Temperature sensor calibration method, device, system and equipment and storage medium

Abstract

The embodiment of the invention relates to the technical field of sensors, and provides a temperature sensor calibration method, device, system and equipment and a storage medium, the method is applied to the calibration equipment, the calibration equipment is connected with a probe station, a wafer of a first temperature sensor is placed on a wafer tray of the probe station, and the wafer tray is provided with a second temperature sensor; a plurality of unpackaged chips are arranged on the wafer; the probe station is used for providing a test environment for the wafer; the method comprises the steps that first temperature information and second temperature information are acquired, the first temperature information is used for indicating the temperature of a test environment measured by a plurality of target chips in a plurality of chips, and the second temperature information is used for indicating the temperature of the test environment measured by a second temperature sensor; the calibration information is determined according to the first temperature information and the second temperature information, and the calibration information is written into the corresponding target chip, so that the plurality of chips of the wafer of the temperature sensor can be calibrated at the same time, the temperature calibration efficiency is improved, and the calibration time is shortened.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and more specifically, to a temperature sensor calibration method, device, system, equipment and storage medium. Background Art

[0002] Among many sensors, temperature sensors are an important type of sensor and are widely used in various electronic devices. In order to improve the temperature measurement accuracy of temperature sensors, they usually need to be temperature calibrated before leaving the factory. That is, temperature calibration is performed on the temperature sensor at the finished product stage after it is packaged. The parallel efficiency is low, which greatly affects the mass production efficiency of temperature sensors. Summary of the invention

[0003] The embodiments of the present application provide a temperature sensor calibration method, apparatus, system, device and storage medium to improve the calibration efficiency of the temperature sensor.

[0004] In the first aspect, an embodiment of the present application provides a temperature sensor calibration method, which is applied to a calibration device, wherein the calibration device is connected to a probe station, and the calibration device is used to perform temperature calibration on a first temperature sensor, wherein a wafer of the first temperature sensor is placed on a wafer tray of the probe station, and the wafer tray is provided with a second temperature sensor; the wafer has a plurality of unpackaged chips; the probe station is used to provide a test environment of a specific temperature for the wafer; the method comprises: obtaining first temperature information and second temperature information, the first temperature information being used to indicate the temperature of the test environment measured by a plurality of target chips among a plurality of the chips, and the second temperature information being used to indicate the temperature of the test environment measured by the second temperature sensor; determining calibration information according to the first temperature information and the second temperature information, and writing the calibration information into the corresponding target chip.

[0005] The calibration equipment of the present application performs temperature calibration on multiple chips on the wafer through a probe station. The temperature calibration is performed before the chips of the wafer are packaged. Multiple chips of the wafer of the temperature sensor can be calibrated at the same time. For example, 100 chips and 200 chips are temperature calibrated at the same time, which improves the efficiency of temperature calibration and reduces the calibration time. The accuracy of the conventional probe station is about 1 to 3 degrees. The greater the temperature difference with the environment, the lower the accuracy. This accuracy cannot meet the sensor level calibration requirements. The present application sets an additional temperature sensor in the probe station, measures the temperature of the test environment through a second temperature sensor, and realizes accurate measurement of the temperature of the test environment to meet the accuracy requirements of the temperature calibration of the temperature sensor. In addition, by setting an additional temperature sensor to break through the accuracy limit of the temperature control module of the ordinary probe station, the high-precision temperature calibration of the wafer of the temperature sensor can be achieved using an ordinary probe station, saving equipment costs.

[0006] Optionally, the first temperature information is used to indicate the temperature of the test environment measured by a target chip among the multiple chips at a first moment, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor at the first moment.

[0007] Optionally, the acquiring the first temperature information and the second temperature information includes:

[0008] Controlling the probe station to provide a test environment with multiple temperatures for the first temperature sensor;

[0009] Acquire the first temperature information and the second temperature information corresponding to each of the temperature test environments;

[0010] The determining calibration information according to the first temperature information and the second temperature information includes:

[0011] The calibration information is determined according to the first temperature information and the second temperature information corresponding to the test environments at the multiple temperatures.

[0012] Optionally, the determining calibration information according to the first temperature information and the second temperature information corresponding to the test environments at a plurality of temperatures includes:

[0013] Determine sub-calibration information according to the first temperature information and the second temperature information corresponding to the test environment of each temperature;

[0014] Calibration information is determined according to the plurality of sub-calibration information.

[0015] Optionally, the acquiring the first temperature information and the second temperature information includes:

[0016] Acquire an image of the wafer, identify a plurality of the chips in the image, and construct a coordinate system according to the plurality of the chips in the image;

[0017] Acquire the coordinates of each target chip in the coordinate system and a plurality of first temperature information and second temperature information corresponding to each target chip;

[0018] Establishing an association relationship between the coordinates of each target chip and the first temperature information and the second temperature information;

[0019] The determining calibration information according to the first temperature information and the second temperature information includes:

[0020] Determine, according to the association relationship, a plurality of first temperature information and second temperature information corresponding to each target chip;

[0021] The calibration information corresponding to the target chip is determined according to the plurality of first temperature information and the second temperature information corresponding to the target chip.

[0022] In a second aspect, a calibration device is provided, comprising: an acquisition module, used to acquire first temperature information and second temperature information, the first temperature information being used to indicate the temperature of the test environment measured by multiple target chips among the multiple chips, and the second temperature information being used to indicate the temperature of the test environment measured by the second temperature sensor; a calibration module, used to determine calibration information based on the first temperature information and the second temperature information, and write the calibration information into the corresponding target chip.

[0023] In a third aspect, a temperature sensor calibration system is provided, the calibration system comprising a calibration device and a probe station, the calibration device being connected to the probe station, the calibration device being used to perform temperature calibration on a first temperature sensor, a wafer of the first temperature sensor being placed on a wafer tray of the probe station, the wafer tray being provided with a second temperature sensor; the wafer having a plurality of unpackaged chips; the probe station being used to provide a test environment of a specific temperature for the wafer;

[0024] The calibration device is used to obtain first temperature information and second temperature information, wherein the first temperature information is used to indicate the temperature of the test environment measured by multiple target chips among the multiple chips, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor;

[0025] The calibration device is used to determine calibration information according to the first temperature information and the second temperature information, and write the calibration information into the corresponding target chip.

[0026] In a fourth aspect, a calibration device is provided, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any one of the methods described in the first aspect when executing the computer program.

[0027] In a fifth aspect, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method of the first aspect is implemented.

[0028] It can be understood that the second aspect, the third aspect, and the fourth aspect provided above are all used to execute the corresponding methods provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods provided above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1A schematic diagram of the architecture of a calibration system provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of a temperature sensor calibration method provided in an embodiment of the present application;

[0031] Figure 3 A schematic diagram of a module of a calibration device provided in an embodiment of the present application;

[0032] Figure 4 A schematic diagram of the structure of a calibration device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0034] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0035] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0036] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0037] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0038] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0039] It should be understood that the order of execution of each step in this embodiment does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In order to illustrate the technical solution of the present application, the following is an illustration through a specific embodiment.

[0040] Figure 1 A calibration system provided in an embodiment of the present application includes a calibration device and a probe station, the calibration device and the probe station are connected, the calibration device is used to perform temperature calibration on a first temperature sensor, a wafer of the first temperature sensor is installed in a wafer tray of the probe station; a second temperature sensor is installed on the wafer tray of the probe station, and the second temperature sensor and the wafer are non-contacted. There are multiple unpackaged chips on the wafer.

[0041] The probe station is used to provide a test environment with a specific temperature for the wafer, and the plurality of chips and the second temperature sensor can sense the temperature of the test environment.

[0042] The calibration device is used to obtain first temperature information and second temperature information, wherein the first temperature information is used to indicate the temperature of the test environment measured by multiple target chips among the multiple chips, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor. The calibration device determines the calibration information of each target chip according to the first temperature information and the second temperature information, and writes the calibration information into the corresponding target chip to achieve temperature calibration of the first temperature sensor.

[0043] Usually, the calibration object of the temperature sensor is the finished product, that is, the packaged chip, which is limited by the number of stations of the calibration equipment (such as a sorting machine), and the number of chips to be calibrated at the same time is limited. For example, if the sorting machine has 8 stations, the calibration equipment can perform temperature calibration on 8 chips at the same time, and the temperature calibration efficiency is low. The calibration equipment of the present application performs temperature calibration on multiple chips on the wafer through a probe station. The temperature calibration is performed before the chips on the wafer are packaged. Multiple chips on the wafer of the temperature sensor can be calibrated at the same time, for example, 100 chips and 200 chips are temperature calibrated at the same time, which improves the efficiency of temperature calibration and reduces the calibration time.

[0044] The accuracy of conventional probe stations is about 1 to 3 degrees. The greater the temperature difference with the environment, the lower the accuracy. This accuracy cannot meet the sensor level calibration requirements. This application sets an additional temperature sensor in the probe station, measures the temperature of the test environment through a second temperature sensor, and achieves accurate measurement of the temperature of the test environment to meet the accuracy requirements of the temperature calibration of the temperature sensor. In addition, by setting an additional temperature sensor to break through the accuracy limit of the temperature control module of the ordinary probe station, the ordinary probe station can be used to achieve high-precision temperature calibration of the temperature sensor wafer, saving equipment costs.

[0045] Figure 1 In the embodiment, the wafer and the second temperature sensor are both arranged on the wafer tray, and the two are arranged at an interval, that is, the wafer and the second temperature sensor are not in direct contact.

[0046] Figure 1 The middle wafer tray is cylindrical, the wafer is arranged above the wafer tray, and the second temperature sensor is arranged on the side wall of the wafer tray.

[0047] Optionally, the second temperature sensor may be mounted on the side wall of the wafer tray by means of double-sided tape or the like.

[0048] Optionally, the calibration equipment may be automatic test equipment (ATE) or electronic equipment with other test functions.

[0049] Optionally, the first temperature sensor is provided with a storage module, and the storage module can be used to store calibration data.

[0050] Optionally, the temperature of the test environment measured by the target chip may be an ADC value output by the target chip.

[0051] Optionally, the calibration information may be an offset temperature, which is the difference between the temperature measured by the chip and the temperature measured by the second temperature sensor. For example, if the temperature measured by the temperature sensor is 25° and the temperature measured by the chip is 24.9°, the offset temperature is 0.1 degrees. In other embodiments, the calibration information may also be temperature gain information of the chip or other information.

[0052] Optionally, the measurement accuracy of the second temperature sensor is greater than or equal to the accuracy required for temperature calibration of the first temperature sensor. For example, if the accuracy required for temperature calibration of the first temperature sensor is 0.5°, the measurement accuracy of the second temperature sensor is 0.1°.

[0053] Optionally, the calibration device may write the calibration information into the corresponding chip by burning or other methods.

[0054] Optionally, since there are multiple chips on the wafer, and the multiple chips are not packaged, the calibration device can simultaneously obtain the test temperature of the multiple chips on the wafer to the test environment, and then perform temperature calibration on the multiple chips at the same time according to the obtained multiple test temperatures; or it can sequentially obtain the temperatures measured by the multiple chips on the wafer, and sequentially perform temperature calibration on the multiple chips according to the obtained measured temperatures.

[0055] Since the precision of different probe stations is different, and the temperature of the test environment provided by the probe station changes gradually, for example, the temperature of the test environment at the first moment is 25.1°, and the temperature of the test environment at the second moment is 25.2. In order to improve the accuracy of the temperature calibration of the temperature sensing chip, the present application measures the temperature of the test environment in real time by a second temperature sensor, and performs temperature calibration on the first temperature sensor based on the temperature. Improve the accuracy of the temperature calibration of the first temperature sensor. The first temperature information and the second temperature information obtained by the calibration device are the temperatures of the test environment measured by the target chip and tested by the second temperature sensor at the same time. The temperature sensor is temperature calibrated by the temperature measured at the same time to improve the accuracy of the temperature calibration.

[0056] In order to improve the calibration accuracy of the temperature sensor, the probe station can be controlled to provide multiple test temperatures for the wafer to be calibrated, and the temperature tested by the chip of the wafer and the second temperature sensor in the test environment of each test temperature can be obtained, and the temperature sensor can be calibrated based on the obtained test temperature to improve the accuracy of temperature calibration.

[0057] Optionally, the calibration device controls the probe station to provide a test environment with multiple temperatures for the wafer of the first sensor, and the calibration device obtains first temperature information and second temperature information of the test environment corresponding to each temperature. Then, the calibration device determines the calibration information based on the first temperature information and second temperature information of the test environment corresponding to each temperature. That is, calibration is performed through test environments with multiple temperatures to improve the calibration accuracy of the temperature sensor.

[0058] Optionally, the probe station provides a test environment with multiple temperatures for the wafer of the first sensor, such as a test environment of 15°, a test environment of 50°, and a test environment of 100°. The calibration device then obtains the first temperature information and the second temperature information of the test environment corresponding to each temperature, and then calibrates the temperature information obtained at each temperature to obtain the corresponding sub-calibration information, and then determines the calibration information based on the sub-calibration information corresponding to the multiple temperatures. The accuracy of the temperature calibration is improved by calibrating the first temperature sensor at different temperatures. During the multi-temperature calibration process, the calibration information is determined based on the sub-calibration information corresponding to the multiple temperatures, that is, the calibration device only needs to write the final calibration information into the chip, reducing the storage loss inside the chip.

[0059] Optionally, after the calibration device obtains multiple sub-calibration information, the calibration information may be obtained by fitting, averaging, etc. For example, if the sub-calibration information is deviation information, the calibration information may be an average value of the deviation information corresponding to multiple temperatures.

[0060] The calibration object of the present application is a wafer before packaging, and there are multiple temperature sensing chips on the wafer. In order to improve the calibration information, multiple temperature sensing chips can be calibrated at the same time. For example, there are 1,000 temperature sensing chips on the wafer, and the calibration equipment calibrates 100 of the temperature sensing chips each time. In order to distinguish multiple chips on the wafer, a coordinate system is constructed, and the coordinates of the multiple temperature sensing chips on the wafer are determined, so that the temperature sensing chip calibrated each time can be determined by the coordinates of the temperature sensing chip.

[0061] Optionally, the tester obtains an image of the wafer through a probe station, and identifies the temperature sensing chip on the wafer according to the image; then constructs a wafer coordinate system XY, and determines the coordinates of the chip in the wafer coordinate system XY.

[0062] Optionally, the probe station has an image acquisition module, which can be used to obtain an image of the wafer on the wafer tray. The calibration device obtains the image, and then identifies the chip in the image through image recognition technology, constructs a coordinate system based on the relative positions of multiple chips on the image, and determines the coordinates of each chip in the coordinate system.

[0063] Optionally, the calibration device can obtain an image of the wafer, then identify the chip in the image, and construct a coordinate system based on the chip in the image; obtain the coordinates of multiple target chips and the first temperature information and the second temperature information corresponding to the multiple target chips; establish an association relationship between the coordinates of each target chip and the first temperature information and the second temperature information; then the calibration device determines the first temperature information and the second temperature information corresponding to each target information based on the association relationship; and determines the calibration information corresponding to the corresponding target chip based on the first temperature information and the second temperature information corresponding to each target chip.

[0064] Optionally, since the temperature of some temperature sensors may shift due to packaging after packaging, the calibration device performs temperature calibration on the temperature sensor and after the chip on the wafer is packaged, the calibration device performs accuracy detection on the packaged chip to determine whether the temperature measurement accuracy of the packaged chip meets the requirements.

[0065] Optionally, the probe station is provided with a probe, and the probe station can control the relative movement of the wafer tray and the probe so that the probe contacts a specific chip on the wafer on the wafer tray, and the calibration device can read the temperature information of the chip test through the probe. Figure 2 , Figure 2 A flow chart of a temperature sensor calibration method provided in an embodiment of the present application is shown, which is applied to a calibration device. The method comprises the following steps:

[0066] S201, acquiring first temperature information and second temperature information, wherein the first temperature information is used to indicate the temperature of the test environment measured by a plurality of target chips among the plurality of chips, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor;

[0067] S202: Determine calibration information according to the first temperature information and the second temperature information, and write the calibration information into the corresponding target chip.

[0068] Optionally, the first temperature information is used to indicate the temperature of the test environment measured by a target chip among the multiple chips at a first moment, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor at the first moment.

[0069] Optionally, the obtaining of the first temperature information and the second temperature information comprises: controlling the probe station to provide a test environment of multiple temperatures for the first temperature sensor; obtaining the first temperature information and the second temperature information corresponding to each test environment of the temperature;

[0070] Determining the calibration information according to the first temperature information and the second temperature information includes: determining the calibration information according to the first temperature information and the second temperature information corresponding to a plurality of the temperature test environments.

[0071] Optionally, the determining calibration information according to the first temperature information and the second temperature information corresponding to the test environments at a plurality of temperatures includes:

[0072] Determine sub-calibration information according to the first temperature information and the second temperature information corresponding to the test environment of each temperature;

[0073] Calibration information is determined according to the plurality of sub-calibration information.

[0074] Optionally, the acquiring the first temperature information and the second temperature information includes:

[0075] Acquire an image of the wafer, identify a plurality of the chips in the image, and construct a coordinate system according to the plurality of the chips in the image;

[0076] Acquire the coordinates of each target chip in the coordinate system and a plurality of first temperature information and second temperature information corresponding to each target chip;

[0077] Establishing an association relationship between the coordinates of each target chip and the first temperature information and the second temperature information;

[0078] The determining calibration information according to the first temperature information and the second temperature information includes:

[0079] Determine, according to the association relationship, a plurality of first temperature information and second temperature information corresponding to each target chip;

[0080] The calibration information corresponding to the target chip is determined according to the plurality of first temperature information and the second temperature information corresponding to the target chip.

[0081] See also Figure 3 , shows a schematic diagram of the structure of a calibration device provided in an embodiment of the present application; for ease of explanation, only the parts related to the embodiment of the present application are shown.

[0082] The calibration device may specifically include the following modules:

[0083] an acquisition module, configured to acquire first temperature information and second temperature information, wherein the first temperature information is used to indicate the temperature of the test environment measured by a plurality of target chips among the plurality of chips, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor;

[0084] The calibration module is used to determine calibration information according to the first temperature information and the second temperature information, and write the calibration information into the corresponding target chip.

[0085] Optionally, the first temperature information is used to indicate the temperature of the test environment measured by a target chip among the multiple chips at a first moment, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor at the first moment.

[0086] Optionally, the obtaining of the first temperature information and the second temperature information comprises: controlling the probe station to provide a test environment of multiple temperatures for the first temperature sensor; obtaining the first temperature information and the second temperature information corresponding to each test environment of the temperature;

[0087] Determining the calibration information according to the first temperature information and the second temperature information includes: determining the calibration information according to the first temperature information and the second temperature information corresponding to a plurality of the temperature test environments.

[0088] Optionally, the determining calibration information according to the first temperature information and the second temperature information corresponding to the test environments at a plurality of temperatures includes:

[0089] Determine sub-calibration information according to the first temperature information and the second temperature information corresponding to the test environment of each temperature;

[0090] Calibration information is determined according to the plurality of sub-calibration information.

[0091] Optionally, the acquiring the first temperature information and the second temperature information includes:

[0092] Acquire an image of the wafer, identify a plurality of the chips in the image, and construct a coordinate system according to the plurality of the chips in the image;

[0093] Acquire the coordinates of each target chip in the coordinate system and a plurality of first temperature information and second temperature information corresponding to each target chip;

[0094] Establishing an association relationship between the coordinates of each target chip and the first temperature information and the second temperature information;

[0095] The determining calibration information according to the first temperature information and the second temperature information includes:

[0096] Determine, according to the association relationship, a plurality of first temperature information and second temperature information corresponding to each target chip;

[0097] The calibration information corresponding to the target chip is determined according to the plurality of first temperature information and the second temperature information corresponding to the target chip.

[0098] The temperature sensor calibration device provided in the embodiment of the present application can be applied in the aforementioned method embodiment. For details, please refer to the description of the aforementioned method embodiment, which will not be repeated here.

[0099] Figure 4 is a structural block diagram of a calibration device provided in an embodiment of the present application. Figure 4 As shown, the calibration device 400 of this embodiment includes: a processor 410, a memory 420, and a computer program 430 stored in the memory 420 and executable on the processor 410, such as a prediction program for temperature sensor calibration. When the processor 410 executes the computer program 430, the steps in each embodiment of the above-mentioned temperature sensor calibration method are implemented, such as Figure 2 Alternatively, the processor 410 implements the above-mentioned method when executing the computer program 430 Figure 3 The functions of each module in the corresponding embodiment.

[0100] Exemplarily, the computer program 430 may be divided into one or more modules, one or more modules are stored in the memory 420, and are executed by the processor 410 to complete the present application. One or more modules may be a series of computer program instruction segments capable of completing specific functions, and the instruction segments are used to describe the execution process of the computer program 430 in the calibration device 400. For example, the computer program 430 may be divided into various unit modules, and the specific functions of each module are as described above.

[0101] The calibration device 400 may include, but is not limited to, a processor 410 and a memory 420. Those skilled in the art will appreciate that Figure 4 It is only an example of the calibration device 400 and does not constitute a limitation of the calibration device 400. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the calibration device may also include input and output devices, network access devices, buses, etc.

[0102] The processor 410 may be a central processing unit, or other general-purpose processors, digital signal processors, application-specific integrated circuits, off-the-shelf programmable gate arrays or other programmable logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0103] The memory 420 may be an internal storage unit of the calibration device 400, such as a hard disk or memory of the calibration device 400. The memory 420 may also be an external storage device of the calibration device 400, such as a plug-in hard disk, a smart memory card, a flash memory card, etc. equipped on the calibration device 400. Furthermore, the memory 420 may also include both an internal storage unit of the calibration device 400 and an external storage device.

[0104] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0105] In some embodiments, the present application provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the temperature sensor calibration method described in any of the above embodiments is implemented.

[0106] In some embodiments, the present application provides a computer program product, which, when executed on a calibration device, enables the calibration device to perform the temperature sensor calibration method described in any of the above embodiments. In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0107] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0108] In the embodiments provided in the present application, it should be understood that the disclosed devices / electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0109] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0110] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0111] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0112] The present application implements all or part of the processes in the above-mentioned embodiment method, and may also be completed through a computer program product. When the computer program product runs on an electronic device, the electronic device can implement the steps in the above-mentioned method embodiments when executing.

[0113] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application is described in detail with reference to the above-mentioned embodiments, a person skilled in the art should understand that the technical solutions described in the above-mentioned embodiments can still be modified, or some of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A temperature sensor calibration method, characterized in that: Applied to a calibration device, the calibration device is connected to a probe station, the calibration device is used to perform temperature calibration on a first temperature sensor, a wafer of the first temperature sensor is placed on a wafer tray of the probe station, the wafer tray is provided with a second temperature sensor; the wafer has a plurality of unpackaged chips; The probe station is used to provide a test environment with a specific temperature for the wafer; The method comprises: Acquire first temperature information and second temperature information, wherein the first temperature information is used to indicate the temperature of the test environment measured by a plurality of target chips among the plurality of chips, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor; Calibration information is determined according to the first temperature information and the second temperature information, and the calibration information is written into the corresponding target chip.

2. The method according to claim 1, characterized in that The first temperature information is used to indicate the temperature of the test environment measured by a target chip among the multiple chips at a first moment, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor at the first moment.

3. The method according to claim 1 or 2, characterized in that The obtaining of the first temperature information and the second temperature information comprises: Controlling the probe station to provide a test environment with multiple temperatures for the first temperature sensor; Acquire the first temperature information and the second temperature information corresponding to each of the temperature test environments; The determining calibration information according to the first temperature information and the second temperature information includes: The calibration information is determined according to the first temperature information and the second temperature information corresponding to the test environments at the multiple temperatures.

4. The method according to claim 3, characterized in that The determining calibration information according to the first temperature information and the second temperature information corresponding to the test environments of the multiple temperatures includes: Determine sub-calibration information according to the first temperature information and the second temperature information corresponding to the test environment of each temperature; Calibration information is determined according to the plurality of sub-calibration information.

5. The method according to claim 1 or 2, characterized in that: The obtaining of the first temperature information and the second temperature information comprises: Acquire an image of the wafer, identify a plurality of the chips in the image, and construct a coordinate system according to the plurality of the chips in the image; Acquire the coordinates of each target chip in the coordinate system and a plurality of first temperature information and second temperature information corresponding to each target chip; Establishing an association relationship between the coordinates of each target chip and the first temperature information and the second temperature information; The determining calibration information according to the first temperature information and the second temperature information includes: Determine, according to the association relationship, a plurality of first temperature information and second temperature information corresponding to each target chip; The calibration information corresponding to the target chip is determined according to the plurality of first temperature information and the second temperature information corresponding to the target chip.

6. A calibration device, characterized in that: include: an acquisition module, configured to acquire first temperature information and second temperature information, wherein the first temperature information is used to indicate the temperature of the test environment measured by a plurality of target chips among the plurality of chips, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor; The calibration module is used to determine calibration information according to the first temperature information and the second temperature information, and write the calibration information into the corresponding target chip.

7. A temperature sensor calibration system, characterized in that: The calibration system includes a calibration device and a probe station, wherein the calibration device is connected to the probe station, and the calibration device is used to perform temperature calibration on a first temperature sensor, wherein a wafer of the first temperature sensor is placed on a wafer tray of the probe station, and the wafer tray is provided with a second temperature sensor; the wafer has a plurality of unpackaged chips; and the probe station is used to provide a test environment of a specific temperature for the wafer; The calibration device is used to obtain first temperature information and second temperature information, wherein the first temperature information is used to indicate the temperature of the test environment measured by multiple target chips among the multiple chips, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor; The calibration device is used to determine calibration information according to the first temperature information and the second temperature information, and write the calibration information into the corresponding target chip.

8. The calibration system according to claim 7, characterized in that The first temperature information is used to indicate the temperature of the test environment measured by a target chip among the multiple chips at a first moment, and the second temperature information is used to indicate the temperature of the test environment measured by the second temperature sensor at the first moment.

9. A calibration device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 5 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method according to any one of claims 1 to 5 when executed.

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