Chip face-down bonding device, chip face-down bonding method and chip assembly

Abstract

The invention relates to the technical field of semiconductors, in particular to a chip face-down bonding device, a chip face-down bonding method and a chip assembly.The chip face-down bonding device comprises a pressure welding piece and a distance adjusting pressure head, and the pressure welding piece is configured to move in the first direction relative to a circuit substrate so that an electric connecting piece on a target chip can be pressed and welded to the circuit substrate; a circuit plane of the circuit substrate is vertical to the first direction; at least one distance adjusting pressure head is arranged, the distance adjusting pressure head is connected with the pressure welding piece, and the distance adjusting pressure head is configured to be capable of moving by a target distance in the first direction so as to press and weld the target connecting piece and the circuit substrate; wherein under the condition that the target chip and the circuit substrate are pressed and welded, the electric connecting piece, which is not connected with the circuit substrate, on the target chip is a target connecting piece; the target distance is the distance from the welding surface of the target connecting piece to the reference plane, and the reference plane is perpendicular to the first direction. Precise pressure control is achieved by arranging the distance adjusting pressure head, the product quality is improved, and high reliability of face-down bonding interconnection is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a chip flip soldering device, a chip flip soldering method and a chip assembly. Background Art

[0002] In infrared detectors, the infrared focal plane array needs to use electrical connectors (such as indium pillars) to interconnect the photosensitive chip and the readout circuit substrate by reverse soldering, thereby achieving the dual purposes of infrared signal acquisition and signal processing.

[0003] Taking the existing reverse soldering interconnection method of a certain photosensitive chip and a readout circuit as an example, after the chip and the circuit substrate are aligned, the chip and the circuit substrate are pressed and welded by a pressure head. However, due to defects on the chip surface and differences in the height of the indium column, each area of ​​the chip is subjected to uneven pressure, which leads to defects such as cold solder joints and empty solder joints in the product, affecting product quality and low reverse soldering reliability. Summary of the invention

[0004] The chip flip soldering device, chip flip soldering method and chip assembly provided by the embodiments of the present invention at least solve the problem that uneven pressure of the existing chip flip soldering head causes defects such as cold solder joints and empty solder joints in the product. By setting an adjustable distance pressure head to achieve precise pressure control, product quality is improved and high flip soldering interconnection reliability is guaranteed.

[0005] In the first aspect, the present invention provides a chip reverse welding device, including a welding component, which is configured to be movable along a first direction relative to a circuit substrate so as to press and weld an electrical connector on a target chip to the circuit substrate; wherein a surface of the circuit substrate where the circuit is located is perpendicular to the first direction; and an adjustable pressure head, at least one adjustable pressure head is provided, the adjustable pressure head is connected to the welding component, and the adjustable pressure head is configured to be movable along the first direction a target distance so as to press and weld a target connector to the circuit substrate; wherein, when the target chip is press-welded to the circuit substrate, the electrical connector on the target chip that is not connected to the circuit substrate is the target connector; the target distance is the distance from the welding surface of the target connector to a reference plane, and the reference plane is perpendicular to the first direction.

[0006] In one embodiment of the present invention, there are multiple adjustable head arrangements, and the multiple adjustable head arrangements are arranged in an array, and each of the adjustable head arrangements corresponds one-to-one to the electrical connector on the target chip; or, there are multiple adjustable head arrangements, and the multiple adjustable head arrangements are arranged in an array, and each of the adjustable head arrangements corresponds to the multiple electrical connectors on the target chip.

[0007] In one embodiment of the present invention, it also includes a rangefinder, which is used to obtain the actual distance; wherein the actual distance is the distance from the welding surface of the electrical connector on the target chip to the reference plane; and a controller, which is electrically connected to the rangefinder and the distance adjustment pressure head respectively, and is used to calculate the target distance based on the actual distance; wherein the target distance is equal to the difference between the reference distance and the actual distance, and the reference distance is the maximum value of the actual distances.

[0008] In one embodiment of the present invention, a first driving member is further included, wherein the first driving member is connected to the pressure welding member, and the first driving member is used to drive the pressure welding member to move along the first direction.

[0009] In one embodiment of the present invention, the pressure welding part includes a pressure welding surface, a negative pressure groove is arranged on the pressure welding surface, and a negative pressure hole is arranged on the bottom surface of the negative pressure groove; the chip reverse welding device also includes a negative pressure valve, the negative pressure valve is connected to the pressure welding part, and the negative pressure valve is connected to the negative pressure hole, and the negative pressure valve is used to connect to the negative pressure device to adsorb the target chip with negative pressure.

[0010] In one embodiment of the present invention, it also includes a first aligner, which is used to detect the distance-adjusting pressure head and the target chip to obtain first alignment data; wherein the first alignment data includes the offset of the target connector and the distance-adjusting pressure head in a preset alignment coordinate system; and a second driving member, which is connected to the pressure welding member and is used to drive the pressure welding member to move according to the first alignment data to align the target connector and the distance-adjusting pressure head.

[0011] In one embodiment of the present invention, it also includes a second aligner, which is used to detect the target chip and the circuit substrate to obtain second alignment data; wherein the second alignment data includes a first preset identification point on the target chip, and an offset of a second preset identification point on the circuit substrate in a preset alignment coordinate system; and a third driving member, which is connected to the circuit substrate and / or to the bonding member, and is used to adjust the position of the target chip and the circuit substrate according to the second alignment data so that the first preset identification point and the second preset identification point are aligned.

[0012] In a second aspect, the present invention also provides a chip flip soldering method based on the chip flip soldering device described in any one of the above items, comprising driving a pressure welding component to move along a first direction close to a circuit substrate so as to press and weld an electrical connector on a target chip to the circuit substrate; wherein a surface of the circuit substrate where the circuit is located is perpendicular to the first direction; driving an adjustable pressure head to move a target distance along the first direction so as to press and weld a target connector to the circuit substrate; wherein at least one adjustable pressure head is provided, and the adjustable pressure head is connected to the pressure welding component; when the target chip is press-welded to the circuit substrate, the electrical connector on the target chip that is not connected to the circuit substrate is the target connector; the target distance is the distance from the welding surface of the target connector to a reference plane, and the reference plane is perpendicular to the first direction.

[0013] In one embodiment of the present invention, before driving the pressure welding component to move close to the circuit substrate along the first direction, it also includes obtaining the actual distance through a rangefinder; wherein the actual distance is the distance from the welding surface of the electrical connector on the target chip to the reference plane; according to the actual distance, the target distance is calculated by a controller; wherein the controller is electrically connected to the rangefinder and the distance-adjusting pressure head respectively, the target distance is equal to the difference between the reference distance and the actual distance, and the reference distance is the maximum value of the actual distances.

[0014] In one embodiment of the present invention, before driving the welding component to move along the first direction close to the circuit substrate, it also includes detecting the distance-adjusting pressure head and the target chip to obtain first alignment data; wherein the first alignment data includes the offset of the target connector and the distance-adjusting pressure head in a preset alignment coordinate system; according to the first alignment data, the welding component is driven to move so that the target connector and the distance-adjusting pressure head are aligned; or / and, detecting the target chip and the circuit substrate to obtain second alignment data; wherein the second alignment data includes a first preset identification point on the target chip, and an offset of a second preset identification point on the circuit substrate in a preset alignment coordinate system; according to the second alignment data, the position of the target chip and the circuit substrate is adjusted so that the first preset identification point and the second preset identification point are aligned.

[0015] In a third aspect, the present invention also provides a chip assembly, comprising a target chip and a circuit substrate; wherein, the electrical connector on the target chip is press-welded to the circuit substrate by a chip flip-welding device as described in any one of the above, or the electrical connector on the target chip is press-welded to the circuit substrate by a chip flip-welding method as described in any one of the above.

[0016] The above technical solution of the present invention has the following beneficial effects compared with the prior art:

[0017] The chip reverse welding device of the present invention provides a distance-adjustable pressure head on the pressure welding part, and the distance-adjustable pressure head can independently adjust the pressure, so that during the chip reverse welding process, the pressure on the back of the chip can be precisely controlled, and the compression amount of the target connection part can be increased. It is ensured that the target connection part and the circuit substrate can be pressed and welded, and defects such as cold welding and empty welding are avoided. High product quality is effectively guaranteed, and the reliability of reverse welding interconnection is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without creative work. In the drawings:

[0019] Figure 1 It is one of the structural schematic diagrams of the chip flip soldering device in the preferred embodiment of the present invention.

[0020] Figure 2 This is the second structural schematic diagram of the chip flip soldering device in the preferred embodiment of the present invention.

[0021] Figure 3 It is one of the cross-sectional structural schematic diagrams of the chip flip soldering device in the preferred embodiment of the present invention.

[0022] Figure 4 This is the third structural schematic diagram of the chip flip soldering device in the preferred embodiment of the present invention.

[0023] Figure 5 This is the second schematic cross-sectional structure diagram of the chip flip soldering device in the preferred embodiment of the present invention.

[0024] Figure 6 It is one of the partial cross-sectional structural schematic diagrams of the chip flip soldering device in the preferred embodiment of the present invention.

[0025] Figure 7 This is the third schematic cross-sectional structure diagram of the chip flip soldering device in the preferred embodiment of the present invention.

[0026] Figure 8 This is the second schematic diagram of the partial cross-sectional structure of the chip flip soldering device in the preferred embodiment of the present invention.

[0027] Fig. 9 This is the fourth structural schematic diagram of the chip flip soldering device in the preferred embodiment of the present invention.

[0028] Fig.10 It is a schematic flow chart of a chip flip soldering method in a preferred embodiment of the present invention.

[0029] The above drawings include the following reference numerals:

[0030] D1, first direction; 10, pressure welding part; 11, pressure welding surface; 111, negative pressure groove; 1111, negative pressure hole; 21, circuit substrate; 211, circuit surface; 22, target chip; 221, electrical connector; 2211, target connector; 2212, welding surface; 30, distance adjusting pressure head; 41, rangefinder; 42, controller; 50, first driving part; 51, driving motor; 52, driving screw; 53, screw guide; 61, negative pressure valve; 71, first aligner; 72, second driving part; 81, second aligner; 82, third driving part. DETAILED DESCRIPTION

[0031] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein, which are instead provided for a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0032] Reference Figure 1 and Figure 2 As shown, in order to solve the problem in the prior art that when a pressure head is used to directly press and weld a photosensitive chip and a readout circuit, different areas of the chip are subjected to uneven pressure due to chip surface defects, indium column height differences, etc., resulting in defects such as cold solder joints and empty solder joints in the product, the present invention provides a chip reverse soldering device. The chip reverse soldering device includes a pressure welding part 10 and a distance-adjustable pressure head 30.

[0033] The pressure welding member 10 is used for pressing and welding the target chip 22 and the circuit substrate 21. The pressure welding member 10 is configured to be movable along the first direction D1 relative to the circuit substrate 21 to press and weld the electrical connector 221 on the target chip 22 to the circuit substrate 21. Those skilled in the art can set its specific shape, size, material, etc. according to actual needs.

[0034] Preferably, a readout circuit of an infrared detector is arranged on the circuit substrate 21, and the substrate material is preferably silicon. Preferably, the target chip 22 is a photosensitive chip of an infrared detector, and its electrical connector 221 is an indium column.

[0035] The circuit surface 211 of the circuit substrate 21 is perpendicular to the first direction D1, so as to ensure that the bonding component 10 can exert a force perpendicular to the circuit surface 211, thereby ensuring good product quality.

[0036] Those skilled in the art can configure the pressure welding part 10 according to actual needs to achieve its movement along the first direction D1, for example, by setting different driving and transmission devices, wherein the driving device includes but is not limited to a motor and a cylinder, and the transmission device includes but is not limited to a gear, a rack, a screw rod, etc.

[0037] Reference Figure 4 and Figure 5 As shown, when the target chip 22 and the circuit substrate 21 are pressed and welded, the electrical connector 221 on the target chip 22 that is not connected to the circuit substrate 21 is the target connector 2211. Due to surface defects of the target chip 22, the size of the electrical connector 221, etc., different areas on the target chip 22 are subjected to uneven pressure, resulting in the welding surface 2212 of the target connector 2211 being unable to contact the circuit substrate 21.

[0038] The welding surface 2212 of the electrical connector 221, that is, the end surface that needs to be pressed and welded to the circuit substrate 21, will have defects such as cold solder joints and empty solder joints if it contacts the circuit substrate 21 but is not firm and fails to form a good electrical connection, or if it does not directly contact the circuit substrate 21.

[0039] Reference Figure 3 As shown, the distance-adjusting pressure head 30 is a core component for solving the problem of uneven pressure. At least one distance-adjusting pressure head 30 is provided, and those skilled in the art can set its specific number and position according to actual needs. For example, there is only one target connector 2211 on the target chip 22, and only one distance-adjusting pressure head 30 is provided and is provided corresponding to the target connector 2211, or multiple distance-adjusting pressure heads 30 are provided.

[0040] The distance-adjusting pressure head 30 is connected to the pressure welding part 10 to ensure that the distance-adjusting pressure head 30 can move synchronously with the pressure welding part 10, and apply pressure to the target chip 22 when necessary, thereby solving the problem of uneven pressure. Exemplarily, the pressure welding part 10 includes a pressure welding surface 11, which is used to contact the target chip 22, thereby applying pressure to it and realizing pressure welding between the chip and the substrate. The pressure welding surface 11 is provided with a mounting hole, and the distance-adjusting pressure head 30 is arranged in the mounting hole.

[0041] Reference Figure 5 , Figure 6 and Figure 7As shown, the distance-adjustable pressure head 30 is configured to move a target distance along the first direction D1 to press and weld the target connector 2211 and the circuit substrate 21. The target distance is the distance from the welding surface 2212 of the target connector 2211 to the reference plane. The reference plane is a plane for reference, and the reference plane is perpendicular to the first direction D1. Those skilled in the art can set the reference plane according to actual needs. Exemplarily, the end surface of the target chip 22 that is away from the surface where the electrical connector 221 is located along the first direction D1 is used as the reference plane.

[0042] It should be noted that the target distance is not necessarily the maximum movable distance of the adjustable head 30. Considering the surface defects of different target chips 22 and the differences in the sizes of different electrical connectors 221, in order to avoid defects such as cold solder joints and empty solder joints, those skilled in the art can set the maximum movable distance of each adjustable head 30 according to actual needs.

[0043] Those skilled in the art can set different adjustable pressure heads 30 according to actual needs to achieve movement and compression welding along the first direction D1. For example, the adjustable pressure head 30 is set as a combination of a micro motor and a pressure block, a combination of piezoelectric ceramics and a pressure block, etc. The shape of the pressure block can be set to a rectangular parallelepiped, a cylinder, etc.

[0044] In addition, those skilled in the art can set the timing for the distance adjustment of the distance adjustment head 30 according to actual needs, for example, during the process of the pressure welding part 10 being pressed and moved, or after the pressure welding part 10 is pressed and moved into place.

[0045] When using the chip flip soldering device described in the present invention to perform chip flip soldering, if there are surface defects on the target chip 22, or there are errors in the size of some electrical connectors 221, the adjustable pressure head 30 can independently adjust the pressure, and the adjustable pressure head 30 and the pressure welding component 10 cooperate to achieve precise pressure control on the back of the chip during the flip soldering process, thereby increasing the clamping amount for the target connector 2211 (the clamping amount is the distance that the target connector 2211 moves due to the clamping force), ensuring that the target connector 2211 can be welded to the circuit substrate 21, avoiding defects such as cold solder joints and empty solder joints.

[0046] The chip reverse welding device of the present invention provides a distance-adjustable pressure head 30 on the pressure welding part 10, and the distance-adjustable pressure head 30 can independently adjust the pressure, so as to realize accurate pressure control on the back side of the chip during the chip reverse welding process, and increase the pressing amount for the target connector 2211. It ensures that the target connector 2211 and the circuit substrate 21 can realize pressing welding, and avoids defects such as cold welding and empty welding. It effectively ensures high product quality and improves the reliability of reverse welding interconnection.

[0047] Reference Figure 5As shown, in the chip flip soldering device of the present invention, in some embodiments, a plurality of adjustable pressure heads 30 are provided, and the plurality of adjustable pressure heads 30 are arranged in an array. Each adjustable pressure head 30 corresponds to the electrical connector 221 on the target chip 22 one by one. This structure can ensure that no matter how many target connectors 2211 there are on the target chip 22, the compression amount can be increased by the corresponding adjustable pressure head 30, which is very accurate, and ensures that the target connector 2211 and the circuit substrate 21 are well compressed and welded.

[0048] Preferably, taking a cylindrical indium column as an example, the distance adjustment pressure head 30 is also configured as a cylindrical structure, and the end surface areas of the cylinders are the same.

[0049] Reference Figure 8 As shown, in the chip flip soldering device of the present invention, in some embodiments, a plurality of adjustable head 30 are provided, and the plurality of adjustable head 30 are arranged in an array. Each adjustable head 30 corresponds to a plurality of electrical connectors 221 on the target chip 22. This structure effectively reduces the number of adjustable heads 30, reduces the complexity of the device, and facilitates production assembly, debugging and maintenance.

[0050] Exemplarily, the distance adjusting head 30 is configured as a cylindrical structure, and each distance adjusting head 30 corresponds to four indium columns.

[0051] Reference Fig. 9 As shown, the chip flip soldering device described in the present invention, in some embodiments, further includes a range finder 41 and a controller 42.

[0052] The rangefinder 41 is used to obtain the actual distance. The actual distance is the distance from the welding surface 2212 of the electrical connector 221 on the target chip 22 to the reference plane. Preferably, the welding surface 2212 is perpendicular to the first direction D1, and the actual distance is the perpendicular distance between the two surfaces along the first direction D1.

[0053] Due to the surface defects of the target chip 22, the size of the electrical connector 221 and other reasons, the actual distances of different electrical connectors 221 on the target chip 22 may be different. The actual distance of some is large, and the actual distance of some is small, which results in the target connector 2211 with a small actual distance having a cold weld or an empty weld when the traditional pressure head performs compression welding. Therefore, by providing the rangefinder 41, the actual distance can be well obtained, so as to cooperate with the distance adjustment pressure head 30 to independently adjust the target connector 2211.

[0054] Those skilled in the art can set the rangefinder 41 according to actual needs, such as a laser rangefinder or a laser scanner. Exemplarily, the laser scanner is used to scan the photosensitive chip and obtain its three-dimensional data, thereby obtaining the distance from the welding surface 2212 of each indium column to the reference plane.

[0055] The controller 42 is electrically connected to the distance meter 41 and the distance adjustment pressure head 30. The controller 42 is used to calculate the target distance according to the actual distance. The target distance is equal to the difference between the reference distance and the actual distance, and the reference distance is the maximum value of the actual distance.

[0056] After the actual distance is obtained by the rangefinder 41, it can be transmitted to the controller 42, and the controller 42 processes and calculates the target distance. After the target distance is obtained, the corresponding distance adjustment pressure head 30 can be adjusted to ensure that the pressure on different areas of the target chip 22 is uniform, thereby ensuring that each electrical connector 221 can be well pressed and welded with the circuit substrate 21 to avoid cold welding and empty welding.

[0057] For example, refer to Figure 6 As shown, taking a device with multiple adjustable pressure heads 30, each of which corresponds to an electrical connector 221 on a target chip 22, as an example, the distance meter 41 obtains the actual distance of the electrical connector 221 corresponding to each adjustable pressure head 30. .

[0058] in, , That is, the total number of the adjustable pressure head 30, which can be understood. It is also the total number of electrical connectors 221. Take the current actual distance The maximum value in As the reference distance, the target distance required for each adjustable pressure head 30 can be calculated. , = , so that the distance head 30 can be adjusted according to the target distance Move and adjust the distance and increase the amount of compression.

[0059] For example, refer to Figure 8 As shown, taking a device with multiple distance-adjusting pressure heads 30, each distance-adjusting pressure head 30 corresponding to four electrical connectors 221 on the target chip 22 as an example, the distance meter 41 obtains the actual distance of each electrical connector 221 .

[0060] in, , That is, the total number of adjustable pressure heads 30, , That is, the number of electrical connectors 221 corresponding to the current adjustable pressure head 30. is 4. Take the current actual distances The maximum value in The reference distance is the smallest distance value among the four electrical connectors 221 corresponding to the same adjustable pressure head 30. , to calculate the target distance required for each adjustable head 30 , , so that the distance head 30 can be adjusted according to the target distance Move and adjust the distance and increase the amount of compression.

[0061] Reference Figure 3 As shown, the chip flip soldering device described in the present invention, in some embodiments, further includes a first driving member 50, the first driving member 50 is connected to the pressure welding member 10, and the first driving member 50 is used to drive the pressure welding member 10 to move along the first direction D1.

[0062] Preferably, the first driving member 50 includes a driving motor 51, a driving lead screw 52 and a lead screw guide 53. The lead screw guide 53 is fixedly arranged, and the driving motor 51 is arranged on the lead screw guide 53 and connected to one axial end of the driving lead screw 52. The other end of the driving lead screw 52 is connected to the pressure welding part 10 in a transmission manner to realize transmission and drive the pressure welding part 10 to move along the first direction D1, so that the pressure welding part 10 is relatively close to or relatively far from the circuit substrate 21. Preferably, the driving lead screw 52 is set as a ball screw to have high precision and ensure high product quality.

[0063] Preferably, refer to Fig. 9 As shown, the first driving member 50 is electrically connected to the controller 42 so as to be controlled together by the controller 42 .

[0064] When in use, the initial setting of the compression amount of the first driving member 50 is , then the total pressing amount of the adjustable pressure head 30 corresponding to the electrical connector 221 is , the total pressing amount of the adjustable pressure head 30 corresponding to the plurality of electrical connectors 221 is , thereby ensuring that each electrical connector 221 can be well pressed and welded to the circuit substrate 21, avoiding defects such as cold soldering and empty soldering.

[0065] Reference Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, in some embodiments of the chip flip soldering device described in the present invention, the chip flip soldering device further includes a negative pressure valve 61.

[0066] On the one hand, the negative pressure valve 61 is connected to the negative pressure device. The negative pressure device belongs to the prior art and can be set as needed by those skilled in the art, which is not shown in the figure. The negative pressure device is used to generate negative pressure, so as to facilitate negative pressure adsorption of the target chip 22. On the other hand, the negative pressure valve 61 is connected to the pressure welding part 10, so that after the target chip 22 is adsorbed, it moves with the pressure welding part 10 to perform the compression welding operation.

[0067] Preferably, the pressure welding part 10 includes a pressure welding surface 11, and a negative pressure groove 111 is provided on the pressure welding surface 11. Those skilled in the art can set the shape, size and position of the negative pressure groove 111 according to actual needs, for example, the negative pressure groove 111 is set to be circular and set in the middle area of ​​the pressure welding surface 11. A negative pressure hole 1111 is provided on the bottom surface of the negative pressure groove 111, and the negative pressure valve 61 is connected to the negative pressure hole 1111.

[0068] Preferably, to facilitate the welding of the chip and the circuit, the end surface of the target chip 22 that is away from the surface where the electrical connector 221 is located along the first direction D1 is selected for adsorption.

[0069] After the negative pressure device is started, the negative pressure valve 61 is opened, and the target chip 22 can be adsorbed and fixed on the bonding surface 11 to perform the operation; the negative pressure valve 61 is closed, and the target chip 22 and the bonding surface 11 can be separated.

[0070] Preferably, the negative pressure groove 111 is set to be annular so as to reduce the number of negative pressure valves 61, so as to make the structure of the device simple and low in cost. It is conceivable that the outer contour area of ​​the annular negative pressure groove 111 is less than or equal to the outer contour area of ​​the target chip 22 so as to achieve negative pressure adsorption. Accordingly, the distance adjustment pressure head 30 is set inside the annular negative pressure groove 111 to achieve the distance adjustment of the target connector 2211 without affecting the negative pressure adsorption chip.

[0071] In some embodiments, the chip flip soldering device of the present invention further includes a first aligner 71 and a second driving member 72 .

[0072] The first alignment device 71 is used to detect the distance adjustment head 30 and the target chip 22 to obtain first alignment data. The first alignment data includes the offset of the target connector 2211 and the distance adjustment head 30 in a preset alignment coordinate system.

[0073] Those skilled in the art can set different first aligners 71 according to actual needs, such as industrial cameras, etc. Preferably, the plane where the preset alignment coordinate system is located is perpendicular to the first direction D1. Taking the xy coordinate system as an example, the offset includes the offset in the x direction and the offset in the y direction.

[0074] The second driving member 72 is connected to the pressure welding member 10 , and is used to drive the pressure welding member 10 to move according to the first alignment data, so as to align the target connecting member 2211 with the distance-adjusting press head 30 .

[0075] Those skilled in the art can set different second driving components 72 according to actual needs, including but not limited to motors, cylinders, robotic arms, etc., which will not be described in detail.

[0076] By setting this structure, it is ensured that the target connector 2211 and the distance adjustment pressure head 30 can be aligned, so that the distance adjustment pressure head 30 can accurately adjust the distance according to the target distance. This ensures that the target connector 2211 and the circuit substrate 21 can be pressed and welded, avoiding defects such as cold welding and empty welding. It effectively ensures high product quality and improves the reliability of reverse welding interconnection.

[0077] It should be noted that, taking a device with multiple adjustable head 30, each adjustable head 30 corresponding one-to-one to the electrical connector 221 on the target chip 22 as an example, when aligning, each electrical connector 221 and the adjustable head 30 are aligned.

[0078] Preferably, refer to Fig. 9 As shown, the first aligner 71 and the second driving member 72 are both electrically connected to the controller 42 so as to realize the alignment control of the target connecting member 2211 and the distance adjustment pressure head 30 through the controller 42 .

[0079] In some embodiments, the chip flip soldering device of the present invention further includes a second aligner 81 and a third driving member 82 .

[0080] The second aligner 81 is used to detect the target chip 22 and the circuit substrate 21 to obtain second alignment data. The second alignment data includes the offset of the first preset identification point on the target chip 22 and the second preset identification point on the circuit substrate 21 in the preset alignment coordinate system.

[0081] Those skilled in the art can set different second alignment devices 81 according to actual needs, such as optical microscope systems. The first preset identification point and the second preset identification point are not shown in the figure. Those skilled in the art can set the first preset identification point and the second preset identification point according to actual needs, and will not be repeated. Preferably, the plane where the preset alignment coordinate system is located is perpendicular to the first direction D1. Taking the xy coordinate system as an example, the offset includes the offset in the x direction and the offset in the y direction.

[0082] It should be noted that, in some embodiments, the first aligner 71 can be provided to detect the target chip 22 and the circuit substrate 21 together to obtain the second alignment data.

[0083] The third driving member 82 is used to adjust the position of the target chip 22 and the circuit substrate 21 according to the second alignment data, so that the first preset marking point and the second preset marking point are aligned.

[0084] Those skilled in the art can set different third driving members 82 according to actual needs, including but not limited to motors, cylinders, mechanical arms, etc., which will not be described in detail. For example, only the third driving member 82 is connected to the circuit substrate 21 to control the movement of the circuit substrate 21 to achieve alignment; or, only the third driving member 82 is connected to the pressure welding member 10 to control the movement of the pressure welding member 10 to achieve alignment; or, the third driving member 82 is connected to the circuit substrate 21 and the pressure welding member 10 at the same time to achieve alignment.

[0085] It should be noted that, in some embodiments, the second driving member 72 can also be used to move the pressure welding member 10 to achieve alignment.

[0086] Preferably, refer to Fig. 9 As shown, the first aligner 71 and the second driving member 72 are both electrically connected to the controller 42 , so as to realize the alignment control of the target chip 22 and the circuit substrate 21 through the controller 42 .

[0087] By setting this structure, it is ensured that the target chip 22 and the circuit substrate 21 can be aligned, so that the distance adjustment head 30 can accurately adjust the distance according to the target distance. This ensures that the target connector 2211 and the circuit substrate 21 can be pressed and welded, avoiding defects such as cold welding and empty welding. It effectively ensures high product quality and improves the reliability of reverse welding interconnection.

[0088] On the other hand, refer to Fig.10 As shown, the embodiment of the present invention further provides a chip flip soldering method based on the chip flip soldering device described in any one of the above embodiments. The chip flip soldering method includes:

[0089] The pressure welding member 10 is driven to move along the first direction D1 close to the circuit substrate 21 to press and weld the electrical connector 221 on the target chip 22 to the circuit substrate 21. The circuit surface 211 of the circuit substrate 21 is perpendicular to the first direction D1.

[0090] The distance-adjustable pressure head 30 is driven to move a target distance along the first direction D1 to press and weld the target connector 2211 to the circuit substrate 21. At least one distance-adjustable pressure head 30 is provided, and the distance-adjustable pressure head 30 is connected to the pressure welding component 10. When the target chip 22 is pressed and welded to the circuit substrate 21, the electrical connector 221 on the target chip 22 that is not connected to the circuit substrate 21 is the target connector 2211. The target distance is the distance from the welding surface 2212 of the target connector 2211 to the reference plane, and the reference plane is perpendicular to the first direction D1.

[0091] When using the chip flip soldering method described in the present invention to perform chip flip soldering, if there are surface defects on the target chip 22, or there are errors in the size of some electrical connectors 221, the adjustable pressure head 30 can independently adjust the pressure, and the adjustable pressure head 30 and the pressure welding part 10 cooperate to achieve precise pressure control on the back of the chip during the flip soldering process, increase the compression amount for the target connector 2211, and ensure that the target connector 2211 can be welded to the circuit substrate 21, avoiding defects such as cold solder joints and empty solder joints.

[0092] The chip reverse soldering method of the present invention provides a distance-adjustable pressure head 30 on the pressure welding part 10, and the distance-adjustable pressure head 30 can independently adjust the pressure, so that during the chip reverse soldering process, the pressure on the back of the chip can be precisely controlled, and the pressing amount of the target connector 2211 can be increased. It is ensured that the target connector 2211 and the circuit substrate 21 can be pressed and welded, and defects such as cold soldering and empty soldering are avoided. High product quality is effectively guaranteed, and the reliability of reverse soldering interconnection is improved.

[0093] In some embodiments, the chip flip soldering method of the present invention further includes, before driving the pressure welding component 10 to move along the first direction D1 close to the circuit substrate 21:

[0094] The actual distance is obtained by the distance meter 41. The actual distance is the distance from the welding surface 2212 of the electrical connector 221 on the target chip 22 to the reference plane.

[0095] According to the actual distance, the target distance is calculated by the controller 42. The controller 42 is electrically connected to the distance meter 41 and the distance adjustment head 30. The target distance is equal to the difference between the reference distance and the actual distance, and the reference distance is the maximum value of the actual distance.

[0096] After the actual distance is obtained by the rangefinder 41, it can be transmitted to the controller 42, and the controller 42 processes and calculates the target distance. After the target distance is obtained, the corresponding distance adjustment pressure head 30 can be adjusted to ensure that the pressure on different areas of the target chip 22 is uniform, thereby ensuring that each electrical connector 221 can be well pressed and welded with the circuit substrate 21 to avoid cold welding and empty welding.

[0097] In some embodiments, the chip flip soldering method of the present invention further includes, before driving the pressure welding component 10 to move along the first direction D1 close to the circuit substrate 21:

[0098] The distance adjustment head 30 and the target chip 22 are detected to obtain first alignment data, wherein the first alignment data includes the offset of the target connector 2211 and the distance adjustment head 30 in a preset alignment coordinate system.

[0099] The pressure welding component 10 is driven to move according to the first alignment data, so that the target connecting component 2211 and the distance adjustment pressure head 30 are aligned.

[0100] Preferably, the first aligner 71 detects the distance adjustment pressure head 30 and the target chip 22, and the second driving member 72 drives the pressure welding member 10 to move and align. Preferably, after the alignment is completed, the negative pressure valve 61 is opened to adsorb the target chip 22 on the pressure welding surface 11 of the pressure welding member 10.

[0101] By aligning the distance-adjusting pressure head 30 and the target connection part 2211 before compression welding, the distance-adjusting pressure head 30 can be accurately adjusted according to the target distance. This ensures that the target connection part 2211 and the circuit substrate 21 can be compressed and welded, avoiding defects such as cold welding and empty welding. This effectively ensures high product quality and improves the reliability of reverse welding interconnection.

[0102] In some embodiments, the chip flip soldering method of the present invention further includes, before driving the pressure welding component 10 to move along the first direction D1 close to the circuit substrate 21:

[0103] The target chip 22 and the circuit substrate 21 are detected to obtain second alignment data, wherein the second alignment data includes the offset of the first preset identification point on the target chip 22 and the second preset identification point on the circuit substrate 21 in the preset alignment coordinate system.

[0104] According to the second alignment data, the positions of the target chip 22 and the circuit substrate 21 are adjusted so that the first preset identification point and the second preset identification point are aligned.

[0105] Preferably, the second aligner 81 detects the distance adjustment pressure head 30 and the target chip 22 , and the third driving member 82 drives the corresponding devices to move and align.

[0106] By aligning the target chip 22 and the circuit substrate 21 before compression welding, the distance adjustment head 30 can accurately adjust the distance according to the target distance. This ensures that the target connector 2211 and the circuit substrate 21 can be compressed and welded, avoiding defects such as cold welding and empty welding. This effectively ensures high product quality and improves the reliability of reverse welding interconnection.

[0107] The present invention also provides a chip assembly, which includes a target chip 22 and a circuit substrate 21. The electrical connector 221 on the target chip 22 is pressed and welded to the circuit substrate 21 by using any of the chip flip soldering devices described above, or the electrical connector 221 on the target chip 22 is pressed and welded to the circuit substrate 21 by using any of the chip flip soldering methods described above.

[0108] Working principle:

[0109] Taking the device in which the distance adjustment pressure head 30 corresponds to the electrical connector 221 on the target chip 22 one by one as an example, when performing compression welding, first, the target chip 22 is detected by the distance meter 41 to obtain the actual distance , that is, the distance from the welding surface 2212 of the electrical connector 221 on the target chip 22 to the reference plane (here, the reference plane is the end surface of the target chip 22 that is away from the surface where the electrical connector 221 is located along the first direction D1). Take the current actual distances The maximum value in The reference distance is processed and calculated by the controller 42 to be the target distance that each distance adjustment head 30 is to move. , = .

[0110] Subsequently, the first alignment device 71 detects the distance-adjusting head 30 and the target chip 22, and obtains the first alignment data, that is, the offset of each electrical connector 221 and the distance-adjusting head 30 corresponding to the electrical connector 221 in the preset alignment coordinate system. After obtaining the offset of the electrical connector 221 and the distance-adjusting head 30, the controller 42 controls the second driving member 72 to move the pressure welding member 10 so that the electrical connector 221 and the distance-adjusting head 30 are aligned. After the alignment is completed, the negative pressure device and the negative pressure valve 61 are turned on to adsorb and fix the target chip 22 on the pressure welding surface 11.

[0111] Next, the target chip 22 and the circuit substrate 21 are detected by the second aligner 81 to obtain second alignment data, that is, the offset of the first preset identification point on the target chip 22 and the second preset identification point on the circuit substrate 21 in the preset alignment coordinate system. After obtaining the offset of the preset identification point, the third driving member 82 is controlled by the controller 42 to align the target chip 22 and the circuit substrate 21.

[0112] Finally, the controller 42 controls the first driving member 50 and the distance adjusting pressure head 30 to press and weld the target chip 22 and the circuit substrate 21. After welding, the negative pressure device and the negative pressure valve 61 are closed, the target chip 22 is released and unloaded for subsequent welding.

[0113] It should be noted that the term "including" and its variations used in the embodiments of the present invention are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". The modifications of "one" and "multiple" mentioned in the embodiments of the present invention are illustrative and not restrictive. Those skilled in the art should understand that unless the context clearly indicates otherwise, it should be understood as "one or more".

[0114] The user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in the embodiments of the present invention are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0115] The various steps described in the method implementation methods provided by the embodiments of the present invention may be performed in different orders and / or in parallel. In addition, the method implementation methods may include additional steps and / or omit the steps shown. The scope of protection of the present invention is not limited in this respect.

[0116] The term "embodiment" in this specification refers to specific features, structures or characteristics described in conjunction with the embodiment that can be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment, nor does it mean that it is mutually exclusive with other embodiments and is independent or optional. The various embodiments in this specification are described in a related manner, and the same or similar parts between the various embodiments refer to each other. In particular, for the device, equipment, and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts refer to the partial description of the method embodiment.

[0117] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of protection. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the attached claims.

Claims

1. A chip flip soldering device, characterized in that: include: A pressure welding member, wherein the pressure welding member is configured to be movable relative to the circuit substrate along a first direction so as to press and weld the electrical connector on the target chip to the circuit substrate; wherein the circuit surface of the circuit substrate is perpendicular to the first direction; and A distance-adjustable pressure head, at least one of which is provided, the distance-adjustable pressure head is connected to the pressure welding part, and the distance-adjustable pressure head is configured to be able to move a target distance along the first direction to pressure-weld the target connector to the circuit substrate; wherein, when the target chip is pressure-welded to the circuit substrate, the electrical connector on the target chip that is not connected to the circuit substrate is the target connector; the target distance is the distance from the welding surface of the target connector to a reference plane, and the reference plane is perpendicular to the first direction.

2. The chip flip soldering device according to claim 1, characterized in that: The distance-adjusting pressure heads are provided in plurality, and the plurality of distance-adjusting pressure heads are arranged in an array, and each of the distance-adjusting pressure heads corresponds one-to-one to the electrical connector on the target chip; or, There are a plurality of the distance adjusting pressure heads, and the plurality of the distance adjusting pressure heads are arranged in an array, and each of the distance adjusting pressure heads corresponds to a plurality of the electrical connectors on the target chip.

3. The chip flip bonding device according to claim 1, characterized in that: Also includes: A rangefinder, the rangefinder is used to obtain an actual distance; wherein the actual distance is the distance from the welding surface of the electrical connector on the target chip to the reference plane; and A controller is electrically connected to the rangefinder and the distance adjusting pressure head respectively, and is used to calculate the target distance according to the actual distance; wherein the target distance is equal to the difference between the reference distance and the actual distance, and the reference distance is the maximum value of the actual distances.

4. The chip flip bonding device according to claim 1, characterized in that: Also includes: A first driving member, wherein the first driving member is connected to the pressure welding member, and the first driving member is used to drive the pressure welding member to move along the first direction.

5. The chip flip soldering device according to claim 1, characterized in that: The pressure welding part comprises a pressure welding surface, a negative pressure groove is arranged on the pressure welding surface, and a negative pressure hole is arranged on the bottom surface of the negative pressure groove; The chip reverse soldering device also includes a negative pressure valve, which is connected to the pressure welding part and communicates with the negative pressure hole. The negative pressure valve is used to connect to the negative pressure device to absorb the target chip with negative pressure.

6. The chip flip bonding device according to claim 1 or 5, characterized in that: Also includes: A first aligner, the first aligner is used to detect the distance adjustment pressure head and the target chip to obtain first alignment data; wherein the first alignment data includes an offset between the target connector and the distance adjustment pressure head in a preset alignment coordinate system; as well as A second driving member, wherein the second driving member is connected to the pressure welding member, and the second driving member is used to drive the pressure welding member to move according to the first alignment data so as to align the target connecting member with the distance-adjusting pressure head.

7. The chip flip bonding device according to claim 1 or 5, characterized in that: Also includes: A second aligner, the second aligner is used to detect the target chip and the circuit substrate to obtain second alignment data; wherein the second alignment data includes a first preset identification point on the target chip and an offset of a second preset identification point on the circuit substrate in a preset alignment coordinate system; as well as A third driving member is connected to the circuit substrate and / or to the bonding member, and is used for adjusting the position of the target chip and the circuit substrate according to the second alignment data so that the first preset identification point and the second preset identification point are aligned.

8. A chip flipping method based on the chip flipping device according to any one of claims 1 to 7, characterized in that: include: Driving the pressure welding component to move along a first direction close to the circuit substrate to press and weld the electrical connector on the target chip to the circuit substrate; wherein the circuit surface of the circuit substrate is perpendicular to the first direction; Drive the adjustable pressure head to move a target distance along the first direction to press and weld the target connector to the circuit substrate; wherein, at least one adjustable pressure head is provided, and the adjustable pressure head is connected to the welding component; when the target chip is press-welded to the circuit substrate, the electrical connector on the target chip that is not connected to the circuit substrate is the target connector; the target distance is the distance from the welding surface of the target connector to a reference plane, and the reference plane is perpendicular to the first direction.

9. The chip flip soldering method according to claim 8, characterized in that: Before driving the pressure welding component to move close to the circuit substrate along the first direction, the method further includes: Acquiring an actual distance through a range finder; wherein the actual distance is the distance from the welding surface of the electrical connector on the target chip to the reference plane; The target distance is calculated by a controller according to the actual distance; wherein the controller is electrically connected to the rangefinder and the distance adjustment pressure head respectively, the target distance is equal to the difference between the reference distance and the actual distance, and the reference distance is the maximum value of the actual distances.

10. The chip flip soldering method according to claim 8, characterized in that: Before driving the pressure welding component to move close to the circuit substrate along the first direction, the method further includes: Detecting the distance-adjusting pressure head and the target chip to obtain first alignment data; wherein the first alignment data includes the offset of the target connecting member and the distance-adjusting pressure head in a preset alignment coordinate system; Drive the pressure welding component to move according to the first alignment data, so that the target connecting component and the distance-adjusting pressure head are aligned; or / and, Detecting the target chip and the circuit substrate to obtain second alignment data; wherein the second alignment data includes a first preset identification point on the target chip and an offset of a second preset identification point on the circuit substrate in a preset alignment coordinate system; According to the second alignment data, the positions of the target chip and the circuit substrate are adjusted so that the first preset identification point and the second preset identification point are aligned.

11. A chip assembly, characterized in that: It comprises a target chip and a circuit substrate; wherein, the electrical connector on the target chip is pressed and welded to the circuit substrate by a chip flip-welding device as described in any one of claims 1 to 7, or, the electrical connector on the target chip is pressed and welded to the circuit substrate by a chip flip-welding method as described in any one of claims 8 to 10.

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