Adjustable semiconductor glass wafer back laser coding machine and use method

Abstract

The invention discloses an adjustable semiconductor glass wafer back laser coding machine and a use method, and belongs to the field of laser coding. The invention discloses an adjustable semiconductor glass wafer back side laser coding machine and a use method, the adjustable semiconductor glass wafer back side laser coding machine comprises a shell, the inner wall of the shell is provided with two cavities, namely a first cavity and a second cavity, the left side of the inner wall of the second cavity is provided with a first storage frame and a second storage frame, and glass wafers are stored in the inner walls of the first storage frame and the second storage frame; a transfer robot for transferring the glass wafer is arranged in the second chamber; according to the invention, the transfer robot drives the lifting arm to extend into the storage frame I, the glass wafer is adsorbed by the vacuum chuck I, then the glass wafer is driven by the transfer robot to be pulled out, the driving motor is controlled to drive the U-shaped turnover frame to turn over by 180 degrees, and then the glass wafer is transferred into the first chamber by the transfer robot to code the back surface of the glass wafer; the use is convenient.

Description

Technical Field

[0001] The invention relates to the technical field of laser coding, and in particular to an adjustable semiconductor glass wafer backside laser coding machine and a use method thereof. Background Art

[0002] When glass wafers are being processed, they need to be transferred by a robot and coded by a laser coding structure. The main purpose of coding is to identify and track the information of the wafer to ensure product quality and traceability. The problem with the above-mentioned prior art is that the glass wafer cannot be turned over when being transferred by the robot, so the operation process of coding the back thereof is relatively cumbersome. At the same time, the position of the laser coding machine is relatively fixed, making it difficult to adjust its position. Summary of the invention

[0003] The purpose of the present invention is to solve the problems in the prior art and to propose an adjustable semiconductor glass wafer back side laser coding machine and a method of use.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions: An adjustable semiconductor glass wafer back laser coder comprises a shell, the inner wall of the shell is provided with two chambers, namely a first chamber and a second chamber, a material storage frame 1 and a material storage frame 2 are installed on the left side of the inner wall of the second chamber, the inner walls of the material storage frame 1 and the material storage frame 2 both store glass wafers, a transfer robot for transferring glass wafers is arranged in the second chamber, and an output end of the transfer robot is connected to an adjustment component for clamping and adsorbing the glass wafers and driving them to flip; A coding mechanism for coding the glass wafer is installed in the first chamber; The bottom end of the coding mechanism is connected to a biaxial moving mechanism that drives it to move for adjusting the position; The adjustment component includes: a connecting frame, one end of the connecting frame is connected to the output end of the transfer robot, a driving motor is fixedly installed on one side of the connecting frame, the output end of the driving motor passes through the connecting frame and is fixedly connected to a U-shaped flip frame, and a lifting arm is installed on the inner side of the U-shaped flip frame.

[0005] Preferably, the lifting arms are provided with two groups, and vacuum suction cups 307 are installed on opposite sides of the two groups of lifting arms. Hydraulic cylinders are fixedly connected to both sides of the outer wall of the U-shaped flip frame, and the output ends of the two groups of hydraulic cylinders extend into the U-shaped flip frame and are respectively fixedly connected to the outer side of one of the two groups of lifting arms.

[0006] Preferably, the transfer robot includes an X-axis moving mechanism, which is installed at the bottom end of the inner wall of the second chamber, and the output end of the X-axis moving mechanism is connected to a lifting cylinder, and the output end of the lifting cylinder is fixedly connected to a rotating motor, and the output end of the rotating motor is fixedly connected to a manipulator base, and the output end of the manipulator base is connected to a robotic arm, and the output end of the robotic arm is connected to a connecting frame.

[0007] Preferably, a coding inspection box is provided on the rear side of the inner wall of the second chamber for inspecting the coded glass wafers.

[0008] Preferably, the coding mechanism comprises: A placing table, wherein both sides of the bottom end of the placing table are fixedly connected to fixing frames, and the bottom end of the fixing frame is fixedly connected to the bottom end of the inner wall of the second chamber; and A laser coder, wherein the top of the laser coder is fixedly connected to a mounting frame, the bottom of the mounting frame away from the laser coder is fixedly connected to a support frame, and a dual-axis moving mechanism is installed between the bottom end of the support frame and the bottom end of the inner wall of the second chamber.

[0009] Preferably, a placement plate is installed at the middle of the top end of the placement table, and a groove is opened in the center of the placement plate.

[0010] Preferably, a second hydraulic cylinder is fixedly mounted on the bottom end of the inner wall of the groove, and a top block is fixedly connected to the output end of the second hydraulic cylinder.

[0011] Preferably, the coding detection box includes a box body, which is fixedly installed on the rear side of the inner wall of the second chamber, and a servo motor is fixedly installed on the inner wall of the box body. The output end of the servo motor is fixedly connected to a rotating shaft, and the top of the rotating shaft is fixedly connected to a placement seat, and a vacuum suction cup 2 is installed on the top of the placement seat.

[0012] Preferably, the adjustable semiconductor glass wafer back laser coding machine has the following specific steps: S1: Control the transfer robot to drive the lifting arm to move to the material storage frame 1, and control the mechanical arm of the transfer robot to drive the lifting arm to extend to adsorb the glass wafer; S2: After adsorption, the lifting cylinder is controlled to lift it up and then pulled out. The adsorbed glass wafer is turned 180 degrees by the adjustment component, and then placed on the top of the placement plate by the transfer robot. The laser coder is driven by the dual-axis moving mechanism to adjust the position and code the back of the glass wafer.

[0013] Compared with the prior art, the present invention provides an adjustable semiconductor glass wafer backside laser coding machine, which has the following beneficial effects: 1. The adjustable semiconductor glass wafer back laser coding machine drives the lifting arm to extend into the material storage frame 1 through the transfer robot, adsorbs the glass wafer through a pair of vacuum suction cups, and then drives the transfer robot to extract it, controls the driving motor to drive the U-shaped flip frame to flip 180 degrees, and then transfers it to the first chamber by the transfer robot to code the back of the glass wafer, which is easy to use; 2. The adjustable semiconductor glass wafer back laser coding machine installs a dual-axis moving mechanism under the laser coding device to drive it to move, thereby expanding the scope of use and adjusting the coding position according to needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view of the adjustable semiconductor glass wafer backside laser coding machine proposed by the present invention; Figure 2 This is a schematic diagram of the internal structure of the adjustable semiconductor glass wafer backside laser coding machine proposed by the present invention; Figure 3 The adjustable semiconductor glass wafer back laser coding machine proposed by the present invention Figure 2 Side view of Figure 4 This is a front view of the placement plate of the adjustable semiconductor glass wafer back laser coding machine proposed by the present invention; Figure 5 A cross-sectional view of a groove of the adjustable semiconductor glass wafer back laser coding machine proposed by the present invention; Figure 6 This is a front view of the support frame of the adjustable semiconductor glass wafer back laser coding machine proposed by the present invention; Figure 7 This is a front view of the second chamber of the adjustable semiconductor glass wafer back laser coding machine proposed by the present invention; Figure 8 This is a front view of the lifting arm of the adjustable semiconductor glass wafer back laser coding machine proposed by the present invention; Fig. 9 This is a cross-sectional view of the box of the adjustable semiconductor glass wafer back laser coding machine proposed by the present invention; Fig.10 This is a diagram of the dual-axis moving mechanism of the adjustable semiconductor glass wafer backside laser coding machine proposed by the present invention.

[0015] In the figure: 1, shell; 101, material storage frame 1; 102, material storage frame 2; 103, first chamber; 104, second chamber; 2, glass wafer; 301, X-axis moving mechanism; 302, lifting cylinder; 303, rotating motor; 304, mechanical arm; 305, connecting frame; 306, lifting arm; 307, vacuum suction cup 1; 308, mechanical arm base; 309, driving motor; 310, U-shaped flip frame; 311, hydraulic cylinder 1; 3 12. T-type guide rail; 313. T-type guide groove; 401. fixed frame; 402. placement table; 403. placement plate; 405. groove; 406. hydraulic cylinder 2; 407. top block; 501. laser coder; 502. mounting frame; 503. support frame; 6. dual-axis moving mechanism; 701. box; 702. servo motor; 703. rotating shaft; 704. placement seat; 705. infrared detector; 706. vacuum suction cup 2; 8. channel. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0017] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. Example

[0018] Reference Figure 1-Figure 10The adjustable semiconductor glass wafer back laser coding machine comprises a housing 1, the inner wall of the housing 1 is provided with two chambers, namely a first chamber 103 and a second chamber 104, a material storage frame 101 and a material storage frame 2 102 are installed on the left side of the inner wall of the second chamber 104, the material storage frame 101 is used to store unprocessed and coded glass wafers 2; the material storage frame 2 102 is used to store processed and coded glass wafers 2, a coding mechanism for coding the glass wafer 2 is installed in the first chamber 103, and a coding mechanism for coding the glass wafer 2 is installed in the second chamber 104 A transfer robot for transferring the glass wafer 2 is provided, and an adjustment component for clamping and adsorbing the glass wafer 2 and driving it to flip is connected to the output end of the transfer robot. The glass wafer 2 in the storage frame 101 is extracted by the transfer robot and the adjustment component, and driven to flip 180 degrees so that its back side faces upward, and is transferred to the first chamber 103 through the channel 8 opened between the first chamber 103 and the second chamber 104, and is placed on the coding mechanism in the first chamber 103; When in use: the transfer robot is controlled to move to take out the unprocessed and coded glass wafer 2 stored in the material storage frame 101, and place it on the coding mechanism in the first chamber 103 through the channel 8 to code it; It should be noted that: the adjustment component includes: a connecting frame 305, one end of the connecting frame 305 is connected to the output end of the transfer robot, a driving motor 309 is fixedly installed on one side of the connecting frame 305, the output end of the driving motor 309 passes through the connecting frame 305 and is fixedly connected to a U-shaped flip frame 310, a lifting arm 306 is installed on the inner side of the U-shaped flip frame 310, and vertical T-shaped guide grooves 313 are opened on both sides of the lifting arm 306 close to one end of the U-shaped flip frame 310, and T-shaped guide rails 312 are fixedly connected on both sides of the inner wall of the U-shaped flip frame 310, and the inner wall of the T-shaped guide groove 313 is slidably connected to the outer wall of the T-shaped guide rail 312; The transfer robot drives the lifting arm 306 to extend into the material storage frame 101, and the glass wafer 2 is adsorbed by the vacuum suction cup 307, and then driven by the transfer robot to pull it out, and the driving motor 309 is controlled to drive the U-shaped flip frame 310 to flip 180 degrees, and then it is transferred to the first chamber 103 by the transfer robot and placed on the coding mechanism.

[0019] There are two groups of upper lifting arms 306, and vacuum suction cups 307 are installed on opposite sides of the two groups of lifting arms 306. Hydraulic cylinders 311 are fixedly connected to both sides of the outer wall of the U-shaped flip frame 310. The output ends of the two groups of hydraulic cylinders 311 extend into the U-shaped flip frame 310 and are fixedly connected to the outer side of one of the two groups of lifting arms 306 respectively. When in use: the transfer robot drives the lifting arm 306 to extend into the material storage frame 101, inserts the glass wafer 2 into the gap between the two sets of lifting arms 306, controls the two sets of hydraulic cylinders 1 311 to push the two sets of lifting arms 306 to move relative to each other, clamps the glass wafer 2, and simultaneously adsorbs the glass wafer 2 through the vacuum suction cup 1 307, and then drives the transfer robot to extract it, controls the driving motor 309 to drive the U-shaped flip frame 310 to flip 180 degrees, and then is transferred to the first chamber 103 by the transfer robot, and is placed in the coding mechanism; like Figure 2-Figure 6 As shown, the coding mechanism includes: a placement table 402, both sides of the bottom end of the placement table 402 are fixedly connected with a fixing frame 401, and the bottom end of the fixing frame 401 is fixedly connected to the bottom end of the inner wall of the second chamber 104; it also includes a laser coder 501, the top of the laser coder 501 is fixedly connected with a mounting frame 502, and the bottom of the mounting frame 502 away from the laser coder 501 is fixedly connected with a support frame 503, and a dual-axis moving mechanism 6 is installed between the bottom end of the support frame 503 and the bottom end of the inner wall of the second chamber 104; When in use, the glass wafer 2 is pulled out from the storage frame 101 and turned 180 degrees through the transfer robot and adjustment component, and is placed on the placement table 402. The dual-axis moving mechanism 6 is controlled to drive the laser coder 501 to move through the support frame 503 and the mounting frame 502, and its position is adjusted to code the glass wafer 2 placed on the placement table 402.

[0020] A placing plate 403 is installed at the middle of the top of the placing table 402. A groove 405 is opened at the center of the placing plate 403. A hydraulic cylinder 406 is fixedly installed at the bottom of the inner wall of the groove 405. A top block 407 is fixedly connected to the output end of the hydraulic cylinder 406. It should be noted that the reference Figure 8 and attached Figure 5 The outer end of the lifting arm 306 is provided with a U-shaped opening structure, the diameter of which is larger than the diameter of the top block 407, and a vacuum suction cup 4 is installed on the top of the top block 407; When in use: through the transfer robot and the adjustment component, the glass wafer 2 is pulled out from the material storage frame 101 and turned 180 degrees, pushed through the channel 8 to extend horizontally into the first chamber 103, the glass wafer 2 is located above the top block 407, and is driven by the transfer robot to descend, and is placed on the top block 407 on the placement table 402, the vacuum suction cup 1 307 of the adjustment component is disconnected, the vacuum suction cup 4 is opened, the hydraulic cylinder 1 311 is controlled to pull the two groups of lifting arms 306 to move and drive the vacuum suction cup 1 307 to separate and pull out the glass wafer 2, the hydraulic cylinder 2 406 is controlled to drive the top block 407 to descend, the bottom surface of the glass wafer 2 is fitted with the top surface of the placement plate 403, the dual-axis moving mechanism 6 is controlled to drive the laser coder 501 to move through the support frame 503 and the mounting frame 502, and its position is adjusted to code the glass wafer 2 placed on the placement table 402; After the coding is completed, the second hydraulic cylinder 406 is controlled to push the top block 407 to drive the coded glass wafer 2 to rise, and the transfer robot is controlled to drive the lifting arm 306 to take it out and place it in the second storage frame 102.

[0021] The transfer robot comprises: an X-axis moving mechanism 301, the X-axis moving mechanism 301 is installed at the bottom end of the inner wall of the second chamber 104, the output end of the X-axis moving mechanism 301 is connected to a lifting cylinder 302, the output end of the lifting cylinder 302 is fixedly connected to a rotating motor 303, the rotating motor 303, the output end of the rotating motor 303 is fixedly connected to a manipulator base 308, the output end of the manipulator base 308 is connected to a manipulator arm 304, and the output end of the manipulator arm 304 is connected to a connecting frame 305; When in use, the X-axis moving mechanism 301 drives the lifting cylinder 302 to move forward and backward, the lifting cylinder 302 drives the rotating motor 303 to move up and down, the rotating motor 303 drives the manipulator base 308 and the manipulator arm 304 to rotate, and then the manipulator arm 304 drives the lifting arm 306 to move in a straight line in the horizontal direction; First, the X-axis moving mechanism 301 and the rotating motor 303 are controlled to drive the lifting arm 306 to be located in front of the material storage frame 101, and the lifting cylinder 302 is controlled to drive the lifting arm 306 to move up to the front of the glass wafer 2 to be taken out, so that the glass wafer 2 is located at the center point between the two groups of lifting arms 306, and the mechanical arm 304 is controlled to drive the lifting arm 306 to insert into the material storage frame 101 in a straight line, and the hydraulic cylinder 1 311 is controlled to drive the two groups of lifting arms 306 to move relative to each other to clamp the glass wafer 2, and at the same time, after it is adsorbed by the vacuum suction cup 1 307, the lifting cylinder 302 is controlled to drive the lifting arm 306 to lift the glass wafer 2 and separate it from the inner wall of the material storage frame 101; the mechanical arm 304 is controlled to shrink to take out the glass wafer 2, and the rotating motor 303 is controlled to drive the lifting arm 306 and the clamped and adsorbed glass wafer 2 to flip 180 degrees, and then the X-axis is controlled. The moving mechanism 301, the rotating motor 303, and the lifting cylinder 302 drive the lifting arm 306 to be located on one side of the channel 8, and the mechanical arm 304 is controlled to push it to extend. At this time, it is located above the top block 407. The lifting cylinder 302 is controlled to drive it to descend and place it on the top block 407 on the placement table 402. The vacuum suction cup 1 307 of the adjustment component is disconnected, and the vacuum suction cup 4 is opened. The hydraulic cylinder 1 311 is controlled to pull the two groups of lifting arms 306 to move and drive the vacuum suction cup 1 307 to separate from the glass wafer 2 and control the mechanical arm 304 to drive the lifting arm 306 to be pulled out. The hydraulic cylinder 2 406 is controlled to drive the top block 407 to descend, and the bottom surface of the glass wafer 2 is fitted with the top surface of the placement plate 403. The dual-axis moving mechanism 6 is controlled to drive the laser coder 501 to move through the support frame 503 and the mounting frame 502, and its position is adjusted to code the glass wafer 2 placed on the placement table 402; After the coding is completed, take it out and place it in the storage frame 102. Example

[0022] Reference Figure 1-6 , an adjustable semiconductor glass wafer back laser coding machine, a coding detection box is provided on the rear side of the inner wall of the second chamber 104, which is used to detect the coded glass wafer 2, and the coding detection box includes a box body 701, the box body 701 is fixedly installed on the rear side of the inner wall of the second chamber 104, a servo motor 702 is fixedly installed on the inner wall of the box body 701, the output end of the servo motor 702 is fixedly connected to a rotating shaft 703, the top of the rotating shaft 703 is fixedly connected to a placing seat 704, and a vacuum suction cup 2 706 is installed on the top of the placing seat 704; In the present invention, after the coding is completed, the glass wafer 2 after coding is taken out by the transfer robot and placed on the placement seat 704. The placement process is the same as the steps of placing on the top block 407. The glass wafer 2 is adsorbed by the vacuum suction cup 706 on the placement seat 704. The servo motor 702 is controlled to drive the placement seat 704 and the glass wafer 2 placed thereon to rotate through the rotating shaft 703, so that the coding position is located below the output end of the infrared detector 705, and the coding is scanned for inspection; After the inspection is completed, the transfer robot takes out the glass wafer 2 and places it in the second storage frame 102 .

[0023] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An adjustable semiconductor glass wafer backside laser coding machine, comprising a housing (1), characterized in that: The inner wall of the shell (1) is provided with two chambers, namely a first chamber (103) and a second chamber (104); a material storage frame 1 (101) and a material storage frame 2 (102) are installed on the left side of the inner wall of the second chamber (104); the inner walls of the material storage frame 1 (101) and the material storage frame 2 (102) both store glass wafers (2); a transfer robot for transferring the glass wafers (2) is provided in the second chamber (104); an output end of the transfer robot is connected to an adjustment component for clamping and adsorbing the glass wafers (2) and driving them to flip; A coding mechanism for coding the glass wafer (2) is installed in the first chamber (103); The bottom end of the coding mechanism is connected to a biaxial moving mechanism (6) for driving the coding mechanism to move for adjusting its position; The adjustment component comprises: a connecting frame (305), one end of the connecting frame (305) is connected to the output end of the transfer robot, a driving motor (309) is fixedly installed on one side of the connecting frame (305), the output end of the driving motor (309) passes through the connecting frame (305) and is fixedly connected to a U-shaped flip frame (310), and a lifting arm (306) is installed on the inner side of the U-shaped flip frame (310).

2. The adjustable semiconductor glass wafer back laser coder according to claim 1, characterized in that: The lifting arms (306) are provided with two groups, and vacuum suction cups 307 are installed on opposite sides of the two groups of lifting arms (306). Hydraulic cylinders 1 (311) are fixedly connected to both sides of the outer wall of the U-shaped flip frame (310). The output ends of the two groups of hydraulic cylinders 1 (311) extend into the U-shaped flip frame (310) and are respectively fixedly connected to the outer side of one of the two groups of lifting arms (306).

3. The adjustable semiconductor glass wafer backside laser coder according to claim 2, characterized in that: The transfer robot comprises an X-axis moving mechanism (301), wherein the X-axis moving mechanism (301) is installed at the bottom end of the inner wall of the second chamber (104), wherein the output end of the X-axis moving mechanism (301) is connected to a lifting cylinder (302), wherein the output end of the lifting cylinder (302) is fixedly connected to a rotating motor (303), wherein the rotating motor (303), wherein the output end of the rotating motor (303) is fixedly connected to a manipulator base (308), wherein the output end of the manipulator base (308) is connected to a manipulator arm (304), and the output end of the manipulator arm (304) is connected to a connecting frame (305).

4. The adjustable semiconductor glass wafer back laser coder according to claim 3, characterized in that: A coding inspection box is provided on the rear side of the inner wall of the second chamber (104) for inspecting the coded glass wafer (2).

5. The adjustable semiconductor glass wafer backside laser coder according to claim 3, characterized in that: The coding mechanism comprises: A placement table (402), wherein both sides of the bottom end of the placement table (402) are fixedly connected to a fixing frame (401), and the bottom end of the fixing frame (401) is fixedly connected to the bottom end of the inner wall of the second chamber (104); and A laser code marker (501), wherein the top end of the laser code marker (501) is fixedly connected to a mounting frame (502), the bottom end of the mounting frame (502) away from the laser code marker (501) is fixedly connected to a support frame (503), and the bottom end of the support frame (503) is connected to the output end of the dual-axis moving mechanism (6).

6. The adjustable semiconductor glass wafer backside laser coder according to claim 5, characterized in that: A placement plate (403) is installed at the middle of the top end of the placement table (402), and a groove (405) is provided at the center of the placement plate (403).

7. The adjustable semiconductor glass wafer backside laser coder according to claim 6, characterized in that: A second hydraulic cylinder (406) is fixedly mounted on the bottom end of the inner wall of the groove (405), and a top block (407) is fixedly connected to the output end of the second hydraulic cylinder (406).

8. The adjustable semiconductor glass wafer backside laser coder according to claim 4, characterized in that: The coding detection box comprises a box body (701), the box body (701) is fixedly mounted on the rear side of the inner wall of the second chamber (104), a servo motor (702) is fixedly mounted on the inner wall of the box body (701), an output end of the servo motor (702) is fixedly connected to a rotating shaft (703), a top end of the rotating shaft (703) is fixedly connected to a placement seat (704), and a second vacuum suction cup (706) is mounted on the top end of the placement seat (704).

9. A method for using an adjustable semiconductor glass wafer backside laser coder, applied to the adjustable semiconductor glass wafer backside laser coder according to claims 1-8, characterized in that: The specific steps are as follows: S1: controlling the transfer robot to drive the lifting arm (306) to move to the material storage frame 1 (101), and controlling the mechanical arm (304) of the transfer robot to drive the lifting arm (306) to extend and adsorb the glass wafer (2); S2: After adsorption, the lifting cylinder (302) is controlled to lift it up and then withdraw it. The adsorbed glass wafer (2) is turned 180 degrees by the adjustment component and then placed on the top of the placement plate (403) by the transfer robot. The laser coder (501) is adjusted to a position by the dual-axis moving mechanism (6) to code the back of the glass wafer (2).

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