Cooling devices for cooling electronic components and electronic devices including such cooling devices
By using a loop heat pipe cooling device and the design of the substrate, cooling fins, and core components, the problem of uneven cooling of electronic components is solved, achieving a more efficient cooling effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2022-09-29
- Publication Date
- 2026-05-26
AI Technical Summary
Existing technologies are insufficient to effectively reduce the thermal resistance of electronic components, resulting in uneven cooling and affecting the stable operation of electronic devices.
The loop heat pipe (LHP) cooling device, including a substrate, cooling fins and core elements, utilizes capillary action to circulate the coolant and achieves efficient and uniform cooling through fluid communication between the substrate and the cooling fins.
It reduces the thermal resistance of the cooling device, improves the uniformity of temperature distribution, provides a more convenient heat flow path, and improves the cooling efficiency of electronic components.
Smart Images
Figure CN119769182B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to cooling technology, and more particularly to cooling devices for cooling electronic components and electronic devices including such cooling devices. Background Technology
[0002] When an electric current flows through electronic components, the components generate heat. The amount of heat depends on the power, device characteristics, and circuit design. The resistance of processors, drive circuits, power circuits, and memory contributes to some heat and power loss. To avoid failure or circuit malfunction, electronic components must operate and remain within a safe temperature range. While some circuits can operate without additional cooling, most circuits require heat dissipation and cooling mechanisms. Summary of the Invention
[0003] The purpose is to provide an improved cooling device for cooling electronic components and an electronic device including such an improved cooling device.
[0004] According to a first aspect, a cooling device is provided for cooling one or more electronic components such as electronic chips or microprocessors.
[0005] The cooling device includes a substrate having a front wall, a rear wall, and a substrate cavity defined between the front wall and the rear wall. In use, the rear wall of the substrate is used for thermal contact with one or more electronic components to be cooled. The substrate may be made of metal, particularly aluminum or an aluminum alloy.
[0006] Furthermore, the cooling device includes a plurality of cooling fins, wherein each cooling fin defines a cooling fin cavity and is attached to the front wall of the substrate, such that the cooling fin cavity is in fluid communication with at least a portion of the substrate cavity. Each cooling fin may be made of metal (especially aluminum or an aluminum alloy). The cooling fin cavity may include a plurality of meandering cooling channels.
[0007] Each of the substrate and the plurality of cooling fins defines a corresponding loop heatpipe (LHP) for circulating coolant, wherein the coolant comprises a liquid-phase coolant and a vapor-phase coolant. The LHP includes an LHP evaporation zone (also called an LHP evaporator) within the substrate cavity, wherein the LHP evaporation zone is used to convert the liquid-phase coolant into the vapor-phase coolant, i.e., to evaporate the liquid-phase coolant. Furthermore, the LHP includes an LHP compensation zone (also called an LHP reservoir) within the corresponding cooling fin, wherein the LHP compensation zone is used to accumulate condensed liquid-phase coolant and supply the coolant back to the LHP evaporator. The LHP also includes a core element (also called a core structure) disposed within the substrate cavity to extend at least partially between the LHP evaporation zone and the LHP compensation zone, and to separate the LHP evaporation zone from the LHP compensation zone, and to absorb and transport the liquid coolant. The core element may include metal powder, such as aluminum alloy powder, pure aluminum powder, copper powder, etc. Therefore, an improved cooling device is provided that can efficiently cool electronic components using an LHP cooling loop. The improved cooling device has lower thermal resistance, resulting in a more uniform temperature distribution along the substrate and cooling fins, thus providing an easier path for heat flow from the electronic components through the cooling device and ultimately to the cooling air. Therefore, for a given size of cooling device, electronic components can be cooled more efficiently by reducing the thermal resistance of the cooling device.
[0008] In another possible implementation, the LHP compensation zone is defined by the cooling fin cavity and, when using the device, is arranged at a height less than the LHP evaporation zone. The core element is used to transport the liquid coolant from the LHP compensation zone to the LHP evaporation zone against gravity via capillary action. In other words, in one implementation, the core element is arranged to generate capillary pressure, which creates a pressure difference between the LHP evaporation zone and the LHP compensation zone, forcing the liquid coolant to move upwards from the LHP compensation zone to the LHP evaporation zone against gravity.
[0009] In another possible implementation, the front wall of each cooling fin or the substrate further includes a partition wall disposed between a portion of the cooling fin cavity and a portion of the substrate cavity to separate at least a portion of the LHP compensation zone from at least a portion of the LHP evaporation zone.
[0010] In another possible implementation, the LHP further includes a coolant line that fluidly connects the LHP evaporation zone to the LHP compensation zone. In other words, in one implementation, the LHP includes a coolant line that provides fluid communication between the LHP evaporation zone and the LHP compensation zone for the coolant vapor generated in the LHP evaporation zone.
[0011] In another possible implementation, the LHP compensation zone is located within a portion of the coolant line and, when using the device, is arranged at a height greater than the LHP evaporation zone, wherein the core element is used to absorb liquid coolant from the LHP compensation zone and prevent vapor coolant from being transported from the LHP evaporation zone to the LHP compensation zone via the core element.
[0012] In another possible implementation, the coolant line is defined by one or more internal channels in each of the plurality of cooling fins.
[0013] In another possible implementation, when using the device, a portion of the coolant line is arranged at a height less than that of the cooling fin cavity, particularly less than the bottom portion of the cooling fin cavity.
[0014] In another possible implementation, the LHP further includes at least one other core element, wherein the at least one other core element is disposed on at least a portion of the inner surface of the coolant line and is in fluid communication with the core element disposed in the substrate cavity, such that liquid coolant is exchanged between the other core element and the core element disposed in the substrate cavity.
[0015] In another possible implementation, each cooling fin cavity includes multiple meandering cooling channels for guiding the flow of steam and liquid coolant within the cooling fin cavity. The portions of the multiple meandering cooling channels are separated by material portions of each cooling fin that mechanically reinforce each cooling fin, enabling it to withstand a wide range of operating pressures (i.e., below and above ambient pressure levels).
[0016] In another possible implementation, the plurality of meandering cooling channels in each cooling fin cavity define an LHP condensation zone for converting the vapor phase coolant into the liquid phase coolant.
[0017] In another possible implementation, the plurality of cooling fins comprises a plurality of roll-fitted cooling fins. In other words, in one implementation, the cooling fins are manufactured using a roll-fitting process.
[0018] In another possible implementation, the core element comprises a porous metal structure. In one implementation, the porous metal core element may be made of metal powder, metal fibers, metal mesh, or a combination thereof.
[0019] In another possible implementation, the core element is disposed within the substrate cavity and contacts the rear wall of the substrate, wherein the rear wall of the substrate is configured to contact the one or more electronic components. A portion of the core element in the evaporation zone may contact both the front and rear walls of the substrate.
[0020] According to a second aspect, an electronic device is provided, comprising one or more electronic components and a cooling device according to a first aspect, the cooling device being used to cool the one or more electronic components. For example, the electronic device may include electronic telecommunications devices such as antennas, receivers, radio remote units (RRUs), and massive MIMO units.
[0021] The following drawings and description illustrate one or more embodiments in detail. Other features, objects, and advantages will be apparent from the description and drawings. Attached Figure Description
[0022] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the drawings:
[0023] Figure 1 This is a partially exploded perspective view of a cooling device for cooling electronic components according to an embodiment;
[0024] Figure 2 yes Figure 1 A perspective view of a cooling device, in which air flows through the space between multiple cooling fins and a substrate of the cooling device;
[0025] Figure 3a According to one embodiment Figure 1 and Figure 2 Cross-sectional view of the cooling fins and substrate of the cooling device;
[0026] Figure 3b schematically shown Figure 3a The flow of liquid coolant and vapor coolant within the cooling fins and substrate portion shown;
[0027] Figure 4a According to another embodiment Figure 1 and Figure 2 Cross-sectional view of the cooling fins and substrate of the cooling device;
[0028] Figure 4b schematically shown Figure 4aThe flow of liquid coolant and vapor coolant within the cooling fins and substrate portion shown;
[0029] Figure 5a According to another embodiment Figure 1 and Figure 2 Cross-sectional view of the cooling fins and substrate of the cooling device;
[0030] Figure 5b schematically shown Figure 5a The flow of liquid coolant and vapor coolant within the cooling fins and substrate portion shown;
[0031] In the following text, the same reference numerals refer to the same or at least functionally equivalent features. Detailed Implementation
[0032] In the following description, reference is made to the accompanying drawings, which form part of this invention, and which illustrate by way of description specific aspects of embodiments of the invention or aspects in which embodiments of the invention may be used. It should be understood that embodiments of the invention can be used in other aspects and include structural or logical variations not depicted in the drawings. Therefore, the following detailed description should not be construed in a limiting sense, and the scope of the invention is defined by the appended claims.
[0033] Figure 1 This is a perspective view of a cooling device 100 or an electronic device for cooling electronic components 210, according to an embodiment. Figure 1 In the illustrated embodiment, electronic component 210 includes a printed circuit board 200 having multiple electronic chips, wherein the printed circuit board 200 and the electronic chips are attached to a cooling device 100. The multiple electronic chips may include a CPU, electronic memory, a communication interface, etc. For example, an electronic device including one or more electronic components 210 and a cooling device 100 may be an electronic telecommunications device, such as an antenna, receiver, radio remote unit (RRU), massive MIMO unit, etc.
[0034] The cooling device 100 includes a substrate 110 and a plurality of cooling fins 120a to 120n. (See below for further details.) Figures 3a to 5a and Figures 3b to 5b As detailed herein, substrate 110 includes a front wall 110a or a front portion, a rear wall 110b or a rear portion, and a substrate cavity 110c defined between the front wall 110a and the rear wall 110b of substrate 110. Figure 2 As can be seen, multiple cooling fins 120a to 120n are attached to the front wall 110a of the substrate 110, and the multiple cooling fins 120a to 120n are in Figures 3a to 5a and Figures 3b to 5bThe embodiment shown is implemented as a plate with a preferred P-shaped profile, and the front wall 110a can be approximately rectangular in shape.
[0035] In one embodiment, the front wall 110a of the substrate may include a plurality of slits or openings for accommodating a plurality of cooling fins 120a to 120n. A plurality of electronic components 210 are attached to the rear wall 110b of the substrate 110. Thus, in use, the rear wall 110b of the substrate 110 is used for thermal contact with one or more electronic components 210 to be cooled. In one embodiment, the front wall 110a and / or the rear wall 110b of the substrate 110 may be made of metal (especially aluminum or an aluminum alloy). Similarly, the plurality of cooling fins 120a to 120n may be made of metal (especially aluminum or an aluminum alloy). In one embodiment, the plurality of cooling fins 120a to 120n comprises a plurality of roll-bonded cooling fins 120a to 120n, i.e., a plurality of cooling fins 120a to 120n manufactured using a roll-bonding process.
[0036] Figure 3a According to one embodiment Figure 1 and Figure 2 A cross-sectional view of the cooling fins 120a and the substrate 110 of the cooling device 100. Figure 3b Schematic illustration of the use of Figure 3a The flow of liquid coolant (indicated by solid arrows) and vapor coolant (indicated by dashed arrows) within the cooling fins 120a and substrate 110 portion of the embodiment shown. Figure 3a The cross-section of cooling fin 120a is shown as an example of a plurality of cooling fins 120a to 120n attached to substrate 110. Figure 3a As can be seen from the image, the exemplary cooling fin 120a defines a cooling fin cavity 124 having a plurality of meandering cooling channels and is attached to the front wall 110a of the substrate 110, such that the cooling fin cavity 124 having a plurality of meandering cooling channels is in fluid communication with at least a portion of the substrate cavity 110c.
[0037] The following details this, especially... Figure 3b In the context of this, substrate 110 and exemplary cooling fins 120a define a loop heat pipe (LHP), i.e., a cooling loop for circulating coolant, wherein the coolant includes liquid-phase coolant and vapor-phase coolant. In one embodiment, the coolant may be a liquid refrigerant.
[0038] LHP includes an LHP evaporation zone (also known as an LHP evaporator) within the substrate cavity 110c. Figures 3a to 5a , Figures 3b to 5b(Represented by the letter "A" in the original text). LHP evaporation zone A is used to convert the liquid-phase coolant into the vapor-phase coolant, i.e., evaporating the liquid-phase coolant. In addition, LHP includes an LHP compensation zone (also known as an LHP reservoir, in...). Figures 3a to 5a , Figures 3b to 5b (represented by the letter "B" in Chinese) Figure 3a and Figure 3b In the illustrated embodiment, the LHP compensation zone is located within a cooling fin cavity 124 having multiple meandering cooling channels, particularly at the bottom portion of the cooling fin cavity 124. The LHP compensation zone B is used to accumulate condensed liquid coolant and supply the liquid coolant back to the LHP evaporation zone A. The LHP also includes core elements (also referred to as core structures) 122a, 122b arranged within a substrate cavity 110c to extend at least partially between the LHP evaporation zone A and the LHP compensation zone B, thereby separating the LHP evaporation zone A from the LHP compensation zone B. Figure 3a and Figure 3b In the illustrated embodiment, specifically, the core element portion 122b extends between the LHP evaporation zone A and the LHP compensation zone B to separate the LHP evaporation zone A from the LHP compensation zone B. In one embodiment, the core elements 122a, 122b comprise a porous metal structure. In one embodiment, the porous metal core elements 122a, 122b may be made of metal powder, metal felt, metal mesh, and / or combinations thereof.
[0039] exist Figure 3a and Figure 3b In the illustrated embodiment, when using device 100, the arrangement height of LHP evaporation zone A is greater than that of LHP compensation zone B. In this embodiment, from Figure 3b As can be seen, the flow of liquid coolant is represented by solid arrows, and the flow of vapor coolant is represented by dashed arrows. Core elements 122a and 122b are used to transport the liquid coolant accumulated in the LHP compensation zone B (i.e., at the bottom of the cooling fin cavity 124) upwards to the LHP evaporation zone A through capillary action, overcoming gravity. In other words, in Figure 3a and Figure 3b In the illustrated embodiment, core elements 122a, 122b are arranged and used to generate capillary pressure, which results in a pressure difference between the LHP evaporation zone A and the LHP compensation zone B, forcing the liquid coolant to overcome gravity and move upward from the LHP compensation zone B to the LHP evaporation zone A along the core element portion 122a.
[0040] like Figure 3a and Figure 3bAs shown, the core element portions 122a and 122b can be arranged within the substrate cavity 110c, contacting the rear wall 110b of the substrate 110 and partially contacting the front wall 110a. As described above, the electronic component 210 is attached to and thus in thermal contact with the rear wall 110b of the substrate 110. Because the core elements 122a and 122b are arranged within the substrate cavity 110c, the liquid coolant rises due to capillary pressure in the core elements 122a and 122b, efficiently absorbing the heat generated by the electronic component 210. This heat absorption, in turn, causes the heated liquid coolant in the core element 122a to evaporate into the evaporation zone, such as... Figure 3b It is shown schematically in the middle.
[0041] like Figure 3a and Figure 3b As shown, the LHP defined by the exemplary cooling fins 120a and the substrate 110 also includes a coolant line that fluidly connects the LHP evaporation zone A to the LHP compensation zone B. It should be understood that, as Figure 3b As shown, the coolant line provides fluid communication between the LHP evaporation zone A and the LHP compensation zone B for the coolant vapor generated in LHP evaporation zone A. Figure 3a and Figure 3b In the illustrated embodiment, the coolant line between the LHP evaporation zone A and the LHP compensation zone B is defined by one or more internal channels of the exemplary cooling fin 120a.
[0042] exist Figure 3a and Figure 3bIn the illustrated embodiment, the coolant line defined by the cooling channels of the exemplary cooling fin 120a includes: a first channel portion 123a extending horizontally at a first height away from the LHP evaporation zone A, a second channel portion 123b extending vertically downward to a second height, a third channel portion 123c, and a fourth channel portion 123d, wherein the third channel portion 123c extends in a short horizontal direction at the second height to reverse the flow direction, and the fourth channel portion 123d extends vertically upward from the second height to guide the vapor coolant generated by the LHP evaporation zone A to the cooling fin cavity 124 of the exemplary cooling fin 120a. Therefore, in one embodiment, when using the cooling device 100, at least a portion of the coolant line (particularly the third channel portion 123c) is arranged at a height less than that of the cooling fin cavity 124 having multiple meandering cooling channels. It should be understood that the coolant line fluidly communicating the LHP evaporation zone A with the LHP compensation zone B may have a different shape and / or a different number of portions than the coolant line shown in the figures. In one embodiment, each cooling fin 120a to 120n may further include more than one coolant line that fluidly connects the LHP evaporation zone A to the LHP compensation zone B. It should be further understood that the generally P-shaped profile of the exemplary cooling fin 120a facilitates more efficient use of the bottom portion of the cooling fin 120a, which is at a height less than that of the cooling fin cavity 124 having multiple meandering cooling channels.
[0043] from Figure 3a and Figure 3bAs can be seen from the figures, the cooling fin cavity 124 of the exemplary cooling fin 120a includes a plurality of interconnected meandering cooling channels or a network of interconnected meandering cooling channels. This network of interconnected meandering cooling channels in the cooling fin cavity 124 can be defined by a plurality of material portions 126 of the roll-bonded material of the exemplary cooling fin 120a, which help prevent the cooling fin cavity 124 from expanding or contracting, allowing the operating pressure within the cooling fin cavity 124 to be within a range above and below ambient pressure levels when the cooling device 100 is used. The network of interconnected meandering cooling channels in the cooling fin cavity 124, defined by the material portions 126 of the exemplary cooling fin 120a, serves to guide the flow of vapor coolant in a meandering manner within the cooling fin cavity 124. In the embodiment shown in the figures, as an example, the plurality of material portions 126 have a generally hexagonal profile or cross-section (which may be circular) to define a honeycomb pattern of the material portions 126, which in turn defines the network of interconnected meandering cooling channels in the cooling fin cavity 124. It should be understood that, in use, the multiple material portions 126, together with the multiple meandering cooling channels formed between the material portions 126, absorb a portion of the heat from the vapor coolant flowing upwards into the cooling fin cavity 124 via the coolant lines. This heat is conducted through the material portions 126 and the walls of the meandering cooling channels to the outer surface of the exemplary cooling fin 120a, which is cooled by air moving along the outer surface of the exemplary cooling fin 120a, such as... Figure 2 An example is shown. It should be understood that, as detailed below, some heat dissipation also occurs in the coolant lines defined by the channels.
[0044] As heat is dissipated via the inner surface of the cooling fin 120a, the vapor coolant flowing upward within the plurality of meandering cooling channels of the cooling fin cavity 124 releases heat energy to the ambient air and thus condenses into liquid coolant. Therefore, the plurality of meandering cooling channels of the exemplary cooling fin 120a's cooling fin cavity 124 can be considered to define an LHP condensation zone C, which is used to convert the vapor-phase coolant into a liquid-phase coolant. Figure 3b As shown, the liquid coolant generated in the LHP condensation zone C accumulates at the bottom of the cooling fin cavity 124, i.e., in the LHP compensation zone B.
[0045] like Figure 3b As shown, some vapor coolant may have condensed as it flows through the vertically upward-extending fourth channel section 123d of the coolant pipeline, and accumulate at the bottom of the vertically upward-extending fourth channel section 123d, i.e., within the third channel section 123c. Therefore, as Figure 3bAs shown, it can also be considered that the steam coolant generated by the LHP evaporation zone A is guided to the fourth channel portion 123d of the cooling fin cavity 124, which extends vertically upward, defining another part of the LHP condensation zone C.
[0046] To efficiently deliver the liquid coolant accumulated in the third channel portion 123c and at the bottom of the cooling fin cavity 124 to the core elements 122a and 122b arranged in the substrate cavity 110c, the exemplary cooling fins 120a and LHP may also include at least one other core element 122c or 122d. Figure 3a and Figure 3b In the illustrated embodiment, at least one other core element 122c, 122d is arranged on the inner surface of the vertically upward-extending fourth channel portion 123d and the bottom surface of the cooling fin cavity 124. For example... Figure 3a and Figure 3b Schematic illustration shows that at least one other core element 122c, 122d is in fluid communication with core elements 122a, 122b disposed in the substrate cavity to deliver liquid coolant from the LHP condensation zone C and the LHP compensation zone B to the core elements 122a, 122b disposed in the substrate cavity 110c.
[0047] like Figure 3a and Figure 3b As shown, in one embodiment, the exemplary cooling fin 120a may further include a partition wall 125 disposed between a portion of the cooling fin cavity 124 having a plurality of meandering cooling channels and a portion of the substrate cavity 110c, and extending between the portion of the cooling fin cavity 124 having a plurality of meandering cooling channels and the portion of the substrate cavity 110c. In another embodiment, the partition wall 125 may be a portion of the front wall 110a of the substrate 110.
[0048] Figure 4a , Figure 4b , Figure 5a and Figure 5b Other embodiments of the exemplary cooling fins 120a and substrate 110 are shown below. The following mainly details... Figure 4a , Figure 4b , Figure 5a and Figure 5b The exemplary embodiments of the cooling fins 120a and the substrate 110 shown are similar to those of the previous embodiments. Figure 3a and Figure 3b Differences between the illustrated embodiments. From Figure 4b and Figure 5b As can be seen from this, the first major difference lies in... Figure 4a , Figure 4b , Figure 5a and Figure 5bIn the exemplary embodiment of the cooling fins 120a and substrate 110 shown, with Figure 3a and Figure 3b Compared to the embodiments shown, the flow directions of the steam coolant and the liquid coolant are generally opposite.
[0049] Furthermore, it should be understood that, Figure 4a , Figure 4b , Figure 5a and Figure 5b In the exemplary embodiment of the cooling fins 120a and substrate 110 shown, when using the cooling device 100, the arrangement height of the LHP compensation region B is greater than that of the LHP evaporation region A. More specifically, as shown in the figure, in Figure 4a , Figure 4b , Figure 5a and Figure 5b In the exemplary embodiment of the cooling fin 120a and substrate 110 shown, the LHP compensation region B is primarily defined within a first horizontally extending channel portion of the coolant conduit, which is defined in the upper portion of the exemplary cooling fin 120a. Therefore, from Figure 4b and Figure 5b As can be seen from these embodiments, core elements 122a and 122b are used to absorb liquid coolant from the LHP compensation zone B located within a first horizontally extending channel portion of the coolant line, thereby preventing vapor coolant from being transported from the LHP evaporation zone A to the LHP compensation zone B via the core elements. Due to this blocking effect of the core elements 122a and 122b, the vapor coolant generated in the LHP evaporation zone A flows back to the LHP compensation zone B through the cooling fin cavity 124 having multiple meandering cooling channels and the coolant line. The cooling fin cavity 124 having multiple meandering cooling channels and the channels are arranged such that at least some of the vapor coolant condenses in the coolant line portion.
[0050] exist Figure 4a and Figure 4b In the embodiments shown, there is no such Figure 3a and Figure 3b Other core elements 122c, 122d as shown in the illustrated embodiment. Figure 5a and Figure 5b In the embodiment shown, other core elements 122c and 122d are disposed on the inner surfaces of the first channel portion 123a extending horizontally and the second channel portion 123b extending vertically downward in the coolant pipeline.
[0051] As above Figure 1 and Figure 2 As described in the context, a plurality of cooling fins 120a to 120n are inserted into the front wall 110a of the substrate 110, for example, into slits of appropriate size. In one embodiment, Figure 3a , Figure 3b , Figure 4a , Figure 4b , Figure 5a and Figure 5b The illustrated core element portions 122a and 122b may extend through the entire substrate cavity 110c, thereby providing core elements for all cooling fins 120a to 120n. In another embodiment, the substrate cavity 110c may be divided by an inner wall into a plurality of compartments, wherein the core element of each compartment provides core elements 122a and 122b for one or more cooling fins 120a to 120n. In one embodiment, these compartments may have different sizes and thus provide core elements for different numbers of cooling fins.
Claims
1. A cooling device (100) for cooling one or more electronic components (210), characterized in that, The cooling device (100) includes: A substrate (110), wherein the substrate (110) has a front wall (110a), a rear wall (110b) and a substrate cavity (110c) located between the front wall (110a) and the rear wall (110b), the rear wall (110b) being used for thermal contact with the one or more electronic components (210); Multiple cooling fins, wherein each cooling fin defines a cooling fin cavity (124) and is attached to the front wall (110a) of the substrate (110) such that the cooling fin cavity (124) is in fluid communication with at least a portion of the substrate cavity (110c). Wherein, the substrate (110) and each of the plurality of cooling fins define a loop heat pipe (LHP), the LHP being used to circulate a coolant, wherein the coolant includes a liquid coolant and a vapor coolant, and the LHP comprises: The LHP evaporation zone (A) within the substrate cavity (110c) is used to evaporate the liquid coolant into the vapor coolant. The corresponding LHP compensation zone (B) within the cooling fins is used to accumulate the liquid coolant; A coolant line that fluidly connects the LHP evaporation zone (A) to the LHP compensation zone (B); the LHP compensation zone (B) is located in a portion of the coolant line and is arranged at a height greater than that of the LHP evaporation zone (A). Core elements (122a, 122b), wherein the core elements (122a, 122b) are disposed within the substrate cavity (110c) to extend at least partially between the LHP evaporation zone (A) and the LHP compensation zone (B), and are used to absorb and transport the liquid coolant to separate the LHP evaporation zone (A) from the LHP compensation zone (B), the core elements (122a, 122b) being used to absorb the liquid coolant from the LHP compensation zone (B) and prevent the vapor coolant from being transported from the LHP evaporation zone (A) to the LHP compensation zone (B) via the core elements (122a, 122b).
2. The cooling device (100) according to claim 1, characterized in that, The coolant lines are defined by one or more internal channels in each of the plurality of cooling fins.
3. The cooling device (100) according to claim 2, characterized in that, A portion of the coolant pipeline (123c) is arranged at a height less than that of the cooling fin cavity (124).
4. The cooling device (100) according to claim 3, characterized in that, The LHP also includes at least one other core element (122c, 122d), wherein the at least one other core element (122c, 122d) is disposed on at least a portion of the inner surface of the coolant line and is in fluid communication with the core element (122a, 122b) disposed within the substrate cavity (110c), such that the liquid coolant is exchanged between the other core element (122c, 122d) and the core element (122a, 122b) disposed within the substrate cavity (110c).
5. The cooling device (100) according to any one of claims 1 to 4, characterized in that, Each cooling fin includes multiple meandering cooling channels for guiding the flow of the vapor coolant within the cooling fin cavity (124).
6. The cooling device (100) according to claim 5, characterized in that, Each portion of the plurality of meandering cooling channels is separated by a plurality of material portions (126) of each cooling fin.
7. The cooling device (100) according to claim 6, characterized in that, The plurality of material portions (126) and the meandering cooling channels formed between the material portions (126) define an LHP condensation zone for converting the vapor coolant into the liquid coolant.
8. The cooling device (100) according to claim 1, characterized in that, The plurality of cooling fins includes a plurality of roll-formed cooling fins.
9. The cooling device (100) according to claim 1, characterized in that, The core components (122a, 122b) comprise a porous metal structure.
10. The cooling device (100) according to claim 1, characterized in that, The core components (122a, 122b) are disposed within the substrate cavity (110c) and are in contact with a portion of the front wall (110a) and a portion of the rear wall (110b) of the substrate (110), wherein the rear wall (110b) of the substrate (110) is used for thermal contact with the one or more electronic components (210).
11. An electronic device, characterized in that, include: One or more electronic components (210); The cooling device (100) according to any one of claims 1 to 10, wherein, The cooling device (100) is used to cool the one or more electronic components (210).