Vertically stacked power supply module structure and manufacturing method, equipment and medium thereof

Abstract

The invention discloses a vertically stacked power supply module structure and a manufacturing method, device and medium thereof, the vertically stacked power supply module structure comprises a chip, a PCB frame layer, an inductor structure and a PCB circuit layer, the inductor structure is embedded in the PCB frame layer, and the chip is attached to the top of the PCB circuit layer; the inductor structure comprises an inductor winding, a magnet and a metal frame, the magnet wraps the inductor winding to form a cuboid inductor body, and the metal frame covers a plurality of outer side faces of the cuboid inductor body to form a magnetic shielding layer; the PCB circuit layers are located at the top and the bottom of the PCB frame layer and are composed of dielectric layers, copper conducting layers, copper through holes and solder mask layers. The dielectric layer of the PCB frame layer is provided with a copper through hole at a position corresponding to the adjacent copper conductive layer and the winding terminal of the inductance structure, and is also provided with a copper through hole at a position corresponding to the adjacent copper conductive layer and the metal frame of the inductance structure. By designing the inductance shielding layer and the PCB through hole structure, electromagnetic shielding and heat dissipation enhancement are achieved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor packaging, and in particular, relates to a vertically stacked power module structure and a manufacturing method, equipment, and medium thereof. Background Art

[0002] With the continuous development of semiconductor technology, in the field of high-integration power chip packaging, in order to adapt to the ever-shrinking terminal equipment, it is necessary to design power chips or modules to occupy as little space as possible.

[0003] Therefore, the industry has proposed a method of vertically stacking components to further reduce the plane space.

[0004] The inventor found that, on the one hand, the control signal interconnection of the switching power module integrated with the digital power control chip is sensitive to electromagnetic interference, and when the inductor is assembled with these chips into a highly integrated power module, the distance between the inductor and these signals is reduced, and its electromagnetic field is very likely to affect the control signal, especially in high-current applications, so it is necessary to electromagnetically shield the inductor to improve the stability of the power module. On the other hand, in order to pursue a smaller volume, the heat dissipation density of the highly integrated power module increases, and it is necessary to provide a heat dissipation channel for the chip as much as possible to ensure its normal operation. The application of PCB embedding technology to improve the integration of the power module will cause the heat dissipation path of the chip itself to become longer, making it at risk of overheating, so it is necessary to perform a more sophisticated heat dissipation design. Summary of the invention

[0005] In order to solve the problem of how to provide a vertically stacked power module structure in the prior art to meet the requirements of electromagnetic shielding and heat dissipation enhancement in magnetic integrated power modules, the technical solution of this application is as follows: On the one hand, a vertically stacked power module structure is provided, comprising: a chip, a PCB frame layer, an inductor structure and a PCB circuit layer, wherein the inductor structure is embedded in the PCB frame layer, the PCB circuit layer covers the top and bottom of the PCB frame layer and forms a PCB as a whole, and the chip is mounted on the top of the PCB as a whole; The inductor structure includes an inductor winding, a magnet and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, and the metal frame covers multiple outer sides of the rectangular inductor body to form a magnetic shielding layer; The PCB circuit layer is provided with a dielectric layer, a copper conductive layer, and a solder resist layer from the inside to the outside; The solder mask is located on the outermost layer of the PCB circuit layer to form a pad pattern that matches the chip pins; The dielectric layer is provided with copper through holes at positions corresponding to the copper conductive layer adjacent to it and the winding terminals of the inductor structure, so that the winding terminals and the copper conductive layer form electrical interconnections and enhance heat dissipation; The dielectric layer is provided with copper through holes at positions corresponding to the adjacent copper conductive layer and the metal frame of the inductor structure, so as to enhance heat dissipation between the metal frame and the copper conductive layer.

[0006] The metal frame is a thin sheet type, and includes one or more metal sheets.

[0007] There are one or more inductor windings.

[0008] The copper through hole includes any one or more of a solid hole slot and a surface copper-clad hole slot.

[0009] On the other hand, a method for manufacturing the vertically stacked power module structure is provided, comprising the steps of: S31: manufacturing an inductor structure having a magnetic shielding layer; S32: preparing a PCB frame layer, and embedding the inductor structure in the PCB frame layer; S33: embedding and coating the PCB frame layer; S34: making PCB circuit layers, including copper conductive layers, dielectric layers and solder resist layers, and making copper through holes according to the design to form electrical circuits and thermal conductive holes connected to the magnetic shielding layer; S35: Chips and components are mounted to complete the production of the vertically stacked power module.

[0010] The steps of making the inductor structure with a magnetic shielding layer include: assembling a metal sheet on the periphery of the magnet of the inductor winding, and the assembling method includes pasting, molding, or using a metal plating process to achieve metal coverage on the surface of the inductor.

[0011] The steps of making the inductor structure with a magnetic shielding layer include: prefabricating the metal sheet into a specific wrapping shape and then performing electromagnetic shielding assembly.

[0012] The manufacturing method is full-plate manufacturing and embedding of multiple inductor structures at the same time.

[0013] On the other hand, a vertically stacked power module structure manufacturing device is provided, comprising a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the above-mentioned vertically stacked power module structure manufacturing method.

[0014] On the other hand, a computer-readable storage medium is provided, on which program instructions are stored, and when the program instructions are executed by a processor, the method for manufacturing the vertically stacked power module structure is implemented.

[0015] The beneficial effects of the present application are: providing a vertically stacked power module structure, including: a chip, a PCB frame layer, an inductor structure, and a PCB circuit layer, wherein the inductor structure is embedded in the PCB frame layer, and the chip is mounted on the top of the PCB circuit layer; the inductor structure includes an inductor winding, a magnet, and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, and the metal frame covers multiple outer sides of the rectangular inductor body to form a magnetic shielding layer; the PCB circuit layer is located at the top and bottom of the PCB frame layer, and is composed of a dielectric layer, a copper conductive layer, a copper through hole, and a solder mask layer. The dielectric layer of the PCB frame layer is provided with a copper through hole at a position corresponding to the winding terminal of the inductor structure and the copper conductive layer adjacent to it, and a copper through hole is provided at a position corresponding to the metal frame of the inductor structure. By forming an electromagnetic shield, the magnetic shielding layer and the through hole can realize the formation of a heat conduction channel when the inductor is embedded in the PCB magnetic integration, thereby achieving the effect of heat dissipation enhancement. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a structural schematic diagram of an embodiment of an inductor structure of the present application; Figure 2 It is a flow chart of an embodiment of a method for manufacturing an inductor structure of the present application; Figure 3 It is a schematic diagram of a sub-flow of an embodiment of a method for manufacturing an inductor structure of the present application; Figure 4 yes Figure 3 Schematic diagram of the corresponding structural changes; Figure 5 It is a schematic diagram of a sub-flow of an embodiment of a method for manufacturing an inductor structure of the present application; Figure 6 yes Figure 5 Schematic diagram of the corresponding structural changes; Figure 7 is a structural schematic diagram of an embodiment of an inductor structure of the present application; Figure 8 yes Figure 7 A schematic flow chart of an embodiment of a corresponding manufacturing method of the inductor structure; Fig. 9 yes Figure 8 The corresponding structural decomposition diagram; Fig.10 This is a structural schematic diagram of an embodiment of a vertically stacked power module structure of the present application; Fig.11 It is a schematic structural diagram of an embodiment of the inductor structure metal frame of the present application with six sides continuously covered; Fig.12 It is a structural schematic diagram of an embodiment of the present invention in which the metal frame of the inductor structure is non-continuously covered on four sides; Fig.13It is a structural schematic diagram of an embodiment of a prefabricated package shape of an inductor structure metal frame of the present application; Fig.14 It is a flow chart of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.15A It is a schematic diagram of a top view of an embodiment of a single-phase module of a vertically stacked power module structure of the present application; Fig. 15B It is a schematic diagram of a top view of an embodiment of a two-phase module and an N-phase module of a vertically stacked power module structure of the present application; Fig. 15C It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.15D It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.15E It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.15F It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Figure 15G It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.15H It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.15I It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.15J It is a schematic diagram of structural changes of an embodiment of a method for manufacturing a vertically stacked power module structure of the present application; Fig.16 It is a schematic diagram of the framework of an embodiment of a vertically stacked power module structure manufacturing device provided by the present application; Fig.17 It is a schematic diagram of a framework of an embodiment of a computer-readable storage medium provided by the present application. DETAILED DESCRIPTION

[0017] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. The preferred embodiments of the present application are provided in the accompanying drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0018] It should be noted that, unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0019] The following are definitions of the professional terms used in the embodiments of this application: Digital power module: A hybrid digital-analog electronic module designed and manufactured based on power topology to provide power energy conversion.

[0020] Chip: integrated circuit carrier.

[0021] Vertical stacking: a form of integration in which chips and other electronic devices are stacked in the vertical direction.

[0022] Packaging: Integrate one or more chips and other electronic devices into one and realize electrical interconnection with peripheral circuits.

[0023] Magnetic integrated power module: The inductor package is integrated into the power module, so that the application power module does not need to be configured with an external inductor.

[0024] Molded inductor: An inductor formed by molding a soft magnetic powder core and a copper conductor through pressing equipment and a mold, and then undergoing heat treatment and other steps.

[0025] Metal frame: A thin metal sheet with a specific shape and structure that can achieve functions such as electrical interconnection and heat dissipation, commonly made of copper.

[0026] SMT surface mounting: The process of using automated equipment and a steel mesh with a specific shape to apply solder paste or other connecting materials, place components, and fix the materials by melting and solidifying.

[0027] Sintered metal: Utilizing the strong activation of the surface of metal nanoparticles, a stable structure is formed through solid-state bonding between nanoparticles at a temperature much lower than the melting point of the metal. Common examples are silver and copper nanoparticles.

[0028] Sintering: The inductor is heat treated according to the material properties to form a dense structure inside.

[0029] The specific contents of this application are described in detail below in conjunction with specific embodiments.

[0030] The present application relates to a power module form and manufacturing method, specifically to a power module design and manufacturing method based on a PCB embedding process and a copper interconnection process, and in conjunction with an inductor structure with magnetic shielding, heat dissipation, and electrical interconnection functions based on compression molding and a metal frame, ultimately realizing a high-performance power module and a corresponding implementation method.

[0031] The inventors have found that in the packaging of high power density and high integration digital power modules, some new requirements are put forward for the packaging structure and inductance. The main problems are described as follows: 1. The magnetically integrated digital power module needs to integrate the power part and the control part in a limited volume. As the power density of the power module increases and the distance between the power part and the control part inside the module decreases, the control signal inside the power module is easily interfered by the power part, causing the power module to work unstably.

[0032] 2. Common inductors are mainly used in planar power circuit structures and are not suitable for highly integrated power modules with vertical stacking structures.

[0033] 3. The vertically stacked magnetic integrated power module packaging design concept poses a challenge to the interconnection method of inductors, resulting in the need for inductor terminals to be located on different surfaces and the need for electromagnetic shielding design.

[0034] In view of this, the present application provides an inductor manufacturing method with an electrical interconnection design, which is compatible with the mature compression molding inductor manufacturing method and semiconductor process. Advanced system-level packaging requires higher dimensional accuracy of devices than the general capabilities of inductor manufacturing, which limits the flexibility of packaging design. The electrode reconstruction method provided by the present invention can solve this precision mismatch and improve design flexibility.

[0035] on the one hand, Figure 1 is a schematic diagram of the structure of an embodiment of the inductor structure of the present application, refer to Figure 1 As shown, the present application provides an inductor structure, including: an inductor winding 103, a magnet 102 and a metal frame 101, wherein the magnet 102 wraps the inductor winding 103 to form a rectangular inductor body, and the metal frame 101 covers the top and / or bottom of the rectangular inductor body and is connected to the inductor winding 103 terminals extended and bent to the top and / or bottom of the rectangular inductor body.

[0036] By providing a metal frame at the top and / or bottom, the flexibility of connecting the inductor with other devices can be expanded on the one hand, and the heat dissipation efficiency can be increased on the other hand. It can be seen that the inductor structure greatly improves the electrical interconnection and heat dissipation capabilities of the inductor, allowing the inductor to provide other functions in addition to the electromagnetic function.

[0037] The metal frame 101 is in a thin sheet shape, and the width of the metal frame 101 is greater than the width of the terminal of the inductor winding 103 .

[0038] Although it is also possible to set the inductor terminal on the top by extending the inductor winding and bending it, the inductor winding is relatively thin, and this method is likely to cause the winding flatness to decrease. The metal frame can be set to a width larger than the inductor winding, thereby meeting more flexible electrical interconnection needs.

[0039] on the other hand, Figure 2 FIG. 1 is a flow chart of an embodiment of a method for manufacturing an inductor structure of the present application. Figure 2 As shown, the present application provides a method for manufacturing the above-mentioned inductor structure, comprising the steps of: S11: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S12: placing the inductor winding into the mold cavity, loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding terminal; S13: Mounting sheet metal frame; S14: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

[0040] The fixed shape may also include other shapes, which are adjusted according to the inductor design requirements.

[0041] in, Figure 3 is a schematic diagram of a sub-flow diagram of an embodiment of a method for manufacturing an inductor structure of the present application. Figure 3 As shown, the mounting of the sheet metal frame in step S13 includes: S1311: Use a steel mesh that matches the end of the inductor winding to coat the sintered nano-metal material, or use a dispensing method to apply the material at a specified position on the end of the inductor winding; S1312: Mount the sheet metal frame at the designated position of the inductor winding end.

[0042] Figure 4 yes Figure 3 The corresponding structural change diagram is as follows: Figure 4 As shown, a schematic diagram of the structural changes of the whole process of the above method is shown, which specifically includes: 1. Make the winding into a fixed shape; 2. Bend the winding ends so that one end of the terminal faces vertically upward and the other end faces vertically downward; 3. Fill and pre-press the magnetic powder to expose the inductor winding terminals; 4. Apply sintering material to the terminal; 5. Install the thin metal frame at the corresponding position; 6. Pressing molding + sintering.

[0043] in, Figure 5 FIG. 1 is a schematic diagram of a sub-flow chart of another embodiment of the method for manufacturing the inductor structure of the present application. Figure 5 As shown, the step S13 of mounting the thin sheet metal frame includes: S1321: coating the thin metal frame with sintered nano-metal material, mounting the preformed inductor on a designated position of the metal frame, sintering and curing the nano-metal once, and dividing the nano-metal; S1322: The segmented inductor is surface mounted on another metal frame and pressed into shape, sintered and solidified to complete the connection on the other side.

[0044] Figure 6 yes Figure 5 The corresponding structural change diagram is as follows: Figure 6 As shown, a schematic diagram of the structural changes of the whole process of the above method is shown, which specifically includes: 1. Make the winding into a fixed shape; 2. Bend the winding ends so that the terminal at one end faces vertically upward and the terminal at the other end faces vertically downward; 3. Fill and pre-press the magnetic powder to expose the inductor winding terminals; 4. Apply the sintered material on the metal frame; 5. Mount the inductor to the metal frame on one side; 6. Flip the inductor over and mount it to the metal frame on the other side for the second time. 7. Pressing and sintering.

[0045] On the other hand, Figure 7 is a structural schematic diagram of an embodiment of an inductor structure of the present application; refer to Figure 7 The present application also provides an inductor structure, including: an inductor winding 103, a magnet 102, a metal connecting sheet 104 and a metal frame 101, wherein the magnet 102 wraps the inductor winding 103 and the metal connecting sheet 104 to form a rectangular inductor body, the metal connecting sheet 104 is located on the outer peripheral surface of the rectangular inductor body, and the metal frame 101 covers the top and / or bottom of the rectangular inductor body, and is connected to the inductor winding 103 terminal and the metal connecting sheet 104 terminal extended and bent to the top and / or bottom of the rectangular inductor body.

[0046] The metal sheet around the inductor is used to expand the flexibility of electrical interconnection. The top and bottom are mounted through a metal frame to achieve conduction, or the inductor body is used to achieve heat dissipation.

[0047] It can be seen that by introducing the metal connecting sheet on the outer peripheral surface, the flexibility of the electrical interconnection of the inductor can be further improved, and the heat dissipation effect can be improved.

[0048] There are multiple metal frames 101 , and the metal frames 101 located at the top and bottom of the rectangular parallelepiped inductor body have different shapes and arrangements.

[0049] Among them, the number and arrangement of metal frames and metal connecting plates can be flexibly changed to meet different electrical interconnection requirements, inductance performance requirements and heat dissipation requirements.

[0050] On the other hand, Figure 8 yes Figure 7 FIG. 1 is a flow chart of an embodiment of a corresponding manufacturing method of the inductor structure.

[0051] refer to Figure 8 As shown, the present application also provides a method for manufacturing the above-mentioned inductor structure, comprising the steps of: S21: manufacturing the copper material into an inductor winding of a fixed shape, wherein the fixed shape includes any one of the following: Z-shape, I-shape, U-shape, C-shape, and spiral shape; S22: placing the inductor winding and the corresponding metal connecting piece terminal into the mold cavity, and loading magnetic powder, and pre-pressing it to keep a certain shape and expose the inductor winding and the metal connecting piece terminal; S23: coating the sintered nano-metal material using a steel mesh matched with the inductor winding end and the metal connecting piece end, or dispensing the material at the designated positions of the inductor winding end and the metal connecting piece end by dispensing; and then attaching the sheet-type metal frame to the designated positions of the inductor winding end and the metal connecting piece end; S24: After pressing and molding, sintering is performed to form the magnetic powder into a solid whole, and the sintered material solidifies to form good connection and conductivity.

[0052] The fixed shape may also include other shapes, which are adjusted according to the inductor design requirements.

[0053] For details, please refer to Fig. 9 , Fig. 9 yes Figure 8 The corresponding structural decomposition diagram. Fig. 9 It can be seen that the metal frames at the top and bottom of the inductor structure have different shapes, and by connecting with the metal connecting pieces on the outer peripheral surface of the inductor body, various electrical connection requirements can be met.

[0054] Based on the above solution, the above inductor structure can be further packaged into a PCB and mounted with the chip to form a vertically stacked power module structure. The following is a specific embodiment: On the other hand, reference Fig.10 and Fig.15J As shown, the present application provides a vertically stacked power module structure, comprising: Chip 201, PCB frame layer 204, inductor structure and PCB circuit layer, the inductor structure is embedded in the PCB frame layer 204, the PCB circuit layer covers the top and bottom of the PCB frame layer 204, and constitutes the PCB as a whole, and the chip 201 is mounted on the top of the PCB as a whole; The inductor structure includes an inductor winding 103, a magnet 102 and a metal frame 101, wherein the magnet 102 wraps the inductor winding 103 to form a rectangular inductor body, and the metal frame 101 covers multiple outer sides of the rectangular inductor body to form a magnetic shielding layer; The PCB circuit layer is provided with a dielectric layer 203, a copper conductive layer 205, and a solder resist layer 206 from the inside to the outside; The solder resist layer 206 is located at the outermost layer of the PCB circuit layer to form a pad pattern that matches the pins of the chip 201; The dielectric layer 203 is provided with a copper through hole 202 at a position corresponding to the copper conductive layer 205 adjacent thereto and the terminal of the inductor winding 103 of the inductor structure (refer to Fig.15J The first copper through hole on the left side of the lower part) is provided so that the terminal of the inductor winding 103 is electrically interconnected with the copper conductive layer 205 and heat dissipation is enhanced; The dielectric layer 203 is provided with a copper through hole 202 at a position corresponding to the copper conductive layer 205 adjacent thereto and the metal frame 101 of the inductor structure (refer to Fig.15J The 2nd to 5th copper through holes on the lower left side are provided to enhance heat dissipation between the metal frame 101 and the copper conductive layer.

[0055] Among them, the purpose of the magnetic shielding layer composed of metal is not only to form electromagnetic shielding, but also to form a heat conduction channel when the inductor is embedded in the PCB magnetic integration.

[0056] This is because, in the design of a mixed digital-analog switching power supply module, due to the integration of a digital power supply control chip, its control signal is very sensitive to electromagnetic interference. When the inductor is assembled with these chips into a highly integrated power supply module (such as the vertically stacked power supply module structure described in this application), the distance between the inductor and these signals becomes increasingly smaller, causing the electromagnetic field of the inductor to easily affect the control signal issued by the digital power supply control chip, especially in high current applications. Therefore, the inductor needs to be electromagnetically shielded to improve the stability of the power supply module.

[0057] Furthermore, in order to reduce the size of highly integrated power modules, their heat dissipation density increases dramatically, and it is necessary to provide heat dissipation channels for the chips as much as possible to ensure their normal operation. However, the use of PCB embedding technology to improve the integration of power modules will itself cause the heat dissipation path of the chip itself to become longer, making it at risk of overheating, so a more sophisticated heat dissipation design is required.

[0058] It can be seen that the present application provides a form and implementation method of vertically stacking high-integration power modules using PCB embedding technology, which can be applied to the design of mixed analog and digital switching power modules. The main idea is to achieve electromagnetic shielding and heat dissipation enhancement by designing the inductor shielding layer and PCB through-hole structure.

[0059] Among them, reference Fig.11 , Fig.12 As shown, the metal frame is a thin sheet type, and the metal frame includes one or more metal sheets. The wrapping method can be to wrap the rectangular inductor body continuously on six sides, or to wrap the rectangular inductor body discontinuously on four sides. The best wrapping scheme can be designed according to the analysis of the electromagnetic field.

[0060] Further, refer to Fig.13 As shown, the metal frame can also be designed as a prefabricated package shape and then assembled to further improve assembly efficiency.

[0061] There are multiple inductor windings, and multiple inductor windings can be arranged in the same inductor structure according to actual needs.

[0062] The copper through hole includes any one or more of a solid hole slot and a surface copper-clad hole slot. The hole slot described in the present application includes any one of a hole and a slot.

[0063] On the other hand, reference Fig.14 As shown, a method for manufacturing the vertically stacked power module structure is provided, comprising the steps of: S31: manufacturing an inductor structure having a magnetic shielding layer; S32: preparing a PCB frame layer, and embedding the inductor structure in the PCB frame layer; S33: embedding and coating the PCB frame layer to make a dielectric layer; S34: making PCB circuit layers, including copper conductive layers, dielectric layers and solder resist layers, and making copper through holes according to the design to form electrical circuits and thermal conductive holes connected to the magnetic shielding layer; S35: Chip and component mounting to complete the vertical stacked power module production.

[0064] The step S31 of manufacturing the inductor structure with the magnetic shielding layer is specifically described in the various methods in the aforementioned inductor structure embodiments, which will not be described in detail here.

[0065] Furthermore, step S31 of manufacturing the inductor structure with a magnetic shielding layer includes: assembling a metal sheet on the periphery of the magnet of the inductor winding, and the assembling method includes pasting, molding, or using a metal plating process to achieve metal coverage on the surface of the inductor.

[0066] Furthermore, the steps of making the inductor structure with a magnetic shielding layer include: prefabricating the metal sheet into a specific wrapping shape and then assembling it for electromagnetic shielding; or forming a specific pattern and then performing metal plating.

[0067] In order to improve efficiency, in actual production, the above production method is full-plate production, that is, multiple inductor structures are embedded into the PCB frame layer at the same time.

[0068] Further, FIG. 15A to FIG. 15J The specific structural change diagram is shown. This process belongs to the industry's advanced PCB process, and this structure that can achieve both electromagnetic shielding and improved thermal conductivity has not been seen before. This embodiment takes the example of embedding a single winding inductor to make a magnetic integrated power module. FIG. 15A to FIG. 15G The schematic diagrams shown in the figure are all single-body cross-section diagrams. The actual production can be a full-board production with multiple inductors embedded. It should be noted that this example is only a schematic diagram of a module with one layer of copper on the outer layer, and a similar structure can be made with multiple layers of copper.

[0069] Specifically, Fig.15A , Fig. 15B This is a top view of an embodiment of the vertically stacked power module structure of the present application. The upper row is the control chip, the lower row is the power chip, and the others are passive components such as resistors and capacitors. Fig.15A For single-phase modules, Fig. 15B The left picture in the middle is a two-phase module, and the right picture is a four-phase or N-phase module.

[0070] FIG. 15C to FIG. 15I for Fig.15A Section B of the middle module. Fig.15J for Fig.15A Schematic diagram of section A of the middle module.

[0071] FIG. 15C to FIG. 15I The structural changes during the manufacturing process of the above method are shown, wherein the difference between the right figure and the left figure in some drawings is that a copper through hole 202 is added in the medium outside the inductor structure of the PCB frame layer.

[0072] Fig. 15C To obtain a cross-sectional view of an inductor structure with a magnetic shielding layer.

[0073] Fig.15D A cross-sectional diagram of preparing a PCB frame and embedding the inductor in the PCB.

[0074] Fig.15E For embedded cladding, a cross-sectional view of the dielectric layer is made.

[0075] Fig.15FThe cross-sectional diagram of copper hole production is shown, including the formation of electrical circuits and thermal conductive holes connected to the magnetic shielding layer. It can be a solid hole slot or a surface copper-clad hole slot, and there is no restriction on the hole size or copper thickness.

[0076] Figure 15G Shows the copper conductive layer used in making PCB circuit layers.

[0077] Fig.15H Demonstrates the production of solder mask in PCB circuit layer.

[0078] Fig.15I The overall structure after chip mounting is completed is shown.

[0079] Furthermore, the PCB frame layer is formed by pressing a single dielectric layer or a plurality of dielectric layers. According to electrical design requirements, copper conductive layers may be added between the layers of the multi-layer dielectric layers to form more electromagnetic shielding.

[0080] Furthermore, if Fig.15D , Fig.15E As shown, a specific portion of the PCB frame layer will be removed to form a space for embedding the inductor structure; after the inductor structure is placed in the space, a dielectric layer material is added to cover the inductor structure and fill the gap in the space (this is also the role of the dielectric layer 203 close to the inductor structure) to complete the embedding and encapsulation.

[0081] Furthermore, the dielectric layer and the copper conductive layer may be a stacked structure that overlaps each other. The number of stacked layers may be multiple layers according to the electrical interconnection design. Multiple non-coplanar copper conductive layers may be electrically interconnected with each other through copper through-holes.

[0082] Further, refer to Fig.15I The right side of Fig.15J As shown, copper through holes may be provided at corresponding positions of the dielectric material between the copper conductive layer 205 , the metal frame 101 of the inductor structure, and the copper conductive layer 205 in the PCB frame layer 204 , thereby enhancing the heat dissipation effect.

[0083] Furthermore, according to the electrical interconnection design, the terminal of the inductor winding extended and bent to the outer side surface of the rectangular inductor body can be connected to the magnetic shielding layer (not shown in the figure), thereby realizing diversified electrical interconnection.

[0084] It can be seen that the present application innovatively proposes an inductor shielding layer design and a thermal conductive design in which the PCB is interconnected with the inductor shielding layer through copper vias, while realizing an inductor embedded PCB magnetic integrated power module form with optimized electromagnetic shielding and thermal conductivity.

[0085] On the other hand, the present application also provides a vertically stacked power module structure manufacturing device, including a memory and a processor coupled to each other, the processor is used to execute program instructions stored in the memory to implement the above-mentioned vertically stacked power module structure manufacturing method.

[0086] Specifically, see Fig.16 The vertical stacked power module structure manufacturing device 200 of the present application may specifically include a processor 210 and a memory 220 . The memory 220 is coupled to the processor 210 .

[0087] The processor 210 is used for the operation of the vertically stacked power module structure manufacturing device 200. The processor 210 can also be called a CPU (Central Processing Unit). The processor 210 may be an integrated circuit chip with signal processing capabilities. The processor 210 can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor can be a microprocessor or the processor 210 can also be any conventional processor, etc.

[0088] The memory 220 is used to store computer programs, and may be a RAM, a ROM, or other types of storage devices. Specifically, the memory may include one or more computer-readable storage media, which may be non-transitory. The memory may also include a high-speed random access memory, and a non-volatile memory, such as one or more disk storage devices, flash memory storage devices. In some embodiments, the non-transitory computer-readable storage medium in the memory is used to store at least one program code.

[0089] The processor 210 is used to execute the computer program stored in the memory 220 to implement the methods described in the various method embodiments of the present application.

[0090] In some embodiments, the vertical stacked power module structure manufacturing device 200 may further include: a peripheral device interface 230 and at least one peripheral device. The processor 210, the memory 220 and the peripheral device interface 230 may be connected via a bus or a signal line. Each peripheral device may be connected to the peripheral device interface 230 via a bus, a signal line or a circuit board. Specifically, the peripheral device includes: at least one of a radio frequency circuit 240, a display screen 250, an audio circuit 260 and a power supply 270.

[0091] The peripheral device interface 230 may be used to connect at least one peripheral device related to I / O (Input / output) to the processor 210 and the memory 220. In some embodiments, the processor 210, the memory 220, and the peripheral device interface 230 are integrated on the same chip or circuit board; in some other implementations, any one or two of the processor 210, the memory 220, and the peripheral device interface 230 may be implemented on a separate chip or circuit board, which is not limited in this embodiment.

[0092] The radio frequency circuit 240 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The radio frequency circuit 240 communicates with the communication network and other communication devices through electromagnetic signals, and the radio frequency circuit 240 is the communication circuit of the vertically stacked power module structure manufacturing device 200. The radio frequency circuit 240 converts the electrical signal into an electromagnetic signal for transmission, or converts the received electromagnetic signal into an electrical signal. Optionally, the radio frequency circuit 240 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, etc. The radio frequency circuit 240 can communicate with other terminals through at least one wireless communication protocol. The wireless communication protocol includes but is not limited to: the World Wide Web, a metropolitan area network, an intranet, various generations of mobile communication networks (2G, 3G, 4G and 5G), a wireless local area network and / or a WiFi (Wireless Fidelity) network. In some embodiments, the radio frequency circuit 240 may also include circuits related to NFC (Near Field Communication), which is not limited in this application.

[0093] The display screen 250 is used to display a UI (User Interface). The UI may include graphics, text, icons, videos, and any combination thereof. When the display screen 250 is a touch display screen, the display screen 250 also has the ability to collect touch signals on the surface or above the surface of the display screen 250. The touch signal can be input to the processor 210 as a control signal for processing. At this time, the display screen 250 can also be used to provide virtual buttons and / or virtual keyboards, also known as soft buttons and / or soft keyboards. In some embodiments, the display screen 250 can be one, arranged on the front panel of the vertically stacked power module structure manufacturing device 200; in other embodiments, the display screen 250 can be at least two, respectively arranged on different surfaces of the vertically stacked power module structure manufacturing device 200 or in a folding design; in other embodiments, the display screen 250 can be a flexible display screen, arranged on a curved surface or a folding surface of the vertically stacked power module structure manufacturing device 200. Even, the display screen 250 can also be set to a non-rectangular irregular figure, that is, a special-shaped screen. The display screen 250 can be made of materials such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode).

[0094] The audio circuit 260 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, and convert the sound waves into electrical signals and input them into the processor 210 for processing, or input them into the radio frequency circuit 240 to achieve voice communication. For the purpose of stereo acquisition or noise reduction, there may be multiple microphones, which are respectively arranged at different parts of the vertically stacked power module structure manufacturing device 200. The microphone may also be an array microphone or an omnidirectional acquisition microphone. The speaker is used to convert the electrical signal from the processor 210 or the radio frequency circuit 240 into sound waves. The speaker may be a traditional film speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can not only convert the electrical signal into sound waves audible to humans, but also convert the electrical signal into sound waves inaudible to humans for purposes such as ranging. In some embodiments, the audio circuit 260 may also include a headphone jack.

[0095] The power supply 270 is used to power the various components in the vertically stacked power module structure manufacturing device 200. The power supply 270 can be an alternating current, a direct current, a disposable battery, or a rechargeable battery. When the power supply 270 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is a battery that is charged through a wired line, and a wireless rechargeable battery is a battery that is charged through a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0096] For a detailed description of the functions and execution processes of each functional module or component in the embodiment of the intelligent control platform of the present application, reference can be made to the description in the above-mentioned embodiment of each method of the present application, which will not be repeated here.

[0097] In the several embodiments provided in the present application, it should be understood that the disclosed intelligent control platform and method can be implemented in other ways. For example, the various embodiments of the intelligent control platform described above are only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0098] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0099] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0100] On the other hand, the present application provides a computer-readable storage medium storing a computer program, where the computer program can be executed by a processor to implement any of the above methods.

[0101] See also Fig.17, if the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium 300. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including several instructions / computer programs to enable an intelligent control platform (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of each implementation method of the present application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks or optical disks, and electronic devices such as computers, mobile phones, laptops, tablet computers, cameras, etc. with the above-mentioned storage media.

[0102] The description of the execution process of the program data in the computer-readable storage medium can refer to the description in the above-mentioned method embodiments of the present application, which will not be repeated here.

[0103] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

[0104] Those skilled in the art will appreciate that, in the above method of specific implementation, the order in which the steps are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of the steps should be determined by their functions and possible internal logic.

[0105] In summary, this application has the following beneficial effects: The electrical interconnection and heat dissipation capabilities of the inductor are greatly improved through a metal frame or selective electroplating, so that the inductor can provide other functions in addition to the electromagnetic function.

[0106] Furthermore, the connection between the inductor and the metal frame is achieved by sintering the nano-metal material, that is, the connection is made using the sintered nano-metal material, which effectively improves the production efficiency.

[0107] Furthermore, the inductor structure of the present application is simple, which improves the flexibility of electrical interconnection and heat dissipation capability while being easy to assemble.

[0108] Furthermore, the present application provides a variety of variations of the inductor structure, which can be flexibly designed according to different requirements.

[0109] Furthermore, the present application provides manufacturing methods corresponding to different inductor structures, so that the manufacturing method can be tailored to the characteristics of the corresponding inductor structure, saving steps and improving accuracy.

[0110] Furthermore, only one PCB is needed to assemble the power module, which has high assembly accuracy, high integration, increased power density, and reduced application-side design requirements.

[0111] Furthermore, the power loop between the chip and the inductor is very short, which reduces losses and improves energy conversion efficiency.

[0112] Furthermore, the electromagnetic shielding and module heat conduction are optimized simultaneously by using the metal-clad inductor, which not only eliminates the electromagnetic interference of the inductor to the digital power control signal, but also optimizes the heat dissipation of the power chip.

Claims

1. A vertically stacked power module structure, characterized in that: include: A chip, a PCB frame layer, an inductor structure and a PCB circuit layer, wherein the inductor structure is embedded in the PCB frame layer, the PCB circuit layer covers the top and bottom of the PCB frame layer and forms a PCB as a whole, and the chip is mounted on the top of the PCB as a whole; The inductor structure comprises an inductor winding, a magnet and a metal frame, wherein the magnet wraps the inductor winding to form a rectangular inductor body, and the metal frame covers multiple outer sides of the rectangular inductor body to form a magnetic shielding layer; The PCB circuit layer is provided with a dielectric layer, a copper conductive layer, and a solder resist layer from the inside to the outside; The solder resist layer is located at the outermost layer of the PCB circuit layer to form a pad pattern that matches the chip pins; The dielectric layer is provided with copper through holes at positions corresponding to the copper conductive layer and the winding terminals of the inductor structure adjacent thereto, so that the winding terminals and the copper conductive layer are electrically interconnected and heat dissipation is enhanced; The dielectric layer is provided with copper through holes at positions corresponding to the adjacent copper conductive layer and the metal frame of the inductor structure, so as to enhance heat dissipation between the metal frame and the copper conductive layer.

2. The vertically stacked power module structure according to claim 1, characterized in that: The metal frame is of a thin sheet type, and includes one or more metal sheets.

3. The vertically stacked power module structure according to claim 1, characterized in that: The number of the inductor winding is one or more.

4. The vertically stacked power module structure according to claim 1, characterized in that: The copper through hole includes any one or more combinations of a solid hole slot and a surface copper-clad hole slot.

5. A method for manufacturing a vertically stacked power module structure as claimed in claim 1, characterized in that: Includes steps: S31: manufacturing an inductor structure having a magnetic shielding layer; S32: preparing a PCB frame layer, and embedding the inductor structure in the PCB frame layer; S33: embedding and coating the PCB frame layer; S34: making PCB circuit layers, including copper conductive layers, dielectric layers and solder resist layers, and making copper through holes according to the design to form electrical circuits and thermal conductive holes connected to the magnetic shielding layer; S35: Chips and components are mounted to complete the production of the vertically stacked power module.

6. The method according to claim 5, characterized in that: The steps of making the inductor structure with a magnetic shielding layer include: assembling a metal sheet on the periphery of the magnet of the inductor winding, and the assembling method includes pasting, molding, or using a metal plating process to achieve metal coverage on the surface of the inductor.

7. The manufacturing method according to claim 5, characterized in that: The steps for making the inductor structure with the magnetic shielding layer include: prefabricating the metal sheet into a specific wrapping shape and then performing electromagnetic shielding assembly.

8. The manufacturing method according to claim 5, characterized in that: The manufacturing method is full-plate manufacturing, and multiple inductor structures are embedded simultaneously.

9. A vertically stacked power module structure manufacturing device, characterized in that: It comprises a memory and a processor coupled to each other, wherein the processor is used to execute program instructions stored in the memory to implement the method for manufacturing the vertically stacked power module structure according to any one of claims 5-8.

10. A computer-readable storage medium having program instructions stored thereon, characterized in that: When the program instructions are executed by the processor, the method for manufacturing the vertically stacked power module structure described in any one of claims 5-8 is implemented.

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