Assembly control system of radiator, electronic equipment and control method

Abstract

The invention provides an assembly control system of a radiator, electronic equipment and a control method, the assembly control system comprises a control module, the radiator, a plurality of screws, motors in one-to-one correspondence with the screws, and a chip arranged on a circuit board, the radiator is locked and attached to the circuit board through the plurality of screws and covers the chip, the heat dissipation module is used for dissipating heat of the chip; and the control module is used for controlling the motor to rotate the corresponding screw under the condition that the assembly state of the radiator is detected to be abnormal so as to adjust the gap between the chip and the radiator.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of computer control technology, and more specifically, to an assembly control system, electronic equipment, and control method for a radiator. Background Art

[0002] Nowadays, electronic products are becoming more and more powerful and more integrated. Heat dissipation directly affects the performance of a product. If the heat dissipation efficiency is high, the product casing can be made smaller, which can save more costs, slow down product aging, and prolong its service life.

[0003] SOC chip is an integrated circuit chip, which can effectively reduce the development cost of electronic / information system products, shorten the development cycle, and improve the competitiveness of products. It is the main product development method that the industry will adopt in the future. Integrated circuit is a microelectronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a tube shell to become a microstructure with the required circuit function.

[0004] Since there are many electrical components inside the chip, a lot of heat will be generated when working. If the heat is not dissipated in time, the processing speed of the chip will slow down. In severe cases, it may even spontaneously combust.

[0005] In the prior art, screws are usually used to fix the heat sink directly to the motherboard. However, the assembly accuracy of the heat sink is low, and the uniformity of the gap on the contact surface cannot be controlled, which often causes poor heat dissipation. Summary of the invention

[0006] An object of the embodiments of the present disclosure is to provide an assembly control system, an electronic device, and a control method for a radiator.

[0007] According to a first aspect of an embodiment of the present disclosure, there is provided an assembly control system for a heat sink, comprising a control module, a heat sink, a plurality of screws, a motor corresponding to each screw, and a chip disposed on a circuit board, wherein the heat sink is fixed to the circuit board by the plurality of screws and covers the chip to dissipate heat for the chip;

[0008] The control module is used to control the motor to rotate the corresponding screw to adjust the gap between the chip and the heat sink when it is detected that the assembly state of the heat sink is abnormal.

[0009] Optionally, the assembly control system further includes a plurality of pressure detection elements, which are distributed between the heat sink and the chip. The control module is used to obtain a first pressure applied to each pressure detection element, and determine whether the assembly state of the heat sink is abnormal based on the first pressure.

[0010] Optionally, the chip includes a chip wafer, the chip wafer is arranged on a side of the chip facing the heat sink, and the multiple pressure detection elements are distributed on the edge of the chip wafer and in contact with the heat sink.

[0011] Optionally, the control module is used to determine that the assembly state of the radiator is abnormal when the first pressure satisfies any one or more of the following:

[0012] The first pressure applied to any pressure detection element is less than or equal to a first threshold value;

[0013] The first pressure applied to any pressure detection element is greater than or equal to a second threshold value;

[0014] The difference between the first pressures applied to any two pressure detection elements is greater than or equal to a third threshold.

[0015] Optionally, the control module is used to control the first motor to lock the corresponding screw when the first pressure applied to the first pressure detection element is less than or equal to the first threshold value, so as to reduce the gap between the chip and the heat sink at a position corresponding to the first motor; wherein, the first motor is the motor closest to the first pressure detection element.

[0016] Optionally, the control module is used to control the second motor to loosen the corresponding screw to increase the gap between the chip and the heat sink at a position corresponding to the second motor when the first pressure applied to the second pressure detection element is greater than or equal to the second threshold value; wherein the second motor is the motor closest to the second pressure detection element.

[0017] Optionally, the control module is used to control the third motor to tighten the corresponding screws to reduce the gap between the chip and the heat sink at the corresponding position of the third motor when the difference between the first pressure applied to the third pressure sensing element and the first pressure applied to the fourth pressure sensing element is greater than or equal to the third threshold, the first pressure applied to the third pressure sensing element is less than the first pressure applied to the fourth pressure sensing element, and the difference between the first pressure applied to the third pressure sensing element and the fourth threshold is greater than the difference between the first pressure applied to the fourth pressure sensing element and the fourth threshold; wherein the third motor is the motor closest to the third pressure sensing element.

[0018] Optionally, the control module is used to determine that the assembly state of the heat sink is abnormal when the accumulated working time of the heat sink reaches a set time after the gap between the chip and the heat sink is adjusted.

[0019] Optionally, the assembly control system further includes a temperature detection element, wherein the temperature detection element is used to detect a first temperature of the chip, and determine whether the assembly state of the heat sink is abnormal according to the first temperature.

[0020] Optionally, the control module is used to control the motor to stop rotating the corresponding screw when the torque of the motor is greater than or equal to a fifth threshold.

[0021] Optionally, a heat dissipation interface material is provided between the chip and the heat sink, and the heat dissipation interface material is coated on the surface of the chip wafer facing the heat sink.

[0022] According to a second aspect of the present disclosure, an electronic device is provided, comprising the assembly control system according to the first aspect of the present disclosure.

[0023] According to a third aspect of the present disclosure, a control method for an assembly control system of a heat sink is provided, the assembly control system comprising a heat sink, a plurality of screws, a motor corresponding to each screw, and a chip disposed on a circuit board, the heat sink being fixed to the circuit board by the plurality of screws and covering the chip to dissipate heat for the chip;

[0024] The method comprises:

[0025] Detecting whether the assembly state of the radiator is abnormal;

[0026] When it is detected that the assembly state of the heat sink is abnormal, the motor is controlled to rotate the corresponding screw to adjust the gap between the chip and the heat sink.

[0027] Through the assembly control system of the heat sink disclosed in the present invention, when an abnormal assembly state of the heat sink is detected, the motor can be controlled to rotate the corresponding screw to adjust the gap between the chip and the heat sink, so that the heat sink can reach the optimal assembly state, ensure the consistency of the product's heat dissipation performance, and reduce fluctuations in the product's heat dissipation performance.

[0028] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0030] Figure 1 is a block diagram of an assembly control system for a radiator according to an embodiment of the present disclosure;

[0031] Figure 2 is a schematic diagram of a circuit board according to an embodiment of the present disclosure;

[0032] Figure 3 is a schematic diagram of an assembly control system for a radiator according to an embodiment of the present disclosure;

[0033] Figure 4 The figure is a flow chart of a control method of an assembly control system of a radiator according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0035] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0036] Technologies, methods and equipment known to persons of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods and equipment should be considered part of the specification.

[0037] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0038] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0039] <Control System Embodiment>

[0040] SOC is the abbreviation of an integrated circuit chip. The SOC chips mentioned in this article refer to integrated circuit chips.

[0041] The present disclosure provides an assembly control system for a heat sink of a SOC chip, such as Figure 1As shown, the assembly control system 1000 of the radiator may include a control module 1100, a radiator 1200, a plurality of screws 1300, a motor 1400 corresponding to each screw 1300, and a SOC chip 1600 disposed on a circuit board 1500. The radiator 1200 is fastened to the circuit board 1500 by means of a plurality of screws 1300 and covers the SOC chip 1600 to dissipate heat for the SOC chip 1600.

[0042] The control module 1100 is used to control the motor 1400 to rotate the corresponding screw 1300 to adjust the gap between the SOC chip 1600 and the heat sink 1200 when it is detected that the assembly state of the heat sink is abnormal.

[0043] Specifically, the motor 1400 rotating the corresponding screw 1300 may include tightening the corresponding screw 1300 or loosening the corresponding screw 1300 .

[0044] In this embodiment, a through hole corresponding to each screw 1300 is provided on the circuit board 1500, and a threaded hole corresponding to each screw 1300 is provided on the heat sink 1200. The screw 1300 can pass through the corresponding through hole on the circuit board 1500 and be locked with the corresponding threaded hole on the heat sink, so that the heat sink 1200 is locked to the circuit board 1500 by the screw 1300.

[0045] In an example, Figure 2 As shown, on the circuit board 1500, the through holes corresponding to the plurality of screws 1300 may be distributed around the SOC chip 1600. For example, the plurality of screws 1300 may be four screws, and the four screws may be four vertices of a rectangle, and the SOC chip 1600 is located in the rectangle.

[0046] like Figure 3 As shown, the heat sink assembly control system 1000 may further include a fixing plate 1900 , and the circuit board 1500 is fixed on the fixing plate 1900 .

[0047] In an example, Figure 3 As shown, the heat sink 1200 may include a heat sink fin 1210, a heat sink heat pipe 1220 and a heat sink copper plate 1230, and the threaded holes may be set on the heat sink copper plate 1230, and the heat sink copper plate 1230 faces the SOC chip.

[0048] In this embodiment, the controller 1100 can control the motor 1400 to rotate forward to tighten the corresponding screws 1300 and reduce the gap between the SOC chip 1600 and the radiator 1200 at the corresponding screw positions; the controller 1100 can also control the motor 1400 to rotate reversely to loosen the corresponding screws 1300 and increase the gap between the SOC chip 1600 and the radiator 1200 at the corresponding screw positions.

[0049] In this embodiment, the SOC chip 1600 includes a chip wafer (SOC Die), and the chip wafer is arranged on the side of the SOC chip 1600 facing the heat sink 1200. Adjusting the gap between the SOC chip 1600 and the heat sink 1200 may specifically be adjusting the gap between the chip wafer and the heat sink 1200.

[0050] Further, the chip wafer may be located at the center of the SOC chip 1600 .

[0051] In one embodiment, the abnormal assembly state of the heat sink may include at least one of the following:

[0052] The pressure of the heat sink on at least one position of the SOC chip is less than or equal to a first threshold;

[0053] The pressure of the radiator on at least one position of the SOC chip is greater than or equal to a second threshold;

[0054] The difference in pressure of the radiator on different positions of the SOC chip is greater than or equal to a third threshold.

[0055] After adjusting the gap between the SOC chip and the radiator, the cumulative working time of the radiator reaches the set time;

[0056] The temperature of the SOC chip is greater than or equal to a fifth threshold.

[0057] Among them, the first threshold, the second threshold, and the third threshold may be pressure values ​​pre-set according to application scenarios or specific requirements. For example, the first threshold may be 0.1N, the second threshold may be 2N, and the third threshold may be 1N.

[0058] The set time and the fifth threshold value may be set in advance according to application scenarios or specific requirements. For example, the set time may be one month or one year, and the fifth threshold value may be 75 degrees Celsius.

[0059] Through the assembly control system of the radiator disclosed in the present invention, when an abnormal assembly state of the radiator is detected, the motor can be controlled to rotate the corresponding screw to adjust the gap between the SOC chip and the radiator, so that the radiator can reach the optimal assembly state, ensure the consistency of the product's heat dissipation performance, and reduce fluctuations in the product's heat dissipation performance.

[0060] In one embodiment of the present disclosure, Figure 3 As shown, a heat dissipation interface material 1700 is disposed between the SOC chip 1600 and the heat sink 1200 , and the heat dissipation interface material 1700 is coated on the surface of the chip wafer (SOC Die) of the SOC chip 1600 facing the heat sink 1200 .

[0061] In one example, the thermal interface material 1700 may be liquid metal.

[0062] By providing the heat dissipation interface material 1700 between the SOC chip 1600 and the heat sink 1200 , the contact area between the SOC chip 1600 and the heat sink 1200 can be increased, thereby improving the heat dissipation effect.

[0063] In one embodiment of the present disclosure, Figure 2 and Figure 3 As shown, the assembly control system also includes a plurality of pressure detection elements 1800, which are distributed between the radiator 1200 and the SOC chip 1600. The control module 1100 is used to obtain a first pressure applied to each pressure detection element 1800, and determine whether the assembly state of the radiator is abnormal based on the first pressure.

[0064] In this embodiment, the pressure detection element 1800 may be a pressure plate or a stress plate, and the control module 1100 may detect the first pressure exerted on the pressure detection element 1800, ie, the pressure exerted by the heat sink on the SOC chip.

[0065] In one embodiment of the present disclosure, a plurality of pressure detection elements 1800 are distributed on the edge of the chip wafer facing the heat sink. Specifically, the chip wafer of the SOC chip 1600 may be rectangular, the plurality of pressure detection elements may be four pressure detection elements, and the four pressure detection elements 1800 may be respectively arranged at the corners of the chip wafer facing the heat sink, such as Figure 2 shown.

[0066] Further, a first surface of the pressure detection element contacts the chip wafer of the SOC chip 1600 , and a second surface of the pressure detection element contacts the heat sink.

[0067] The first pressure in this embodiment may be the most recently detected pressure value of the pressure detection element 1800, or may be the average or median of the pressure values ​​detected within the first period of time. The first period of time may be pre-set according to the application scenario or specific requirements, for example, the first period of time may be the past 1 minute.

[0068] In one embodiment of the present disclosure, the control module is used to determine that the assembly state of the radiator is abnormal when the first pressure satisfies any one or more of the following conditions:

[0069] The first pressure applied to any pressure detection element is less than or equal to a first threshold value;

[0070] The first pressure applied to any pressure detection element is greater than or equal to a second threshold value;

[0071] The difference between the first pressures applied to any two pressure detection elements is greater than or equal to a third threshold.

[0072] When the first pressures applied to all pressure detection elements are greater than the first threshold, the first pressures applied to all pressure detection elements are less than the second threshold, and the difference between the first pressures applied to any two pressure detection elements is less than the third threshold, it indicates that the assembly state of the radiator is normal and there is no need to rotate the screws to adjust the gap between the SOC chip and the radiator.

[0073] The control module 1100 is used to control the first motor to lock the corresponding screw when the first pressure applied to the first pressure detection element is less than or equal to the first threshold value, so as to reduce the gap between the SOC chip and the heat sink at the position corresponding to the first motor; wherein the first motor is the motor closest to the first pressure detection element, that is, the screw corresponding to the first motor is closest to the first pressure detection element. The first pressure detection element is any one or more pressure detection elements among the multiple pressure detection elements.

[0074] The control module 1100 is used to control the second motor to loosen the corresponding screw when the first pressure on the second pressure detection element is greater than or equal to the second threshold value, so as to increase the gap between the SOC chip and the radiator at the corresponding position of the second motor; wherein the second motor is the motor closest to the second pressure detection element, that is, the screw corresponding to the second motor is closest to the second pressure detection element. The second pressure detection element is any one or more pressure detection elements among the multiple pressure detection elements.

[0075] The control module 1100 is used to control the third motor to tighten the corresponding screws to reduce the gap between the SOC chip and the radiator at the corresponding position of the third motor when the difference between the first pressure received by the third pressure detection element and the first pressure received by the fourth pressure detection element is greater than or equal to the third threshold, the first pressure received by the third pressure detection element is less than the first pressure received by the fourth pressure detection element, and the difference between the first pressure received by the third pressure detection element and the fourth threshold is greater than the difference between the first pressure received by the fourth pressure detection element and the fourth threshold; wherein the third motor is the motor closest to the third pressure detection element, and the first pressure received by the third pressure detection element is less than the first pressure received by the fourth pressure detection element. wherein the third pressure detection element and the fourth pressure detection element are different pressure detection elements among the plurality of pressure detection elements.

[0076] The control module 1100 is used to control the third motor to loosen the corresponding screws to increase the gap between the SOC chip and the radiator at the corresponding position of the third motor when the difference between the first pressure applied to the third pressure sensing element and the first pressure applied to the fourth pressure sensing element is greater than or equal to the third threshold, the first pressure applied to the third pressure sensing element is greater than the first pressure applied to the fourth pressure sensing element, and the difference between the first pressure applied to the third pressure sensing element and the fourth threshold is greater than the difference between the first pressure applied to the fourth pressure sensing element and the fourth threshold.

[0077] The difference in this embodiment may be the absolute value of the difference between two values.

[0078] In this embodiment, the fourth threshold may be a value greater than the first threshold and less than the second threshold. For example, the fourth threshold may be an average value of the first threshold and the second threshold.

[0079] In one embodiment, the control module 1100 may control the motor 1400 to rotate the corresponding screw 1300 to a set angle when the first pressure determines that the assembly state of the radiator is abnormal, wherein the set angle may be pre-set according to the outer diameter of the screw. For example, the set angle may be 90 degrees.

[0080] Furthermore, when controlling the motor 1400 to rotate the corresponding screw 1300 to a set angle, the control module 1100 can re-acquire the first pressure applied to each pressure detection element 1800, and determine whether the assembly state of the radiator is abnormal based on the first pressure, and control the motor 1400 to rotate the corresponding screw 1300 to a set angle when the assembly state of the radiator is abnormal, and execute the detection control process in a loop until the assembly state of the radiator is normal.

[0081] In one embodiment of the present disclosure, the control module 1100 is used to determine that the assembly state of the radiator is abnormal when the accumulated working time of the radiator reaches a set time after the gap between the SOC chip and the radiator is adjusted.

[0082] After adjusting the gap between the SOC chip and the radiator and the accumulated working time of the radiator reaches the set time, it can be determined that the SOC chip and the radiator are loose, and the control module 1100 can control the motor to tighten the corresponding screws to lock the SOC chip and the radiator.

[0083] In one embodiment of the present disclosure, the control module is used to control the motor to stop rotating the corresponding screw when the torque of the motor rotation is greater than or equal to a fifth threshold.

[0084] The fifth threshold value may be pre-set according to application scenarios or specific requirements. When the torque of the motor is greater than or equal to the fifth threshold value, it indicates that the screw cannot continue to rotate and has been tightened to the maximum extent. Therefore, the motor may be controlled to stop rotating the corresponding screw.

[0085] In one embodiment of the present disclosure, the assembly control system further includes a temperature detection element, which is used to detect a first temperature of the SOC chip and determine whether the assembly state of the heat sink is abnormal according to the first temperature.

[0086] The first temperature in this embodiment may be the temperature value most recently detected by the temperature detection element, or may be the average or median of the temperature values ​​detected by the temperature detection element in the second time period. The second time period may be pre-set according to the application scenario or specific requirements, for example, the second time period may be the past 1 minute.

[0087] In this embodiment, if the first temperature is greater than or equal to the fifth threshold, it can be determined that the assembly state of the radiator is abnormal, and the SOC chip and the radiator may be loose. The control module 1100 can control the motor to tighten the corresponding screws to lock the SOC chip and the radiator.

[0088] In one embodiment of the present disclosure, the control module is used to control the motor to stop rotating the corresponding screw when the torque of the motor rotation is greater than or equal to a fifth threshold.

[0089] <Electronic Equipment Embodiment>

[0090] This embodiment further provides an electronic device, which may include the assembly control system 1000 of the radiator described in any of the above embodiments.

[0091] <Method Example>

[0092] The present embodiment provides a control method for an assembly control system of a radiator, wherein the assembly control system of the radiator includes a radiator, a plurality of screws, a motor corresponding to each screw, and a SOC chip fixed on a fixed plate. The radiator is fastened to the fixed plate by the plurality of screws and covers the SOC chip to dissipate heat for the SOC chip.

[0093] The control method may include Figure 4 Steps S4100 to S4200 shown:

[0094] Step S4100, detecting whether the assembly state of the heat sink is abnormal.

[0095] In one embodiment, the assembly state of the heat sink may be detected to be abnormal according to a set frequency, wherein the set frequency may be set in advance according to an application scenario or specific requirements, for example, the set frequency may be 1 Hz.

[0096] In one embodiment, it may be determined that the assembly state of the heat sink is abnormal when at least one of the following items is detected:

[0097] The pressure of the heat sink on at least one position of the SOC chip is less than or equal to a first threshold;

[0098] The pressure of the radiator on at least one position of the SOC chip is greater than or equal to a second threshold;

[0099] The difference in pressure of the radiator on different positions of the SOC chip is greater than or equal to a third threshold.

[0100] After adjusting the gap between the SOC chip and the radiator, the cumulative working time of the radiator reaches the set time;

[0101] The temperature of the SOC chip is greater than or equal to a fifth threshold.

[0102] Step S4200, when it is detected that the assembly state of the heat sink is abnormal, the motor is controlled to rotate the corresponding screw to adjust the gap between the SOC chip and the heat sink.

[0103] In this embodiment, the motor can be controlled to rotate forward to tighten the corresponding screws and reduce the gap between the SOC chip and the radiator at the corresponding screw positions; the motor can also be controlled to rotate reversely to loosen the corresponding screws and increase the gap between the SOC chip and the radiator at the corresponding screw positions.

[0104] Through the embodiments of the present disclosure, when an abnormal assembly state of the radiator is detected, the motor can be controlled to rotate the corresponding screw to adjust the gap between the SOC chip and the radiator, so that the radiator can reach the optimal assembly state, ensure the consistency of the product's heat dissipation performance, and reduce fluctuations in the product's heat dissipation performance.

[0105] In one embodiment of the present disclosure, when an abnormal assembly state of the radiator is detected, controlling the motor to rotate the corresponding screw to adjust the gap between the SOC chip and the radiator may include: when the first pressure applied to the first pressure detection element is less than or equal to the first threshold pressure detection element, controlling the first motor to lock the corresponding screw to reduce the gap between the SOC chip and the radiator at the position corresponding to the first motor; wherein the first motor is the motor closest to the first pressure detection element, that is, the screw corresponding to the first motor is closest to the first pressure detection element. wherein the first pressure detection element is any one or more pressure detection elements among the plurality of pressure detection elements.

[0106] In one embodiment of the present disclosure, when an abnormal assembly state of the radiator is detected, controlling the motor to rotate the corresponding screw to adjust the gap between the SOC chip and the radiator may include: when the first pressure on the second pressure detection element is greater than or equal to the second threshold pressure detection element, controlling the second motor to loosen the corresponding screw to increase the gap between the SOC chip and the radiator at the position corresponding to the second motor; wherein the second motor is the motor closest to the second pressure detection element, that is, the screw corresponding to the second motor is closest to the second pressure detection element. The second pressure detection element is any one or more pressure detection elements among the plurality of pressure detection elements.

[0107] In one embodiment of the present disclosure, when an abnormal assembly state of the heat sink is detected, controlling the motor to rotate the corresponding screw to adjust the gap between the SOC chip and the heat sink may include: when the difference between the first pressure received by the third pressure detection element and the first pressure received by the fourth pressure detection element is greater than or equal to the third threshold, and the difference between the first pressure received by the third pressure detection element and the fourth threshold is greater than the difference between the first pressure received by the fourth pressure detection element and the fourth threshold, controlling the third motor to tighten the corresponding screw to reduce the gap between the SOC chip and the heat sink at the corresponding position of the third motor; wherein the third motor is the motor closest to the third pressure detection element, and the first pressure received by the third pressure detection element is less than the first pressure received by the fourth pressure detection element. wherein the third pressure detection element and the fourth pressure detection element are different pressure detection elements among the plurality of pressure detection elements.

[0108] The difference in this embodiment may be the absolute value of the difference between two values.

[0109] In this embodiment, the fourth threshold may be a value greater than the first threshold and less than the second threshold. For example, the fourth threshold may be an average value of the first threshold and the second threshold.

[0110] <Readable Storage Medium Embodiment>

[0111] This embodiment provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method described in any method embodiment of the present disclosure is executed.

[0112] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0113] A computer-readable storage medium may be a tangible device that can hold and store instructions used by an instruction execution device. A computer-readable storage medium may be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples of computer-readable storage media (a non-exhaustive list) include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punch card or a raised structure in a groove on which instructions are stored, and any suitable combination of the foregoing. As used herein, a computer-readable storage medium is not to be interpreted as a transient signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0114] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0115] The computer program instructions for performing the operation of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions may be executed entirely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be personalized by utilizing the state information of the computer-readable program instructions, and the electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present invention.

[0116] Various aspects of the present invention are described herein with reference to the flow charts and / or block diagrams of the methods, devices (systems) and computer program products according to embodiments of the present invention. It should be understood that each box of the flow chart and / or block diagram and the combination of each box in the flow chart and / or block diagram can be implemented by computer-readable program instructions.

[0117] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0118] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0119] The flow charts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a part of a module, a program segment or an instruction, and a part of the module, a program segment or an instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that it is equivalent to implement it by hardware, implement it by software, and implement it by combining software and hardware.

[0120] Embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A radiator assembly control system, characterized in that: It includes a control module, a heat sink, a plurality of screws, a motor corresponding to each screw, and a chip arranged on a circuit board, wherein the heat sink is fixed to the circuit board through the plurality of screws and covers the chip to dissipate heat for the chip; The control module is used to control the motor to rotate the corresponding screw to adjust the gap between the chip and the heat sink when it is detected that the assembly state of the heat sink is abnormal.

2. The assembly control system according to claim 1, characterized in that: The assembly control system also includes a plurality of pressure detection elements, which are distributed between the heat sink and the chip. The control module is used to obtain a first pressure applied to each pressure detection element and determine whether the assembly state of the heat sink is abnormal based on the first pressure.

3. The assembly control system according to claim 2, characterized in that: The chip comprises a chip wafer, the chip wafer is arranged on a side of the chip facing the heat sink, and the plurality of pressure detection elements are distributed on the edge of the chip wafer and are in contact with the heat sink.

4. The assembly control system according to claim 2, characterized in that: The control module is used to determine that the assembly state of the radiator is abnormal when the first pressure satisfies any one or more of the following conditions: The first pressure applied to any pressure detection element is less than or equal to a first threshold value; The first pressure applied to any pressure detection element is greater than or equal to the second threshold value; The difference between the first pressures applied to any two pressure detection elements is greater than or equal to a third threshold.

5. The assembly control system according to claim 4, characterized in that: The control module is used to control the first motor to lock the corresponding screw when the first pressure applied to the first pressure detection element is less than or equal to the first threshold value, so as to reduce the gap between the chip and the heat sink at the position corresponding to the first motor; wherein the first motor is the motor closest to the first pressure detection element.

6. The assembly control system according to claim 4, characterized in that: The control module is used to control the second motor to loosen the corresponding screws to increase the gap between the chip and the heat sink at the position corresponding to the second motor when the first pressure applied to the second pressure detection element is greater than or equal to the second threshold value; wherein the second motor is the motor closest to the second pressure detection element.

7. The assembly control system according to claim 4, characterized in that: The control module is used to control the third motor to tighten the corresponding screws to reduce the gap between the chip and the heat sink at the corresponding position of the third motor when the difference between the first pressure applied to the third pressure sensing element and the first pressure applied to the fourth pressure sensing element is greater than or equal to the third threshold, the first pressure applied to the third pressure sensing element is less than the first pressure applied to the fourth pressure sensing element, and the difference between the first pressure applied to the third pressure sensing element and the fourth threshold is greater than the difference between the first pressure applied to the fourth pressure sensing element and the fourth threshold; wherein the third motor is the motor closest to the third pressure sensing element.

8. The assembly control system according to claim 1, characterized in that: The control module is used for determining that the assembly state of the heat sink is abnormal when the accumulated working time of the heat sink reaches a set time after the gap between the chip and the heat sink is adjusted.

9. The assembly control system according to claim 1, characterized in that: The assembly control system further includes a temperature detection element, wherein the temperature detection element is used to detect a first temperature of the chip and determine whether an assembly state of the heat sink is abnormal according to the first temperature.

10. The assembly control system according to claim 8 or 9, characterized in that: The control module is used to control the motor to stop rotating the corresponding screw when the torque of the motor is greater than or equal to a fifth threshold.

11. The assembly control system according to claim 3, characterized in that: A heat dissipation interface material is arranged between the chip and the heat sink, and the heat dissipation interface material is coated on the surface of the chip wafer facing the heat sink.

12. An electronic device, characterized in that: Comprising an assembly control system as claimed in any one of claims 1 to 11.

13. A control method for an assembly control system of a radiator, characterized in that: The assembled control system includes a heat sink, a plurality of screws, a motor corresponding to each screw, and a chip arranged on a circuit board. The heat sink is fixed to the circuit board through the plurality of screws and covers the chip to dissipate heat for the chip. The method comprises: Detecting whether the assembly state of the radiator is abnormal; When it is detected that the assembly state of the heat sink is abnormal, the motor is controlled to rotate the corresponding screw to adjust the gap between the chip and the heat sink.

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