation hole matches the size of the heat dissipation boss.

[0016] In one embodiment, it also includes: a pressure support and multiple receiving parts; the pressure support is arranged on the upper surface of the circuit board, and the pressure support includes a pressure part located at the center part thereof and multiple elastic parts located at the edge part thereof and fixedly connected to or integrally formed with the pressure part; the pressure part corresponds to the position of the chip body, and the receiving part corresponds to the position of the elastic part; one end of the receiving part is fixedly connected to the heat sink, and the other end of the receiving part passes through the circuit board, the elastic part is matched and connected with the other end of the receiving part passing through the circuit board and generates an elastic restoring force, and the pressure part is to overcome the elastic restoring force of the multiple elastic parts and apply pressure to the circuit board toward the heat sink so that the chip body fits the heat sink.

[0017] In one embodiment, the pressure-applying portion is a hollow annular structure, and at least one group of symmetrical pressure-applying points or pressure-applying surfaces for contacting the circuit board is arranged at the inner circumferential edge of the annular structure.

[0018] In one embodiment, the elastic portion includes an elastic foot that is warped by a predetermined amplitude relative to the pressure portion and away from the circuit board. The elastic foot is cooperatively connected with the other end of the receiving member passing through the circuit board to generate the elastic restoring force.

[0019] In one embodiment, the elastic support leg is provided with a U-shaped opening, and the receiving member includes a snap-fit ​​end cover, and the snap-fit ​​end cover is snap-fitted with the elastic support leg through the U-shaped opening.

[0020] Compared with the prior art, this application has the following advantages:

[0021] The semiconductor component provided in the embodiment of the present application includes: a chip body, a substrate, a shell, a heat sink, and a circuit board; the upper surface of the substrate is bonded to the lower surface of the circuit board, the chip body is soldered to the lower surface of the substrate in a flip-chip form, the top of the shell is bonded to the substrate, and the bottom of the shell includes a heat dissipation hole; the heat sink is provided with a heat dissipation boss, the heat dissipation boss passes through the heat dissipation hole so that its heat dissipation surface is bonded to the bottom of the chip body, the width of the heat dissipation surface is not less than the width of the chip body, and the difference between the width of the chip body and the width of the heat dissipation surface is less than a predetermined threshold. Since the width of the above-mentioned heat dissipation surface is not less than the width of the chip body, and the difference between the width of the chip body and the width of the heat dissipation surface is less than a predetermined threshold, the heat generated by the chip body can be effectively dissipated while avoiding the excessive contact area between the packaged chip and the heat sink in the prior art. In this case, even if the chip body is warped, since the contact area between it and the heat sink is only the chip body itself, the problem of thermal conductive adhesive cracking is not likely to occur between the two. While ensuring the heat dissipation effect of the chip body, the existing problem of thermal conductive adhesive cracking caused by excessive contact area between the heat sink and the packaged chip, which is easily caused by chip warping and deformation, can be avoided.

[0022] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specifically cites the preferred embodiments and describes them in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic diagram of the structure of a semiconductor component provided in an embodiment of the present application;

[0024] Figure 2 is a schematic diagram of a semiconductor assembly structure provided by an embodiment of the present application;

[0025] Notes on the attached drawings:

[0026] 1 semiconductor component, 111 chip body, 112 substrate, 113 housing, 12 heat sink, 121 heat dissipation boss, 122 heat dissipation surface, 123 step surface, 124 phase change thermal conductive adhesive, 13 circuit board, 2 pressure bracket, 21 pressure part, 211 pressure point (pressure surface), 22 elastic part, 221 elastic support foot, 3 receiving part, 31 clamping end cover DETAILED DESCRIPTION

[0027] Many specific details are described in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application, so the present application is not limited by the specific implementation disclosed below.

[0028] The terms used in one or more embodiments of this specification are only for the purpose of describing specific embodiments, and are not intended to limit one or more embodiments of this specification. The singular forms of "a", "said" and "the" used in one or more embodiments of this specification and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0029] It should be understood that although the terms first, second, etc. may be used to describe various information in one or more embodiments of this specification, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of one or more embodiments of this specification, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0030] In the field of semiconductor processing technology, in order to avoid the failure of effective heat dissipation of high-power chips due to cracking of the thermal conductive adhesive between the packaged chip and the heat sink, the embodiment of the present application provides a semiconductor component and a semiconductor assembly structure, please refer to Figure 1 and Figure 2 To understand this embodiment, Figure 1 is a schematic structural diagram of a semiconductor component provided in this embodiment; Figure 2 It is a schematic diagram of a semiconductor assembly structure provided in an embodiment of the present application.

[0031] like Figure 1As shown, the semiconductor component 1 provided in this embodiment includes a chip body 111, a substrate 112, a shell 113, a heat sink 12, and a circuit board 13; the upper surface of the substrate 112 is bonded to the lower surface of the circuit board 13, the chip body 111 is soldered to the lower surface of the substrate 112 in a flip-chip form, and is encapsulated in a space formed by the bonding of the shell 113 and the substrate 112, the top of the shell 113 is bonded to the substrate 112 to form a packaging space, the shell 113 can be a copper shell with a preset thickness, and a heat dissipation hole is provided at the bottom thereof; the heat sink 12 can be a water-cooled plate or other heat dissipation device or component, which is provided with a heat dissipation boss 121, the heat dissipation boss 121 is correspondingly arranged with the chip body 111 in the thickness direction, that is, the heat dissipation boss 121 and the chip body 111 correspond to the same central axis, the heat dissipation boss 121 passes through the above-mentioned heat dissipation hole so that the heat dissipation surface 122 at the top thereof is bonded to the bottom of the chip body 111, so as to efficiently dissipate heat for the chip body 111. In this embodiment, the width of the heat dissipation surface 122 of the heat dissipation boss 121 is not less than the width of the chip body 111, and the difference between the width of the chip body 111 and the width of the heat dissipation surface 122 is less than a predetermined threshold, for example, the size of the heat dissipation surface 122 is slightly larger than or equal to the size of the chip body 111.

[0032] In this embodiment, the size of the heat dissipation boss 121 matches the size of the heat dissipation hole, so that the heat dissipation boss 121 can play a role in supporting the heat dissipation hole after passing through the above-mentioned heat dissipation hole. The heat dissipation boss 121 and the shell 113 together constitute a protective structure of the chip body 111, thereby ensuring the protection of the chip body 111.

[0033] Since the width of the above-mentioned heat dissipation surface 122 is not less than the width of the chip body 111, and the difference between the width of the chip body 111 and the width of the heat dissipation surface 122 is less than a predetermined threshold, the heat generated by the chip body 111 can be effectively dissipated while avoiding the excessive contact area between the packaged chip and the heat sink 12 in the prior art. In this case, even if the chip body 111 warps, since the contact area between it and the heat sink 12 is only the chip body 111 itself, the problem of cracking of the thermal conductive adhesive is not likely to occur between the two. While ensuring the heat dissipation effect of the chip body 111, the existing problem of cracking of the thermal conductive adhesive caused by the excessive contact area between the heat sink 12 and the packaged chip, which is easy to cause the chip to warp and deform, can be avoided.

[0034] In one embodiment, the size of the heat dissipation surface 122 can be preferably set to be larger than the size of the chip body 111 so that the contact area between the chip body 111 and the heat dissipation surface 122 is located in the middle area of ​​the heat dissipation surface 122, thereby preventing the chip body 111 from being scratched or damaged by the corners of the heat dissipation boss 121.

[0035] In this embodiment, the heat dissipation surface 122 is bonded to the bottom of the chip body 111 by a phase-change thermal adhesive 124. The phase-change thermal adhesive 124 can use aluminum powder as the main thermal conductive material, and its fluidity or deformation performance after heating is correspondingly enhanced. When the chip body 111 is warped and deformed, the phase-change thermal adhesive 124 can adaptively deform based on the deformation of the chip body 111, thereby reducing or avoiding the risk of cracking between the thermal adhesive, the chip body 111 and the heat dissipation surface 122; and the phase-change thermal adhesive 124 can be used as a buffer surface of the chip body 111 due to its deformable performance, thereby providing a protective function for the chip body 111 and preventing the chip body 111 from being scratched or damaged.

[0036] Since the heat dissipation adhesive is more likely to crack at the end corners of the right-angled area, in this embodiment, the shape of the heat dissipation surface 122 can be set to a rectangular structure with chamfered or arc-shaped edges (not shown in the figure). For example, the rectangular structure can be formed by cutting off a right-angled area of ​​a predetermined size from a rectangle or square corresponding to the shape of the chip body 111, and the missing size of the chamfered or arc-shaped rectangular structure must be greater than a preset threshold value compared to the rectangular structure to further avoid interface separation between the heat sink 12 and the chip body 111.

[0037] Compared with the existing bonding area between the shell 113 and the heat sink 12 being equal to or larger than the size of the substrate 112, the width of the heat sink 122 in this embodiment is not less than the width of the chip body 111, and the difference between the width of the chip body 111 and the width of the heat sink 122 is less than a predetermined threshold. This structure avoids the interface separation between the heat sink 12 and the packaged chip due to the excessive contact area between the heat sink 12 and the packaged chip, while also reducing the heat dissipation area and the bonding area between the shell 113 and the heat sink 12, which may result in a partial loss of heat dissipation performance or a reduction in the bonding strength between the two. Therefore, the above-mentioned heat dissipation boss 121 can be set as a stepped structure (such as Figure 2 As shown in the figure, the heat dissipation surface 122 is located at the top of the stepped structure, and the stepped surface 123 of the stepped structure and the peripheral area of ​​the heat dissipation hole of the shell 113 are filled with thermal conductive adhesive. In this way, on the basis of the core heat dissipation area (i.e., the bonding area between the heat dissipation surface 122 and the chip body 111), an auxiliary heat dissipation area (the bonding area between the stepped surface 123 and the peripheral area of ​​the heat dissipation hole of the shell 113) can be added in its peripheral area to achieve stepped heat dissipation and make up for the partial loss of heat dissipation performance caused by the reduction of the heat dissipation area. In addition, on the basis of the above-mentioned improvement of the heat dissipation effect, the thermal conductive adhesive filled between the stepped surface 123 and the peripheral area of ​​the heat dissipation hole of the shell 113 can improve the bonding strength between the heat dissipation boss 121 and the shell 113, and can avoid or reduce the influence of the bonding strength caused by the reduction of the bonding area between the packaged chip and the heat sink 12.

[0038] In this embodiment, in order to meet the auxiliary heat dissipation demand and / or auxiliary bonding demand of the peripheral area of ​​the heat dissipation hole of the shell 113, the size of the step surface 123 and the distance between it and the shell 113 (i.e., the step height) must match the auxiliary heat dissipation demand and / or auxiliary bonding demand of the peripheral area of ​​the heat dissipation hole of the shell 113. For example, the step height must be sufficient to achieve a predetermined thermal conductivity effect after filling with thermal conductive adhesive, and the size of the step surface 123 must be sufficient to meet the additional heat dissipation area required beyond the heat dissipation surface 122 of the heat dissipation boss 121.

[0039] The semiconductor component 1 provided in this embodiment can effectively dissipate the heat generated by the chip body 111, because the width of the heat dissipation surface 122 is not less than the width of the chip body 111, and the difference between the width of the chip body 111 and the width of the heat dissipation surface 122 is less than a predetermined threshold value. Therefore, the heat generated by the chip body 111 can be effectively dissipated while avoiding the excessive contact area between the packaged chip and the heat sink 12 in the prior art. In this case, even if the chip body 111 is warped, the contact area between it and the heat sink 12 is only the chip body 111 itself, so the problem of cracking of the thermal conductive adhesive is not likely to occur between the two. This ensures the heat dissipation effect of the chip body 111 while avoiding the problem of cracking of the thermal conductive adhesive caused by excessive contact area between the heat sink 12 and the packaged chip, which is easy to cause the chip to warp and deform.

[0040] like Figure 2 As shown, the semiconductor component also includes: a pressure support 2 and a plurality of receiving parts 3; the pressure support 2 is arranged on the upper surface of the circuit board 13, and the pressure support 2 includes a pressure portion 21 located at the center thereof and a plurality of elastic portions 22 located at the edge thereof and fixedly connected to or integrally formed with the pressure portion 21; the pressure portion 21 corresponds to the position of the chip body 111 located on the lower surface of the circuit board 13 in the chip thickness direction, and the receiving part 3 corresponds to the position and number of the elastic portions 22; one end of the receiving part 3 is fixedly connected to the heat sink 12, and the other end of the receiving part 3 passes through the circuit board 13, the elastic portion 22 is matched and connected with the other end of the receiving part 3 passing through the circuit board 13 and generates an elastic restoring force, and the pressure portion 21 is to overcome the elastic restoring force of the plurality of elastic portions 22 and apply pressure to the circuit board 13 toward the heat sink 12, so that the chip body 111 fits with the heat dissipation surface 122 of the heat dissipation boss 121.

[0041] In this embodiment, the pressure applying portion 21 includes at least one set of symmetrically arranged pressure applying points or pressure applying surfaces 211 for contacting the circuit board 13. Figure 2As shown, the pressure-applying portion 21 is a hollow annular structure, and the pressure-applying point or pressure-applying surface 211 is arranged at the inner circumferential edge of the annular structure. Through the cooperation and connection between each elastic portion 22 of the pressure bracket 2 and its corresponding receiving member 3, the force applied by the pressure-applying portion 21 to the circuit board 13 in the direction of the heat dissipation boss 121 and the bearing force applied by the heat dissipation boss 121 (heat dissipation surface 122) to the chip body 111 in the direction of the circuit board 13 can cooperate with each other, and jointly apply continuous pressure toward each other to the heat dissipation surface 122 of the heat dissipation boss 121 and the chip body 111, so that the bonding part between the two can be closely fitted, and the close fit between the core heat dissipation area (the area corresponding to the chip body 111) and the heat dissipation surface 122 of the heat dissipation boss 121 is ensured.

[0042] like Figure 2 As shown, the elastic portion 22 includes an elastic leg 221 that is warped by a predetermined amplitude relative to the pressure-applying portion 21 and in a direction away from the circuit board 13. The elastic leg 221 is matched and connected with the other end of the receiving member 3 that passes through the circuit board 13 and generates an elastic restoring force. In this embodiment, the elastic leg 221 is provided with a U-shaped opening, and the receiving member 3 includes a clamping end cover 31, which can be clamped with the elastic leg 221 through the U-shaped opening.

[0043] It should be noted that although the present application is disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field may make possible changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims of the present application.

Claims

1. A semiconductor component, characterized in that: include: Chip body, substrate, housing, heat sink, and circuit board; The upper surface of the substrate is bonded to the lower surface of the circuit board, the chip body is soldered to the lower surface of the substrate in a flip-chip form, the top of the shell is bonded to the substrate, and the bottom of the shell includes a heat dissipation hole; The heat sink is provided with a heat dissipation boss, which passes through the heat dissipation hole so that its heat dissipation surface is bonded to the bottom of the chip body, the width of the heat dissipation surface is not less than the width of the chip body, and the difference between the width of the chip body and the width of the heat dissipation surface is less than a predetermined threshold.

2. The semiconductor component according to claim 1, characterized in that The shape of the heat dissipation surface includes a rectangular structure with chamfered or arc-shaped edges.

3. The semiconductor component according to claim 2, characterized in that The missing size of the chamfered or arc-shaped rectangular-like structure compared to the rectangular structure is larger than a preset threshold.

4. The semiconductor component according to claim 1, characterized in that The heat dissipation surface is bonded to the bottom of the chip body through phase-change thermal conductive adhesive.

5. The semiconductor component according to claim 1, characterized in that The heat dissipation boss is a stepped structure, the heat dissipation surface is located at the top of the stepped structure, and thermal conductive adhesive is filled between the stepped surface of the stepped structure and the peripheral area of ​​the heat dissipation hole of the shell.

6. The semiconductor component according to claim 5, characterized in that The size of the step surface and the distance between the step surface and the shell body match the auxiliary heat dissipation requirement and / or auxiliary bonding requirement of the peripheral area of ​​the heat dissipation hole of the shell body.

7. The semiconductor component according to claim 1, characterized in that The width of the heat dissipation surface is greater than the width of the chip body.

8. The semiconductor component according to claim 1, characterized in that The size of the heat dissipation hole matches the size of the heat dissipation boss.

9. The semiconductor component according to claim 1, characterized in that Also includes: A pressure support and multiple receiving parts; the pressure support is arranged on the upper surface of the circuit board, and the pressure support includes a pressure part located at the center part thereof and multiple elastic parts located at the edge part thereof and fixedly connected to or integrally formed with the pressure part; the pressure part corresponds to the position of the chip body, and the receiving part corresponds to the position of the elastic part; one end of the receiving part is fixedly connected to the heat sink, and the other end of the receiving part passes through the circuit board, the elastic part is matched and connected with the other end of the receiving part passing through the circuit board and generates an elastic restoring force, and the pressure part is used to overcome the elastic restoring force of the multiple elastic parts and apply pressure to the circuit board toward the heat sink so that the chip body fits the heat sink.

10. The semiconductor component according to claim 9, characterized in that The pressure-applying portion is a hollow annular structure, and at least one group of symmetrical pressure-applying points or pressure-applying surfaces for contacting the circuit board is arranged at the inner circumferential edge of the annular structure.

11. The semiconductor component according to claim 9, characterized in that The elastic part includes an elastic foot which is warped by a predetermined amplitude relative to the pressure-applying part and away from the circuit board. The elastic foot is cooperatively connected with the other end of the receiving member passing through the circuit board to generate the elastic restoring force.

12. The semiconductor component according to claim 9, characterized in that The elastic support leg is provided with a U-shaped opening, and the receiving member comprises a clamping end cover, and the clamping end cover is clamped with the elastic support leg through the U-shaped opening.

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