Brain electrode device and method of making the same

Abstract

The application discloses a brain electrode device and a preparation method thereof. The brain electrode device comprises a signal processing structure and a brain electrode structure, and the signal processing structure and the brain electrode structure are connected. The brain electrode structure is used for collecting brain electrical signals. The signal processing structure comprises a circuit board and a flexible connecting structure. The output end of the flexible connecting structure is detachably connected with the circuit board. The input end of the flexible connecting structure is electrically connected with the brain electrode structure. The circuit board forms at least one U-shaped structure, and the flexible connecting structure is arranged in a folded mode. According to the disclosed embodiment, the space occupation of the signal processing structure in the brain electrode device is reduced by the circuit board arranged in a folded mode and the flexible connecting structure arranged in a folded mode, so that the internal structure of the brain electrode device is compactly arranged, the volume of the device is reduced, and the device is not too large to be inconvenient to carry.

Description

Technical Field

[0001] This invention relates to the field of brain electrode technology, and in particular to a brain electrode device and its preparation method. Background Technology

[0002] Brain-computer interfaces (BCIs) are an interdisciplinary technology involving neuroscience, signal detection, and signal processing, holding significant research importance and immense application potential in fields such as biomedicine, neurorehabilitation, and intelligent robotics. They establish a direct communication and control channel between the human brain and a computer or other electronic devices. Brain signals collected from the cerebral cortex are amplified, filtered, and converted into computer-recognizable signals through A / D conversion. These signals are then preprocessed to extract feature signals, which are used for pattern recognition, ultimately transforming into specific commands to control external devices. To minimize incisions and prevent infection from long-term implantation, semi-implantable BCIs can be used; however, current BCIs are generally bulky, making them inconvenient for patients to carry. Summary of the Invention

[0003] To address the aforementioned problems in the prior art, this invention discloses a brain electrode device and its fabrication method, which can reduce the space occupied by the circuit board and flexible connection structure in the brain electrode device, thereby making the internal layout of the brain electrode device compact and reducing the device size. The technical solution disclosed in this invention is as follows:

[0004] According to one aspect of the disclosed embodiments of the present invention, a brain electrode device is provided, the brain electrode device comprising a signal processing structure and a brain electrode structure, the signal processing structure and the brain electrode structure being connected, and the brain electrode structure being used to acquire brain electrical signals;

[0005] The signal processing structure includes a circuit board and a flexible connection structure. The output end of the flexible connection structure is detachably connected to the circuit board, and the input end of the flexible connection structure is electrically connected to the brain electrode structure. The circuit board forms at least one U-shaped structure, and the flexible connection structure is folded.

[0006] Optionally, the circuit board includes a signal transmission circuit board, at least two signal processing circuit boards, and at least two flexible circuit boards. The at least two signal processing circuit boards are arranged opposite to each other. The signal transmission circuit board and the at least two signal processing circuit boards are folded to form the at least one U-shaped structure. The output end of the flexible connection structure is detachably connected to the at least two signal processing circuit boards. The signal transmission circuit board is electrically connected through the at least two flexible circuit boards and the at least two signal processing circuit boards. Each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the EEG signal.

[0007] Optionally, the at least two signal processing circuit boards include a first signal processing circuit board and a second signal processing circuit board, the first signal processing circuit board and the second signal processing circuit board are disposed opposite each other on both sides of the signal transmission circuit board, and the output end of the flexible connection structure is detachably connected to the target signal processing circuit board; the target signal processing circuit board is the first signal processing circuit board or the second signal processing circuit board.

[0008] Optionally, each signal processing circuit board is provided with a first transmission interface, the output end of the flexible connection structure is provided with a second transmission interface, the signal transmission circuit board is provided with a third transmission interface, the output end of the flexible connection structure is detachably connected to the target signal processing circuit board through the second transmission interface, the first transmission interface, and the signal transmission circuit board is communicatively connected to an external analysis device through the third transmission interface;

[0009] The target signal processing circuit board is any one of the at least two signal processing circuit boards.

[0010] Optionally, the brain electrode structure includes a fixed structure and a contact electrode structure, the input end of the flexible connection structure is fixedly connected to the fixed structure, the contact electrode structure is in contact with the cerebral cortex to collect the brain electrical signals, and the fixed structure and the contact electrode structure are electrically connected.

[0011] The contact electrode structure includes multiple sub-contact electrode structures, and through holes are provided between adjacent sub-contact electrode structures.

[0012] Optionally, the brain electrode device further includes a housing and a support structure, the signal processing structure is disposed in the housing through the support structure, and one end of the housing is fixedly connected to the skull;

[0013] The shell and the skull form a sealed space, and the signal processing structure and the brain electrode structure are disposed within the sealed space; the shell is filled with adhesive.

[0014] Optionally, the housing includes a fixed base and a cover, wherein the fixed base is fixedly connected to the skull, and the fixed base and the cover are detachably connected;

[0015] The fixing base includes a first part, a second part, and a fixing part. The fixing part is fixedly connected to the skull, the second part is detachably connected to the cover, the first part is located between the second part and the fixing part, and is close to the fixing part. The cross-sectional area of ​​the first part is smaller than that of the second part.

[0016] Optionally, the bottom of the housing is provided with an opening through which the brain electrode structure passes; the brain electrode structure includes a fixing structure and a contact electrode structure, the fixing structure is disposed inside the housing, and the contact electrode structure is disposed outside the housing; the opening is filled with cured silicone.

[0017] According to another aspect of the disclosed embodiments of the present invention, a method for preparing the above-described brain electrode device is provided, wherein the brain electrode device further includes a housing, the bottom of which is provided with an opening, and the brain electrode structure includes a fixing structure and a contact electrode structure, and the method includes:

[0018] The brain electrode structure is prepared for acquiring brain electrical signals;

[0019] The signal processing structure is connected to the fixed structure, and the contact electrode structure extends from the opening;

[0020] Preparation of cured silicone and adhesive;

[0021] The opening is sealed by the cured silicone to obtain a sealed brain electrode device;

[0022] The adhesive is injected into the sealed brain electrode device and then cured.

[0023] Optionally, injecting the adhesive into the sealed brain electrode device and performing a curing process includes:

[0024] The brain electrode device is activated.

[0025] The adhesive is injected into the activated brain electrode device, followed by vacuuming and curing.

[0026] The brain electrode device and its preparation method provided by this invention have the following technical effects:

[0027] The present invention provides a brain electrode device comprising a signal processing structure and a brain electrode structure, which are connected. The brain electrode structure is used to acquire electroencephalogram (EEG) signals. The signal processing structure includes a circuit board and a flexible connection structure. The output end of the flexible connection structure is detachably connected to the circuit board, and the input end of the flexible connection structure is electrically connected to the brain electrode structure. The circuit board forms at least one U-shaped structure, and the flexible connection structure is folded. Therefore, by using a folded circuit board with at least one U-shaped structure and a folded flexible connection structure in the signal processing structure of the brain electrode device, the space occupied by the signal processing structure in the brain electrode device can be reduced, resulting in a compact internal structure, reduced device size, and avoiding excessive size that would hinder portability.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the disassembled structure of a brain electrode device according to an exemplary embodiment;

[0031] Figure 2 This is a schematic diagram illustrating a signal processing structure according to an exemplary embodiment;

[0032] Figure 3 This is a tiled schematic diagram of a circuit board structure according to an exemplary embodiment;

[0033] Figure 4 This is a folding schematic diagram of a circuit board structure according to an exemplary embodiment;

[0034] Figure 5 This is a schematic diagram illustrating a flexible connection structure according to an exemplary embodiment;

[0035] Figure 6 This is a folding schematic diagram illustrating another circuit board structure according to an exemplary embodiment;

[0036] Figure 7 This is a schematic diagram illustrating a brain electrode structure according to an exemplary embodiment;

[0037] Figure 8 This is a schematic diagram of the assembly structure of a signal processing structure and a brain electrode structure according to an exemplary embodiment;

[0038] Figure 9 This is a schematic diagram of a brain electrode device according to an exemplary embodiment;

[0039] Figure 10 This is a bottom view schematic diagram illustrating a brain electrode device according to an exemplary embodiment;

[0040] The reference numerals in the attached figures are as follows: 1-Signal processing structure; 2-Circuit board; 21-First signal processing circuit board; 22-Second signal processing circuit board; 23-Flexible circuit board; 24-First transmission interface; 25-Signal transmission circuit board; 26-Third transmission interface; 27-Amplifier chip; 28-Reference line; 29-Third signal processing circuit board; 3-Flexible connection structure; 31-Input end; 32-Output end; 33-Second transmission interface; 4-Brain electrode structure; 41-Fixing structure; 42-Contact electrode structure; 43-Through hole; 5-Housing shell; 51-Fixing base; 52-Cover; 53-First part; 54-Second part; 55-Fixing part; 56-Opening; 57-Baffle; 6-Support structure. Detailed Implementation

[0041] To enable those skilled in the art to better understand the technical solutions disclosed in this invention, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0042] It should be noted that the term "an embodiment" or "embodiment" in the specification of the embodiments of this invention refers to a specific feature, structure, or characteristic that can be included in at least one implementation of this application. It should be understood that in the specification, claims, and accompanying drawings of the embodiments of this application, the terms "upper," "lower," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention disclosed herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or devices.

[0043] Please see Figure 1 , Figure 1 This is a schematic diagram illustrating the disassembled structure of a brain electrode device according to an exemplary embodiment, such as... Figure 1As shown, the brain electrode device includes a signal processing structure 1 and a brain electrode structure 4, which are connected. The brain electrode structure 4 is used to collect brain signals. The signal processing structure 1 includes a circuit board 2 and a flexible connection structure 3. The output end 32 of the flexible connection structure 3 is detachably connected to the circuit board 2, and the input end 31 of the flexible connection structure 3 is electrically connected to the brain electrode structure 4. The circuit board 2 forms at least one U-shaped structure, and the flexible connection structure 3 is folded.

[0044] In one specific embodiment, the EEG device can acquire EEG signals through the EEG electrode structure 4, and transmit and process the EEG signals through the signal processing structure 1. The processed EEG signals can then be transmitted to external devices (such as analysis and display devices) for further processing. Specifically, the EEG device can be semi-implantable, with part of the EEG electrode structure 4 implanted to acquire EEG signals. The signal processing structure 1 can be fixed to the skull to process the EEG signals. The flexible connection structure 3 can be a flexible printed circuit board (FPC). The input end 31 of the flexible connection structure 3 and the EEG electrode structure 4 are electrically connected by soldering. Correspondingly, the connection between the input end 31 of the flexible connection structure 3 and the EEG electrode structure 4 can be a solder pad, specifically soldered using solder paste via flip-chip soldering. Multiple arrayed solder points can be provided on the solder pad, multiple arrayed electrode points can be provided on the EEG electrode structure 4, and multiple lines can be provided on the circuit board 2, with each solder point, electrode point, and line corresponding to the others.

[0045] Specifically, the circuit board 2 forms at least one U-shaped structure, meaning the circuit board 2 is folded within the brain electrode device, and the flexible connection structure 3 is also folded. This reduces the space occupied by the signal processing structure 1 within the brain electrode device, thereby reducing the overall space required for the brain electrode device while maintaining a high channel count. The flexible connection structure 3 can... Figure 5 The flexible connection structure 3 is folded in both the vertical and horizontal directions, and the output end 32 of the flexible connection structure 3 and the circuit board 2 are detachably connected. The circuit board 2 can be replaced by pulling out the folded flexible connection structure 3 from the brain electrode device.

[0046] Optional, such as Figures 2-4As shown, the circuit board 2 includes a signal transmission circuit board 25, at least two signal processing circuit boards, and at least two flexible circuit boards 23. The at least two signal processing circuit boards are arranged opposite each other. The signal transmission circuit board 25 and the at least two signal processing circuit boards are folded to form at least one U-shaped structure. The output end 32 of the flexible connection structure 3 is detachably connected to the at least two signal processing circuit boards. The signal transmission circuit board 25 is electrically connected through the at least two flexible circuit boards 23 and the at least two signal processing circuit boards. The signal transmission circuit board 25 can also be electrically connected through the flexible circuit boards 23. Each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the EEG signal.

[0047] In one specific embodiment, the circuit board 2 may include one or more signal transmission circuit boards 25. Specifically, at least two signal processing circuit boards are disposed opposite each other on both sides of the corresponding signal transmission circuit board 25. Each signal processing circuit board corresponds to a flexible circuit board 23, and each signal processing circuit board is connected to the corresponding signal transmission circuit board 25 through the corresponding flexible circuit board 23 to form a U-shaped structure. Optionally, multiple signal processing circuit boards can be connected by one signal transmission circuit board 25 and multiple flexible circuit boards, or multiple U-shaped circuit boards can be stacked by connecting multiple signal transmission circuit boards 25.

[0048] Optional, such as Figures 2-5 As shown, each signal processing circuit board is provided with a first transmission interface 24, the output end 32 of the flexible connection structure 3 is provided with a second transmission interface 33, and the signal transmission circuit board 25 is provided with a third transmission interface 26. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board through the second transmission interface 33 and the first transmission interface 24. The signal transmission circuit board 25 is connected to an external analysis device through the third transmission interface 26. The target signal processing circuit board is any one of at least two signal processing circuit boards.

[0049] In one specific embodiment, the flexible circuit board 23 is bent to form an L-shape between the signal transmission circuit board 25 and each signal processing circuit board. Each signal processing circuit board may have a first transmission interface 24 and an amplifier chip 27 respectively on both sides, with the first transmission interface 24 and the amplifier chip 27 being arranged correspondingly. Specifically, the first transmission interface 24 may be located on the side of the signal processing circuit board facing the signal transmission circuit board 25, and the amplifier chip 27 may be located on the other side.

[0050] Specifically, the output end 32 of the flexible connection structure 3 can be detachably connected to any signal processing circuit board. This detachable connection between the signal processing circuit board and the flexible connection structure 3 is achieved through the insertion between the first transmission interface 24 and the second transmission interface 33. The flexible connection structure 3 has an overall L-shaped structure. The output end 32 of the flexible connection structure 3 is folded so that the second transmission interface 33 is positioned opposite to each other, thereby correspondingly engaging with the third transmission interface 26 of the signal processing circuit board. The first transmission interface 24 on the signal processing circuit board and the second transmission interface 33 on the flexible connection structure 3 are arranged in a one-to-one correspondence. The signal transmission circuit board 25 communicates with external devices through the third transmission interface 26 to transmit the processed EEG signals to external devices. Specifically, the first transmission interface 24 and the second transmission interface 33 can be Molex interfaces, and the third transmission interface 26 can be an HDMI interface.

[0051] In some embodiments, such as Figure 4 As shown, the above-mentioned at least two signal processing circuit boards include a first signal processing circuit board 21 and a second signal processing circuit board 22. The first signal processing circuit board 21 and the second signal processing circuit board 22 are electrically connected to the signal transmission circuit board 25 through corresponding flexible circuit boards 23. The first signal processing circuit board 21 and the second signal processing circuit board 22 are arranged opposite to each other on both sides of the signal transmission circuit board 25. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board. The target signal processing circuit board is either the first signal processing circuit board 21 or the second signal processing circuit board 22.

[0052] Specifically, each signal processing circuit board and signal transmission circuit board 25 are connected by a flexible circuit board 23 to form a U-shaped structure. The two signal processing circuit boards are arranged opposite each other on both sides of the signal transmission circuit board 25. The first transmission interface 24 can be set on one side of the two signal processing circuit boards respectively, and the amplifier chip 27 is set on the other side respectively. The output end 32 of the flexible connection structure 3 can be detachably connected to one of the signal processing circuit boards through the first transmission interface 24 and the second transmission interface 33.

[0053] In some embodiments, such as Figure 6As shown, the aforementioned at least two signal processing circuit boards include a first signal processing circuit board 21, a second signal processing circuit board 22, and a third signal processing circuit board 29. The first signal processing circuit board 21 and the second signal processing circuit board 22 are electrically connected to the signal transmission circuit board 25 via flexible circuit boards 23, respectively. The third signal processing circuit board 29 is electrically connected to the first signal processing circuit board 21 via the flexible circuit board 23. The first signal processing circuit board 21 and the second signal processing circuit board 22 are arranged opposite each other on both sides of the signal transmission circuit board 25. The third signal processing circuit board 29 is located between the first signal processing circuit board 21 and the second signal processing circuit board 22, and is arranged parallel to the first signal processing circuit board 21 and the second signal processing circuit board 22. The output terminal 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board; the target signal processing circuit board is the first signal processing circuit board 21, the second signal processing circuit board 22, or the third signal processing circuit board 29.

[0054] Specifically, the signal transmission circuit board 25 is folded together with the first signal processing circuit board 21 and the second signal processing circuit board 22 through a flexible circuit board 23 to form a U-shaped structure. The third signal processing circuit board 29 is also folded together with the first signal processing circuit board 21 through a flexible circuit board 23 to form a U-shaped structure. The number of second transmission interfaces 33 on the flexible connection structure 3 can be set according to the number of signal processing circuit boards. Optionally, the third signal processing circuit board 29 can also be electrically connected to the second signal processing circuit board 22 through the flexible circuit board 23.

[0055] In the above embodiments, when the channel requirements are higher, more signal processing circuit boards and interfaces need to be added. Without increasing the size of a single signal processing circuit board (for example, setting two amplifier chips on a processing circuit board), the additional signal processing circuit board 29 is further folded and set between the two signal processing circuit boards 21 and 22 that are connected to and opposite to the signal transmission circuit board 25, in order to save space and avoid making major design changes to the existing circuit board structure.

[0056] In an optional embodiment, such as Figure 7 As shown, the brain electrode structure 4 includes a fixed structure 41 and a contact electrode structure 42. The input end 31 of the flexible connection structure 3 is fixedly connected to the fixed structure 41. The contact electrode structure 42 contacts the cerebral cortex inside the skull to collect brain signals. The fixed structure 41 and the contact electrode structure 42 are electrically connected. The contact electrode structure 42 includes multiple sub-contact electrode structures, and through holes 43 are provided between adjacent sub-contact electrode structures.

[0057] Specifically, the fixed structure 41 can be a solder pad, flip-chip bonded to the input terminal 31 of the flexible connection structure 3. Each sub-contact electrode structure 42 can be a flexible electrode point. The solder pad includes multiple solder points, and each sub-contact electrode structure corresponds one-to-one with a solder point and corresponds to a signal channel in the circuit board 2. Each sub-contact electrode structure and its corresponding solder point are electrically connected by flip-chip bonding using solder paste. The multiple sub-contact electrode structures are arranged in an array, and through holes 43 can be provided between adjacent flexible electrode points to increase the adhesion between the contact electrode structure 42 and the cerebral cortex, while facilitating the drainage of cerebrospinal fluid below the cerebral cortex.

[0058] In an optional embodiment, such as Figure 1 and Figures 9-10 As shown, the brain electrode device also includes a housing 5 and a support structure 6. The signal processing structure 1 is disposed inside the housing 5 through the support structure 6. One end of the housing 5 is fixedly connected to the skull. The housing 5 and the skull form a sealed space, and the signal processing structure 1 and the brain electrode structure 4 are disposed inside the sealed space. The housing 5 is filled with adhesive.

[0059] Specifically, the housing 5 can be a metal housing, such as titanium. The signal processing structure 1 can be housed within the housing 5, and the support structure 6 can be used to stably house the signal processing structure 1 within the housing 5, for example, vertically. The support structure 6 can include upper and lower support structures 6, which are respectively connected to the two ends of the signal processing structure 1 in the vertical direction, so that the signal processing structure 1 is stably housed within the housing 5. One end of the housing 5 and the skull can be fixedly connected by fasteners, specifically, the fasteners can include, but are not limited to, screws.

[0060] In the above embodiments, by setting a sealed housing 5, the brain electrode structure 4 can be placed in a closed space, thereby avoiding environmental infection of the brain and improving the reliability of the brain electrode device.

[0061] Specifically, the ground wire on the circuit board 2 can be connected to the housing 5, and the reference line 28 is led out from the housing 5. During use, the reference line 28 is connected to the dura mater.

[0062] Optional, such as Figure 10 As shown, the bottom of the housing 5 has an opening 56 through which the brain electrode structure 4 passes; the fixing structure 41 is disposed inside the housing 5, and the contact electrode structure 42 is disposed outside the housing 5; the opening 56 is filled with cured silicone. Specifically, the fixing structure 41 is welded to the input end 31 of the flexible connection structure 3 inside the housing 5, and the contact electrode structure 42 is implanted in the brain.

[0063] Optional, such as Figure 1 and Figures 9-10As shown, the shell 5 includes a fixed base 51 and a cover 52. The fixed base 51 is fixedly connected to the skull, and the fixed base 51 and the cover 52 are detachably connected. The fixed base 51 includes a first part 53, a second part 54 and a fixing part 55. The fixing part 55 is fixedly connected to the skull, and the second part 54 is detachably connected to the cover 52. The first part 53 is located between the second part 54 and the fixing part 55 and is close to the fixing part 55. The cross-sectional area of ​​the first part 53 is smaller than that of the second part 54.

[0064] Specifically, the fixation part 55 can be adjusted according to the shape of the skull to fit and fix it to the skull shape. The thickness of the fixation part 55 can be set according to the actual application requirements, for example, it can be set to 0.5mm to 1mm. The fixation part 55 is provided with mounting holes, which can be fixed to the skull with fasteners. During the implantation of the brain electrode device, the contact electrode structure 42 and the fixation part 55 are implanted in the brain, and the fixation part 55 is fixed to the skull. Other structures are not implanted. The second part 54 can be set as a narrow and elongated channel, which can accommodate the pad end of the flexible connection structure 3 and the brain electrode structure 4 while reducing the implantation wound in the brain, which is conducive to sealing, reducing space, and reducing the probability of infection and harm to the patient.

[0065] Specifically, the cover 52 and the fixed base 51 can be fixedly connected by fasteners, including but not limited to screws. Optionally, the cover 52 may include a removable baffle 57, which is correspondingly disposed above the third transmission interface 26 on the signal transmission circuit board 25. The baffle 57 can be positioned above the third transmission interface 26, so that the third transmission interface 26 can be exposed by opening the baffle 57, and then connected to an external device via a connecting cable. When the connection is not needed, the baffle 57 can be closed to protect the third transmission interface 26.

[0066] In practical applications, the signal processing structure 1 and the fixing structure 41 of the brain electrode structure 4 are electrically connected by flip-chip soldering using solder paste, and the entire assembly is installed inside the housing 5. The bottom of the housing 5 has an opening 56, and the contact electrode structure 42 of the brain electrode structure 4 extends from the opening 56 of the housing 5, located outside the housing 5. During the use of the brain electrode device, the contact electrode structure 42 needs to be implanted into the brain, and the device is fixed to the skull through the bottom of the housing 5. Other structures are located outside the brain. Therefore, it is necessary to seal the bottom opening 56 to seal the housing 5 and prevent bodily fluids from entering the device through the opening 56 of the housing 5 during use, which could corrode the internal electronic components and cause failure.

[0067] Specifically, the opening 56 of the aforementioned brain electrode device can be sealed using cured silicone. Furthermore, a filling adhesive can be injected into the interior of the housing 5 (between the signal processing structure 1, the support structure 6, and the housing 5) to seal the gaps between the internal components, further protecting the electronic components and extending their lifespan.

[0068] The following describes specific embodiments of this application based on the above technical solution.

[0069] Example 1

[0070] Please see Figures 1-5 and Figures 7-10 Example 1 provides a brain electrode device, including a signal processing structure 1 and a brain electrode structure 4, which are connected. The brain electrode structure 4 is used to collect brain signals. The signal processing structure 1 includes a circuit board 2 and a flexible connection structure 3. The output end 32 of the flexible connection structure 3 is detachably connected to the circuit board 2, and the input end 31 of the flexible connection structure 3 is electrically connected to the brain electrode structure 4. The circuit board 2 forms at least one U-shaped structure, and the flexible connection structure 3 is folded.

[0071] Specifically, the circuit board 2 forms at least one U-shaped structure, meaning the circuit board 2 is folded within the brain electrode device, and the flexible connection structure 3 is also folded. This reduces the space occupied by the signal processing structure 1 within the brain electrode device, thereby reducing the overall space required for the brain electrode device while maintaining a high channel count. The flexible connection structure 3 can... Figure 5 The flexible connection structure 3 is folded in both the vertical and horizontal directions, and the output end 32 of the flexible connection structure 3 and the circuit board 2 are detachably connected. The circuit board 2 can be replaced by pulling out the folded flexible connection structure 3 from the brain electrode device.

[0072] Optional, such as Figures 2-4 As shown, the circuit board 2 includes a signal transmission circuit board 25, at least two signal processing circuit boards, and at least two flexible circuit boards 23. The at least two signal processing circuit boards are arranged opposite each other. The signal transmission circuit board 25 and the at least two signal processing circuit boards are folded to form at least one U-shaped structure. The output end 32 of the flexible connection structure 3 is detachably connected to the at least two signal processing circuit boards. The signal transmission circuit board 25 is electrically connected through the at least two flexible circuit boards 23 and the at least two signal processing circuit boards. The signal transmission circuit board 25 can also be electrically connected through the flexible circuit boards 23. Each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the EEG signal.

[0073] Optional, such as Figures 2-5As shown, each signal processing circuit board is provided with a first transmission interface 24, the output end 32 of the flexible connection structure 3 is provided with a second transmission interface 33, and the signal transmission circuit board 25 is provided with a third transmission interface 26. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board through the second transmission interface 33 and the first transmission interface 24. The signal transmission circuit board 25 is connected to an external analysis device through the third transmission interface 26. The target signal processing circuit board is any one of at least two signal processing circuit boards.

[0074] In one specific embodiment, the flexible circuit board 23 is bent to form an L-shape between the signal transmission circuit board 25 and each signal processing circuit board. Each signal processing circuit board may have a first transmission interface 24 and an amplifier chip 27 respectively on both sides, with the first transmission interface 24 and the amplifier chip 27 being arranged correspondingly. Specifically, the first transmission interface 24 may be located on the side of the signal processing circuit board facing the signal transmission circuit board 25, and the amplifier chip 27 may be located on the other side.

[0075] Specifically, the output end 32 of the flexible connection structure 3 can be detachably connected to any signal processing circuit board. This detachable connection between the signal processing circuit board and the flexible connection structure 3 is achieved through the insertion between the first transmission interface 24 and the second transmission interface 33. The flexible connection structure 3 has an overall L-shaped structure. The output end 32 of the flexible connection structure 3 is folded so that the second transmission interface 33 is positioned opposite to each other, thereby correspondingly engaging with the third transmission interface 26 of the signal processing circuit board. The first transmission interface 24 on the signal processing circuit board and the second transmission interface 33 on the flexible connection structure 3 are arranged in a one-to-one correspondence. The signal transmission circuit board 25 communicates with external devices through the third transmission interface 26 to transmit the processed EEG signals to external devices. Specifically, the first transmission interface 24 and the second transmission interface 33 can be Molex interfaces, and the third transmission interface 26 can be an HDMI interface.

[0076] In some embodiments, such as Figure 4 As shown, the above-mentioned at least two signal processing circuit boards include a first signal processing circuit board 21 and a second signal processing circuit board 22. The first signal processing circuit board 21 and the second signal processing circuit board 22 are electrically connected to the signal transmission circuit board 25 through corresponding flexible circuit boards 23. The first signal processing circuit board 21 and the second signal processing circuit board 22 are arranged opposite to each other on both sides of the signal transmission circuit board 25. The output end 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board. The target signal processing circuit board is either the first signal processing circuit board 21 or the second signal processing circuit board 22.

[0077] Specifically, each signal processing circuit board and signal transmission circuit board 25 are connected by a flexible circuit board 23 to form a U-shaped structure. The two signal processing circuit boards are arranged opposite each other on both sides of the signal transmission circuit board 25. The first transmission interface 24 can be set on one side of the two signal processing circuit boards respectively, and the amplifier chip 27 is set on the other side respectively. The output end 32 of the flexible connection structure 3 can be detachably connected to one of the signal processing circuit boards through the first transmission interface 24 and the second transmission interface 33.

[0078] In an optional embodiment, such as Figure 7 As shown, the brain electrode structure 4 includes a fixed structure 41 and a contact electrode structure 42. The input end 31 of the flexible connection structure 3 is fixedly connected to the fixed structure 41. The contact electrode structure 42 contacts the cerebral cortex inside the skull to collect brain signals. The fixed structure 41 and the contact electrode structure 42 are electrically connected. The contact electrode structure 42 includes multiple sub-contact electrode structures, and through holes 43 are provided between adjacent sub-contact electrode structures.

[0079] Specifically, the fixed structure 41 can be a solder pad, flip-chip bonded to the input terminal 31 of the flexible connection structure 3. Each sub-contact electrode structure 42 can be a flexible electrode point. The solder pad includes multiple solder points, and each sub-contact electrode structure corresponds one-to-one with a solder point and corresponds to a signal channel in the circuit board 2. Each sub-contact electrode structure and its corresponding solder point are electrically connected by flip-chip bonding using solder paste. The multiple sub-contact electrode structures are arranged in an array, and through holes 43 can be provided between adjacent flexible electrode points to increase the adhesion between the contact electrode structure 42 and the cerebral cortex, while facilitating the drainage of cerebrospinal fluid below the cerebral cortex.

[0080] In an optional embodiment, such as Figure 1 and Figures 9-10 As shown, the brain electrode device also includes a housing 5 and a support structure 6. The signal processing structure 1 is disposed inside the housing 5 through the support structure 6. One end of the housing 5 is fixedly connected to the skull. The housing 5 and the skull form a sealed space, and the signal processing structure 1 and the brain electrode structure 4 are disposed inside the sealed space. The housing 5 is filled with adhesive.

[0081] Optional, such as Figure 10 As shown, the bottom of the housing 5 has an opening 56 through which the brain electrode structure 4 passes; the fixing structure 41 is disposed inside the housing 5, and the contact electrode structure 42 is disposed outside the housing 5; the opening 56 is filled with cured silicone. Specifically, the fixing structure 41 is welded to the input end 31 of the flexible connection structure 3 inside the housing 5, and the contact electrode structure 42 is implanted in the brain.

[0082] Optional, such as Figure 1 and Figures 9-10As shown, the shell 5 includes a fixed base 51 and a cover 52. The fixed base 51 is fixedly connected to the skull, and the fixed base 51 and the cover 52 are detachably connected. The fixed base 51 includes a first part 53, a second part 54 and a fixing part 55. The fixing part 55 is fixedly connected to the skull, and the second part 54 is detachably connected to the cover 52. The first part 53 is located between the second part 54 and the fixing part 55 and is close to the fixing part 55. The cross-sectional area of ​​the first part 53 is smaller than that of the second part 54.

[0083] Optionally, the cover 52 may include a removable baffle 57, which is correspondingly disposed above the third transmission interface 26 on the signal transmission circuit board 25. The baffle 57 can be opened to expose the third transmission interface 26, and then connected to an external device via a connecting cable. When the connection is not needed, the baffle 57 can be closed to protect the third transmission interface 26.

[0084] Specifically, the opening 56 of the aforementioned brain electrode device can be sealed using cured silicone. Furthermore, a filling adhesive can be injected into the interior of the housing 5 (between the signal processing structure 1, the support structure 6, and the housing 5) to seal the gaps between the internal components, further protecting the electronic components and extending their lifespan.

[0085] Example 2

[0086] The difference between Embodiment 2 and Embodiment 1 lies in the arrangement of circuit board 2. The similarities with Embodiment 1 will not be repeated here. The differences between Embodiment 2 and Embodiment 1 are explained below:

[0087] like Figure 6 As shown, the at least two signal processing circuit boards include a first signal processing circuit board 21, a second signal processing circuit board 22, and a third signal processing circuit board 29. The first and second signal processing circuit boards 21 and 22 are electrically connected to the signal transmission circuit board 25 via corresponding flexible circuit boards 23. The third signal processing circuit board 29 is electrically connected to the first signal processing circuit board 21 via the flexible circuit board 23. The first and second signal processing circuit boards 21 and 22 are arranged opposite each other on both sides of the signal transmission circuit board 25. The third signal processing circuit board 29 is located between the first and second signal processing circuit boards 21 and 22, and is arranged parallel to them. The output terminal 32 of the flexible connection structure 3 is detachably connected to the target signal processing circuit board; the target signal processing circuit board is the first signal processing circuit board 21, the second signal processing circuit board 22, or the third signal processing circuit board 29. Optionally, the third signal processing circuit board 29 can also be electrically connected to the second signal processing circuit board 22 via the flexible circuit board 23.

[0088] As can be seen from the technical solutions provided in the embodiments of this specification above, the brain electrode device in this specification includes a signal processing structure and a brain electrode structure. The signal processing structure and the brain electrode structure are connected. The brain electrode structure is used to collect brain signals. The signal processing structure includes a circuit board and a flexible connection structure. The output end of the flexible connection structure is detachably connected to the circuit board, and the input end of the flexible connection structure is electrically connected to the brain electrode structure. The circuit board forms at least one U-shaped structure, and the flexible connection structure is folded. Therefore, in the signal processing structure of the brain electrode device, the space occupied by the signal processing structure in the brain electrode device can be reduced by the folded circuit board with at least one U-shaped structure and the folded flexible connection structure, thereby making the internal structure layout of the brain electrode device compact, reducing the size of the device, and avoiding excessive size that is not conducive to portability.

[0089] This application embodiment also provides a method for preparing the above-mentioned brain electrode device. The brain electrode device further includes a housing 5, the bottom of which is provided with an opening 56. The brain electrode structure 4 includes a fixing structure 41 and a contact electrode structure 42. The above method may include:

[0090] Brain electrode structure 4 was fabricated and used to collect brain electrical signals.

[0091] The signal processing structure 1 is connected to the fixed structure 41, and the contact electrode structure 42 extends out from the opening 56;

[0092] Preparation of cured silicone and adhesive;

[0093] The opening 56 was sealed by curing silicone to obtain the sealed brain electrode device.

[0094] The adhesive is injected into the sealed brain electrode device and then cured.

[0095] In one specific embodiment, the opening 56 is sealed with curing silicone. The prepared curing silicone is degassed by a vacuum machine and poured into a mold. Then, the bottom of the housing 5 (i.e., the aforementioned fixing part 55) is pressed into the mold, so that the electrode wires are also covered by the curing silicone. Further curing is performed based on a preset temperature and a preset time. Specifically, it can be placed in an oven for curing. The first preset temperature and the first preset time can be set according to actual needs. The first preset temperature can be set to 80°C to 120°C, and the first preset time can be set to 4 hours to 12 hours. For example, the temperature is set to 120°C and the time is set to 4 hours.

[0096] Specifically, the curing silicone can be obtained by mixing silicone and curing agent in a first preset ratio. The preset ratio can be set according to actual application requirements. For example, the ratio of silicone to curing agent can be set to 10:1.

[0097] In one specific embodiment, after sealing the opening 56 of the housing 5 with silicone, the prepared adhesive is injected into the housing 5 using a syringe or similar means, and cured based on a second preset temperature and a second preset time. The second preset temperature and the second preset time can be set according to actual needs. The second preset temperature can be set to 60°C to 80°C, and the second preset time can be set to 4 hours to 8 hours. For example, the temperature can be set to 80°C and the time to 4 hours.

[0098] Specifically, the adhesive can be epoxy resin glue. The epoxy resin glue and hardener are mixed according to a second preset ratio to obtain the prepared adhesive. The second preset ratio can be set according to actual application requirements. For example, in practical applications, the epoxy resin glue and hardener can be poured into a centrifuge tube according to the second preset ratio for preparation. After preparation, the mixture is shaken evenly using a mixer, and then poured into a centrifuge tube to remove air bubbles. The parameters during the preparation process can be set according to actual application requirements. For example, during the air bubble removal process, the centrifuge speed can be set to 2000 rpm to 3000 rpm, and the centrifugation time can be set to 5 minutes to 10 minutes. Specifically, the speed can be set to 3000 rpm and the centrifugation time to 5 minutes.

[0099] Optionally, the above-mentioned process of injecting adhesive into the sealed brain electrode device and then curing it may include:

[0100] The brain electrode device was activated.

[0101] The adhesive is injected into the activated brain electrode device, followed by vacuuming and curing.

[0102] In one specific embodiment, before injecting the adhesive, the signal processing structure 1, the support structure 6, and the housing 5 can be activated to clean the structural surfaces, thereby enhancing the bonding force between the adhesive and the inner wall of the housing 5, the circuit board 2, and the brain electrode structure 4. Specifically, oxygen plasma can be used to activate the above structures. The processing time and power can be set according to actual application requirements; for example, the processing time can be set to 5 to 30 minutes, and the power can be set to 200W to 500W.

[0103] In one specific embodiment, after the oxygen plasma activation treatment is completed, the epoxy resin adhesive is filled within a certain time (e.g., within 30 min to 120 min). After filling, it can be placed in a vacuum kettle for vacuum treatment, thereby ensuring that the epoxy resin can completely fill the pores in the shell 5 and preventing the generation of air bubbles in the epoxy resin.

[0104] Regarding the structures in the above embodiments, the specific arrangements of each structure have been described in detail in the embodiments related to the device, and will not be elaborated here.

[0105] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles disclosed herein and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.

[0106] It should be understood that the present invention is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A brain electrode device, characterized in that, The brain electrode device includes a signal processing structure and a brain electrode structure, the signal processing structure and the brain electrode structure are connected, and the brain electrode structure is used to collect brain electrical signals. The signal processing structure includes a circuit board and a flexible connection structure. The output end of the flexible connection structure is detachably connected to the circuit board, and the input end of the flexible connection structure is electrically connected to the brain electrode structure. The circuit board forms at least one U-shaped structure, and the flexible connection structure is folded. The circuit board includes a signal transmission circuit board, at least two signal processing circuit boards, and at least two flexible circuit boards, wherein the at least two signal processing circuit boards include a first signal processing circuit board, a second signal processing circuit board, and a third signal processing circuit board. The first signal processing circuit board and the second signal processing circuit board are electrically connected to the signal transmission circuit board through the flexible circuit board, respectively. The third signal processing circuit board is electrically connected to the first signal processing circuit board through the flexible circuit board. The first signal processing circuit board and the second signal processing circuit board are arranged opposite each other on both sides of the signal transmission circuit board. The third signal processing circuit board is located between the first signal processing circuit board and the second signal processing circuit board and is arranged parallel to the first signal processing circuit board and the second signal processing circuit board.

2. The brain electrode device according to claim 1, characterized in that, The at least two signal processing circuit boards are arranged opposite to each other, and the signal transmission circuit board and the at least two signal processing circuit boards are folded to form the at least one U-shaped structure. The output end of the flexible connection structure is detachably connected to the at least two signal processing circuit boards. The signal transmission circuit board is electrically connected through the at least two flexible circuit boards and the at least two signal processing circuit boards. Each signal processing circuit board is used to perform analog-to-digital conversion and amplification processing on the electroencephalogram (EEG) signal.

3. The brain electrode device according to claim 2, characterized in that, The at least two signal processing circuit boards include a first signal processing circuit board and a second signal processing circuit board, which are disposed opposite to each other on both sides of the signal transmission circuit board. The output end of the flexible connection structure is detachably connected to the target signal processing circuit board. The target signal processing circuit board is either the first signal processing circuit board or the second signal processing circuit board.

4. The brain electrode device according to claim 2, characterized in that, Each signal processing circuit board is provided with a first transmission interface, the output end of the flexible connection structure is provided with a second transmission interface, the signal transmission circuit board is provided with a third transmission interface, the output end of the flexible connection structure is detachably connected to the target signal processing circuit board through the second transmission interface, the first transmission interface, and the signal transmission circuit board is communicatively connected to external analysis equipment through the third transmission interface; The target signal processing circuit board is any one of the at least two signal processing circuit boards.

5. The brain electrode device according to claim 1, characterized in that, The brain electrode structure includes a fixed structure and a contact electrode structure. The input end of the flexible connection structure is fixedly connected to the fixed structure. The contact electrode structure is in contact with the cerebral cortex to collect the brain electrical signals. The fixed structure and the contact electrode structure are electrically connected. The contact electrode structure includes multiple sub-contact electrode structures, and through holes are provided between adjacent sub-contact electrode structures.

6. The brain electrode device according to claim 1, characterized in that, The brain electrode device also includes a housing and a support structure. The signal processing structure is disposed in the housing through the support structure. One end of the housing is fixedly connected to the skull. The shell and the skull form a sealed space, and the signal processing structure and the brain electrode structure are disposed within the sealed space; the shell is filled with adhesive.

7. The brain electrode device according to claim 6, characterized in that, The housing includes a fixed base and a cover, the fixed base being fixedly connected to the skull, and the fixed base and the cover being detachably connected; The fixing base includes a first part, a second part, and a fixing part. The fixing part is fixedly connected to the skull, the second part is detachably connected to the cover, the first part is located between the second part and the fixing part, and is close to the fixing part. The cross-sectional area of ​​the first part is smaller than that of the second part.

8. The brain electrode device according to claim 6, characterized in that, The bottom of the housing has an opening through which the brain electrode structure passes; the brain electrode structure includes a fixing structure and a contact electrode structure, the fixing structure is disposed inside the housing, and the contact electrode structure is disposed outside the housing; the opening is filled with cured silicone.

9. A method for preparing the brain electrode device according to any one of claims 1 to 8, characterized in that, The brain electrode device further includes a housing, the bottom of which has an opening; the brain electrode structure includes a fixing structure and a contact electrode structure; the method includes: The brain electrode structure is prepared for acquiring brain electrical signals; The signal processing structure is connected to the fixed structure, and the contact electrode structure extends from the opening; Preparation of cured silicone and adhesive; The opening is sealed by the cured silicone to obtain a sealed brain electrode device; The adhesive is injected into the sealed brain electrode device and then cured.

10. The method according to claim 9, characterized in that, The step of injecting the adhesive into the sealed brain electrode device and then performing a curing process includes: The brain electrode device is activated. The adhesive is injected into the activated brain electrode device, followed by vacuuming and curing.

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