A film backplane integrated material and its preparation method and application

Abstract

The present invention relates to an integrated adhesive film backplane material and a preparation method and application thereof. The integrated adhesive film backplane material comprises a hardening coating, a transparent heat-resistant layer and a functional adhesive film layer. The integrated adhesive film backplane material provided by the present invention has good heat resistance, friction resistance and water vapor barrier resistance, so it can be well applied to lightweight components. At the same time, it also has the characteristics of integrated adhesive film backplane, can be directly pressed with battery cells for use, simplifies the stacking steps, increases the stability of the lamination process, not only increases the production yield, reduces the finished product explosion rate, but also improves the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic modules, and in particular to an adhesive film backplane integrated material and a preparation method and application thereof. Background Art

[0002] With the improvement of people's environmental awareness and the society's emphasis on renewable energy, solar power generation has developed rapidly as an environmentally friendly energy source. The conventional solar cell single-glass photovoltaic module structure is glass / film / cell / film / backplane, but due to the use of glass, it still has the problem of being too heavy to meet the lightweight requirements, and its toughness is poor and not easy to bend. In addition, solar photovoltaic cells are easily affected by natural factors such as heat, light, oxygen, and moisture during use, resulting in a decrease in photoelectric conversion efficiency or even failure, which brings considerable challenges to the application of photovoltaic modules.

[0003] Based on the low-density characteristics of polymer materials, lightweight components generally use polymer materials instead of glass materials for component packaging; while reducing the weight of the components, the long-term reliability of the components must still be met, so there are higher requirements for the selection of packaging materials and packaging structure solutions for lightweight components; while the components are lightweight, the packaging materials need to have long-term weather resistance, especially in terms of heat resistance, friction resistance and water vapor barrier resistance.

[0004] Therefore, it is of great significance to design and develop an integrated film backplane material for lightweight components that has the characteristics of heat resistance, wear resistance and water vapor barrier resistance. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides an adhesive film backplane integrated material and its preparation method and application. The adhesive film backplane integrated material has good heat resistance, friction resistance and water vapor barrier resistance, and can be directly pressed with the battery cell, with simple packaging process and high production efficiency.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides an adhesive film and backplane integrated material, wherein the adhesive film and backplane integrated material comprises a hardening coating layer, a transparent heat-resistant layer and a functional adhesive film layer.

[0008] The present invention makes the obtained adhesive film backplane integrated material have good heat resistance, friction resistance and water vapor barrier performance through the combination of hardening coating, transparent heat-resistant layer and functional adhesive film layer, so that it can be well applied to lightweight components. At the same time, the adhesive film backplane integrated material has the characteristics of adhesive film backplane integration, can be directly pressed with battery cells for use, simplifies the stacking steps, increases the stability of the lamination process, not only increases the production yield, reduces the finished product explosion rate, but also improves production efficiency.

[0009] Preferably, the transparent heat-resistant layer comprises the following raw material components in parts by weight:

[0010] Polyethylene resin 30-90 parts by weight Thermoplastic resin 10-70 parts by weight 0.5-3 parts by weight of anti-aging agent.

[0011] In the present invention, the content of polyethylene resin is 30-90 parts by weight, for example, it can be 30 parts by weight, 40 parts by weight, 50 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight or 90 parts by weight.

[0012] When the content of polyethylene resin in the transparent heat-resistant layer of the present invention is 30-90 parts by weight, it can make the obtained film backplane integrated material have better water vapor barrier resistance and heat resistance. When its content is too low, the processing is difficult. When its content is too high, its water vapor barrier resistance and heat resistance are poor.

[0013] The content of the thermoplastic resin is 10-70 parts by weight, for example, 10 parts by weight, 20 parts by weight, 30 parts by weight, 40 parts by weight, 50 parts by weight, 60 parts by weight or 70 parts by weight.

[0014] The content of the anti-aging agent is 0.5-3 parts by weight, for example, it can be 0.5 parts by weight, 0.8 parts by weight, 1 part by weight, 1.2 parts by weight, 1.5 parts by weight, 1.8 parts by weight, 2 parts by weight, 2.2 parts by weight, 2.5 parts by weight, 2.8 parts by weight or 3 parts by weight, etc.

[0015] Preferably, the mass ratio of the thermoplastic resin to the polyethylene resin is 1:(1-4), wherein (1-4) can be, for example, 1, 1.2, 1.5, 1.8, 2, 2.5, 3, 3.5 or 4, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0016] The compounding of the polyethylene resin and the thermoplastic resin in the transparent heat-resistant layer of the present invention can play a synergistic role, thereby further improving the water vapor barrier performance and heat resistance of the obtained film-backplane integrated material without affecting the processing performance. Furthermore, by optimizing the mass ratio of the polyethylene resin and the thermoplastic resin in the transparent heat-resistant layer, a film-backplane integrated material with high water vapor barrier performance and high heat resistance with better practical performance can be obtained. When the mass ratio of the two is 1: (1-4), the processing difficulty is low, and the obtained film-backplane integrated material has better water vapor barrier performance and heat resistance. When the mass ratio of the two is lower than 1: 4, the polyethylene resin content is too high, and the water vapor barrier performance and heat resistance of the obtained film-backplane integrated material are reduced. When the mass ratio of the two is higher than 1: 1, the polyethylene resin content is too low, and the processing difficulty is great in actual production.

[0017] Preferably, the thermoplastic resin includes any one or a combination of at least two of ethylene-methacrylic acid copolymer (EMA), ethylene-vinyl acetate copolymer (EVA), ethylene-butyl acrylate copolymer (EBA), ethylene-acrylic acid copolymer (EAA), ethylene-methyl methacrylate copolymer (EMMA), cyclic olefin copolymer (COC), cyclic olefin polymer (COP) or polyolefin elastomer (POE).

[0018] Preferably, the anti-aging aid comprises a light stabilizer A and an antioxidant.

[0019] Preferably, the light stabilizer A includes any one of a light shielding agent light stabilizer, a quencher light stabilizer, a free radical scavenger light stabilizer or a hydroperoxide decomposer light stabilizer, or a combination of at least two of them.

[0020] Preferably, the quencher-type light stabilizer comprises an organic nickel compound.

[0021] Preferably, the free radical scavenger light stabilizer includes hindered amine light stabilizer (HALS) and / or 2,4.6-trimethylbenzoylphenyl ethyl phosphate (TPO-L);

[0022] Preferably, the hindered amine light stabilizer (HALS) comprises bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate (Light Stabilizer 770).

[0023] Preferably, the antioxidant includes any one of hindered phenol antioxidants, aromatic amine antioxidants, phosphite antioxidants, thioether antioxidants or metal passivator antioxidants, or a combination of at least two thereof.

[0024] Preferably, the hindered phenol antioxidant includes any one of antioxidant 1010, antioxidant 2246, antioxidant 425 or antioxidant 330, or a combination of at least two thereof.

[0025] Preferably, the aromatic amine antioxidant includes any one of N,N'-diphenyl-p-phenylenediamine (DPPD), butylated hydroxyanisole (BHA), 2,6-di-tert-butyl-p-cresol (BHT) or 4,4'-di(phenylisopropyl)diphenylamine (445) or a combination of at least two thereof.

[0026] Preferably, the phosphite antioxidant includes any one of antioxidant 168, antioxidant 618 or antioxidant 9928, or a combination of at least two of them.

[0027] Preferably, the thioether antioxidant includes any one of distearate thiodipropionate (DSTDP), didodecyl thiodipropionate (DLTDP) or pentaerythritol tetrakis (3-laurylthiopropionate) or a combination of at least two thereof.

[0028] Preferably, the metal passivator antioxidant includes BASF antioxidant 1024.

[0029] Preferably, the raw material components of the transparent heat-resistant layer further include a cross-linking aid and / or a processing aid.

[0030] Preferably, the content of the auxiliary cross-linking agent is 0-3 parts by weight, for example, it can be 0 parts by weight, 0.2 parts by weight, 0.5 parts by weight, 0.8 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight or 3 parts by weight.

[0031] Preferably, the auxiliary cross-linking agent includes any one of trimethylolpropane triacrylate (TMPTA), trimethylolpropane trimethacrylate (TMPTMA), ethylene glycol diacrylate (EGDA), ethylene glycol dimethacrylate (EGDMA), N,N′-p-phenylbismaleimide (PDM or HVA-2), zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), triallyl cyanurate (TAC), triallyl isocyanurate (TAIC) or 1,2-polybutadiene (1,2-PBR) or a combination of at least two thereof.

[0032] Preferably, the content of the processing aid is 0-5 parts by weight, for example, it can be 0 parts by weight, 0.5 parts by weight, 1 parts by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight or 5 parts by weight, etc.

[0033] Preferably, the processing aid includes any one of silicone, calcium stearate, zinc stearate, oleamide, erucamide or polyethylene wax, or a combination of at least two thereof.

[0034] Preferably, the transparent heat-resistant layer is obtained after electron beam irradiation.

[0035] Preferably, the irradiation voltage of the electron beam irradiation is 100-400KeV, for example, it can be 100KeV, 150KeV, 200KeV, 250KeV, 300KeV, 350KeV or 400KeV, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0036] Preferably, the irradiation dose of the electron beam irradiation is 100-200KGy, for example, it can be 100KGy, 110KGy, 120KGy, 130KGy, 140KGy, 150KGy, 160KGy, 170KGy, 180KGy, 190KGy or 200KGy, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0037] The transparent heat-resistant layer of the present invention is compounded with specific contents of polyethylene resin, thermoplastic resin and anti-aging additive, and then cross-linked by electron beam irradiation, which can effectively improve the heat resistance of the transparent heat-resistant layer, thereby helping to improve the heat resistance of the obtained film backplane integrated material.

[0038] Preferably, the hardening coating comprises silicone-modified acrylate.

[0039] Preferably, the hardening coating is prepared by coating.

[0040] Preferably, the coating method includes any one of spraying, scraping, brushing or troweling, or a combination of at least two of them.

[0041] Preferably, the organosilicon-modified acrylate is dried and cured after coating.

[0042] Preferably, the drying comprises natural drying.

[0043] Preferably, the drying time is 20-40 min, for example, it can be 20 min, 22 min, 24 min, 26 min, 28 min, 30 min, 32 min, 34 min, 36 min, 38 min or 40 min, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0044] Preferably, the curing temperature is 60-90°C, for example, it can be 60°C, 65°C, 70°C, 75°C, 80°C, 85°C or 90°C, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0045] Preferably, the curing time is 1-5h, for example, it can be 1h, 1.5h, 2h, 2.5h, 3h, 3.5h, 4h, 4.5h or 5h, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0046] Preferably, the hardening coating in the present invention comprises the following components in weight percentage (the selection of raw material components and contents are all referenced to patent CN115785798B):

[0047] 30-50% of film-forming material, 10-30% of modified sol, 10-30% of diluent, 1-5% of catalyst, 0.1-3% of lubricant, 0.5-8% of auxiliary agent and 0-10% of filler are stirred and mixed.

[0048] Exemplarily, the specific preparation method of the hardening coating in the present invention comprises the following steps:

[0049] (i) mixing 30-50% of a film former, 10-30% of a modified sol, 10-30% of a diluent, 1-5% of a catalyst, 0.1-3% of a lubricant, 0.5-8% of an additive and 0-10% of a filler, and stirring at 20-30° C. for 1-4 hours to obtain a silicone-modified acrylate;

[0050] (ii) applying the organosilicon-modified acrylate of step (i) to one side of the transparent heat-resistant layer by spraying, drying naturally for 20-40 minutes, and then drying and curing at 60-90° C. for 1-5 hours to obtain the hardening coating.

[0051] Preferably, the functional adhesive film layer is an EVA layer or a POE layer.

[0052] Preferably, the functional adhesive film layer comprises the following components in parts by weight:

[0053] 60-100 parts by weight of base resin, 0-40 parts by weight of tackifying resin, 0-1 parts by weight of main cross-linking agent, 0-1 parts by weight of auxiliary cross-linking agent, 0.2-0.8 parts by weight of coupling agent, 0.1-0.5 parts by weight of light stabilizer, 0-0.3 parts by weight of ultraviolet absorber and 0-1 parts by weight of antioxidant.

[0054] Preferably, the matrix resin is selected from EVA resin or POE resin.

[0055] Preferably, the tackifying resin includes any one of ethylene / acrylate copolymer, POE-maleic anhydride graft, ethylene / acrylic acid copolymer, ethylene / butyl acrylate copolymer or POE-glycidyl acrylate graft, or a combination of at least two thereof.

[0056] Preferably, the primary crosslinking agent comprises any one or a combination of at least two of tert-butyl peroxy-2-ethylhexyl carbonate, dicumyl peroxide and 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane or carbonyl peroxyacid-O,O-(1,1-dimethylpropyl)-O-(2-ethylhexyl) ester.

[0057] Preferably, the auxiliary crosslinking agent includes any one of triallyl isocyanurate, trimethallyl isocyanate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate or propoxylated trimethylolpropane triacrylate, or a combination of at least two thereof.

[0058] Preferably, the coupling agent includes any one or a combination of at least two of 3-methacryloxypropylmethyltrimethoxysilane, 3-glycidylpropyltrimethoxysilane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, isopropyl triisostearoyl titanate, isopropyl tri(dioctyl pyrophosphate) titanate, isocyanatepropyltrimethoxysilane, isocyanatepropyltriethoxysilane or 1,3,5-tris(trimethoxysilylpropyl)isocyanurate.

[0059] Preferably, the light stabilizer includes any one of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, poly(4-hydroxy-2,2,6,6-tetramethyl-1-piperidinethanol) succinate or poly-{[6-[(1,1,3,3-tetramethylbutyl)-imino]-1,3,5-triazine-2,4-diyl][2-(2,2,6,6-tetramethylpiperidinyl)-nitrogen]-hexylene-[4-(2,2,6,6-tetramethylpiperidinyl)-amino]} or a combination of at least two thereof.

[0060] Preferably, the antioxidant includes any one of antioxidant 1010, antioxidant 1076 or antioxidant 168, or a combination of at least two of them.

[0061] Preferably, the film-backplane integrated material further includes a water-blocking layer, a first adhesive layer and a second adhesive layer.

[0062] Preferably, the water-blocking layer is located between the transparent heat-resistant layer and the functional adhesive film layer.

[0063] Preferably, the first adhesive layer is located between the transparent heat-resistant layer and the water-blocking layer.

[0064] Preferably, the second adhesive layer is located between the functional adhesive film layer and the water-blocking layer.

[0065] Preferably, the water-blocking layer comprises PET silicon oxide and an inorganic layer.

[0066] Preferably, the inorganic layer includes any one of aluminum oxide, silicon oxide, aluminum silicon oxide, aluminum silicon nitride, silicon oxynitride, aluminum silicon oxynitride, copper oxide, titanium dioxide, indium tin oxide, silicon nitride, titanium nitride, zinc oxide, aluminum zinc oxide, zirconium dioxide, yttrium oxide or calcium orthosilicate, or a combination of at least two of them.

[0067] Preferably, the inorganic layer is prepared by a deposition process.

[0068] Preferably, the deposition process comprises any one of condensation, chemical vapor deposition, atomic layer deposition, physical vapor deposition, evaporation, plasma deposition, reactive ion etching or sputtering.

[0069] Preferably, the first adhesive layer and the second adhesive layer are each independently selected from a hot melt adhesive layer or a glue layer.

[0070] Preferably, the adhesive layer comprises an additive.

[0071] Preferably, the additive comprises an anti-ultraviolet agent and / or a light stabilizer B.

[0072] Preferably, the anti-ultraviolet agent includes the ultraviolet light absorber.

[0073] Preferably, the ultraviolet absorber includes any one of a benzophenone ultraviolet absorber, a benzotriazole ultraviolet absorber, a salicylate ultraviolet absorber, a substituted acrylonitrile ultraviolet absorber or a triazine ultraviolet absorber, or a mixture of at least two thereof.

[0074] Preferably, the light stabilizer B includes any one of a light shielding agent light stabilizer, a quencher light stabilizer, a free radical scavenger light stabilizer and a hydroperoxide decomposer light stabilizer, or a mixture of at least two of them.

[0075] In a second aspect, the present invention provides a method for preparing the adhesive film backplane integrated material as described in the first aspect, the preparation method comprising the following steps:

[0076] A hardening coating is arranged on the side of the transparent heat-resistant layer away from the functional adhesive film layer to obtain the adhesive film backplane integrated material.

[0077] Preferably, when the adhesive film backplane integrated material of the present invention is a hardening coating composite / transparent heat-resistant layer / functional adhesive film layer, its preparation method specifically comprises the following steps:

[0078] (1) After the raw material components of the transparent heat-resistant layer and the functional adhesive film layer are mixed respectively, they are first co-extruded and cast, and then the cast transparent heat-resistant layer film is irradiated by electron beam, with an irradiation voltage of 100-400KeV and an irradiation dose of 100-200KGY to obtain a transparent heat-resistant layer / functional adhesive film layer.

[0079] (2) The raw material components of the hardening coating are mixed evenly to obtain a silicone-modified acrylate, and then the silicone-modified acrylate is applied to the surface of the transparent heat-resistant layer in the transparent heat-resistant layer / functional adhesive film layer by spraying, and then dried and cured at 60-90° C. for 1-5 hours after natural drying for 20-40 minutes to obtain the adhesive film backplane integrated material (hardening coating composite / transparent heat-resistant layer / functional adhesive film layer).

[0080] Preferably, when the adhesive film backplane integrated material of the present invention is a composite of hardening coating / transparent heat-resistant layer / first adhesive layer / water-blocking layer / second adhesive layer / functional adhesive film layer, its preparation method specifically comprises the following steps:

[0081] (1) Preparation of a transparent heat-resistant layer: After mixing the raw material components of the transparent heat-resistant layer, the mixture is extruded and cast, and the cast transparent heat-resistant layer film is irradiated by electron beam at an irradiation voltage of 100-400 KeV and an irradiation dose of 100-200 KGY to obtain a transparent heat-resistant layer.

[0082] (2) Preparation of the functional adhesive film layer: The functional adhesive film layer is prepared by mixing the raw material components thereof respectively and then forming the functional adhesive film layer by co-extrusion casting.

[0083] Steps (1) and (2) are performed in no particular order.

[0084] (3) Preparation of hard coating / transparent heat-resistant layer: The raw material components of the hard coating are mixed evenly to obtain silicone-modified acrylate, and the silicone-modified acrylate is applied to one side of the transparent heat-resistant layer by spraying. After natural drying for 20-40 minutes, the hard coating / transparent heat-resistant layer is dried and cured at 60-90°C for 1-5 hours to obtain the hard coating / transparent heat-resistant layer.

[0085] (4) The hardening coating / transparent heat-resistant layer, the first adhesive layer, the water-blocking layer, the second adhesive layer and the functional film layer are sequentially compounded online to obtain an integrated film backplane material (hardening coating compound / transparent heat-resistant layer / first adhesive layer / water-blocking layer / second adhesive layer / functional film layer).

[0086] In a third aspect, the present invention provides an application of the adhesive film backplane integrated material as described in the first aspect in a photovoltaic module.

[0087] Compared with the prior art, the present invention has at least the following beneficial effects:

[0088] The present invention combines a hardening coating, a transparent heat-resistant layer and a functional adhesive film layer to obtain an integrated adhesive film backplane material having good heat resistance, friction resistance and water vapor barrier properties. By further optimizing the raw material components of the transparent heat-resistant layer and its preparation method, its heat resistance (TI>105°C), friction resistance (after 2000 steel wool friction tests, the hardening coating surface of the integrated adhesive film backplane material has no change) and water vapor barrier properties (not higher than 1.5g / m 2 / day), so it can be well applied to lightweight components. In addition, the film backplane integrated material has the characteristics of film backplane integration, which can well replace the glass and film in the single-glass photovoltaic component structure to meet the needs of lightweight components. At the same time, it can be directly pressed with the battery sheet for use, which simplifies the stacking steps and increases the stability of the lamination process. Not only does it increase the production yield and reduce the finished product explosion rate, but it also improves production efficiency. DETAILED DESCRIPTION

[0089] For the convenience of understanding the present invention, the present invention lists the following embodiments. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0090] Unless otherwise specified, various raw materials of the present invention can be purchased commercially or prepared according to conventional methods in the art. Information on some raw materials is as follows:

[0091] Polyethylene resin: SP1520 was purchased from Mitsui, Japan; 18D was purchased from Daqing Petrochemical;

[0092] COC: 6013F-04 purchased from Polyplastics of Japan;

[0093] The first adhesive layer and the second adhesive layer are both XH-60TY\LW75, purchased from Guangdong Xinhui Chemical;

[0094] The water-blocking layer was purchased from Lucky Huaguang B-PT12C.

[0095] Example 1

[0096] The present embodiment provides an integrated adhesive film backplane material, comprising a hardening coating layer, a transparent heat-resistant layer, a first adhesive layer, a water-blocking layer, a second adhesive layer and a functional adhesive film layer, which are arranged in sequence from top to bottom.

[0097] The method for preparing the integrated adhesive film backplane material comprises the following steps:

[0098] (1) Preparation of transparent heat-resistant layer:

[0099] 60 parts by weight of SP1520, 10 parts by weight of 18D, 30 parts by weight of 6013F-04, 0.2 parts by weight of antioxidant 1010, 0.2 parts by weight of antioxidant 168, 1.2 parts by weight of trimethylolpropane triacrylate, 0.2 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate and 1 part by weight of erucamide are mixed, and cast at 220°C. The cast film is irradiated with an electron beam at a voltage of 250 KeV and a dose of 150 KGY to obtain the transparent heat-resistant layer.

[0100] (2) Preparation of functional adhesive film layer:

[0101] 90 parts by weight of EVA resin (Hanwha EP282), 10 parts by weight of ethylene / acrylate / glycidyl acrylate copolymer (Arkema AX8900), 0.5 parts by weight of tert-butyl peroxide 2-ethylhexyl carbonate, 0.7 parts by weight of triallyl isocyanurate, 0.8 parts by weight of ethoxylated trimethylolpropane triacrylate, 0.3 parts by weight of 3-methacryloxypropyl methyltrimethoxysilane, 0.1 parts by weight of isocyanatepropyl triethoxysilane, 0.1 parts by weight of light stabilizer 770 and 0.2 parts by weight of antioxidant 1010 are mixed evenly, and the functional adhesive film layer is obtained by co-extrusion casting.

[0102] Steps (1) and (2) are performed in no particular order.

[0103] (3) Preparation of hard coating / transparent heat-resistant layer:

[0104] (i) 50% polyurethane modified acrylate (Shaanxi Xilaiwu UV6906), 25% mercapto coupling agent modified silica sol (prepared by reference to Preparation Example 2 of Patent CN115785798B), 20.5% butyl acetate, 1% initiator-184, 3% lubricant (erucic acid amide), and 0.5% leveling agent (BYK-333) were added into a stirring barrel and stirred for 2 hours to obtain silicone modified acrylate;

[0105] (ii) The organosilicon-modified acrylate of step (i) is applied to one side of the transparent heat-resistant layer of step (1) by spraying, and then dried and cured at 75° C. for 3 hours to obtain a hardened coating / transparent heat-resistant layer.

[0106] (4) The hardening coating / transparent heat-resistant layer, the first adhesive layer, the water-blocking layer, the second adhesive layer and the functional film layer are sequentially compounded online to obtain an integrated film backplane material (hardening coating compound / transparent heat-resistant layer / first adhesive layer / water-blocking layer / second adhesive layer / functional film layer).

[0107] Example 2

[0108] The present embodiment provides an integrated adhesive film backplane material, comprising a hardening coating layer, a transparent heat-resistant layer, a first adhesive layer, a water-blocking layer, a second adhesive layer and a functional adhesive film layer, which are arranged in sequence from top to bottom.

[0109] (1) Preparation of transparent heat-resistant layer:

[0110] 50 parts by weight of SP1520, 50 parts by weight of thermoplastic resin COC (Polyplastics 8007S, Japan), 1 part by weight of antioxidant 1010, 1 part by weight of antioxidant 168, 3 parts by weight of trimethylolpropane triacrylate, 1 part by weight of bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate and 5 parts by weight of erucamide are mixed and cast at 180°C. The cast film is irradiated with an electron beam at a voltage of 400KeV and a dose of 200KGY to obtain the transparent heat-resistant layer.

[0111] The raw materials, content and preparation method of the functional adhesive film layer in step (2) are the same as those in Example 1.

[0112] Steps (1) and (2) are performed in no particular order.

[0113] (3) Preparation of hard coating / transparent heat-resistant layer:

[0114] The raw materials, content and preparation method of the organosilicon-modified acrylate in step (i) are the same as those in Example 1;

[0115] (ii) applying the organosilicon-modified acrylate of step (i) to one side of the transparent heat-resistant layer by knife coating, drying naturally for 40 minutes, and then drying and curing at 90° C. for 1 hour to obtain the hardening coating / transparent heat-resistant layer.

[0116] (4) The hardening coating / transparent heat-resistant layer, the first adhesive layer, the water-blocking layer, the second adhesive layer and the functional film layer are sequentially compounded online to obtain an integrated film backplane material.

[0117] Example 3

[0118] The present embodiment provides an integrated adhesive film backplane material, comprising a hardening coating layer, a transparent heat-resistant layer, a first adhesive layer, a water-blocking layer, a second adhesive layer and a functional adhesive film layer, which are arranged in sequence from top to bottom.

[0119] (1) Preparation of transparent heat-resistant layer:

[0120] 90 parts by weight of SP1520, 10 parts by weight of thermoplastic resin POE (Dow Chemical 8450), 0.5 parts by weight of antioxidant 1010, 0.5 parts by weight of antioxidant 168 and 0.5 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate are mixed, and cast at 180°C. The cast film is irradiated with an electron beam at a voltage of 100KeV and a dose of 100KGY to obtain the transparent heat-resistant layer.

[0121] The raw materials, content and preparation method of the functional adhesive film layer in step (2) are the same as those in Example 1.

[0122] Steps (1) and (2) are performed in no particular order.

[0123] (3) Preparation of hard coating / transparent heat-resistant layer:

[0124] The raw materials, content and preparation method of the organosilicon-modified acrylate in step (i) are the same as those in Example 1;

[0125] (ii) applying the organosilicon-modified acrylate of step (i) to one side of the transparent heat-resistant layer by spraying, drying naturally for 20 minutes, and then drying and curing at 60° C. for 5 hours to obtain the hardening coating / transparent heat-resistant layer.

[0126] (4) The hardening coating / transparent heat-resistant layer, the first adhesive layer, the water-blocking layer, the second adhesive layer and the functional film layer are sequentially compounded online to obtain an integrated film backplane material.

[0127] Example 4

[0128] The present embodiment provides an adhesive film backplane integrated material, comprising a hardening coating layer, a transparent heat-resistant layer and a functional adhesive film layer arranged in sequence from top to bottom.

[0129] The transparent heat-resistant layer includes the following components in parts by weight:

[0130] 60 parts by weight of SP1520, 10 parts by weight of 18D, 30 parts by weight of 6013F-04, 0.2 parts by weight of antioxidant, 0.2 parts by weight of antioxidant 1010, 1.2 parts by weight of trimethylolpropane triacrylate, 0.2 parts by weight of bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate and 1 part by weight of erucamide.

[0131] The functional adhesive film layer includes the following components in parts by weight:

[0132] 50 parts by weight of POE (Dow Chemical PV8669), 50 parts by weight of POE (Dow Chemical 8450), 0.3 parts by weight of 3-methacryloxypropylmethyltrimethoxysilane, 0.1 parts by weight of isocyanatepropyltriethoxysilane, and 0.1 parts by weight of light stabilizer 770 and 0.2 parts by weight of 1076.

[0133] The hardening coating comprises the following components in parts by weight:

[0134] 50% polyurethane modified acrylate (Shaanxi Xilaiwu UV6906), 25% mercapto coupling agent modified silica sol (prepared by reference to patent CN115785798B Preparation Example 2), 20.5% butyl acetate, 1% initiator-184, 3% lubricant (erucic acid amide) and 0.5% leveling agent (BYK-333).

[0135] The method for preparing the integrated adhesive film backplane material of this embodiment comprises the following steps:

[0136] (1) The raw material components of the transparent heat-resistant layer and the functional adhesive film layer are mixed respectively, and then co-extruded and cast, and then the cast transparent heat-resistant layer film is irradiated by electron beam, with an irradiation voltage of 100KeV and an irradiation dose of 100KGY to obtain a transparent heat-resistant layer / functional adhesive film layer.

[0137] (2) The raw material components of the hardening coating are mixed evenly to obtain silicone-modified acrylate, which is then applied to the surface of the transparent heat-resistant layer in the transparent heat-resistant layer / functional adhesive film layer by spraying, and then dried and cured at 75° C. for 3 hours to obtain the adhesive film backplane integrated material (hardening coating composite / transparent heat-resistant layer / functional adhesive film layer).

[0138] Example 5

[0139] This embodiment provides an integrated adhesive film backplane material, which differs from Embodiment 1 only in that step (1) is not subjected to electron beam irradiation treatment, and a transparent heat-resistant layer is directly obtained after tape casting. Other raw materials, contents and preparation methods are the same as those in Embodiment 1.

[0140] Example 6

[0141] This embodiment provides an integrated film backplane material, which differs from Embodiment 1 only in that 6013F is not added in step (1), and its reduced weight portion is proportionally distributed to SP1520 and 18D, and other raw materials, contents and preparation methods are the same as those in Embodiment 1.

[0142] Example 7

[0143] This embodiment provides an integrated adhesive film backplane material, which differs from the embodiment 1 only in that SP1520 and 18D are not added in step (1), and the reduced weight portions thereof are allocated to 6013F-04, and the other raw materials, contents and preparation methods are the same as those in the embodiment 1. In this embodiment, due to the excessively high COC content, the processing difficulty is large in actual production, and the practical performance is poor.

[0144] Example 8

[0145] This embodiment provides an integrated film backplane material, which differs from Embodiment 4 only in that the total content of SP1520 and 18D in step (1) is adjusted from 70 parts by weight to 80 parts by weight (68.5 parts by weight of SP1520 and 11.5 parts by weight of 18D), and the content of 6013F-04 is adjusted from 30 parts by weight to 20 parts by weight, and other raw materials, contents and preparation methods are the same as those in Embodiment 4.

[0146] Example 9

[0147] This embodiment provides an integrated film backplane material, which differs from Embodiment 4 only in that the total content of SP1520 and 18D in step (1) is adjusted from 70 parts by weight to 50 parts by weight (43 parts by weight of SP1520 and 7 parts by weight of 18D), and the content of 6013F-04 is adjusted from 30 parts by weight to 50 parts by weight, and other raw materials, contents and preparation methods are the same as those in Embodiment 4.

[0148] Example 10

[0149] This embodiment provides an integrated film backplane material, which differs from Embodiment 4 only in that the total content of SP1520 and 18D in step (1) is adjusted from 70 parts by weight to 84 parts by weight (72 parts by weight of SP1520 and 12 parts by weight of 18D), and the content of 6013F-04 is adjusted from 30 parts by weight to 16 parts by weight, and other raw materials, contents and preparation methods are the same as those in Embodiment 4.

[0150] Embodiment 11

[0151] This embodiment provides an integrated adhesive film backplane material, which differs from Embodiment 1 only in that in step (1), the weight of SP1520 is adjusted from 60 weight parts to 17.2 weight parts, and the weight of 18D is adjusted from 10 weight parts to 2.8 weight parts, and other raw materials, contents and preparation methods are the same as those in Embodiment 1. In this embodiment, due to the high COC content, the processing difficulty is large in actual production, the surface is not smooth, and the practical performance is poor.

[0152] Example 12

[0153] This embodiment provides an integrated film backplane material, which differs from Embodiment 1 only in that in step (1), the weight of SP1520 is adjusted from 60 weight parts to 84 weight parts, and the weight of 18D is adjusted from 10 weight parts to 14 weight parts, and other raw materials, contents and preparation methods are the same as those in Embodiment 1.

[0154] Comparative Example 1

[0155] This comparative example provides an integrated film backplane material, which differs from Example 1 only in that no transparent heat-resistant layer is provided, and other raw materials, contents and preparation methods are the same as those in Example 1.

[0156] Comparative Example 2

[0157] This comparative example provides an integrated film backplane material, which differs from Example 1 only in that no hardening coating is provided, and other raw materials, contents and preparation methods are the same as those in Example 1.

[0158] The performance test of the film backplane integrated materials obtained in Examples 1-6, Examples 8-10 and Example 12 and Comparative Examples 1-2 was performed, and the test method / standard is as follows:

[0159] (1) Water vapor transmission value: The water vapor transmission value through the integrated material of the film back sheet with a thickness of 0.45 mm is measured at 38°C and 90% RH.

[0160] (2) Heat resistance: Test the heat resistance index TI according to the test standard IEC 60216-1;

[0161] (3) Friction resistance: A reciprocating wear tester (GME 60248) was used to test the friction resistance of the hardened coating surface of the film backplane integrated material under 0000# steel wool and a load of 500g.

[0162] The test results are shown in Table 1.

[0163] Table 1

[0164] <![CDATA[Water vapor transmission rate (g / m 2 / day)]]> Heat resistance(℃) Friction resistance Example 1 0.5 125 2000 times, no change Example 2 0.8 130 2000 times, no change Example 3 1.0 110 2000 times, no change Example 4 1.4 125 2000 times, no change Example 5 0.8 70 2000 times, no change Example 6 0.7 90 2000 times, no change Example 8 1.5 120 2000 times, no change Example 9 1.0 130 2000 times, no change Example 10 1.9 115 2000 times, no change Example 12 1.0 92 2000 times, no change Comparative Example 1 0.8 40 2000 times, no change Comparative Example 2 0.6 123 2000 times, surface polished

[0165] The test results show that:

[0166] (1) It can be seen from Examples 1 to 4 that the present invention has good water vapor barrier properties (its water vapor transmission rate is less than 2 g / m 2 / day), heat resistance (TI>105℃) and friction resistance (after 2000 times of steel wool friction test, the hardening coating surface of the film backplane integrated material has no change).

[0167] (2) By comparing Example 1 with Example 5, it can be seen that the electron beam irradiation treatment during the preparation of the transparent heat-resistant layer of the present invention can significantly improve the heat resistance of the obtained film backplane integrated material, and at the same time, can further improve its water vapor barrier performance.

[0168] (3) By comparing Example 1 with Examples 6 and 7, it can be seen that the transparent heat-resistant layer of the present invention can make the polyethylene resin and the thermoplastic resin play a synergistic role by compounding the two, and can further improve the water vapor barrier performance and heat resistance of the obtained film backplane integrated material without affecting the processing performance.

[0169] (4) By comparing Example 4 with Examples 8-10, it can be seen that when the mass ratio of the polyethylene resin to the thermoplastic resin in the transparent heat-resistant layer is higher than 4:1, the polyethylene resin content is too high, and the water vapor barrier performance and heat resistance of the obtained film backplane integrated material are reduced, while when the mass ratio of the two is lower than 1:1, the polyethylene resin content is too low, and the processing is difficult in actual production. This shows that the present invention can obtain a film backplane integrated material with better practical performance, high water vapor barrier performance and high heat resistance by further optimizing the mass ratio of the polyethylene resin to the thermoplastic resin in the transparent heat-resistant layer.

[0170] (5) By comparing Example 1 with Example 11 and Example 12, it can be seen that the present invention, by limiting the content of the polyethylene resin in the transparent heat-resistant layer, can obtain an integrated film backplane material with better practical performance, high water vapor barrier performance and high heat resistance.

[0171] (6) It can be seen from the comparison between Example 1 and Comparative Example 1 that the present invention can make the film backplane integrated material have better heat resistance and water vapor barrier performance by setting a specific transparent heat-resistant layer.

[0172] (7) By comparing Example 1 with Comparative Example 2, it can be seen that the present invention can effectively improve the surface friction resistance of the obtained film backplane integrated material by setting a specific hardening coating.

[0173] The present invention combines a specific hardening coating, a transparent heat-resistant layer and a functional adhesive film layer to obtain an integrated adhesive film backplane material having good heat resistance, friction resistance and water vapor barrier properties. Furthermore, by optimizing the raw material components of the transparent heat-resistant layer and its preparation method, its heat resistance (TI>105°C), friction resistance (after 2000 steel wool friction tests, the hardening coating surface of the integrated adhesive film backplane material has no change) and water vapor barrier properties (not higher than 1.5g / m 2 / day), which makes it well suited for lightweight components.

[0174] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A film backplane integrated material, characterized in that: The adhesive film backplane integrated material comprises a hardening coating layer, a transparent heat-resistant layer and a functional adhesive film layer.

2. The adhesive film backplane integrated material according to claim 1, characterized in that: The transparent heat-resistant layer comprises the following raw material components in parts by weight: Polyethylene resin 30-90 parts by weight Thermoplastic resin 10-70 parts by weight 0.5-3 parts by weight of anti-aging additives.

3. The adhesive film backplane integrated material according to claim 2, characterized in that: The mass ratio of the thermoplastic resin to the polyethylene resin is 1:(1-4); Preferably, the thermoplastic resin comprises any one or a combination of at least two of ethylene-methacrylic acid copolymer, ethylene-vinyl acetate copolymer, ethylene-butyl acrylate copolymer, ethylene-acrylic acid copolymer, ethylene-methyl methacrylate copolymer, cyclic olefin copolymer, cyclic olefin polymer or polyolefin elastomer; Preferably, the anti-aging aid comprises a light stabilizer A and an antioxidant; Preferably, the light stabilizer A comprises any one of a light shielding agent light stabilizer, a quencher light stabilizer, a free radical scavenger light stabilizer or a hydroperoxide decomposer light stabilizer, or a combination of at least two thereof; Preferably, the antioxidant includes any one of hindered phenol antioxidants, aromatic amine antioxidants, phosphite antioxidants, thioether antioxidants or metal passivator antioxidants, or a combination of at least two thereof.

4. The adhesive film back sheet integrated material according to claim 2 or 3, characterized in that: The raw material components of the transparent heat-resistant layer also include a cross-linking agent and / or a processing aid; Preferably, the content of the auxiliary cross-linking agent is 0-3 parts by weight; Preferably, the auxiliary cross-linking agent includes any one of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, N,N′-p-phenyl bismaleimide, zinc diacrylate, zinc dimethacrylate, triallyl cyanurate, triallyl isocyanurate or 1,2-polybutadiene, or a combination of at least two thereof; Preferably, the content of the processing aid is 0-5 parts by weight; Preferably, the processing aid includes any one of silicone, calcium stearate, zinc stearate, oleamide, erucamide or polyethylene wax, or a combination of at least two thereof.

5. The adhesive film backplane integrated material according to any one of claims 1 to 4, characterized in that: The transparent heat-resistant layer is obtained after electron beam irradiation; Preferably, the irradiation voltage of the electron beam irradiation is 100-400 KeV; Preferably, the irradiation dose of the electron beam irradiation is 100-200 KGy.

6. The adhesive film back sheet integrated material according to any one of claims 1 to 5, characterized in that: The hardening coating comprises silicone-modified acrylate; Preferably, the hardening coating is prepared by coating; Preferably, the coating method includes any one of spraying, scraping, brushing or smearing, or a combination of at least two of them; Preferably, the silicone-modified acrylate is dried and cured after coating; Preferably, the drying comprises natural drying; Preferably, the drying time is 20-40 minutes; Preferably, the curing temperature is 60-90°C; Preferably, the curing time is 1-5h; Preferably, the functional adhesive film layer is an EVA layer or a POE layer.

7. The adhesive film back sheet integrated material according to any one of claims 1 to 6, characterized in that: The film backplane integrated material further includes a water-blocking layer, a first adhesive layer and a second adhesive layer; Preferably, the water-blocking layer is located between the transparent heat-resistant layer and the functional adhesive film layer; Preferably, the first adhesive layer is located between the transparent heat-resistant layer and the water-blocking layer; Preferably, the second adhesive layer is located between the functional adhesive film layer and the water-blocking layer.

8. The adhesive film back sheet integrated material according to claim 7, characterized in that: The water-blocking layer comprises PET silicon oxide and an inorganic layer; Preferably, the inorganic layer comprises any one of aluminum oxide, silicon oxide, aluminum silicon oxide, aluminum silicon nitride, silicon oxynitride, aluminum silicon oxynitride, copper oxide, titanium dioxide, indium tin oxide, silicon nitride, titanium nitride, zinc oxide, aluminum zinc oxide, zirconium dioxide, yttrium oxide or calcium orthosilicate, or a combination of at least two thereof; Preferably, the first adhesive layer and the second adhesive layer are each independently selected from a hot melt adhesive layer or a glue layer; Preferably, the adhesive layer includes an additive; Preferably, the additive comprises an anti-ultraviolet agent and / or a light stabilizer B.

9. A method for preparing the adhesive film backplane integrated material according to any one of claims 1 to 8, characterized in that: The preparation method comprises the following steps: A hardening coating is arranged on the side of the transparent heat-resistant layer away from the functional adhesive film layer to obtain the adhesive film backplane integrated material.

10. Use of the adhesive film backplane integrated material according to any one of claims 1 to 8 in a photovoltaic module.