Package device, package method, and package control program

Abstract

Provided is a packaging device including a packaging control unit that recognizes a reference position of a package on the basis of a look-up image, adjusts the position of a stage such that a surface to be packaged on a predetermined region is placed at the same height as a mark surface, and packages a packaging surface on the surface to be packaged on the basis of the recognized reference position. The look-up image is obtained by adjusting the position of the packaging tool such that the mark surface of the calibration mark, which is disposed so as to be able to be imaged by the look-up imaging unit and the look-down imaging unit using the Sammer optical system, and the packaging surface of the package are at the same height, thereby causing the look-up imaging unit to image and output the packaging surface. According to the packaging device, even if the temperature of the surrounding environment changes, and even if a plurality of packaging bodies such as semiconductor chips are packaged in an overlapping manner, the target positions of the packaging bodies can be accurately determined by using an imaging unit adopting a Sammer optical system, and the packaging effect is improved. And placing and packaging the packaging body at the target position on a substrate or on another packaging body.

Description

Technical Field

[0001] The invention relates to a packaging device, a packaging method and a packaging control program. Background Art

[0002] In a bonding device as an example of a previous packaging device, first, a camera is used to photograph a work object such as a chip pad from directly above to confirm its position. Then, after the camera is retracted, the head supporting the bonding tool is moved to directly above the work object to perform the bonding operation. A bonding device using such a structure not only requires operation time, but also the accumulation of movement errors of the work target position will become a problem. Therefore, it is considered to use a shooting unit using a Scheimpflug optical system that can shoot the work object from an oblique angle (for example, refer to patent document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-179560 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, it is known that, in terms of the structural characteristics of the optical system of the shooting unit using the Sham optical system, the slight displacement of the optical system components accompanying the temperature change of the surrounding environment will become the displacement of the output image in the plane direction and will be easily revealed. The displacement of the output image in the plane direction will cause an error in the calculation of the target position where the semiconductor chip should be placed, and therefore, it will hinder the semiconductor chip from being accurately packaged in the original target position. In particular, in the so-called stacked chip packaging or 2.5-dimensional packaging in which other semiconductor chips are stacked on the semiconductor chip packaged on the substrate, the height of the mounting surface on which each semiconductor chip is mounted will change. In this case, the issue of different error amounts for each height becomes clear.

[0008] The present invention is designed to solve this problem and provides a packaging device, etc., which can use a shooting unit using a Sham optical system to accurately determine the target position of each package even if the temperature of the surrounding environment changes. In addition, even in the case of overlapping packaging of multiple semiconductor chips and other packages, the package can be placed and packaged at the target position on the substrate or other packages.

[0009] Technical means of solving problems

[0010] The packaging device in the first embodiment of the present invention includes: a packaging tool, which picks up and holds a package having a packaging surface, and packages the packaging surface on a substrate placed on a stage or in a predetermined loading area set relative to other packages already packaged on the substrate; a top-view shooting unit, which configures the optical system and the shooting element to satisfy the Sham condition so that a plane parallel to the stage surface of the stage becomes a focal plane, and is used to shoot the predetermined loading area from the same side as the packaging tool relative to the stage surface; an upward-looking shooting unit, which is used to shoot the package held in the packaging tool from the opposite side to the top-looking shooting unit relative to the stage surface; a calibration mark, which is configured to be able to be photographed by the top-looking shooting unit and the upward-looking shooting unit; and a packaging control unit, which identifies the reference position of the package based on the bottom-view image, adjusts the position of the stage in such a way that the packaged surface of the predetermined loading area and the mark surface are at the same height, and packages the package on the packaged surface based on the reference position, wherein the bottom-view image is obtained by adjusting the position of the packaging tool in such a way that the packaging surface and the mark surface of the calibration mark are at the same height, so that the top-looking shooting unit shoots and outputs the packaging surface.

[0011] In addition, the packaging method in the second embodiment of the present invention is a packaging method for a packaging body using a packaging device, wherein the packaging device includes: a packaging tool, which picks up and holds a packaging body having a packaging surface, and packages the packaging surface on a substrate mounted on a carrier or in a predetermined mounting area set relative to other packaging bodies that have been packaged on the substrate; a top-view shooting unit, which configures the optical system and the shooting element to meet the Sham condition so that a plane parallel to the carrier surface of the carrier becomes a focal plane, and is used to photograph the predetermined mounting area from the same side as the packaging tool relative to the carrier surface; and a bottom-view shooting unit, which is used to photograph the predetermined mounting area from the same side as the packaging tool relative to the carrier surface. The side opposite to the downward-looking shooting unit is upward-looking to shoot the package body held in the state of the packaging tool; and the calibration mark is configured to be photographed by the downward-looking shooting unit and the upward-looking shooting unit, the packaging method comprising a packaging control step, the packaging control step identifying the reference position of the package body based on the downward-looking image, adjusting the position of the carrier in such a way that the packaged surface of the predetermined area and the mark surface are at the same height, and packaging on the packaged surface based on the reference position, the upward-looking image is obtained by adjusting the position of the packaging tool in such a way that the packaging surface and the mark surface of the calibration mark are at the same height, so that the upward-looking shooting unit photographs and outputs the packaging surface.

[0012] In addition, the packaging control program in the third embodiment of the present invention is a packaging control program for controlling a packaging device, wherein the packaging device includes: a packaging tool, which picks up and holds a packaging body having a packaging surface, and packages the packaging surface on a substrate mounted on a carrier or on a predetermined mounting area set relative to other packaging bodies that have been packaged on the substrate; a top-view shooting unit, which configures the optical system and the shooting element to meet the Sham condition so that a plane parallel to the carrier surface of the carrier becomes a focal plane, and is used to shoot the predetermined mounting area from the same side as the packaging tool relative to the carrier surface; and a top-view shooting unit, which is used to shoot the predetermined mounting area from the same side as the top-view shooting unit relative to the carrier surface. A package body held in a packaging tool is photographed from the side opposite to the photographing unit by looking up; and a calibration mark is configured to be photographed by the downward-looking photographing unit and the upward-looking photographing unit, wherein the packaging control program enables the computer to execute a packaging control step, wherein the packaging control step identifies a reference position of the package body based on the upward-looking image, adjusts the position of the carrier so that the packaged surface of a predetermined area is at the same height as the mark surface, and packages the package on the packaged surface based on the reference position, wherein the upward-looking image is used to adjust the position of the packaging tool so that the package surface and the mark surface of the calibration mark are at the same height, and the upward-looking photographing unit photographs and outputs the package surface.

[0013] Effects of the Invention

[0014] Through the present invention, a packaging device can be provided, which can accurately determine the target position of each package by using a shooting unit using a Sham optical system even if the temperature of the surrounding environment changes. In addition, even in the case of overlapping packaging of multiple semiconductor chips and other packages, the package can be placed and packaged at the target position on the substrate or other packages. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] [ Figure 1 ] is an overall structural diagram of a flip chip bonding machine including the bonding device of this embodiment.

[0016] [ Figure 2 ] is a system structure diagram of the bonding device.

[0017] [ Figure 3 ] is an illustration for explaining the Sham optical system.

[0018] [ Figure 4 ] is a diagram showing a situation where three imaging units photograph a calibration mark.

[0019] [ Figure 5 ] is a diagram showing the situation where the bonding tool picks up the first semiconductor chip.

[0020] [ Figure 6] is a diagram showing a situation where the third imaging unit images the first semiconductor chip and adjusts the height of the first area surface to the height of the marking surface.

[0021] [ Figure 7 ] is a diagram schematically showing an overhead view image output by the third shooting unit.

[0022] [ Figure 8 ] is a diagram showing a situation where the first imaging unit and the second imaging unit photograph the lead frame serving as the predetermined loading area.

[0023] [ Fig. 9 ]yes Figure 8 A partial stereogram of .

[0024] [ Fig.10 ] is a diagram showing the sequence of calculating the target coordinates on the chip pad of the first semiconductor chip based on the first overhead image and the second overhead image.

[0025] [ Fig.11 ] is a diagram showing a situation in which a bonding tool places and bonds a first semiconductor chip at a target position.

[0026] [ Fig.12 ] is a diagram showing the situation in which the joining tool retreats.

[0027] [ Fig.13 ] is a diagram showing a situation where the third imaging unit images the second semiconductor chip and adjusts the height of the second region surface to the height of the marking surface.

[0028] [ Fig.14 ] is a diagram schematically showing an overhead view image output by the third shooting unit.

[0029] [ Fig.15 ] is a diagram showing a situation where the first imaging unit and the second imaging unit photograph the first semiconductor chip which is a predetermined mounting area.

[0030] [ Fig.16 ] is a diagram showing a sequence for calculating target coordinates on a first semiconductor chip on which a second semiconductor chip is mounted based on a first overhead image and a second overhead image.

[0031] [ Fig.17 ] is a diagram showing a situation where a bonding tool places and bonds the second semiconductor chip at a target position.

[0032] [ Fig.18 ] is a flow chart illustrating the bonding sequence of semiconductor chips.

[0033] [ Fig.19 ] is a sub-flowchart illustrating the sequence of calibration control steps.

[0034] [ Fig. 20 ] is a sub-flow chart illustrating the order of the engagement control steps.

[0035] [ Fig.21 ] is a diagram showing a situation in which three photographing units photograph a calibration mark in another embodiment.

[0036] [ Fig. 22 ] is a flow chart illustrating the bonding sequence of semiconductor chips in another embodiment.

[0037] [ Fig.23 ] is a flowchart that further illustrates the additional steps of the modified example. DETAILED DESCRIPTION

[0038] The present invention is described below by the embodiments of the invention, but the invention of the claims is not limited to the following embodiments. In addition, all the structures described in the embodiments are not necessarily technical means for solving the problem. In addition, in each figure, when there are multiple structures with the same or similar structure, in order to avoid becoming complicated, sometimes a part of them is marked with a symbol, and the other parts are omitted from marking with the same symbol.

[0039] Figure 1 1 is an overall structural diagram of a flip chip bonding machine including a bonding device 100 as a packaging device of the present embodiment. The flip chip bonding machine mainly includes the bonding device 100 and a chip supply device 500. The chip supply device 500 is a device that places the cut semiconductor chip 310 as a package on its upper surface and supplies it to the bonding device 100. Specifically, the chip supply device 500 includes a pickup mechanism 510 and a flip mechanism 520. The pickup mechanism 510 is a device that pushes any placed semiconductor chip 310 toward the flip mechanism 520. The flip mechanism 520 is a device that adsorbs and flips the semiconductor chip 310 pushed from the pickup mechanism 510, thereby exchanging its vertical direction. In the present embodiment [present embodiment], two types of semiconductor chips 310, namely, a first semiconductor chip 310a and a second semiconductor chip 310b, are prepared. The bonding apparatus 100 is an apparatus that picks up the first semiconductor chip 310a or the second semiconductor chip 310b that has been sucked in a state flipped by the flip mechanism 520 by the bonding tool 120 described later, and stacks and bonds it to the lead frame 330. In this embodiment [this embodiment], the first semiconductor chip 310a is placed on the lead frame 330 and bonded, and the second semiconductor chip 310b is overlapped and bonded on the first semiconductor chip 310a. The lead frame 330 is an example of a substrate placed on the stage 190.

[0040] The bonding device 100 mainly includes a head 110, a bonding tool 120, a first imaging unit 130, a second imaging unit 140, a third imaging unit 150, a calibration unit 170, and a stage 190. The head 110 supports the bonding tool 120, the first imaging unit 130, and the second imaging unit 140, and can be moved in a planar direction and a vertical direction by a head drive motor 111. In this embodiment, as shown in the figure, the planar direction is a horizontal direction defined by an X-axis direction and a Y-axis direction, and the vertical direction (height direction) is a Z-axis direction orthogonal to the X-axis direction and the Y-axis direction.

[0041] The bonding tool 120 can be moved in the height direction relative to the head 110 and can be rotated around the Z axis by a tool driving motor 121. The bonding tool 120 is an example of a packaging tool, and has a chuck 122 that adsorbs the semiconductor chip 310 at the front end and a heater 124 that heats the semiconductor chip 310 adsorbed by the chuck 122. The bonding tool places the semiconductor chip 310 adsorbed by the chuck 122 at a predetermined position, and heats and bonds the semiconductor chip 310 while applying pressure at the front end of the chuck 122.

[0042] The first imaging unit 130 and the second imaging unit 140 are imaging units for taking a top-view image of the lead frame 330. The first imaging unit 130 includes a first optical system 131 and a first imaging element 132, and is tiltedly disposed on the head 110 with its optical axis directed toward the bottom of the bonding tool 120. The first optical system 131 and the first imaging element 132 are arranged to satisfy the Sham condition so that a plane parallel to the stage surface 190a of the stage 190 becomes the focal plane 110a.

[0043] The second imaging unit 140 includes a second optical system 141 and a second imaging element 142, and is tiltedly arranged on the head 110 on the side opposite to the first imaging unit 130 with respect to the bonding tool 120, with its optical axis directed toward the bottom of the bonding tool 120. The second optical system 141 and the second imaging element 142 are arranged to satisfy the Sham condition so that a plane parallel to the stage surface 190a of the stage 190 becomes the focal plane 110a. In addition, in the following description, the first imaging unit 130 and the second imaging unit 140 are sometimes collectively referred to as a "top-view imaging unit".

[0044] The third imaging unit 150 is an upward-view imaging unit for photographing the semiconductor chip 310 held in the chuck 122 of the bonding tool 120 from an upward perspective. As shown in the figure, if the stage surface 190a of the stage 190 is used as a dividing surface, the third imaging unit 150 is arranged in a space on the opposite side of the space where the downward-view imaging unit is arranged. The third imaging unit 150 includes a third optical system 151 and a third imaging element 152, and is arranged so that its optical axis is directed upward. The third imaging unit 150 is a general imaging unit in which the third optical system 151 and the third imaging element 152 are arranged to be orthogonal to the optical axis, and its focal plane 150a is parallel to the light receiving surface of the third imaging element 152. In addition, in the following description, the third imaging unit 150 is sometimes referred to as an "upward-view imaging unit".

[0045] The calibration unit 170 mainly includes a mark driving motor 171, a mark plate 172, and a calibration mark 173. The calibration mark 173 is, for example, a reference mark that specifies a reference position such as an intersection of a cross mark. The mark plate 172 is, for example, a thin plate of glass or transparent resin, and the calibration mark 173 is printed on one side thereof. That is, the calibration mark 173 can also be observed from any side of the mark plate 172. In the present embodiment, the calibration mark 173 is printed on the surface of the mark plate 172 on the side opposite to the surface facing the third imaging unit 150. In the present embodiment, the surface on which the calibration mark 173 is printed is referred to as a mark surface 173a.

[0046] In addition, the sign plate 172 may be opaque as long as two calibration marks 173 are printed on both sides of the sign plate 172 and there is no offset between the reference positions in the XY direction. In the above case, the thickness of the sign plate 172 is set so that the calibration mark 173 facing the third imaging unit 150 is within the depth of field of the third imaging unit 150. In addition, the calibration mark 173 is not limited to printing, and can also be set by attaching a seal or marking the surface of the sign plate 172. In the case where the calibration mark 173 is set on both sides of the sign plate 172, the surface opposite to the surface facing the third imaging unit 150 can be defined as the mark surface 173a. The error in the Z direction caused by the difference between the calibration mark 173 photographed by the first imaging unit 130 and the second imaging unit 140 and the calibration mark 173 photographed by the third imaging unit 150 can be corrected based on the thickness of the sign plate 172.

[0047] The mark driving motor 171 rotates the mark plate 172 around the Z axis, thereby moving the calibration mark 173 to the vicinity of the center of the field of view of the third imaging unit 150 or retreating from the field of view. When the mark plate 172 rotates and the calibration mark 173 is put into the field of view of the third imaging unit 150, the respective configurations are adjusted so that the calibration mark 173 becomes the focal plane 150a of the third imaging unit 150. In addition, the third optical system 151 uses a fixed depth range across the focal plane 150a as the depth of field, so as long as the mark plane 173a and the focal plane 150a are within the range of the depth of field, a deviation is allowed.

[0048] The stage 190 can be moved in the planar direction and the vertical direction by the stage driving motor 191. Specifically, as will be described later, according to the packaging process, the position of the stage 190 is adjusted so that the first regional surface 330a (the upper surface of the lead frame 330) as the regional surface of the predetermined loading area for loading the first semiconductor chip 310a or the second regional surface 330b (the upper surface of the first semiconductor chip 310a following the lead frame 330) as the regional surface of the predetermined loading area for loading the second semiconductor chip 310b is at the same height as the mark surface 173a. Here, the first regional surface 220a includes the packaged surface of the package surface of the first semiconductor chip 310a. In addition, the second regional surface 330b includes the packaged surface of the package surface of the second semiconductor chip 310b.

[0049] Figure 2 1 is a system structure diagram of the bonding apparatus 100. The control system of the bonding apparatus 100 mainly includes a processing unit 210, a storage unit 220, an input / output device 230, a first imaging unit 130, a second imaging unit 140, a third imaging unit 150, a head driving motor 111, a tool driving motor 121, a mark driving motor 171, and a stage driving motor 191.

[0050] The operation processing unit 210 is a processor (central processing unit (CPU)) that controls the bonding device 100 and executes the program. The processor may also be a structure combined with an operation processing chip such as an application specific integrated circuit (ASIC) or a graphics processing unit (GPU). The operation processing unit 210 reads the bonding control program stored in the storage unit 220 and executes various processes related to the bonding control.

[0051] The storage unit 220 is a non-volatile storage medium, such as a hard disk drive (HDD). In addition to storing the bonding control program, the storage unit 220 can also store various parameter values, functions, comparison tables, etc. used for control or calculation. The storage unit 220 particularly stores calibration data 221. The calibration data 221 will be specifically described later and is data related to the following calibration value, which is the difference between the coordinate value calculated based on the overhead image and the coordinate value calculated based on the bottom view image for the same observation object.

[0052] The input / output device 230 includes, for example, a keyboard, a mouse, and a display monitor, and is a device for accepting menu operations performed by the user or presenting information to the user. For example, the processing unit 210 may also display the acquired top-view image or bottom-view image on the display monitor which is one of the input / output devices 230.

[0053] The first imaging unit 130 receives an imaging request signal from the operation processing unit 210 and performs imaging, and sends the first overhead image output by the first imaging element 132 as an image signal to the operation processing unit 210. The second imaging unit 140 receives an imaging request signal from the operation processing unit 210 and performs imaging, and sends the second overhead image output by the second imaging element 142 as an image signal to the operation processing unit 210. The third imaging unit 150 receives an imaging request signal from the operation processing unit 210 and performs imaging, and sends the bottom image output by the third imaging element 152 as an image signal to the operation processing unit 210.

[0054] The head drive motor 111 receives a drive signal from the calculation processing unit 210 to move the head 110 in the horizontal direction and the height direction. The tool drive motor 121 receives a drive signal from the calculation processing unit 210 to move the bonding tool 120 in the height direction and rotate around the Z axis. The mark drive motor 171 receives a drive signal from the calculation processing unit 210 to rotate the mark plate 172. The stage drive motor 191 receives a drive signal from the calculation processing unit 210 to move the stage 190 in the horizontal direction and the height direction.

[0055] The operation processing unit 210 also plays the role of a functional operation unit, which performs various operations according to the processing instructed by the bonding control program. The operation processing unit 210 can function as an image acquisition unit 211, a drive control unit 212, a calibration control unit 213, and a bonding control unit 214. The image acquisition unit 211 sends a shooting request signal to the first shooting unit 130, the second shooting unit 140, and the third shooting unit 150 to acquire image signals of the first top view image, the second top view image, and the bottom view image. The drive control unit 212 sends a drive signal corresponding to the control amount to the head drive motor 111, the tool drive motor 121, the mark drive motor 171, and the stage drive motor 191, thereby moving the head 110, the bonding tool 120, the mark plate 172, and the stage 190 to the target position. In addition, a drive signal is sent to the pickup mechanism 510 or the flipping mechanism 520, thereby pushing up the semiconductor chip 310 to be the target, or adsorbing and flipping the semiconductor chip 310.

[0056] The calibration control unit 213 calculates the calibration value by controlling the image acquisition unit 211 or the drive control unit 212, etc., based on causing the downward-viewing imaging unit to capture and output the downward-viewing image of the calibration mark 173 and causing the upward-viewing imaging unit to capture and output the downward-viewing image of the calibration mark 173. The bonding control unit 214 is an example of a packaging control unit, and recognizes the reference position of the semiconductor chip 310 by controlling the image acquisition unit 211 or the drive control unit 212, etc., based on causing the upward-viewing imaging unit to capture and output the downward-viewing image of the semiconductor chip 310 held by the bonding tool 120. At this time, the bonding control unit 214 adjusts the position of the stage 190 in such a way that the area surface of the predetermined placement area of ​​the semiconductor chip 310 and the mark surface 173a of the calibration mark 173 are at the same height. Then, the bonding tool 120 places and bonds the semiconductor chip 310 on the predetermined placement area so that the reference position matches the target position determined based on the overhead image of the placement area where the semiconductor chip 310 is to be placed and the calibration value captured and output by the overhead imaging unit. At this time, the bonding control unit 214 adjusts the position of the head 110 so that the focal plane 110a of the overhead imaging unit and the area surface of the placement area are at the same height. The specific control or processing of the calibration control unit 213 and the bonding control unit 214 will be described in detail below.

[0057] Figure 3 1 is an explanatory diagram for explaining the Sham optical system adopted in the first imaging unit 130. The second imaging unit 140 also adopts the same Sham optical system, but the Sham optical system of the first imaging unit 130 will be representatively described here.

[0058] exist Figure 3In the embodiment, plane S1 is the focal plane 110a parallel to the stage surface of stage 190. Virtual plane S2 is a plane including the principal plane of the first optical system 131 having the object side lens group 131a and the image side lens group 131b as a structural group. Plane S3 is a plane including the light receiving surface of the first imaging element 132. In the present embodiment, the Sham optical system includes the first optical system 131 and the first imaging element 132 configured to satisfy the Sham condition. The so-called configuration satisfying the Sham condition is a configuration in which plane S1, virtual plane S2, and virtual plane S3 intersect each other on a common straight line P.

[0059] The aperture 133 is disposed between the object side lens group 131a and the image side lens group 131b to limit the light beam passing through. The depth of field D can be adjusted by the diameter of the aperture 133. P Therefore, for example, as long as the first area surface 330a or the second area surface 330b is within the depth of field, the first imaging unit 130 can capture the pad reference mark or the stacking reference mark described later in a focused state. In the above meaning, the position control adjusted so that the focal plane 110a and a certain surface are at the same height is only required within the depth of field D. P If the deviation is within the range of

[0060] The second imaging unit 140 includes the same structure as the first imaging unit 130, and is symmetrically arranged on the head 110 with respect to the YZ plane including the central axis of the bonding tool 120. Therefore, the second imaging unit 140 can also capture the pad reference mark or the stacking reference mark in a focused state, similarly to the first imaging unit 130. The focal plane of the first imaging unit 130 and the focal plane of the second imaging unit 140 are preferably consistent with the focal plane 110a, but even if there is a deviation, as long as a part of the depth of field of each other overlaps, the pad reference mark or the stacking reference mark can be captured in a focused state.

[0061] Furthermore, if such a photographing unit using a Sham optical system is used, the lower part of the bonding tool 120 can be observed from an oblique direction. Therefore, even when the semiconductor chip 310 is kept on the bonding tool 120 and the bonding tool 120 is moved to the state directly above the predetermined loading area, the predetermined loading area can be observed using the overhead photographing unit. That is, the bonding tool 120 can be moved to the state directly above the predetermined loading area, and then the target position for loading the semiconductor chip 310 is determined based on the overhead image output by the overhead photographing unit. In this way, it is sufficient to move the semiconductor chip 310 from the state to the target position, so the movement of the head 110 or the bonding tool 120 can be greatly suppressed, thereby achieving a reduction in positional deviation or a shortening of the lead time associated with the movement.

[0062] However, it is known that the shooting unit using the Sham optical system has the characteristics of the configuration of the optical system or the shooting element, and as long as the optical system or the shooting element is slightly displaced as the temperature of the surrounding environment changes, the output image is displaced in the planar direction. That is, it is known that the image will shift according to the temperature of the surrounding environment. This phenomenon will cause an error in the target position when the target position for mounting the semiconductor chip 310 is determined based on the top view image, resulting in the result of hindering the semiconductor chip from being accurately bonded to the original target position. In particular, when the bonding tool 120 includes a heater 124 for heating the semiconductor chip 310, the temperature change around the Sham optical system becomes larger. In addition, in the so-called stacked chip package or 2.5-dimensional package in which other semiconductor chips are overlapped and bonded on the semiconductor chip bonded to the substrate, the height of the mounting surface on which each semiconductor chip is mounted will change. In this case, the issue of different error amounts generated for the height also becomes clear.

[0063] Therefore, in this embodiment, the calibration process is performed at a predetermined timing when the temperature of the surrounding environment is assumed to change, and in the bonding process, the height of the mark surface 173a of the calibration mark 173 is aligned with the height of the area surface (first area surface 330a or second area surface 330b) of the placement area of ​​the semiconductor chip 310 to be packaged next, so that the calibration value obtained by the calibration process can also be applied to the target position recognition of the semiconductor chip 310 stacked on any layer. The calibration process and the bonding process are described in sequence below.

[0064] The calibration process is executed by the calibration control unit 213. The calibration control unit 213 first causes the first imaging unit 130, the second imaging unit 140, and the third imaging unit 150 to image the calibration mark 173. Figure 4 This is a diagram showing a situation where three imaging units capture an image of the calibration mark 173 .

[0065] As shown in the figure, when the calibration control unit 213 starts the calibration process, the mark driving motor 171 is driven via the drive control unit 212, thereby moving the mark plate 172 into the field of view of the third imaging unit 150. When the mark plate 172 moves into the field of view of the third imaging unit 150, the calibration mark 173 provided on the mark plate 172 is located at the approximate center of the field of view of the third imaging unit 150, and its mark surface 173a and the focal plane 150a of the third imaging unit 150 become the same surface.

[0066] Next, the calibration control unit 213 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 so that the focal plane 110a of the overhead imaging unit coincides with the mark surface 173a and the calibration mark 173 is located directly below the bonding tool 120. In addition, the bonding tool 120 retreats to a position that does not enter the field of view of the overhead imaging unit.

[0067] In the state where the calibration control unit 213 is arranged as described above, the calibration control unit 213 acquires the first top view image from the first imaging unit 130, the second top view image from the second imaging unit 140, and the bottom view image from the third imaging unit 150 via the image acquisition unit 211. Then, the three-dimensional coordinates (X x y ) of the calibration mark 173 are calculated based on the image coordinates of the images of the calibration mark 173 captured in the first top view image and the second top view image. hr , Y hr , Z hr In addition, the three-dimensional coordinates (X and Y) of the calibration mark 173 are calculated based on the image coordinates of the image of the calibration mark 173 captured in the bottom-up image. sr , Y sr , Z sr ). If it is assumed that the overhead imaging unit is not affected by the temperature change of the surrounding environment and the coordinates between the imaging units are accurately adjusted in the initial state of the bonding apparatus 100, then at least X hr =X sr , Y hr =Y sr .

[0068] However, as described above, after a period of time has passed since the bonding device 100 was first used, the three-dimensional coordinates calculated based on the overhead image will be affected by the temperature change of the surrounding environment and contain errors. Therefore, (ΔX, ΔY) as the error is used as the calibration value. Specifically, the error is expressed in the form of a difference, which can be set as ΔX = X sr -X hr , ΔY=Y sr -Y hr As long as the calibration value is calculated in advance as described above, the three-dimensional coordinates of a certain observation object are calculated based on the overhead image by the overhead image capturing unit (X ht , Y ht , Z ht ), then the calibration value can be added to correct it to (X ht +ΔX,Y ht +ΔY,Z ht ). It can be said that the corrected coordinate values ​​have no error with respect to the coordinate values ​​calculated from the bottom-up image obtained even if the same observation object is photographed by the bottom-up imaging unit.

[0069] The calibration control unit 213 stores the calibration value calculated as described above in the storage unit 220 as calibration data 221. Before it is evaluated that the temperature of the surrounding environment may further change and the calibration process is required again, the calibration data 221 is referred to in the bonding process described later. In other words, if it is evaluated that the calibration process is required again, the calibration control unit 213 repeats the process and updates the calibration value.

[0070] As an example of evaluating the need for another calibration process, consider the timing when the bonding control unit 214 completes the bonding of a preset batch of semiconductor chips 310. Specifically, the calibration control unit 213 may also perform the calibration process corresponding to the timing of supplying a new batch of semiconductor chips 310 to the chip supply device 500. In addition, the operation time of the bonding operation performed by the bonding control unit 214 may also be used as a standard. For example, it may be stipulated that the calibration process is performed when the bonding operation is continuously performed for 60 minutes. Furthermore, a temperature detection unit for detecting the temperature of the overhead shooting unit is provided in the head 110, and the timing when the temperature detection unit detects a preset temperature may also be used. Specifically, multiple temperatures are pre-set, and the calibration process is performed when it is detected that the ambient temperature has crossed the temperature change. As long as the calibration value is updated as described above, the error of the coordinate value calculated based on the overhead image can be suppressed within a certain range throughout the period of continuous bonding processing.

[0071] The bonding process is executed by the bonding control unit 214. The bonding control unit 214 first picks up the target semiconductor chip 310. Figure 5 This is a diagram showing a state where the bonding tool 120 picks up the first semiconductor chip 310 a .

[0072] The bonding control unit 214 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 to the upper part of the chip supply device 500, and drives the tool drive motor 121, thereby lowering the bonding tool 120. At the same time, the pickup mechanism 510 pushes a first semiconductor chip 310a as a bonding object among the semiconductor chips 310 placed on the chip supply device 500 toward the flip mechanism 520, and the flip mechanism 520 absorbs the first semiconductor chip 310a and flips it. Then, the lowered bonding tool 120 absorbs and picks up the first semiconductor chip 310a through the chuck 122, so that the bonding tool 120 rises.

[0073] When the mark plate 172 is located in the field of view of the third imaging unit 150, the bonding control unit 214 moves the mark plate 172 away from the field of view of the third imaging unit 150 before and after the bonding tool 120 picks up the first semiconductor chip 310a. Specifically, the bonding control unit 214 drives the mark drive motor 171 via the drive control unit 212 to move the mark plate 172.

[0074] Next, the bonding control unit 214 causes the third imaging unit 150 to image the first semiconductor chip 310 a sucked by the bonding tool 120 . Figure 6 The third imaging unit 150 captures the first semiconductor chip 310a adsorbed on the bonding tool 120 and adjusts the height of the first region surface 330a, which is the region surface of the planned placement region for placing the first semiconductor chip 310a, to the height of the marking surface 173a.

[0075] The bonding control unit 214 drives the head driving motor 111 via the driving control unit 212, thereby moving the head 110 so that the focal plane 110a of the overhead imaging unit and the marking surface 173a are at the same height, and the third imaging unit 150 is located directly below the bonding tool 120. Then, the tool driving motor 121 is driven, thereby lowering the bonding tool 120 so that the contact predetermined surface of the held first semiconductor chip 310a that contacts the intended placement area of ​​the lead frame 330 and the marking surface 173a are at the same height. In addition, the contact predetermined surface includes the packaging surface of the first semiconductor chip 310a. After completing the adjustment of such a configuration, the bonding control unit 214 causes the third imaging unit 150 to capture the contact predetermined surface of the first semiconductor chip 310a held in the bonding tool 120 via the image acquisition unit 211. In addition, the contact predetermined surface of the first semiconductor chip 310a is the surface on the opposite side to the surface adsorbed on the chuck 122, and is the surface facing the third imaging unit 150.

[0076] Before and after the third imaging unit 150 images the contacting predetermined surface of the first semiconductor chip 310a, the bonding control unit 214 drives the stage driving motor 191 via the driving control unit 212, thereby adjusting the position of the stage 190. Specifically, the first area surface 330a, which is the area surface of the predetermined area for placing the first semiconductor chip 310a, is adjusted to be at the same height as the marking surface 173a. For example, the thickness of the lead frame 330 is known, so the bonding control unit 214 only needs to move the stage surface 190a to Z=Z1, which is the height of the marking surface 173a minus the thickness of the lead frame 330.

[0077] If the first region surface 330a has been adjusted to the same height as the mark surface 173a, the bonding control unit 214 skips the position adjustment of the stage 190. The position adjustment of the stage 190 may be performed before the bonding control unit 214 starts the operation of placing the first semiconductor chip 310a in the scheduled placement region.

[0078] Figure 7 1 and 2 are diagrams schematically showing that the third imaging unit 150 captures and outputs a bottom view image of the first semiconductor chip 310a held by the bonding tool 120. In addition, each subject image in the figure is directly labeled with the corresponding subject number for description.

[0079] As described above, the bonding tool 120 picks up and holds the semiconductor chip 310 (first semiconductor chip 310a, second semiconductor chip 310b) prepared by the chip supply device 500 by adsorbing it with the chuck 122. At this time, the bonding tool 120 wants to adsorb the center of the semiconductor chip 310 in a predetermined direction, but in fact, there is a case where the semiconductor chip is adsorbed with an offset. Therefore, the bonding control unit 214 confirms in what direction and position the semiconductor chip 310 is actually held, and identifies the reference position for placing the semiconductor chip 310 on the lead frame 330.

[0080] Figure 7 The bottom view image shown is an image obtained by the third imaging unit 150 looking up at the first semiconductor chip 310a, so the chuck 122 holding the first semiconductor chip 310a is also captured. Therefore, the bonding control unit 214 calculates the image coordinates of the chuck center 123 by detecting a circle as the outline of the chuck 122.

[0081] In addition, the first semiconductor chip 310a in this embodiment is provided with a chip reference mark 311a on the contacting predetermined surface with the lead frame 330, and the bonding control unit 214 calculates the image coordinates of the chip reference mark 311a captured in the bottom-view image. The bonding control unit 214 can recognize the direction and position of the first semiconductor chip 310a in which it is actually held relative to the chuck 122, based on the image coordinates of the chuck center 123 and the image coordinates of the chip reference mark 311a calculated as described above. For example, if the position where the chip reference mark 311a is provided is used as the reference position for placing the first semiconductor chip 310a on the placement predetermined area of ​​the lead frame 330, the bonding control unit 214 can calculate the three-dimensional coordinates of the reference position of the first semiconductor chip 310a at the time of capturing the bottom-view image. Therefore, even if the bonding tool 120 or the head 110 is moved later, as long as the chuck 122 continues to hold the first semiconductor chip 310a, the three-dimensional coordinates of the reference position can be tracked.

[0082] After the bonding control unit 214 recognizes the three-dimensional coordinates of the reference position, the tool driving motor 121 is driven to raise the bonding tool 120 to a position where the held first semiconductor chip 310a is retracted from the field of view of the overhead imaging unit. Then, the head driving motor 111 is driven to move the head 110 so that the bonding tool 120 is directly above the chip pad that is the next placement area for placing the first semiconductor chip 310a, and the focal plane 110a of the overhead imaging unit is aligned with the first area surface 330a. In addition, the raising of the bonding tool 120 and the movement of the head 110 may be performed in parallel.

[0083] Figure 8 1 is a diagram showing a state where the first imaging unit 130 and the second imaging unit 140 capture images of the placement area on the lead frame 330 when the head 110 and the bonding tool 120 are arranged as described above. Fig. 9 yes Figure 8 The lead frame 330 in this embodiment has a die pad 320 in each unit area 322 which is cut out and stored in a package in the future. The die pad 320 shown in the figure is a predetermined placement area where the first semiconductor chip 310a is placed. In addition, a pad reference mark 321 indicating the reference position is provided in each unit area 322.

[0084] In such Figure 8 and Fig. 9 In such a configuration, the first imaging unit 130 and the second imaging unit 140 can capture the die pad 320 and the pad reference mark 321 included in the same unit area 322 in the field of view and capture them in a focused state. The bonding control unit 214 uses the first top view image output by the first imaging unit 130 and the second top view image output by the second imaging unit 140 to calculate the coordinates of the target position where the reference position should be matched when the first semiconductor chip 310a is placed on the die pad 320.

[0085] Fig.101 is a diagram showing a sequence of calculating the target coordinates for placing the first semiconductor chip 310a from the first top view image and the second top view image. The first imaging unit 130 images the chip pads 320 from the pad reference mark 321 side, so that the unit area 322 is captured in the first top view image as the output image of the chip pad 320 in a trapezoidal shape that expands toward the pad reference mark 321 side. On the other hand, the second imaging unit 140 images the chip pads 320 from the side opposite to the pad reference mark 321, so that the unit area 322 is captured in the second top view image as the output image of the chip pad 320 in a trapezoidal shape that narrows toward the pad reference mark 321 side.

[0086] The bonding control unit 214 determines the image coordinates (x 1k ,y 1k ), and in addition, the image coordinates (x 2k ,y 2k Then, by referring to a conversion table for converting image coordinates into three-dimensional coordinates, for example, the marker coordinates (X k , Y k , Z k ). The coordinate value of the marker coordinate is a temporary target position used to calculate the precise target position, and as described above, it may be affected by the temperature change of the surrounding environment and contain errors. Therefore, the calibration value (ΔX, ΔY) is read from the calibration data 221 and then corrected. It is expected that the corrected marker coordinate (X k +ΔX,Y k +ΔY,Z k ) has no error with respect to the spatial coordinates calculated based on the upward-looking image.

[0087] Since the relative position between the predetermined target position of the die pad 320 and the pad reference mark 321 is known, the bonding control unit 214 can adjust the position of the die pad 320 according to the corrected mark coordinates (X k +ΔX,Y k +ΔY,Z k ) accurately calculate the coordinates of the target position (X Ta , Y Ta , Z Ta ).

[0088] After the coordinates of the target position are determined, the first semiconductor chip 310 a is placed and bonded to the target position. Fig.11 This is a diagram showing a state in which the bonding tool 120 places and bonds the first semiconductor chip 310 a at a target position.

[0089] As described above, the bonding control unit 214 tracks and grasps the three-dimensional coordinates of the reference position of the first semiconductor chip 310a relative to the movement of the bonding tool 120 or the head 110, and moves the first semiconductor chip 310a so that the reference position matches the target position of the die pad 320. Specifically, the head drive motor 111 is driven by the drive control unit 212 to finely adjust the position of the head 110 in the XY direction, and the tool drive motor 121 is driven to finely adjust the rotation amount of the bonding tool 120 around the Z axis. Then, the bonding tool 120 is lowered in a state where the X coordinate and Y coordinate of the reference position are respectively consistent with the X coordinate and Y coordinate of the target position, and the first semiconductor chip 310a is placed on the die pad 320. Then, the first semiconductor chip 310a is pressed by the front end of the chuck 122 and heated by the heater 124, so that the first semiconductor chip 310a is bonded to the die pad 320.

[0090] In this embodiment, as described above, the position of the head 110 in the Z direction when calculating the calibration value is the same as the position of the head 110 in the Z direction when the chip reference mark 311a is photographed by the overhead imaging unit. Figure 6 and Figure 7 As described above, the contact plan surface of the first semiconductor chip 310a held by the chuck 122 is aligned with the height of the mark surface 173a on which the calibration process has been performed, and the three-dimensional coordinates of the chip reference mark 311a are calculated. Then, the height of the first area surface 330a is made consistent with the mark surface 173a on which the calibration process has been performed. That is, the positions of the head 110 in the Z direction when obtaining the calibration value, calculating the three-dimensional coordinates of the chip reference mark 311a, and placing the first semiconductor chip 310a on the die pad 320 are all the same.

[0091] Therefore, there is no need to consider the error between the actual three-dimensional coordinates and the recognized three-dimensional coordinates relative to the XY direction that may occur when the head 110 or the bonding tool 120 is moved in the Z direction. Figure 8 In the state, the bonding tool 120 holds the first semiconductor chip 310a and withdraws from the field of view of the overhead imaging unit. However, the X-coordinate and Y-coordinate of the actual reference position in the state may not be consistent with the X-coordinate and Y-coordinate recognized by the bonding control unit 214 due to the influence of the clearance between the components of the moving mechanism that moves the bonding tool 120 up and down. Fig.11In this way, the height of the bonding tool 120 when the first semiconductor chip 310a is placed on the first region surface 330a becomes the same as the height of the bonding tool 120 when the three-dimensional coordinates of the chip reference mark 311a are calculated, and the error factor caused by the moving mechanism is eliminated. That is, the X coordinate and Y coordinate of the actual reference position when the first semiconductor chip 310a is placed on the first region surface 330a become consistent with the X coordinate and Y coordinate recognized by the bonding control unit 214. Therefore, in this embodiment, when the first semiconductor chip 310a is placed and bonded to the die pad 320, the height of the first region surface 330a is made consistent with the height of the mark surface 173a.

[0092] Fig.12 1 is a diagram showing a state where the bonding tool 120 is retracted. As shown in the figure, after the bonding of the first semiconductor chip 310a is completed, the bonding control unit 214 drives the tool driving motor 121 via the drive control unit 212 to thereby raise the bonding tool 120.

[0093] Next, the bonding control unit 214 starts a process of stacking and bonding the second semiconductor chip 310b to the first semiconductor chip 310a that has been bonded. Figure 5 Similarly to the pickup of the first semiconductor chip 310a described above, a second semiconductor chip 310b as a bonding target among the semiconductor chips 310 placed on the chip supply device 500 is flipped by the pickup mechanism 510 and the flip mechanism 520, and the second semiconductor chip 310b is adsorbed and picked up by the chuck 122.

[0094] Fig.13 The third imaging unit 150 captures the second semiconductor chip 310b adsorbed on the bonding tool 120 and adjusts the height of the second region surface 330b, which is the region surface of the planned placement region for placing the second semiconductor chip 310b, to the height of the marking surface 173a.

[0095] The bonding control unit 214 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 so that the focal plane 110a of the overhead shooting unit and the mark surface 173a are at the same height, and the third shooting unit 150 is located directly below the bonding tool 120. Then, the tool drive motor 121 is driven to lower the bonding tool 120 so that the contact predetermined surface of the held second semiconductor chip 310b that contacts the predetermined loading area of ​​the first semiconductor chip 310a as the stacking object and the mark surface 173a are at the same height. In addition, the contact predetermined surface includes the packaging surface of the second semiconductor chip 310b. After completing the adjustment of this configuration, the bonding control unit 214 causes the third shooting unit 150 to shoot the contact predetermined surface of the second semiconductor chip 310b held in the bonding tool 120 via the image acquisition unit 211. In addition, the planned contact surface of the second semiconductor chip 310 b is a surface opposite to the surface adsorbed to the chuck 122 , and is a surface facing the third imaging unit 150 .

[0096] Before and after the third imaging unit 150 images the contacting predetermined surface of the second semiconductor chip 310b, the bonding control unit 214 drives the stage driving motor 191 via the driving control unit 212, thereby adjusting the position of the stage 190. Specifically, the second area surface 330b, which is the area surface of the predetermined area for placing the second semiconductor chip 310b, is adjusted to be at the same height as the marking surface 173a. For example, the thickness of the lead frame 330 and the first semiconductor chip 310a is known, so the bonding control unit 214 only needs to move the stage surface 190a to Z=Z2, which is the height of the marking surface 173a minus the thickness of the lead frame 330 and the thickness of the first semiconductor chip 310a.

[0097] If the second region surface 330b has been adjusted to the same height as the mark surface 173a, the bonding control unit 214 skips the position adjustment of the stage 190. The position adjustment of the stage 190 may be performed before the bonding control unit 214 starts the operation of placing the second semiconductor chip 310b in the scheduled placement region.

[0098] Fig.14 1 is a diagram schematically showing that the third imaging unit 150 captures and outputs a bottom view image of the second semiconductor chip 310b held by the bonding tool 120. As in the case of the first semiconductor chip 310a, the bonding control unit 214 also confirms the suction position and direction of the second semiconductor chip 310b relative to the chuck 122, and recognizes the reference position for placing the second semiconductor chip 310b on the first semiconductor chip 310a.

[0099] The bonding control unit 214 detects a circle as the outline of the chuck 122, thereby calculating the image coordinates of the chuck center 123. In addition, the second semiconductor chip 310b in this embodiment is provided with a chip reference mark 311b on the contacting surface with the first semiconductor chip 310a, and the bonding control unit 214 calculates the image coordinates of the chip reference mark 311b captured in the bottom-up image. The bonding control unit 214 can recognize the direction and position of the second semiconductor chip 310b with respect to the chuck 122 based on the image coordinates of the chuck center 123 and the image coordinates of the chip reference mark 311b calculated as described above. Therefore, even if the bonding tool 120 or the head 110 is moved later, as long as the chuck 122 continues to hold the second semiconductor chip 310b, the three-dimensional coordinates of the reference position can be tracked.

[0100] After the bonding control unit 214 recognizes the three-dimensional coordinates of the reference position, it drives the tool drive motor 121, thereby raising the bonding tool 120 to a position where the held second semiconductor chip 310b is retracted from the field of view of the overhead imaging unit. Then, the head drive motor 111 is driven to move the head 110 so that the bonding tool 120 is directly above the first semiconductor chip 310a, which is the predetermined placement area for the next placement of the second semiconductor chip 310b, and the focal plane 110a of the overhead imaging unit coincides with the second area surface 330b. In addition, the raising of the bonding tool 120 and the movement of the head 110 may be performed in parallel.

[0101] Fig.15 The figure shows a state where the first imaging unit 130 and the second imaging unit 140 photograph the intended placement area on the first semiconductor chip 310a when the head 110 and the bonding tool 120 are arranged as described above. In this state, the first imaging unit 130 and the second imaging unit 140 can capture the intended placement area on the first semiconductor chip 310a as a target within the field of view and photograph it in a focused state. The bonding control unit 214 uses the first top view image output by the first imaging unit 130 and the second top view image output by the second imaging unit 140 to calculate the coordinates of the target position where the reference position should be matched when the second semiconductor chip 310b is placed on the first semiconductor chip 310a.

[0102] Fig.16 The figure shows the sequence from the first top view image and the second top view image to the target coordinates for placing the second semiconductor chip 310b. As shown in the figure, the first semiconductor chip 310a to be stacked has been bonded to the unit area 322 on the lead frame 330, and the stacking reference mark 323 indicating the reference position on the upper surface of the first semiconductor chip 310a is captured in both the first top view image and the second top view image.

[0103] The bonding control unit 214 determines the image coordinates (x 1j ,y 1j ), and further, the image coordinates (x 2j ,y 2j Then, the marker coordinates (X j , Y j , Z j ). The coordinate value of the marker coordinate is a temporary target position used to calculate the precise target position, and as described above, it may be affected by the temperature change of the surrounding environment and contain errors. Therefore, the calibration value (ΔX, ΔY) is read from the calibration data 221 and then corrected. It is expected that the corrected marker coordinate (X j +ΔX,Y j +ΔY,Z j ) has no error with respect to the spatial coordinates calculated from the bottom-up image. The relative position of the target position on the first semiconductor chip 310a and the stacking reference mark 323 is known, so the bonding control unit 214 can adjust the target position based on the corrected mark coordinates (X j +ΔX,Y j +ΔY,Z j ) accurately calculate the coordinates of the target position (X Tb , Y Tb , Z Tb ).

[0104] After the coordinates of the target position are determined, the second semiconductor chip 310 b is placed and bonded to the target position. Fig.17 The figure shows a state where the bonding tool 120 places and bonds the second semiconductor chip 310 b to a target position of the first semiconductor chip 310 a .

[0105] As described above, the bonding control unit 214 tracks and grasps the three-dimensional coordinates of the reference position of the second semiconductor chip 310b relative to the movement of the bonding tool 120 or the head 110, and moves the second semiconductor chip 310b so that the reference position matches the target position of the first semiconductor chip 310a. Specifically, the head drive motor 111 is driven by the drive control unit 212 to fine-tune the position of the head 110 in the XY direction, and the tool drive motor 121 is driven to fine-tune the rotation amount of the bonding tool 120 around the Z axis. Then, the bonding tool 120 is lowered in a state where the X coordinate and Y coordinate of the reference position are respectively consistent with the X coordinate and Y coordinate of the target position, and the second semiconductor chip 310b is placed on the first semiconductor chip 310a. Then, the second semiconductor chip 310b is pressed by the front end of the chuck 122 and heated by the heater 124, so that the second semiconductor chip 310b is connected to the first semiconductor chip 310a.

[0106] In this embodiment, as described above, the position of the head 110 in the Z direction when calculating the calibration value is the same as the position of the head 110 in the Z direction when the chip reference mark 311b is photographed by the overhead imaging unit. Fig.13 and Fig.14 As described above, the contacting planned surface of the second semiconductor chip 310b held by the chuck 122 is aligned with the height of the mark surface 173a on which the calibration process has been performed, and the three-dimensional coordinates of the chip reference mark 311b are calculated. Then, the height of the second region surface 330b is made consistent with the mark surface 173a on which the calibration process has been performed. That is, the positions of the respective heads 110 in the Z direction are the same when the calibration value is obtained, when the three-dimensional coordinates of the chip reference mark 311b are calculated, and when the second semiconductor chip 310b is placed on the first semiconductor chip 310a.

[0107] Therefore, there is no need to consider the error between the actual three-dimensional coordinates and the recognized three-dimensional coordinates relative to the XY direction that may occur when the head 110 or the bonding tool 120 is moved in the Z direction. Fig.15 In the state, the bonding tool 120 holds the second semiconductor chip 310b and withdraws from the field of view of the overhead imaging unit. However, the X-coordinate and Y-coordinate of the actual reference position in the state may not be consistent with the X-coordinate and Y-coordinate recognized by the bonding control unit 214 due to the influence of the clearance between the components of the moving mechanism that moves the bonding tool 120 up and down. Fig.17In this way, the height of the bonding tool 120 when the second semiconductor chip 310b is placed on the second region surface 330b becomes the same as the height of the bonding tool 120 when the three-dimensional coordinates of the chip reference mark 311b are calculated, and the error factor caused by the moving mechanism is eliminated. That is, the X coordinate and Y coordinate of the actual reference position when the second semiconductor chip 310b is placed on the second region surface 330b become consistent with the X coordinate and Y coordinate recognized by the bonding control unit 214. Therefore, in this embodiment, when the second semiconductor chip 310b is placed and connected to the first semiconductor chip 310a, the height of the second region surface 330b is made consistent with the height of the mark surface 173a.

[0108] After the bonding of the second semiconductor chip 310b is completed, the bonding control unit 214 drives the tool drive motor 121 via the drive control unit 212, thereby raising the bonding tool 120. When bonding a new semiconductor chip 310b, the bonding tool 120 is returned to the position where the bonding tool 120 is to be bonded. Figure 5 In addition, in the present embodiment, the following process is adopted, that is, after the first semiconductor chip 310a is bonded to the die pad 320, the position of the carrier 190 is adjusted, and the second semiconductor chip 310b is stacked on the first semiconductor chip 310a, but the processing process is not limited to this. For example, the first semiconductor chip 310a may be firstly packaged on each of the plurality of die pads 320 provided on the lead frame 330, and then the position of the carrier 190 may be adjusted, and the second semiconductor chip 310b may be packaged on each of these first semiconductor chips 310a in sequence. If such a process is adopted, the number of times the position adjustment of the carrier 190 is performed can be reduced, so the lead time can be expected to be shortened.

[0109] Next, the overall joining procedure including the calibration process and joining process described above will be summarized along the flowchart. Fig.18 3 is a flowchart illustrating a procedure for bonding the semiconductor chip 310 .

[0110] In step S11, the calibration control unit 213 starts a calibration control step for performing a calibration process. The details will be described later as a subroutine. In addition, when the joining process is started from the initial state where the coordinates between the imaging units are accurately adjusted, the initial calibration control step may be skipped.

[0111] After the calibration control unit 213 completes the execution of the calibration control step, the process proceeds to step S12, and the joining control unit 214 starts the joining control step for performing the joining process. The details will be described later as a subroutine.

[0112] After the bonding control unit 214 finishes the execution of the bonding control step, the process proceeds to step S13, where the calibration control unit 213 determines whether the state of the bonding device 100 at the time point satisfies the pre-set calibration timing condition. As the pre-set calibration timing condition, a condition that may be considered to require another calibration process is set. For example, as described above, the number of batches that have been processed, the operation time of the bonding operation, the temperature detected by the temperature detection unit, etc. become candidates for setting the condition.

[0113] In step S13, if the calibration control unit 213 determines that the condition is satisfied, the process returns to step S11. If the condition is not satisfied, the process proceeds to step S14. In the case of proceeding to step S14, the bonding control unit 214 determines whether all the predetermined bonding processes have been completed. If it is determined that there are semiconductor chips 310 that should be bonded, the process returns to step S12. If it is determined that all the bonding processes have been completed, the series of processes ends.

[0114] Fig.19 is a sub-flow chart illustrating the sequence of the calibration control steps. In the calibration control step, the main execution is to use Figure 4 In step S1101, the calibration control unit 213 moves the mark plate 172 to place the calibration mark 173 at the center of the field of view of the third imaging unit 150. Next, in step S1102, the calibration control unit 213 moves the head 110 so that the mark surface 173a of the calibration mark 173 becomes the same surface as the focal plane 110a of the first imaging unit 130 and the second imaging unit 140, and the calibration mark 173 is located directly below the bonding tool 120.

[0115] The calibration control unit 213 proceeds to step S1103, and causes each imaging unit to perform imaging via the image acquisition unit 211, and acquires a first top view image from the first imaging unit 130, a second top view image from the second imaging unit 140, and a bottom view image from the third imaging unit 150. Then, in the subsequent step S1104, the three-dimensional coordinates of the calibration mark 173 are calculated based on the image coordinates of the images of the calibration mark 173 captured in the first top view image and the second top view image, respectively, and the three-dimensional coordinates of the calibration mark 173 are calculated based on the image of the calibration mark 173 captured in the bottom view image. The calibration control unit 213 calculates the difference in the XY plane direction of each three-dimensional coordinate calculated as described above as a calibration value. The calculated calibration value is stored in the storage unit 220 as calibration data 221.

[0116] Then, in step S1105, the calibration control unit 213 moves the mark plate 172 to retract the calibration mark 173 from the field of view of the third imaging unit 150. After the calibration mark 173 is retracted, the process returns to the main flow. In addition, the calibration mark 173 may also be retracted in the subsequent bonding process.

[0117] Fig. 20 is a sub-flow chart illustrating the sequence of the engagement control step. In the engagement control step, the main execution is to use Figures 5 to 17 The joining control unit 214 sets "1" to the counter n in step S1201.

[0118] Entering step S1202, the head 110 is moved to the upper part of the chip supply device 500, and the bonding tool 120 is lowered. Then, the nth semiconductor chip placed as the nth layer among the semiconductor chips 310 placed on the chip supply device 500 is turned over by the pickup mechanism 510 and the flip mechanism 520, and the nth semiconductor chip is adsorbed and picked up by the chuck 122. For example, if n=1, the first semiconductor chip 310a is picked up. After picking up the nth semiconductor chip, the bonding tool 120 is raised.

[0119] In step S1203, the bonding control unit 214 moves the head 110 so that the mark surface 173a becomes the same surface as the focus surface 110a of the first imaging unit 130 and the second imaging unit 140, and positions the third imaging unit 150 directly below the bonding tool 120. Furthermore, in step S1204, the bonding tool 120 is lowered so that the contacting surface of the held nth semiconductor chip that is in contact with the stacking object becomes the same surface as the mark surface 173a.

[0120] After completing the adjustment of such arrangement, the bonding control unit 214 causes the third imaging unit 150 to photograph the contacting planned surface of the nth semiconductor chip held by the bonding tool 120 in step S1205. Then, in step S1206, the bottom view image output by the third imaging unit 150 is acquired, and the three-dimensional coordinates of the reference position of the nth semiconductor chip are recognized based on the image coordinates of the captured chip reference mark and the like.

[0121] In step S1207, the joint control unit 214 adjusts the position of the stage 190 so that the nth region surface and the index surface 173a are flush with each other. For example, if n=1, the stage surface 190a is moved to Z=Z1 so that the first region surface 330a and the index surface 173a are flush with each other.

[0122] In step S1208, the bonding control unit 214 raises the bonding tool 120 to a position where the held nth semiconductor chip is retracted from the field of view of the overhead imaging unit, and moves the head 110 so that the bonding tool 120 is directly above the scheduled placement area where the nth semiconductor chip is to be placed next. In the subsequent step S1209, the height of the head 110 is adjusted so that the focal plane 110a of the overhead imaging unit coincides with the nth area surface.

[0123] After completing the adjustment of such arrangement, the bonding control unit 214 causes the first imaging unit 130 and the second imaging unit 140 to capture the vicinity of the scheduled placement area including the reference marks such as the pad reference mark 321 and the stacking reference mark 323 in step S1210. Then, the first top view image output by the first imaging unit 130 and the second top view image output by the second imaging unit 140 are acquired, and in step S1211, the three-dimensional coordinates of the target position are calculated based on the image coordinates of the captured reference marks and calibration values.

[0124] After the target position is determined, the process proceeds to step S1212, where the bonding control unit 214 moves the head 110 and the bonding tool 120 so that the reference position of the nth semiconductor chip matches the target position, and the nth semiconductor chip is placed in the predetermined placement area. Then, the nth semiconductor chip is pressurized / heated to complete the bonding. After the bonding of the nth semiconductor chip is completed, the bonding tool 120 is raised.

[0125] The bonding control unit 214 enters step S1213 and increments the counter n. Then, in step S1214, it is confirmed whether the incremented counter n exceeds the predetermined stacking total number n0. In the present embodiment, the first semiconductor chip 310a forming the first layer is bonded to the lead frame 330, and the second semiconductor chip 310b forming the second layer is bonded thereon, so the predetermined stacking total number is "2". If the counter n does not exceed the predetermined stacking total number n0, the process returns to step S1202 and performs bonding of the nth semiconductor chip corresponding to the incremented n. If the counter n exceeds the predetermined stacking total number n0, the process returns to the main process.

[0126] In the present embodiment described above, the calibration process is separated from the joining process, and the calibration process is performed when the state of the joining device 100 satisfies the conditions of the pre-set calibration timing. Therefore, the calibration value calculated after performing one calibration process is maintained in the storage unit 220, and the calibration value is continuously referred to each time in the joining process performed before the next calibration process is performed. However, the following processing sequence may also be adopted: the calibration process is incorporated into a series of joining processes, and the calibration value is updated each time in the processing step of performing the joining process on each nth semiconductor chip. Another embodiment as described above is described below. In addition, in the following another embodiment, the structure of the joining device itself is the same as that of the embodiment, so its description is omitted, and the part with a different processing sequence is mainly described.

[0127] Fig.21 17 is a diagram showing a state in which three imaging units capture images of the calibration mark 173 in another embodiment. In this embodiment, a calibration process for calculating a calibration value is performed between the picking process of the nth semiconductor chip and the imaging process of the nth semiconductor chip by the third imaging unit 150.

[0128] More specifically, Fig. 22 The chuck 122 holds the first semiconductor chip 310a to be bonded, and the chip is withdrawn from the field of view of the overhead imaging unit. The first semiconductor chip 310a held by the chuck 122 is then placed and bonded to the predetermined placement area on the lead frame 330 as shown by the dotted line. In the figure, the position of the stage 190 is adjusted so that the first area surface 330a and the mark surface 173a are at the same height. The position adjustment of the stage 190 can be performed before the bonding control unit 214 starts the operation of placing the first semiconductor chip 310a on the predetermined placement area.

[0129] Other situations and Figure 4 The three imaging units shown in the figure are the same in that they image the calibration mark 173. Specifically, the position of the head 110 is adjusted so that the focal plane 110a of the overhead imaging unit and the mark surface 173a are at the same height. In addition, the calibration mark 173 is arranged near the center of the field of view of each imaging unit.

[0130] The calibration control unit 213 calculates the calibration value as described above based on the first top view image, the second top view image, and the bottom view image obtained by each imaging unit. After the calibration control unit 213 calculates the calibration value, the bonding control unit 214 then lowers the bonding tool 120 to execute the bonding process. Figure 6The processing after the imaging of the first semiconductor chip 310a by the third imaging unit 150 is described. The calibration value calculated in the calibration processing executed synchronously with the bonding processing as described above is only used for positioning the first semiconductor chip 310a to be bonded in the bonding processing.

[0131] The same is true for the case where the second semiconductor chip 310b is bonded. Between the picking up process of the second semiconductor chip 310b and the imaging process of the second semiconductor chip 310b by the third imaging unit 150, a calibration process for calculating a calibration value is performed. After the calibration control unit 213 calculates the calibration value based on the first top view image, the second top view image, and the bottom view image obtained by the imaging units, the bonding tool 120 is lowered to perform the calibration process using Fig.13 The processing after the imaging of the second semiconductor chip 310b by the third imaging unit 150 is described. The calibration value calculated in the calibration processing executed synchronously with the bonding processing as described above is only used for positioning the second semiconductor chip 310b to be bonded in the bonding processing.

[0132] As described above, if the calibration control unit 213 and the bonding control unit 214 cause the third imaging unit 150 to capture the calibration mark and update the calibration value in synchronization with the process of capturing the nth semiconductor chip, the time interval between the time when the calibration value is calculated and the time when the calibration value is used can be shortened. Therefore, more accurate positioning can be expected with respect to the temperature change of the surrounding environment.

[0133] Fig. 22 FIG. 1 is a flowchart for explaining the bonding sequence of semiconductor chips in another embodiment. Figures 18 to 20 The same processing sequence as described above is marked with the same step number, and the detailed description of the processing content is omitted. As described above, this embodiment is a processing sequence that incorporates the calibration process into each bonding process, so the process flow is mainly described.

[0134] In step S1201, the bonding control unit 214 substitutes "1" into the counter n. The process proceeds to step S1202, where the nth semiconductor chip placed as the nth layer among the semiconductor chips 310 placed on the chip supply device 500 is adsorbed and picked up by the chuck 122. The calibration control unit 213 executes step S1101 of moving the mark plate 172 and placing the calibration mark 173 in the center of the field of view of the third imaging unit 150 before or after step S1202 or in parallel with step S1202.

[0135] Next, the process proceeds to step S1203 , and the alignment control unit 213 moves the head 110 so that the mark plane 173 a and the focal plane 110 a become flush with each other and the alignment mark 173 is positioned directly below the bonding tool 120 .

[0136] In the subsequent step S1103, the calibration control unit 213 causes the first imaging unit 130, the second imaging unit 140, and the third imaging unit 150 to perform imaging, and then in step S1104, the calibration value is calculated. After the calibration value is calculated, the process proceeds to step S1105, and the calibration mark 173 is retracted from the field of view of each imaging unit. If the calibration control unit 213 retracts the calibration mark 173, the subsequent steps S1204 to S1212 are the same as those using Fig. 20 The described processing order is the same.

[0137] When the bonding control unit 214 enters step S1213 from step S1212, the counter n is incremented. Then, in step S1214, it is confirmed whether the incremented counter n exceeds the predetermined stacking total number n0. If the counter n does not exceed the predetermined stacking total number n0, the process returns to step S1202 and performs bonding of the nth semiconductor chip corresponding to the incremented n. If the counter n exceeds the predetermined stacking total number n0, the process enters step S14.

[0138] When the bonding control unit 214 enters step S14, it determines whether all the scheduled bonding processes have been completed. If it is determined that there are semiconductor chips to be bonded, the process returns to step S1201. If it is determined that all the bonding processes have been completed, the series of processes ends.

[0139] In the present embodiment described above, including other embodiments, the bonding control unit 214 adjusts the position of the stage 190 so that the area surface of the predetermined loading area (e.g., the first area surface 330a) and the mark surface 173a are at the same height. However, when the position of the stage 190 is adjusted based on the stage surface 190a, the height of the predetermined loading area may not be consistent with the height of the mark surface 173a due to the thickness deviation of the lead frame 330 or the first semiconductor chip 310a or the influence of the adhesive. Therefore, a modified example corresponding to this problem is described.

[0140] A variation is to use Fig. 20 A modified example of adding a sequence is applied between step S1210 and step S1211 of the described engagement control step. Fig.23 This is a flowchart for explaining the addition procedure of the modification example.

[0141] In step S1210, the joint control unit 214 causes the first shooting unit 130 and the second shooting unit 140 to shoot the vicinity of the predetermined loading area, obtain two overhead images, and calculate the temporary three-dimensional coordinates of the target position. The joint control unit 214 can identify the height of the area surface of the predetermined loading area based on the Z coordinate value of the temporary three-dimensional coordinates calculated here. Therefore, the process proceeds to step S2301, and determines whether the height of the area surface is within a preset allowable range relative to the height of the mark surface 173a actually measured in the calibration control step. If it does not converge within the preset allowable range, the process proceeds to step S2302, and based on the height of the identified area surface, the stage drive motor 191 is driven via the drive control unit 212 to readjust the position of the stage 190.

[0142] After re-adjusting the position of the stage 190, the joint control unit 214 causes the first imaging unit 130 and the second imaging unit 140 to capture the vicinity of the scheduled placement area again in step S2303, obtains two overhead images, and calculates the temporary three-dimensional coordinates of the target position in the same manner as step S1210. After calculating the temporary three-dimensional coordinates, the process returns to step S2301 again.

[0143] If it is determined in step S2301 that the height of the area surface is within the preset allowable range, the process proceeds to step S1211. If such an additional sequence is added between step S1210 and step S1211, the three-dimensional coordinates of the target position can be calculated more accurately.

[0144] In the present embodiment described above, the overhead shooting unit is a structure including the first shooting unit 130 and the second shooting unit 140, but the overhead shooting unit may also be configured to include three or more shooting units each using a Sham optical system. In addition, in the present embodiment described above, the three-dimensional coordinates of the object are calculated using the parallax between the first overhead image and the second overhead image, but the method of using the overhead shooting unit to calculate the three-dimensional coordinates is not limited to this. For example, it is also possible to set a overhead shooting unit using a Sham optical system as one and use other auxiliary means. For example, a light projection unit capable of pattern projection may also be provided in the head 110, and the shape of the projection pattern observed on the observation surface in the overhead image output by the overhead shooting unit is analyzed, thereby calculating the three-dimensional coordinates of the object. In addition, in the present embodiment, a flip chip bonding machine is described, but it is not limited to this, and it can be applied to a chip bonding machine, a surface packaging machine for packaging electronic parts on a substrate, etc., and other packaging devices.

[0145] Description of Figure Numbers

[0146] 100: Jointing device

[0147] 110: Head

[0148] 110a: focal plane

[0149] 111: Head drive motor

[0150] 120: Joining tool

[0151] 121: Tool drive motor

[0152] 122: Chuck

[0153] 123: Chuck center

[0154] 124: Heater

[0155] 130: First shooting unit

[0156] 131: First optical system

[0157] 131a: Object side lens group

[0158] 131b: Image side lens group

[0159] 132: First camera element

[0160] 133: Aperture

[0161] 140: Second shooting unit

[0162] 141: Second optical system

[0163] 142: Second camera element

[0164] 150: Third shooting unit

[0165] 150a: focal plane

[0166] 151: The third optical system

[0167] 152: Third camera element

[0168] 170: Calibration unit

[0169] 171: Logo drive motor

[0170] 172: Sign board

[0171] 173: Calibration mark

[0172] 173a: Logo surface

[0173] 190: Carrier

[0174] 190a: Carrier surface

[0175] 191: Stage drive motor

[0176] 210: Operation processing unit

[0177] 211: Image acquisition unit

[0178] 212: Drive control unit

[0179] 213: Calibration Control Department

[0180] 214: Joint control unit

[0181] 220: Storage

[0182] 221: Calibration Data

[0183] 230: Input and output devices

[0184] 310: Semiconductor chips

[0185] 310a: first semiconductor chip

[0186] 310b: second semiconductor chip

[0187] 311a: Chip fiducial mark

[0188] 311b: Chip fiducial mark

[0189] 320: Chip pad

[0190] 321: Pad fiducial mark

[0191] 322: Unit area

[0192] 323: Stacked Fiducial Marks

[0193] 330: Lead frame

[0194] 330a: First area surface

[0195] 330b: Second area surface

[0196] 500: Chip supply device

[0197] 510: Pick-up mechanism

[0198] 520: Flip mechanism

Claims

1. A packaging device, comprising: A packaging tool, which picks up and holds a package having a packaging surface, and packages the packaging surface on a substrate mounted on a carrier or in a predetermined mounting area set relative to other packages already packaged on the substrate; A top-view imaging unit, which is configured so that the optical system and the imaging element satisfy the Sham condition, so that a plane parallel to the stage surface of the stage becomes a focal plane, and is used to photograph the predetermined mounting area from the same side as the packaging tool relative to the stage surface; An upward-viewing photographing unit for photographing the package body held in the packaging tool from an upward-viewing side opposite to the downward-viewing photographing unit with respect to the stage surface; a calibration mark configured to be photographed by the downward-looking photographing unit and the upward-looking photographing unit; as well as The packaging control unit identifies the reference position of the packaging body based on the bottom-up image, adjusts the position of the carrier in such a way that the packaging surface of the predetermined carrying area and the marking surface are at the same height, and packages the packaging on the packaging surface based on the reference position. The bottom-up image is used to adjust the position of the packaging tool in such a way that the packaging surface and the marking surface of the calibration mark are at the same height, so that the bottom-up shooting unit shoots and outputs the packaging surface.

2. The packaging device according to claim 1 comprises a calibration control unit, wherein the calibration control unit calculates a calibration value based on the top view image of the calibration mark captured by the top view imaging unit and outputted, and the bottom view image of the calibration mark captured by the bottom view imaging unit and outputted, wherein the calibration value calibrates the difference between the coordinate value calculated based on the top view image outputted by the top view imaging unit and the coordinate value calculated based on the bottom view image outputted by the bottom view imaging unit, The packaging control unit identifies the target position of the predetermined loading area based on the overhead image and the calibration value, and places the package body on the predetermined loading area in a manner that the reference position matches the target position. The overhead image is obtained by adjusting the position of the overhead viewing camera unit so that the focal plane and the packaged surface are at the same height, so that the overhead viewing camera unit captures the predetermined loading area.

3. The packaging device according to claim 2, wherein: The calibration control unit calculates and updates the calibration value every time the packaging control unit completes packaging of a preset batch of the package bodies.

4. The packaging device according to claim 2, wherein: The calibration control unit calculates and updates the calibration value based on the operation time of the packaging operation performed by the packaging control unit.

5. The packaging device according to claim 2, comprising a temperature detection unit for detecting the temperature of the top-view imaging unit, The calibration control unit calculates and updates the calibration value when the temperature detection unit detects a preset temperature.

6. The packaging device according to claim 2, wherein: The calibration control unit and the packaging control unit cause the bottom-view imaging unit to image the calibration mark in synchronization with a process in which the bottom-view imaging unit causes the packaging surface of the packaging body to be imaged by the bottom-view imaging unit, and calculate the calibration value.

7. The packaging device according to claim 2, wherein: After the plurality of packages are sequentially packaged on the substrate, the packaging control unit adjusts the position of the stage to sequentially package other packages on each of the packages packaged on the substrate.

8. The packaging device according to claim 2, wherein: When the packaging control unit adjusts the position of the overhead viewing camera unit so that the focal plane and the packaged surface are at the same height, the height of the packaged surface is measured, and when the measured height of the packaged surface does not converge within an allowable range pre-set based on the marking surface, the package body is packaged after re-adjusting the position of the carrier.

9. The packaging device according to any one of claims 2 to 8, wherein: The overhead imaging unit includes a first imaging unit and a second imaging unit, and the first imaging unit and the second imaging unit are adjusted so that the focal planes thereof coincide with each other. The packaging control unit recognizes the target position by correcting the temporary target position calculated by causing the first imaging unit to capture and output a first overhead image of the scheduled placement area and causing the second imaging unit to capture and output a second overhead image of the scheduled placement area using the calibration value.

10. A packaging method, which is a packaging method using a packaging body of a packaging device, wherein the packaging device comprises: A packaging tool, which picks up and holds the package having a packaging surface, and packages the packaging surface on a substrate mounted on a stage or a predetermined placement area set relative to other packages already packaged on the substrate; a top-view shooting unit, which configures the optical system and the shooting element to satisfy the Sham condition so that a plane parallel to the stage surface of the stage becomes a focal plane, and is used to shoot the predetermined placement area from the same side as the packaging tool relative to the stage surface; an upward-view shooting unit, which is used to shoot the package held in the packaging tool from the opposite side to the top-view shooting unit relative to the stage surface; and a calibration mark, configured to be photographed by the downward-looking photographing unit and the upward-looking photographing unit, the packaging method comprising a packaging control step, The packaging control step identifies the reference position of the packaging body based on the bottom-up image, adjusts the position of the carrier in such a way that the packaging surface of the predetermined carrying area and the marking surface are at the same height, and packages the packaging on the packaging surface based on the reference position. The bottom-up image adjusts the position of the packaging tool in such a way that the packaging surface and the marking surface of the calibration mark are at the same height, so that the bottom-up shooting unit shoots and outputs the packaging surface.

11. A packaging control program is a packaging control program for controlling a packaging device, wherein the packaging device comprises: A packaging tool, which picks up and holds a package having a packaging surface, and packages the packaging surface on a substrate mounted on a stage or a predetermined mounting area set relative to other packages already packaged on the substrate; a top-view shooting unit, which arranges the optical system and the shooting element to satisfy the Sham condition so that a plane parallel to the stage surface of the stage becomes a focal plane, and is used to shoot the predetermined mounting area from the same side as the packaging tool with respect to the stage surface; an upward-view shooting unit, which is used to shoot the package held in the packaging tool from the opposite side to the top-view shooting unit with respect to the stage surface; and a calibration mark, configured to be photographed by the downward-looking photographing unit and the upward-looking photographing unit, wherein the packaging control program causes the computer to execute a packaging control step, The packaging control step identifies the reference position of the packaging body based on the bottom-up image, adjusts the position of the carrier in such a way that the packaging surface of the predetermined carrying area and the marking surface are at the same height, and packages the packaging on the packaging surface based on the reference position. The bottom-up image adjusts the position of the packaging tool in such a way that the packaging surface and the marking surface of the calibration mark are at the same height, so that the bottom-up shooting unit shoots and outputs the packaging surface.

Images