Screening device for quickly screening chip surface appearance defects and use method

Abstract

The present invention discloses a screening device for quickly screening chip surface appearance defects and a method for using the device, which relates to the field of automated control technology, including a feeding mechanism, an imaging detection mechanism and a sorting mechanism, wherein the side of the outer wall of the feeding mechanism is fixedly mounted with an imaging detection mechanism, and the side of the outer wall of the imaging detection mechanism is fixedly mounted with a sorting mechanism, and the feeding mechanism, the imaging detection mechanism and the sorting mechanism are connected through a conveyor belt. The present invention realizes automatic screening of stacked qualified chips through the sorting mechanism, solves the problem of being unable to output in an orderly manner during chip sorting, reduces damage to the chip caused by falling collision, and improves the accuracy and stability of sorting.

Description

Technical Field

[0001] The present invention relates to the field of automation control technology, and in particular to a screening device for rapidly screening chip surface appearance defects and a use method thereof. Background Art

[0002] In today's digital age, chips are the core components of various electronic devices. Their manufacturing is an extremely complex and precise process involving multiple steps and processes, such as photolithography, etching, deposition, etc. In each link, various factors may cause appearance defects on the chip surface, such as scratches, cracks, holes, foreign matter adhesion, and abnormal metal wires. These seemingly minor defects may seriously affect the performance and stability of the chip or even cause it to fail completely; Existing testing equipment often requires a lot of parameter adjustments and complex operations when testing chips of different types and sizes, and lacks sufficient flexibility and versatility.

[0003] Therefore, it is very necessary to propose a screening device and a method for quickly screening chip surface appearance defects in the present application to solve the problems in the background.

[0004] 1. Patent document CN117726627B discloses a chip surface defect detection method and device. The above patent realizes continuous optimization and adjustment of model parameters, so that the model can have good adaptability and robustness when facing new and unknown defect types.

[0005] 2. Patent document CN116777894B discloses a method and device for detecting surface defects of a chip. The above patent realizes the use of a surface defect detection model based on a convolutional neural network to identify whether there are surface defects in the chip surface image.

[0006] 3. Patent document CN117115148B discloses a method for intelligent identification of chip surface defects based on 5G technology. The above patent solves the problems in the prior art that the generalization ability of machine learning models is weak, the accuracy of defect identification cannot be guaranteed, and the types of chip surface defects are numerous and complex in shape, making it impossible to meet the accuracy and robustness requirements.

[0007] 4. Patent document CN118351111B discloses a chip surface defect detection method, device, equipment and storage medium. The above patent realizes the reasonable planning of the remaining chips in the same batch of chips, without the need to photograph the entire area of ​​the remaining chips one by one, saving time.

[0008] In summary, inspired by the above patents, this application has discovered that it can realize automatic screening and stacking of qualified chips and integrated screening functions to output qualified chips in an orderly manner and reduce the damage caused by falling and collision of chips, and realize selective cleaning of chip surface dirt to achieve cleaning of chip surface dirt before detection to pave the way for detection chips and reasonably use automatic control energy to reduce the operating cost of equipment; To this end, the present application proposes a screening device and a method for quickly screening chip surface appearance defects that can automatically screen stacked qualified chips, integrate screening functions, selectively clean chip surface dirt, and rationally utilize automated control energy. Summary of the invention

[0009] The purpose of the present invention is to provide a screening device and a method for using the device for quickly screening chip surface appearance defects, so as to solve the technical problems raised in the above-mentioned background technology, such as the inability to output in an orderly manner during the chip sorting process, excessive manual intervention and unsmooth process connection, chip surface dirt affecting the accuracy of imaging detection results, and the rational use of automated control energy.

[0010] To achieve the above object, the present invention provides the following technical solution: a screening device for quickly screening chip surface appearance defects, comprising a feeding mechanism, an imaging detection mechanism and a sorting mechanism, wherein the imaging detection mechanism is fixedly installed on the side of the outer wall of the feeding mechanism, and the sorting mechanism is fixedly installed on the side of the outer wall of the imaging detection mechanism, and the feeding mechanism, the imaging detection mechanism and the sorting mechanism are connected through a conveyor belt; The sorting mechanism includes a replaceable inner core, a carrier plate and an output guide rail. The output guide rail is fixedly installed on the side of the rear end of the conveyor belt. The replaceable inner core is embedded in the output guide rail. A shallow groove is provided on the top of the carrier plate to embed the chip. A track corresponding to the output guide rail is provided on the bottom of the outer wall of the carrier plate. Positioning hooks are provided on the inner wall of the output guide rail from top to bottom. The positioning hooks are connected to the inner wall of the output guide rail through an installed rotating shaft. The inner wall of the replaceable inner core is fixedly installed with a layered block.

[0011] Preferably, a photoelectric detection component is fixedly installed at the tail end of the feeding mechanism, and the photoelectric detection component is connected to the control unit of the imaging detection mechanism through a cable. A waste box is arranged on the other side of the tail end of the conveyor belt, and a guide plate is fixedly installed at one end of the side surface of the tail end of the conveyor belt. The guide plate outlet is connected to the top opening of the waste box, and the front of the outer wall of the waste box is arranged as a transparent panel.

[0012] Preferably, a cleaning mechanism is provided at the front end of the imaging detection mechanism, and the imaging detection mechanism includes a scanning light source, an elastic clamp and an image acquisition card; A light source mounting seat is fixedly installed on the top of the outer wall of the scanning light source, an angle encoder is arranged inside the light source mounting seat, a rotating shaft is fixedly installed on the front end of the outer wall of the light source mounting seat, the angle encoder is connected to the image acquisition card through a data cable, and the image acquisition card has a built-in control unit.

[0013] Preferably, a buffer zone is provided in the middle of the conveyor belt, guardrails are fixedly installed on both sides of the buffer zone, a damper is provided at the entrance of the buffer zone, guide wheels are fixedly installed on both sides of the conveyor belt, a slider is fixedly installed on the top end of the outer wall of the guide wheel, a connecting block is fixedly installed on the bottom end of the outer wall of the slider, the shape of the connecting block is the same as the tooth shape of the synchronous belt, and the connecting block is meshed with the belt teeth.

[0014] Preferably, the cleaning mechanism comprises an air nozzle, a compressed air source and an ion air flow source; A left air inlet is fixedly installed at one end of the side surface of the outer wall of the air nozzle, and a right air inlet is fixedly installed at the other end of the side surface of the outer wall of the air nozzle. Solenoid valves are installed in the left and right air inlets respectively. The right air inlet is connected to a compressed air source through a tapered pipe, and the left air inlet is connected to an ion air flow source through a tapered pipe. A mixing chamber runs through the top of the outer wall of the air nozzle.

[0015] Preferably, two parallel slots are provided at the top of the outer wall of the slider along the length direction, the width of the slots is interference fit with the carrier plate, an iron core is longitudinally embedded in the slots, a coil is wound around the iron core, a flat push rod is fixedly installed at the top of the outer wall of the iron core, and a buffer pad is fixedly installed at the top of the outer wall of the flat push rod; In a static state, the axis of the buffer pad is parallel to the plane of the carrier plate and is located on the center line of the slot.

[0016] Preferably, a connecting rod, a left rod and a right rod are provided on the side of the outer wall of the output guide rail, the tail ends of the left rod and the right rod are fixed by the connecting rod, and rotating shafts are fixedly installed at both ends of the connecting rod. The connecting rod is fixedly installed on the top of the outer wall of the support base, and the support base is fixedly installed 1 meter behind the tail end of the conveyor belt.

[0017] Preferably, a pair of capacitor plates are fixedly installed at the bottom of the outer wall of the flat push rod, a second pair of capacitor plates is fixedly installed at the bottom of the outer wall of the conveyor belt, a guide groove with the same track as the bottom of the slider is arranged at the starting end of the conveyor belt, a ball screw is fixedly installed at the frame arranged on the side of the guide groove, a push plate is fixedly installed at the front end of the ball screw, the imaging detection mechanism is connected to the sorting mechanism through the ball screw, and a vibration disk is fixedly installed on the side of the outer wall of the frame.

[0018] Preferably, the method of use comprises the following steps: S1. Place the chips to be tested in the loading mechanism, which arranges the chips one by one through a vibrating plate and transports them to the carrier plate on the conveyor belt; S2. The chip moves to the tail end of the loading mechanism along with the carrier plate. The photoelectric detection component transmits the signal to the control unit of the imaging detection mechanism through the cable. The scanning light source is driven by the motor inside the light source mounting seat to adjust the angle through the angle encoder and the rotating shaft to illuminate the chip from different directions. The image acquisition card collects the image information of the chip and transmits it to the control unit for analysis and processing. S3, qualified chips continue to move along the conveyor belt along with the carrier plate and are output through the output rail; S4. When the unqualified chip moves to the tail end of the conveyor belt with the carrier plate, the control system sends a signal, and the coil on the iron core in the slot at the top of the outer wall of the slider is energized to generate a magnetic field, so that the iron core drives the flat push rod to move upward, and the buffer pad at the top of the flat push rod pushes the carrier plate to move upward. The rotating shaft drives the right rod parallel to the conveyor belt, and the right rod swings to the side to make the carrier plate leave the original track and enter the waste box along the guide plate. The capacitor plates at the bottom of the outer wall of the flat push rod and the second pair of capacitor plates at the bottom of the outer wall of the conveyor belt power the coil.

[0019] Preferably, the method of use further comprises the following steps: S11, the chip is embedded in the shallow groove on the top of the carrier plate and fixed, and the carrier plate moves along the direction of movement of the conveyor belt with the slider; S21, the carrier plate carries the chip along the conveyor belt into the cleaning area at the front end of the imaging detection mechanism. When the dirt on the chip surface is obvious by manual observation, the compressed air source and the ion air flow source are sprayed to the chip surface through the right air inlet and the left air inlet respectively through the air nozzle. When the dirt on the chip surface is not obvious by manual observation, the compressed air source and the ion air flow source are mixed in the mixing chamber through the right air inlet and the left air inlet respectively, and then blown to the chip surface through the air nozzle; S31. The rotating shaft drives the left rod parallel to the conveyor belt. The left rod swings sideways to make the carrier plate slide sideways. The track line at the bottom of the carrier plate is stuck in the axis line of the output guide rail. Under the action of the positioning hook of the output guide rail, the carrier plate is stacked down along the track line of the output guide rail. The layered grids inside the replaceable inner core block the falling chips and provide buffering to reduce the impact of the gravity of the falling chips. When the stacked chips of the replaceable inner core reach the top, they are carried away by the automatic vehicle.

[0020] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention realizes automatic screening and stacking of qualified chips through the sorting mechanism, solves the problem that the chips cannot be output in an orderly manner during the sorting process, reduces the damage caused by falling and collision of chips, and improves the accuracy and stability of sorting; 2. The present invention realizes the integrated screening function by passing the conveyor belt through the connecting mechanism, solves the problem of too much manual intervention and unsmooth process connection, improves the screening efficiency, reduces the errors caused by manual operation, and ensures the consistency and stability of the screening process; 3. The present invention uses a cleaning mechanism to selectively clean dirt on the chip surface, thereby solving the problem that dirt on the chip surface affects the accuracy of imaging detection results, improving the accuracy of imaging detection, and reducing misjudgment and missed judgment; 4. The present invention supplies power to the coil through the capacitor plate at the bottom of the conveyor belt, thereby realizing the rational use of automatic control energy, solving the problems of low degree of automatic control and unreasonable energy utilization in the screening process, and reducing the operating cost of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a front structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the imaging detection structure of the present invention; Figure 4 It is a schematic diagram of the cleaning mechanism structure of the present invention; Figure 5 It is a schematic diagram of the structure of the sorting mechanism of the present invention; Figure 6 It is a schematic diagram of the output guide rail structure of the present invention.

[0022] In the figure: 1. feeding mechanism; 2. imaging detection mechanism; 3. sorting mechanism; 4. conveyor belt; 5. photoelectric detection assembly; 6. control unit; 7. output guide rail; 8. waste box; 9. guide plate; 10. carrier plate; 11. shallow groove; 12. positioning hook; 13. rotating shaft; 14. layered block; 15. replaceable inner core; 16. slider; 17. connecting block; 18. guide wheel; 19. guardrail; 20. damper; 21. scanning light source; 22. light source mounting seat; 23. angle encoder; 24. Air nozzle; 25. Left air inlet; 26. Right air inlet; 27. Mixing chamber; 28. Solenoid valve; 29. ​​Compressed air source; 30. Gradually converging pipe; 31. Ion air flow source; 32. Elastic splint; 33. Image acquisition card; 34. Iron core; 35. Coil; 36. Flat push rod; 37. Buffer pad; 38. Capacitor plate; 39. Connecting rod; 40. Left rod; 41. Right rod; 42. Rotating shaft; 43. Support base; 44. Guide groove; 45. Frame; 46. Vibrating disk; 47. Card slot. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] See also Figure 1 , Figure 2 and Figure 3 , an embodiment of the present invention provides: a screening device for quickly screening chip surface appearance defects, comprising a feeding mechanism 1, an imaging detection mechanism 2 and a sorting mechanism 3, wherein the imaging detection mechanism 2 is fixedly installed on the side of the outer wall of the feeding mechanism 1, and the sorting mechanism 3 is fixedly installed on the side of the outer wall of the imaging detection mechanism 2, and the feeding mechanism 1, the imaging detection mechanism 2 and the sorting mechanism 3 are connected through a conveyor belt 4; The method of use comprises the following steps: S1, placing the chip to be detected in the loading mechanism 1, the loading mechanism 1 arranges the chips one by one through the vibration plate 46 and transports them to the carrier plate 10 on the conveyor belt 4; S2, the chip moves to the tail end of the loading mechanism 1 along with the carrier plate 10, the photoelectric detection component 5 transmits the signal to the control unit 6 of the imaging detection mechanism 2 through the cable, the scanning light source 21 is driven by the motor inside the light source mounting seat 22 through the angle encoder 23 and the rotating shaft 13 to irradiate the chip from different directions, the image acquisition card 33 collects the image information of the chip, and transmits it to the control unit 6 for analysis and processing; Further, the operator pours a tray of chips to be tested into the vibration plate 46 of the feeding mechanism 1, turns on the frequency conversion controller of the vibration plate 46, sets the initial vibration frequency to 50 Hz and the vibration amplitude to 0.5 mm, and under the action of vibration, the chips move on the track and gradually arrange into a single row, and as the conveyor belt 4 runs at a speed of 20 mm / s, the chips are transported one by one to the carrier plate 10; The conveyor belt 4 is driven by a high-precision servo motor, and the running speed is stable at 10 meters per minute. When the chip moves to the tail end of the loading mechanism 1 along with the carrier plate 10, the photoelectric detection component 5 captures the position signal of the chip and quickly transmits it to the control unit 6 of the imaging detection mechanism 2 through a cable. After receiving the signal, the control unit 6 triggers the scanning light source 21 and the image acquisition card 33 to start. Driven by the motor, the scanning light source 21 starts from an initial angle of 0° and gradually rotates to 180° in increments of 15° each time, irradiating the chip from different directions. At each irradiation angle, the image acquisition card 33 collects the image information of the chip with a resolution of 5 million pixels and an exposure time of 1 / 1000s, and transmits the image to the control unit 6 in real time through a high-speed data transmission line; The control unit 6 has built-in image analysis algorithms and deep learning algorithm models. After training with a large number of standard chip images and defective chip images, the collected images are processed. The algorithm identifies whether there are scratches, cracks, stains, missing corners and other appearance defects on the chip surface by comparing the standard image template of the chip.

[0027] See also Figure 1 , Figure 3 and Figure 4 , an embodiment of the present invention provides: a screening device for quickly screening surface appearance defects of chips, wherein a photoelectric detection component 5 is fixedly installed at the tail end of the feeding mechanism 1, and the photoelectric detection component 5 is connected to the control unit 6 of the imaging detection mechanism 2 through a cable, a waste box 8 is arranged on the other side of the tail end of the conveyor belt 4, and a guide plate 9 is fixedly installed on one end of the side of the tail end of the conveyor belt 4, and the outlet of the guide plate 9 is connected to the top opening of the waste box 8, and the front of the outer wall of the waste box 8 is arranged as a transparent panel; S3, the qualified chips continue to move along the conveyor belt 4 with the carrier plate 10 and are output through the output guide rail 7; S4, when the unqualified chips move to the tail end of the conveyor belt 4 with the carrier plate 10, the control system sends a signal, and the coil 35 on the iron core 34 in the slot 47 at the top of the outer wall of the slider 16 is energized to generate a magnetic field, so that the iron core 34 drives the flat push rod 36 to move upward, and the buffer pad 37 at the top of the flat push rod 36 pushes the carrier plate 10 to move upward, and the rotating shaft 42 drives the right rod 41 to be parallel to the conveyor belt 4, and the right rod 41 swings to the side to make the carrier plate 10 leave the original track and enter the waste box 8 along the guide plate 9, and the capacitor plate 38 at the bottom of the outer wall of the flat push rod 36 and the second pair of capacitor plates 38 at the bottom of the outer wall of the conveyor belt 4 supply power to the coil 35; Furthermore, the temperature and humidity of the surrounding environment are precisely controlled at 25°C and 50%RH. The photoelectric detection component 5 adopts advanced laser reflection sensor technology. When the chip moves to the detection position along with the carrier plate 10, the photoelectric detection component 5 transmits the electrical signal to the control unit 6 of the imaging detection mechanism 2 through a low-resistance, anti-interference cable. The control unit 6 adopts a high-performance industrial-grade microprocessor. The conveyor belt 4 is made of high-strength rubber material, and the surface is specially anti-slip treated. The surface of the output guide rail 7 is polished with high precision, and the roughness reaches Ra0.05μm. When the unqualified chip moves to the tail end of the conveyor belt 4 along with the carrier plate 10, the coil 35 on the iron core 34 installed in the slot 47 at the top of the outer wall of the slider 16 is energized. The coil 35 is wound with high-purity copper wire. Under the action of the magnetic field, the iron core 34 drives the flat push rod 36 to move upward. The right rod 41 is parallel to the conveyor belt 4 under the drive of the rotating shaft 42, and then swings to the side, so that the carrier plate 10 leaves the original track, slides along the guide plate 9, and finally falls into the waste bin 8. The inclination angle of the guide plate 9 is designed to be 30°. The capacitor plates 38 at the bottom of the outer wall of the flat push rod 36 cooperate with the second pair of capacitor plates 38 at the bottom of the outer wall of the conveyor belt 4 to form an energy recovery system. When the flat push rod 36 moves upward, the relative positions of the capacitor plates change, thereby generating an induced current to power the coil 35 and realize energy recycling. The front side of the outer wall of the waste box 8 is set as a transparent panel to facilitate the operator to observe the accumulation of waste at any time.

[0028] See also Figure 1 , Figure 2 and Figure 4 , an embodiment of the present invention provides: a screening device for quickly screening surface appearance defects of a chip, wherein a cleaning mechanism is arranged at the front end of the imaging detection mechanism 2, and the imaging detection mechanism 2 comprises a scanning light source 21, an elastic clamp 32 and an image acquisition card 33; a light source mounting seat 22 is fixedly mounted on the top of the outer wall of the scanning light source 21, an angle encoder 23 is arranged inside the light source mounting seat 22, a rotating shaft 13 is fixedly mounted on the front end of the outer wall of the light source mounting seat 22, the angle encoder 23 is connected to the image acquisition card 33 via a data cable, and the image acquisition card 33 has a built-in control unit 6; The cleaning mechanism includes an air nozzle 24, a compressed air source 29 and an ion air flow source 31; a left air inlet 25 is fixedly installed at one end of the side surface of the outer wall of the air nozzle 24, and a right air inlet 26 is fixedly installed at the other end of the side surface of the outer wall of the air nozzle 24. The left air inlet 25 and the right air inlet 26 are respectively installed with solenoid valves 28. The right air inlet 26 is connected to the compressed air source 29 through a tapered pipe 30, and the left air inlet 25 is connected to the ion air flow source 31 through a tapered pipe 30. A mixing chamber 27 runs through the top of the outer wall of the air nozzle 24; The method of use also includes the following steps: S11, the chip is embedded in the shallow groove 11 on the top of the carrier plate 10 and fixed, and the carrier plate 10 moves along the moving direction of the conveyor belt 4 with the slider 26; S21, the carrier plate 10 carries the chip along the conveyor belt 4 into the cleaning area at the front end of the imaging detection mechanism 2, and when the dirt on the chip surface is obvious by manual observation, the compressed air source 29 and the ion air flow source 31 are sprayed to the chip surface through the right air inlet 26 and the left air inlet 25 through the air nozzle 24 in succession, and when the dirt on the chip surface is not obvious by manual observation, the compressed air source 29 and the ion air flow source 31 are mixed in the mixing chamber 27 through the right air inlet 26 and the left air inlet 25 respectively, and then blown to the chip surface through the air nozzle 24; Further, the carrier plate 10 is connected with the slider 26 and moves toward the imaging detection mechanism 2 along with the conveyor belt 4. The conveyor belt 4 adopts a high-precision synchronous belt transmission system, and its linear speed is controlled at 50 mm per second. When the carrier plate 10 carries the chip into the cleaning area at the front end of the imaging detection mechanism 2, the operator observes the chip surface through a high-definition monitoring camera. If the operator finds that the chip surface is obviously dirty, the compressed air source 29 is started first, and the compressed air passes through the right air inlet 26 and rushes to the air nozzle 24 at high speed along the tapered pipe 30. The inner wall of the tapered pipe 30 is ultra-precision polished, and the roughness is Ra0.02μm. After the compressed air purge is completed, the ion airflow source 31 is started, and the ion airflow passes through the left air inlet 25 and reaches the air nozzle 24 through the tapered pipe 30 to perform secondary cleaning on the chip surface; If the operator observes that the dirt on the chip surface is not obvious, the compressed air source 29 and the ion air flow source 31 are started at the same time, and the airflows of the two enter the mixing chamber 27 at the top of the air nozzle 24 through the right air inlet 26 and the left air inlet 25 respectively, and the mixed airflow is blown from the air nozzle 24 to the chip surface at a speed of 200m / s; After cleaning, the chip enters the imaging detection mechanism 2, and the scanning light source 21 is installed on the light source mounting seat 22. The angle encoder 23 inside the light source mounting seat 22 adopts a high-precision absolute encoder with a resolution of 0.01°. Under the control of the control unit 6, the angle encoder 23 adjusts the irradiation angle of the scanning light source 21. The rotating shaft 13 at the front end of the light source mounting seat 22 adopts a high-precision ball bearing with extremely small rotational friction. The light emitted by the scanning light source 21 is collimated and focused by the optical lens group so that the light is irradiated on the chip surface.

[0029] See also Figure 1 , Figure 3 and Figure 6, an embodiment of the present invention provides: a screening device for quickly screening surface appearance defects of chips, the sorting mechanism 3 includes a replaceable inner core 15, a carrier plate 10 and an output guide rail 7, the output guide rail 7 is fixedly installed on the side of the tail end of the conveyor belt 4, the replaceable inner core 15 is embedded in the output guide rail 7, the top of the carrier plate 10 is provided with a shallow groove 11 to embed the chip, the bottom of the outer wall of the carrier plate 10 is provided with a track corresponding to the output guide rail 7, the inner wall of the output guide rail 7 is provided with a positioning hook 12 from top to bottom, the positioning hook 12 is connected to the inner wall of the output guide rail 7 through an installed rotating shaft 13, and the inner wall of the replaceable inner core 15 is fixedly installed with a layered block 14; Two parallel slots 47 are formed at the top of the outer wall of the slider 16 along the length direction. The width of the slots 47 is interference fit with the carrier plate 10. An iron core 34 is longitudinally embedded in the slots 47. The iron core 34 is wound with a coil 35. A flat push rod 36 is fixedly mounted on the top of the outer wall of the iron core 34. A buffer pad 37 is fixedly mounted on the top of the outer wall of the flat push rod 36. In a static state, the axis of the buffer pad 37 is parallel to the plane of the carrier plate 10 and is located on the center line of the slots 47. A pair of capacitor plates 38 are fixedly mounted on the bottom of the outer wall of the flat push rod 36, a second pair of capacitor plates 38 are fixedly mounted on the bottom of the outer wall of the conveyor belt 4, a guide groove 44 with the same track as the bottom of the slider 16 is arranged at the starting end of the conveyor belt 4, a ball screw is fixedly mounted on the frame 45 arranged on the side of the guide groove 44, a push plate is fixedly mounted on the front end of the ball screw, the imaging detection mechanism 2 is connected to the sorting mechanism 3 through the ball screw, and a vibration plate 46 is fixedly mounted on the side of the outer wall of the frame 45; Further, after the chip has been inspected by the imaging inspection mechanism 2, as the carrier plate 10 moves along the conveyor belt 4 toward the sorting mechanism 3, an output guide rail 7 is installed on the side of the tail end of the conveyor belt 4, and a replaceable inner core 15 is embedded in the output guide rail 7. The replaceable inner core 15 adopts a modular design. When the carrier plate 10 approaches the output guide rail 7, the positioning hooks 12 arranged from top to bottom on the inner wall of the output guide rail 7 are started, and the positioning hooks 12 are rotated by the rotating shaft 13 installed on the inner wall of the output guide rail 7. The rotating shaft 13 adopts a high-precision ceramic bearing. When the carrier plate 10 arrives, the positioning hook 12 rotates, clamps the part of the carrier plate 10, and enters the running track of the output guide rail 7; After entering the output guide rail 7, the carrier plate 10 moves downward along the track line, and the layered block 14 of the inner wall of the replaceable inner core 15 is made of flexible material, which has good buffering performance and can effectively reduce the impact force when the chip falls; Two parallel slots 47 are provided along the length direction at the top of the outer wall of the slider 16, and the width thereof is interference fit with the carrier plate 10, and the interference is controlled between 0.03-0.05 mm. The iron core 34 is longitudinally embedded in the slot 47, and the iron core 34 is made of soft magnetic material with high magnetic permeability. The current passes through the coil 35, and a magnetic field is generated around the iron core 34. Under the action of the magnetic field, the iron core 34 drives the flat push rod 36 fixedly connected thereto to move upward, and the buffer pad 37 at the top of the outer wall of the flat push rod 36 pushes the carrier plate 10. In a stationary state, the axis of the buffer pad 37 is parallel to the plane of the carrier plate 10 and is located on the center line of the slot 47.

[0030] See also Figure 1 , Figure 5 and Figure 6 , an embodiment of the present invention provides: a screening device for quickly screening surface appearance defects of chips, wherein a buffer zone is arranged in the middle of the conveyor belt 4, guardrails 19 are fixedly installed on both sides of the buffer zone, a damper 20 is arranged at the entrance of the buffer zone, guide wheels 18 are fixedly installed on both sides of the conveyor belt 4, a slider 16 is fixedly installed on the top of the outer wall of the guide wheel 18, a connecting block 17 is fixedly installed on the bottom of the outer wall of the slider 16, the shape of the connecting block 17 is the same as the tooth shape of the synchronous belt, and the connecting block 17 is meshed with the belt tooth shape; The outer wall side of the output guide rail 7 is provided with a connecting rod 39, a left rod 40 and a right rod 41, the tail ends of the left rod 40 and the right rod 41 are fixed by the connecting rod 39, and the two ends of the connecting rod 39 are fixedly installed with a rotating shaft 42, and the connecting rod 39 is fixedly installed on the top of the outer wall of the support base 43, and the support base 43 is fixedly installed 1 meter behind the tail end of the conveyor belt 4; S31, the rotating shaft 42 drives the left rod 40 to be parallel to the conveyor belt 4, and the left rod 40 swings sideways to make the carrier plate 10 slide sideways, and the track line at the bottom of the carrier plate 10 is stuck in the axis of the output guide rail 7. Under the action of the positioning hook 12 of the output guide rail 7, the carrier plate 10 is stacked downward along the track line of the output guide rail 7, and the layered barriers 14 inside the replaceable inner core 15 separate the falling chips and provide buffering to reduce the impact of the gravity of the falling chips. When the stacked chips of the replaceable inner core 15 reach the top, they are carried away by the automatic vehicle; Furthermore, guardrails 19 are installed on both sides of the buffer zone, and a magnetorheological damper is selected for the damper 20 at the entrance of the buffer zone. When the chip enters the buffer zone, the damper 20 detects the chip through the sensing device and automatically adjusts the damping force to reduce the speed of the conveyor belt 4. The guide wheels 18 are fixedly installed on both sides of the conveyor belt 4, and the slider 16 is fixedly installed on the top of the outer wall. When the chip reaches the tail end along with the conveyor belt 4, the connecting rod 39, the left rod 40 and the right rod 41 arranged on the side of the outer wall of the output guide rail 7 constitute a guide sorting mechanism. The driving motor drives the rotating shaft 42 to rotate, so that the left rod 40 is parallel to the conveyor belt 4. During the rotation process, the left rod 40 swings to the side through the coordinated action of the position sensor and the control system, pushing the carrier plate 10 to slide to the side. When the carrier plate 10 is pushed to slide to the side by the left rod 40, the track line of its bottom is stuck in the axis of the output guide rail 7, and moves downward along the track line of the output guide rail 7; When the chips stacked on the replaceable inner core 15 reach the top, the automatic guided vehicle equipped in the workshop automatically drives under the output guide rail 7, and grabs the replaceable inner core 15 filled with chips through the grabbing device and transports it to the storage area.

[0031] Working principle: the feeding mechanism 1 arranges the chips one by one and transports them to the carrier plate 10 on the conveyor belt 4 by using the vibrating plate 46. The chips are embedded in the shallow groove 11 on the top of the carrier plate 10. Then the carrier plate 10 moves along the moving direction of the conveyor belt 4 with the slider 26; The compressed air source 29 and the ion air flow source 31 are respectively sprayed onto the chip surface through the right air inlet 26 and the left air inlet 25 through the air nozzle 24, and the photoelectric detection component 5 detects the chip position and transmits the signal to the control unit 6 of the imaging detection mechanism 2 through the cable. After receiving the signal, the control unit 6 drives the internal motor of the light source mounting seat 22 to operate, driving the scanning light source 21 to adjust the angle through the angle encoder 23 and the rotating shaft 13, and the image acquisition card 33 collects the image information of the chip and transmits it to the control unit 6 for analysis and processing; The rotating shaft 42 drives the left rod 40 to be parallel to the conveyor belt 4. The left rod 40 swings sideways to make the carrier plate 10 slide sideways. The track line at the bottom of the carrier plate 10 is stuck in the axis line of the output guide rail 7. The positioning hook 12 of the output guide rail 7 guides the carrier plate 10 to be stacked downward along the track line of the output guide rail 7 under the action of the rotating shaft 13. The layered barriers 14 inside the replaceable inner core 15 separate the falling chips and provide a buffer to reduce the impact of the gravity of the falling chips. When the stacked chips of the replaceable inner core 15 reach the top, they are carried away by the automatic vehicle.

[0032] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A screening device for rapidly screening chip surface appearance defects, characterized in that: It comprises a feeding mechanism (1), an imaging detection mechanism (2) and a sorting mechanism (3); the imaging detection mechanism (2) is fixedly mounted on the side of the outer wall of the feeding mechanism (1); the sorting mechanism (3) is fixedly mounted on the side of the outer wall of the imaging detection mechanism (2); the feeding mechanism (1), the imaging detection mechanism (2) and the sorting mechanism (3) are connected through a conveyor belt (4); The sorting mechanism (3) comprises a replaceable inner core (15), a carrier plate (10) and an output guide rail (7), wherein the output guide rail (7) is fixedly mounted on the side of the rear end of the conveyor belt (4), wherein the replaceable inner core (15) is embedded in the output guide rail (7), wherein a shallow groove (11) is provided on the top of the carrier plate (10) for embedding a chip, wherein a track corresponding to the output guide rail (7) is provided on the bottom of the outer wall of the carrier plate (10), wherein the inner wall of the output guide rail (7) is provided with positioning hooks (12) from top to bottom, wherein the positioning hooks (12) are connected to the inner wall of the output guide rail (7) via an installed rotating shaft (13), and wherein a layered block (14) is fixedly mounted on the inner wall of the replaceable inner core (15).

2. A screening device for rapidly screening chip surface appearance defects according to claim 1, characterized in that: A photoelectric detection component (5) is fixedly mounted on the rear end of the feeding mechanism (1), and the photoelectric detection component (5) is connected to a control unit (6) of the imaging detection mechanism (2) via a cable. A waste box (8) is arranged on the other side of the rear end of the conveyor belt (4), and a guide plate (9) is fixedly mounted on one end of the side surface of the rear end of the conveyor belt (4). The outlet of the guide plate (9) is connected to the top opening of the waste box (8), and the front of the outer wall of the waste box (8) is arranged as a transparent panel.

3. The screening device for rapidly screening chip surface appearance defects according to claim 1, characterized in that: A cleaning mechanism is provided at the front end of the imaging detection mechanism (2), and the imaging detection mechanism (2) comprises a scanning light source (21), an elastic clamping plate (32) and an image acquisition card (33); A light source mounting seat (22) is fixedly mounted on the top of the outer wall of the scanning light source (21); an angle encoder (23) is arranged inside the light source mounting seat (22); a rotating shaft (13) is fixedly mounted on the front end of the outer wall of the light source mounting seat (22); the angle encoder (23) is connected to an image acquisition card (33) via a data cable; and the image acquisition card (33) has a built-in control unit (6).

4. The screening device for rapidly screening chip surface appearance defects according to claim 1, characterized in that: A buffer zone is arranged in the middle of the conveyor belt (4), guardrails (19) are fixedly installed on both sides of the buffer zone, a damper (20) is arranged at the entrance of the buffer zone, guide wheels (18) are fixedly installed on both sides of the conveyor belt (4), a slider (16) is fixedly installed on the top of the outer wall of the guide wheel (18), and a connecting block (17) is fixedly installed on the bottom of the outer wall of the slider (16), the shape of the connecting block (17) is the same as the tooth shape of the synchronous belt, and the connecting block (17) meshes with the belt tooth shape.

5. The screening device for rapidly screening chip surface appearance defects according to claim 3, characterized in that: The cleaning mechanism comprises an air nozzle (24), a compressed air source (29) and an ion air flow source (31); A left air inlet (25) is fixedly mounted on one end of the side surface of the outer wall of the air nozzle (24), and a right air inlet (26) is fixedly mounted on the other end of the side surface of the outer wall of the air nozzle (24). Solenoid valves (28) are respectively mounted on the left air inlet (25) and the right air inlet (26). The right air inlet (26) is connected to a compressed air source (29) via a tapered pipe (30), and the left air inlet (25) is connected to an ion air flow source (31) via a tapered pipe (30). A mixing chamber (27) runs through the top end of the outer wall of the air nozzle (24).

6. The screening device for rapidly screening chip surface appearance defects according to claim 4, characterized in that: The top end of the outer wall of the slider (16) is provided with two parallel slots (47) along the length direction, the width of the slots (47) is interference fit with the carrier plate (10), an iron core (34) is longitudinally embedded in the slots (47), a coil (35) is wound around the iron core (34), a flat push rod (36) is fixedly mounted on the top end of the outer wall of the iron core (34), and a buffer pad (37) is fixedly mounted on the top end of the outer wall of the flat push rod (36); In a static state, the axis of the buffer pad (37) is parallel to the plane of the carrier plate (10) and is located on the center line of the slot (47).

7. The screening device for rapidly screening chip surface appearance defects according to claim 1, characterized in that: A connecting rod (39), a left rod (40) and a right rod (41) are arranged on the side of the outer wall of the output guide rail (7); the tail ends of the left rod (40) and the right rod (41) are fixed by the connecting rod (39); rotating shafts (42) are fixedly mounted on both ends of the connecting rod (39); the connecting rod (39) is fixedly mounted on the top of the outer wall of the supporting base (43); and the supporting base (43) is fixedly mounted 1 meter behind the tail end of the conveyor belt (4).

8. The screening device for rapidly screening chip surface appearance defects according to claim 6, characterized in that: A pair of capacitor plates (38) are fixedly mounted on the bottom of the outer wall of the flat push rod (36); a second pair of capacitor plates (38) are fixedly mounted on the bottom of the outer wall of the conveyor belt (4); a guide groove (44) having the same track as the bottom track of the slider (16) is arranged at the starting end of the conveyor belt (4); a ball screw is fixedly mounted on a frame (45) arranged on the side of the guide groove (44); a push plate is fixedly mounted on the front end of the ball screw; the imaging detection mechanism (2) is connected to the sorting mechanism (3) via the ball screw; and a vibration plate (46) is fixedly mounted on the side of the outer wall of the frame (45).

9. A method for using a screening device for rapidly screening chip surface appearance defects, applicable to a screening device for rapidly screening chip surface appearance defects according to any one of claims 1 to 8, characterized in that: The method of use comprises the following steps: S1, placing the chips to be tested in a loading mechanism (1), and the loading mechanism (1) arranges the chips one by one through a vibration plate (46) and transports them to a carrier plate (10) on a conveyor belt (4); S2, the chip moves to the rear end of the loading mechanism (1) along with the carrier plate (10), the photoelectric detection component (5) transmits the signal to the control unit (6) of the imaging detection mechanism (2) through the cable, the scanning light source (21) is driven by the internal motor of the light source mounting seat (22) through the angle encoder (23) and the rotating shaft (13) to adjust the angle, and illuminate the chip from different directions, the image acquisition card (33) collects the image information of the chip, and transmits it to the control unit (6) for analysis and processing; S3, the qualified chips continue to move along the conveyor belt (4) along with the carrier plate (10) and are output through the output guide rail (7); S4. When the unqualified chip moves to the tail end of the conveyor belt (4) along with the carrier plate (10), the control system sends a signal, and the coil (35) on the iron core (34) in the slot (47) at the top end of the outer wall of the slider (16) is energized to generate a magnetic field, so that the iron core (34) drives the flat push rod (36) to move upward, and the buffer pad (37) at the top end of the flat push rod (36) pushes the carrier plate (10) to move upward. The rotating shaft (42) drives the right rod (41) parallel to the conveyor belt (4), and the right rod (41) swings sideways to make the carrier plate (10) leave the original track and enter the waste box (8) along the guide plate (9). The capacitor plate (38) at the bottom of the outer wall of the flat push rod (36) and the second pair of capacitor plates (38) at the bottom of the outer wall of the conveyor belt (4) supply power to the coil (35).

10. The method for using the screening device for rapid screening of chip surface appearance defects according to claim 9, characterized in that: The method of use also includes the following steps: S11, the chip is embedded in the shallow groove (11) on the top of the carrier plate (10) and fixed, and the carrier plate (10) moves along the moving direction of the conveyor belt (4) along with the slider (26); S21, the carrier plate (10) carries the chip along the conveyor belt (4) into the cleaning area at the front end of the imaging detection mechanism (2). When the dirt on the chip surface is obvious through manual observation, the compressed air source (29) and the ion air flow source (31) are sprayed onto the chip surface through the right air inlet (26) and the left air inlet (25) through the air nozzle (24) in sequence. When the dirt on the chip surface is not obvious through manual observation, the compressed air source (29) and the ion air flow source (31) are mixed in the mixing chamber (27) through the right air inlet (26) and the left air inlet (25) and then blown onto the chip surface through the air nozzle (24); S31, the rotating shaft (42) drives the left rod (40) to be parallel to the conveyor belt (4), and the left rod (40) swings sideways to make the carrier plate (10) slide sideways, and the track line at the bottom of the carrier plate (10) is inserted into the axis line of the output guide rail (7). Under the action of the positioning hook (12) of the output guide rail (7), the carrier plate (10) is stacked downward along the track line of the output guide rail (7), and the layered blocks (14) inside the replaceable inner core (15) space the falling chips and provide a buffer to reduce the impact of the gravity of the falling chips. When the stacked chips of the replaceable inner core (15) reach the top, they are carried away by the automatic vehicle.

Images