A dispersion-strengthened copper alloy preparation system and method

Abstract

The present application provides a dispersion-strengthened copper alloy preparation system and method, which detects the elements of copper alloy powders that have been ground for different times in a target grinding device, and obtains the element distribution diagrams in the copper alloy powders at different grinding times; collects the diffraction patterns of the copper alloy powders at different grinding times, and determines the lattice expansion coefficient of the copper alloy powders based on all the diffraction patterns; determines the optimal preparation time when the copper alloy powders are uniformly distributed after grinding based on the lattice expansion coefficient and all the element distribution diagrams; and uses the copper alloy powders ground for the optimal preparation time for hot isostatic pressing and sintering to obtain a strengthened copper alloy with uniformly distributed dispersed particles. The scheme of the present application can reduce the aggregation of dispersed particles during the grinding process of the mechanical alloying method, and promote the uniform distribution of dispersed particles in the matrix, thereby improving the uniformity of the performance of the copper alloy.

Description

Technical Field

[0001] The present application relates to the technical field of copper alloy preparation, and more specifically, to a dispersion-strengthened copper alloy preparation system and method. Background Art

[0002] The preparation of dispersion-strengthened copper alloys is to evenly distribute fine dispersed particles in the copper matrix to enhance the strength and high-temperature performance of the alloy. The commonly used dispersed phase materials are refractory phases such as oxides, carbides or borides. Common methods for preparing dispersion-strengthened copper alloys include: mechanical alloying, internal oxidation, powder metallurgy, rapid solidification and electron beam melting.

[0003] Among them, the mechanical alloying method is a process in which different metals or alloying elements are uniformly mixed through mechanical stirring means such as high-energy grinding, thereby realizing alloying at the nano or submicron scale. This method can realize alloying between different metals at room temperature, and is particularly suitable for materials with high melting points or difficult to alloy. It can also form ultrafine particle structures or even nano structures, thereby significantly improving the mechanical properties and high-temperature properties of the materials. Therefore, it is widely used in the preparation of dispersion-strengthened alloys and nanostructured materials. The existing dispersion-strengthened copper alloy preparation method has achieved remarkable results in enhancing alloy performance, but during the grinding process, the dispersed phase particles are prone to aggregation, resulting in uneven distribution in the matrix, thereby affecting the uniformity of the alloy's performance. Therefore, how to reduce the aggregation of dispersed particles during the grinding process of the mechanical alloying method and promote the uniform distribution of dispersed particles in the matrix, thereby improving the uniformity of the performance of the copper alloy has become a difficult problem faced by the industry. Summary of the invention

[0004] The present application provides a dispersion-strengthened copper alloy preparation system and method, which can reduce the aggregation of dispersed particles during the grinding process of the mechanical alloying method, promote the uniform distribution of dispersed particles in the matrix, and thus improve the performance uniformity of the copper alloy.

[0005] In a first aspect, the present application provides a method for determining the preparation time of a dispersion-strengthened copper alloy powder, comprising the following steps:

[0006] Determining a grinding time range for the copper alloy powder in a target grinding device, setting different grinding times within the grinding time range, and the target grinding device grinding the copper alloy powder according to the set different grinding times;

[0007] Performing element detection on the copper alloy powder that has been subjected to different grinding times in the target grinding equipment to obtain the molar ratios of the elements in the copper alloy powder at different grinding times, and then determining the element distribution map in the copper alloy powder at different grinding times according to all the molar ratios;

[0008] Collecting diffraction patterns of the copper alloy powder at different grinding times, determining the lattice distortion rate of the copper alloy powder at different grinding times based on all the diffraction patterns, fitting the expansion coefficients of all the lattice distortion rates, and obtaining the lattice expansion coefficient of the copper alloy powder;

[0009] The alloy uniformity of the copper alloy powder at different grinding times is determined based on the lattice expansion coefficient and all element distribution diagrams, and the optimal preparation time when the copper alloy powder is evenly distributed after grinding is determined through all alloy uniformities.

[0010] In some embodiments, the copper alloy powder that has been subjected to different grinding times in the target grinding equipment is subjected to element detection to obtain the molar ratio of elements in the copper alloy powder at different grinding times, which specifically includes:

[0011] For the copper alloy powder at each grinding time, an energy spectrum diagram of X-ray signal composition of different elements in the copper alloy powder is obtained;

[0012] The molar ratio of the elements in the copper alloy powder at each grinding time is determined according to the energy spectrum.

[0013] In some embodiments, determining the element distribution diagram in the copper alloy powder at different grinding times according to all molar ratios specifically includes:

[0014] For the copper alloy powder at each grinding time, a scanning electron microscope is used to scan the copper alloy powder to obtain a surface morphology image of the copper alloy powder;

[0015] The element distribution diagram in the copper alloy powder at each grinding time is determined according to the molar ratio of different elements in the copper alloy powder and the surface morphology diagram.

[0016] In some embodiments, determining the lattice distortion rate of the copper alloy powder at different grinding times based on all diffraction patterns specifically includes:

[0017] For the copper alloy powders at different grinding times, the half-peak width of each diffraction peak is determined according to the diffraction pattern of the copper alloy powder;

[0018] Determine the grain size of the crystal structure in copper alloy powders;

[0019] Determining the lattice change value of each diffraction peak based on all half-peak widths and the grain size;

[0020] The lattice distortion rate of the copper alloy powder is determined by all lattice change values, and then the lattice distortion rate of the copper alloy powder at different grinding times is obtained.

[0021] In some embodiments, determining the alloy uniformity of the copper alloy powder at different grinding times based on the lattice expansion coefficient and the distribution diagram of all elements specifically includes:

[0022] Obtain the ideal distribution map of elements when the copper alloy powder is evenly distributed;

[0023] For the copper alloy powders at different grinding times, determining the distribution difference between the element distribution in the copper alloy powder and the ideal distribution according to the element distribution diagram of the copper alloy powder and the ideal distribution diagram;

[0024] The alloy uniformity of the copper alloy powder is determined based on the lattice expansion coefficient and the distribution difference, and then the alloy uniformity of the copper alloy powder under different grinding times is obtained.

[0025] In some embodiments, the copper alloy powder is a basic alloy powder obtained by melting and atomizing pure copper, copper oxide and dispersed particles using vacuum gas atomization powder making equipment.

[0026] In some embodiments, the dispersed particles are yttrium trioxide.

[0027] In a second aspect, the present application provides a dispersion-strengthened copper alloy preparation system, including a copper alloy powder preparation time determination device, the copper alloy powder preparation time determination device comprising:

[0028] An indication module, used to determine a grinding time range of the copper alloy powder in a target grinding device, set different grinding times within the grinding time range, and indicate the target grinding device to grind the copper alloy powder according to the set different grinding times;

[0029] A processing module, used to control element detection of copper alloy powders that have undergone different grinding times in a target grinding device, obtain molar ratios of elements in the copper alloy powders at different grinding times, and then determine element distribution diagrams in the copper alloy powders at different grinding times based on all the molar ratios;

[0030] The processing module is further used to collect diffraction patterns of the copper alloy powder at different grinding times, determine the lattice distortion rate of the copper alloy powder at different grinding times based on all the diffraction patterns, and perform expansion coefficient fitting on all the lattice distortion rates to obtain the lattice expansion coefficient of the copper alloy powder;

[0031] The execution module is used to determine the alloy uniformity of the copper alloy powder under different grinding times based on the lattice expansion coefficient and the distribution diagram of all elements, and determine the optimal preparation time when the dispersed particles of the copper alloy powder are evenly distributed after grinding through all alloy uniformities.

[0032] In a third aspect, the present application provides a computer device, comprising a memory and a processor, wherein the memory stores codes, and the processor is configured to obtain the codes and execute the above-mentioned method for determining the preparation time of dispersion-strengthened copper alloy powder.

[0033] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned method for determining the preparation time of dispersion-strengthened copper alloy powder is implemented.

[0034] The technical solution provided by the embodiments disclosed in this application has the following beneficial effects:

[0035] In the dispersion-strengthened copper alloy preparation system and method provided in the present application, firstly, the grinding time range of the copper alloy powder in the target grinding equipment is determined, different grinding times are set within the grinding time range, and the target grinding equipment grinds the copper alloy powder according to the set different grinding times; element detection is performed on the copper alloy powder that has undergone different grinding times in the target grinding equipment to obtain the molar ratio of the elements in the copper alloy powder at different grinding times, and then the element distribution diagram in the copper alloy powder at different grinding times is determined according to all the molar ratios; the diffraction spectrum of the copper alloy powder at different grinding times is collected, and the lattice distortion rate of the copper alloy powder at different grinding times is determined based on all the diffraction spectrum, and the expansion coefficient is fitted for all the lattice distortion rates to obtain the lattice expansion coefficient of the copper alloy powder; the alloy uniformity of the copper alloy powder at different grinding times is determined based on the lattice expansion coefficient and all the element distribution diagrams, and the optimal preparation time when the dispersed particles of the copper alloy powder are uniformly distributed after grinding is determined through all the alloy uniformities; the copper alloy powder ground after the optimal preparation time is used for hot isostatic pressing sintering to obtain a strengthened copper alloy with uniform dispersed particles distribution.

[0036] It can be seen that the present application uses the copper alloy powder ground after the optimal preparation time to perform hot isostatic pressing sintering to obtain a reinforced copper alloy with uniformly distributed dispersed particles; first, the determination of the element distribution map can help evaluate the uniformity and composition consistency of the alloy powder, and understand whether the dispersed particles are uniformly distributed at different grinding times; then, the determination of the lattice expansion coefficient can obtain the rate of change of the lattice structure of the copper alloy powder with the grinding time under continuous grinding. The determination of the lattice expansion coefficient helps to understand the interaction between the various elements in the alloy at different grinding times. Combined with the element distribution map in the copper alloy powder, the alloy uniformity of the copper alloy powder at different grinding times, that is, the uniform distribution degree of each component element in the copper alloy powder, can be determined, thereby analyzing all Alloy uniformity determines the best preparation time when the dispersed particles of the copper alloy powder are evenly distributed after grinding, that is, the optimal preparation time; finally, the determination of the optimal preparation time can obtain the grinding time required for the copper alloy powder to achieve optimal uniformity. The above steps can help find the time point when the dispersed particles in the copper alloy are most evenly distributed during the grinding process, thereby ensuring the best alloy performance of the copper alloy by determining the grinding time, and solving the problem that the dispersed phase particles are easy to aggregate during the grinding process, resulting in uneven distribution in the matrix, thereby affecting the performance uniformity of the alloy; in summary, based on the above scheme, it is possible to reduce the aggregation of dispersed particles during the grinding process of the mechanical alloying method, promote the uniform distribution of dispersed particles in the matrix, and thus improve the performance uniformity of the copper alloy. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is an exemplary flow chart of a method for determining the preparation time of dispersion-strengthened copper alloy powder according to some embodiments of the present application;

[0038] Figure 2 is an exemplary flow chart of determining an element distribution map according to some embodiments of the present application;

[0039] Figure 3 is an exemplary flow chart of determining the lattice distortion rate according to some embodiments of the present application;

[0040] Figure 4 is a schematic diagram of the structure of a device for determining the preparation time of a copper alloy powder according to some embodiments of the present application;

[0041] Figure 5 It is a schematic diagram of the structure of a computer device for implementing a method for determining the preparation time of dispersion-strengthened copper alloy powder according to some embodiments of the present application. DETAILED DESCRIPTION

[0042] In order to better understand the technical solution of the present application, the technical solution of the present application will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] refer to Figure 1 , which is an exemplary flow chart of a method for determining the preparation time of a dispersion-strengthened copper alloy powder according to some embodiments of the present application. The method 100 for determining the preparation time of a dispersion-strengthened copper alloy powder mainly includes the following steps:

[0044] In step 101, a grinding time range of copper alloy powder in a target grinding device is determined, different grinding times are set within the grinding time range, and the target grinding device grinds the copper alloy powder according to the set different grinding times.

[0045] It should be noted that copper alloy powder refers to a basic alloy powder containing pure copper, copper oxide and dispersed particles; wherein, dispersed particles refer to solid particles that can be dispersed in a metal matrix to improve the strength, hardness and high temperature resistance of the metal material. The dispersed particles used in this application are yttrium trioxide, because yttrium trioxide has excellent thermal stability, and the yttrium element has an extremely low solubility in the copper matrix (mass fraction is 0.05% at room temperature), which can inhibit the coarsening of the dispersed particles and ensure the purity of the copper matrix, thereby greatly reducing the impact on the thermal conductivity while improving the dispersion strengthening effect. Other dispersed particles may also be used in other embodiments, which are not specifically limited here;

[0046] In addition, it should be noted that, in the present application, grinding time refers to the time that the target grinding equipment grinds the copper alloy powder; the target grinding equipment can be a ball mill or other equipment with grinding function. As a preferred embodiment, the target grinding equipment in the present application adopts a ball mill. A ball mill is a mechanical equipment that crushes and / or refines the material through the mutual collision and friction between the grinding balls in a rotating cylinder and the material. It is widely used in mining, metal alloy preparation, chemical industry, building materials and other fields. In other embodiments, other grinding equipment can also be used, and no specific limitation is made here.

[0047] In specific implementation, the grinding time range of the copper alloy powder in the ball mill can be set to 0 to 60 hours according to the grinding performance of the ball mill, and different grinding times (for example: 6, 15, 30, 45, 60 hours) can be set within the grinding time range, and then the pre-prepared copper alloy powder is added to the grinding tank of the ball mill, and an appropriate amount of grinding media (for example: hard steel balls) is added to ensure that the copper alloy powder is effectively ground, the ball mill is started, and the ball mill is stopped after different grinding times are reached and a small amount of copper alloy powder is taken out, thereby obtaining copper alloy powders at different grinding times.

[0048] It should be noted that the materials of the grinding jar and the grinding media must be compatible with the grinding material to prevent contamination or mutual reaction of the materials. The grinding jar and the grinding media used in the present application can be, for example, 304 stainless steel to avoid mutual reaction with the copper alloy. In other embodiments, grinding jars and grinding media of other materials can also be selected, which are not specifically limited here.

[0049] In step 102, element detection is performed on the copper alloy powder that has undergone different grinding times in the target grinding equipment to obtain the molar ratios of the elements in the copper alloy powder at different grinding times, and then the element distribution diagram in the copper alloy powder at different grinding times is determined based on all the molar ratios.

[0050] In some embodiments, element detection is performed on copper alloy powders that have been subjected to different grinding times in a target grinding device to obtain the molar ratio of elements in the copper alloy powders at different grinding times. The following steps can be used:

[0051] For the copper alloy powder at each grinding time, an energy spectrum diagram of X-ray signal composition of different elements in the copper alloy powder is obtained;

[0052] The molar ratio of the elements in the copper alloy powder at each grinding time is determined according to the energy spectrum.

[0053] It should be noted that, in the present application, the molar ratio refers to the ratio of the molar number of elements such as copper, oxygen, yttrium, and iron in the copper alloy powder to the total molar number of the copper alloy powder, which reflects the relative content of elements such as copper, oxygen, yttrium, and iron in the copper alloy powder; the energy spectrum is a graphical representation that shows the characteristic X-ray energy distribution of each element in the alloy material and is used to analyze the types of elements in the alloy material and their relative contents.

[0054] In addition, it should be noted that the copper alloy powder will produce different degrees of lattice distortion after different grinding times. Lattice distortion refers to the phenomenon that the atomic arrangement deviates from the ideal lattice position in the crystal structure of the solid material due to external factors or internal defects. During the grinding process, the alloy powder will continue to collide, rub and compress under the mechanical force, resulting in a decrease in particle size, an increase in surface activity, and lattice distortion. The present application calculates the molar ratio of each element in the copper alloy powder to generate a distribution map of the elements in the copper alloy powder, and further analyzes the degree of lattice distortion of the copper alloy powder at different grinding times.

[0055] In a specific implementation, first, for the copper alloy powder at each grinding time, the copper alloy powder can be placed on the sample stage of a scanning electron microscope, and the position can be adjusted so that the electron beam can cover the entire surface of the copper alloy powder. Then, the energy spectrometer in the scanning electron microscope is used to collect characteristic X-ray signals emitted by different elements in the copper alloy powder and perform imaging to obtain an energy spectrum composed of X-ray signals of different elements in the copper alloy powder; then, the existing element analysis tools (for example, energy dispersive X-ray spectrometer) are used to perform peak recognition on the energy spectrum and convert the peaks of different elements into molar ratios, thereby obtaining the molar ratios of different elements in the copper alloy powder. The molar ratios of elements in the copper alloy powder at different grinding times can be obtained in the above manner.

[0056] It should be noted that a scanning electron microscope is an electron microscope that obtains information such as the material's morphology, composition, and microstructure through the interaction between a scanning electron beam and the material's surface. It is used to generate high-resolution images of the material's surface. A scanning electron microscope equipped with an energy spectrometer can also analyze the chemical composition of different areas through X-ray signals, thereby detecting the elemental composition of the material.

[0057] In some embodiments, reference Figure 2 , which is an exemplary flow chart of determining the element distribution diagram according to some embodiments of the present application. In the present application, the element distribution diagram in the copper alloy powder at different grinding times according to all molar ratios can be determined by the following steps:

[0058] In step 1021, for the copper alloy powder at each grinding time, a scanning electron microscope is used to scan the copper alloy powder to obtain a surface morphology image of the copper alloy powder;

[0059] In step 1022, the element distribution map in the copper alloy powder at each grinding time is determined according to the molar ratio of different elements in the copper alloy powder and the surface morphology map.

[0060] It should be noted that, in the present application, the element distribution map refers to a visual image showing the specific position and distribution of different elements in the copper alloy powder; the surface morphology map is an image that provides information such as the shape, size, distribution and surface characteristics of the particles in the copper alloy powder.

[0061] In specific implementation, first, for the copper alloy powder at each grinding time, the surface of the copper alloy powder can be scanned by the electron beam of a scanning electron microscope to generate a surface morphology of the copper alloy powder; then, the molar ratio of different elements in the copper alloy powder is associated with the surface morphology using an existing element analysis tool (e.g., an energy dispersive X-ray spectrometer) to generate an element mapping diagram for each element, and then the element mapping diagrams of all elements in the copper alloy powder are superimposed to obtain an element distribution diagram of the copper alloy powder. The element distribution diagram in the copper alloy powder at different grinding times can be obtained by the above method, wherein the element mapping diagram is an image showing the distribution of elements in different areas of the sample surface. In the energy dispersive X-ray spectrometer, each element will be assigned a different color label and then superimposed on the surface morphology diagram. The concentration of the element at different locations on the sample surface is displayed by the depth or distribution of the color. For example, a region containing a high concentration of copper may be displayed as dark red, while copper oxide may be displayed as green or blue. Through such spatial mapping, the distribution diagram of the elements in the alloy powder at different grinding times can be constructed.

[0062] It should be noted that in this application, by combining the surface morphology of the copper alloy powder and the molar ratio of different elements, the distribution of different elements in the copper alloy powder can be displayed, which helps to understand the elemental composition and characteristics of the copper alloy powder. The element distribution diagram can help evaluate the uniformity and composition consistency of the alloy powder, and understand whether the dispersed particles are evenly distributed at different grinding times.

[0063] In step 103, the diffraction patterns of the copper alloy powder at different grinding times are collected, the lattice distortion rate of the copper alloy powder at different grinding times is determined based on all the diffraction patterns, and the expansion coefficient of all the lattice distortion rates is fitted to obtain the lattice expansion coefficient of the copper alloy powder.

[0064] It should be noted that, in the present application, the diffraction pattern is an image containing relevant information of a series of diffraction peaks generated when an incident wave (such as X-rays) passes through the crystal inside the copper alloy powder and interacts with the atomic arrangement inside the crystal.

[0065] In specific implementation, for copper alloy powders at different grinding times, an X-ray diffraction device can be started to allow X-rays to penetrate the copper alloy powder from different diffraction angles, and a detector is used to record the X-ray intensity at different diffraction angles to obtain a diffraction spectrum of the copper alloy powder. The diffraction spectrum of the copper alloy powder at different grinding times can be obtained in the above manner, wherein a copper target X-ray source is used as the X-ray source, and other X-ray sources may also be used in other embodiments, which are not specifically limited here.

[0066] It should be noted that the diffraction angle refers to the angle of the diffraction wave relative to the incident wave when the incident wave (such as X-rays) interacts with the crystals inside the copper alloy powder in the diffraction phenomenon. It is also the angle of the detector that detects the diffraction signal. It can be set to any angle between 5 degrees and 90 degrees in order to capture the diffraction peak of the copper alloy powder crystal structure. Five different diffraction angles are set in this application, namely 20 degrees, 30 degrees, 40 degrees, 50 degrees and 60 degrees. In other embodiments, it can also be set to other angles, which are not specifically limited here.

[0067] In some embodiments, reference Figure 3 , which is an exemplary flow chart of determining the lattice distortion rate according to some embodiments of the present application. In the present application, the lattice distortion rate of the copper alloy powder at different grinding times based on all diffraction patterns can be determined by the following steps:

[0068] In step 1031, for the copper alloy powders at different grinding times, the half-peak width of each diffraction peak is determined according to the diffraction pattern of the copper alloy powders;

[0069] In step 1032, determining the grain size of the crystal structure in the copper alloy powder;

[0070] In step 1033, the lattice change value of each diffraction peak is determined based on all the half-peak widths and the grain size;

[0071] In step 1034, the lattice distortion rate of the copper alloy powder is determined through all the lattice change values, and then the lattice distortion rate of the copper alloy powder at different grinding times is obtained.

[0072] It should be noted that, in the present application, the lattice distortion rate refers to the degree of microscopic distortion of the crystal structure of the copper alloy powder when ground at different grinding times, reflecting the changes in the lattice caused by dislocations; the half-peak width refers to the peak width corresponding to half the height of a diffraction peak in the diffraction spectrum, wherein the diffraction peak refers to the peak value observed in the diffraction spectrum; the lattice change value refers to the degree of microscopic distortion of the crystal structure of the copper alloy powder detected at different diffraction angles.

[0073] In specific implementation, first, for copper alloy powders at different grinding times, the existing diffraction pattern analysis software (for example: Origin data analysis and drawing software) can be used to process the diffraction pattern of the copper alloy powder to determine the half-peak width of each diffraction peak; secondly, the grain size of the crystal structure in the copper alloy powder is determined; then, based on all the half-peak widths and the grain size, the lattice change value of each diffraction peak is determined; then, the average of the lattice change values ​​of all diffraction peaks can be used as the lattice distortion rate of the copper alloy powder; finally, the lattice distortion rate at different grinding times can be obtained in the above manner.

[0074] It should be noted that in the present application, the width of the diffraction peak is measured by determining the half-peak width. The diffraction peak represents the periodic arrangement of atoms in the copper alloy powder crystal. The appearance of the diffraction peak is due to the interaction between the X-rays and the atoms in the copper alloy powder crystal, which causes the X-rays to be enhanced at a specific angle. Under different grinding times, the lattice distortion rate of the copper alloy powder will affect the morphology of the diffraction peak, especially the change in the half-peak width. The lattice distortion rate of the copper alloy powder can be further obtained through the half-peak width.

[0075] Preferably, in some embodiments, determining the grain size of the crystal structure in the copper alloy powder can be achieved in the following manner, namely: selecting one of all the diffraction peaks as the selected diffraction peak, then obtaining the wavelength of the incident wave in the diffraction spectrum, and dividing the product of the wavelength and the shape factor by the product of the half-width of the selected diffraction peak and the cosine value of the diffraction angle corresponding to the selected diffraction peak, and the obtained value is used as the grain size of the copper alloy powder under the selected diffraction peak, and continuing to determine the grain size of the copper alloy powder under the remaining diffraction peaks, and taking the average of all grain sizes as the grain size of the crystal structure in the copper alloy powder.

[0076] It should be noted that the shape factor in the present application is an important parameter for estimating the grain size, and its value is usually 0.9. However, in other embodiments, it can also be adjusted according to the shape of the crystal and the characteristics of the diffraction peak, which is not specifically limited here.

[0077] Preferably, in some embodiments, determining the lattice change value of each diffraction peak based on all the half-peak widths and the grain size can be achieved in the following manner, namely: selecting one from all the diffraction peaks as the selected diffraction peak, and obtaining the wavelength of the incident wave in the diffraction spectrum, and then subtracting the ratio of the product of the wavelength and the shape factor to the grain size from the product of the half-peak width of the selected diffraction peak and the cosine value of the diffraction angle corresponding to the selected diffraction peak, and dividing the difference by four times the sine value of the diffraction angle corresponding to the selected diffraction peak, and using the obtained value as the lattice change value of the selected diffraction peak, and continuing to determine the lattice change values ​​of the remaining diffraction peaks.

[0078] In some embodiments, the expansion coefficient fitting is performed on all lattice distortion rates to obtain the lattice expansion coefficient of the copper alloy powder by the following steps:

[0079] Data fitting is performed on all lattice distortion rates to obtain the lattice distortion curve of the copper alloy powder;

[0080] The lattice expansion coefficient of the copper alloy powder is determined based on the change trend of the lattice distortion curve.

[0081] It should be noted that, in the present application, the lattice expansion coefficient is the rate of change of the lattice structure of the copper alloy powder under continuous grinding with grinding time; the lattice distortion curve is a curve that describes the trend of the lattice distortion rate of the copper alloy powder with grinding time.

[0082] In the specific implementation, first, an existing linear fitting model (for example, a simple linear regression model) can be loaded, and the grinding time of the copper alloy powder is used as the independent variable in the input of the linear fitting model, and the lattice distortion rate of the copper alloy powder is used as the dependent variable in the input of the linear fitting model. Different grinding times and their corresponding lattice distortion rates of the copper alloy powder are used as data sets in the input of the linear fitting model, and then the linear fitting model is executed, and the fitting function in the output of the linear fitting model is used as the lattice distortion curve of the copper alloy powder; then, the change rate of the lattice distortion rate at each grinding time point can be calculated through the lattice distortion curve, that is, the slope of the lattice distortion curve at the corresponding grinding time point, and all the change rates are used as the lattice expansion coefficient of the copper alloy powder.

[0083] It should be noted that the present application can more intuitively observe the change trend of the copper alloy powder through the lattice distortion curve, thereby determining the lattice expansion coefficient of the copper alloy powder. It can be seen from the lattice distortion curve that in the early stage of grinding, the copper alloy powder has good plasticity and will undergo severe deformation under the high-speed impact of the grinding ball, resulting in a large number of defects (such as vacancies, dislocations, grain boundaries, etc.), and the lattice is severely distorted. Therefore, the lattice distortion rate increases sharply. As the grinding time increases, the deformation of the copper alloy powder decreases, and the atoms inside begin to diffuse continuously. Thereafter, the lattice distortion is mainly related to the formation of the solid solution. When the atoms of the dispersed particles with a larger atomic radius are dissolved in the lattice with a smaller radius to form a solid solution, the lattice expands and the lattice distortion rate increases. However, as the diffusion of atoms slows down and the solid solution gradually stabilizes, the lattice also gradually tends to stabilize, and the trend of the lattice distortion rate gradually slows down until it stabilizes. At this time, the copper alloy powder also begins to tend to be uniform.

[0084] In step 104, the alloy uniformity of the copper alloy powder at different grinding times is determined based on the lattice expansion coefficient and all element distribution diagrams, and the optimal preparation time when the copper alloy powder is evenly distributed after grinding is determined through all alloy uniformities.

[0085] In some embodiments, determining the alloy uniformity of the copper alloy powder at different grinding times based on the lattice expansion coefficient and the distribution diagram of all elements can be achieved by the following steps:

[0086] Obtain the ideal distribution map of elements when the copper alloy powder is evenly distributed;

[0087] For the copper alloy powders at different grinding times, determining the distribution difference between the element distribution in the copper alloy powder and the ideal distribution according to the element distribution diagram of the copper alloy powder and the ideal distribution diagram;

[0088] The alloy uniformity of the copper alloy powder is determined based on the lattice expansion coefficient and the distribution difference, and then the alloy uniformity of the copper alloy powder under different grinding times is obtained.

[0089] It should be noted that in this application, the ideal distribution diagram is a theoretical image that describes the spatial distribution characteristics of each element in the copper alloy powder under ideal conditions (such as uniform mixing, no phase separation, etc.); distribution difference refers to the difference between the distribution of each element in the copper alloy powder under actual conditions and the ideal distribution; alloy uniformity refers to the uniform distribution degree of each component element in the copper alloy powder.

[0090] In specific implementation, first, the thermodynamic data of each component in the copper alloy powder and the operating parameters of the ball mill can be obtained, and the thermodynamic data and operating parameters can be used as input parameters of existing thermodynamic calculation software (for example, phase equilibrium thermodynamic calculation software). The thermodynamic calculation software is used to predict the distribution of each element in the copper alloy powder after grinding, and the distribution is converted into an ideal distribution diagram, thereby obtaining an ideal distribution diagram of the elements when the copper alloy powder is uniformly distributed; secondly, the molar ratio of the elements in each area in the element distribution diagram of the copper alloy powder and the ideal distribution value of the corresponding area in the ideal distribution diagram can be calculated by using existing graphics processing software (for example, analysis software in an energy dispersive X-ray spectrometer) to obtain the distribution difference value of each area, and the standard deviation of all distribution difference values ​​is used as the distribution difference between the element distribution in the copper alloy powder and the ideal distribution; then, the change rate of the lattice distortion rate at the grinding time point is obtained in the lattice expansion coefficient, and the product of the change rate and the distribution difference is used as the alloy uniformity of the copper alloy powder. The alloy uniformity of the copper alloy powder at different grinding times can be obtained in the above manner.

[0091] It should be noted that, by using the ideal distribution diagram as a comparison standard, the present application can evaluate whether the distribution of elements in the copper alloy powder in actual situations reaches the expected uniformity.

[0092] In some embodiments, the optimal preparation time for determining the uniform distribution of dispersed particles of the copper alloy powder after grinding by all alloy uniformity can be achieved by the following steps:

[0093] The maximum value among all alloy uniformities is selected as the best uniformity;

[0094] The optimal preparation time when the copper alloy powder is ground and dispersed with uniform particle distribution is determined based on the optimal uniformity.

[0095] It should be noted that, in the present application, the optimal preparation time refers to the grinding time required for the copper alloy powder to achieve optimal uniformity; the optimal uniformity refers to the state in which the particles in the copper alloy powder are most uniformly distributed under different grinding times, and the optimal uniformity means that the distribution of the dispersed particles in the powder has reached the most ideal uniformity level; in specific implementation, first, the alloy uniformity with the largest value among all alloy uniformities is selected as the optimal uniformity; then, the grinding time corresponding to the optimal uniformity is used as the optimal preparation time when the dispersed particles of the copper alloy powder are uniformly distributed after grinding.

[0096] It should be noted that during the grinding process, the copper alloy powder particles will undergo different degrees of refinement and homogenization. As the grinding time increases, the particle distribution tends to be uniform. When the optimal uniformity is reached, further grinding may not significantly improve the uniformity, but will lead to excessive refinement or agglomeration of particles. Therefore, the optimal preparation time refers to the time point when the dispersed particles in the copper alloy are most evenly distributed, which means that the grinding operation should be completed at the optimal preparation time to ensure the best alloy performance.

[0097] In addition, in another aspect of the present application, in some embodiments, the present application provides a dispersion-strengthened copper alloy preparation system, including a copper alloy powder preparation time determination device, referring to Figure 4 , which is a schematic diagram of the structure of a device for determining the preparation time of a copper alloy powder according to some embodiments of the present application, the device 400 for determining the preparation time of a copper alloy powder comprises: an indication module 401, a processing module 402 and an execution module 403, which are respectively described as follows:

[0098] Indication module 401, in the present application, the indication module 401 is mainly used to determine the grinding time range of the copper alloy powder in the target grinding equipment, set different grinding times within the grinding time range, and instruct the target grinding equipment to grind the copper alloy powder according to the set different grinding times;

[0099] Processing module 402, in the present application, the processing module 402 is mainly used to control the element detection of the copper alloy powder that has undergone different grinding times in the target grinding equipment, obtain the molar ratio of the elements in the copper alloy powder at different grinding times, and then determine the element distribution map in the copper alloy powder at different grinding times according to all the molar ratios;

[0100] It should be noted that the processing module 402 in the present application is also used to collect diffraction patterns of the copper alloy powder at different grinding times, determine the lattice distortion rate of the copper alloy powder at different grinding times based on all the diffraction patterns, perform expansion coefficient fitting on all the lattice distortion rates, and obtain the lattice expansion coefficient of the copper alloy powder;

[0101] Execution module 403, the processing module 403 in this application is mainly used to determine the alloy uniformity of the copper alloy powder under different grinding times based on the lattice expansion coefficient and all element distribution diagrams, and determine the optimal preparation time when the dispersed particles of the copper alloy powder are uniformly distributed after grinding through all alloy uniformities.

[0102] In addition, the present application also provides a computer device, which includes a memory and a processor, wherein the memory stores codes, and the processor is configured to obtain the codes and execute the above-mentioned method for determining the preparation time of dispersion-strengthened copper alloy powder.

[0103] In some embodiments, reference Figure 5 , which is a schematic diagram of the structure of a computer device for implementing a method for determining the preparation time of a dispersion-strengthened copper alloy powder according to some embodiments of the present application. The method for determining the preparation time of a dispersion-strengthened copper alloy powder in the above embodiment can be performed by Figure 5 The computer device 500 shown in the figure is implemented, and the computer device 500 includes at least one processor 501, a communication bus 502, a memory 503 and at least one communication interface 504.

[0104] The processor 501 may be a general-purpose central processing unit (CPU) or an application-specific integrated circuit (ASIC).

[0105] The communication bus 502 may be used to transmit information between the above-mentioned components.

[0106] The memory 503 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a random access memory (RAM) or other types of dynamic storage devices that can store information and instructions, or an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, an optical disc storage (including a compressed optical disc, a laser disc, an optical disc, a digital versatile disc, a Blu-ray disc, etc.), a magnetic disk or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer, but is not limited thereto. The memory 503 may exist independently and be connected to the processor 501 via the communication bus 502. The memory 503 may also be integrated with the processor 501.

[0107] The memory 503 is used to store the program code for executing the solution of the present application, and the execution is controlled by the processor 501. The processor 501 is used to execute the program code stored in the memory 503. The program code may include one or more software modules. The method for determining the preparation time of the dispersion-strengthened copper alloy powder in the above embodiment can be implemented by the processor 501 and one or more software modules in the program code in the memory 503.

[0108] The communication interface 504 uses any transceiver or other device for communicating with other devices or communication networks, such as Ethernet, radio access network (RAN), wireless local area networks (WLAN), etc.

[0109] In a specific implementation, as an embodiment, a computer device may include multiple processors, each of which may be a single-CPU processor or a multi-CPU processor. The processor here may refer to one or more devices, circuits, and / or processing cores for processing data (e.g., computer program instructions).

[0110] The above-mentioned computer device may be a general-purpose computer device or a special-purpose computer device. In a specific implementation, the computer device may be a desktop computer, a portable computer, a network server, a personal digital assistant (PDA), a mobile phone, a tablet computer, a wireless terminal device, a communication device or an embedded device. The embodiment of the present application does not limit the type of computer device.

[0111] In addition, the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the above-mentioned method for determining the preparation time of dispersion-strengthened copper alloy powder is implemented.

[0112] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0113] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method for determining the preparation time of dispersion-strengthened copper alloy powder, characterized in that: The steps include: Determining a grinding time range for the copper alloy powder in a target grinding device, setting different grinding times within the grinding time range, and the target grinding device grinding the copper alloy powder according to the set different grinding times; Performing element detection on the copper alloy powder that has been subjected to different grinding times in the target grinding equipment to obtain the molar ratios of the elements in the copper alloy powder at different grinding times, and then determining the element distribution map in the copper alloy powder at different grinding times according to all the molar ratios; Collecting diffraction patterns of the copper alloy powder at different grinding times, determining the lattice distortion rate of the copper alloy powder at different grinding times based on all the diffraction patterns, fitting the expansion coefficients of all the lattice distortion rates, and obtaining the lattice expansion coefficient of the copper alloy powder; Determine the alloy uniformity of the copper alloy powder at different grinding times based on the lattice expansion coefficient and all element distribution diagrams, and determine the optimal preparation time when the copper alloy powder is evenly distributed after grinding through all alloy uniformities; Among them, the lattice distortion rate of the copper alloy powder at different grinding times is determined based on all diffraction patterns and specifically includes: For the copper alloy powders at different grinding times, the half-peak width of each diffraction peak is determined according to the diffraction pattern of the copper alloy powder; Determine the grain size of the crystal structure in copper alloy powders; Determining the lattice change value of each diffraction peak based on all half-peak widths and the grain size; The lattice distortion rate of the copper alloy powder is determined by all lattice change values, and then the lattice distortion rate of the copper alloy powder at different grinding times is obtained; Among them, the expansion coefficient fitting of all lattice distortion rates is carried out to obtain the lattice expansion coefficient of the copper alloy powder using the following steps: Data fitting is performed on all lattice distortion rates to obtain the lattice distortion curve of the copper alloy powder; Determining the lattice expansion coefficient of the copper alloy powder based on the change trend of the lattice distortion curve; Wherein, determining the alloy uniformity of the copper alloy powder at different grinding times based on the lattice expansion coefficient and the distribution diagram of all elements specifically includes: Obtain the ideal distribution map of elements when the copper alloy powder is evenly distributed; For the copper alloy powders at different grinding times, determining the distribution difference between the element distribution in the copper alloy powder and the ideal distribution according to the element distribution diagram of the copper alloy powder and the ideal distribution diagram; Determining the alloy uniformity of the copper alloy powder based on the lattice expansion coefficient and the distribution difference, and then obtaining the alloy uniformity of the copper alloy powder at different grinding times; The optimal preparation time for uniformly dispersing the copper alloy powder particles after grinding is determined by all alloy uniformities by the following steps: The maximum value among all alloy uniformities is selected as the best uniformity; The optimal preparation time when the copper alloy powder is ground and dispersed with uniform particle distribution is determined based on the optimal uniformity.

2. The method according to claim 1, characterized in that The copper alloy powders that have been subjected to different grinding times in the target grinding equipment are subjected to element detection, and the molar ratios of the elements in the copper alloy powders at different grinding times are obtained, including: For the copper alloy powder at each grinding time, an energy spectrum diagram of X-ray signal composition of different elements in the copper alloy powder is obtained; The molar ratio of the elements in the copper alloy powder at each grinding time is determined according to the energy spectrum.

3. The method according to claim 1, characterized in that The element distribution diagrams in the copper alloy powder at different grinding times are determined based on all molar ratios, including: For the copper alloy powder at each grinding time, a scanning electron microscope is used to scan the copper alloy powder to obtain a surface morphology image of the copper alloy powder; The element distribution diagram in the copper alloy powder at each grinding time is determined according to the molar ratio of different elements in the copper alloy powder and the surface morphology diagram.

4. The method according to claim 1, characterized in that The copper alloy powder is a basic alloy powder obtained by melting and atomizing pure copper, copper oxide and dispersed particles using vacuum gas atomizing powder making equipment.

5. The method according to claim 4, characterized in that The dispersed particles are yttrium trioxide.

6. A dispersion-strengthened copper alloy preparation system, which uses the method according to any one of claims 1 to 5 to determine the preparation time of copper alloy powder, the system comprising a copper alloy powder preparation time determination device, characterized in that: The copper alloy powder preparation time determination device comprises: An indication module, used to determine a grinding time range of the copper alloy powder in a target grinding device, set different grinding times within the grinding time range, and indicate the target grinding device to grind the copper alloy powder according to the set different grinding times; A processing module, used to control element detection of copper alloy powders that have undergone different grinding times in a target grinding device, obtain molar ratios of elements in the copper alloy powders at different grinding times, and then determine element distribution diagrams in the copper alloy powders at different grinding times based on all the molar ratios; The processing module is further used to collect diffraction patterns of the copper alloy powder at different grinding times, determine the lattice distortion rate of the copper alloy powder at different grinding times based on all the diffraction patterns, and perform expansion coefficient fitting on all the lattice distortion rates to obtain the lattice expansion coefficient of the copper alloy powder; The execution module is used to determine the alloy uniformity of the copper alloy powder under different grinding times based on the lattice expansion coefficient and the distribution diagram of all elements, and determine the optimal preparation time when the dispersed particles of the copper alloy powder are evenly distributed after grinding through all alloy uniformities.

7. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method for determining the preparation time of the dispersion-strengthened copper alloy powder according to any one of claims 1 to 5 are implemented.

8. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the method for determining the preparation time of the dispersion-strengthened copper alloy powder according to any one of claims 1 to 5 are implemented.

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