Chip mounter and control system thereof

Abstract

The invention discloses a chip mounter and a control system thereof, and relates to the technical field of chip mounters, the chip mounter specifically comprises a chip mounter body, the chip mounter body is internally provided with a suction component capable of moving in three-dimensional directions, the suction component comprises a driving component and a suction head arranged at the bottom end of the driving component, and the suction head is connected with the chip mounter body. A filter screen used for filtering sucked air is arranged in the middle of the suction head, a cleaning part capable of scraping the lower surface of the filter screen is arranged under the filter screen, the air entering the suction head can be filtered through the filter screen, and then through arrangement of a scraper, the air can be sucked into the suction head through the scraper. According to the chip mounter, dust adsorbed on the lower surface of the filter screen can be scraped, meanwhile, the scraped dust can be collected through the arrangement of a collecting box, the negative pressure state of a cavity in the bottom end of a suction head can be relieved through the arrangement of a telescopic air storage part, meanwhile, electronic components cannot be affected, and then the chip mounting quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounters, and more specifically, to a chip mounter and a control system thereof. Background Art

[0002] Electronic component placement machine, also known as "placement machine" or "surface mount system" (Surface Mount System), is one of the indispensable key equipment in the field of modern electronic manufacturing. The electronic component placement machine is mainly responsible for accurately placing various types of chip SMC / SMD (surface mount components) on the corresponding position of the PCB (printed circuit board) surface that has been printed with solder paste or patch glue in the production line. With the development trend of miniaturization, lightweight, high density and multi-functionality of electronic products, the role of placement machines has become increasingly important; The electronic component placement machine is mainly composed of PCB transmission, component feeding, component removal, component positioning and component installation. Component installation is a crucial part of the placement machine, because electronic components are large and small, and some electronic components have many pins and are very close together, so component installation is a process that requires precision; For example, the Chinese patent application number is CN202310192725.4, which discloses an automatic circuit board patch device, including a protective frame, a power box, a patch assembly and a display assembly. The patch assembly includes a sliding table, a cylinder, a patch suction cup, a dimmer and a camera. An adjustment aperture is installed at one end of the dimmer. A camera is provided on the surface of the camera. The circuit board is photographed and recorded by the camera, and the picture taken by the camera is compared with the picture of the standard circuit board taken before the patch. The operator confirms the joint position of the two to determine the pick-up point of the patch and the position where the patch is installed on the surface of the circuit board, thereby improving the effect of the positional relationship between the patch and the circuit board, and improving and ensuring the quality of the product; the principle of infrared light refraction positioning is adopted to increase the clarity of the camera shooting, so that the operator can locate the position of the patch and determine the accuracy of the patch position, while ensuring that the image can be clearly imaged on the external monitor when the human eye cannot see the environment clearly.

[0003] Although this patent can accurately install electronic components by comparing the picture taken by the camera with the picture of the standard circuit board taken before the patch, when placing the electronic components, the patch suction cup is only a conventional setting. Therefore, the airflow when the negative pressure state of the patch suction cup is released will act on the electronic components, thereby affecting the accuracy of the patch. Because in the prior art, when the nozzle device of the patch machine (equivalent to the patch suction cup) is used to grab the electronic components, the solenoid valve will control the negative pressure generator to connect with the nozzle device, and the nozzle device grabs the electronic components through negative pressure, and then the robotic arm drives the nozzle device to move to remove the electronic components on the nozzle device. Inserted into the PCB board, the solenoid valve switches the air blow pipe, so that the air blow pipe is connected with the suction nozzle device, and then blows air into the suction nozzle device, thereby releasing the vacuum of the suction nozzle device and allowing the suction nozzle device to put down the electronic components. However, because electronic components are large and small, and some electronic components have a lot of pins and are relatively dense, when the continuous airflow blown into the suction nozzle device acts on smaller electronic components or electronic components with more pins, it is easy to cause the small electronic components to shake, thereby causing the electronic components to be skewed, and the electronic components with more pins to cause pin misalignment, which will greatly increase the occurrence of cold soldering. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a chip mounter and a control system thereof, which solve the problems raised in the above background technology.

[0005] The technical solution of the present invention is as follows: To achieve the above objectives, the present invention is implemented through the following technical solutions: a chip mounter, comprising a chip mounter body, wherein a suction component capable of moving in three-dimensional directions is arranged in the chip mounter body; The suction component includes a driving component and a suction head arranged at the bottom end of the driving component, a filter screen for filtering the inhaled air is arranged in the middle of the suction head, and a cleaning component capable of scraping the lower surface of the filter screen is arranged directly below the filter screen; Two telescopic air storage parts capable of relieving the negative pressure state at the bottom of the suction head are relatively arranged in the middle of the suction head, and the opposite ends of the two telescopic air storage parts are fixedly connected to power plates capable of approaching or moving away from each other, and the upper surfaces of the two power plates are fixedly connected to push rods capable of causing the filter screen to rotate; A sealing component capable of preventing active pressure release in the cavity at the bottom of the suction head is also provided in the middle of the suction head; Two power installation grooves communicating with the cavity are relatively opened in the cavity in the middle of the suction head, the two telescopic air storage parts are respectively arranged in the corresponding power installation grooves, and the end of the telescopic air storage part away from the cavity is fixedly connected to the inner side of the power installation groove, the middle part of the outer peripheral surface of the suction head is provided with an air inlet one-way valve communicating with the telescopic air storage part, and the lower surfaces of the opposite ends of the two telescopic air storage parts are provided with air outlet one-way valves communicating with the cavity at the bottom end of the suction head.

[0006] Preferably, two air outlet passages connected to the air outlet one-way valve are relatively opened in the middle of the suction head cavity, and the sealing component is arranged on the inner wall of the suction head cavity at a position close to the air outlet of the air outlet passage and the opening of the power installation slot.

[0007] Preferably, a first tension spring is fixedly connected to one side of the power plate close to the air intake check valve, and one end of the first tension spring away from the power plate is fixedly connected to the inner side of the telescopic air storage part, and the outer peripheral surface of the telescopic air storage part abuts against the inner wall of the power mounting groove.

[0008] Preferably, the sealing component includes a mounting plate fixedly connected to the inner wall of the nozzle cavity, the upper surface of the mounting plate is provided with a sealing mounting groove, the inner bottom surface of the sealing mounting groove is fixedly connected with a second tension spring, the top end of the second tension spring is fixedly connected with an auxiliary sealing plate, the lower surface of the auxiliary sealing plate abuts against the mounting plate, and the lower surface of the mounting plate is provided with a connecting port connected to the sealing mounting groove.

[0009] Preferably, a push rod moving groove is provided on the inner top surface of the power mounting groove, and a mounting groove connected to the top ends of the two push rod moving grooves is provided on the inner wall of the suction head cavity, a filter mounting ring is fixedly connected to the outer peripheral surface of the filter screen, and the filter mounting ring is rotatably connected in the mounting groove, and a plurality of rotatable push plates are evenly arranged on the outer peripheral surface of the filter mounting ring, and the two push rods are respectively slidably connected in the corresponding push rod moving grooves.

[0010] Preferably, both the upper surface and the lower surface of the filter mounting ring are fixedly connected with a limit ring, and the limit ring is clamped in the mounting groove.

[0011] Preferably, a rotating shaft is inserted into one end of the push plate close to the filter mounting ring, and the rotating shaft is rotatably connected in the filter mounting ring. The outer peripheral surface of the filter mounting ring is evenly provided with reset mounting grooves with the same number as the push plate, and the reset mounting grooves are fixedly connected to a third tension spring with one end arranged on the push plate.

[0012] Preferably, the hinged end on one side of the push plate in the counterclockwise direction can fit on the filter mounting ring, and there is a gap between the hinged end on one side of the push plate in the clockwise direction and the filter mounting ring.

[0013] Preferably, the cleaning component includes an auxiliary support box fixedly connected to the inner wall of the suction head cavity, the inner side wall of the auxiliary support box is fixedly connected to a scraper with one end abutting against the filter screen, a pull-out collection box is inserted in the middle of the outer peripheral surface of the suction head, and the inner end of the collection box is slidably connected in the auxiliary support box.

[0014] A chip placement machine control system comprises the following steps: The image acquisition unit acquires position images of the PCB board and the components to be mounted, and outputs the acquired information to the image processing unit; The image processing unit is connected to the image acquisition unit, receives and processes the acquisition information, and outputs control instructions to the motor motion control unit according to the processed information; The motor motion control unit is connected to the image processing unit, receives the control instruction issued by the image processing unit, and controls the motion of the placement machine motor according to the control instruction.

[0015] Beneficial Effects The present invention provides a chip mounter and a control system thereof, which have the following beneficial effects: 1. The present invention, through the arrangement of the sealing component, the telescopic air storage part and the power plate, can connect the air blowing pipe with the suction head when the solenoid valve switches the air blowing pipe, and then blow air into the suction head, thereby releasing the negative pressure state above the mounting plate. At this time, the first tension spring will pull the power plate back to its initial position, squeeze the telescopic air storage part, so that the air in the telescopic air storage part is discharged from the air outlet one-way valve, and finally enters the cavity below the mounting plate through the air outlet duct, thereby prompting the negative pressure state of the cavity below the mounting plate to be released. At the same time, because in the initial setting, the amount of air inhaled by the two telescopic air storage parts when they are stretched in the negative pressure state is roughly the same as the amount of air in the cavity below the mounting plate moved to the top of the mounting plate, therefore, when the power plate returns to its initial position, the air discharged by the two telescopic air storage parts is exhausted after the negative pressure state of the cavity below the mounting plate is released, which can ensure the normal operation of the suction head while the air blown into the suction head will not affect the electronic components.

[0016] 2. The present invention, through the arrangement of the cleaning component, the push rod and the push plate, can make it possible that when the solenoid valve controls the negative pressure generator to be connected with the suction head, the two power plates will move relatively due to the negative pressure in the suction head cavity, and the power plate will move with the push rod. When the push rod continues to move, the top end of the push rod will enter the installation groove from the push rod moving groove, and then abut against one side surface of a push plate in the clockwise direction. Therefore, when the push rod continues to move again, a thrust will be generated on the push plate. At the same time, because the initial state of the push plate on the filter mounting ring is inclined, the push plate will rotate counterclockwise with the filter mounting ring, and the filter mounting ring rotates with the filter screen. When the filter screen rotates counterclockwise, the scraper will scrape the lower surface of the filter screen, thereby scraping off the dust adsorbed on the lower surface of the filter screen, and the scraped dust will fall into the collection box. Therefore, it can effectively avoid the situation where the suction head has unstable negative pressure due to clogging of the filter screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the chip mounter body of the present invention; Figure 2 It is a schematic diagram of the structure inside the chip mounter body of the present invention; Figure 3 It is a structural schematic diagram of the suction component of the present invention; Figure 4 For the present invention Figure 3 The enlarged structural diagram at A in the middle; Figure 5 It is a schematic diagram of the cross-sectional structure of the suction head of the present invention when viewed from the front; Figure 6 For the present invention Figure 5 The enlarged structural diagram at B in the middle; Figure 7 For the present invention Figure 5 The enlarged structural diagram at C in the middle; Figure 8 It is a structural schematic diagram of a partial cross section of the suction head of the present invention; Fig. 9 This is a schematic diagram of the top view of the filter installation ring of the present invention; Fig.10 For the present invention Fig. 9 The enlarged structural diagram at D in the middle; Fig.11 It is a schematic diagram of the control system of the chip placement machine of the present invention.

[0018] In the figure: 1. SMT machine body; 2. Machine cover; 3. Bracket; 4. Suction component; 6. Suction sleeve; 7. Suction head; 8. Collection box; 9. Air inlet check valve; 10. Push rod moving groove; 11. Mounting groove; 12. Filter mounting ring; 13. Filter net; 14. Power mounting groove; 15. Telescopic air storage part; 16. Air outlet check valve; 17. First tension spring; 18. Power plate; 19. Push rod; 20. Push plate; 21. Air outlet; 22. Mounting plate; 23. Auxiliary sealing plate; 24. Second tension spring; 25. Connecting port; 26. Auxiliary support box; 27. Scraper; 29. ​​Limiting ring; 30. Third tension spring; 31. Reset mounting groove. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Embodiment 1 In a conventional placement machine, the solenoid valve controls the negative pressure generator to be connected to the suction nozzle device, and the suction nozzle device grabs the electronic components through negative pressure. Then the robotic arm drives the suction nozzle device to move and inserts the electronic components on the suction nozzle device onto the PCB board. The solenoid valve switches the air blow pipe so that the air blow pipe is connected to the suction nozzle device, and then blows air into the suction nozzle device to release the vacuum of the suction nozzle device, so that the suction nozzle device puts down the electronic components. However, when the air blow pipe blows air into the suction nozzle, although the vacuum state of the suction nozzle can be released, the air blow pipe blows continuously. Therefore, when the air flow blows on the electronic components, it is easy to cause the electronic components to be skewed or the pins to be misaligned, thereby causing the situation of cold soldering. This embodiment is specially invented to solve the above problem.

[0021] See also Figures 1 to 10 The present invention provides a technical solution: a placement machine, including a placement machine body 1, a suction component 4 capable of moving in a three-dimensional direction is arranged in the placement machine body 1, wherein a bracket 3 is also arranged in the placement machine body 1, a three-dimensional driving device and a machine cover 2 are arranged on the bracket 3, and the suction component 4 is arranged on the three-dimensional driving device, so as to move in the three-dimensional direction. At the same time, because the bracket and the three-dimensional driving device are conventional devices on the market, they are not described in detail. At the same time, a suction sleeve 6 is arranged at the bottom end of the suction component 4, and the suction component 4 is clamped in the suction sleeve 6, and personnel can replace the suction component 4 in the suction sleeve 6.

[0022] The suction component 4 includes a driving component and a suction head 7 arranged at the bottom of the driving component, wherein the driving component can cause the suction head 7 to move up and down or rotate. At the same time, the driving component is also a prior art, so it is not described in detail. A filter screen 13 for filtering the inhaled air is arranged in the middle of the suction head 7, and a cleaning component capable of scraping the lower surface of the filter screen 13 is arranged directly below the filter screen 13.

[0023] Two telescopic air storage parts 15 capable of relieving the negative pressure state at the bottom end of the suction head 7 are relatively arranged in the middle part of the suction head 7, and the opposite ends of the two telescopic air storage parts 15 are fixedly connected with power plates 18 that can approach or move away from each other, and the upper surfaces of the two power plates 18 are fixedly connected with push rods 19 that can cause the filter screen 13 to rotate.

[0024] A sealing component is also provided in the middle of the suction head 7 to prevent active pressure relief in the cavity at the bottom of the suction head 7 .

[0025] Two power installation grooves 14 connected to the cavity are relatively opened in the cavity in the middle of the suction head 7, and two telescopic air storage parts 15 are respectively arranged in the corresponding power installation grooves 14, and the end of the telescopic air storage part 15 away from the cavity is fixedly connected to the inner side surface of the power installation groove 14, and an air intake check valve 9 connected to the telescopic air storage part 15 is arranged in the middle of the outer peripheral surface of the suction head 7, wherein the number of the air intake check valves 9 is two, and each air intake check valve 9 is connected to a telescopic air storage part 15, and the lower surfaces of the opposite ends of the two telescopic air storage parts 15 are provided with air outlet check valves 16 connected to the cavity at the bottom end of the suction head 7. Therefore, when the telescopic air storage part 15 is stretched, the telescopic air storage part 15 will draw in air from the outside through the air intake check valve 9, and when the telescopic air storage part 15 is compressed, it will be exhausted from the air outlet check valve 16 (wherein the air outlet check valve 16 can only exhaust to the outside, and the air intake check valve 9 can only take air into the telescopic air storage part 15).

[0026] Two air outlet passages 21 connected to the air outlet one-way valve 16 are relatively opened in the middle of the cavity of the suction head 7. Therefore, when the telescopic air storage part 15 discharges gas from the air outlet one-way valve 16, the gas will eventually enter the cavity at the bottom end of the suction head 7 through the air outlet passage 21, and the sealing component is arranged on the inner wall of the cavity of the suction head 7 near the air outlet of the air outlet passage 21 and the opening of the power mounting groove 14. Therefore, through the setting of the sealing component, the cavity inside the suction head 7 can be divided into two parts. The side of the power plate 18 close to the air inlet one-way valve 9 is fixedly connected with the first tension spring 17, and the end of the first tension spring 17 away from the power plate 18 is fixedly connected to the inner side surface of the telescopic air storage part 15, and the outer peripheral surface of the telescopic air storage part 15 contacts the inner wall of the power mounting groove 14. Therefore, when the power plate 18 slides in the power mounting groove 14, the telescopic air storage part 15 will be prompted to contract or stretch.

[0027] The sealing component includes a mounting plate 22 fixedly connected to the inner wall of the cavity of the suction head 7, a sealing mounting groove is provided on the upper surface of the mounting plate 22, a second tension spring 24 is fixedly connected to the inner bottom surface of the sealing mounting groove, an auxiliary sealing plate 23 is fixedly connected to the top of the second tension spring 24, the lower surface of the auxiliary sealing plate 23 abuts against the mounting plate 22, and a connecting port 25 connected to the sealing mounting groove is provided on the lower surface of the mounting plate 22. Through the setting of the connecting port 25, the cavity below the mounting plate 22 can be connected to the cavity above, but through the setting of the auxiliary sealing plate 23, the entire cavity of the suction head 7 can be temporarily sealed.

[0028] When the solenoid valve controls the negative pressure generator to connect with the suction head 7, negative pressure will be generated in the cavity above the mounting plate 22, so that the air at normal atmospheric pressure below the mounting plate 22 will enter through the connecting port 25 and then push open the auxiliary sealing plate 23 to enter above the mounting plate 22, so that the cavity below the mounting plate 22 will form a negative pressure state, so that the suction head 7 grabs the electronic components through the negative pressure.

[0029] At the same time, when the air above the mounting plate 22 is being sucked away, the power plates 18 in the two power mounting grooves 14 will also move closer to each other due to the negative pressure (the first tension spring 17 will be stretched at this time), thereby prompting the telescopic air storage part 15 to stretch. When the telescopic air storage part 15 is stretched, air will be sucked from the outside through the air intake one-way valve 9, so that outside air will enter the telescopic air storage part 15.

[0030] When the solenoid valve switches the air blowing pipe, the air blowing pipe is connected to the suction head 7, and then air is blown into the suction head 7. However, the auxiliary sealing plate 23 is provided to block the air blown in from above the mounting plate 22 from entering below the mounting plate 22, thereby effectively preventing the continuously incoming air from acting on the electronic components. Therefore, the electronic components can be effectively prevented from being skewed or the pins being misaligned due to the continuously blowing air.

[0031] When the solenoid valve switches the air blowing pipe, the air blowing pipe is connected to the suction head 7, and then air is blown into the suction head 7, thereby destroying the negative pressure state above the mounting plate 22. At this time, the first tension spring 17 will pull the power plate 18 to return to the initial position. When the power plate 18 returns to the initial position, the telescopic air storage part 15 will be squeezed, so that the air in the telescopic air storage part 15 will be discharged from the air outlet check valve 16, and finally enter the cavity below the mounting plate 22 through the air outlet duct 21, thereby promoting the negative pressure state of the cavity below the mounting plate 22. At the same time, because in the initial setting, the amount of air inhaled by the two telescopic air storage parts 15 when they are stretched due to the negative pressure state is roughly the same as the amount of air in the cavity below the mounting plate 22 moving to the top of the mounting plate 22, when the power plate 18 returns to its initial position, the air discharged by the two telescopic air storage parts 15 is exhausted after the negative pressure state of the cavity below the mounting plate 22 is released. Therefore, while ensuring the normal operation of the suction head 7, the air blown into the suction head 7 will not affect the electronic components.

[0032] Embodiment 2 On the basis of the above embodiment, although the electronic components will not be affected by the blowing of air when the negative pressure state of the suction head is released, in order to prevent dust from entering the negative pressure generator in the placement machine, the air entering the suction head is often filtered through a filter. However, after long-term use, the filter often becomes clogged. Therefore, when the filter is clogged, the adsorption force of the suction nozzle will be weakened. Therefore, when the suction nozzle moves with the electronic components, it is easy to become skewed. This embodiment is specially invented to solve the above problem.

[0033] See also Figures 1 to 10 On the basis of the above embodiment, the technical solution adopted includes that the inner top surface of the power installation groove 14 is provided with a push rod moving groove 10, and the inner wall of the cavity of the suction head 7 is provided with a mounting groove 11 connected with the top of the two push rod moving grooves 10 (such as Figure 5 and Figure 8 As shown), the outer circumference of the filter screen 13 is fixedly connected to a filter mounting ring 12, and the filter mounting ring 12 is rotatably connected in the mounting groove 11. The outer circumference of the filter mounting ring 12 is evenly provided with a plurality of rotatable push plates 20, and two push rods 19 are respectively slidably connected in the corresponding push rod moving grooves 10.

[0034] The upper surface and the lower surface of the filter mounting ring 12 are fixedly connected with a limit ring 29, and the limit ring 29 is clamped in the mounting groove 11. Therefore, through the setting of the limit ring 29, the position of the filter mounting ring 12 in the mounting groove 11 can be limited, so that the filter mounting ring 12 can only rotate in the mounting groove 11. Therefore, when the filter mounting ring 12 rotates, it can rotate with the filter net 13.

[0035] A rotating shaft is inserted into one end of the push plate 20 close to the filter mounting ring 12, and the rotating shaft is rotatably connected in the filter mounting ring 12. The outer peripheral surface of the filter mounting ring 12 is evenly provided with reset mounting grooves 31 with the same number as the push plate 20, and the reset mounting grooves 31 are fixedly connected to a third tension spring 30 with one end set on the push plate 20.

[0036] The hinged end of the push plate 20 on one side in the counterclockwise direction can be attached to the filter mounting ring 12 (both the counterclockwise direction and the clockwise direction are Fig. 9 As a basis), there is a gap between the hinged end of one side of the push plate 20 in the clockwise direction and the filter mounting ring 12; therefore, the initial state of the push plate 20 on the filter mounting ring 12 is that the third tension spring 30 pulls the push plate 20, thereby prompting the one side of the push plate 20 in the counterclockwise direction to fit tightly against the filter mounting ring 12. At the same time, because there is a gap between the hinged end of one side of the push plate 20 in the clockwise direction and the filter mounting ring 12, the push plate 20 can rotate clockwise on the filter mounting ring 12. At the same time, the setting of the third tension spring 30 can prompt the push plate 20 to rotate counterclockwise, thereby prompting the push plate 20 to return to its initial position.

[0037] The cleaning component includes an auxiliary support box 26 fixedly connected to the inner wall of the cavity of the suction head 7, and the inner side wall of the auxiliary support box 26 is fixedly connected to a scraper 27 with one end abutting against the filter screen 13. A pull-out collection box 8 is inserted in the middle of the outer peripheral surface of the suction head 7, and the inner end of the collection box 8 is slidably connected in the auxiliary support box 26, wherein one end of the collection box 8 in the counterclockwise direction abuts against the lower surface of the filter screen 13, and one end of the collection box 8 in the clockwise direction is rotatably connected to a sealing roller with an outer peripheral surface abutting against the filter screen 13, so that the dust blocked on the filter screen 13 will not be scraped out of the collection box 8 by the collection box 8 (the direction of rotation of the filter screen 13 is counterclockwise).

[0038] When the solenoid valve controls the negative pressure generator to be connected to the suction head 7, the two power plates 18 will move relative to each other due to the negative pressure in the cavity of the suction head 7, so that the power plate 18 will move with the push rod 19. When the push rod 19 continues to move, the top end of the push rod 19 will enter the installation groove 11 from the push rod moving groove 10, and then abut against a clockwise side surface of a push plate 20. Therefore, when the push rod 19 continues to move again, a thrust will be generated on the push plate 20. At the same time, because the push plate 20 is in The initial state of the filter mounting ring 12 is inclined, so the push plate 20 will rotate counterclockwise with the filter mounting ring 12, and the filter mounting ring 12 will rotate with the filter screen 13. When the filter screen 13 rotates counterclockwise, the scraper 27 will scrape the lower surface of the filter screen 13, thereby scraping off the dust adsorbed on the lower surface of the filter screen 13, and the scraped dust will fall into the collection box 8, thereby effectively avoiding the filter screen 13 from being blocked and causing the suction head 7 to have an unstable negative pressure.

[0039] Embodiment 3 Based on the above embodiment, this embodiment also provides a control system for a placement machine, such as Fig.11 As shown, the specific steps include: The image acquisition unit acquires position images of the PCB board and the components to be mounted, and outputs the acquired information to the image processing unit; The image processing unit is connected to the image acquisition unit, receives and processes the acquisition information, and outputs control instructions to the motor motion control unit according to the processed information; The motor motion control unit is connected to the image processing unit, receives control instructions from the image processing unit, and controls the motion of the placement machine motor according to the control instructions. The above control system is prior art and will not be described in detail.

[0040] In summary, when the chip mounter and its control system are used, the air entering the suction head 7 can be filtered through the filter 13, and then the dust adsorbed on the lower surface of the filter 13 can be scraped off through the setting of the scraper 27, and the scraped dust can be collected through the setting of the collection box 8; By setting the telescopic air storage portion 15, the negative pressure state of the cavity at the bottom end of the suction head 7 can be relieved without affecting the electronic components. At the same time, by setting the push rod 19, power can be provided for the rotation of the filter 13. Therefore, the contraction and expansion of the telescopic air storage portion 15 can solve the clogging problem of the filter 13 and relieve the negative pressure state of the cavity at the bottom end of the suction head 7 without affecting the placement of electronic components, thereby improving the quality of the patch.

[0041] It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip mounter, comprising a chip mounter body (1), characterized in that: The chip mounter body (1) is provided with a suction component (4) capable of moving in three-dimensional directions; The suction component (4) comprises a driving component and a suction head (7) arranged at the bottom end of the driving component, a filter screen (13) for filtering the inhaled air is arranged in the middle of the suction head (7), and a cleaning component capable of scraping the lower surface of the filter screen (13) is arranged directly below the filter screen (13); Two telescopic air storage parts (15) capable of releasing the negative pressure state at the bottom end of the suction head (7) are relatively arranged in the middle part of the suction head (7), and the opposite ends of the two telescopic air storage parts (15) are fixedly connected to power plates (18) capable of moving closer to or farther from each other, and the upper surfaces of the two power plates (18) are fixedly connected to push rods (19) capable of causing the filter screen (13) to rotate; A sealing component capable of preventing active pressure relief in the cavity at the bottom of the suction head (7) is also provided in the middle of the suction head (7); two power installation grooves (14) communicating with the cavity are provided in the cavity in the middle of the suction head (7) opposite to each other; the two telescopic air storage parts (15) are respectively provided in the corresponding power installation grooves (14), and one end of the telescopic air storage part (15) away from the cavity is fixedly connected to the inner side surface of the power installation groove (14); an air inlet check valve (9) communicating with the telescopic air storage part (15) is provided in the middle of the outer peripheral surface of the suction head (7); and an air outlet check valve (16) communicating with the cavity at the bottom of the suction head (7) is provided on the lower surfaces of the opposite ends of the two telescopic air storage parts (15).

2. A chip mounter according to claim 1, characterized in that: Two air outlet passages (21) in communication with the air outlet one-way valve (16) are relatively formed in the middle of the cavity of the suction head (7), and the sealing component is arranged on the inner wall of the cavity of the suction head (7) at a position close to the air outlet of the air outlet passage (21) and between the opening of the power installation slot (14).

3. A chip mounter according to claim 2, characterized in that: A first tension spring (17) is fixedly connected to one side of the power plate (18) close to the air intake check valve (9); one end of the first tension spring (17) away from the power plate (18) is fixedly connected to the inner side of the telescopic air storage portion (15); and the outer peripheral surface of the telescopic air storage portion (15) abuts against the inner wall of the power installation groove (14).

4. A chip mounter according to claim 3, characterized in that: The sealing component comprises a mounting plate (22) fixedly connected to the inner wall of the cavity of the suction head (7); a sealing mounting groove is provided on the upper surface of the mounting plate (22); a second tension spring (24) is fixedly connected to the inner bottom surface of the sealing mounting groove; an auxiliary sealing plate (23) is fixedly connected to the top end of the second tension spring (24); the lower surface of the auxiliary sealing plate (23) abuts against the mounting plate (22); and a connecting port (25) connected to the sealing mounting groove is provided on the lower surface of the mounting plate (22).

5. A chip mounter according to claim 4, characterized in that: The inner top surface of the power installation groove (14) is provided with a push rod moving groove (10), and the inner wall of the cavity of the suction head (7) is provided with a mounting groove (11) connected to the top ends of the two push rod moving grooves (10). The outer peripheral surface of the filter screen (13) is fixedly connected with a filter mounting ring (12), and the filter mounting ring (12) is rotatably connected in the mounting groove (11). The outer peripheral surface of the filter mounting ring (12) is evenly provided with a plurality of rotatable push plates (20), and the two push rods (19) are respectively slidably connected in the corresponding push rod moving grooves (10).

6. A chip mounter according to claim 5, characterized in that: The upper surface and the lower surface of the filter installation ring (12) are both fixedly connected to a limit ring (29), and the limit ring (29) is clamped in the installation groove (11).

7. A chip mounter according to claim 6, characterized in that: A rotating shaft is inserted into one end of the push plate (20) close to the filter mounting ring (12), and the rotating shaft is rotatably connected in the filter mounting ring (12); the outer peripheral surface of the filter mounting ring (12) is evenly provided with reset mounting grooves (31) having the same number as the push plate (20); and the reset mounting grooves (31) are all fixedly connected with a third tension spring (30) having one end arranged on the push plate (20).

8. A chip mounter according to claim 7, characterized in that: The hinged end on one side of the push plate (20) in the counterclockwise direction can fit on the filter installation ring (12), and a gap exists between the hinged end on one side of the push plate (20) in the clockwise direction and the filter installation ring (12).

9. A chip mounter according to claim 8, characterized in that: The cleaning component comprises an auxiliary support box (26) fixedly connected to the inner wall of the cavity of the suction head (7); a scraper (27) having one end abutting against the filter screen (13) is fixedly connected to the inner wall of the auxiliary support box (26); a pull-out collection box (8) is inserted in the middle of the outer peripheral surface of the suction head (7); and the inner end of the collection box (8) is slidably connected in the auxiliary support box (26).

10. A chip mounter control system, the control system being used to control the chip mounter according to claim 9, characterized in that: The following steps are involved: The image acquisition unit acquires position images of the PCB board and the components to be mounted, and outputs the acquired information to the image processing unit; The image processing unit is connected to the image acquisition unit, receives and processes the acquisition information, and outputs control instructions to the motor motion control unit according to the processed information; The motor motion control unit is connected to the image processing unit, receives the control instruction issued by the image processing unit, and controls the motion of the placement machine motor according to the control instruction.

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