A method for fine-finishing printed circuit board molding

Abstract

The present invention discloses a method for fine gong processing of printed circuit board molding, which relates to the technical field of printed circuit board processing, and includes the following operation steps: S1, on a conventional gong machine table pad, use a positioning hole drill belt to drill the required positioning holes; S2, implant positioning pins in the positioning holes at the upper and lower ends; S3, respectively correspond the two boards to the positioning holes in S2 and fix them in the positioning pins, and fix the boards on the gong machine table at the same time; S4, first use r1801 for rough gong in the vertical direction; then use r1802 for fine gong; S5, take out the positioning pins at the upper and lower ends on the machine table. The present invention realizes fine gong through conventional molding equipment, which reduces the equipment cost; the present invention ensures the molding tolerance of the printed circuit board by controlling the tolerance within ±0.05mm; the present invention realizes one-time operation of two boards through the improvement of the molding design program, which significantly improves the production efficiency of the printed circuit board.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board processing, in particular to a method for fine forming processing of a printed circuit board. Background Art

[0002] Printed circuit boards (PCBs) are the basic components of modern electronic devices, and molding precision processing technology is crucial in their manufacturing process. Especially in the manufacturing of small-pitch display panels without positioning holes, molding precision processing faces severe challenges.

[0003] At present, the forming method for small-pitch display screens without positioning holes is generally to use a laser forming machine to form the board. However, this method has significant limitations. It can only form one board at a time. Since the machine relies on air pressure to adsorb the board surface for fixation, one head can only make one board at a time, resulting in low production efficiency. In addition, the cost of laser forming machines is high, which is not conducive to widespread application. If conventional equipment is used to form the board, the board cannot be fixed because there are no positioning holes in the unit, so the forming tolerance cannot be guaranteed, which increases the difficulty of processing. Summary of the invention

[0004] The purpose of the present invention is to provide a method for fine-finishing molding of printed circuit boards to solve the technical problems of low production efficiency, high cost of equipment purchase and routine maintenance, and inability to guarantee molding tolerances proposed in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: a method for fine-finishing a printed circuit board, comprising the following steps: S1. Use a positioning hole drill to drill the required positioning holes on the conventional gong machine table pad; S2. Insert positioning pins into the positioning holes at the upper and lower ends; S3, respectively place the two boards in the positioning holes corresponding to S2 and fix them in the positioning pins, and fix the boards on the gong machine table; S4, first use r1801 for rough gong in vertical direction; then use r1802 for fine gong; S5. Remove the upper and lower positioning pins on the machine, and insert the left, middle and right positioning pins; S6. Align the long board with the corresponding positioning pins to fix it. Two large boards can be stacked and fixed; S7, first use r1803 to rough gong the middle part, and then use r1804 to fine gong; S8, finally use r1805 directly for fine gong at the upper and lower ends; S9, remove the single-piece board and check the size with an electronic caliper; S10. The above is a method for one machine. You can also use two machines at the same time to work separately according to the positioning holes to improve production efficiency.

[0006] Preferably, the positioning hole drilling belt is composed of 5 gong belts, and uses a gong cutter with a diameter of 1.8 mm, and is named r1801, r1802, r1803, r1804 and r1805 respectively.

[0007] Preferably, the conventional gong machine in S1 has 6 heads, the number of positioning holes in S1 is 28, and the diameter is 1.95 mm.

[0008] Preferably, the number of the positioning holes at the upper and lower ends of S2 is 12.

[0009] Preferably, the board produced by the r1801 gong in S4 is 3 long strips, and the size is 0.01mm larger on one side than the standard value, and 0.02mm larger overall.

[0010] Preferably, the ratio of r1802 fine gong in S4 is 1:1, and its dimensional tolerance is controlled within ±0.05mm.

[0011] Preferably, there are 16 positioning pins implanted in the left, middle and right parts of S5, ensuring that the positioning pins are seamlessly fixed to the board.

[0012] Preferably, the r1803 rough gong in S7 should ensure that the size is 0.1mm larger.

[0013] Preferably, the ratio of r1804 fine gong in the S7 is 1:1, and its size is completely controlled within ±0.05mm.

[0014] Preferably, the ratio of r1805 fine gong in S8 is 1:1, and the inspection of the dimensions in S9 shows that the tolerance meets the standard requirement of ±0.05mm.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention successfully realizes fine processing through conventional molding equipment, effectively reducing the equipment cost for fine processing of printed circuit board molding. Compared with the traditional method that relies on expensive laser molding machines, the application of the present invention can significantly reduce production input and improve overall economic benefits; 2. The present invention ensures the molding tolerance of the printed circuit board by controlling the tolerance within ±0.05mm, so as to meet the strict requirements of high-precision electronic equipment on the printed circuit board; 3. The present invention realizes a new mode of processing two boards at a time through innovative improvements in the molding design program, which not only simplifies the production process, but also significantly improves the production efficiency of printed circuit boards. Compared with the traditional method of processing only one board at a time, the application of the present invention can greatly improve production capacity and meet the high market demand for printed circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present invention is a schematic flow chart of the method for fine-finishing printed circuit board molding. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1 The present invention provides a technical solution: a method for forming and fine-finishing a printed circuit board, comprising the following steps: S1. On the conventional gong machine table pad, use the positioning hole drill belt to drill the required positioning holes. The conventional gong machine has 6 heads. Because there are no positioning holes in the small-pitch display panel, such as P1.53 / P1.25 / P0.93, and other products with high precision requirements, in the production of PNL, 28 positioning holes with a diameter of 1.95mm are drilled outside the small board; S2. Implant positioning pins in the positioning holes at the upper and lower ends, and the number of positioning holes at the upper and lower ends is 12; S3, respectively place the two boards in the positioning holes corresponding to S2 and fix them in the positioning pins, and fix the boards on the gong machine table; S4, first use r1801 for vertical rough gong, and the board gonged by r1801 is 3 long strips, and the size is 0.01mm larger than the standard value on one side, and 0.02mm larger overall; then use r1802 for fine gong, and the ratio of r1802 fine gong is 1:1, and its dimensional tolerance is controlled within ±0.05mm; S5. Remove the positioning pins at the upper and lower ends of the machine, and implant the positioning pins on the left, middle and right. There are 16 positioning pins implanted on the left, middle and right sides, ensuring that the positioning pins are seamlessly fixed to the board. S6. Align the long board with the corresponding positioning pins to fix it. Two large boards can be stacked and fixed; S7, first use r1803 to rough gong the middle part, and the r1803 rough gong should ensure that the size is 0.1mm larger, then use r1804 for fine gong, and the ratio of r1804 fine gong is 1:1, and its size is completely controlled within ±0.05mm; S8, finally use r1805 to refine the upper and lower ends, and the ratio of r1805 is 1:1; S9. Remove the single-piece board and check the size with an electronic caliper. The size inspection shows that the tolerance meets the standard requirement of ±0.05mm. S10. The above is a method for one machine. You can also use two machines at the same time to work separately according to the positioning holes to improve production efficiency.

[0019] The positioning hole drilling belt is composed of 5 gong belts and uses a gong cutter with a diameter of 1.8 mm. They are named r1801, r1802, r1803, r1804 and r1805 respectively, and the content belongs to gong belt program design.

[0020] The above-mentioned precision processing was successfully achieved through conventional molding equipment, which effectively reduced the equipment cost for precision molding processing of printed circuit boards. Compared with the traditional method of relying on expensive laser molding machines, the application of the present invention can significantly reduce production investment and improve overall economic benefits; and by controlling the tolerance within ±0.05mm, the molding tolerance of the printed circuit board is guaranteed, so that the strict requirements of high-precision electronic equipment for printed circuit boards can be met; at the same time, through the innovative improvement of the molding design program, a new mode of operating two boards at a time is realized, which not only simplifies the production process, but also significantly improves the production efficiency of printed circuit boards. Compared with the traditional method of only processing one board at a time, the application of the present invention can greatly improve production capacity and meet the market's high demand for printed circuit boards.

[0021] Working principle: When using the method of fine gong processing for printed circuit board forming, use a positioning hole drill belt to drill 28 1.95mm positioning holes on the conventional 6-head gong machine table pad, implant positioning pins in the 12 positioning holes at the upper and lower ends, respectively fix the two boards in the positioning pins corresponding to the positioning holes in S2, and fix the boards on the gong machine table. First use r1801 for vertical rough gong, that is, 4 knives, and the gonged board is 3 long strips, and the size is 0.01mm larger than the standard value on one side and 0.02mm larger as a whole. Then use r1802 for fine gong at a ratio of 1:1. The dimensional tolerance of the gong in this direction is controlled within ±0.05mm. Take out the positioning pins at the upper and lower ends of the machine, and implant the positioning pins on the left, middle and right, for a total of 16, ensure that the positioning pins and the board are seamlessly fixed, align the long board with the corresponding positioning pins and fix it, and the two large boards can be stacked and fixed. First, use r1803 to rough-rough the middle part to ensure that the size is 0.1mm larger, and then use r1804 to fine-roughen it at a 1:1 ratio. The size here is completely controlled within ±0.05mm. Finally, use r1805 to fine-roughen the upper and lower ends at a 1:1 ratio. Remove the single-piece board and check the size with an electronic caliper. The tolerance shows that it meets the standard requirement of ±0.05mm. The above is the method on one machine, and two machines can also be used at the same time to operate separately according to the positioning holes to improve production efficiency. The content not described in detail in this description belongs to the prior art known to professional and technical personnel in this field.

[0022] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for fine processing of printed circuit board molding, characterized in that: The steps are as follows: S1. Use a positioning hole drill to drill the required positioning holes on the conventional gong machine table pad; S2. Insert positioning pins into the positioning holes at the upper and lower ends; S3, respectively place the two boards in the positioning holes corresponding to S2 and fix them in the positioning pins, and fix the boards on the gong machine table; S4, first use r1801 for rough gong in vertical direction; then use r1802 for fine gong; S5. Remove the upper and lower positioning pins on the machine, and insert the left, middle and right positioning pins; S6. Align the long board with the corresponding positioning pins to fix it. Two large boards can be stacked and fixed; S7, first use r1803 to rough gong the middle part, and then use r1804 to fine gong; S8, finally use r1805 directly for fine gong at the upper and lower ends; S9, remove the single-piece board and check the size with an electronic caliper; S10. The above is a method for one machine. You can also use two machines at the same time to work separately according to the positioning holes to improve production efficiency.

2. A method for forming and finishing a printed circuit board according to claim 1, characterized in that: The positioning hole drilling belt is composed of 5 gong belts and uses a gong cutter with a diameter of 1.8 mm, and is named r1801, r1802, r1803, r1804 and r1805 respectively.

3. The method for forming and finishing a printed circuit board according to claim 1, characterized in that: The conventional gong machine in the S1 has 6 heads, the number of positioning holes in the S1 is 28, and the diameter is 1.95 mm.

4. The method for forming and finishing a printed circuit board according to claim 1, characterized in that: The number of the positioning holes at the upper and lower ends of S2 is 12.

5. The method for forming and finishing a printed circuit board according to claim 1, characterized in that: The board produced by the r1801 gong in the S4 is 3 long strips, and the size is 0.01mm larger on one side than the standard value, and 0.02mm larger overall.

6. A method for forming and finishing a printed circuit board according to claim 5, characterized in that: The ratio of r1802 fine gong in the S4 is 1:1, and its dimensional tolerance is controlled within ±0.05mm.

7. The method for forming and finishing a printed circuit board according to claim 1, characterized in that: There are a total of 16 positioning pins implanted in the left, middle and right parts of the S5 to ensure that the positioning pins are seamlessly fixed to the board.

8. The method for forming and finishing a printed circuit board according to claim 1, characterized in that: The r1803 rough gong in the S7 should be ensured to be 0.1mm larger.

9. A method for forming and finishing a printed circuit board according to claim 8, characterized in that: The ratio of r1804 fine gong in the S7 is 1:1, and its size is completely controlled within ±0.05mm.

10. The method for forming and finishing a printed circuit board according to claim 1, characterized in that: The ratio of the R1805 fine gong in the S8 is 1:1, and the inspection of the dimensions in the S9 shows that the tolerance meets the standard requirement of ±0.05mm.

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