External energy field synergistic chemical mechanical planarization equipment

By designing a device that integrates ultrasonic, electrochemical and mechanical polishing functions, the problem of difficulty in achieving efficient material removal and surface quality improvement in the prior art is solved, and an automated polishing process is realized, which improves efficiency and quality.

CN119772747AActive Publication Date: 2025-04-08NANCHANG UNIV
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Patent Information

Application Number
CN202411844254.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2025-04-08
Estimated Expiration
2044-12-16

AI Technical Summary

Technical Problem

The existing ultrasonic chemical mechanical polishing technology and electrochemical mechanical polishing technology are difficult to achieve efficient material removal rate and surface quality improvement at the same time, and there is a lack of equipment that can coordinate ultrasonic vibration, current voltage, polishing head and polishing disc rotation and other functions.

Method used

An external energy field collaborative chemical mechanical planarization equipment is designed, including a screw rack, servo screw device, electrochemical device, peristaltic pump, ultrasonic generator and control box, which can realize the automatic loading, rotation, polishing liquid supply, waste liquid collection, and automatic adjustment functions of the polishing head and polishing disk, and can set the polishing process parameters by themselves.

Benefits of technology

This equipment can realize the automated operation of ultrasonic electrochemical mechanical polishing technology, improve polishing efficiency and surface quality, and meet the multiple functional needs of research experiments.

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Abstract

The invention discloses external energy field synergistic chemical mechanical planarization equipment, and relates to the technical field of polishing, the external energy field synergistic chemical mechanical planarization equipment comprises a lead screw rack, a servo lead screw device is vertically arranged on the lead screw rack, the servo lead screw device and the lead screw rack are in a cross connection structure, a polishing head device is arranged on the servo lead screw device, and a polishing head is arranged on the polishing head device. The servo lead screw device can drive the polishing head device to move in the horizontal direction and the vertical direction, a workpiece to be machined is arranged on the polishing head device, a polishing disc rack is arranged below the polishing head device, a polishing disc device is arranged on the polishing disc rack, and the polishing disc device is arranged below the polishing head device. The ultrasonic polishing machine further comprises an electrochemical device, a peristaltic pump, an ultrasonic generator and a control box, the ultrasonic polishing machine can provide the functions of ultrasonic vibration, current and voltage, rotation of the polishing head and the polishing disc, automatic loading of the polishing head, collection of polishing pressure and friction force, polishing liquid supply, waste liquid collection and automatic adjustment of the polishing head, polishing process parameters can be automatically set, and the ultrasonic polishing machine can automatically run.
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Description

Technical Field

[0001] The invention relates to the technical field of polishing, in particular to an external energy field coordinated chemical mechanical planarization device. Background Art

[0002] Ultrasonic chemical mechanical polishing technology and electrochemical mechanical polishing technology can greatly improve the material removal rate of wafers, and the surface quality can be improved to varying degrees. Therefore, both ultrasonic and electrical factors can be introduced at the same time to study ultrasonic electrochemical mechanical polishing technology. In order to realize the research of ultrasonic electrochemical mechanical polishing technology, a special external energy field coordinated chemical mechanical planarization equipment is required. Summary of the invention

[0003] In response to the above needs, the present invention provides an external energy field coordinated chemical mechanical planarization device to meet the ultrasonic vibration, current and voltage, rotation of the polishing head and polishing disk, automatic loading of the polishing head, collection of polishing pressure and friction force, polishing liquid supply, waste liquid collection, and automatic adjustment of the polishing head required for research experiments. It can also set the polishing process parameters by itself, and the equipment can run automatically.

[0004] The above-mentioned optimized structure of the present invention is realized by the following technical scheme: an external energy field coordinated chemical mechanical flattening device, comprising a screw rack, a servo screw device is vertically arranged on the screw rack, the servo screw device and the screw rack are in a cross connection structure, a polishing head device is arranged on the servo screw device, the servo screw device can drive the polishing head device to move in the horizontal and vertical directions, a workpiece to be processed is arranged on the polishing head device, a polishing disk rack is arranged below the polishing head device, a polishing disk device is arranged on the polishing disk rack, and the polishing disk device is arranged below the polishing head device; It also includes an electrochemical device, a peristaltic pump, an ultrasonic generator, and a control box. The electrochemical device can apply an electric field to the workpiece to be processed, the peristaltic pump can transport polishing liquid to the polishing disc device, the ultrasonic generator can drive the workpiece to be processed to vibrate, and the control box is electrically connected to the servo screw device, the polishing head device, the polishing disc device, and the ultrasonic generator.

[0005] In some embodiments, the servo screw device includes a screw rack, a vertical servo motor, a vertical screw assembly, a screw connecting plate, a horizontal screw assembly support foot, a horizontal servo motor, and a horizontal screw assembly. The vertical screw assembly is arranged in parallel on the screw rack, a vertical servo motor is arranged on the top of the vertical screw assembly, the screw connecting plate is arranged on the vertical screw assembly, the horizontal screw assembly is arranged on the screw connecting plate, the horizontal servo motor is arranged at one end of the horizontal screw assembly, the polishing head device is arranged on the side of the horizontal screw assembly away from the screw connecting plate, and a plurality of horizontal screw assembly support feet are arranged between the horizontal screw assembly and the screw connecting plate.

[0006] In some embodiments, the servo screw device also includes three vertical photoelectric sensors and three horizontal photoelectric sensors. The three vertical photoelectric sensors are arranged on one side of the vertical screw assembly, and the three horizontal photoelectric sensors are arranged on the top of the horizontal screw assembly.

[0007] In some embodiments, the servo screw device further includes a guide rail connecting plate, a guide rail, and a slider; The screw rod connecting plate is symmetrically provided with two guide rail connecting plates, the guide rail is fixed to the guide rail connecting plate by threaded connection, the slider is slidably matched with the guide rail, and the polishing head device is connected between the two sliders.

[0008] In some embodiments, the polishing head device includes a sensor connecting plate, a small pulley, a polishing head servo motor, a balancing element, a hexagon socket bolt, a spring, an ultrasonic transducer, a vibrator holder, a rotating shaft, a bearing seat, a bearing end cover, a three-dimensional pressure sensor, a belt, a large pulley, a conductive slip ring, and a conductive slip ring seat; The sensor connecting plate is fixed on the horizontal screw rod assembly, the polishing head servo motor is fixed on the lower right side of the sensor connecting plate, the small pulley is fixed on the output end of the polishing head servo motor, the conductive slip ring seat is fixed on the sensor connecting plate, the conductive slip ring is located below the conductive slip ring seat, the three-dimensional pressure sensor is located at the lower left side of the sensor connecting plate, the bearing end cover is fixed below the three-dimensional pressure sensor, the bearing seat is fixed below the bearing end cover, the rotating shaft passes through the bearing end cover, the bearing seat and the sensor connecting plate, the large pulley is fixed The invention relates to a method for producing a balancing device for producing a ultrasonic transducer. The balancing device is fixed at the top of the rotating shaft, the belt is located in the grooves of the small pulley and the large pulley, the balancing element is fixed at the bottom of the rotating shaft, the vibrator clamp is located at the bottom of the balancing element, a plurality of the hexagon socket bolts penetrate the balancing element and are fixed at the top of the vibrator clamp, the spring is sleeved on the hexagon socket bolts, the two ends of the spring are respectively connected with the vibrator clamp and the bottom of the balancing element, the ultrasonic transducer is fixed at the bottom of the vibrator clamp and is electrically connected with the conductive slip ring, a clamping assembly is provided at the bottom of the ultrasonic transducer, and the clamping assembly clamps the workpiece to be processed.

[0009] In some embodiments, the clamping assembly includes a spring ejector plate, clamp No. 1, and clamp No. 2. Clamp No. 2 is fixed to the bottom of the ultrasonic transducer by AB glue, clamp No. 1 is fixed to one side of clamp No. 2 and is located below the ultrasonic transducer, the spring ejector is installed in the hole of clamp No. 2, and the spring ejector plate is fixed above clamp No. 2.

[0010] In some embodiments, a tapered roller bearing is coaxially disposed in the bearing seat, the tapered roller bearing is coaxially disposed with the rotating shaft, a bearing end cover is disposed on the bearing seat, and the rotating shaft is penetrated by the bearing end cover.

[0011] In some embodiments, the rotating shaft is a hollow structure, a threading hole is provided at the bottom of the rotating shaft, the conductive slip ring is connected to an electric wire, one end of the electric wire passes through the rotating shaft and then out of the threading hole and is connected to the ultrasonic transducer.

[0012] In some embodiments, a groove is provided at the upper end of the vibrator holder, a joint bearing is provided in the groove, a connecting shaft is coaxially provided in the joint bearing, and the connecting shaft is plug-fitted with the rotating shaft.

[0013] In some embodiments, the polishing disk device includes a polishing disk, a guide tube rack, a polishing disk servo motor, a waste liquid tank, a hollow rotating platform, and a connecting disk. The hollow rotating platform and the polishing disk servo motor are arranged on the polishing disk frame, the connecting disk is fixed above the hollow rotating platform, the polishing disk is fixed above the connecting disk and is connected to the polishing disk servo motor, the waste liquid tank is located above the polishing disk frame and below the polishing disk, the guide tube rack is located above the waste liquid tank, and the liquid outlet of the guide tube rack is arranged above the polishing disk, and the peristaltic pump is connected to the side of the guide tube rack away from the polishing disk.

[0014] One or more of the above technical solutions in the embodiments of the present invention have at least the following technical effects or advantages: The present invention can provide ultrasonic vibration, current and voltage, rotation of the polishing head and polishing disk, automatic loading of the polishing head, collection of polishing pressure and friction force, supply of polishing liquid, collection of waste liquid, and automatic adjustment of the polishing head, and can set polishing process parameters by itself, and the equipment runs automatically. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the architecture of the present invention; Figure 2 It is a structural schematic diagram of the servo screw device of the present invention; Figure 3 It is a schematic structural diagram of the polishing head device of the present invention; Figure 4 It is a schematic diagram of the connection between the rotating shaft and the bearing seat of the present invention; Figure 5 is a schematic structural diagram of the clamping assembly of the present invention; Figure 6 is a partial cross-sectional view of the clamping assembly of the present invention; Figure 7 It is a schematic diagram of the connection between the vibrator holder and the connecting shaft of the present invention; Figure 8 It is a schematic structural diagram of the polishing disc device of the present invention; Fig. 9 It is a schematic diagram of the connection between the connecting disc and the polishing disc frame of the present invention.

[0017] In the figure: 1, servo screw device; 2, polishing head device; 3, polishing disc device; 4, electrochemical device; 5, ultrasonic generator; 6, peristaltic pump; 7, polishing disc rack; 8, screw rack; 9, control box; 101, vertical servo motor; 102, vertical photoelectric sensor; 103, vertical screw assembly; 104, screw connecting plate; 105, guide rail connecting plate, 106, guide rail, 107, slider, 108, horizontal screw assembly support foot; 109, horizontal servo motor; 110, horizontal screw assembly; 111, horizontal photoelectric sensor; 201, sensor connecting plate; 202, small pulley; 203, polishing head servo motor; 204, balance Component; 205, hexagon socket bolt; 206, spring; 207, ultrasonic transducer; 208, vibrator clamp; 209, rotating shaft; 210, bearing seat; 211, bearing end cover; 212, three-dimensional pressure sensor; 213, belt; 214, large pulley; 215, conductive slip ring; 216, conductive slip ring seat; 217, tapered roller bearing; 218, spring thimble pressure plate; 219, fixture No. 1; 220, fixture No. 2; 221, spring thimble; 222, spherical bearing; 223, connecting shaft; 31, polishing disk; 32, catheter rack; 33, polishing disk servo motor; 34, waste liquid tank; 35, hollow rotating platform; 36, connecting disk. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0019] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] refer to Figure 1-9 , an external energy field coordinated chemical mechanical flattening device, the device includes a polishing head device 2, a polishing disc device 3, a servo screw device 1, an electrochemical device 4, an ultrasonic generator 5, a peristaltic pump 6, and a control box 9. The servo screw device 1 is connected to the screw rack 8 in a cross structure and installed vertically and horizontally. The polishing head device 2 is arranged on the servo screw device 1 and is driven by the servo screw device 1 to move up, down, left, and right. The polishing disc device 3 is arranged on the polishing disc rack 7 and is located below the polishing head device 2. The peristaltic pump 6, the electrochemical device 4 and the ultrasonic generator 5 are all placed on the right side of the polishing disc device 3. The control box 9 is placed behind the servo screw device 1. The electrochemical device 4 can apply an electric field to the workpiece to be processed, the peristaltic pump 6 can transport polishing liquid to the polishing disc device 3, and the ultrasonic generator can drive the workpiece to be processed to vibrate. The control box 9 is electrically connected to the servo screw device 1, the polishing head device 2, the polishing disc device 3, and the ultrasonic generator 5. Through the control box 9, power is provided for the operation of the equipment, and control parameters can be input through the control box 9 to realize ultrasonic electrochemical mechanical polishing of the workpiece to be processed.

[0023] In some embodiments, the servo screw device 1 includes a screw frame 8, a vertical servo motor 101, a vertical screw assembly 103, a screw connecting plate 104, a horizontal screw assembly support foot 108, a horizontal servo motor 109, and a horizontal screw assembly 110. The vertical screw assembly 103 is arranged in parallel on the screw frame 8. A vertical servo motor 101 is provided on the top of the vertical screw assembly 103. A screw connecting plate 104 is provided on the vertical screw assembly 103, which can be fixed by a bolt assembly. The vertical screw assembly 103 may include a vertical screw, a vertical frame and other structures. The vertical screw is connected to the vertical servo motor 101, and a screw connecting plate 104 is provided on the vertical screw. The vertical servo motor 101 rotates to drive the vertical screw to rotate, so that the screw connecting plate 104 slides in the vertical direction. This is a prior art and will not be repeated here. A horizontal screw assembly 110 is provided on the screw connecting plate 104 and can be fixed by a bolt assembly. A horizontal servo motor 109 is provided at one end of the horizontal screw assembly 110. A polishing head device 2 is provided on the side of the horizontal screw assembly 110 away from the screw connecting plate 104. A plurality of horizontal screw assembly supporting feet 108 are provided between the horizontal screw assembly 110 and the screw connecting plate 104. There can be four horizontal screw assembly supporting feet 108, which can be symmetrically arranged to strengthen the connection strength between the horizontal screw assembly 110 and the screw connecting plate 104 and ensure the stability of the horizontal screw assembly 110 during movement. The horizontal screw assembly 110 is similar in structure to the vertical screw assembly 103 and is also a prior art, which will not be repeated here.

[0024] In some embodiments, the servo screw device 1 also includes three vertical photoelectric sensors 102 and three horizontal photoelectric sensors 111. The three vertical photoelectric sensors 102 are arranged on one side of the vertical screw assembly 103, and the three horizontal photoelectric sensors 111 are arranged on the top of the horizontal screw assembly 110. Through the vertical photoelectric sensors 102 and the horizontal photoelectric sensors 111, the moving speed and moving position of the screw connecting plate 104 and the polishing head device 2 can be controlled.

[0025] In some embodiments, the servo screw device 1 also includes a guide rail connecting plate 105, a guide rail 106, and a slider 107; two guide rail connecting plates 105 are symmetrically arranged on the screw connecting plate 104, the guide rail 106 is fixed to the guide rail connecting plate 105 by a threaded connection, the slider 107 slides with the guide rail 106, and a polishing head device 2 is connected between the two sliders 107. Through the sliding cooperation between the two sliders 107 and the guide rail 106, support can be provided when the polishing head device 2 moves, thereby improving the stability of the movement of the polishing head device 2.

[0026] In some embodiments, the polishing head device 2 includes a sensor connecting plate 201, a small pulley 202, a polishing head servo motor 203, a balancing element 204, a hexagon socket bolt 205, a spring 206, an ultrasonic transducer 207, a vibrator clamp 208, a rotating shaft 209, a bearing seat 210, a bearing end cover 211, a three-dimensional pressure sensor 212, a belt 213, a large pulley 214, a conductive slip ring 215, and a conductive slip ring seat 216.

[0027] The sensor connecting plate 201 is fixed on the horizontal screw assembly 110, so that the polishing head device 2 can be moved and adjusted in the horizontal direction. The polishing head servo motor 203 is fixed at the lower right of the sensor connecting plate 201. The small pulley 202 is fixed to the output end of the polishing head servo motor 203 through a key connection. The conductive slip ring seat 216 is fixed on the sensor connecting plate 201, and the conductive slip ring 215 is located below the conductive slip ring seat 216. The three-dimensional pressure sensor 212 is located at the lower left of the sensor connecting plate 201. The bearing end cover 211 is fixed below the three-dimensional pressure sensor 212. The bearing seat 210 is fixed below the bearing end cover 211. The rotating shaft 209 passes through the bearing end cover 211, the bearing seat 210 and the sensor connecting plate 201, which can provide a stable rotation axis. The large pulley 214 is fixed on the top of the rotating shaft 209, and the belt 213 is located in the grooves of the small pulley 202 and the large pulley 214, thereby realizing the power transmission from the polishing head servo motor 203 to the rotating shaft 209. By controlling the rotation speed of the polishing head servo motor 203, the rotation speed of the rotating shaft 209 is controlled to meet different polishing requirements.

[0028] The balancing element 204 is fixed below the rotating shaft 209, and the vibrator clamp 208 is located below the balancing element 204. A plurality of hexagon socket bolts 205 penetrate the balancing element 204 and are fixed above the vibrator clamp 208. A spring 206 is sleeved on the hexagon socket bolts 205. The two ends of the spring 206 are respectively connected to the vibrator clamp 208 and the bottom of the balancing element 204. The vibrator clamp 208 can automatically adjust its posture during the polishing process through the spring 206, ensuring that the ultrasonic transducer 207 and the polishing disc 31 are tightly and flatly fitted, thereby realizing the automatic adjustment function of the polishing head device 2. The ultrasonic transducer 207 is fixed below the vibrator clamp 208 and is electrically connected to the conductive slip ring 215. A clamping assembly is provided below the ultrasonic transducer 207, and the clamping assembly clamps the workpiece to be processed so that it can be polished under the action of the ultrasonic transducer 207.

[0029] The positive and negative electrodes of the ultrasonic transducer 207 can be connected to the positive and negative electrodes of the ultrasonic generator 5 through the conductive slip ring 215, thereby establishing a channel for power transmission, so that the ultrasonic generator 5 can provide the required power to the ultrasonic transducer 207, thereby driving it to generate ultrasonic vibration.

[0030] The ultrasonic energy field is generated by the ultrasonic transducer 207 under the drive of the ultrasonic generator 5. The ultrasonic generator 5 is an external device. By changing different types of ultrasonic vibrators and adjusting the power and frequency of the ultrasonic generator 5 accordingly, the system can flexibly provide ultrasonic energy fields of different powers and frequencies. This adjustability enables the ultrasonic polishing process to be optimized according to the material and polishing requirements of the workpiece.

[0031] It is worth noting that the operation of the ultrasonic generator, as an independent external device, is not directly controlled by the control box 9. Therefore, during the experiment, the ultrasonic generator needs to be operated separately to achieve the required ultrasonic vibration parameter settings.

[0032] The three-dimensional pressure sensor 212 can collect the force conditions of the workpiece to be processed in the three directions of X, Y, and Z in real time. The Z direction is the vertical direction, and X and Y are the horizontal directions. The data is fed back to the control box 9. The force in the Z direction measures the loading pressure. The control box 9 controls the rise and fall of the vertical screw assembly 103 by comparing the Z direction force with the input required force value to control the magnitude of the force, thereby realizing the automatic loading of the workpiece to be processed. X and Y are the forces measured in the horizontal direction. The force measured in the Y direction is removed due to the tension of the pulley, and the resultant force of the force measured in the X direction is the friction force, thereby realizing the collection of friction force. The friction coefficient can be calculated by the values ​​of friction force and load to obtain the friction curve.

[0033] In some embodiments, the clamping assembly includes a spring ejector plate 218, a clamp No. 1 219, a clamp No. 220, and a spring ejector 221. The clamp No. 220 is fixed to the bottom of the ultrasonic transducer 207 by AB glue, the clamp No. 1 219 is fixed to one side of the clamp No. 2 220 and is located below the ultrasonic transducer 207, the spring ejector 221 is installed in the hole of the clamp No. 2 220, and the spring ejector plate 218 is fixed above the clamp No. 2 220. After the workpiece is installed in the circular groove below the clamp No. 2 220, the clamp No. 1 219 presses the workpiece tightly into the clamp No. 2 220 through three hexagon socket bolts.

[0034] In some embodiments, a tapered roller bearing 217 is coaxially disposed in the bearing seat 210. The two tapered roller bearings 217 can withstand a large radial load and a certain axial load, and can withstand both the large radial load required during the polishing process and the axial friction generated during the polishing process. The tapered roller bearing 217 is coaxially disposed with a rotating shaft 209, and a bearing end cover 211 is disposed on the bearing seat 210, and the bearing end cover 211 is penetrated by a rotating shaft 209.

[0035] In some embodiments, the rotating shaft 209 is a hollow structure, a threading hole is provided at the bottom of the rotating shaft 209, and the conductive slip ring 215 is connected to an electric wire. One end of the electric wire passes through the rotating shaft 209 and then passes through the threading hole and is connected to the ultrasonic transducer 207 to provide electrical energy. A groove is provided at the upper end of the vibrator clamp 208, a joint bearing 222 is provided in the groove, a connecting shaft 223 is coaxially provided in the joint bearing 222, and the connecting shaft 223 is plugged into the rotating shaft 209.

[0036] In some embodiments, the polishing disk device 3 includes a polishing disk 31, a guide tube frame 32, a polishing disk servo motor 33, a waste liquid pool 34, a hollow rotating platform 35, and a connecting disk 36. The hollow rotating platform 35 and the polishing disk servo motor 33 are arranged on the polishing disk frame 7. The connecting disk 36 is fixed above the hollow rotating platform 35. The polishing disk 31 is fixed above the connecting disk 36 and is connected to the polishing disk servo motor 33. The waste liquid pool 34 is located above the polishing disk frame 7 and below the polishing disk 31. The guide tube frame 32 is located above the waste liquid pool 34, and the liquid outlet of the guide tube frame 32 is located above the polishing disk 31. The guide tube frame 32 is connected to a peristaltic pump 6 on the side away from the polishing disk 31, and the peristaltic pump 6 is used to continuously provide polishing liquid or deionized water.

[0037] The electrochemical device 4 can apply electric fields of different strengths to the workpiece to be processed. Specifically, the positive electrode of the electrochemical device 4 supports the tail of the spring ejector 221 through the conductive slip ring 215 and the cylindrical protrusion under the spring ejector plate 218, and the spring ejector 221 is pressed tightly in the hole of the clamp No. 2 220. The front end of the spring ejector 221 can shrink when the force is applied, which can ensure that the front end of the spring ejector 221 is in direct contact with the workpiece to be processed. When the workpiece is installed, the negative electrode of the electrochemical device 4 and the reference electrode are directly inserted into the waste liquid tank 34 from the outside. During the polishing process, there will always be polishing liquid on the polishing disc 31, so that the current flows from the positive electrode through the workpiece to be processed and the polishing liquid to the negative electrode, and the electric field is applied. During the experiment, the electrochemical device 4 can provide electric fields of different strengths by setting the applied voltage value, etc., and can measure the changes in current and potential to obtain the electrochemical properties of the material. The electrochemical device 4 is external, and the control box 9 cannot be directly controlled. The electrochemical device 4 needs to be operated separately during the experiment.

[0038] The specific working principle is as follows: When in use, the parameters such as rotation speed, polishing liquid flow rate, polishing pressure, horizontal screw moving distance, manual and automatic movement of the mechanism are input into the control box 9. In addition, the automatic loading program can be set. The automatic loading program can be set to load in three stages, and the required pressure can be loaded in stages to play the function of automatic loading. After the polishing is completed, the polishing will be automatically ended to realize the automatic operation of the equipment polishing. Through the clamp No. 1 219 and the clamp No. 2 220, the workpiece to be processed is clamped at the bottom of the clamping assembly.

[0039] Under the control of the control box 9 , the servo screw device 1 moves the workpiece to be processed to a set position and contacts the polishing disc 31 through the joint action of the vertical screw assembly 103 and the horizontal screw assembly 110 .

[0040] During this process, the polishing disk 31 rotates at a set speed under the action of the polishing disk servo motor 33. During the rotation of the polishing disk 31, the peristaltic pump 6 continuously sprays polishing liquid or deionized water onto the polishing disk 31. The workpiece to be processed contacts the polishing disk 31 for polishing. The polishing liquid that flows out or is thrown out during the polishing process will be collected in the waste liquid pool 34 and finally flow into the waste liquid collection barrel through a pipe.

[0041] At the same time, the positive electrode of the electrochemical device 4 is connected to the tail of the spring ejector pin below the spring ejector pin pressure plate 218 through the conductive slip ring 215, and the front end of the spring ejector pin is in direct contact with the workpiece to be processed. The negative electrode of the electrochemical device 4 and the reference electrode are directly inserted into the waste liquid pool 34 from the outside. During the polishing process, there will always be polishing liquid on the polishing disk 31, so that the current flows from the positive electrode through the workpiece to be processed and the polishing liquid to the negative electrode, thereby realizing the application of the electric field.

[0042] During the polishing process, the force acting on the workpiece to be processed will be transmitted to the three-dimensional pressure sensor 212, which collects the force conditions of the workpiece to be processed in the three directions of X, Y, and Z, and feeds back the data to the control box 9. The control box 9 controls the rise and fall of the vertical screw assembly 103 to control the magnitude of the force by comparing the Z-direction force with the input required force value, thereby realizing automatic loading of the workpiece to be processed.

[0043] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An external energy field synergistic chemical mechanical planarization device, characterized in that: The invention comprises a screw rod frame (8), a servo screw rod device (1) is vertically arranged on the screw rod frame (8), the servo screw rod device (1) and the screw rod frame (8) are in a cross-connected structure, a polishing head device (2) is arranged on the servo screw rod device (1), the servo screw rod device (1) can drive the polishing head device (2) to move in the horizontal and vertical directions, a workpiece to be processed is arranged on the polishing head device (2), a polishing disc frame (7) is arranged below the polishing head device (2), a polishing disc device (3) is arranged on the polishing disc frame (7), and the polishing disc device (3) is arranged below the polishing head device (2); The invention also comprises an electrochemical device (4), a peristaltic pump (6), an ultrasonic generator (5), and a control box (9); the electrochemical device (4) can apply an electric field to a workpiece to be processed; the peristaltic pump (6) can deliver polishing liquid to the polishing disc device (3); the ultrasonic generator (5) can drive the workpiece to be processed to vibrate; and the control box (9) is electrically connected to the servo screw device (1), the polishing head device (2), the polishing disc device (3), and the ultrasonic generator (5).

2. The external energy field synergistic chemical mechanical planarization device according to claim 1, characterized in that: The servo screw device (1) comprises a screw rack (8), a vertical servo motor (101), a vertical screw assembly (103), a screw connecting plate (104), a horizontal screw assembly supporting foot (108), a horizontal servo motor (109), and a horizontal screw assembly (110); the vertical screw assembly (103) is arranged in parallel on the screw rack (8); the vertical servo motor (101) is arranged on the top of the vertical screw assembly (103); the screw connecting plate (104) is arranged on the vertical screw assembly (103); the horizontal screw assembly (110) is arranged on the screw connecting plate (104); one end of the horizontal screw assembly (110) is arranged with the horizontal servo motor (109); the polishing head device (2) is arranged on the side of the horizontal screw assembly (110) away from the screw connecting plate (104); and a plurality of horizontal screw assembly supporting feet (108) are arranged between the horizontal screw assembly (110) and the screw connecting plate (104).

3. The external energy field synergistic chemical mechanical planarization device according to claim 2, characterized in that: The servo screw device (1) further comprises three vertical photoelectric sensors (102) and three horizontal photoelectric sensors (111), wherein the three vertical photoelectric sensors (102) are arranged on one side of the vertical screw assembly (103), and the three horizontal photoelectric sensors (111) are arranged on the top of the horizontal screw assembly (110).

4. The external energy field synergistic chemical mechanical planarization device according to claim 2, characterized in that: The servo screw device (1) further comprises a guide rail connecting plate (105), a guide rail (106), and a sliding block (107); Two guide rail connecting plates (105) are symmetrically arranged on the screw rod connecting plate (104); the guide rail (106) is fixed to the guide rail connecting plate (105) by threaded connection; the slider (107) is slidably matched with the guide rail (106); and the polishing head device (2) is connected between the two sliders (107).

5. The external energy field synergistic chemical mechanical planarization device according to claim 1, characterized in that: The polishing head device (2) comprises a sensor connecting plate (201), a small pulley (202), a polishing head servo motor (203), a balancing element (204), a hexagon socket bolt (205), a spring (206), an ultrasonic transducer (207), a vibrator clamp (208), a rotating shaft (209), a bearing seat (210), a bearing end cover (211), a three-dimensional pressure sensor (212), a belt (213), a large pulley (214), a conductive slip ring (215), and a conductive slip ring seat (216); The sensor connecting plate (201) is fixed on the horizontal screw assembly (110); the polishing head servo motor (203) is fixed to the lower right of the sensor connecting plate (201); the small pulley (202) is fixed to the output end of the polishing head servo motor (203); the conductive slip ring seat (216) is fixed to the sensor connecting plate (201); the conductive slip ring (215) is located below the conductive slip ring seat (216); the three-dimensional pressure sensor (212) is located at the lower left of the sensor connecting plate (201); the bearing end cover (211) is fixed below the three-dimensional pressure sensor (212); the bearing seat (210) is fixed below the bearing end cover (211); the rotating shaft (209) passes through the bearing end cover (211), the bearing seat (210) and the sensor connecting plate (201); the large pulley (21 4) is fixed on the top of the rotating shaft (209), the belt (213) is located in the grooves of the small pulley (202) and the large pulley (214), the balancing element (204) is fixed below the rotating shaft (209), the vibrator clamp (208) is located below the balancing element (204), a plurality of hexagon socket bolts (205) penetrate the balancing element (204) and are fixed above the vibrator clamp (208), the spring (206) is sleeved on the hexagon socket bolts (205), the two ends of the spring (206) are respectively connected to the vibrator clamp (208) and the bottom of the balancing element (204), the ultrasonic transducer (207) is fixed below the vibrator clamp (208) and is electrically connected to the conductive slip ring (215), and a clamping assembly is provided below the ultrasonic transducer (207), and the clamping assembly clamps the workpiece to be processed.

6. The external energy field synergistic chemical mechanical planarization device according to claim 5, characterized in that: The clamping assembly comprises a spring ejector plate (218), a clamp No. 1 (219), a clamp No. 2 (220), and a spring ejector (221); the clamp No. 2 (220) is fixed below the ultrasonic transducer (207); the clamp No. 1 (219) is fixed on one side of the clamp No. 2 (220) and is located below the ultrasonic transducer (207); the spring ejector (221) is installed in a hole of the clamp No. 2 (220); and the spring ejector plate (218) is fixed above the clamp No. 2 (220).

7. The external energy field synergistic chemical mechanical planarization device according to claim 5, characterized in that: A tapered roller bearing (217) is coaxially disposed in the bearing seat (210), the tapered roller bearing (217) is coaxially disposed with the rotating shaft (209), a bearing end cover (211) is disposed on the bearing seat (210), and the rotating shaft (209) is penetrated by the bearing end cover (211).

8. The external energy field synergistic chemical mechanical planarization device according to claim 5, characterized in that: The rotating shaft (209) is a hollow structure. A threading hole is provided at the bottom of the rotating shaft (209). The conductive slip ring (215) is connected to an electric wire. One end of the electric wire passes through the rotating shaft (209) and then passes through the threading hole to be connected to the ultrasonic transducer (207).

9. The external energy field synergistic chemical mechanical planarization device according to claim 5, characterized in that: The upper end of the vibrator holder (208) is provided with a groove, a joint bearing (222) is provided in the groove, a connecting shaft (223) is coaxially provided in the joint bearing (222), and the connecting shaft (223) is plug-fitted with the rotating shaft (209).

10. The external energy field synergistic chemical mechanical planarization device according to claim 1, characterized in that: The polishing disc device (3) comprises a polishing disc (31), a guide tube frame (32), a polishing disc servo motor (33), a waste liquid pool (34), a hollow rotating platform (35), and a connecting disc (36); the hollow rotating platform (35) and the polishing disc servo motor (33) are arranged on the polishing disc frame (7); the connecting disc (36) is fixed above the hollow rotating platform (35); the polishing disc (31) is fixed above the connecting disc (36) and is connected to the polishing disc servo motor (33); the waste liquid pool (34) is located above the polishing disc frame (7) and below the polishing disc (31); the guide tube frame (32) is located above the waste liquid pool (34); and a liquid outlet of the guide tube frame (32) is arranged above the polishing disc (31); and the peristaltic pump (6) is connected to the side of the guide tube frame (32) away from the polishing disc (31).

Citation Information

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