A chip mounting device for integrated circuit processing

Abstract

The present invention belongs to the technical field of circuit processing and chip mounting, and discloses a chip mounting device for integrated circuit processing, including a chip mounting mechanism and a glue dropper arranged thereon. A glue dropping tube is installed at the bottom of the glue dropper, and a first fixing plate is fixedly sleeved on the outer side of the glue dropping tube. Symmetrically distributed first electric push rods are fixedly installed at the bottom of the first fixing plate. In the present invention, the glue leveling and removing plate can change the inclination angle. At different angles, the rotation of the toothed ring can drive the glue leveling and removing plate to level the colloid, and can also push the excess colloid onto the glue leveling and removing plate during rotation to remove the excess colloid. And during the process of leveling and removing the colloid, only one surface of the glue leveling and removing plate is in contact with the colloid all the time. During the subsequent process of the push plate pushing the glue, all the colloid on the glue leveling and removing plate can be pushed into the glue guiding mechanism to prevent colloid residue.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit processing patch technology, in particular to a patch device for integrated circuit processing. Background Art

[0002] When using polymer adhesive as the adhesive for the chip, the adhesive is often applied to the chip pad using a syringe or a syringe, and then the chip is accurately placed on the adhesive on the pad using an automatic pick-up machine, and finally pressed together.

[0003] The patent with application number CN202310493255.5 discloses a patch device for integrated circuit processing, which relates to the field of integrated circuit processing patch technology, including a patch machine body, a moving table installed on the upper part of the patch machine body, and a mounting plate is provided on the front end surface of the moving seat of the third linear motor, a glue dispenser is installed on one side of the front end surface of the mounting plate, and a glue filling machine is provided on the top surface of the patch machine body; a glue dispenser is vertically installed at the liquid outlet end of the glue dispenser, and a glue leveling mechanism is provided inside the sleeve; a pushing component is provided on the outer wall of the upper part of the glue dispenser; the present invention cooperates with the sleeve, the glue leveling mechanism and the positioning ring plate, so that after the PCB board is patched with glue, the colloid dripped on the patch can be evenly spread out immediately, and the excess colloid can be scraped and collected, which can effectively avoid the occurrence of high stress caused by the formation of voids between the chip and the colloid at the bottom when the chip is subsequently patched by the chip mounting machine, so as to improve the chip bonding efficiency and bonding stability.

[0004] However, in the above patent, the convex surface of the glue leveling board is used when spreading the colloid evenly, and the concave surface of the glue leveling board is used when collecting excess colloid. This will result in residual colloid adhering to the convex surface of the glue leveling board after the colloid is spread. The residual colloid may drip when the glue is not leveled, thereby affecting the patch; in addition, dust may remain on the PCB board, and dust particles will be mixed between the surface of the bonded object and the epoxy resin adhesive, hindering the sufficient contact between the adhesive and the bonded object, making it impossible for the adhesive to well infiltrate the surface of the bonded object, thereby failing to form a strong bonding interface, and ultimately resulting in a decrease in bonding strength.

[0005] Therefore, improvements are made to the above problems. Summary of the invention

[0006] In order to solve the problems mentioned in the above background technology that residual colloid may adhere to the convex surface of the glue-spreading plate, the residual colloid may drip when the glue is not spread, thereby affecting the patch, and dust may affect the bonding strength, the present invention provides a patch device for integrated circuit processing.

[0007] To achieve the above object, the present invention provides the following technical solution: A chip mounting device for integrated circuit processing, including a chip mounting mechanism and a glue dropper arranged thereon. A glue dropping tube is installed at the bottom of the glue dropper. A first fixing plate is fixedly sleeved outside the glue dropping tube. Symmetrically distributed first electric push rods are fixedly installed at the bottom of the first fixing plate. Further included are,

[0008] A sleeve, which is sleeved on the surface of the glue dropping tube and fixedly installed at the movable end of the first electric push rod;

[0009] A positioning mechanism, which is sleeved at the lower end of the sleeve and is used to limit the area of the flattened colloid;

[0010] A colloid leveling and removing mechanism, which is arranged inside the positioning mechanism and is used to flatten and remove the colloid discharged from the glue dropping tube;

[0011] A driving mechanism, which is arranged inside the positioning mechanism and is used to drive the colloid leveling and removing mechanism to rotate;

[0012] A glue pushing mechanism, which is arranged inside the colloid leveling and removing mechanism and is used to push the excess colloid for collection;

[0013] A glue guiding mechanism, which is arranged outside the positioning mechanism and is used to collect the excess colloid.

[0014] Preferably, the positioning mechanism includes a positioning ring and a first spring. The positioning ring is slidably connected to the sleeve. The first spring is sleeved on the surface of the positioning ring and its two ends are elastically contacted with the positioning ring and the first spring respectively.

[0015] Preferably, the driving mechanism includes a second fixing plate, a first micro motor, a gear, a toothed ring and a connecting rod. The second fixing plate is fixedly connected to the positioning ring. The first micro motor is fixedly connected to the second fixing plate. The gear is fixedly installed on the output shaft of the first micro motor. The toothed ring is rotatably connected to the inner wall of the positioning ring and meshes with the gear. The two ends of the connecting rod are respectively fixedly connected to the toothed ring and the colloid leveling and removing mechanism.

[0016] Preferably, the colloid leveling and removing mechanism includes a storage bin, a positioning plate, a colloid leveling and removing plate, a second electric push rod, a connecting slider and a positioning slide. The storage bin is fixedly connected to the connecting rod. The positioning plates are symmetrically fixed on the top of the storage bin. The colloid leveling and removing plate is movably connected to the middle of the storage bin and one end of it is slidably connected to the positioning plate. The second electric push rod is fixedly installed on the top of the storage bin. The connecting slider is connected to the movable end of the second electric push rod through a universal joint. The positioning slide is fixedly installed on the surface of the colloid leveling and removing plate and is slidably connected to the connecting slider.

[0017] Preferably, the glue pushing mechanism includes a second micro-motor, a threaded rod, and a push plate. The second micro-motor is fixedly installed on one side of the storage bin. The threaded rod is fixedly installed on the output shaft of the second micro-motor. The push plate is threadedly connected to the threaded rod, and the push plate slides inside the storage bin through the threaded rod.

[0018] Preferably, the glue guiding mechanism includes a first glue guiding tube, a second glue guiding tube, a second spring, a third glue guiding tube, and a collection bin. The first glue guiding tube is fixedly installed on the side of the storage bin away from the second micro-motor. The third glue guiding tube is fixedly installed on the outside of the positioning ring. The second glue guiding tube is elastically slidably connected to the third glue guiding tube through the second spring. The second glue guiding tube is elastically clamped to the first glue guiding tube through the second spring. The collection bin is fixedly connected to the third glue guiding tube. One end of the second glue guiding tube close to the first glue guiding tube is provided with an arc chamfer.

[0019] Preferably, the surface of the positioning plate is provided with a first arc groove and a second arc groove, and the first arc groove is connected to the second arc groove. One end of the glue spreading and removing plate is slidably clamped inside the first arc groove and the second arc groove.

[0020] Preferably, a rubber strip is provided at the contact between the glue spreading and removing plate and the storage bin.

[0021] Preferably, when the glue spreading and removing plate moves inside the second arc groove, the bottom ends of the glue spreading and removing plate are at the same height.

[0022] Preferably, a dust removal mechanism is provided on the surface of the sleeve. The dust removal mechanism includes a micro fan and a connecting hose. The micro fan is fixedly installed on the outside of the sleeve. The connecting hose connects the inner cavity of the storage bin and the micro fan. The connecting hose is connected to the storage bin through a sealing bearing. A dust removal bag for collecting dust is also provided at the connection between the micro fan and the connecting hose. A rectangular notch is provided at a corner of the glue spreading and removing plate close to the second micro-motor.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. In the present invention, the glue spreading and removing plate can change the inclination angle. When the glue spreading and removing plate is at the angle shown in Figure 9 , the rotation of the gear ring can drive the glue spreading and removing plate to flatten the colloid. When the glue spreading and removing plate is at the angle shown in Figure 11 , the excess colloid can be pushed onto the glue spreading and removing plate during rotation to achieve the removal of the excess colloid. And during the process of flattening and removing the colloid, only one surface of the glue spreading and removing plate is in contact with the colloid all the time. During the subsequent process of the push plate pushing the glue, all the colloid on the glue spreading and removing plate can be pushed into the glue guiding mechanism, preventing colloid residue.

[0025] 2. During the rotation of the glue spreading and removing plate provided in the present invention, a displacement will also occur between the glue spreading and removing plate and the storage bin. In this way, it can be ensured that when the glue spreading and removing plate changes from the glue spreading state to the glue removing state, it will not penetrate into the flattened area to dig out the colloid, thus ensuring the uniformity of spreading.

[0026] 3. Through the cooperation of the dust removal mechanism with the glue spreading and removing mechanism and the glue pushing mechanism, the present invention can achieve the cleaning of dust on the PCB board, and the adjustable glue spreading and removing plate is in the state as shown in. By rotating the threaded rod, the push plate located at one end close to the first glue guiding tube is moved towards the end close to the micro fan. During the movement of the push plate, the dust adhered to the storage bin and the glue spreading and removing plate is scraped off. When the push plate moves to the notch at one corner of the glue spreading and removing plate, the adhered dust is sucked into the connecting hose by the wind force and finally enters the dust removal bag, preventing the dust from contacting the excess colloid. Figure 12 BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic structural diagram of the present invention;

[0028] Figure 2 is a schematic structural diagram of the sleeve of the present invention;

[0029] Figure 3 is a schematic diagram of the internal structure of the sleeve of the present invention;

[0030] Figure 4 is a schematic diagram of the position of the glue spreading and removing mechanism of the present invention;

[0031] Figure 5 is a detailed structural diagram of the driving mechanism of the present invention;

[0032] Figure 6 is a detailed structural diagram of the glue pushing mechanism of the present invention;

[0033] Figure 7 is a detailed structural diagram of the glue spreading and removing mechanism of the present invention;

[0034] Figure 8 is a separated structural diagram of the glue guiding mechanism of the present invention;

[0035] Figure 9 is a schematic diagram of the structural form of the glue spreading and removing plate during glue spreading of the present invention;

[0036] Figure 10 is a schematic diagram of the structural form of the glue spreading and removing plate during the process of changing from glue spreading to glue removing of the present invention;

[0037] Figure 11 is a schematic diagram of the structural form of the glue spreading and removing plate during glue removing of the present invention;

[0038] Figure 12 is a schematic diagram of the structural form of the glue spreading and removing plate during colloid collection of the present invention.​

[0039] In the figure: 1. SMT mechanism; 2. Glue dispenser; 3. Glue dripping tube; 4. First fixed plate; 5. First electric push rod; 6. Sleeve; 7. Positioning mechanism; 701. Positioning ring; 702. First spring; 8. Driving mechanism; 801. Second fixed plate; 802. First micro motor; 803. Gear; 804. Tooth ring; 805. Connecting rod; 9. Glue leveling and removing mechanism; 901. Storage bin; 902. Positioning plate; 903. Glue leveling and removing plate; 904. Second electric push rod; 905. Connecting slider; 906. Positioning slide; 921. First arc groove; 922. Second arc groove; 10. Glue pushing mechanism; 1001. Second micro motor; 1002. Threaded rod; 1003. Pushing plate; 11. Dust removing mechanism; 1101. Micro fan; 1102. Connecting hose; 12. Glue guiding mechanism; 1201. First glue guiding tube; 1202. Second glue guiding tube; 1203. Second spring; 1204. Third glue guiding tube; 1205. Collection bin. Detailed implementation manners

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0041] As Figures 1 to 12 shown, the present invention provides a SMT device for integrated circuit processing, including an SMT mechanism 1 and a glue dispenser 2 arranged thereon. A glue dripping tube 3 is installed at the bottom of the glue dispenser 2. The outer side of the glue dripping tube 3 is fixedly sleeved with a first fixed plate 4. Symmetrically distributed first electric push rods 5 are fixedly installed at the bottom of the first fixed plate 4. It further includes a sleeve 6 sleeved on the surface of the glue dripping tube 3 and fixedly installed at the movable end of the first electric push rod 5; a positioning mechanism 7 sleeved at the lower end of the sleeve 6 and used to limit the area of the flattened glue; a glue leveling and removing mechanism 9 arranged inside the positioning mechanism 7 and used to level and remove the glue discharged from the glue dripping tube 3; a driving mechanism 8 arranged inside the positioning mechanism 7 and used to drive the glue leveling and removing mechanism 9 to rotate; a glue pushing mechanism 10 arranged inside the glue leveling and removing mechanism 9 and used to push the excess glue for collection; a glue guiding mechanism 12 arranged outside the positioning mechanism 7 and used to collect the excess glue.

[0042] Adopting the above solution: Before dispensing the glue, first start the micro fan 1101, generate negative pressure through the channel formed by the storage bin 901 and the glue leveling and removing plate 903, and adsorb the dust on the PCB board. At the same time, drive the storage bin 901 to rotate through the driving mechanism 8, which can ensure the dust removal effect. And after dispensing the glue, by starting the second electric push rod 904 to drive the glue leveling and removing plate 903 to rotate and adjust the position, the glue leveling and removing plate 903 can be tilted in two opposite directions. In this way, driven by the driving mechanism 8, the glue leveling and removing plate 903 can flatten the colloid and collect it before removal. And by further tilting the glue leveling and removing plate 903 driven by the second electric push rod 904 until a relatively closed cavity is formed with the storage bin 901, the push plate 1003 is driven to move inside the storage bin 901 by the rotation of the threaded rod 1002, and the colloid can be pushed into the glue guiding mechanism 12 for collection.

[0043] As Figure 3 shown, the positioning mechanism 7 includes a positioning ring 701 and a first spring 702. The positioning ring 701 is slidably connected to the sleeve 6, and the first spring 702 is sleeved on the surface of the positioning ring 701 and its two ends are elastically in contact with the positioning ring 701 and the first spring 702 respectively.

[0044] Adopting the above solution: The first spring 702 provided can make the positioning ring 701 keep stable after contacting the PCB board under the push of the first electric push rod 5, and at this time the first spring 702 is compressed, providing a certain redundancy.

[0045] As Figure 4 、 5 shown, the driving mechanism 8 includes a second fixing plate 801, a first micro motor 802, a gear 803, a toothed ring 804 and a connecting rod 805. The second fixing plate 801 is fixedly connected to the positioning ring 701, the first micro motor 802 is fixedly connected to the second fixing plate 801, the gear 803 is fixedly installed on the output shaft of the first micro motor 802, the toothed ring 804 is rotatably connected to the inner wall of the positioning ring 701 and meshes with the gear 803, and the two ends of the connecting rod 805 are respectively fixedly connected to the toothed ring 804 and the glue leveling and removing mechanism 9.

[0046] Adopting the above solution: By driving the gear 803 to rotate through the first micro motor 802, the toothed ring 804 can be driven to rotate inside the positioning ring 701, and then the storage bin 901 is driven to rotate through the connecting rod 805, achieving the purpose of rotating the glue leveling and removing plate 903 to flatten the colloid.

[0047] As Figure 6 、 7As shown in the figure, the spin coating and glue removing mechanism 9 includes a storage bin 901, a positioning plate 902, a spin coating and glue removing plate 903, a second electric push rod 904, a connecting slider 905 and a positioning slide 906. The storage bin 901 is fixedly connected to the connecting rod 805. The positioning plates 902 are symmetrically fixed to the top of the storage bin 901. The spin coating and glue removing plate 903 is movably connected to the middle of the storage bin 901 and one end thereof is slidably connected to the positioning plate 902. The second electric push rod 904 is fixedly installed on the top of the storage bin 901. The connecting slider 905 is connected to the movable end of the second electric push rod 904 through a universal joint. The positioning slide 906 is fixedly installed on the surface of the spin coating and glue removing plate 903 and is slidably connected to the connecting slider 905.

[0048] Adopting the above solution: The set spin coating and glue removing plate 903 can change the inclination angle. When the spin coating and glue removing plate 903 is at the angle shown in Figure 9 the figure, the rotation of the toothed ring 804 can drive the spin coating and glue removing plate 903 to flatten the colloid. When the spin coating and glue removing plate 903 is at the angle shown in Figure 11 the figure, it can push the excess colloid onto the spin coating and glue removing plate 903 during rotation to achieve the removal of the excess colloid. And during the process of flattening and removing the colloid, only one surface of the spin coating and glue removing plate 903 is in contact with the colloid all the time. During the subsequent process of the push plate 1003 pushing the glue, all the colloid on the spin coating and glue removing plate 903 can be pushed into the glue guiding mechanism 12 to prevent colloid residue.

[0049] As shown in Figure 6 the figure, the glue pushing mechanism 10 includes a second micro motor 1001, a threaded rod 1002 and a push plate 1003. The second micro motor 1001 is fixedly installed on one side of the storage bin 901. The threaded rod 1002 is fixedly installed on the output shaft of the second micro motor 1001. The push plate 1003 is threadedly connected to the threaded rod 1002. The push plate 1003 slides inside the storage bin 901 through the threaded rod 1002.

[0050] Adopting the above solution: During the spin coating process, the push plate 1003 only fits against the inner wall of the storage bin 901. When the spin coating and glue removing plate 903 removes the excess colloid and is in the state shown in Figure 12 the figure, the push plate 1003 also fits against the spin coating and glue removing plate 903. At this time, the movement of the push plate 1003 can push the colloid on the spin coating and glue removing plate 903 into the glue guiding mechanism 12 by extrusion to achieve the collection of the excess colloid.

[0051] As shown in Figure 6 and 8As shown in the figure, the glue guiding mechanism 12 includes a first glue guiding tube 1201, a second glue guiding tube 1202, a second spring 1203, a third glue guiding tube 1204 and a collection bin 1205. The first glue guiding tube 1201 is fixedly installed on the side of the storage bin 901 away from the second micro motor 1001. The third glue guiding tube 1204 is fixedly installed on the outer side of the positioning ring 701. The second glue guiding tube 1202 is elastically and slidably connected to the third glue guiding tube 1204 through the second spring 1203. The second glue guiding tube 1202 is elastically clamped to the first glue guiding tube 1201 through the second spring 1203. The collection bin 1205 is fixedly connected to the third glue guiding tube 1204. One end of the second glue guiding tube 1202 close to the first glue guiding tube 1201 is provided with an arc chamfer.

[0052] Adopting the above solution: Since the storage bin 901 rotates driven by the connecting rod 805, through the slidable second glue guiding tube 1202, docking can be carried out by extrusion during the rotation of the first glue guiding tube 1201 with the storage bin 901.

[0053] As Figure 9 shown in the figure, the surface of the positioning plate 902 is provided with a first arc groove 921 and a second arc groove 922. The first arc groove 921 is connected to the second arc groove 922. One end of the glue spreading and removing plate 903 is slidably clamped inside the first arc groove 921 and the second arc groove 922. When the glue spreading and removing plate 903 moves inside the second arc groove 922, the bottom ends of the glue spreading and removing plate 903 are at the same height.

[0054] Adopting the above solution: Through the provided first arc groove 921 and second arc groove 922, the position of the glue spreading and removing plate 903 can be limited. When one end of the glue spreading and removing plate 903 is located in the first arc groove 921, the rotation of the glue spreading and removing plate 903 is centered on the hinge with the storage bin 901. When one end of the glue spreading and removing plate 903 is located in the second arc groove 922, a displacement will also occur between the glue spreading and removing plate 903 and the storage bin 901 during rotation. This can ensure that when the glue spreading and removing plate 903 changes from the glue spreading state to the glue removing state, it will not penetrate into the flattened area to dig out the colloid, ensuring the uniformity of spreading.

[0055] As Figure 6 shown in the figure, a rubber strip is provided at the contact between the glue spreading and removing plate 903 and the storage bin 901.

[0056] Adopting the above solution: Through the provided rubber strip, the sealing performance of the connection between the two can be ensured, so as to ensure that the wind enters from below the storage bin 901 when removing dust.

[0057] As Figure 4 、 5As shown in the figure, a dust removal mechanism 11 is provided on the surface of the sleeve 6. The dust removal mechanism 11 includes a micro fan 1101 and a connecting hose 1102. The micro fan 1101 is fixedly installed on the outer side of the sleeve 6. The connecting hose 1102 connects the inner cavity of the storage bin 901 and the micro fan 1101. The connecting hose 1102 is connected to the storage bin 901 through a sealed bearing. A dust removal bag for collecting dust is also provided at the connection between the micro fan 1101 and the connecting hose 1102. A rectangular notch is opened at a corner of the glue spreading and removing plate 903 close to the second micro motor 1001.

[0058] Adopting the above solution: Through the rectangular notch at one corner of the glue spreading and removing plate 903, during the dust removal process, the push plate 1003 can move from the end close to the first glue guiding tube 1201 to the end close to the second micro motor 1001, and during this process, the glue spreading and removing plate 903 and the storage bin 901 form a sealed cavity, as Figure 12 shown in the figure. During this process, the dust adhering to the storage bin 901 and the glue spreading and removing plate 903 can be pushed off, so that when the push plate 1003 moves to the notch at one corner of the glue spreading and removing plate 903, it is sucked into the connecting hose 1102 by the wind force and finally enters the dust removal bag, further improving the dust removal effect and preventing dust from being contaminated when removing the excess glue.

[0059] The working principle and usage process of the present invention:

[0060] Before dispensing glue, first start the first electric push rod 5 to drive the sleeve 6 so that the bottom of the positioning ring 701 is in pressure contact with the PCB board, and keep the bottom of the dispensing tube 3 higher than the storage bin 901. Then start the micro fan 1101. Under the connection of the connecting hose 1102, the wind enters from the bottom opening formed by the storage bin 901 and the glue spreading and removing plate 903. Then start the first micro motor 802 to drive the storage bin 901 to rotate, and the dust on the PCB board is taken away by the wind force. At the same time, the position of the glue spreading and removing plate 903 can be adjusted by the second electric push rod 904 to adjust the magnitude of the negative pressure wind force. After the dust is taken away, the glue spreading and removing plate 903 can be adjusted to the state as Figure 12 shown in the figure, and start the second micro motor 1001. The push plate 1003 located at the end close to the first glue guiding tube 1201 is moved towards the end close to the micro fan 1101 by the rotation of the threaded rod 1002. During the movement of the push plate 1003, the dust adhering to the storage bin 901 and the glue spreading and removing plate 903 is scraped off. When the push plate 1003 moves to the notch at one corner of the glue spreading and removing plate 903, the adhering dust is sucked into the connecting hose 1102 by the wind force and finally enters the dust removal bag;

[0061] Then start the glue dispenser 2 to dispense glue through the dispensing tube 3. After dispensing glue, the glue spreading and removing plate 903 is first in the state as Figure 9In the state shown, start the first micro-motor 802 to drive the gear 803 to rotate, thereby driving the toothed ring 804 to rotate, and then driving the storage bin 901 to rotate inside the positioning ring 701 through the connecting rod 805 to flatten the colloid;

[0062] After the flattening is completed, stop the first micro-motor 802. At this time, start the second electric push rod 904 to drive the glue leveling and glue removing plate 903 to rotate, so that one end of the glue leveling and glue removing plate 903 reaches the connection of the first arc groove 921 and the second arc groove 922 and stops, as Figure 11 shown in the state. At this time, start the first micro-motor 802 again. When the glue leveling and glue removing plate 903 rotates, the excess colloid is brought to the surface of the glue leveling and glue removing plate 903 by pressure;

[0063] After all the excess colloid reaches the surface of the glue leveling and glue removing plate 903, start the second electric push rod 904 again to make the glue leveling and glue removing plate 903 as Figure 12 shown in the state. At this time, start the second micro-motor 1001. The threaded rod 1002 rotates to drive the push plate 1003 to move from the second micro-motor 1001 towards the first glue guiding tube 1201. During the movement, the excess colloid can be pressed into the dust removing mechanism 11 for collection;

[0064] It should be noted that during the rotation of the storage bin 901, every time it rotates a full circle, the first glue guiding tube 1201 will be docked with the second glue guiding tube 1202 once. And when the glue leveling and glue removing plate 903 presents the state as Figure 12 shown, the first glue guiding tube 1201 and the second glue guiding tube 1202 are in a docked state.

[0065] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0066] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip mounting device for integrated circuit processing, comprising a chip mounting mechanism (1) and a glue dropper (2) arranged thereon. A glue dropping tube (3) is installed at the bottom of the glue dropper (2). A first fixing plate (4) is fixedly sleeved on the outer side of the glue dropping tube (3). Symmetrically distributed first electric push rods (5) are fixedly installed at the bottom of the first fixing plate (4), characterized in that: It further includes a sleeve (6) sleeved on the surface of the dispensing tube (3) and fixedly installed at the movable end of the first electric push rod (5); a positioning mechanism (7) sleeved on the lower end of the sleeve (6) and used to limit the area of the flattened colloid; a glue leveling and removing mechanism (9) arranged inside the positioning mechanism (7) and used to level and remove the colloid discharged from the dispensing tube (3); a driving mechanism (8) arranged inside the positioning mechanism (7) and used to drive the glue leveling and removing mechanism (9) to rotate; a glue pushing mechanism (10) arranged inside the glue leveling and removing mechanism (9) and used to push the excess colloid for collection; a glue guiding mechanism (12) arranged outside the positioning mechanism (7) and used to collect the excess colloid; the positioning mechanism (7) includes a positioning ring (701) and a first spring (702); the driving mechanism (8) includes a second fixing plate (801), a first micro motor (802), a gear (803), a toothed ring (804) and a connecting rod (805). The second fixing plate (801) is fixedly connected to the positioning ring (701), the first micro motor (802) is fixedly connected to the second fixing plate (801), the gear (803) is fixedly installed on the output shaft of the first micro motor (802), the toothed ring (804) is rotatably connected to the inner wall of the positioning ring (701) and meshes with the gear (803), and the two ends of the connecting rod (805) are respectively fixedly connected to the toothed ring (804) and the glue leveling and removing mechanism (9); the glue leveling and removing mechanism (9) includes a storage bin (901), a positioning plate (902), a glue leveling and removing plate (903), a second electric push rod (904), a connecting slider (905) and a positioning slide (906). The storage bin (901) is fixedly connected to the connecting rod (805), the positioning plate (902) is symmetrically fixed to the top of the storage bin (901), the glue leveling and removing plate (903) is movably connected to the middle of the storage bin (901) and one end of it is slidably connected to the positioning plate (902), the second electric push rod (904) is fixedly installed on the top of the storage bin (901), the connecting slider (905) is connected to the movable end of the second electric push rod (904) through a universal joint, and the positioning slide (906) is fixedly installed on the surface of the glue leveling and removing plate (903) and slidably connected to the connecting slider (905).

2. The chip mounting device for integrated circuit processing according to claim 1, wherein: The positioning ring (701) is slidably connected to the sleeve (6), and the first spring (702) is sleeved on the surface of the positioning ring (701) and its two ends are respectively in elastic contact with the positioning ring (701) and the first spring (702).

3. The chip mounter for integrated circuit processing according to claim 1, characterized in that: The glue pushing mechanism (10) includes a second micro-motor (1001), a threaded rod (1002), and a push plate (1003). The second micro-motor (1001) is fixedly installed on one side of the storage bin (901). The threaded rod (1002) is fixedly installed on the output shaft of the second micro-motor (1001). The push plate (1003) is threadedly connected to the threaded rod (1002), and the push plate (1003) slides inside the storage bin (901) through the threaded rod (1002).

4. The chip mounting device for integrated circuit processing according to claim 3, wherein: The glue guiding mechanism (12) includes a first glue guiding tube (1201), a second glue guiding tube (1202), a second spring (1203), a third glue guiding tube (1204), and a collection bin (1205). The first glue guiding tube (1201) is fixedly installed on the side of the storage bin (901) away from the second micro-motor (1001). The third glue guiding tube (1204) is fixedly installed on the outer side of the positioning ring (701). The second glue guiding tube (1202) is elastically slidably connected to the third glue guiding tube (1204) through the second spring (1203). The second glue guiding tube (1202) is elastically clamped to the first glue guiding tube (1201) through the second spring (1203). The collection bin (1205) is fixedly connected to the third glue guiding tube (1204). One end of the second glue guiding tube (1202) close to the first glue guiding tube (1201) is provided with an arc chamfer.

5. The chip mounting device for integrated circuit processing according to claim 1, wherein: The surface of the positioning plate (902) is provided with a first arc groove (921) and a second arc groove (922). The first arc groove (921) is connected to the second arc groove (922). One end of the glue spreading and removing plate (903) is slidably clamped inside the first arc groove (921) and the second arc groove (922).

6. The chip mounting device for integrated circuit processing according to claim 1, wherein: A rubber strip is provided at the contact between the glue spreading and removing plate (903) and the storage bin (901).

7. The chip mounting device for integrated circuit processing according to claim 5, wherein: When the glue spreading and removing plate (903) moves inside the second arc groove (922), the bottom ends of the glue spreading and removing plate (903) are at the same height.

8. The chip mounter for integrated circuit processing according to claim 3, characterized in that: A dust removal mechanism (11) is provided on the surface of the sleeve (6). The dust removal mechanism (11) includes a micro-fan (1101) and a connecting hose (1102). The micro-fan (1101) is fixedly installed on the outer side of the sleeve (6). The connecting hose (1102) connects the inner cavity of the storage bin (901) and the micro-fan (1101). The connecting hose (1102) is connected to the storage bin (901) through a sealed bearing. A dust removal bag for collecting dust is further provided at the connection between the micro-fan (1101) and the connecting hose (1102). A rectangular notch is provided at a corner of the glue spreading and removing plate (903) close to the second micro-motor (1001).

Images