Projection device, projection device and projection equipment

Abstract

The invention relates to a projection device, a projection device and projection equipment, the projection device comprises a light source assembly and a scanning reflection assembly, the scanning reflection assembly is used for receiving light emitted by the light source assembly and deflecting the light, and scanning is carried out through the light to form a projection image; the scanning reflection assembly comprises a reflector, the reflector comprises a substrate and a reflection layer located on the substrate, and the material of the substrate comprises silicon carbide. The reflector adopts the substrate comprising silicon carbide, and the silicon carbide has relatively large forbidden bandwidth, saturated electron drift rate, heat conductivity and breakdown electric field intensity, so that the heat dissipation capability, the limit working temperature, the corresponding speed, the working frequency and the like of the reflector are improved, and the working performance of the projection device can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of projection technology, and in particular to a projection device, a projection apparatus and a projection equipment. Background Art

[0002] In the related art, projection devices mostly use MEMS (Micro-Electro-Mechanical System, MEMS) scanning reflection components to control the reflection direction of light, thereby forming a projection image. The MEMS scanning reflection component will generate a lot of heat during operation, causing the surrounding temperature to rise. The reflector in the MEMS scanning reflection component usually uses silicon material as a substrate. The thermal conductivity of silicon material is low, resulting in poor heat dissipation effect of the reflector. In addition, the cantilever and other tiny structures used to realize the rotation of the reflector in the MEMS scanning reflection component are prone to material fatigue at high temperatures, resulting in fracture or damage, which affects the service life of the projection device. Summary of the invention

[0003] The embodiments of the present disclosure provide a projection device, a projection apparatus and a projection equipment, which improve the heat dissipation effect of the MEMS scanning reflection component, thereby increasing the service life of the microstructures in the MEMS scanning reflection component, so as to at least partially solve the above technical problems.

[0004] In order to achieve the above-mentioned purpose, according to the first aspect of the present disclosure, there is provided a projection device, comprising: a light source assembly and a scanning and reflecting assembly, wherein the scanning and reflecting assembly is used to receive light emitted by the light source assembly and deflect the light so as to form a projection image by scanning the light; the scanning and reflecting assembly comprises a reflector, wherein the reflector comprises a substrate and a reflective layer located on the substrate, and the material of the substrate comprises silicon carbide.

[0005] Optionally, the silicon carbide includes at least one of 3C-SiC, 4H-SiC, and 6H-SiC.

[0006] Optionally, the light source assembly includes a light source and a light adjusting component, the light source is used to emit a light beam, and the light adjusting component is located on a propagation path of the light beam to collimate the light beam to form a light beam for sending to the scanning reflection assembly.

[0007] Optionally, the light source includes a laser, and the light source assembly further includes a speckle reduction component located between the laser and the light adjustment component, wherein the speckle reduction component is used to receive a laser beam from the laser and transmit the laser beam to the light adjustment component after performing speckle reduction.

[0008] Optionally, the light source assembly further comprises a heat dissipation mechanism disposed on one side of the laser to dissipate heat from the heat dissipation mechanism.

[0009] Optionally, the heat dissipation mechanism includes a semiconductor thermoelectric cooling sheet.

[0010] Optionally, the light adjusting member comprises a collimating lens.

[0011] Optionally, the scanning reflection assembly further includes a driving mechanism for driving the reflection mirror to deflect.

[0012] Optionally, the driving mechanism includes a MEMS driving motor.

[0013] According to a second aspect of the present disclosure, a projection device is provided, comprising at least one projection device as described in any one of the above embodiments.

[0014] Optionally, the projection device includes a plurality of the projection devices arranged side by side or in an array, and the projection images formed by the plurality of projection devices together form a display image.

[0015] Optionally, the projection device further includes a housing and a projection lens fixed on the housing, the light source assembly and the scanning and reflecting assembly are located inside the housing, and the projection lens is used to receive the light deflected by the scanning and reflecting assembly.

[0016] According to a third aspect of the present disclosure, a projection device is also provided, comprising a controller and at least one projection device as described in any of the above embodiments, wherein the controller is electrically connected to the light source assembly and the scanning reflection assembly, and the controller is used to output a light generation signal to the light source assembly to control the light source assembly to emit the light, and output a deflection signal to the scanning reflection assembly to control the scanning reflection assembly to deflect the light according to the deflection signal.

[0017] For the projection device of the embodiment of the present disclosure, since the material of the substrate of the reflector includes silicon carbide, compared with silicon, the bandgap width, saturated electron drift rate, thermal conductivity and breakdown electric field strength of silicon carbide are significantly improved. Since silicon carbide has a relatively large thermal conductivity, the heat dissipation capacity of the reflector is effectively improved, so that the scanning reflection component can always work under a good temperature condition, so that the cantilever and other micro structures in the reflector can be avoided from fatigue and fracture; and, since the heat dissipation capacity of the reflector is improved, it can also avoid the need to set up an additional heat sink to dissipate heat for the reflector, which is conducive to the miniaturization of the projection device. In addition, since silicon carbide has a relatively large bandgap width and breakdown electric field strength, it also means that the reflector can work at a higher voltage, thereby achieving a higher operating frequency; and, since silicon carbide has a relatively large saturated electron drift rate, it also means that under a high electric field, electrons can move faster in the material, which helps to improve the response speed and optical power density of the reflector. Therefore, based on the fact that the reflector in the present disclosure adopts a silicon carbide substrate, the reflector has stronger structural stability, higher extreme operating temperature, wider operating temperature range, lower heat dissipation requirements, lower working condition requirements, faster response speed, and higher operating frequency, so that the projection device has a longer service life, better environmental adaptability, higher projection resolution and projection brightness, thereby improving the user's perception of the projected image and the user experience of the projection device.

[0018] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0020] In order to more completely understand the present disclosure and its beneficial effects, the following description will be made in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0021] Figure 1 is a schematic diagram of the structure of a projection device provided by some embodiments of the present disclosure;

[0022] Figure 2 is a schematic diagram of the structure of a projection device provided by other embodiments of the present disclosure;

[0023] Figure 3 is a schematic diagram of the structure of a projection device provided by some embodiments of the present disclosure;

[0024] Figure 4 is a schematic diagram of the structure of a projection device provided in some embodiments of the present disclosure;

[0025] Figure 5 It is a schematic diagram of the structure of a projection device provided in some other embodiments of the present disclosure.

[0026] Description of reference numerals:

[0027] 10. Projection device; 100. Projection device; 11. Light source assembly; 110. Laser; 111. Light source; 112. Light adjustment member; 113. Speckle reduction member; 114. Heat dissipation mechanism; 12. Scanning reflection assembly; 120. Reflector; 1201. Base; 1202. Reflection layer; 121. Driving mechanism;

[0028] 21. housing; 22. projection lens; 23. cooling fan; 200. projection equipment;

[0029] 31. Controller. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0031] The present disclosure provides a projection device, see Figure 1 , Figure 1 The schematic diagram of the structure of the projection device 10 provided in the embodiment of the present disclosure is as follows. The projection device 10 includes a light source component 11 and a scanning reflection component 12.

[0032] The scanning reflection component 12 is used to receive the light emitted by the light source component 11 and deflect the received light so as to form a projection image by scanning this part of the light.

[0033] Specifically, after the light from the light source component 11 is deflected by the scanning and reflecting component 12, the light is reflected to a specific position and forms a single pixel point. The scanning and reflecting component 12 can form multiple pixel points at a specific position under high-speed movement to satisfy the visual persistence effect of the human eye and ultimately form a perceptible projection image.

[0034] The scanning reflection assembly 12 includes a reflection mirror 120 and a driving mechanism 121 for driving the reflection mirror 120 to deflect. For example, the driving mechanism 121 is a MEMS (Micro-Electro-Mechanical System, MEMS) driving motor. The MEMS driving motor is a driving motor made by micro-electromechanical system technology. For ease of description, the scanning reflection assembly 12 including the MEMS driving motor is referred to as the MEMS scanning reflection assembly below.

[0035] The reflector 120 includes a substrate 1201 and a reflective layer 1202 located on the substrate 1201. The reflective layer 1202 is used to reflect the light from the light source assembly 11. Due to the driving mechanism 121 driving the reflector, the reflected light can be deflected to a specific position according to a set direction. In addition, based on the continuous reflection of the light from the light source assembly 11 by the driving mechanism 121, a projection image can be scanned.

[0036] The material of the substrate 1201 includes silicon carbide.

[0037] In order to satisfy the persistence of vision effect of the human eye, the reflector 120 usually has a high rotation speed when driven by the MEMS drive motor, which easily generates a high temperature around the reflector 120. Microstructures such as the cantilever in the reflector 120 are prone to fatigue under high temperature, which in turn leads to problems such as cantilever breakage. In the related art, the substrate of the reflector is usually made of silicon material, and the thermal conductivity of silicon material is low, resulting in poor heat dissipation effect of the reflector. Therefore, the stability of microstructures such as the cantilever is poor, which in turn affects the service life of the projection device.

[0038] As for the projection device 10 provided by the present disclosure, since the material of the substrate 1201 of the reflector 120 includes silicon carbide, as shown in Table 1, compared with silicon, the band gap width, saturated electron drift velocity, thermal conductivity, breakdown electric field strength and other characteristics of silicon carbide are significantly improved. Since silicon carbide has a relatively large thermal conductivity, the heat dissipation capacity of the reflector 120 is effectively improved, so that the MEMS scanning reflection component can always work under a good temperature condition, so that the cantilever and other micro structures in the reflector 120 can be prevented from fatigue and fracture; and since the heat dissipation capacity of the reflector 120 is improved, it can also avoid the need to set up an additional heat sink to dissipate heat from the reflector 120, which is conducive to the miniaturization of the projection device 10. In addition, since silicon carbide has a relatively large bandgap width and breakdown electric field strength, this also means that the reflector 120 can operate at a higher voltage, thereby achieving a higher operating frequency; and, since silicon carbide has a relatively large saturated electron drift rate, this also means that under a high electric field, electrons can move faster in the material, which helps to improve the response speed and optical power density of the reflector 120. Therefore, based on the reflector 120 in the present disclosure using a silicon carbide substrate 1201, the reflector 120 has a stronger structural stability, a higher limit operating temperature, a wider operating temperature range, lower heat dissipation requirements, lower working condition requirements, a faster response speed, and a higher operating frequency, so that the projection device 10 has a longer service life, better environmental adaptability, higher projection resolution and projection brightness, thereby improving the user's perception of the projected image and the user experience of the projection device 10.

[0039]

[0040] Table 1

[0041] In some embodiments, silicon carbide includes at least one of 3C-SiC, 4H-SiC, and 6H-SiC.

[0042] For example, silicon carbide includes 3C-SiC. In this case, compared with silicon, 3C-SiC has a more obvious improvement in bandgap width and breakdown electric field strength, and 3C-SiC has a significant improvement in saturated electron drift rate and thermal conductivity. Therefore, using 3C-SiC as the substrate material can make the reflector 120 more structurally stable, more responsive, and have a higher operating frequency, thereby extending the service life of the projection device 10 and enabling the projection device 10 to adapt to applications with higher-precision projection images.

[0043] For example, silicon carbide includes 4H-SiC. In this case, compared with silicon, 4H-SiC has significantly improved bandgap width, saturated electron drift velocity, thermal conductivity and breakdown electric field strength. Therefore, using 4H-SiC as the substrate material allows the reflector 120 to have good structural stability, faster response speed, and higher operating frequency, thereby achieving excellent working state and performance, so as to ensure that the projection device can have a longer service life and stably and efficiently output high-precision projection images.

[0044] For example, silicon carbide includes 6H-SiC. In this case, compared with silicon, 6H-SiC has a significant improvement in bandgap width, saturated electron drift velocity, thermal conductivity, and breakdown electric field strength. Therefore, using 6H-SiC as the substrate material allows the reflector 120 to have good structural stability, faster response speed, and higher operating frequency, thereby achieving excellent working state and performance, so as to ensure that the projection device can have a longer service life and stably and efficiently output high-precision projection images.

[0045] In some examples, the reflective layer 1202 may be adhered to the substrate 1201. For example, an adhesive layer is provided between the reflective layer 1202 and the substrate 1201 so that the reflective layer 1202 is fixed to the substrate 1201.

[0046] In some examples, the reflective layer 1202 may be a metal reflective film, for example, the material of the reflective layer is a metal such as gold, silver or aluminum.

[0047] In some examples, the MEMS scanning reflection component may be a single-axis scanning reflection component or a dual-axis scanning reflection component, which may be selected according to actual needs.

[0048] In some embodiments, Figure 1 and Figure 2 As shown, the light source assembly 11 includes a light source 111 and a light adjusting member 112 , wherein the light source 111 is used to emit a light beam, and the light adjusting member 112 is located on the propagation path of the light beam to collimate the light beam and form a light beam for sending to the scanning reflection assembly 12 .

[0049] Normally, the light beam emitted by the light source 111 is relatively divergent, and through the adjustment of the light adjusting member 112 , the light beam directed to the scanning reflective component 12 can be more collimated, thereby improving the projection quality of the projection device 10 .

[0050] It is worth noting that the light beam emitted by the light source 111 and the light collimated by the light adjusting member 112 are only for distinguishing the light at different positions, and do not limit the intensity, illumination and other characteristics of the light.

[0051] In some examples, the light adjusting member 112 may include a collimating lens, so that the divergent light beams from the light source 111 can be formed into parallel light beams, thereby facilitating the reflection of the scanning reflective component 12 to present good projection quality. For example, the collimating lens may be a spherical lens or an aspherical lens, which is not limited in the present application.

[0052] In other examples, the light adjusting member 112 may also include a single lens or a combination of multiple lenses other than the collimating lens. For example, the light adjusting member 112 includes multiple lenses for adjusting the refraction direction of the light, and the light beam of the light source 111 is adjusted by arranging multiple lenses so that the quality of the light received by the scanning and reflecting component 12 is better, thereby improving the projection effect of the projection device 10. In addition, the light adjusting member 112 may also include a reflector or a combination of multiple reflectors so that the light can be effectively received by the scanning and reflecting component 12.

[0053] In some embodiments, Figure 2 As shown, the light source includes a laser 110 , and the light source assembly 11 also includes a speckle reduction member 113 located between the laser 110 and the light adjustment member 112 , and the speckle reduction member 113 is used to receive the laser beam from the laser 110 and output the laser beam after speckle reduction to the light adjustment member 112 .

[0054] It is worth noting that when the laser 110 is used as the light source 111, since the laser emitted by the laser 110 has strong coherence, random speckles or granular patterns will be generated during imaging, thereby affecting the appearance of the projected image and causing a poor user experience.

[0055] Since the speckle reduction element 113 is provided in the embodiment of the present disclosure, the speckle generated by the laser beam emitted by the laser 110 is reduced, which can improve the quality of the projected image and further improve the user experience.

[0056] In some examples, the speckle reduction element 113 may be a homogenized diffractive optical element (DOE). For example, the speckle reduction element 113 may be made of homogenized glass.

[0057] In other examples, the speckle reduction element 113 may also be implemented by a structure having a vibrating rough surface (e.g., a rough mirror surface). The embodiment of the present disclosure does not limit the selection and specific structural design of the speckle reduction element 113, as long as it can achieve speckle reduction of the laser beam emitted by the laser 110.

[0058] In some examples, the laser 110 may be an RGB laser that can emit red, green, and blue laser beams to display a color projection image.

[0059] In the case of using RGB laser, the RGB laser will first emit three laser beams of red, green and blue, which are coupled to the reflector surface of the MEMS scanning reflective component 12 through the light adjustment member 112. Secondly, the control system will calculate and control the deflection angle and deflection speed of the MEMS scanning reflective component 12 according to the information of the image to be projected, and deflect the laser light to a specific position, where the light forms a pixel point.

[0060] After completing the deflection of one pixel, the MEMS scanning reflective component 12 will repeat the previous steps for the remaining pixels until a complete frame of image is scanned. Although only one independent pixel point appears on the imaging surface each time, due to the persistence of the human eye, the human eye and brain can perceive each frame of image from point to surface, thereby realizing the viewing of the projected image.

[0061] In some embodiments, Figure 2 As shown, the light source assembly further includes a heat dissipation mechanism 114 located on one side of the laser 110 , and the heat dissipation mechanism 114 dissipates heat for the laser 110 .

[0062] Since the laser 110 generates a lot of heat during operation, the temperature change of the laser 110 will have a significant impact on its output power, and the temperature change is also likely to cause the laser wavelength to drift and affect the output stability of the laser beam. The embodiment of the present disclosure provides a heat dissipation mechanism 114 on one side of the laser 110 to dissipate the heat generated by the laser 110, which is conducive to ensuring the working stability of the laser 110, thereby ensuring that the projected image always presents a good look.

[0063] In some examples, the heat dissipation mechanism 114 may include a semiconductor thermoelectric cooler (TEC). The semiconductor thermoelectric cooler utilizes the Peltier effect of semiconductor materials. When direct current passes through a couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple, thereby achieving the purpose of cooling. This method has the advantages of no moving parts, high reliability, and precise temperature control, and can be effectively applied to the temperature control of the laser 110 to ensure the working stability of the laser 110. In addition, the semiconductor thermoelectric cooler is also conducive to the lightweight and miniaturization of the light source assembly 11, thereby improving the spatial layout efficiency of the projection device 10.

[0064] In some examples, the heat dissipation mechanism 114 may be fixed on the laser 110. In other examples, the heat dissipation mechanism 114 may also be integrated into the laser 110. In this way, the temperature control effect of the heat dissipation mechanism 114 on the laser 110 can be guaranteed.

[0065] Some embodiments of the present disclosure also provide a projection device, such as Figure 3 As shown, the projection device 100 includes one or more projection devices 10 described in any of the above embodiments.

[0066] Since the projection device 10 is included, the projection apparatus 100 has all the technical effects of the projection device 10 , which will not be described in detail herein.

[0067] It is worth noting that, since the projection device 10 uses a MEMS scanning reflective component to achieve projection, compared with the digital light processing (DLP) method, it eliminates the need to set up several digital micromirror devices (DMD). Therefore, the cost of the projection device 10 and the projection device 100 can be effectively controlled, thereby facilitating their promotion.

[0068] In some embodiments, the projection device 100 includes a plurality of projection devices 10 , which are arranged side by side or in an array, and projection images formed by the plurality of projection devices 10 are spliced ​​to form a display image.

[0069] The arrangement of the multiple projection devices 10 is related to the size of the display image finally formed. For example, when the display image is rectangular, the multiple projection devices 10 can be arranged in parallel along a direction, each projection device 10 scans a corresponding partial area, and the areas scanned by the multiple projection devices 10 together constitute the area corresponding to the display image. Of course, when the multiple projection devices 10 are arranged in an array, the projection images formed by the multiple projection devices 10 can also be spliced ​​together to form a display image.

[0070] By arranging a plurality of projection devices 10 in the above manner and splicing a plurality of projection images to form a display image, it is helpful to improve the resolution of the display image, thereby improving the user experience.

[0071] In some embodiments, Figure 3 As shown, the projection device 100 further includes a housing 21 and a projection lens 22 fixed on the housing 21 . The light source assembly 11 and the scanning reflection assembly 12 are located in the housing 21 . The projection lens 22 is used to receive the light deflected by the scanning reflection assembly 12 .

[0072] The projection lens 22 can modulate the light from the projection device 10 so that the modulated light is emitted to the receiving component (such as a projection screen or other projection components) outside the housing 21 to meet the viewing needs of the user. In addition, the modulation of the light by the projection lens 22 can also improve the clarity of the final projected image to enhance the viewing experience of the user.

[0073] In some examples, the projection lens 22 may also magnify or reduce the projected image or the displayed image to meet the viewing needs of the user.

[0074] In some examples, all components included in the projection device 10 are fixed in the housing 21 to ensure the stability of the relative position relationship of each component, thereby ensuring that the projection device 100 can stably output the projection image.

[0075] In some examples, the projection device 100 also includes a shock-absorbing mechanism, which is used to buffer the vibration of the components inside the shell 21 and fixed on the shell 21, thereby preventing the components in the projection device 100 from being vibrated and causing functional damage or falling off, which ultimately affects the stable operation of the projection device 100.

[0076] For example, the shock absorbing mechanism includes a rubber member, and the projection lens 22 and the projection device 10 and other devices can be fixed to the housing 21 by the rubber member to prevent resonance between the housing 21 and the above devices (including the projection lens 22). Of course, when the rubber member is used for fixing, the rubber member and the above devices can be fixed by bonding.

[0077] In some examples, such as Figure 3 As shown, the projection device 100 further includes a heat dissipation fan 23 located in the housing 21 , so as to utilize the heat dissipation fan 23 to dissipate heat inside the projection device 100 .

[0078] Some embodiments of the present disclosure also provide a projection device, such as Figure 4 As shown, the projection device 200 includes a controller 31 and one or more projection devices described in any of the above embodiments. The controller 31 is electrically connected to the light source assembly 11 and the scanning reflection assembly 12. The controller is used to output a light generation signal to the light source assembly 11 to control the light source assembly 11 to emit the light, and to output a deflection signal to the scanning reflection assembly 12 to control the scanning reflection assembly 12 to deflect the light according to the deflection signal, thereby finally forming a projection image.

[0079] In some examples, the controller 31 is electrically connected to the light source 111 (eg, the laser 110 ), and the controller 31 can output a light generation signal to the light source 111 , and the light source 111 can emit a light beam after receiving the light generation signal.

[0080] In some examples, a modulator is further provided at the output end of the controller 31, and a demodulator is further provided at the light source 111. By modulating and demodulating the light generated signal output by the controller 31, the signal transmission efficiency can be improved and signal interference can be reduced.

[0081] In some examples, the controller 31 is electrically connected to the driving mechanism 121, and the controller 31 can output a deflection signal to the driving mechanism 121. After receiving the deflection signal, the driving mechanism 121 deflects the reflector 120, thereby deflecting and scanning the light to form a projection image.

[0082] In some examples, such as Figure 5 As shown, the controller 31 can also receive data on the actual deflection of the driving mechanism 121, so as to correct the deflection signal subsequently output to the driving mechanism 121, so that the deflection action of the driving mechanism 121 to drive the reflector 120 can adapt to the light generation signal output by the controller 31 to the light source 111, thereby ensuring that a stable and clear projection image is finally formed.

[0083] In some examples, the projection device 200 may further include a wireless connection mechanism, and input a signal to the controller 31 through the wireless connection mechanism, so that the projection device 200 performs corresponding operations, thereby improving the additional attributes of the product.

[0084] In the description of the present disclosure, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0085] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0086] The embodiments, implementation methods and related technical features of the present disclosure may be combined or replaced with each other unless there is any conflict.

[0087] The above are only preferred embodiments of the present disclosure and are not intended to limit the present disclosure in any form. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure are still within the scope of the technical solution of the present disclosure.

Claims

1. A projection device, characterized in that: include: a light source assembly (11); and A scanning and reflecting component (12) is used to receive light emitted by a light source component (11) and deflect the light so as to form a projection image by scanning the light; the scanning and reflecting component (12) comprises a reflecting mirror (120), the reflecting mirror (120) comprises a substrate (1201) and a reflecting layer (1202) located on the substrate (1201), and the material of the substrate (1201) comprises silicon carbide.

2. The projection device according to claim 1, characterized in that: The silicon carbide includes at least one of 3C-SiC, 4H-SiC, and 6H-SiC.

3. The projection device according to claim 1 or 2, characterized in that: The light source component (11) comprises a light source (111) and a light adjustment member (112); the light source (111) is used to emit a light beam; the light adjustment member (112) is located on a propagation path of the light beam to collimate the light beam to form a light beam for sending to the scanning reflection component (12).

4. The projection device according to claim 3, characterized in that: The light source (111) comprises a laser (110), and the light source assembly (11) further comprises a speckle reduction component (113) located between the laser (110) and the light adjustment component (112), wherein the speckle reduction component (113) is used to receive a laser beam from the laser (110) and transmit the laser beam to the light adjustment component (112) after performing speckle reduction.

5. The projection device according to claim 4, characterized in that: The light source assembly (11) further comprises a heat dissipation mechanism (114) arranged on one side of the laser (110) to dissipate heat from the laser (110).

6. The projection device according to claim 5, characterized in that: The heat dissipation mechanism (114) comprises a semiconductor thermoelectric cooling sheet.

7. The projection device according to claim 3, characterized in that: The light adjusting member (112) comprises a collimating lens for collimating the light beam.

8. The projection device according to claim 1, characterized in that: The scanning reflection component (12) also includes a driving mechanism (121) for driving the reflection mirror (120) to deflect.

9. The projection device according to claim 8, characterized in that: The driving mechanism (121) comprises a MEMS driving motor.

10. A projection device, characterized in that: The method comprises at least one projection device (10) according to any one of claims 1 to 9.

11. The projection device according to claim 10, characterized in that: The projection device comprises a plurality of projection devices (10) arranged side by side or in an array, and projection images formed by the plurality of projection devices (10) together form a display image.

12. The projection device according to claim 10 or 11, characterized in that: The projection device (100) further comprises a housing (21) and a projection lens (22) fixed on the housing (21); the light source assembly (11) and the scanning reflection assembly (12) are located inside the housing (21); and the projection lens (22) is used for receiving light deflected by the scanning reflection assembly (12).

13. A projection device, characterized in that: include: Controller (31); as well as At least one projection device (10) according to any one of claims 1 to 9; The controller (31) is electrically connected to the light source component (11) and the scanning reflection component (12), and the controller (31) is used to output a light generation signal to the light source component (11) to control the light source component (11) to emit the light, and to output a deflection signal to the scanning reflection component (12) to control the scanning reflection component (12) to deflect the light according to the deflection signal.

Images