Magnetic sensor

Abstract

The present invention relates to a magnetic sensor which reduces the influence of a magnetic field generated from an end portion of a compensation coil on a magnetosensitive element. A magnetic sensor (1) is provided with: an external magnetic body (30) that collects a magnetic field to be detected to a sensor chip (20); a compensation coil (60) wound around the outer magnetic body (30) via the bobbin section (51) of the molded member (50); and a connection terminal (71) which is fixed to the terminal fixing part (52) of the molded member (50) and to which one end of the compensation coil (60) is connected. The terminal fixing portion (52) has a bobbin connection surface (S1) and a terminal fixing surface (S2). One end of the compensation coil (60) has a section (61) extending along the bobbin connection surface (S1) and a section (62) extending along the terminal fixing surface (S2). As a result, it is possible to reduce the influence of a magnetic field generated from the end of the compensation coil on the magnetosensitive element.

Description

Technical Field

[0001] The present invention relates to a magnetic sensor, and in particular to a magnetic sensor including an external magnetic body for concentrating magnetic flux on a magnetic sensitive element and a compensation coil. Background Art

[0002] As a magnetic sensor having an external magnetic body for concentrating magnetic flux on a magnetic sensitive element and a compensation coil, there is a known magnetic sensor described in Patent Document 1. The magnetic sensor described in Patent Document 1 has a molded component fixed to the external magnetic body, and the end of the compensation coil is connected to a connecting pin held in the molded component. This makes it easy to connect the compensation coil and the feedback circuit.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-046892 Summary of the invention

[0006] The technical problem that the invention is intended to solve

[0007] Here, since most of the compensation coil is wound around the external magnetic body, the direction of the magnetic field generated by the current flowing through the compensation coil is almost always axial to the external magnetic body. However, since a small magnetic field is also generated from the end of the compensation coil connected to the connection pin, it is desirable to have a structure in which the magnetic field generated from the end of the compensation coil does not become noise.

[0008] Therefore, an object of the present invention is to reduce the influence of a magnetic field generated from an end of a compensation coil on a magnetic sensor including an external magnetic body for concentrating magnetic flux on the magnetic sensor and a compensation coil.

[0009] Means for solving technical problems

[0010] The magnetic sensor provided by the present invention comprises: a sensor chip, which has a magnetic sensitive element; an external magnetic body, which collects the magnetic field of the detection object to the magnetic sensitive element; a formed component, which has a winding frame part and a terminal fixing part covering the external magnetic body; a compensation coil, which is wound around the external magnetic body via the winding frame part of the formed component; and a first connecting terminal, which is fixed to the terminal fixing part of the formed component and to which one end of the compensation coil is connected, the winding frame part of the formed component has a first direction as an axial direction, and the terminal fixing part of the formed component has: a winding frame connecting surface that is perpendicular to the first direction and connected to the winding frame part, and a terminal fixing surface that is parallel to the first direction and fixes the first connecting terminal, and one end of the compensation coil has: a first section extending along the winding frame connecting surface and a second section extending along the terminal fixing surface.

[0011] According to the present invention, since one end of the compensation coil extends along the bobbin connection surface and the terminal fixing surface, the position of the one end of the compensation coil does not change due to conditions, or the position of the one end of the compensation coil does not differ from product to product. As a result, the influence of the magnetic field generated from the end of the compensation coil on the magnetic sensitive element can be reduced.

[0012] Alternatively, the magnetic sensor of the present invention further includes a second connecting terminal, which is fixed to a terminal fixing portion of a molded component, to which the other end of the compensation coil is connected, and the second connecting terminal is fixed to a terminal fixing surface of the terminal fixing portion, and the other end of the compensation coil has a third section extending along the winding frame connection surface and a fourth section extending along the terminal fixing surface. Accordingly, the position of the other end of the compensation coil does not change due to conditions, or the position of the other end of the compensation coil does not differ depending on the product. Furthermore, since the first and second connecting terminals are fixed to the terminal fixing surface of the terminal fixing portion, the magnetic field generated from the second section and the magnetic field generated from the fourth section can be offset.

[0013] In the present invention, the first section and the third section may extend parallel to each other. In this way, the magnetic field generated from the first section and the magnetic field generated from the third section can be effectively offset.

[0014] In the present invention, the second section and the fourth section may extend parallel to each other. In this way, the magnetic field generated from the second section and the magnetic field generated from the fourth section can be effectively offset.

[0015] In the present invention, the second section and the fourth section may both extend along the first direction. This can further reduce the influence of the magnetic field generated from the second and fourth sections on the magnetic sensor.

[0016] In the present invention, the terminal fixing surface may extend along the first direction and the second direction perpendicular to the first direction, the terminal fixing portion may further include a positioning portion provided on the terminal fixing surface, and the position of the second section of the compensation coil in the second direction may be positioned by the positioning portion. Accordingly, the position of the second section of the compensation coil in the second direction is not easily offset.

[0017] In the present invention, the external magnetic body may include: a first region facing the sensor chip in the first direction, and a second region located on the opposite side of the sensor chip when viewed from the first region, the height of the second region in the second direction perpendicular to the first direction is smaller than that of the first region, and the winding frame portion of the molded member covers the second region of the external magnetic body. Accordingly, even when the external magnetic body and the molded member are mounted on the substrate, interference between the compensation coil and the substrate can be prevented.

[0018] Effects of the Invention

[0019] As described above, according to the present invention, in a magnetic sensor including an external magnetic body for concentrating magnetic flux on a magnetic sensing element and a compensation coil, the influence of a magnetic field generated from an end of the compensation coil on the magnetic sensing element can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic perspective view showing the appearance of a magnetic sensor 1 according to one embodiment of the present invention.

[0021] Figure 2 is a schematic perspective view showing the appearance of the magnetic sensor 1. Figure 1 The images obtained by observing from different directions.

[0022] Figure 3 It is a schematic exploded perspective view of the magnetic sensor 1 .

[0023] Figure 4 It is a schematic top view of the sensor chip 20 .

[0024] Figure 5 It is along Figure 4 Schematic cross-sectional view along line AA.

[0025] Figure 6 This is a schematic cross-sectional view for explaining an example in which a magnetic layer and a magnetic sensitive element overlap.

[0026] Figure 7 It is a circuit diagram for explaining the connection relationship between the magnetic sensing elements R1 to R4 and the compensation coil 60.

[0027] Figure 8 It is a schematic perspective view for explaining the structure of the external magnetic body 30 .

[0028] Fig. 9 It is a schematic perspective view for explaining the structure of the molded component 50 .

[0029] Explanation of symbols

[0030] 1...Magnetic sensor

[0031] 10…Substrate

[0032] 11...Surface of substrate

[0033] 12...Wiring

[0034] 13~15……Through hole conductor

[0035] 20...Sensor chip

[0036] 21……Component forming surface

[0037] 22...The back of the sensor chip

[0038] 23-26...Side of the sensor chip

[0039] 27……Terminal electrode group

[0040] 28, 29...Insulation layer

[0041] 30, 41, 42...External magnetic body

[0042] 30a, 41a, 42a ...areas covered by external magnetic bodies

[0043] 31... First Area

[0044] 31a……End face

[0045] 32...Second Area

[0046] 50...Formed components

[0047] 51...Winding rack

[0048] 52……Terminal fixing part

[0049] 53……Flange

[0050] 54……Positioning unit

[0051] 60......Compensation coil

[0052] 61……First section

[0053] 62...Second interval

[0054] 63...the third section

[0055] 64...the fourth section

[0056] 71, 72...Connection terminals

[0057] 71a, 71b, 72a, 72b...Terminal part

[0058] 80... Connector

[0059] 81~83……Terminal

[0060] 91...Differential amplifier

[0061] 92......Detection circuit

[0062] G1~G4……Magnetic gap

[0063] M1~M3、M11、M12、M21、M22、M31、M32……magnetic layer

[0064] R1~R4……magnetic sensitive element

[0065] S1... Winding frame connection surface

[0066] S2...Terminal fixing surface

[0067] S3...bottom

[0068] T11~T14……Terminal electrode DETAILED DESCRIPTION

[0069] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0070] Figure 1 and Figure 2 1 is a schematic perspective view showing the appearance of a magnetic sensor 1 according to an embodiment of the present invention, showing states viewed from different directions. Figure 3 It is a schematic exploded perspective view of the magnetic sensor 1 .

[0071] like Figure 1 to Figure 3 As shown, the magnetic sensor 1 of this embodiment includes a substrate 10, a sensor chip 20 mounted on a surface 11 constituting an XZ plane of the substrate 10, external magnetic bodies 30, 41, 42 and a molded member 50, a compensation coil 60 wound on the molded member 50, and a pair of connection terminals 71, 72 fixed to the molded member 50. The sensor chip 20 has an element forming surface 21 and a back surface 22 constituting an XY plane, side surfaces 23, 24 constituting a YZ plane, and side surfaces 25, 26 constituting an XZ plane, and is mounted on the substrate 10 in a manner that the side surface 26 faces the surface 11 of the substrate 10. The magnetic sensing element and magnetic body layers M1 to M3 described later are formed on the element forming surface 21 of the sensor chip 20. Thus, in this embodiment, the surface 11 of the substrate 10 and the element forming surface 21 of the sensor chip 20 are perpendicular. However, in the present invention, the two do not need to be completely perpendicular, and may have a predetermined inclination relative to the perpendicular.

[0072] The external magnetic bodies 30, 41, and 42 play a role in concentrating magnetic flux on the sensor chip 20, and are all made of high magnetic permeability materials such as ferrite. Among them, the external magnetic body 30 is a rod-shaped body with the Z direction as the long side direction, and is positioned at the approximately central part of the element forming surface 21 in the X direction in a manner that covers a part of the magnetic layer M1. The external magnetic bodies 41 and 42 are located on the side opposite to the external magnetic body 30 when viewed from the sensor chip 20. Among them, the external magnetic body 41 covers a part of the magnetic layer M2, and covers a part of the side 23 and the back 22 of the sensor chip 20. The external magnetic body 42 covers a part of the magnetic layer M3, and covers another part of the side 24 and the back 22 of the sensor chip 20. According to this structure, the magnetic field in the Z direction is selectively collected, and the collected magnetic field is applied to the sensor chip 20.

[0073] The molded component 50 is made of a non-magnetic insulating material such as resin, and is fixed to the external magnetic body 30 using an adhesive or the like. The compensation coil 60 is wound on the molded component 50, and the connection terminals 71 and 72 are fixed. The connection terminals 71 and 72 are embedded in the molded component 50, and have a main body extending in the Y direction and a terminal portion formed by bending both ends of the main body in the X direction. One end of the compensation coil 60 is connected to the terminal portion 71a of the connection terminal 71, and the other end of the compensation coil 60 is connected to the terminal portion 72a of the connection terminal 72. In addition, the terminal portion 71b of the connection terminal 71 and the terminal portion 72b of the connection terminal 72 are connected to the pad pattern provided on the surface 11 of the substrate 10. The structure of the molded component 50 and the compensation coil 60 will be described later.

[0074] Figure 4 is a schematic top view of the sensor chip 20. Figure 5 It is along Figure 4 A schematic cross-sectional view of line AA.

[0075] like Figure 4 and Figure 5 As shown, four magnetic sensitive elements R1 to R4 are formed on the element forming surface 21 of the sensor chip 20. The magnetic sensitive elements R1 to R4 are not particularly limited as long as they are elements whose resistance changes according to the direction of the magnetic flux, and for example, MR elements can be used. The fixed magnetization directions of the magnetic sensitive elements R1 to R4 are uniformly set to the same direction as each other (for example, the positive side in the X direction). The magnetic sensitive elements R1 to R4 are covered by an insulating layer 28, and magnetic layers M1 to M3 composed of Permalloy and the like are formed on the surface of the insulating layer 28. The magnetic layers M1 to M3 are covered by an insulating layer 29. Moreover, in the magnetic layers M1 to M3, one side located in the Y direction ( Figure 4 The upper side in the Y direction is defined as the magnetic layer M11, M21, and M31, and the other side ( Figure 4 When the lower side (in the figure) is defined as the magnetic body layer M12, M22, and M32, when viewed from above (viewed from the Z direction), the magnetic sensitive element R1 is located between the magnetic body layer M11 and the magnetic body layer M21, the magnetic sensitive element R2 is located between the magnetic body layer M12 and the magnetic body layer M22, the magnetic sensitive element R3 is located between the magnetic body layer M11 and the magnetic body layer M31, and the magnetic sensitive element R4 is located between the magnetic body layer M12 and the magnetic body layer M32. Thus, the magnetic field passing through the magnetic gaps G1 to G4 is applied to the magnetic sensitive elements R1 to R4.

[0076] However, in the present invention, each magnetic sensitive element R1 to R4 does not need to be located between two magnetic layers when viewed from above. It is sufficient to arrange each magnetic sensitive element R1 to R4 near the magnetic gaps G1 to G4 formed by the two magnetic layers, that is, on the magnetic path formed by the magnetic gaps G1 to G4. In addition, the width of the magnetic gaps G1 to G4 does not need to be wider than the width of the magnetic sensitive elements R1 to R4. The width of the magnetic gaps G1 to G4 can also be narrower than the width of the magnetic sensitive elements R1 to R4. Figure 6 In the example shown, the width Gx of the magnetic gap G1 in the X direction is narrower than the width Rx of the magnetic sensor R1 in the X direction. Therefore, when viewed from the Z direction, the magnetic layers M1 and M2 and the magnetic sensor R1 have an overlap OV. The relationship between the magnetic gaps G1 to G4 and the magnetic sensors R1 to R4 can also be Figure 6 The relationship shown.

[0077] exist Figure 4 and Figure 5 In the figure, the areas indicated by the reference numerals 30a, 41a, and 42a respectively represent the areas covered by the external magnetic bodies 30, 41, and 42. Figure 4 and Figure 5 As shown, the external magnetic body 30 covers the magnetic body layer M1 , the external magnetic body 41 covers the magnetic body layer M2 , and the external magnetic body 42 covers the magnetic body layer M3 .

[0078] Figure 7 It is a circuit diagram for explaining the connection relationship between the magnetic sensing elements R1 to R4 and the compensation coil 60.

[0079] like Figure 7 As shown, the magnetic sensor element R1 is connected between the terminal electrodes T11 and T13, the magnetic sensor element R2 is connected between the terminal electrodes T12 and T14, the magnetic sensor element R3 is connected between the terminal electrodes T11 and T12, and the magnetic sensor element R4 is connected between the terminal electrodes T13 and T14. The terminal electrodes T11 to T14 constitute Figure 3 The terminal electrodes of the terminal electrode group 27 shown in FIG. The terminal electrode group 27 is provided on the sensor chip 20 and is connected to the connector 80 arranged on the back side of the substrate 10 via the wiring 12 formed on the surface 11 of the substrate 10 and the through-hole conductor 13 provided to penetrate the substrate 10. The power supply potential Vcc is provided to the terminal electrode T11, and the ground potential GND is provided to the terminal electrode T14. In addition, since the magnetic sensing elements R1 to R4 have exactly the same fixed magnetization direction, a difference is generated between the resistance change amount of the magnetic sensing elements R1 and R2 located on one side when viewed from the external magnetic body 30 and the resistance change amount of the magnetic sensing elements R3 and R4 located on the other side when viewed from the external magnetic body 30. As a result, the magnetic sensing elements R1 to R4 constitute a differential bridge circuit, and the change in the resistance of the magnetic sensing elements R1 to R4 corresponding to the magnetic flux density appears as a differential signal Va on the terminal electrodes T12 and T13.

[0080] The differential signal Va outputted from the terminal electrodes T12 and T13 is inputted to the differential amplifier 91 provided outside via the substrate 10 or the connector 80. The output signal of the differential amplifier 91 is fed back to the connection terminal 71. Figure 7 As shown, the compensation coil 60 is connected between the connection terminal 71 and the connection terminal 72, thereby generating a cancellation magnetic field corresponding to the output signal of the differential amplifier 91. In addition, another compensation coil composed of a pattern coil may be provided on the element forming surface 21 of the sensor chip 20.

[0081] According to this structure, when the differential signal Va corresponding to the change in resistance of the magnetic sensitive elements R1 to R4 corresponding to the magnetic flux density of the magnetic field to be detected appears on the terminal electrodes T12 and T13, the corresponding current flows to the compensation coil 60, generating a cancellation magnetic field in the opposite direction. As a result, the magnetic field to be detected is cancelled. Moreover, if the current output from the differential amplifier 91 is converted into a current-voltage by the detection circuit 92, the intensity of the magnetic field to be detected can be detected. Through such closed-loop control, the magnetic field collected by the external magnetic bodies 30, 41, and 42 can be detected with high accuracy.

[0082] Figure 8 It is a schematic perspective view for explaining the structure of the external magnetic body 30 .

[0083] like Figure 8 As shown, the external magnetic body 30 has a first region 31 and a second region 32 at different positions in the Z direction. The first region 31 and the second region 32 are not different components, but are integrated. In the first region 31, the end surface 31a constituting the XY plane faces the element forming surface 21 of the sensor chip 20 in the Z direction. That is, Figure 4 and Figure 5 The region indicated by the symbol 30a shown corresponds to the region covered by the end surface 31a of the external magnetic body 30. The height of the first region 31 in the Y direction is H1. The second region 32 is located on the opposite side of the sensor chip 20 when viewed from the first region 31, and its height in the Y direction is H2. The height H2 of the second region 32 is smaller than the height H1 of the first region 31. Therefore, when the external magnetic body 30 is mounted on the surface 11 of the substrate 10, the first region 31 is in contact with the surface 11 of the substrate 10, while the second region 32 is in a state of floating from the surface 11 of the substrate 10. The first region 31 and the second region 32 may be the same in thickness in the X direction.

[0084] Fig. 9 It is a schematic perspective view for explaining the structure of the molded component 50 .

[0085] like Fig. 9As shown, the molded component 50 includes a bobbin portion 51, a terminal fixing portion 52, and a flange portion 53. The bobbin portion 51 is located between the terminal fixing portion 52 and the flange portion 53 in the Z direction, and is a portion where most of the compensation coil 60 is wound. The bobbin portion 51 has a hollow shape, and the second region 32 of the external magnetic body 30 is arranged inside the bobbin portion 51. Thus, the compensation coil 60 is wound around the second region 32 of the external magnetic body 30 via the bobbin portion 51. The axial direction of the bobbin portion 51 is the Z direction, and thus, the axial direction of the compensation coil 60 wound around the bobbin portion 51 is also the Z direction. The diameter of the bobbin portion 51 is smaller than the diameters of the terminal fixing portion 52 and the flange portion 53, and thus, the compensation coil 60 wound around the bobbin portion 51 can be prevented from falling off. Furthermore, as described above, the second region 32 of the external magnetic body 30 covered by the bobbin portion 51 is in a state of floating from the surface 11 of the substrate 10 . Therefore, the molded member 50 and the compensation coil 60 do not interfere with the surface 11 of the substrate 10 .

[0086] The terminal fixing portion 52 has a bobbin connection surface S1 that constitutes an XY plane and is connected to the bobbin portion 51, a terminal fixing surface S2 that constitutes a YZ plane and fixes the connection terminals 71 and 72, and a bottom surface S3 that constitutes an XZ plane and faces the surface 11 of the substrate 10. The terminal fixing portion 52 also has a hollow shape, and the first region 31 of the external magnetic body 30 is arranged inside. The positions of the connection terminals 71 and 72 in the Z direction are different from each other, the connection terminal 71 is located on the sensor chip 20 side, and the connection terminal 72 is located on the compensation coil 60 side. In addition, the positions of the terminal portions 71b and 72b of the connection terminals 71 and 72 in the Y direction are consistent with each other, while the positions of the terminal portions 71a and 72a of the connection terminals 71 and 72 in the Y direction are different from each other.

[0087] like Figure 1 As shown, one end of the compensation coil 60 is connected to the terminal portion 71a of the connection terminal 71, and the other end of the compensation coil 60 is connected to the terminal portion 72a of the connection terminal 72. The terminal portions 71b and 72b of the connection terminals 71 and 72 are respectively connected to the through-hole conductors 14 and 15 provided on the substrate 10. The through-hole conductor 14 is connected to the terminal 81 of the connector 80, and the through-hole conductor 15 is connected to the terminal 82 of the connector 80. In addition, the wiring 12 connected to the terminal electrode group 27 of the sensor chip 20 is connected to the terminal 83 of the connector 80 via the through-hole conductor 13.

[0088] Here, one end of the compensation coil 60 has a first section 61 extending along the winding frame connection surface S1 in the X direction and a second section 62 extending along the terminal fixing surface S2 in the Z direction. Similarly, the other end of the compensation coil 60 has a third section 63 extending along the winding frame connection surface S1 in the X direction and a fourth section 64 extending along the terminal fixing surface S2 in the Z direction. The first section 61 and the third section 63 extend parallel to each other along the X direction while being in contact with the winding frame connection surface S1. The second section 62 and the fourth section 64 extend parallel to each other along the Z direction while being in contact with the terminal fixing surface S2.

[0089] The height positions of the first and second sections 61, 62 and the third and fourth sections 63, 64 in the Y direction are different from each other, thereby preventing mutual interference on the bobbin connection surface S1 and the terminal fixing surface S2. In addition, the lengths of the second section 62 and the fourth section 64 in the Z direction on the terminal fixing surface S2 are different from each other, and the length of the second section 62 is longer. On the terminal fixing surface S2, a protruding positioning portion 54 is provided on the upper part of the terminal portion 72a, thereby positioning the second section 62 in the Y direction.

[0090] Thus, in the present embodiment, one end and the other end of the compensation coil 60 extend along the bobbin connection surface S1 and the terminal fixing surface S2 of the molded component 50, so the positions of the one end and the other end of the compensation coil 60 do not change due to conditions, or the positions of the one end and the other end of the compensation coil 60 do not differ from product to product. In addition, since any section of the one end and the other end of the compensation coil 60 extends substantially straight in the X direction or the Z direction, and there is no section extending in an oblique direction, the magnetic field generated by the current flowing through the one end and the other end of the compensation coil 60 is unlikely to become noise to the magnetic sensing elements R1 to R4.

[0091] Furthermore, since currents in opposite directions flow through the first section 61 and the third section 63 extending in parallel on the bobbin connection surface S1, the magnetic field generated from the first section 61 and the magnetic field generated from the third section 63 cancel each other out. Similarly, since currents in opposite directions flow through the second section 62 and the fourth section 64 extending in parallel on the terminal fixing surface S2, the magnetic field generated from the second section 62 and the magnetic field generated from the fourth section 64 cancel each other out. Thus, the influence of the magnetic field generated from one end and the other end of the compensation coil 60 on the magnetic sensitive elements R1 to R4 can be suppressed to a minimum.

[0092] As mentioned above, although the preferred embodiment of the present invention has been described, the present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the gist of the present invention, and these modifications are naturally included in the scope of the present invention.

[0093] For example, in the above embodiment, both the connection terminals 71 and 72 are fixed to the terminal fixing surface S2 , but the connection terminal 71 may be fixed to the terminal fixing surface S2 , while the connection terminal 72 may be fixed to the surface opposite to the terminal fixing surface S2 .

[0094] In addition, in order to more accurately position one end and the other end of the compensation coil 60 in the Y direction, a slit that can accommodate one end and the other end of the compensation coil 60 can also be provided at the corner of the forming component 50 that serves as the boundary between the winding frame connection surface S1 and the terminal fixing surface S2.

Claims

1. A magnetic sensor, wherein: have: A sensor chip having a magnetic sensitive element; An external magnetic body, which collects the magnetic field of the detection object to the magnetic sensitive element; a molded member having a winding frame portion and a terminal fixing portion covering the external magnetic body; a compensation coil wound around the external magnetic body via the winding frame portion of the molded member; as well as a first connecting terminal, which is fixed to the terminal fixing portion of the molded component and to which one end of the compensation coil is connected, The bobbin portion of the forming member has a first direction as an axial direction, The terminal fixing portion of the molded member includes: a bobbin connecting surface that is perpendicular to the first direction and connected to the bobbin portion, and a terminal fixing surface that is parallel to the first direction and to which the first connecting terminal is fixed. The one end of the compensation coil has a first section extending along the bobbin connection surface and a second section extending along the terminal fixing surface.

2. The magnetic sensor according to claim 1, wherein: The magnetic sensor further includes a second connection terminal, which is fixed to the terminal fixing portion of the molded member and to which the other end of the compensation coil is connected. The second connecting terminal is fixed to the terminal fixing surface of the terminal fixing portion, The other end of the compensation coil has a third section extending along the bobbin connection surface and a fourth section extending along the terminal fixing surface.

3. The magnetic sensor according to claim 2, wherein: The first section and the third section extend parallel to each other.

4. The magnetic sensor according to claim 2, wherein: The second section and the fourth section extend parallel to each other.

5. The magnetic sensor according to claim 4, wherein: The second section and the fourth section both extend along the first direction.

6. The magnetic sensor according to claim 5, wherein: The terminal fixing surface extends along the first direction and a second direction perpendicular to the first direction, The terminal fixing portion further comprises a positioning portion arranged on the terminal fixing surface, The position of the second section of the compensation coil in the second direction is positioned by the positioning portion.

7. The magnetic sensor according to any one of claims 1 to 6, wherein: The external magnetic body includes a first region facing the sensor chip in the first direction and a second region located on the opposite side of the sensor chip when viewed from the first region. The height of the second region in a second direction perpendicular to the first direction is smaller than that of the first region, The bobbin portion of the molded member covers the second region of the external magnetic body.

Images