Jet flow evaporation cooling system

By configuring the inclined cooling part and a pressure reducing chamber in the jet vaporization cooling system, the problem of reducing the cooling efficiency of the liquid jet stream is solved, and stable cooling efficiency and efficient heat removal are achieved.

CN119764270APending Publication Date: 2025-04-04CANON KK
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Patent Information

Application Number
CN202411286108.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-10-02
Filing Date
2024-09-13
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

When using the liquid jet cooling method, cooling efficiency may be reduced due to the cooling fluid not vaporized by the heat source and left on the cooling surface, or the coolant drop due to gravity hinders the jet stream.

Method used

A jet stream vaporization cooling system is designed, wherein the cooling portion is configured to be inclined and maintains a decompression environment in the chamber, the opening portion is used to eject liquid, and the discharge portion is used to discharge the unevaporated liquid. This configuration prevents unevaporated liquid from remaining on the cooling portion, hindering the jet flow.

Benefits of technology

By preventing unevaporated liquid residue and gravity drop obstacles, the system can maintain a stable cooling efficiency and effectively remove heat from the heating unit.

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Abstract

The invention discloses a jet flow evaporation cooling system. The jet flow vaporization cooling system for cooling a heat generating unit using a liquid jet flow includes: a heat transfer portion integrally formed with a cooling portion configured to receive the liquid jet flow and an arrangement portion on which the heat generating unit is arranged; an opening portion configured to eject the liquid supplied from the supply portion to the cooling portion; a discharge portion configured to discharge the liquid; and a chamber configured to accommodate the opening portion, the discharge portion, and the cooling portion, and configured not to accommodate the arrangement portion therein, in which the chamber is maintained in a reduced pressure environment, in which the opening portion is configured to eject the liquid to the cooling portion, in which the discharge portion is configured to eject the liquid to the discharge portion, and in which the discharge portion is configured to discharge the liquid to the discharge portion. At least a portion of the cooling portion is inclined, and wherein the liquid is discharged from the discharge portion via the cooling portion.
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Description

Technical Field

[0001] The invention relates to a jet flow evaporation cooling system, which utilizes a jet flow of liquid to cool a heat generating unit. Background Art

[0002] In recent years, the heat generation density of various devices has tended to increase due to the high integration of devices and the high complexity of industrial devices. In order to cool these various devices, there is a challenge to effectively remove heat from a high heat flux (heat per unit area passing through a specific surface per unit time) through a cooling portion that is a part of a heat transfer unit in thermal contact with these devices. The cooling method of the cooling device having the above-mentioned function includes sensible heat cooling that uses the temperature difference between a refrigerant (such as gas and liquid) and a cooling portion in contact with the refrigerant to cool the cooling portion and vaporization cooling that uses the latent heat (vaporization heat) required for boiling and vaporization of the refrigerant to cool the cooling portion.

[0003] The main types of evaporative cooling are boiling cooling in which a cooling portion is immersed in a refrigerant and cooled by boiling of the refrigerant, and a method for spraying a refrigerant from an opening portion (such as a nozzle) to a cooling portion and vaporizing the refrigerant to cool the cooling portion (hereinafter referred to as jet stream evaporative cooling). According to Japanese Unexamined Patent Application Publication (Translation of PCT Application) No. 2003-509874, a technology for spraying a cooling liquid from a nozzle arranged above a circuit board to cool a semiconductor device provided on a circuit substrate is discussed. Summary of the invention

[0004] However, in the cooling method using a liquid jet, in some cases, the cooling efficiency may be reduced due to obstruction of the jet caused by the coolant that is not vaporized by the heat source and remains on the cooling surface, or due to obstruction of the jet caused by the sprayed coolant falling due to gravity and reaching the opening portion of the nozzle.

[0005] According to one aspect of the present invention, a jet evaporation cooling system that utilizes a liquid jet to cool a heat generating unit includes: a heat transfer portion, which is integrally formed with a cooling portion configured to receive the liquid jet and an arrangement portion on which the heat generating unit is arranged; an opening portion, which is configured to spray liquid supplied from a supply portion to the cooling portion; a discharge portion, which is configured to discharge the liquid; and a chamber, which is configured to accommodate the opening portion, the discharge portion and the cooling portion, and is configured not to accommodate the arrangement portion therein, wherein the chamber is maintained under a reduced pressure environment, wherein the opening portion is configured to spray the liquid to the cooling portion, wherein at least a portion of the cooling portion is inclined, and wherein the liquid is discharged from the discharge portion via the cooling portion.

[0006] Further features of the present invention will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic diagram showing a jet evaporative cooling system according to a first exemplary embodiment.

[0008] FIG. 2A to FIG. 2D : is a diagram showing a modification of the inclined portion in the jet evaporative cooling system according to the first exemplary embodiment.

[0009] Figure 3 is a schematic diagram showing a jet evaporation cooling system according to a second exemplary embodiment.

[0010] Figure 4 is a schematic diagram showing a modification of the inclined portion in the jet evaporative cooling system according to the second exemplary embodiment.

[0011] Figure 5A and Figure 5B is a diagram showing a modification of the cooling portion according to the first or second exemplary embodiment.

[0012] Figure 6 is a schematic diagram showing a jet evaporative cooling system according to a third exemplary embodiment.

[0013] Figure 7 is a schematic diagram showing a jet evaporative cooling system according to a fourth exemplary embodiment.

[0014] FIG. 8A to FIG. 8C is a schematic diagram showing a modification of a partition portion in the jet evaporative cooling system according to the fourth exemplary embodiment.

[0015] Fig. 9 is a schematic diagram showing a jet evaporative cooling system according to a fifth exemplary embodiment.

[0016] Fig.10 is a schematic diagram showing a modification of a partition portion in the jet evaporative cooling system according to the fifth exemplary embodiment.

[0017] Fig.11 is a schematic diagram showing a jet evaporative cooling system according to a sixth exemplary embodiment.

[0018] Fig.12 is a schematic diagram showing a jet evaporative cooling system according to a seventh exemplary embodiment. DETAILED DESCRIPTION

[0019] An exemplary embodiment of a jet flow evaporative cooling system according to the present invention will be described below with reference to the accompanying drawings. The same or equivalent components, parts and processes shown in the accompanying drawings are represented by the same reference numerals, and redundant descriptions will be omitted. In addition, the configurations in each exemplary embodiment can be appropriately combined and implemented.

[0020] Figure 1 1 is a schematic diagram showing a configuration of a jet flow evaporative cooling system 100 surrounding a heat generating unit according to a first exemplary embodiment of the present invention. The jet flow evaporative cooling system 100 according to the present exemplary embodiment sprays liquid supplied from a supply portion 110 to a cooling portion (also referred to as a cooling surface) 104 where a heat generating unit 101 is arranged to cool the heat generating unit 101.

[0021] The jet evaporative cooling system 100 according to the present exemplary embodiment includes a cooling portion 104 receiving a jet of liquid, an arrangement portion 103 on which a heat generating unit 101 is arranged, a heat transfer portion 102 integrated with the cooling portion 104 and the arrangement portion 103, and an opening portion 111 that sprays liquid supplied from a supply portion 110 to the cooling portion 104. The jet evaporative cooling system 100 also includes a chamber 121 configured to accommodate a discharge portion 122 for discharging liquid, the opening portion 111, and the cooling portion 104, but not accommodating the arrangement portion 103 therein. The jet evaporative cooling system 100 is configured such that while the chamber 121 is maintained under a reduced pressure environment, the opening portion 111 sprays a jet of refrigerant 113 to the cooling portion 104, a portion of the cooling portion 104 is inclined, and liquid is discharged from the discharge portion 122 via the cooling portion 104. Here, the cooling portion 104 is configured to be inclined relative to a plane formed by the arrangement portion 103. With this configuration, providing the jet flow evaporative cooling system 100 for the heat generating unit 101 enables liquid to be efficiently discharged through the cooling portion 104 .

[0022] Each component included in the jet evaporative cooling system 100 is described below.

[0023] The heat generating unit 101 is in thermal contact with the arrangement portion 103 which is a part of the heat transfer portion 102, and the heat generated in the heat generating unit 101 is transferred to the cooling portion 104 via the heat transfer portion 102, and the cooling portion 104 is a part of the heat transfer portion 102. The heat transfer portion 102, the arrangement portion 103, and the cooling portion 104 do not necessarily have to be configured as an integrated component, and they can be configured by different parts. Each of the parts can be subjected to interface treatment to reduce thermal resistance, and integrated into one component made of different parts.

[0024] The heat transfer portion 102 is made of a material having high thermal conductivity, such as copper, aluminum, or an alloy thereof, and has an appropriate thickness so as to quickly transfer heat generated in the heat generating unit 101 to the cooling portion 104 .

[0025] The arrangement portion 103 is in proper contact with the heat generating unit 101, for example, they are closely adhered using thermal grease, etc., so that the temperature difference (thermal resistance) between the heat generating unit 101 and the heat transfer portion 102 is small. With this configuration, the cooling portion 104 is cooled, so that the heat generated in the heat generating unit 101 can be removed, and the heat generating unit 101 can be quickly cooled.

[0026] The jet flow evaporation cooling system 100 includes a jet unit 115 including a supply portion 110 for supplying refrigerant and an opening portion 111 for jetting a jet of refrigerant toward a cooling portion 104, and a chamber 121 accommodating the cooling portion 104 and a discharge portion 122 for discharging the refrigerant therein and forming a space 120. The chamber 121 can be applied to cooling of various types of heat sources by contacting with the heat generating unit 101 as a cooling target via the heat transfer portion 102. The shape of the opening portion 111 can be appropriately determined by the user so that cooling performance suitable for the purpose can be obtained.

[0027] exist Figure 1 In the embodiment, three openings are provided in the opening portion 111, but the present exemplary embodiment is not limited to this configuration, and the number and arrangement of the openings can be appropriately set by the user. For example, a single opening can be provided, or openings can be provided in two directions.

[0028] An example is shown in which the supply portion 110 supplies the refrigerant to each of the plurality of openings of the opening portion 111 , but the present exemplary embodiment is not limited to this configuration, and the supply portion 110 may be individually provided for each of the openings in the opening portion 111 .

[0029] Since the heating unit 101 is arranged outside the space 120, the jet stream evaporative cooling system 100 does not need to consider the influence of the characteristics of the refrigerant (electrical insulation characteristics, chemical characteristics, etc.) on the heating unit 101. Therefore, the refrigerant can be appropriately selected according to the expected performance of the jet stream evaporative cooling system 100. Various refrigerants can be used for evaporative cooling, including water, ethanol and fluorine-based inert liquids. In the case where the expected performance is to remove heat from a high heat flux, it is desirable to use a refrigerant containing water as a main component, because water has a very large heat of vaporization, which significantly affects the cooling capacity, and is also more superior in terms of safety, cost, etc.

[0030] The space 120 in the chamber 121 is in a reduced pressure environment in which the vacuum degree is adjusted in advance using a unit for exhausting air from the exhaust portion 123. In other words, the jet stream evaporative cooling system 100 may further include a decompression unit that reduces the pressure in the chamber 121 via the exhaust portion 123. The vacuum degree may be adjusted so that the boiling point of the refrigerant is at a temperature desired by the user. For example, in the case where water is used as the refrigerant and the boiling point is set to about 33°C, the vacuum degree in the space 120 may be set to 5 kPa.

[0031] The jet flow evaporation cooling system 100 allows the refrigerant 113 to pass through the supply portion 110 and be sprayed from the opening portion 111 to the cooling portion 104. If the temperature of the cooling portion 104 becomes higher than the boiling point of the refrigerant due to the heat generated in the heating unit 101, the refrigerant is vaporized into steam, and the cooling portion 104 is cooled by the vaporization heat. The steam of the refrigerant generated on the cooling portion 104 is exhausted from the exhaust portion 123, so that the vacuum degree in the space 120 can be maintained. However, the present exemplary embodiment is not limited to this configuration.

[0032] The discharge portion 122 is appropriately arranged so that the liquid of the refrigerant 113 that has been sprayed to the cooling portion 104 but has not yet vaporized is discharged to the outside of the chamber 121. In the jet flow evaporation cooling system 100 according to the first exemplary embodiment, the chamber 121 is arranged so that the arrangement portion 103 is vertically located below the opening portion 111, and the cooling portion 104 is inclined with respect to the vertical direction, as shown in FIG. Figure 1 In addition, at least a portion of the discharge portion 122 is vertically disposed below the cooling portion 104, so that the unvaporized refrigerant can be quickly discharged by the inclination of the cooling portion 104. The jet evaporation cooling system 100 according to the present exemplary embodiment has the above configuration, and thus it is possible to prevent the unvaporized liquid from remaining on the cooling portion 104 and hindering the jet flow of the liquid sprayed from the opening portion 111, thereby being able to provide cooling with stable cooling efficiency.

[0033] (First Modification)

[0034] FIG. 2A to FIG. 2D The inclined portion of the cooling portion 104 included in the jet evaporative cooling system 100 is shown. Figure 1 According to the first exemplary embodiment, an example in which the cooling portion 104 is tilted in the direction toward the exhaust portion 122 in the jet flow evaporation cooling system 100 is described, but the tilt of the cooling portion 104 is not limited to the above example. For example, the cooling portion 104 may be horizontal to the direction of the exhaust path, such as Figure 2A As shown, it is also possible to Figure 1 Tilt in different directions, such as Figure 2B As shown, it is along Figure 2A In addition, the cooling portion 104 can be tilted in multiple directions, such as Figure 2C In addition, the jet collision portion (also referred to as the jet collision range) 114 where the jet of liquid ejected from the opening portion 111 collides with the cooling portion 104 may be inclined, such as Figure 2D By this configuration, it is possible to prevent unvaporized refrigerant from remaining on the jet collision portion 114, and jet evaporation cooling can be performed with stable cooling efficiency.

[0035] According to the first exemplary embodiment and the first modified example, liquid refrigerant that is not vaporized at cooling portion 104 moves rapidly on cooling portion 104 by the slope formed thereon, and is discharged from discharge portion 122. Therefore, the momentum of the jet flow ejected from opening portion 111 to cooling portion 104 is less likely to be blocked, and the temperature of cooling portion 104 can be stably controlled.

[0036] Reference Figure 3 A jet evaporative cooling system 200 according to a second exemplary embodiment of the present invention is described. Figure 3 1 is a schematic diagram showing a jet flow evaporative cooling system 200 according to a second exemplary embodiment. According to the first exemplary embodiment, the cooling portion 104 is vertically disposed below the opening portion 111. On the other hand, in the jet flow evaporative cooling system 200 according to the second exemplary embodiment, the chamber 121 is arranged in which the cooling portion 104 is vertically disposed above the opening portion 111.

[0037] Furthermore, the cooling portion 104 included in the jet evaporative cooling system 200 according to the second exemplary embodiment is inclined with respect to the vertical direction and includes a vertical lower portion 104 c which is the lowermost portion of the cooling portion 104 .

[0038] The second exemplary embodiment includes Figure 1 , except that the opening portion 111 is arranged at a position different from the position directly vertically below the vertical lower portion 104c of the cooling portion 104, and the discharge portion 122 is located vertically below the opening portion 111. In other words, the opening portion 111 is provided at a position different from the position of the vertical lower portion 104c located at the lowest position of the cooling portion 104.

[0039] Unvaporized refrigerant 116 of the refrigerant 113 injected from the opening portion 111 to the cooling portion 104 does not fall vertically downward rapidly due to the influence of surface tension, but moves along the inclination of the cooling portion 104 to the vertical lower portion 104c and then falls.

[0040] Figure 3An example of the inclination of the cooling portion 104 according to the second exemplary embodiment is shown, but the present exemplary embodiment is not limited to this example, and may be configured such that, for example, the cooling portion 104 has a plurality of inclinations or a plurality of openings are formed in the opening portion 111, as shown in FIG. Figure 4 As shown. The jet flow evaporation cooling system 200 according to the present exemplary embodiment has the above configuration, so that a jet flow evaporation cooling system with stable cooling efficiency can be provided. Specifically, even if the unvaporized refrigerant 116, which is a liquid that is not vaporized by the heat generating unit 101, falls due to gravity, the jet flow of the refrigerant 113 from the opening portion 111 can be prevented from being blocked.

[0041] (Second Modification)

[0042] Reference Figure 5A and Figure 5B Modifications of the cooling portion 104 included in the heat transfer portion 102 according to the first or second exemplary embodiment of the present invention are described. Figure 5A is a cross-sectional view showing the configuration around the heat transfer portion 102 .

[0043] Figure 5A An example is shown in which the cooling portion 104 included in the heat transfer portion 102 according to the first or second exemplary embodiment is provided with a groove portion consisting of an upper groove portion 104a and a lower groove portion 104b, and the upper groove portion 104a and the lower groove portion 104b are inclined in the direction in which the groove of the groove portion extends.

[0044] The shape of the groove portion is not limited to Figure 5A The shape shown, for example, can be Figure 5B The shapes shown can also be Figure 1 and FIG. 2A to FIG. 2D The configuration of the cooling portion 104 shown is combined. In addition, the shape, width, depth, pitch, etc. of the groove portion can be appropriately set.

[0045] By the configuration according to the second modification, the contact area between cooling portion 104 and the ejected liquid can be increased, and the area allowing the liquid to vaporize is increased, so that the cooling efficiency can be further improved while maintaining the effects of the first or second exemplary embodiment.

[0046] Reference Figure 6 A jet evaporative cooling system 300 according to a third exemplary embodiment of the present invention is described. Figure 6 An example of the overall configuration of the jet evaporative cooling system 300 is shown.

[0047] Figure 6 The jet flow evaporative cooling system 300 is shown in FIG. Figure 1The jet flow evaporative cooling system 100 around the heat generating unit 101 in FIG. 1 has an example of a similar functional configuration, but the present exemplary embodiment is not limited to this configuration and may have the configurations described according to the first and second exemplary embodiments and the first and second modified examples.

[0048] exist Figure 6 In the illustrated jet evaporation cooling system 300, the refrigerant is maintained at a pressure equal to or higher than atmospheric pressure before passing through the refrigerant supply valve 117. Then, if the refrigerant supply valve 117 is opened, the refrigerant is supplied from the refrigerant delivery unit 139 to the supply portion 110 that supplies the liquid due to the pressure difference with the pressure in the space 120 within the chamber 121.

[0049] The vapor of the refrigerant vaporized on the cooling surface 104 is discharged from the exhaust portion 123 provided in the chamber 121 through the exhaust path 130 by the pressure reducing pump 135 .

[0050] The decompression pump 135 may be, for example, a gear pump, a water seal type pump, or a water ejector, but is not limited thereto, and may be appropriately selected according to the purpose and environment of the user.

[0051] The refrigerant that is not vaporized on the cooling surface 104 is also collected from the discharge portion 122 via the discharge path 131 by the decompression pump 135, but the present exemplary embodiment is not limited to this configuration. For example, the remaining liquid may be discharged by a separately provided pump (not shown) or the like.

[0052] Even if the heating value of the heating unit 101 changes, the temperature of the cooling part 104 can be stably controlled by controlling the flow rate of the refrigerant, etc. However, in order to simplify the description, the control system used to control them and detailed components such as thermometers, vacuum gauges and vacuum valves are omitted here.

[0053] The overall configuration of the jet stream evaporative cooling system 300 is not limited to the above configuration, and may be appropriately set according to the user's purpose, environment, and the like.

[0054] According to the present exemplary embodiment, while the cooling portion 104 is cooled by the jet flow evaporative cooling, the increase in the boiling point of the refrigerant can be suppressed by maintaining the space 120 in a decompressed state. Therefore, the temperature of the cooling portion 104 can be stably controlled, and the jet flow evaporative cooling system 300 with stable cooling efficiency can be provided.

[0055] Refer to the following Figure 7 A jet flow evaporative cooling system 400 according to a fourth exemplary embodiment is described. The fourth to sixth exemplary embodiments described below may be appropriately combined with the above-described configurations according to the first to third exemplary embodiments.

[0056] The jet flow evaporative cooling system 400 according to the present exemplary embodiment is a cooling system that uses a liquid jet flow to cool the heat generating unit 101. The jet flow evaporative cooling system 400 includes a heat transfer portion 102 disposed near the heat generating unit 101 and a jet unit 115. The jet unit 115 includes an opening portion 111 and a partition portion 112 that spray the liquid supplied from the supply portion 110 to the heat transfer portion 102. The jet flow evaporative cooling system 400 also includes a chamber 121 that accommodates a portion of the heat transfer portion 102 and the jet unit 115. In the jet unit 115, the partition portion 112 is disposed near the opening portion 111 to surround the opening of the opening portion 111, and the jet unit 115 maintains the chamber 121 in a reduced pressure environment. In addition, the opening portion 111 accommodated in the chamber 121 is configured to spray the liquid to a second portion (cooling portion 104) of the heat transfer portion 102, which is different from a first portion (arrangement portion 103) of the heat transfer portion 102 where the heat generating unit 101 is disposed.

[0057] Figure 7 A configuration of a jet evaporative cooling system 400 according to a fourth exemplary embodiment is shown.

[0058] Each component included in the jet evaporative cooling system 400 is described below.

[0059] The heat generating unit 101 is in thermal contact with the arrangement portion 103 which is a part of the heat transfer portion 102 , and the heat generated in the heat generating unit 101 is transferred to the cooling portion 104 which is a part of the heat transfer portion 102 via the heat transfer portion 102 .

[0060] The heat transfer portion 102 is made of a material having high thermal conductivity, such as copper, aluminum, or an alloy thereof, and has an appropriate thickness so as to quickly transfer heat generated in the heat generating unit 101 to the cooling portion 104 .

[0061] The arrangement portion 103 is in proper contact with the heat generating unit 101, for example, by closely adhering them using thermal grease, etc., so that the temperature difference (thermal resistance) between the heat generating unit 101 and the heat transfer portion 102 is small. With this configuration, the cooling portion 104 is cooled, so that the heat generated in the heat generating unit 101 can be removed, and the heat generating unit 101 can be quickly cooled.

[0062] The jet flow evaporative cooling system 400 according to the present exemplary embodiment includes a supply portion 110 for supplying a refrigerant 113 and a spray unit 115 including an opening portion 111 and a partition portion 112 for spraying the refrigerant 113 to the cooling portion 104. The jet flow evaporative cooling system 400 also includes a chamber 121 accommodating the spray unit 115, the cooling portion 104, and a discharge portion 122 for discharging the refrigerant and forming a space 120. FIG. 8A to FIG. 8C The shape and effect of the partition portion 112 which are features of the present exemplary embodiment are described.

[0063] The shape of the opening portion 111 can be appropriately determined by the user so that cooling performance suitable for the purpose can be obtained.

[0064] exist Figure 7 In the embodiment, three openings are provided in the opening portion 111, but the present exemplary embodiment is not limited to this configuration, and the number and arrangement of the openings of the opening portion 111 can be appropriately set by the user. For example, a single opening can be provided, or openings can be provided in two directions.

[0065] An example is shown in which the supply portion 110 supplies the refrigerant to each of the plurality of openings of the opening portion 111 , but the present exemplary embodiment is not limited to this configuration, and the supply portion 110 may be individually provided for each of the openings of the opening portion 111 .

[0066] In the jet flow evaporative cooling system 400 according to the present exemplary embodiment, the heat generating unit 101 is disposed outside the space 120. Therefore, it is not necessary to consider the influence of the characteristics (electrical insulation characteristics, chemical characteristics, etc.) of the refrigerant on the heat generating unit 101, and the refrigerant can be appropriately selected according to the expected performance of the jet flow evaporative cooling system 400. For example, in the case where the expected performance is to remove heat from a high heat flux, it is desirable to use a refrigerant containing water as a main component because water has a very large heat of vaporization, which significantly affects the cooling capacity, and is also superior in terms of safety, cost, etc. The space 120 within the chamber 121 is in a reduced pressure environment, in which the vacuum degree is pre-adjusted using a unit for exhausting air from the exhaust portion 123 or the like. The vacuum degree can be adjusted so that the boiling point of the refrigerant is at a temperature expected by the user. For example, in the case where water is used as the refrigerant and the boiling point is set to about 33°C, the vacuum degree in the space 120 can be set to 5 kPa. The jet flow evaporative cooling system 400 allows the refrigerant 113 to pass through the supply portion 110 and be ejected from the opening portion 111 to the cooling portion 104.

[0067] If the temperature of the cooling portion 104 becomes higher than the boiling point of the refrigerant due to the heat generated in the heat generating unit 101, the refrigerant vaporizes into steam, and the cooling portion 104 is cooled by the vaporization heat.

[0068] The vapor of the refrigerant generated at the cooling portion 104 is exhausted from the exhaust portion 123, so that the vacuum degree in the space 120 can be maintained. However, the present exemplary embodiment is not limited to this configuration.

[0069] The discharge portion 122 is appropriately provided so that some of the refrigerant 113 that has been injected to the cooling portion 104 and remains unvaporized is discharged to the outside of the chamber 121 .

[0070] Here, refer to FIG. 8A to FIG. 8C The shape and effect of the partition portion 112 are described. FIG. 8A to FIG. 8C It is an enlarged view of the vicinity of the opening portion 111 in the ejection unit 115 . Fig. 8A An example of the shape of the partition portion 112 is shown, Figure 8B and Figure 8C Examples of different patterns of the shape of the partitioning portion 112 are shown.

[0071] Fig. 8A A state is shown in which water vapor generated by vaporizing liquid at the cooling portion 104 contacts the outer peripheral portion of the ejection unit 115 and condenses to form dew condensation (unvaporized refrigerant) 116 .

[0072] As in the present exemplary embodiment of the present invention, the partition portion 112 is provided to surround the opening of the opening portion 111, thereby preventing the unvaporized refrigerant 116 from entering the opening portion 111 and obstructing the jet flow of the refrigerant 113, and suppressing an instantaneous decrease in cooling efficiency.

[0073] Figure 8B FIG. 1 shows a state where the exterior of the injection unit 115 and the partition portion 112 are integrated. Figure 8B As shown, a step is provided in the height direction of each opening relative to the opening portion 111, and the opening portion of the partition portion 112 is provided at a position lower than the opening portion 111, so that the unvaporized refrigerant 116 can be prevented from entering the opening portion 111. In addition, it can be expected that the manufacturing cost and space of the partition portion 112 can be reduced by processing and integrating the shape of the partition portion 112 outside the injection unit 115. Ideally, Figure 8B The area of ​​the partition 112 in the embodiment is small enough so that condensation of water vapor will not remain therein.

[0074] Figure 8C Another pattern is shown in which the inner periphery of the partition portion 112 is tapered. The shape of the partition portion 112 is not limited to FIG. 8A to FIG. 8C The shape shown in the figure can be any shape having a step in the height direction relative to each opening of the opening portion 111, and can be appropriately set by the user. The partition portion 112 does not need to be annular, and only needs to surround the opening of the nozzle with a small enough gap to prevent dew condensation 116 from entering the spray unit 115.

[0075] The jet evaporative cooling system 400 according to the present exemplary embodiment is configured as described above, and thus the condensed liquid can be prevented from reaching the opening portion 111 of the jet unit 115. According to the present exemplary embodiment, the jet evaporative cooling system 400 having stable cooling efficiency can be provided.

[0076] Fig. 9 A configuration of a jet evaporative cooling system 500 according to a fifth exemplary embodiment is shown.

[0077] According to the fourth exemplary embodiment, the opening portion 111 is configured to spray the refrigerant 113 vertically downward toward the cooling portion 104, as shown in FIG. Figure 7 On the other hand, Fig. 9 As shown, the jet flow evaporative cooling system 500 according to the present exemplary embodiment has a configuration in which the jet flow evaporative cooling system 400 according to the fourth exemplary embodiment is inverted, the chamber 121 is disposed relative to the heat generating unit 101, and the opening portion 111 sprays the refrigerant 113 vertically upward toward the cooling portion 104. Other device configurations and systems are similar to those according to the fourth exemplary embodiment, and thus descriptions thereof are omitted.

[0078] Fig.10 The relationship between the jet collision range 114 and the opening range of the partition portion 112 is shown. Fig.10 In the embodiment, the unvaporized refrigerant 116, which is some of the liquid that is sprayed to the cooling portion 104 but not vaporized, is pushed out of the jet flow collision range 114 in which the liquid is sprayed in the cooling portion 104 by the jet flow of the refrigerant 113 from the opening portion 111. Then, the unvaporized refrigerant 116 accumulates and gradually falls on the spray unit 115 under the action of gravity. Fig.10 As shown, the opening range 112 a of the partition portion 112 is narrower than the jet flow collision range 114 , thereby preventing the unvaporized refrigerant 116 from falling and directly entering the opening portion 111 and obstructing the jet flow of the refrigerant 113 .

[0079] In other words, the opening range of the opening portion 111 is narrower than the opening range 112a of the partition portion 112. Here, the opening range 112a of the partition portion 112 refers to the opening range of the end of the partition portion 112, at which a step is provided in the height direction relative to each opening of the opening portion 111. The jet flow evaporation cooling system 500 according to the present exemplary embodiment is configured as described above, and thus a jet flow evaporation refrigeration system 500 with stable cooling efficiency can be provided. Specifically, it is possible to prevent some of the unvaporized spray liquid from falling due to gravity, reaching the opening portion 111, and obstructing the spray flow of the refrigerant 113.

[0080] Fig.11 An example of the overall configuration of a jet flow evaporative cooling system 600 according to a sixth exemplary embodiment of the present invention is shown. Fig.11 A configuration similar to that of the jet flow evaporative cooling system 400 described according to the fourth exemplary embodiment is shown, but the present exemplary embodiment is not limited to this configuration. The configuration of the jet flow evaporative cooling system 600 may be the configuration described according to the fifth exemplary embodiment, or may be appropriately combined with the configurations according to the first to fourth exemplary embodiments.

[0081] exist Fig.11 In the illustrated jet evaporation cooling system 600, the refrigerant is maintained at a pressure equal to or higher than atmospheric pressure before passing through the refrigerant supply valve 117. If the refrigerant supply valve 117 is opened, the refrigerant is supplied from the refrigerant delivery unit 139 to the supply portion 110 for supplying liquid due to the pressure difference with the pressure in the space 120 within the chamber 121.

[0082] The vapor of the refrigerant vaporized on the cooling surface 104 is discharged from the exhaust portion 123 provided in the chamber 121 through the exhaust path 130 by the pressure reducing pump 135 .

[0083] The decompression pump 135 may be, for example, a gear pump, a water seal type pump, or a water ejector, but is not limited thereto, and may be appropriately selected according to the purpose and environment of the user.

[0084] The refrigerant that is not vaporized on the cooling surface 104 is also collected from the discharge portion 122 via the discharge path 131 by the decompression pump 135, but the present exemplary embodiment is not limited to this configuration. The remaining liquid may be discharged by a separately provided pump (not shown) or the like.

[0085] Even if the heating value of the heating unit 101 changes, the temperature of the cooling part 104 can be stably controlled by controlling the flow rate of the refrigerant, etc. However, in order to simplify the description, the control system used to control them and detailed components such as thermometers, vacuum gauges and vacuum valves are omitted here.

[0086] The overall configuration of the jet stream evaporative cooling system 600 is not limited to the above configuration, and may be appropriately set according to the user's purpose, environment, and the like.

[0087] According to the present exemplary embodiment, while the cooling portion 104 is cooled by jet evaporative cooling, the space 120 may be maintained in a decompressed state, so that an increase in the boiling point of the refrigerant may be suppressed and the temperature of the cooling portion 104 may be stably controlled.

[0088] Fig.12is a schematic diagram showing a jet flow evaporative cooling system according to a seventh exemplary embodiment. This exemplary embodiment is a combination of a part of the configuration according to the first to third exemplary embodiments and a part of the configuration according to the fourth to sixth exemplary embodiments. Specifically, this exemplary embodiment is a combination of the inclination of the cooling portion 104 according to the first to third exemplary embodiments and the partition portion 112 near the opening portion 111 according to at least one of the fourth to sixth exemplary embodiments. The combination according to this exemplary embodiment is merely an example, and the jet flow evaporative cooling system can also be implemented by appropriately combining the configurations of other exemplary embodiments.

[0089] According to the present exemplary embodiment, the jet flow evaporative cooling system 700 includes Figure 1 The jet flow evaporation cooling system 100 shown in the figure is similarly configured, except that the partition portion 112 is provided to surround the opening of the opening portion 111. According to the present exemplary embodiment, in addition to the effect of the first exemplary embodiment, even if the refrigerant condensed in the chamber 121 moves to the vicinity of the opening portion 111, the partition portion 112 makes it difficult for the refrigerant to reach the opening portion 111. Therefore, the jet flow of the refrigerant 113 from the opening portion 111 is less likely to be obstructed, and the temperature of the cooling portion 104 can be further stably controlled.

[0090] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A jet flow evaporative cooling system for cooling a heat generating unit by using a liquid jet flow, the jet flow evaporative cooling system comprising: a heat transfer portion formed integrally with a cooling portion configured to receive the liquid jet and an arrangement portion on which the heat generating unit is arranged; an opening portion configured to spray the liquid supplied from the supply portion to the cooling portion; a discharge portion configured to discharge the liquid; as well as a chamber configured to accommodate the opening portion, the discharge portion, and the cooling portion, and configured not to accommodate the placement portion therein, wherein the chamber is maintained under a reduced pressure environment, wherein the opening portion is configured to spray the liquid onto the cooling portion, wherein at least a portion of the cooling portion is inclined, and The liquid is discharged from the discharge portion via the cooling portion.

2. The jet flow evaporative cooling system according to claim 1, in, In the chamber, the cooling portion is vertically arranged below the opening portion, and at least a portion of the discharge portion is vertically arranged below the cooling portion.

3. The jet flow evaporative cooling system according to claim 1, in, In the chamber, the cooling part is vertically arranged above the opening part, the discharge part is vertically arranged below the opening part, and the opening part is vertically arranged below the cooling part and arranged at a position different from the position of the vertically lower part of the lowermost part of the cooling part.

4. The jet flow evaporative cooling system according to any one of claims 1 to 3, further comprising a jet unit, the jet unit being configured to include the supply portion, the opening portion, and a partition portion, in, The partition portion is arranged near the opening portion to surround the opening portion in the ejection unit.

5. The jet flow evaporative cooling system according to claim 4, wherein: An opening range of the opening portion is narrower than an opening range of the partition portion.

6. The jet flow evaporative cooling system according to any one of claims 1 to 3, in, The cooling portion includes a trough portion formed by an upper trough portion and a lower trough portion, and Wherein, at least a portion of the upper groove portion and the lower groove portion is inclined in a direction in which the groove portion extends.

7. The jet flow evaporative cooling system according to any one of claims 1 to 3, wherein: The liquid mainly comprises water.

8. The jet flow evaporative cooling system according to any one of claims 1 to 3, further comprising: a refrigerant delivery unit configured to deliver liquid to the supply portion; as well as A decompression unit is configured to discharge gas generated by vaporizing the liquid in the chamber from the chamber via a gas exhaust portion.

Citation Information

Cited By

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