Megasonic water area conduction device and megasonic cleaning system

Abstract

The invention provides a megasonic water area conduction device and a megasonic cleaning system. The megasonic water area conduction device comprises a water area tank; two branch pipelines are arranged in the water area tank, each branch pipeline is provided with a series of openings which are arranged in a linear mode in the longitudinal direction of the branch pipeline, liquid flows into the water area tank through the openings, the two branch pipelines are arranged in a mode of being symmetrical about the neutral plane of the water area tank, and the two branch pipelines are arranged in a mode of being symmetrical about the neutral plane of the water area tank. And the two branch pipelines are arranged to enable liquid leaving each branch pipeline to flow towards an intersection line between the middle vertical surface and the overflow plane of the water area tank in an obliquely upward manner. According to the megasonic water area conduction device, a liquid stratosphere can be formed near the liquid level, so that turbulent flow is inhibited, and bubbles occasionally formed on the liquid level can be quickly discharged out of a water area groove.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor wafer production, and in particular to a megasonic water area conduction device and a megasonic cleaning system. Background Art

[0002] In the field of semiconductor wafer production, wafer cleaning is a crucial link. During the manufacturing process, wafers are exposed to various chemicals and particulate matter. If these substances are not completely removed, they will seriously affect the performance and reliability of the device. Therefore, the cleaning process must not only remove physical and chemical contaminants on the surface of the wafer, but also ensure that no new contamination is introduced. With the continuous reduction in the size of semiconductor devices and the increase in integration, the requirements for wafer surface cleanliness are also getting higher and higher. The advancement of cleaning technology is crucial to the continued development of the semiconductor industry.

[0003] At present, in the semiconductor industry, cleaning equipment in the wafer production process generally adopts megasonic cleaning technology. Megasonic cleaning uses the cavitation effect produced by ultrasound in liquid, so that tiny bubbles in the liquid are continuously formed, grown and broken under the action of ultrasound. This process produces strong impact force and microjets, which impact the surface of the semiconductor, peel off the contaminants from the surface and disperse them into the cleaning liquid, thereby achieving the purpose of cleaning. Megasonic cleaning technology has been widely used in the field of semiconductor cleaning due to its high efficiency, environmental protection and strong adaptability.

[0004] Although megasonic cleaning technology has achieved certain results in the field of semiconductor cleaning, there are still some problems. Since the megasonic cleaning method is water conduction, if bubbles or turbulence appear on the contact surface between the water area and the water tank, it will affect the uniformity of the megasonic waves inside the water tank, thereby affecting the cleaning effect. The appearance of bubbles and turbulence will lead to uneven distribution of megasonic energy, weaken the cleaning ability, and may even cause damage to the wafer surface. In addition, unstable water flow may also cause the redeposition of pollutants in the water area and reduce the efficiency of megasonic conduction. Therefore, how to control the water state in the water tank to be laminar and minimize the generation of bubbles, or quickly remove bubbles, has become the key to improving the cleaning effect of megasonic waves. This is not only related to the cleaning quality, but also to production costs and efficiency. Summary of the invention

[0005] The present invention provides a megasonic water area conduction device and a megasonic cleaning system, which can form a liquid stratosphere near the liquid surface, thereby suppressing turbulence, and can quickly discharge bubbles occasionally formed on the liquid surface from the water area tank.

[0006] The technical solution of the present disclosure is achieved as follows: In a first aspect, the present disclosure provides a megasonic water area conduction device, the megasonic water area conduction device comprising: water trough; The two branch pipes inside the water tank are each formed with a series of openings arranged in a straight line along the longitudinal direction of the branch pipe, and the liquid flows into the water tank through the openings. The two branch pipes are arranged symmetrically about the neutral plane of the water tank, and the two branch pipes are configured so that the liquid leaving each branch pipe flows obliquely upward toward the intersection line between the neutral plane and the overflow plane of the water tank.

[0007] In some optional examples, the angle between the flow direction of the liquid leaving each branch pipe and the neutral plane is between 40° and 50°.

[0008] In some optional examples, the upper edges of the water troughs are in the same horizontal plane.

[0009] In some optional examples, the upper edge is formed with a series of V-shaped grooves with the same recessed depth.

[0010] In some optional examples, the series of V-shaped grooves are evenly distributed along the upper edge.

[0011] In some optional examples, the megasonic water area conduction device further includes a mounting bracket, and the mounting bracket is used to mount the two branch pipes inside the water area tank.

[0012] In some optional examples, the two branch pipes are made of perfluoroalkoxyethylene.

[0013] In some optional examples, the megasonic water area conduction device further includes a main pipe, through which liquid from a liquid source flows to the two branch pipes, and the main pipe and the branch pipes are connected to each other via a heat shrink connection.

[0014] In some optional examples, the megasonic water area conduction device further includes a control valve disposed on the main pipeline, and the control valve is used to adjust the flow rate of the liquid flowing in the main pipeline.

[0015] In a second aspect, the present disclosure provides a megasonic cleaning system, the megasonic cleaning system comprising: The megasonic water area conduction device according to the first aspect; Megasonic generator; A quartz tank, the quartz tank is used to accommodate the wafer to be cleaned, The megasonic waves emitted by the megasonic wave generator are conducted to the quartz tank via the megasonic water area conduction device to clean the wafer.

[0016] The present disclosure provides a megasonic water area conduction device and a megasonic cleaning system, which can effectively suppress the interference of turbulence and bubbles on the megasonic cleaning process when the water area tank is filled with liquid, thereby improving the cleaning effect. Since the liquid leaving each branch pipe flows obliquely upward to the intersection line between the neutral plane and the overflow plane, this helps to form a liquid stratosphere near the liquid surface that flows horizontally from the neutral plane to both sides. Such a stratosphere effectively avoids the turbulence caused by the violent movement of the liquid, reduces the interference with the megasonic waves, maintains the uniformity of the megasonic waves, and thus improves the cleaning effect. When the liquid in the water area tank overflows, the bubbles formed on the liquid surface will quickly reach the edge of the water area tank with the liquid stratosphere, and leave the water area tank with the overflowing liquid. This process avoids the interference of bubbles on the megasonic waves, affects the uniformity of the megasonic waves, and then affects the cleaning effect. The rapid discharge of bubbles reduces the instability in the cleaning process and improves the consistency of cleaning. The liquid flows into the water area tank through multiple openings, so that the flow rate becomes moderate and the occurrence of turbulence is reduced. The smooth flow of liquid helps to maintain the stability of the liquid in the water tank, further ensuring the uniform conduction of megasonic waves. At the same time, larger particle impurities in the liquid will also be quickly discharged from the water tank, because once these impurities enter the liquid stratosphere, they will reach the edge of the water tank with the liquid stratosphere, and leave the water tank with the overflowing liquid, thereby reducing the impact on the conduction of megasonic waves. This rapid discharge mechanism helps to maintain the cleanliness of the liquid in the water tank and improve the conduction efficiency of megasonic waves. The two branch pipes are arranged in a symmetrical manner about the neutral plane of the water tank, and this symmetry helps to maintain the stability and uniformity of the liquid flow. The symmetrically arranged branch pipes ensure that the liquid flows evenly into the water tank from two directions, enhancing the stability of the liquid flow. Through this design, the megasonic water area conduction device provided in the embodiment of the present disclosure realizes the optimization of liquid flow, reduces the generation of turbulence and bubbles, and quickly discharges bubbles and large particle impurities, thereby improving the uniformity and efficiency of megasonic cleaning, and ensuring the stability of the cleaning process and the consistency of the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic front cross-sectional view of a megasonic water area conduction device provided in an embodiment of the present disclosure.

[0018] Figure 2 A schematic top view of a megasonic water area conduction device provided in an embodiment of the present disclosure.

[0019] Figure 3 A schematic front view of a water area tank of a megasonic water area conduction device provided in an embodiment of the present disclosure.

[0020] Figure 4 A schematic front cross-sectional view of a megasonic water area conduction device provided in another embodiment of the present disclosure.

[0021] Figure 5 A schematic top view of a megasonic water area conduction device provided in another embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] The technical solutions in the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings in the present disclosure.

[0023] In the semiconductor manufacturing process, wafer cleaning is a key step to ensure product quality. Wafers will inevitably come into contact with a variety of chemicals and particles during the production process. If these residues are not completely removed, they will directly affect the performance and reliability of the final product. Therefore, the cleaning process must not only completely remove the contaminants on the surface of the wafer, but also ensure that no new sources of contamination are introduced. As the size of semiconductor devices becomes smaller and the integration becomes higher, the requirements for wafer cleanliness are also increasing. The advancement of cleaning technology is of great significance to the sustainable development of the semiconductor industry.

[0024] In the current semiconductor industry, megasonic cleaning technology is widely used in the wafer cleaning process. This technology uses the cavitation effect produced by ultrasound in liquid, so that tiny bubbles in the liquid are formed, grown and finally burst under the action of ultrasound, generating strong impact force and micro jets, which can impact the semiconductor surface, peel off the contaminants from the surface and disperse them into the cleaning liquid to achieve the purpose of cleaning. Due to its high efficiency, environmental protection and strong adaptability, megasonic cleaning technology has become the mainstream technology in the field of semiconductor cleaning.

[0025] However, although megasonic cleaning technology has achieved certain results, it still faces some challenges in practical applications. Megasonic cleaning relies on water conduction. If there are bubbles or turbulence at the contact surface between the water and the cleaning tank, it will affect the uniformity of the megasonic waves inside the cleaning tank, thereby affecting the cleaning effect. Bubbles and turbulence may cause uneven distribution of megasonic energy, reduce cleaning ability, and may even cause damage to the wafer surface. In addition, unstable water flow may cause the redeposition of contaminants in the cleaning fluid and reduce the efficiency of megasonic conduction. Therefore, controlling the water flow state in the cleaning tank to maintain a laminar state and reduce the generation of bubbles, or quickly removing bubbles, is crucial to improving the cleaning effect of megasonic waves. This is not only related to cleaning quality, but also to production costs and efficiency.

[0026] In view of the problems existing in the prior art, the present disclosure proposes a megasonic water area conduction device, which aims to improve the uniformity and efficiency of megasonic cleaning by improving the structural design of the water area tank, optimizing the liquid flow state, and reducing the impact of bubbles and turbulence.

[0027] Specifically, see Figure 1 and Figure 2The embodiment of the present disclosure provides a megasonic water area conduction device 10 , which may include a water area tank 11 and two branch pipes 12 inside the water area tank 11 .

[0028] Each branch pipe 12 is formed with a series of openings 12A arranged in a straight line along the longitudinal direction of the branch pipe 12. For example, a liquid that conducts megasonic waves, such as water, flows into the water tank 11 through the openings 12A. Figure 1 The area filled with dots schematically shows the liquid filling the water tank 11. The above-mentioned "arranged in a straight line" means that a series of openings 12A are formed in the same circumferential direction of the branch pipe 12, or in other words, a series of openings 12A are not arranged along the longitudinal direction of the branch pipe 12 and rotated in the circumferential direction of the branch pipe 12 to form a spiral shape as a whole.

[0029] The two branch pipes 12 are arranged in a symmetrical manner with respect to the neutral plane MP of the water tank 11. The neutral plane MP here refers to a vertical plane that can divide the water tank 11 into two equal parts, such as Figure 1 and Figure 2 In the case where the water tank 11 shown in FIG. 1 is a cube, the neutral plane MP may be as follows: Figure 1 and Figure 2 The plane passing through the midline of the bottom surface of the water tank 11 and perpendicular to the bottom surface of the water tank 11 is schematically shown by the dotted line segment in the figure, and the two branch pipes 12 are arranged so that the liquid leaving each branch pipe 12, that is, the liquid flowing out of the above-mentioned opening 12A, flows in an oblique upward manner toward the intersection line CL between the neutral plane MP and the overflow plane SP of the water tank 11, as shown in Figure 1 In this case, it can be inferred that the two branch pipes 12 need to be arranged horizontally and parallel to each other. In addition, the overflow plane SP of the water tank 11 refers to the liquid surface when the liquid in the water tank 11 overflows. In addition, the above-mentioned intersection line CL is Figure 1 The cross symbol is schematically shown in the front view of Figure 2 It is schematically shown by solid line segments in the top view of FIG. Figure 2 In the top view, the intersection line CL coincides with the neutral plane MP.

[0030] First, when the water tank 11 is filled with liquid, since the liquid leaving each branch pipe 12 flows obliquely upward toward the intersection line CL between the neutral plane MP and the overflow plane SP of the water tank 11, it is helpful to form a liquid stratosphere near the liquid surface or the surface layer of the liquid, which flows horizontally from the neutral plane MP toward both sides of the neutral plane MP, such as Figure 1and Figure 2 As shown by the dotted line with arrows, such a stratosphere can effectively suppress the turbulence caused by the violent movement of the liquid, effectively avoid the occurrence of liquid turbulence in the water tank 11, reduce the interference with the megasonic waves, thereby maintaining the uniformity of the megasonic waves used to clean the wafers and improving the cleaning effect.

[0031] Secondly, when the liquid in the water tank 11 overflows, bubbles B occasionally formed on the liquid surface will quickly reach the edge of the water tank 11 along with the above-mentioned liquid stratosphere, and leave the water tank 11 along with the overflowing liquid. This process prevents the bubbles B from interfering with the megasonic waves, affecting the uniformity of the megasonic waves used to clean the wafers, and further affecting the cleaning effect. Figure 1 As shown, the rapid discharge of the bubbles B reduces the instability during the cleaning process.

[0032] Again, since the liquid flows into the water tank 11 through multiple openings 12A, the flow rate becomes moderate, reducing the occurrence of turbulence. The smooth flow of the liquid helps to maintain the stability of the liquid in the water tank 11, further ensuring the uniform conduction of the megasonic waves.

[0033] Thirdly, larger particle impurities in the liquid will also be discharged from the water tank 11 in a faster manner, because once such impurities enter the liquid stratosphere, they will follow the liquid stratosphere to the edge of the water tank 11 and leave the water tank 11 with the overflowing liquid, thereby reducing the impact on the conduction of megasonic waves. This rapid discharge mechanism helps to maintain the cleanliness of the liquid in the water tank 11 and improve the conduction efficiency of megasonic waves.

[0034] Finally, the two branch pipes 12 are arranged in a symmetrical manner with respect to the neutral plane MP of the water tank 11. This symmetry helps to maintain the stability and uniformity of the liquid flow. Figure 1 and Figure 2 As shown, the symmetrically arranged branch pipes 12 ensure that the liquid flows into the water tank 11 evenly from two directions, thereby enhancing the stability of the liquid flow.

[0035] In some embodiments of the present disclosure, see Figure 1 The angle α between the flow direction of the liquid leaving each branch pipe 12 and the neutral plane MP may be between 40° and 50°.

[0036] Such a specific angle range is conducive to the liquid forming an upward oblique flow when leaving the branch pipe 12, helps to maintain the uniformity of liquid flow in the water tank 11, and helps the liquid form a stable stratosphere in the water tank 11, thereby reducing the formation of turbulence and bubbles, reducing the energy loss of megasonic waves during propagation, allowing more energy to act on the wafer surface, thereby improving the cleaning effect.

[0037] In some embodiments of the present disclosure, see Figure 2 Combined with Figure 1 , the upper edge 11E of the water area trough 11 can be in the same horizontal plane.

[0038] In this way, it is ensured that when the liquid in the water tank 11 overflows, the liquid can flow out evenly from every position of the upper edge 11E. Figure 1 As shown, this uniform overflow design helps maintain the stability of the liquid in the water tank 11 and prevents liquid fluctuations caused by excessive overflow in local areas. More importantly, since the liquid can flow out evenly from every position of the upper edge 11E, it helps the bubbles B and large particles of impurities to be quickly taken out of the water tank 11 when the liquid overflows, avoiding the bubbles B and impurities from being retained near the side walls of the water tank 11, reducing their influence on the conduction of megasonic waves, thereby improving the cleaning efficiency and quality.

[0039] In some embodiments of the present disclosure, see Figure 3 The upper edge 11E of the water area trough 11 may be formed with a series of V-shaped grooves 11G having the same recessed depth.

[0040] In this way, the overflow function can be activated at a relatively low water level difference. Even if the water level in the water tank is only slightly higher than the normal water level, the V-shaped groove 11G can quickly guide the water flow into the overflow system, thereby improving the sensitivity and reliability of the overflow. More importantly, the instant response characteristics of the V-shaped groove 11G help maintain the smooth flow of the liquid in the water tank 11 and the stability of the liquid surface, thus promoting the uniform conduction of the megasonic wave and maintaining the consistency of the megasonic wave cleaning process.

[0041] In some embodiments of the present disclosure, see Figure 3 , a series of V-shaped grooves 11G may be evenly distributed along the upper edge 11E.

[0042] The uniform distribution of the V-shaped grooves 11G helps to optimize the flow characteristics of the liquid in the water area tank 11. This design allows the liquid to be evenly dispersed along the upper edge 11E when overflowing, reducing the turbulence and pressure imbalance that may be caused by the liquid flowing out of a certain point, thereby maintaining the uniformity and stability of the liquid flow and preventing liquid fluctuations caused by excessive overflow in local areas.

[0043] In some embodiments of the present disclosure, see Figure 4 The megasonic water area conduction device 10 may further include a mounting bracket 13 , and the mounting bracket 13 is used to mount the two branch pipes 12 inside the water area tank 11 .

[0044] By using the mounting bracket 13, the two branch pipes 12 are firmly mounted inside the water tank 11, ensuring that the position of the branch pipes 12 is fixed and preventing displacement caused by external force or liquid flow, thereby ensuring the stability and reliability of the entire device. The use of the mounting bracket 13 ensures the accuracy of the angle of the outflowing liquid. The fixed installation of the branch pipes 12 allows the angle of the liquid flowing out from the opening 12A to be precisely controlled, which is essential for forming a suitable liquid stratosphere and reducing turbulence. Precise control of the liquid outflow angle helps to improve the uniformity of the megasonic waves in the water tank 11. Due to the stable installation of the branch pipes 12, the liquid can flow out at a predetermined angle to form a uniform stratosphere, so that the megasonic waves can act evenly on the wafer surface and improve the cleaning effect.

[0045] In some embodiments of the present disclosure, the two branch pipes 12 may be made of perfluoroalkoxyethylene (PFA).

[0046] PFA materials are particularly used in situations that require high temperature resistance and corrosion resistance, especially in semiconductor manufacturing and the chemical industry. The low friction coefficient of PFA materials helps to reduce resistance to liquid flow, thereby reducing energy consumption. This property has a positive impact on improving megasonic cleaning efficiency and reducing operating costs. The surface of PFA materials is very smooth and not easy to adhere to pollutants, which helps to keep the cleaning liquid clean, reduce cross contamination during the cleaning process, and improve the cleaning quality. The aging resistance of PFA materials makes it less prone to aging and embrittlement during long-term use, which helps to extend the service life of the branch pipe 12, reduce the frequency of replacement, and reduce maintenance costs.

[0047] In some embodiments of the present disclosure, see Figure 5 The megasonic water area conduction device 10 may further include a main pipe 14, through which the liquid from the liquid source flows to the two branch pipes 12, and the main pipe 14 and the branch pipes 12 may be connected to each other by heat shrink connection.

[0048] The main pipeline 14 is responsible for conveying the liquid from the liquid source to the two branch pipelines 12, so that the liquid can efficiently flow from the main pipeline 14 to the branch pipeline 12, ensuring the continuity and stability of the liquid supply. Through the use of the main pipeline 14, a more flexible pipeline layout can be achieved. The main pipeline 14 can be arranged according to the specific position and space limitations of the water tank 11, and the branch pipeline 12 can be precisely positioned as needed to achieve the best liquid flow and megasonic wave conduction effect. The heat shrink connection between the main pipeline 14 and the branch pipeline 12 provides a convenient installation and maintenance method. The heat shrink connection can not only ensure the sealing of the connection, but also can be quickly disassembled when maintenance or replacement of the pipeline is required, reducing maintenance time and cost. The use of heat shrink connection enhances the sealing of the entire system. The connection between the main pipeline 14 and the branch pipeline 12 is tightly fitted by the shrinkage of the heat shrink material, effectively preventing liquid leakage and ensuring the safety and stability of the system. In addition, the heat shrink connection has good adaptability and can adapt to different pipeline diameters and materials. This connection method allows the main pipeline 14 to be connected to branch pipelines 12 of different sizes and materials, improving compatibility.

[0049] In some embodiments of the present disclosure, see Figure 5 The megasonic water area conduction device 10 may further include a control valve 15 disposed on the main pipeline 14 , and the control valve 15 is used to adjust the flow rate of the liquid flowing in the main pipeline 14 .

[0050] The control valve 15 is used to accurately adjust the flow rate of the liquid flowing in the main pipeline 14. This precise control is crucial to maintaining the stability of the liquid in the water tank 11 and the consistency of the megasonic cleaning process. By adjusting the flow rate through the control valve 15, the megasonic cleaning effect can be optimized. The appropriate flow rate can ensure the formation of a liquid stratosphere while avoiding turbulence and bubble generation caused by excessive flow, thereby improving the cleaning efficiency and quality.

[0051] The present disclosure also provides a megasonic cleaning system (not shown in the drawings), which may include: The megasonic water area conducting device 10 according to the aforementioned embodiments of the present disclosure; Megasonic generator; A quartz tank, which is used to hold the wafer to be cleaned, The megasonic waves emitted by the megasonic wave generator are transmitted to the quartz tank via the megasonic water area transmission device to clean the wafer.

[0052] The megasonic water area conduction device 10 works in conjunction with the megasonic wave generator to ensure that the megasonic waves are efficiently conducted from the generator to the quartz tank. This efficient conduction ensures full utilization of the megasonic wave energy, thereby improving the cleaning efficiency and effect. Through the control valve 15 and the main pipeline 14 in the megasonic water area conduction device 10, the liquid flow rate can be accurately controlled, thereby controlling the intensity and distribution of the megasonic waves. This precise control helps to adjust the parameters of the megasonic waves according to the cleaning requirements of different wafers, and realize accurate cleaning process control.

[0053] It should be noted that the technical solutions described in the present disclosure can be combined arbitrarily without conflict.

[0054] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A megasonic water area conduction device, characterized in that: The megasonic water area conduction device comprises: water trough; The two branch pipes inside the water tank are each formed with a series of openings arranged in a straight line along the longitudinal direction of the branch pipe, and the liquid flows into the water tank through the openings. The two branch pipes are arranged symmetrically about the neutral plane of the water tank, and the two branch pipes are configured so that the liquid leaving each branch pipe flows obliquely upward toward the intersection line between the neutral plane and the overflow plane of the water tank.

2. The megasonic water area conduction device according to claim 1, characterized in that: The angle between the flow direction of the liquid leaving each branch pipe and the neutral plane is between 40° and 50°.

3. The megasonic water area conduction device according to claim 1, characterized in that: The upper edges of the water area troughs are in the same horizontal plane.

4. The megasonic water area conduction device according to claim 3, characterized in that: The upper edge is formed with a series of V-shaped grooves with the same recessed depth.

5. The megasonic water area conduction device according to claim 4, characterized in that: The series of V-shaped grooves are evenly distributed along the upper edge.

6. The megasonic water area conduction device according to any one of claims 1 to 5, characterized in that: The megasonic water area conduction device also includes a mounting bracket, and the mounting bracket is used to install the two branch pipes inside the water area tank.

7. The megasonic water area conduction device according to any one of claims 1 to 5, characterized in that: The two branch pipes are made of perfluoroalkoxyethylene.

8. The megasonic water area conduction device according to any one of claims 1 to 5, characterized in that: The megasonic water area conduction device further comprises a main pipeline, through which liquid from a liquid source flows to the two branch pipelines, and the main pipeline and the branch pipelines are connected to each other via a heat shrink connection.

9. The megasonic water area conduction device according to claim 8, characterized in that: The megasonic water area conduction device further comprises a control valve arranged on the main pipeline, and the control valve is used to adjust the flow rate of the liquid flowing in the main pipeline.

10. A megasonic cleaning system, characterized in that: The megasonic cleaning system comprises: The megasonic water area conducting device according to any one of claims 1 to 9; Megasonic generator; A quartz tank, the quartz tank is used to accommodate the wafer to be cleaned, The megasonic waves emitted by the megasonic wave generator are conducted to the quartz tank via the megasonic water area conduction device to clean the wafer.

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